ATE176416T1 - Laserbearbeitungsgerät - Google Patents

Laserbearbeitungsgerät

Info

Publication number
ATE176416T1
ATE176416T1 AT91119757T AT91119757T ATE176416T1 AT E176416 T1 ATE176416 T1 AT E176416T1 AT 91119757 T AT91119757 T AT 91119757T AT 91119757 T AT91119757 T AT 91119757T AT E176416 T1 ATE176416 T1 AT E176416T1
Authority
AT
Austria
Prior art keywords
work
optical system
holes
small holes
processing device
Prior art date
Application number
AT91119757T
Other languages
English (en)
Inventor
Masaki Inaba
Hiroshi Kohno
Fumio Ichikawa
Kazuaki Masuda
Takashi Watanabe
Tsuyoshi Orikasa
Masayuki Nishiwaki
Toshio Tsuda
Mitakedai
Akira Goto
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2314135A external-priority patent/JPH04187394A/ja
Priority claimed from JP2314136A external-priority patent/JPH04187395A/ja
Priority claimed from JP2315925A external-priority patent/JPH04187392A/ja
Priority claimed from JP2329524A external-priority patent/JP2679869B2/ja
Priority claimed from JP3135324A external-priority patent/JP2672203B2/ja
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE176416T1 publication Critical patent/ATE176416T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Laser Surgery Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT91119757T 1990-11-21 1991-11-19 Laserbearbeitungsgerät ATE176416T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2314135A JPH04187394A (ja) 1990-11-21 1990-11-21 レーザ加工装置
JP2314136A JPH04187395A (ja) 1990-11-21 1990-11-21 レーザ加工装置のマスク固定機構
JP2315925A JPH04187392A (ja) 1990-11-22 1990-11-22 レーザ孔開け加工機
JP2329524A JP2679869B2 (ja) 1990-11-30 1990-11-30 孔開け加工位置の位置合わせ方法およびレーザ孔開け加工機
JP3135324A JP2672203B2 (ja) 1991-05-13 1991-05-13 孔開け加工機

Publications (1)

Publication Number Publication Date
ATE176416T1 true ATE176416T1 (de) 1999-02-15

Family

ID=27527409

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91119757T ATE176416T1 (de) 1990-11-21 1991-11-19 Laserbearbeitungsgerät

Country Status (5)

Country Link
US (1) US5389954A (de)
EP (1) EP0488033B1 (de)
AT (1) ATE176416T1 (de)
CA (1) CA2055899C (de)
DE (1) DE69130854T2 (de)

Families Citing this family (47)

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US5463200A (en) * 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
JP3211525B2 (ja) * 1993-04-22 2001-09-25 オムロン株式会社 薄材メッシュ、その製造方法及びその製造装置
JP3132291B2 (ja) * 1993-06-03 2001-02-05 ブラザー工業株式会社 インクジェットヘッドの製造方法
DE69407613T2 (de) * 1993-09-30 1998-06-04 Cymer Inc Vollfeldmaske-beleuchtungsverbesserungsverfahren und -vorrichtung
US6130009A (en) * 1994-01-03 2000-10-10 Litel Instruments Apparatus and process for nozzle production utilizing computer generated holograms
US5571429A (en) * 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
SG52140A1 (en) * 1994-03-04 1998-09-28 Canon Kk Ink jet recording head and method of manufacture therefor and laser processing apparatus and ink jet recording apparatus
EP0680224B1 (de) * 1994-04-27 2002-11-13 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Rauschvermindernde Filterung und interpolierende Abtastratenwandlung für digitale Videosignale, gesteuert durch mit Fuzzy-Logik detektierte Zwischenfeld-Korrelationsinformation
US5748213A (en) * 1994-10-28 1998-05-05 Canon Kabushiki Kaisha Ink jet head having plural elemental substrates, apparatus having the ink jet head, and method for manufacturing the ink jet head
JP2773661B2 (ja) * 1994-11-28 1998-07-09 日本電気株式会社 ビームスキャン式レーザマーキング方法および装置ならびにこのためのマスク
TW342365B (en) * 1995-12-21 1998-10-11 Ricoh Microelectronics Kk A printing mask with a plastic printing plate and process for producing the same
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
JP3689490B2 (ja) * 1996-06-07 2005-08-31 キヤノン株式会社 ノズル部材の製造方法及びそれを用いた加工装置
JP3501598B2 (ja) * 1996-10-16 2004-03-02 キヤノン株式会社 レーザー加工方法、インクジェット記録ヘッド及びインクジェット記録ヘッド製造装置
JPH10193618A (ja) * 1996-11-13 1998-07-28 Canon Inc 液体噴射記録ヘッドおよびその製造方法
JP3423551B2 (ja) * 1996-12-13 2003-07-07 キヤノン株式会社 インクジェット記録ヘッド製造方法及びインクジェット記録ヘッド
US6213587B1 (en) 1999-07-19 2001-04-10 Lexmark International, Inc. Ink jet printhead having improved reliability
US6409308B1 (en) 1999-11-19 2002-06-25 Lexmark International, Inc. Method of forming an inkjet printhead nozzle structure
US6731446B2 (en) * 2000-02-03 2004-05-04 Matsushita Electric Industrial Co., Ltd. Method for forming a magnetic pattern in a magnetic recording medium, method for producing a magnetic recording medium, magnetic pattern forming device, magnetic recording medium and magnetic recording device
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US6881203B2 (en) * 2001-09-05 2005-04-19 3M Innovative Properties Company Microneedle arrays and methods of manufacturing the same
JP3984019B2 (ja) * 2001-10-15 2007-09-26 パイオニア株式会社 電子ビーム装置及び電子ビーム調整方法
KR20120087197A (ko) * 2002-07-19 2012-08-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 마이크로 니들 장치, 마이크로 니들 장치를 사용하는 방법 및 마이크로 니들 장치를 송출하는 방법
GB0305856D0 (en) * 2003-03-14 2003-04-16 Qinetiq Ltd Bistable display device
EP1607088B1 (de) * 2003-03-17 2019-02-27 Takeda Pharmaceutical Company Limited Zusammensetzung mit kontrollierter freisetzung
WO2004083133A2 (en) * 2003-03-21 2004-09-30 Rorze Systems Corporation Apparatus for cutting glass plate
US7415299B2 (en) * 2003-04-18 2008-08-19 The Regents Of The University Of California Monitoring method and/or apparatus
US7753888B2 (en) * 2003-11-21 2010-07-13 The Regents Of The University Of California Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles
EP1869414A4 (de) * 2005-03-29 2010-07-28 Arkal Medical Inc Vorrichtungen, systeme, verfahren und werkzeuge zur kontinuierlichen glucoseüberwachung
US7538295B2 (en) * 2005-04-21 2009-05-26 Hewlett-Packard Development Company, L.P. Laser welding system
US20080154107A1 (en) * 2006-12-20 2008-06-26 Jina Arvind N Device, systems, methods and tools for continuous glucose monitoring
US20100049021A1 (en) * 2006-03-28 2010-02-25 Jina Arvind N Devices, systems, methods and tools for continuous analyte monitoring
US20090131778A1 (en) * 2006-03-28 2009-05-21 Jina Arvind N Devices, systems, methods and tools for continuous glucose monitoring
US20080058726A1 (en) * 2006-08-30 2008-03-06 Arvind Jina Methods and Apparatus Incorporating a Surface Penetration Device
JP4274214B2 (ja) * 2006-09-08 2009-06-03 セイコーエプソン株式会社 液体噴射ヘッドのアライメント装置及びそのアラインメント方法
US20080234562A1 (en) * 2007-03-19 2008-09-25 Jina Arvind N Continuous analyte monitor with multi-point self-calibration
JP4514767B2 (ja) 2007-03-28 2010-07-28 日立ビアメカニクス株式会社 レーザエネルギ測定装置とレーザ加工装置
US20080312518A1 (en) * 2007-06-14 2008-12-18 Arkal Medical, Inc On-demand analyte monitor and method of use
JP2009072789A (ja) * 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
US20090099427A1 (en) * 2007-10-12 2009-04-16 Arkal Medical, Inc. Microneedle array with diverse needle configurations
CN101987049B (zh) * 2009-07-30 2014-10-01 上海微创医疗器械（集团）有限公司 在医疗器械上装载药物和/或聚合物的方法和装置
JP7325229B2 (ja) * 2019-06-06 2023-08-14 株式会社ディスコ 発振器載置台、レーザー加工装置及び発振器載置台の調整方法
CN112276371B (zh) * 2019-07-09 2022-07-05 大族激光科技产业集团股份有限公司 一种切割头随动控制系统及方法
CN115157872B (zh) * 2022-08-12 2024-01-16 浙江弘宇激光设备有限公司 具有识别功能的双头激光打标机
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
CN117798525B (zh) * 2023-12-29 2025-10-28 安徽东海裕祥智能装备科技有限公司 一种多工位大功率双激光切割生产线

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US4345262A (en) 1979-02-19 1982-08-17 Canon Kabushiki Kaisha Ink jet recording method
US4463359A (en) 1979-04-02 1984-07-31 Canon Kabushiki Kaisha Droplet generating method and apparatus thereof
US4313124A (en) 1979-05-18 1982-01-26 Canon Kabushiki Kaisha Liquid jet recording process and liquid jet recording head
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JPS57202992A (en) * 1982-01-21 1982-12-13 Nec Corp Laser engraving device
JPS59123670A (ja) 1982-12-28 1984-07-17 Canon Inc インクジエツトヘツド
JPS59138461A (ja) * 1983-01-28 1984-08-08 Canon Inc 液体噴射記録装置
JPS6381882A (ja) * 1986-09-25 1988-04-12 Nikon Corp エネルギ−量制御装置
US4758703A (en) * 1987-05-06 1988-07-19 Estee Lauder Inc. System and method for encoding objects
GB8722085D0 (en) * 1987-09-19 1987-10-28 Cambridge Consultants Ink jet nozzle manufacture
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GB8811532D0 (en) * 1988-05-16 1988-06-22 Lumonics Ltd Beam combining unit
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Also Published As

Publication number Publication date
EP0488033A2 (de) 1992-06-03
EP0488033A3 (en) 1993-06-16
CA2055899A1 (en) 1992-05-22
DE69130854T2 (de) 1999-08-05
DE69130854D1 (de) 1999-03-18
US5389954A (en) 1995-02-14
EP0488033B1 (de) 1999-02-03
CA2055899C (en) 1997-12-16

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties