DE69225347D1 - Projektionsbelichtungsmethode und optische Maske für die Projektionsbelichtung - Google Patents
Projektionsbelichtungsmethode und optische Maske für die ProjektionsbelichtungInfo
- Publication number
- DE69225347D1 DE69225347D1 DE69225347T DE69225347T DE69225347D1 DE 69225347 D1 DE69225347 D1 DE 69225347D1 DE 69225347 T DE69225347 T DE 69225347T DE 69225347 T DE69225347 T DE 69225347T DE 69225347 D1 DE69225347 D1 DE 69225347D1
- Authority
- DE
- Germany
- Prior art keywords
- projection exposure
- optical mask
- exposure method
- projection
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4539491 | 1991-02-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69225347D1 true DE69225347D1 (de) | 1998-06-10 |
DE69225347T2 DE69225347T2 (de) | 1998-09-03 |
Family
ID=12718050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69225347T Expired - Lifetime DE69225347T2 (de) | 1991-02-19 | 1992-02-18 | Projektionsbelichtungsmethode und optische Maske für die Projektionsbelichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5418093A (de) |
EP (1) | EP0500456B1 (de) |
KR (1) | KR960010023B1 (de) |
DE (1) | DE69225347T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5242770A (en) * | 1992-01-16 | 1993-09-07 | Microunity Systems Engineering, Inc. | Mask for photolithography |
JP3194155B2 (ja) * | 1992-01-31 | 2001-07-30 | キヤノン株式会社 | 半導体デバイスの製造方法及びそれを用いた投影露光装置 |
JP3210123B2 (ja) * | 1992-03-27 | 2001-09-17 | キヤノン株式会社 | 結像方法及び該方法を用いたデバイス製造方法 |
EP0634028B1 (de) * | 1992-04-06 | 1998-07-22 | MicroUnity Systems Engineering, Inc. | Methode zur herstellung eines lithographischen musters in einem verfahren zur herstellung von halbleitervorrichtungen |
USRE36475E (en) * | 1993-09-15 | 1999-12-28 | Hyundai Electronics Industries Co., Ltd. | Method of forming a via plug in a semiconductor device |
JPH09167753A (ja) * | 1995-08-14 | 1997-06-24 | Toshiba Corp | 半導体基板の表面の平坦化方法とその装置 |
US5866913A (en) * | 1995-12-19 | 1999-02-02 | International Business Machines Corporation | Proximity correction dose modulation for E-beam projection lithography |
KR100229611B1 (ko) * | 1996-06-12 | 1999-11-15 | 구자홍 | 액정표시장치의 제조방법 |
US5786114A (en) * | 1997-01-10 | 1998-07-28 | Kabushiki Kaisha Toshiba | Attenuated phase shift mask with halftone boundary regions |
US6440644B1 (en) | 1997-10-15 | 2002-08-27 | Kabushiki Kaisha Toshiba | Planarization method and system using variable exposure |
JP3119217B2 (ja) * | 1997-10-31 | 2000-12-18 | 日本電気株式会社 | フォトマスクおよびフォトマスクを使用した露光方法 |
US6947025B2 (en) * | 2001-10-09 | 2005-09-20 | Seiko Epson Corporation | Lighting apparatus and projection type display, and driving method therefore |
KR100596801B1 (ko) * | 2005-05-18 | 2006-07-04 | 주식회사 하이닉스반도체 | 반도체 소자 제조용 포토마스크 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1154327B (de) * | 1962-10-27 | 1963-09-12 | Telefunken Patent | Verfahren zur Herstellung von Mikromasken |
IT939738B (it) * | 1970-08-12 | 1973-02-10 | Rank Organisation Ltd | Dispositivo di illuminazione per la stampa fotolitografica dei componenti di microcircuiti |
DE2835363A1 (de) * | 1978-08-11 | 1980-03-13 | Siemens Ag | Verfahren zum uebertragen von strukturen fuer halbleiterschaltungen |
US4902899A (en) * | 1987-06-01 | 1990-02-20 | International Business Machines Corporation | Lithographic process having improved image quality |
US5130213A (en) * | 1989-08-07 | 1992-07-14 | At&T Bell Laboratories | Device manufacture involving lithographic processing |
JP2697746B2 (ja) * | 1989-09-01 | 1998-01-14 | 富士通株式会社 | 投影露光装置用光学マスク |
-
1992
- 1992-02-18 DE DE69225347T patent/DE69225347T2/de not_active Expired - Lifetime
- 1992-02-18 EP EP92400431A patent/EP0500456B1/de not_active Expired - Lifetime
- 1992-02-18 KR KR1019920002401A patent/KR960010023B1/ko not_active IP Right Cessation
-
1994
- 1994-02-24 US US08/201,079 patent/US5418093A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0500456B1 (de) | 1998-05-06 |
EP0500456A1 (de) | 1992-08-26 |
KR960010023B1 (ko) | 1996-07-25 |
US5418093A (en) | 1995-05-23 |
KR920017180A (ko) | 1992-09-26 |
DE69225347T2 (de) | 1998-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJITSU MICROELECTRONICS LTD., TOKYO, JP |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJITSU SEMICONDUCTOR LTD., YOKOHAMA, KANAGAWA, JP |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE |