ATE155612T1 - Schaltungsanordnung - Google Patents

Schaltungsanordnung

Info

Publication number
ATE155612T1
ATE155612T1 AT92104842T AT92104842T ATE155612T1 AT E155612 T1 ATE155612 T1 AT E155612T1 AT 92104842 T AT92104842 T AT 92104842T AT 92104842 T AT92104842 T AT 92104842T AT E155612 T1 ATE155612 T1 AT E155612T1
Authority
AT
Austria
Prior art keywords
heat sink
press
base plate
component
contact pads
Prior art date
Application number
AT92104842T
Other languages
German (de)
English (en)
Original Assignee
Export Contor Aussenhandel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Export Contor Aussenhandel filed Critical Export Contor Aussenhandel
Application granted granted Critical
Publication of ATE155612T1 publication Critical patent/ATE155612T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/233—Arrangements for cooling characterised by their places of attachment or cooling paths attached to chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Vehicle Body Suspensions (AREA)
  • Seal Device For Vehicle (AREA)
AT92104842T 1991-04-08 1992-03-20 Schaltungsanordnung ATE155612T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4111247A DE4111247C3 (de) 1991-04-08 1991-04-08 Schaltungsanordnung
DE4122428A DE4122428A1 (de) 1991-04-08 1991-07-06 Schaltungsanordnung

Publications (1)

Publication Number Publication Date
ATE155612T1 true ATE155612T1 (de) 1997-08-15

Family

ID=25902610

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92104842T ATE155612T1 (de) 1991-04-08 1992-03-20 Schaltungsanordnung

Country Status (5)

Country Link
US (1) US5296739A (https=)
EP (1) EP0508179B1 (https=)
JP (1) JPH05121605A (https=)
AT (1) ATE155612T1 (https=)
DE (2) DE4111247C3 (https=)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
DE4310446C1 (de) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Schaltungsanordnung
US5424580A (en) * 1993-11-01 1995-06-13 Unisys Corporation Electro-mechanical assembly of high power and low power IC packages with a shared heat sink
EP0678917B1 (en) * 1994-04-22 2003-06-25 Nec Corporation Supporting member for cooling means and electronic package using the same
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
DE4443498C1 (de) * 1994-12-07 1996-02-15 Export Contor Ausenhandelsgese Dynamisch angesteuerter Motor
DE4446527A1 (de) * 1994-12-24 1996-06-27 Ixys Semiconductor Gmbh Leistungshalbleitermodul
FR2729045B1 (fr) * 1994-12-29 1997-01-24 Bull Sa Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes
US5685071A (en) * 1995-06-05 1997-11-11 Hughes Electronics Method of constructing a sealed chip-on-board electronic module
DE19529237C1 (de) * 1995-08-09 1996-08-29 Semikron Elektronik Gmbh Schaltungsanordnung
DE19533298A1 (de) * 1995-09-08 1997-03-13 Siemens Ag Elektronisches Modul mit Leistungsbauelementen
DE19624475A1 (de) * 1996-06-19 1998-01-02 Kontron Elektronik Vorrichtung zum Temperieren elektronischer Bauteile
DE19651632C2 (de) * 1996-12-12 2000-12-14 Semikron Elektronik Gmbh Leistungshalbleitermodul
DE19703329A1 (de) * 1997-01-30 1998-08-06 Asea Brown Boveri Leistungshalbleitermodul
JPH10335579A (ja) * 1997-05-27 1998-12-18 Toshiba Corp 大電力半導体モジュール装置
US6008536A (en) * 1997-06-23 1999-12-28 Lsi Logic Corporation Grid array device package including advanced heat transfer mechanisms
JPH11121666A (ja) 1997-10-20 1999-04-30 Fujitsu Ltd マルチチップモジュールの冷却装置
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
DE19751487A1 (de) * 1997-11-20 1999-06-02 Pac Tech Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
US6043560A (en) * 1997-12-03 2000-03-28 Intel Corporation Thermal interface thickness control for a microprocessor
US6181006B1 (en) 1998-05-28 2001-01-30 Ericsson Inc. Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
DE19834800C1 (de) * 1998-08-01 1999-10-28 Semikron Elektronik Gmbh Leistungshalbleiterschaltungsanordnung
US6703560B2 (en) * 1998-09-15 2004-03-09 International Business Machines Corporation Stress resistant land grid array (LGA) module and method of forming the same
DE19850153B4 (de) * 1998-10-30 2005-07-21 Siemens Ag Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
DE19903875C2 (de) * 1999-02-01 2001-11-29 Semikron Elektronik Gmbh Leistungshalbleiterschaltungsanordnung, insbesondere Stromumrichter, in Druckkontaktierung
DE10016306C2 (de) * 1999-02-01 2002-05-29 Semikron Elektronik Gmbh Leistungshalbleiterschaltungsanordnung, insbesondere Stromumrichter, in Druckkontaktierung
US6055158A (en) * 1999-03-16 2000-04-25 Framatome Connectors Interlock, Inc. Electronic component heat sink assembly
US6507101B1 (en) * 1999-03-26 2003-01-14 Hewlett-Packard Company Lossy RF shield for integrated circuits
DE19942770A1 (de) * 1999-09-08 2001-03-15 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul
JP2001110967A (ja) * 1999-10-07 2001-04-20 Fujikura Ltd 電子素子の放熱構造
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6404638B1 (en) * 2000-11-30 2002-06-11 International Business Machines Corporation Small gaps cooling technology
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
GB2380613A (en) * 2001-10-04 2003-04-09 Motorola Inc Package for electronic components and method for forming such a package
DE10149886A1 (de) 2001-10-10 2003-04-30 Eupec Gmbh & Co Kg Leistunghalbleitermodul
US7242583B2 (en) * 2002-12-16 2007-07-10 Paricon Technologies, Corporation System for loading a heat sink mechanism independently of clamping load on electrical device
DE102004018476B4 (de) * 2004-04-16 2009-06-18 Infineon Technologies Ag Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung
JP2006278941A (ja) * 2005-03-30 2006-10-12 Fujitsu Ltd 放熱装置及びプラグインユニット
JP4715283B2 (ja) * 2005-04-25 2011-07-06 日産自動車株式会社 電力変換装置及びその製造方法
KR100677620B1 (ko) * 2005-11-22 2007-02-02 삼성전자주식회사 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기
DE102006021095B4 (de) * 2006-05-05 2008-09-04 Continental Automotive Gmbh Leiterbahnträgervorrichtung
US7440282B2 (en) * 2006-05-16 2008-10-21 Delphi Technologies, Inc. Heat sink electronic package having compliant pedestal
US7480142B2 (en) * 2006-12-12 2009-01-20 Cummins Power Generation Ip, Inc. Boost spring holder for securing a power device to a heatsink
JP5344733B2 (ja) * 2007-09-14 2013-11-20 株式会社日立ハイテクノロジーズ 高周波電力発生装置
DE102007045261A1 (de) * 2007-09-21 2009-04-23 Continental Automotive Gmbh Elektrisches Gerät, insbesondere Steuergerät für ein Kraftfahrzeug
US7808100B2 (en) 2008-04-21 2010-10-05 Infineon Technologies Ag Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
DE102008034068B4 (de) * 2008-07-22 2019-07-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
DE102009015757A1 (de) * 2009-04-01 2010-10-14 Siemens Aktiengesellschaft Druckunterstützung für eine elektronische Schaltung
DE102009002191B4 (de) 2009-04-03 2012-07-12 Infineon Technologies Ag Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE102009028814B4 (de) * 2009-08-21 2018-04-26 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Montage eines Leistungshalbleitermoduls
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
DE102009046403B4 (de) * 2009-11-04 2015-05-28 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontakttechnik
AT510389B1 (de) * 2010-09-13 2014-03-15 Melecs Ews Gmbh & Co Kg Kühlvorrichtung für ein elektrisches gerät und zugehöriges herstellungsverfahren
US8682169B2 (en) 2011-02-28 2014-03-25 Eldon Technology Limited Apparatus, systems and methods for detecting infrared signals at a media device configured to be positioned in different orientations
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) * 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9047492B2 (en) 2011-03-22 2015-06-02 Echostar Uk Holdings Limited Apparatus, systems and methods for securely storing media content events on a flash memory device
US8638199B2 (en) 2011-03-29 2014-01-28 Eldon Technology Limited Apparatus, systems and methods for power line carrier data communication to DC powered electronic device
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
JP5892796B2 (ja) * 2012-01-20 2016-03-23 富士電機株式会社 高圧モジュール
US20130250522A1 (en) * 2012-03-22 2013-09-26 Varian Medical Systems, Inc. Heat sink profile for interface to thermally conductive material
JP2014187264A (ja) * 2013-03-25 2014-10-02 Toshiba Corp 半導体装置
US20150173243A1 (en) * 2013-12-13 2015-06-18 General Electric Company Integrated heat exchange assembly and an associated method thereof
US9839133B2 (en) 2014-06-04 2017-12-05 Apple Inc. Low-area overhead connectivity solutions to SIP module
US10624214B2 (en) * 2015-02-11 2020-04-14 Apple Inc. Low-profile space-efficient shielding for SIP module
DE102015112031B4 (de) 2015-07-23 2017-08-17 Halla Visteon Climate Control Corporation Anordnung zur Verbesserung einer Strombelastbarkeit von Leiterbahnen
US9570373B1 (en) 2015-12-09 2017-02-14 International Business Machines Corporation Near-chip compliant layer for reducing perimeter stress during assembly process
DE102016123697B4 (de) * 2016-12-07 2021-06-24 Semikron Elektronik Gmbh & Co. Kg Druckeinrichtung für eine leistungselektronische Schalteinrichtung, Schalteinrichtung und Anordnung hiermit
DE102017127076A1 (de) * 2017-11-17 2019-05-23 Eaton Industries (Austria) Gmbh Mechatronikbaugruppe mit einer hybriden Schaltungsanordnung
US10978313B2 (en) 2018-02-20 2021-04-13 International Business Machines Corporation Fixture facilitating heat sink fabrication
AT522432B1 (de) * 2019-08-29 2020-11-15 Melecs Ews Gmbh Elektronisches Gerät

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1489097B1 (de) * 1964-12-16 1970-10-22 Licentia Gmbh Halbleiter-Gleichrichterzelle
DE1514162B2 (de) * 1965-10-01 1971-08-15 Licentia Patent Verwaltungs GmbH, 6000 Frankfurt Verfahren zur herstellung einer halbleitergleichrichter zelle mit flaechenhafter druckkontaktierung
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4153107A (en) * 1977-06-30 1979-05-08 International Business Machines Corporation Temperature equalizing element for a conduction cooling module
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
FR2528658A1 (fr) * 1982-06-15 1983-12-16 Silicium Semiconducteur Ssc Boitier a capot plastique pour composants semi-conducteurs
DE3378870D1 (en) * 1982-09-09 1989-02-09 Siemens Ag Cooling device for a plurality of integrated components assembled as a flat structure
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
US4769744A (en) * 1983-08-04 1988-09-06 General Electric Company Semiconductor chip packages having solder layers of enhanced durability
JPS60249391A (ja) * 1984-05-25 1985-12-10 キヤノン株式会社 熱伝導手段
GB2167228B (en) * 1984-10-11 1988-05-05 Anamartic Ltd Integrated circuit package
DE3442132A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten
DE3508456C2 (de) * 1985-03-09 1987-01-08 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul und Verfahren zur Herstellung eines solchen Moduls
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
US4709301A (en) * 1985-09-05 1987-11-24 Nec Corporation Package
US4715115A (en) * 1986-04-03 1987-12-29 Hewlett-Packard Company Package for water-scale semiconductor devices
DE3628556C1 (en) * 1986-08-22 1988-04-14 Semikron Elektronik Gmbh Semiconductor device
JPS63226952A (ja) * 1987-03-16 1988-09-21 Hitachi Ltd 半導体装置
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US4928129A (en) * 1988-04-30 1990-05-22 Sharp Kabushiki Kaisha Printing apparatus
DE340959T1 (de) * 1988-05-06 1990-08-16 Digital Equipment Corp., Maynard, Mass. Schaltungschipspackung zum schuetzen gegen elektromagnetische interferenzen, elektrostatische entladungen und thermische und mechanische spannungen.
JPH01310566A (ja) * 1988-06-08 1989-12-14 Mitsubishi Electric Corp 半導体装置
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
CA1304830C (en) * 1988-09-20 1992-07-07 Toshifumi Sano Cooling structure
DE4001554A1 (de) * 1990-01-20 1991-07-25 Abb Ixys Semiconductor Gmbh Leistungshalbleitermodul

Also Published As

Publication number Publication date
EP0508179A3 (de) 1992-12-30
DE4111247C3 (de) 1996-11-21
EP0508179B1 (de) 1997-07-16
DE4122428C2 (https=) 1993-07-22
US5296739A (en) 1994-03-22
DE4122428A1 (de) 1993-01-28
DE4111247A1 (de) 1992-10-22
DE4111247C2 (https=) 1993-02-25
JPH05121605A (ja) 1993-05-18
EP0508179A2 (de) 1992-10-14

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