KR950005337A - 플렉시블 회로 기판과 접촉 대상물의 접속 방법 및 그 구조 - Google Patents

플렉시블 회로 기판과 접촉 대상물의 접속 방법 및 그 구조 Download PDF

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KR950005337A
KR950005337A KR1019940021136A KR19940021136A KR950005337A KR 950005337 A KR950005337 A KR 950005337A KR 1019940021136 A KR1019940021136 A KR 1019940021136A KR 19940021136 A KR19940021136 A KR 19940021136A KR 950005337 A KR950005337 A KR 950005337A
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contact
contacted
bump
flexible circuit
contact object
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야스히꼬 야마모또
이사오 오오끼
준지 요시다
히데오 야마시따
가쯔오 오오찌
마사유끼 가네또
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가마이 고도
닛또 덴꼬 가부시끼가이샤
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Publication of KR950005337A publication Critical patent/KR950005337A/ko

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    • A—HUMAN NECESSITIES
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    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B37/00—Solid balls; Rigid hollow balls; Marbles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01023—Vanadium [V]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/013—Alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

다수의 범프 접점 부착 플렉시블 회로 기판과 다수의 피접촉부를 가진 접촉 대상물을 각각의 범프 접점과 피접촉부가 접합면에서 서로 대향 대응되도록 적층시키는 단계와, 상기 적층물을 적층방향으로 조이도록 제공된 가압수단으로 플렉시블 회로 기판상에 장착된 다수의 범프 접점과 그것에 대응하는 접촉 대상물상에 장착된 다수의 피접촉부를 각각 접촉시키기 위하여 상기 적층물의 전 표면에 대해 압축 방향으로 가압력을 가하는 단계를 포함하는 플렉시블 회로 기판과 접촉 대상물의 접촉 방법.

Description

플렉시블 회로 기판과 접촉 대상물의 접속 방법 및 그 구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1A도 및 제1B도는 각각 본 발명의 일 예에 따른 플렉시블 회로기판의 구조를 모식적으로 도시한 단면도, 제2A도 내지 제2C도는 각각 탄성체의 구체적인 상태를 모식적으로 도시한 단면도, 제3A도 내지 제3D도는 각각 본 발명의 접속 구조에 적합한 가입 수단의 구조적 예를 도시한 모식도, 제4도는 접촉 신뢰성 확인 실험 2의 구성을 개략적으로 도시한 도면,

Claims (6)

  1. 플렉시블 회로 기판과 접촉대상물을 접속시키는 방법에 있어서, 절연 필름의 한표면상에 장착된 다수의 범프 접점이 상기 필름의 어느 한 표면 또는 그 내부에 제공된 회로 패턴에 전기적으로 접속되어 있고 탄성체가 적어도 상기 범프 접점의 후면에 대응하는 부분에 장착되어 이는 다수의 범프 접점 부착 플렉시블 회로 기판과 다수의 피접촉부를 가지는 접촉 대상물을 상기 다수의 범프 접점과 상기 다수의 피접촉부가 접합면에서 서로 대향 대응되도록 적층물을 형성하는 적층 단계와 상기 적층물을 적층 방향으로 조이도록 제공된 가압수단으로 상기 다수의 범프 접점과 그것에 대응하는 다수의 피접촉부가 각각 접촉하도록 상기 적층물의 전표면에 대해 압축방향으로 가압력을 가하는 단계를 포함하는 것을 특징으로 하는 플렉시블 기판과 접촉 대상물의 접속 방법.
  2. 제1항에 있어서, 상기 적층물을 적층 방향으로 조이는 가압 수단중 적어도 하나가 가압원으로부터의 압력을 가압 수용부분에서 집중적으로 수용하고, 이것을 전달 부분을 통하여 상기 범프 접점과 상기 피접촉부 각각의 접촉에 분산시켜서 전달하는 것을 특징으로 하는 플렉시블 기판과 접촉 대상물의 접속 방법.
  3. 제1항에 있어서, 상기 탄성체는, 상기 피접촉부와 상기 피접촉부측의 가압수단과의 사이에 끼이도록 상기 접촉 대상물의 피접촉부의 후면에 대응하는 위치에 장착되는 것을 특징으로 하는 플렉시블 기판과 접촉 대상물의 접속 방법.
  4. 플렉시블 회로 기판과 접촉 대상물의 접속 구조에 있어서, 다수의 범프 접점 부착 플렉시블 회로 기판과 다수의 피접촉부를 가지는 접촉 대상물이 상기 다수의 범프 접점과 상기 다수의 피접촉부가 접합면에서 서로 대향 대응되도록 적층물과, 상기 적층되어 있는 적층물을 적층 방향으로 조이도록 제공된 가압 수단을 포함하며, 상기 플렉시블 회로 기판대에는 절연 필름의 한 표면상에 장착된 다수의 범프 접점이 상기 필름의 어느 한 표면 또는 그 내부에 제공된 회로 패턴에 전기적으로 접속되어 있고 탄성체가 적어도 상기 범프 접점의 후면에 대응하는 부분에 장착되어 있으며, 상기 가압 수단으로 상기 다수의 범프 접점과 그것에 대응하는 피접촉부가 각각 접촉하도록 상기 적층물의 전 표면에 대해 압축 방향으로 가압력을 가하는 것을 특징으로 하는 플렉시블 기판과 접촉 대상물의 접속 구조.
  5. 제4항에 있어서, 상기 적층물을 적층 방향으로 조이는 상기 가압수단중 적어도 하나가, 가압원으로부터의 가압력을 집중적으로 숭용하는 압력 수용부분과, 상기 압력 수용부분에 의해 수용된 가압력을 상기 범프 접점과 상기 피접촉부 각각의 접촉에 분산시켜 전달하는 전달부분을 포함하는 것을 특징으로 하는 플렉시블 기판과 접촉 대상물의 접속 구조.
  6. 제4항에 있어서, 상기 탄성체는 상기 피접촉부와 상기 피접촉부측의 상기 가압 수단 사이에 끼이도록 상기 접촉 대상물의 상기 피접촉부의 후면에 대응하는 위치에 장착되는 것을 특징으로 하는 플렉시블 회로 기판과 접촉 대상물의 접속 구조.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019940021136A 1993-08-27 1994-08-26 플렉시블 회로 기판과 접촉 대상물의 접속 방법 및 그 구조 KR950005337A (ko)

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JP5213146A JP2867209B2 (ja) 1993-08-27 1993-08-27 フレキシブル回路基板と接触対象物との接続方法およびその構造
JP93-213146 1993-08-27

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US (1) US5575662A (ko)
EP (1) EP0641038B1 (ko)
JP (1) JP2867209B2 (ko)
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DE (1) DE69428955T2 (ko)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977783A (en) * 1994-10-28 1999-11-02 Nitto Denko Corporation Multilayer probe for measuring electrical characteristics
JP3015712B2 (ja) * 1995-06-30 2000-03-06 日東電工株式会社 フィルムキャリアおよびそれを用いてなる半導体装置
EP0838100B1 (en) * 1995-07-07 2000-12-20 Minnesota Mining And Manufacturing Company Separable electrical connector assembly having a planar array of conductive protrusions
US5776824A (en) * 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications
US6100596A (en) * 1996-03-19 2000-08-08 Methode Electronics, Inc. Connectorized substrate and method of connectorizing a substrate
US5899757A (en) 1997-11-03 1999-05-04 Intercon Systems, Inc. Compression connector
US6036502A (en) * 1997-11-03 2000-03-14 Intercon Systems, Inc. Flexible circuit compression connector system and method of manufacture
US6156484A (en) * 1997-11-07 2000-12-05 International Business Machines Corporation Gray scale etching for thin flexible interposer
KR100485966B1 (ko) 1998-04-09 2005-05-03 세이코 엡슨 가부시키가이샤 압착 접속 기판, 액정 장치 및 전자 기기
WO1999053735A1 (fr) * 1998-04-09 1999-10-21 Seiko Epson Corporation Substrat colle par pression, composant a cristaux liquides et composant electronique
US6580035B1 (en) * 1998-04-24 2003-06-17 Amerasia International Technology, Inc. Flexible adhesive membrane and electronic device employing same
JP2000106482A (ja) * 1998-07-29 2000-04-11 Sony Chem Corp フレキシブル基板製造方法
DE19838418A1 (de) * 1998-08-24 2000-03-02 Delphi Automotive Systems Gmbh Elektrische Anschlußvorrichtung sowie Verfahren zur Herstellung einer elektrischen Kontaktierung
GB2352315B (en) * 1999-07-19 2003-12-03 Nokia Mobile Phones Ltd Sim card reader
JP2001077501A (ja) * 1999-09-03 2001-03-23 Seiko Epson Corp フレキシブル配線基板、電気光学装置および電子機器
US6230400B1 (en) * 1999-09-17 2001-05-15 George Tzanavaras Method for forming interconnects
JP3741927B2 (ja) * 2000-03-31 2006-02-01 日本電気株式会社 半導体チップ又はパッケージ検査装置及びその検査方法
DE10028184A1 (de) * 2000-06-09 2002-03-07 Hirschmann Austria Gmbh Rankwe Vorrichtung zum Verbindung von elektrischen Leitern
JP4669651B2 (ja) * 2000-06-28 2011-04-13 日本発條株式会社 導電性接触子
JP2002090388A (ja) * 2000-09-13 2002-03-27 Soushiyou Tec:Kk リードの接点構造
US6425768B1 (en) 2000-11-17 2002-07-30 Intercon Systems, Inc. Clamp connector assembly
US6818545B2 (en) * 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
US20030094666A1 (en) * 2001-11-16 2003-05-22 R-Tec Corporation Interposer
AU2003211368A1 (en) * 2002-03-07 2003-09-16 Jsr Corporation Anisotropic conductive connector and its production method, and circuit device test instrument
US6881072B2 (en) * 2002-10-01 2005-04-19 International Business Machines Corporation Membrane probe with anchored elements
US6839965B2 (en) * 2003-02-06 2005-01-11 R-Tec Corporation Method of manufacturing a resistor connector
US20070020960A1 (en) 2003-04-11 2007-01-25 Williams John D Contact grid array system
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7244125B2 (en) 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US7597561B2 (en) 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US7628617B2 (en) 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
TWI239685B (en) * 2003-05-13 2005-09-11 Jsr Corp Flaky probe, its manufacturing method and its application
US7347698B2 (en) 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
WO2005091998A2 (en) * 2004-03-19 2005-10-06 Neoconix, Inc. Electrical connector in a flexible host
US7354276B2 (en) 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
US6991473B1 (en) * 2004-11-30 2006-01-31 International Business Machines Corporation Electrical connector with elastomeric pad having compressor fingers each including a filler member to mitigate relaxation of the elastomer
JP2007062036A (ja) * 2005-08-29 2007-03-15 Seiko Epson Corp 液滴吐出ヘッド及び液滴吐出装置並びに液滴吐出ヘッドの製造方法
US7357644B2 (en) 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
US7621757B2 (en) 2006-06-23 2009-11-24 Delphi Technologies, Inc. Solderless electrical interconnection for electronic package
US7785113B2 (en) * 2006-10-27 2010-08-31 Asahi Denka Kenkyusho Co., Ltd. Electrical connection structure
US20090112767A1 (en) * 2007-10-25 2009-04-30 Ayman Hammad Escrow system and method
US7841078B2 (en) * 2008-01-07 2010-11-30 International Business Machines Corporation Method of optimizing land grid array geometry
JP2010098046A (ja) * 2008-10-15 2010-04-30 Renesas Technology Corp プローブカードおよび半導体装置の製造方法
CN102035085B (zh) * 2009-10-08 2014-03-05 群康科技(深圳)有限公司 导电结构及其制造方法
JP5798848B2 (ja) * 2011-09-14 2015-10-21 デクセリアルズ株式会社 接続方法及び接続構造体の製造方法
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
KR102341794B1 (ko) * 2015-01-15 2021-12-21 삼성디스플레이 주식회사 가요성 표시 장치 및 그 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4453795A (en) * 1975-12-01 1984-06-12 Hughes Aircraft Company Cable-to-cable/component electrical pressure wafer connector assembly
US4184729A (en) * 1977-10-13 1980-01-22 Bunker Ramo Corporation Flexible connector cable
US4647125A (en) * 1985-07-22 1987-03-03 Rogers Corporation Solderless connector technique
US4813129A (en) * 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
EP0338717A3 (en) * 1988-04-21 1990-10-17 McMURDO LIMITED A connector assembly
NL8900676A (nl) * 1989-03-20 1990-10-16 Philips Nv Substraat met interconnectiestructuren.
US5069628A (en) * 1990-03-13 1991-12-03 Hughes Aircraft Company Flexible electrical cable connector with double sided dots
US5147208A (en) * 1991-06-28 1992-09-15 Rogers Corporation Flexible printed circuit with raised contacts
JPH07105420B2 (ja) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー 成形された接点をもった電気接続

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EP0641038A3 (en) 1997-04-02
US5575662A (en) 1996-11-19
DE69428955D1 (de) 2001-12-13
JPH0766240A (ja) 1995-03-10
DE69428955T2 (de) 2002-04-04
EP0641038B1 (en) 2001-11-07
JP2867209B2 (ja) 1999-03-08
EP0641038A2 (en) 1995-03-01

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