AT503053A3 - Kombination aus einem träger und einem wafer - Google Patents
Kombination aus einem träger und einem wafer Download PDFInfo
- Publication number
- AT503053A3 AT503053A3 AT17812006A AT17812006A AT503053A3 AT 503053 A3 AT503053 A3 AT 503053A3 AT 17812006 A AT17812006 A AT 17812006A AT 17812006 A AT17812006 A AT 17812006A AT 503053 A3 AT503053 A3 AT 503053A3
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- carrier
- combination
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1348—Work traversing type
- Y10T156/1352—Work traversing type with liquid applying means
- Y10T156/1361—Cutting after bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200610000687 DE102006000687B4 (de) | 2006-01-03 | 2006-01-03 | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
Publications (3)
Publication Number | Publication Date |
---|---|
AT503053A2 AT503053A2 (de) | 2007-07-15 |
AT503053A3 true AT503053A3 (de) | 2008-04-15 |
AT503053B1 AT503053B1 (de) | 2010-11-15 |
Family
ID=38169821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0178106A AT503053B1 (de) | 2006-01-03 | 2006-10-24 | Kombination aus einem träger und einem wafer |
Country Status (3)
Country | Link |
---|---|
US (7) | US7910454B2 (de) |
AT (1) | AT503053B1 (de) |
DE (1) | DE102006000687B4 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006000687B4 (de) | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
DE202009018064U1 (de) * | 2008-01-24 | 2010-12-02 | Brewer Science, Inc. | Gegenstände beim reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat |
EP2091071B1 (de) * | 2008-02-15 | 2012-12-12 | Soitec | Verfahren zum Bonden zweier Substrate |
DE102008044200B4 (de) * | 2008-11-28 | 2012-08-23 | Thin Materials Ag | Bonding-Verfahren |
EP2402981B1 (de) | 2009-03-18 | 2013-07-10 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger |
EP2290679B1 (de) | 2009-09-01 | 2016-05-04 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Produktsubstrats (z.B. eines Halbleiterwafers) von einem Trägersubstrat durch Verformung eines auf einem Filmrahmen montierten flexiblen Films |
EP2299486B1 (de) * | 2009-09-18 | 2015-02-18 | EV Group E. Thallner GmbH | Verfahren zum Bonden von Chips auf Wafer |
US8613996B2 (en) * | 2009-10-21 | 2013-12-24 | International Business Machines Corporation | Polymeric edge seal for bonded substrates |
US8287980B2 (en) * | 2009-10-29 | 2012-10-16 | International Business Machines Corporation | Edge protection seal for bonded substrates |
US9018308B2 (en) * | 2009-12-01 | 2015-04-28 | Pbi Performance Products, Inc. | Polybenzimidazole/polyacrylate mixtures |
KR101856429B1 (ko) | 2010-03-31 | 2018-05-09 | 에베 그룹 에. 탈너 게엠베하 | 양면에 칩이 장착되는 웨이퍼를 제작하기 위한 방법 |
EP2523209B1 (de) | 2010-04-23 | 2017-03-08 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Produktsubstrats von einem Trägersubstrat |
FR2960340B1 (fr) * | 2010-05-21 | 2012-06-29 | Commissariat Energie Atomique | Procede de realisation d'un support de substrat |
US8852391B2 (en) * | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
US9688014B2 (en) * | 2010-09-01 | 2017-06-27 | Toshiba Kikai Kabushiki Kaisha | Transferring system and transferring method |
US8753460B2 (en) * | 2011-01-28 | 2014-06-17 | International Business Machines Corporation | Reduction of edge chipping during wafer handling |
KR101579772B1 (ko) | 2011-02-18 | 2015-12-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 레벨 싱귤레이션 방법 및 시스템 |
DE102011080653A1 (de) * | 2011-08-09 | 2013-02-14 | Osram Opto Semiconductors Gmbh | Trägerfolie für ein silikonelement und verfahren zum herstellen einer trägerfolie für ein silikonelement |
US8975157B2 (en) | 2012-02-08 | 2015-03-10 | Advanced Semiconductor Engineering, Inc. | Carrier bonding and detaching processes for a semiconductor wafer |
DE102012101237A1 (de) * | 2012-02-16 | 2013-08-22 | Ev Group E. Thallner Gmbh | Verfahren zum temporären Verbinden eines Produktsubstrats mit einem Trägersubstrat |
JP6021431B2 (ja) * | 2012-05-22 | 2016-11-09 | 株式会社ディスコ | 表面保護テープの貼着方法 |
DE102012220345B4 (de) | 2012-11-08 | 2023-02-02 | Disco Corporation | Verfahren zur Bearbeitung einer Wafereinrichtung |
US8962449B1 (en) | 2013-07-30 | 2015-02-24 | Micron Technology, Inc. | Methods for processing semiconductor devices |
JP2015217461A (ja) * | 2014-05-16 | 2015-12-07 | 株式会社ディスコ | ウェーハの加工方法 |
US9475272B2 (en) * | 2014-10-09 | 2016-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | De-bonding and cleaning process and system |
US20180022079A1 (en) * | 2015-01-14 | 2018-01-25 | Ev Group E. Thallner Gmbh | Method and device for detaching a substrate from a substrate stack |
JP2016146429A (ja) * | 2015-02-09 | 2016-08-12 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
NL2014625B1 (en) * | 2015-04-13 | 2017-01-06 | Suss Microtec Lithography Gmbh | Wafer treating device and sealing ring for a wafer treating device. |
KR101630646B1 (ko) * | 2015-05-14 | 2016-06-15 | 주식회사 대화알로이테크 | 면상발열체를 이용한 반도체 진공라인의 히팅 장치 |
US20180068843A1 (en) * | 2016-09-07 | 2018-03-08 | Raytheon Company | Wafer stacking to form a multi-wafer-bonded structure |
DE102017205635A1 (de) | 2017-04-03 | 2018-10-04 | 3D-Micromac Ag | Verfahren und Fertigungssystem zur Herstellung mikroelektronischer Komponenten mit Schichtaufbau |
US10300649B2 (en) | 2017-08-29 | 2019-05-28 | Raytheon Company | Enhancing die flatness |
US10497667B2 (en) | 2017-09-26 | 2019-12-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for bond wave propagation control |
US10847569B2 (en) | 2019-02-26 | 2020-11-24 | Raytheon Company | Wafer level shim processing |
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JP2006135272A (ja) | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
DE102004018250A1 (de) * | 2004-04-15 | 2005-11-03 | Infineon Technologies Ag | Wafer-Stabilisierungsvorrichtung und Verfahren zu dessen Herstellung |
US7829152B2 (en) | 2006-10-05 | 2010-11-09 | Lam Research Corporation | Electroless plating method and apparatus |
JP2006032506A (ja) | 2004-07-14 | 2006-02-02 | Taiyo Yuden Co Ltd | 半導体ウェハの剥離方法および剥離装置 |
KR100610676B1 (ko) * | 2004-08-11 | 2006-08-10 | 한국타이어 주식회사 | 3차원의 물결 및 직선홈을 가진 트레드 패턴 |
JP2006059861A (ja) | 2004-08-17 | 2006-03-02 | Lintec Corp | 脆質部材の転着装置 |
JP4679890B2 (ja) | 2004-11-29 | 2011-05-11 | 東京応化工業株式会社 | サポートプレートの貼り付け装置 |
JP4848153B2 (ja) | 2005-08-10 | 2011-12-28 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP4668052B2 (ja) | 2005-12-06 | 2011-04-13 | 東京応化工業株式会社 | 剥離装置 |
DE102006000687B4 (de) | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
JP2008021929A (ja) | 2006-07-14 | 2008-01-31 | Tokyo Ohka Kogyo Co Ltd | サポートプレート、搬送装置、剥離装置及び剥離方法 |
JP5074940B2 (ja) | 2008-01-30 | 2012-11-14 | 東京応化工業株式会社 | 基板の処理方法 |
JP2009182256A (ja) | 2008-01-31 | 2009-08-13 | Tokyo Ohka Kogyo Co Ltd | 基板の処理装置および基板の処理方法 |
EP2402981B1 (de) | 2009-03-18 | 2013-07-10 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger |
-
2006
- 2006-01-03 DE DE200610000687 patent/DE102006000687B4/de active Active
- 2006-10-24 AT AT0178106A patent/AT503053B1/de active
- 2006-12-14 US US11/610,750 patent/US7910454B2/en active Active
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2010
- 2010-11-01 US US12/916,751 patent/US8349701B2/en active Active
- 2010-11-01 US US12/916,734 patent/US8156981B2/en active Active
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2012
- 2012-05-04 US US13/464,088 patent/US8293063B2/en active Active
- 2012-05-04 US US13/464,187 patent/US8536020B2/en active Active
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2013
- 2013-06-12 US US13/915,908 patent/US8664082B2/en active Active
- 2013-07-22 US US13/947,265 patent/US8802542B2/en active Active
Also Published As
Publication number | Publication date |
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US8293063B2 (en) | 2012-10-23 |
US8802542B2 (en) | 2014-08-12 |
US20120216959A1 (en) | 2012-08-30 |
AT503053A2 (de) | 2007-07-15 |
DE102006000687B4 (de) | 2010-09-09 |
AT503053B1 (de) | 2010-11-15 |
US8156981B2 (en) | 2012-04-17 |
US20110045240A1 (en) | 2011-02-24 |
US8536020B2 (en) | 2013-09-17 |
US8349701B2 (en) | 2013-01-08 |
US20130309840A1 (en) | 2013-11-21 |
DE102006000687A1 (de) | 2007-07-12 |
US7910454B2 (en) | 2011-03-22 |
US20120247640A1 (en) | 2012-10-04 |
US20070155129A1 (en) | 2007-07-05 |
US20110042010A1 (en) | 2011-02-24 |
US8664082B2 (en) | 2014-03-04 |
US20130295746A1 (en) | 2013-11-07 |
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