ZA201301890B - Printed temperature sensor - Google Patents
Printed temperature sensorInfo
- Publication number
- ZA201301890B ZA201301890B ZA2013/01890A ZA201301890A ZA201301890B ZA 201301890 B ZA201301890 B ZA 201301890B ZA 2013/01890 A ZA2013/01890 A ZA 2013/01890A ZA 201301890 A ZA201301890 A ZA 201301890A ZA 201301890 B ZA201301890 B ZA 201301890B
- Authority
- ZA
- South Africa
- Prior art keywords
- temperature sensor
- printed temperature
- printed
- sensor
- temperature
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed with two or more layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA201006532 | 2010-09-13 | ||
| PCT/IB2011/054001 WO2012035494A1 (en) | 2010-09-13 | 2011-09-13 | Printed temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA201301890B true ZA201301890B (en) | 2014-05-28 |
Family
ID=45831072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA2013/01890A ZA201301890B (en) | 2010-09-13 | 2013-03-13 | Printed temperature sensor |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9029180B2 (https=) |
| EP (1) | EP2616784B1 (https=) |
| JP (1) | JP5806316B2 (https=) |
| KR (1) | KR20130128383A (https=) |
| CN (1) | CN103210290B (https=) |
| ES (1) | ES2663098T3 (https=) |
| RU (1) | RU2013116739A (https=) |
| WO (1) | WO2012035494A1 (https=) |
| ZA (1) | ZA201301890B (https=) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112010004038T5 (de) | 2009-10-16 | 2012-09-20 | Kesumo, Llc | Fussbetätigter Controller |
| CN104185780A (zh) * | 2012-01-30 | 2014-12-03 | Pst传感器(私人)有限公司 | 热成像传感器 |
| US9076419B2 (en) | 2012-03-14 | 2015-07-07 | Bebop Sensors, Inc. | Multi-touch pad controller |
| DE102012111458B4 (de) * | 2012-11-27 | 2022-12-08 | Tdk Electronics Ag | Halbleitervorrichtung |
| US20150108632A1 (en) * | 2013-10-23 | 2015-04-23 | Nano And Advanced Materials Institute Limited | Thin film with negative temperature coefficient behavior and method of making thereof |
| JP6024642B2 (ja) * | 2013-10-25 | 2016-11-16 | 株式会社デンソー | 熱電変換装置およびその製造方法 |
| WO2015096927A1 (en) * | 2013-12-27 | 2015-07-02 | Arcelik Anonim Sirketi | An induction cooker, the safe utilization of which is provided |
| US9281104B2 (en) * | 2014-03-11 | 2016-03-08 | Nano And Advanced Materials Institute Limited | Conductive thin film comprising silicon-carbon composite as printable thermistors |
| CN106415225B (zh) * | 2014-04-15 | 2019-06-04 | 皇家飞利浦有限公司 | 用于温度测量的低成本磁共振安全探头 |
| US9753568B2 (en) | 2014-05-15 | 2017-09-05 | Bebop Sensors, Inc. | Flexible sensors and applications |
| US9965076B2 (en) * | 2014-05-15 | 2018-05-08 | Bebop Sensors, Inc. | Piezoresistive sensors and applications |
| US9442614B2 (en) | 2014-05-15 | 2016-09-13 | Bebop Sensors, Inc. | Two-dimensional sensor arrays |
| US10362989B2 (en) | 2014-06-09 | 2019-07-30 | Bebop Sensors, Inc. | Sensor system integrated with a glove |
| TWI711806B (zh) | 2014-07-22 | 2020-12-01 | 美商布魯爾科技公司 | 傳感器、感測器以及偵測條件之存在的方法 |
| US9931778B2 (en) | 2014-09-18 | 2018-04-03 | The Boeing Company | Extruded deposition of fiber reinforced polymers |
| US9863823B2 (en) | 2015-02-27 | 2018-01-09 | Bebop Sensors, Inc. | Sensor systems integrated with footwear |
| KR102381654B1 (ko) * | 2015-03-23 | 2022-04-04 | 삼성디스플레이 주식회사 | 온도 검출 소자 및 이를 이용한 온도 센서 |
| JP6532259B2 (ja) * | 2015-03-27 | 2019-06-19 | 東京コスモス電機株式会社 | 温度センサ |
| US10082381B2 (en) | 2015-04-30 | 2018-09-25 | Bebop Sensors, Inc. | Sensor systems integrated with vehicle tires |
| US9827996B2 (en) | 2015-06-25 | 2017-11-28 | Bebop Sensors, Inc. | Sensor systems integrated with steering wheels |
| WO2017022373A1 (ja) | 2015-07-31 | 2017-02-09 | 株式会社村田製作所 | 温度センサ |
| US10034609B2 (en) * | 2015-11-05 | 2018-07-31 | Nano And Advanced Materials Institute Limited | Temperature sensor for tracking body temperature based on printable nanomaterial thermistor |
| JP2018534573A (ja) * | 2015-11-18 | 2018-11-22 | ピーエスティ・センサーズ・(プロプライエタリー)・リミテッドPst Sensors (Proprietary) Limited | デジタルセンサ |
| US10393598B1 (en) * | 2015-12-03 | 2019-08-27 | FluxTeq LLC | Heat flux gage |
| CN107560750A (zh) * | 2016-06-30 | 2018-01-09 | 国神光电科技(上海)有限公司 | 一种测温电路及一种测温结构 |
| CN106322457B (zh) * | 2016-09-09 | 2018-10-23 | 深圳拓邦股份有限公司 | 一种电磁灶 |
| DE102016119340A1 (de) * | 2016-10-11 | 2018-04-12 | Heraeus Sensor Technology Gmbh | Verfahren zur Herstellung eines Sensors, Sensor und Verwendung eines Sensors |
| WO2018073826A1 (en) * | 2016-10-22 | 2018-04-26 | Lapidot Matan | Mobile inspection system for the detection of defect occurrence and location |
| CN106556473A (zh) * | 2016-11-23 | 2017-04-05 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| CN106556474A (zh) * | 2016-11-23 | 2017-04-05 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| CN106644144A (zh) * | 2016-11-23 | 2017-05-10 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| CN106370318A (zh) * | 2016-11-23 | 2017-02-01 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| EP3373310A1 (en) * | 2017-03-06 | 2018-09-12 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Printed temperature sensor |
| DE102017105317B3 (de) | 2017-03-14 | 2018-05-09 | Helmholtz-Zentrum Dresden - Rossendorf E.V. | Vorrichtung zum Charakterisieren des elektrischen Widerstandes eines Messobjekts |
| KR101923074B1 (ko) | 2017-03-21 | 2018-11-28 | 부경대학교 산학협력단 | 저온 센서용 금 나노입자-실리콘 복합소재 |
| CN107063492A (zh) * | 2017-04-20 | 2017-08-18 | 武汉大学 | 一种印刷型温度传感器及应用该温度传感器的疏散标志 |
| KR20190004974A (ko) * | 2017-07-05 | 2019-01-15 | 주식회사 이엠따블유 | 프린팅 공정을 이용한 센서의 제조방법 및 이에 의해 제조된 센서 |
| EP3435048A1 (de) | 2017-07-25 | 2019-01-30 | Heraeus Sensor Technology GmbH | Sensor zur erfassung eines räumlichen temperaturprofils und verfahren zur herstellung einer sensoreinheit |
| TW201930837A (zh) * | 2017-09-05 | 2019-08-01 | 美商力特福斯股份有限公司 | 溫度感應膠帶 |
| US11300458B2 (en) | 2017-09-05 | 2022-04-12 | Littelfuse, Inc. | Temperature sensing tape, assembly, and method of temperature control |
| KR102073720B1 (ko) * | 2017-12-15 | 2020-02-05 | (주) 텔로팜 | 최소 침습 기술을 이용한 식물의 수액 흐름 측정용 마이크로 니들 프로브 장치 |
| EP3521786B8 (en) | 2018-01-31 | 2020-11-18 | ABB Power Grids Switzerland AG | Wound electrical component with printed electronics sensor |
| DE102018102471B3 (de) * | 2018-02-05 | 2019-02-21 | Leoni Kabel Gmbh | Vorrichtung und Verfahren zur Messung einer Temperaturverteilung auf einer Oberfläche |
| JP6524567B1 (ja) * | 2018-02-28 | 2019-06-05 | 株式会社Gceインスティチュート | 熱電素子、熱電装置、及び熱電素子の形成方法 |
| KR102007446B1 (ko) * | 2018-05-21 | 2019-10-21 | 해성디에스 주식회사 | 센서 유닛, 이를 포함하는 온도 센서, 센서 유닛의 제조방법 및 이를 이용하여 제조된 온도 센서 |
| US10884496B2 (en) | 2018-07-05 | 2021-01-05 | Bebop Sensors, Inc. | One-size-fits-all data glove |
| KR102131121B1 (ko) * | 2018-08-28 | 2020-07-07 | 건국대학교 산학협력단 | 플렉시블 온도 센서를 활용한 온도 제어 시스템 |
| US11280685B2 (en) | 2018-10-01 | 2022-03-22 | Goodrich Corporation | Additive manufactured resistance temperature detector |
| US11085833B2 (en) * | 2018-10-31 | 2021-08-10 | Xerox Corporation | Temperature sensor ink composition with metal oxide nanoparticles |
| US11187590B2 (en) | 2018-11-13 | 2021-11-30 | Institut National D'optique | Microbolometer detectors and arrays for printed photonics applications |
| KR102205001B1 (ko) * | 2019-01-28 | 2021-01-18 | 순천대학교 산학협력단 | 롤투롤 그라비아 인쇄를 이용한 온도 센서 태그 제조 방법 |
| CN109781291B (zh) * | 2019-02-02 | 2021-10-26 | 五邑大学 | 一种柔性温度传感器 |
| JP7374589B2 (ja) * | 2019-02-06 | 2023-11-07 | 日東電工株式会社 | 温度センサフィルム、導電フィルムおよびその製造方法 |
| US11480481B2 (en) | 2019-03-13 | 2022-10-25 | Bebop Sensors, Inc. | Alignment mechanisms sensor systems employing piezoresistive materials |
| TWI728345B (zh) * | 2019-04-19 | 2021-05-21 | 美宸科技股份有限公司 | 柔性感測器 |
| DE102019122364A1 (de) * | 2019-08-20 | 2021-02-25 | Schreiner Group Gmbh & Co. Kg | Gegenstand zur Durchführung einer elektrischen Messung an einer Messschicht |
| DE102019127915A1 (de) | 2019-10-16 | 2021-04-22 | Tdk Electronics Ag | Sensorelement und Verfahren zur Herstellung eines Sensorelements |
| DE102019127924B3 (de) | 2019-10-16 | 2021-01-21 | Tdk Electronics Ag | Bauelement und Verfahren zur Herstellung eines Bauelements |
| WO2021214461A1 (en) * | 2020-04-22 | 2021-10-28 | Nanoco 2D Materials Limited | Negative Temperature Coefficient (NTC) Thermistors Utilising Transition Metal Dichalcogenide Quantum Dots |
| KR102418224B1 (ko) * | 2020-04-24 | 2022-07-08 | 성균관대학교산학협력단 | 탈부착이 가능한 수유병 센싱 장치 및 상기 장치를 포함하는 수유병 모니터링 시스템 |
| JP7519043B2 (ja) | 2020-06-12 | 2024-07-19 | Tianma Japan株式会社 | 熱電変換素子及び熱電変換モジュール |
| US11688614B2 (en) * | 2021-04-28 | 2023-06-27 | Kla Corporation | Mitigating thermal expansion mismatch in temperature probe construction apparatus and method |
| FI129739B (en) * | 2021-06-08 | 2022-08-15 | Teknologian Tutkimuskeskus Vtt Oy | Improved negative temperature coefficient thermistor |
| CN114980382B (zh) * | 2022-05-09 | 2025-02-25 | 闽都创新实验室 | 一种微型加热器及其应用 |
| WO2024102851A1 (en) * | 2022-11-09 | 2024-05-16 | Littelfuse, Inc. | Temperature sensing tape having a temperature sensor element with multiple crystallization points |
| TWI898800B (zh) * | 2024-08-23 | 2025-09-21 | 國巨股份有限公司 | 電阻器及其製作方法 |
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| US4415607A (en) * | 1982-09-13 | 1983-11-15 | Allen-Bradley Company | Method of manufacturing printed circuit network devices |
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-
2011
- 2011-09-13 ES ES11824675.0T patent/ES2663098T3/es active Active
- 2011-09-13 JP JP2013528807A patent/JP5806316B2/ja not_active Expired - Fee Related
- 2011-09-13 EP EP11824675.0A patent/EP2616784B1/en not_active Not-in-force
- 2011-09-13 US US13/822,965 patent/US9029180B2/en not_active Expired - Fee Related
- 2011-09-13 WO PCT/IB2011/054001 patent/WO2012035494A1/en not_active Ceased
- 2011-09-13 CN CN201180054592.XA patent/CN103210290B/zh not_active Expired - Fee Related
- 2011-09-13 KR KR1020137009246A patent/KR20130128383A/ko not_active Ceased
- 2011-09-13 RU RU2013116739/07A patent/RU2013116739A/ru unknown
-
2013
- 2013-03-13 ZA ZA2013/01890A patent/ZA201301890B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2616784A1 (en) | 2013-07-24 |
| US9029180B2 (en) | 2015-05-12 |
| EP2616784B1 (en) | 2017-12-20 |
| JP5806316B2 (ja) | 2015-11-10 |
| CN103210290A (zh) | 2013-07-17 |
| KR20130128383A (ko) | 2013-11-26 |
| CN103210290B (zh) | 2015-12-09 |
| WO2012035494A1 (en) | 2012-03-22 |
| RU2013116739A (ru) | 2014-10-20 |
| JP2013538462A (ja) | 2013-10-10 |
| ES2663098T3 (es) | 2018-04-11 |
| EP2616784A4 (en) | 2015-09-09 |
| US20130203201A1 (en) | 2013-08-08 |
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