ZA200704704B - Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors - Google Patents

Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors

Info

Publication number
ZA200704704B
ZA200704704B ZA200704704A ZA200704704A ZA200704704B ZA 200704704 B ZA200704704 B ZA 200704704B ZA 200704704 A ZA200704704 A ZA 200704704A ZA 200704704 A ZA200704704 A ZA 200704704A ZA 200704704 B ZA200704704 B ZA 200704704B
Authority
ZA
South Africa
Prior art keywords
cleaning compositions
aqueous
compositions containing
corrosion inhibitors
containing polymeric
Prior art date
Application number
ZA200704704A
Other languages
English (en)
Inventor
Inaoka Seiji
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of ZA200704704B publication Critical patent/ZA200704704B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3723—Polyamines or polyalkyleneimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
ZA200704704A 2004-12-10 2007-06-08 Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors ZA200704704B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63494504P 2004-12-10 2004-12-10

Publications (1)

Publication Number Publication Date
ZA200704704B true ZA200704704B (en) 2008-09-25

Family

ID=34960534

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200704704A ZA200704704B (en) 2004-12-10 2007-06-08 Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors

Country Status (17)

Country Link
US (2) US7947639B2 (xx)
EP (1) EP1828848B1 (xx)
JP (1) JP4272677B2 (xx)
KR (1) KR100744223B1 (xx)
CN (1) CN101076760B (xx)
AT (1) ATE463763T1 (xx)
BR (1) BRPI0518420A2 (xx)
CA (1) CA2591477A1 (xx)
DE (1) DE602005020499D1 (xx)
IL (1) IL183699A (xx)
MY (1) MY143658A (xx)
NO (1) NO20073497L (xx)
PL (1) PL1828848T3 (xx)
PT (1) PT1828848E (xx)
TW (1) TWI353380B (xx)
WO (1) WO2006065256A1 (xx)
ZA (1) ZA200704704B (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060064441A (ko) * 2004-12-08 2006-06-13 말린크로트 베이커, 인코포레이티드 비수성 비부식성 마이크로전자 세정 조성물
JP4272677B2 (ja) * 2004-12-10 2009-06-03 マリンクロッド・ベイカー・インコーポレイテッド ポリマー腐食阻害剤含有、非水性非腐食性マイクロエレクトロニクス洗浄組成物
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
CN101126053A (zh) * 2006-08-17 2008-02-20 安集微电子（上海）有限公司 用于半导体工业中等离子刻蚀残留物的清洗液组合物
CN101959977B (zh) * 2008-02-29 2013-12-04 安万托特性材料股份有限公司 微电子基底清洁组合物
SG188848A1 (en) * 2008-03-07 2013-04-30 Advanced Tech Materials Non-selective oxide etch wet clean composition and method of use
JP5305803B2 (ja) * 2008-09-19 2013-10-02 株式会社カネカ ポリエーテル類の製造方法
KR101579846B1 (ko) * 2008-12-24 2015-12-24 주식회사 이엔에프테크놀로지 포토레지스트 패턴 제거용 조성물 및 이를 이용한 금속 패턴의 형성 방법
CA2753399A1 (en) * 2009-02-25 2010-09-02 Avantor Performance Materials, Inc. Multipurpose acidic, organic solvent based microelectronic cleaning composition
SG11201400840UA (en) 2011-10-05 2014-04-28 Avantor Performance Mat Inc Microelectronic substrate cleaning compositions having copper/azole polymer inhibition
CN102618900B (zh) * 2012-04-14 2016-12-14 烟台恒迪克能源科技有限公司 一种三极管表面处理液及其制备方法
CN109971565B (zh) * 2017-12-27 2021-10-22 安集微电子（上海）有限公司 一种含氟清洗液
JP2020094152A (ja) * 2018-12-14 2020-06-18 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 基板洗浄液、これを用いる洗浄された基板の製造方法およびデバイスの製造方法
WO2022093752A1 (en) * 2020-10-26 2022-05-05 Lsp Technologies, Inc. System and method for in-process corrosion inhibition in laser peening
CN113201743B (zh) * 2021-04-08 2022-06-21 浙江工业大学 一种适用于电子器件的除锈剂及其制备方法
CN113921383B (zh) 2021-09-14 2022-06-03 浙江奥首材料科技有限公司 一种铜表面钝化组合物、其用途及包含其的光刻胶剥离液

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208752A (ja) 1984-04-03 1985-10-21 Asahi Glass Co Ltd ホトレジスト剥離用組成物
IE59971B1 (en) 1986-11-10 1994-05-04 Baker J T Inc Stripping compositions and their use for stripping resists from substrates
CA2059867A1 (en) * 1991-02-13 1992-08-14 Miles Inc. Binder and vehicle for inks and other color formulations
US5561105A (en) 1995-05-08 1996-10-01 Ocg Microelectronic Materials, Inc. Chelating reagent containing photoresist stripper composition
JPH08311492A (ja) * 1995-05-19 1996-11-26 Yushiro Chem Ind Co Ltd 水系洗浄剤組成物
JPH0934117A (ja) 1995-07-21 1997-02-07 Fuji Photo Film Co Ltd 光重合性平版印刷版
US6268323B1 (en) * 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6136714A (en) 1998-12-17 2000-10-24 Siemens Aktiengesellschaft Methods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductor
JP3891768B2 (ja) * 1999-12-28 2007-03-14 株式会社トクヤマ 残さ洗浄液
KR100522845B1 (ko) 2000-09-01 2005-10-20 가부시끼가이샤 도꾸야마 잔류물 제거용 세정액
US6599370B2 (en) * 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
KR200241834Y1 (ko) * 2001-05-14 2001-10-15 김경철 농업용 열풍보일러
CN100403169C (zh) * 2001-07-13 2008-07-16 Ekc技术公司 亚砜吡咯烷酮链烷醇胺剥离和清洗组合物
JP4639567B2 (ja) 2001-09-28 2011-02-23 三菱瓦斯化学株式会社 フォトレジスト剥離液組成物
JP2004101849A (ja) * 2002-09-09 2004-04-02 Mitsubishi Gas Chem Co Inc 洗浄剤組成物
JP4272677B2 (ja) * 2004-12-10 2009-06-03 マリンクロッド・ベイカー・インコーポレイテッド ポリマー腐食阻害剤含有、非水性非腐食性マイクロエレクトロニクス洗浄組成物

Also Published As

Publication number Publication date
NO20073497L (no) 2007-07-06
KR20060065412A (ko) 2006-06-14
PT1828848E (pt) 2010-05-21
KR100744223B1 (ko) 2007-07-30
CN101076760B (zh) 2010-12-22
WO2006065256A1 (en) 2006-06-22
PL1828848T3 (pl) 2010-09-30
CA2591477A1 (en) 2006-06-22
US20090156453A1 (en) 2009-06-18
TW200619379A (en) 2006-06-16
DE602005020499D1 (de) 2010-05-20
EP1828848A1 (en) 2007-09-05
IL183699A (en) 2012-10-31
BRPI0518420A2 (pt) 2008-11-25
EP1828848B1 (en) 2010-04-07
IL183699A0 (en) 2007-09-20
US7947639B2 (en) 2011-05-24
ATE463763T1 (de) 2010-04-15
TWI353380B (en) 2011-12-01
CN101076760A (zh) 2007-11-21
JP2007514984A (ja) 2007-06-07
MY143658A (en) 2011-06-30
US20110207645A1 (en) 2011-08-25
JP4272677B2 (ja) 2009-06-03

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