TW200519238A - Electrolytic copper-stripping liquid and electrolytic stripping method - Google Patents
Electrolytic copper-stripping liquid and electrolytic stripping methodInfo
- Publication number
- TW200519238A TW200519238A TW093132148A TW93132148A TW200519238A TW 200519238 A TW200519238 A TW 200519238A TW 093132148 A TW093132148 A TW 093132148A TW 93132148 A TW93132148 A TW 93132148A TW 200519238 A TW200519238 A TW 200519238A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrolytic
- stripping
- copper
- liquid
- stripping liquid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F5/00—Electrolytic stripping of metallic layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The present invention provides an electrolytic copper-stripping liquid free from a cyan compound, which comprises a copper compound or an aromatic nitro compound as a copper-oxidizing agent, and which has a pH of from 9 to 12. Also disclosed is an electrolytic stripping method using the electrolytic stripping liquid.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003413387A JP4264338B2 (en) | 2003-12-11 | 2003-12-11 | Copper electrolytic stripping solution and electrolytic stripping method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200519238A true TW200519238A (en) | 2005-06-16 |
TWI385283B TWI385283B (en) | 2013-02-11 |
Family
ID=34650502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093132148A TWI385283B (en) | 2003-12-11 | 2004-10-22 | Electrolytic copper-stripping liquid and electrolytic stripping method |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050126926A1 (en) |
JP (1) | JP4264338B2 (en) |
KR (1) | KR20050058184A (en) |
CN (1) | CN1626703A (en) |
TW (1) | TWI385283B (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009108922A1 (en) * | 2008-02-28 | 2009-09-03 | Aeromet Technologies, Inc. | Methods for removing precious metal-containing coatings and recovery of precious metals therefrom |
US9957622B2 (en) | 2009-07-23 | 2018-05-01 | Field Upgrading Limited | Device and method of obtaining diols and other chemicals using decarboxylation |
US8647492B2 (en) | 2009-07-23 | 2014-02-11 | Ceramatec, Inc. | Method of producing coupled radical products from biomass |
CN103397373A (en) * | 2010-06-25 | 2013-11-20 | 张红雨 | Deplating solution |
US9493882B2 (en) * | 2010-07-21 | 2016-11-15 | Ceramatec, Inc. | Custom ionic liquid electrolytes for electrolytic decarboxylation |
KR101915824B1 (en) | 2011-01-25 | 2018-11-06 | 필드 업그레이딩 리미티드 | Production of fuel from chemicals derived from biomass |
DE102011005918A1 (en) * | 2011-03-22 | 2012-09-27 | Airbus Operations Gmbh | Peelable anodizing agent, especially for local anodic oxidation of metal surfaces |
CN102168290B (en) * | 2011-04-08 | 2012-10-17 | 哈尔滨工业大学 | Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof |
CN104404611B (en) * | 2014-11-28 | 2016-11-30 | 江门市瑞期精细化学工程有限公司 | A kind of release agent for electrolytic of copper alloy surface coating and preparation method thereof |
EP3168332B2 (en) | 2015-03-13 | 2023-07-26 | Okuno Chemical Industries Co., Ltd. | Use of a jig electrolytic stripper for removing palladium from an object and a method for removing palladium |
CN104882494B (en) * | 2015-04-27 | 2017-02-22 | 中国科学院光电技术研究所 | Film stripping process for removing silver reflective film with chromium-containing material as adhesive layer |
CN105543948B (en) * | 2015-12-23 | 2017-10-31 | 苏州卓融新能源科技有限公司 | It is a kind of for PCB electroplate accompany plating plate/drag cylinder plate move back process for copper |
KR102226075B1 (en) | 2017-04-05 | 2021-03-11 | 단국대학교 산학협력단 | A hydrogen gas filter using proton beam |
CN109778299B (en) * | 2019-02-22 | 2021-05-04 | 江门市瑞期精细化学工程有限公司 | Electrolytic stripping agent for copper-plated layer on surface of iron base material, and preparation method and stripping process thereof |
CN111487267B (en) * | 2020-04-09 | 2023-04-14 | 哈尔滨工业大学 | Method for stripping double-layer oxide film defect in aluminum bronze alloy |
CN113122906B (en) * | 2021-03-23 | 2022-11-15 | 广州市睿承科技有限公司 | Electric release oil synergist |
CN113652694A (en) * | 2021-06-24 | 2021-11-16 | 广东桐鸣环保科技有限公司 | Copper plating layer stripping liquid and stripping method |
KR102534371B1 (en) * | 2021-08-30 | 2023-05-26 | 이강익 | Portable Electrolytic polisher Using Neutral Salt Electrolyte |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2596307A (en) * | 1947-11-05 | 1952-05-13 | Charles Litzenberg | Process of electrostripping electrodeposited metals |
US4264420A (en) * | 1979-10-29 | 1981-04-28 | Oxy Metal Industries Corporation | Electrolytic stripping bath and process |
JPS6056800B2 (en) * | 1982-08-11 | 1985-12-11 | 新光電気工業株式会社 | Method for removing protruding parts of base copper plating in partial silver plating and method for finishing surface of silver plating |
US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
-
2003
- 2003-12-11 JP JP2003413387A patent/JP4264338B2/en not_active Expired - Fee Related
-
2004
- 2004-10-15 KR KR1020040082415A patent/KR20050058184A/en not_active Application Discontinuation
- 2004-10-22 CN CNA2004100860305A patent/CN1626703A/en active Pending
- 2004-10-22 TW TW093132148A patent/TWI385283B/en not_active IP Right Cessation
- 2004-10-22 US US10/971,898 patent/US20050126926A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1626703A (en) | 2005-06-15 |
JP2005171320A (en) | 2005-06-30 |
KR20050058184A (en) | 2005-06-16 |
JP4264338B2 (en) | 2009-05-13 |
TWI385283B (en) | 2013-02-11 |
US20050126926A1 (en) | 2005-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |