TWI353380B - Non-aqueous, non-corrosive microelectronic cleanin - Google Patents
Non-aqueous, non-corrosive microelectronic cleanin Download PDFInfo
- Publication number
- TWI353380B TWI353380B TW094108992A TW94108992A TWI353380B TW I353380 B TWI353380 B TW I353380B TW 094108992 A TW094108992 A TW 094108992A TW 94108992 A TW94108992 A TW 94108992A TW I353380 B TWI353380 B TW I353380B
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- Taiwan
- Prior art keywords
- group
- cleaning composition
- composition
- ethylene
- cleaning
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- 238000004377 microelectronic Methods 0.000 title claims description 18
- 230000009972 noncorrosive effect Effects 0.000 title abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 92
- 238000004140 cleaning Methods 0.000 claims abstract description 47
- 238000005260 corrosion Methods 0.000 claims abstract description 25
- 230000007797 corrosion Effects 0.000 claims abstract description 24
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 24
- 229920000642 polymer Polymers 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000003112 inhibitor Substances 0.000 claims abstract description 18
- 150000001412 amines Chemical class 0.000 claims abstract description 16
- 239000003495 polar organic solvent Substances 0.000 claims abstract description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- -1 Poly(hydroxyalkyl acrylate Chemical compound 0.000 claims description 10
- 229920002873 Polyethylenimine Polymers 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000002798 polar solvent Substances 0.000 claims description 8
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000005977 Ethylene Substances 0.000 claims description 7
- 239000004615 ingredient Substances 0.000 claims description 7
- 230000002401 inhibitory effect Effects 0.000 claims description 7
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 239000008139 complexing agent Substances 0.000 claims description 5
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 4
- CMJLMPKFQPJDKP-UHFFFAOYSA-N 3-methylthiolane 1,1-dioxide Chemical compound CC1CCS(=O)(=O)C1 CMJLMPKFQPJDKP-UHFFFAOYSA-N 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 239000006184 cosolvent Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 229920006001 poly(vinyl alcohol-co-ethylene) Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 3
- AIDFJGKWTOULTC-UHFFFAOYSA-N 1-butylsulfonylbutane Chemical compound CCCCS(=O)(=O)CCCC AIDFJGKWTOULTC-UHFFFAOYSA-N 0.000 claims description 2
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000003599 detergent Substances 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 4
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 claims 2
- HQFQTTNMBUPQAY-UHFFFAOYSA-N cyclobutylhydrazine Chemical compound NNC1CCC1 HQFQTTNMBUPQAY-UHFFFAOYSA-N 0.000 claims 2
- KWTSXDURSIMDCE-QMMMGPOBSA-N (S)-amphetamine Chemical compound C[C@H](N)CC1=CC=CC=C1 KWTSXDURSIMDCE-QMMMGPOBSA-N 0.000 claims 1
- RJLKIAGOYBARJG-UHFFFAOYSA-N 1,3-dimethylpiperidin-2-one Chemical compound CC1CCCN(C)C1=O RJLKIAGOYBARJG-UHFFFAOYSA-N 0.000 claims 1
- ODNPATOFEUFJRH-UHFFFAOYSA-N 1-hydrazinylpyrrolidin-2-one Chemical compound NNN1CCCC1=O ODNPATOFEUFJRH-UHFFFAOYSA-N 0.000 claims 1
- JEXYCADTAFPULN-UHFFFAOYSA-N 1-propylsulfonylpropane Chemical compound CCCS(=O)(=O)CCC JEXYCADTAFPULN-UHFFFAOYSA-N 0.000 claims 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 claims 1
- 240000005979 Hordeum vulgare Species 0.000 claims 1
- 235000007340 Hordeum vulgare Nutrition 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 229930013930 alkaloid Natural products 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229940025084 amphetamine Drugs 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- HOBBGWUQJYXTQU-UHFFFAOYSA-N sulfurodithioic O,O-acid Chemical compound OS(O)(=S)=S HOBBGWUQJYXTQU-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 19
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 11
- 238000001465 metallisation Methods 0.000 description 10
- 238000004380 ashing Methods 0.000 description 5
- 239000002738 chelating agent Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000000637 aluminium metallisation Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000012085 test solution Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
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- 230000008569 process Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- PFTAWBLQPZVEMU-DZGCQCFKSA-N (+)-catechin Chemical compound C1([C@H]2OC3=CC(O)=CC(O)=C3C[C@@H]2O)=CC=C(O)C(O)=C1 PFTAWBLQPZVEMU-DZGCQCFKSA-N 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 description 1
- ATPNEAQEWYMEJG-UHFFFAOYSA-N 1-propyl-9h-fluorene Chemical compound C1C2=CC=CC=C2C2=C1C(CCC)=CC=C2 ATPNEAQEWYMEJG-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- JOWBFITYYIZBFK-UHFFFAOYSA-N 2,2-bis(sulfanyl)acetamide Chemical compound NC(=O)C(S)S JOWBFITYYIZBFK-UHFFFAOYSA-N 0.000 description 1
- FCKYPQBAHLOOJQ-UWVGGRQHSA-N 2-[[(1s,2s)-2-[bis(carboxymethyl)amino]cyclohexyl]-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)[C@H]1CCCC[C@@H]1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UWVGGRQHSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- 244000080767 Areca catechu Species 0.000 description 1
- 235000006226 Areca catechu Nutrition 0.000 description 1
- 235000016068 Berberis vulgaris Nutrition 0.000 description 1
- 241000335053 Beta vulgaris Species 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical class CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- 108010068370 Glutens Proteins 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- WZQGFVLHMQEHOY-UHFFFAOYSA-N SC1C(N(CCC1)S)=O Chemical compound SC1C(N(CCC1)S)=O WZQGFVLHMQEHOY-UHFFFAOYSA-N 0.000 description 1
- TWXHOCQWENATIA-UHFFFAOYSA-N SNNS Chemical compound SNNS TWXHOCQWENATIA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000012964 benzotriazole Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
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- 125000000524 functional group Chemical group 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- SAMYCKUDTNLASP-UHFFFAOYSA-N hexane-2,2-diol Chemical compound CCCCC(C)(O)O SAMYCKUDTNLASP-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- HDZGCSFEDULWCS-UHFFFAOYSA-N monomethylhydrazine Chemical compound CNN HDZGCSFEDULWCS-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical group 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920001603 poly (alkyl acrylates) Polymers 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- BGKZULDOBMANRY-UHFFFAOYSA-N sulfanyl prop-2-enoate Chemical compound SOC(=O)C=C BGKZULDOBMANRY-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- HODRFAVLXIFVTR-RKDXNWHRSA-N tevenel Chemical compound NS(=O)(=O)C1=CC=C([C@@H](O)[C@@H](CO)NC(=O)C(Cl)Cl)C=C1 HODRFAVLXIFVTR-RKDXNWHRSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical group C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
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- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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Description
^53380 九、發明說明： * 【發明所屬之技術領域】 ••本發明係關於清潔微電子基材之方法及非水性、本質上 非腐姓性清潔組合物’且特別是關於該清潔組合物可使用 並具有與銅金屬化特性化之微電子基材及鋁金屬化特性化 之基材的改良相容性。本發明亦關於該清潔組合物於汽提 光阻材料及清潔來自產生有機、有機金屬及無機化合物之 姓刻與電漿過程之殘餘物之用途。 * 【先前技術】 曾&出許多光阻材料汽提劑及殘餘物移除劑用於微電子 領域作為生產線清潔劑之下游或後端。在製造過程中，光 阻材料之薄膜沉積在晶圓基材上，然後電路設計印在薄膜 上。在烘焙後，未聚合防蝕材料係用光阻材料展開劑移除。 然後所得影像利用反射性電漿蝕刻氣體或化學蝕刻物溶液 轉移至下方材料’其通常為介電質或金屬。姓刻氣體或化 學蝕刻物溶液選擇性侵襲光阻材料未保護的基材區。 * 此外，在儀刻步驟終止後，防钱罩必須自晶圓之保護區 移除，使得最後修整操作可進行。此可使用適當電聚灰磨 氣體或濕化學汽提劑於電漿灰磨步驟中完成。頃發現適當 清潔組合物供此防蝕罩材料之移除而不會不利地影響，例 如腐蝕、/谷解或消光時，金屬電路亦經證實有問題。 由於微電子製造整合準位增加及圖案化微電子裝置面積 朝向原子之尺寸減少，電流通過電路形成之熱變成嚴重問 題。其變成在此技藝中日增普遍以使用銅金屬化作為導體 100317.doc 1353380 材料取代鋁，因為銅更有益於減少熱形成。此等含銅微電 子材料呈現額外挑戰性以發現可接受清潔劑組合物。先前 發展供含有Al/Si〇2或Al(Cu)/Si〇2結構之"傳統"或，，習用"半 導體裝置之許多加工技術組合物無法使用銅金屬化結構。 例如，以羥基胺為主汽提劑或殘餘移除劑組合物可成功地 用於具有A1金屬化之清潔裝置，但實際上卻不適合供該等 具有銅金屬化者。同樣，許多用於具有鋼金屬化之清潔裝 置之汽提劑或殘餘物移除劑組合物不適於A1金屬化裝置， 除非對組合物作顯著調整。 在對該銅及鋁金屬化微電子結構之電漿蝕刻及/或灰磨 過程後，此等蝕刻及/或灰磨殘餘物之移除經證實有問題， 特別是對用銅金屬化之基材^無法完全移除或中和此等殘 餘物可導致水份之吸收及可造成對金屬結構之腐蝕之不宜 物質之形成。電路材料係由不宜物質腐蝕並產生電路中斷 及電阻方面之不宜增加。 迄今為止，光阻材料汽提劑時常包含胺，因為其通常在 侵襲硬化光阻劑及自微電子基材表面汽提該硬化光阻劑之 能力方面顯示優異清潔性能。然而，鋼通常亦被胺類嚴重 侵襲，且若使用該習用光阻材料汽提劑而不改質時，顯著 的金屬腐蝕會發生◊因此，希望提供一種用於微電子工業， 特別疋銅金屬化材料之銅相容性光阻材料汽提劑或清潔 劑。亦希望提供-種用於微電子卫業，特別是銅金屬化材 料以及鋁金屬化材料之銅相容性光阻材料汽提劑或清潔 劑。因為自鋁至銅金屬化之技術上相同變易可在平板顯示 100317.doc 1353380 盗之發展令看到，所以亦希望提供一種可在製造該平板顯 * 示器時使用之汽提劑/清潔劑。 【發明内容】 本發明之後端光阻材料洗提劑及清潔組合物係由非水 性、非腐蝕性清潔組合物提供，其本質上對銅及鋁為非腐 蝕性且其包含至少一種極性有機溶劑、至少一種羥基化有 機胺及至少一種具有與聚合物主鏈側連之多羥基或胺基官 月&基之腐蝕抑制劑。本發明之組合物亦可包含許多其他視 • 需要成份。本發明之清潔組合物可用於廣泛範圍pH及溫度 之加工/操作條件，並可用以有效地移除光阻材料、後電漿 蝕刻/灰磨殘餘物、防蝕消耗吸光材料及抗反射性塗料 (ARC)。此外，亦發現很難清潔樣品，如高度交聯或硬化光 阻劑及結構，其包含鈦（鈦、氧化鈦及氮化鈦）或鈕（鈕、氧 化鈕及氮化钽），可容易用本發明之清潔組合物清潔。 本發明之非水性、本質上非腐蝕性微電子汽提劑/清潔劑 組合物通常包含約80%或以上有機極性溶劑成份、約1%至 ^ 約15 /°有機羥基化胺成份、及腐蝕抑制量之腐蝕抑制劑聚 合物成份，通常約〇.1%至約10%具有多羥基官能基之腐蝕 抑制劑聚合物成份。此說明書提供之重量％乃以清潔組合 物之全部重量計。 本發明之非水性、本質上非腐蝕性汽提/清潔組合物亦可 視需要包含其他相容性成份，包括但不限於成份如螯合 劑、有機含羥基共溶劑、安定化及金屬螯合或錯合劑、其 他金屬腐蝕抑制劑及界面活性劑。 100317.doc 1353380 本發明之後端光阻材料洗提劑及清潔組合物係由非水性 組合物提供，非水性組合物本質上對鋼及鋁為非腐蝕性且 其包含一或多種極性有機溶劑、一或多種羥基化有機胺及 一或多種具有與聚合物主鏈側連之多羥基或胺基官能基之 腐蝕抑制劑聚合物。"非水性"意指組合物實質上無水且通 常僅具有水存在作為來自其他成份之雜質，然後通常其量 不超過約3重量％組合物，較佳為更低。 本發明之清潔組合物可用於廣泛範圍pH及溫度之加工/ 操作條件，並可用以有效地移除光阻材料、後電漿蝕刻/灰 磨殘餘物、防蝕消耗吸光材料及抗反射性塗料（ARc)。此 外，亦發現很難清潔樣品，如高度交聯或硬化光阻劑及結 構，其包含鈦（鈦、氧化鈦及氮化鈦）或鈕（鈕、氧化鈕及氮 化组）’可容易用本發明之清潔組合物清潔。 本發明之非水性、本質上非腐蝕性微電子汽提劑/清潔劑 組合物通常包含約80%或以上，較佳為約8S%或以上，最佳 為約90%或以上，有機極性溶劑成份；約1%至約15%，較 佳為約2%至約10%，更佳為約2%至約5%，有機羥基化胺成 份、及腐蝕抑制量之腐蝕抑制劑聚合物成份，通常自約〇·ι% 至約10%，較佳為約〇 3%至約5%，更佳為約〇 3%至約。 此說明書提供之重量％乃以清潔組合物之全部重量計。 本發明之組合物可包含一或多種任何適當有機極性溶 劑，較佳為有機極性溶劑，其包括醯胺、砜、亞砜、飽和 醇等。該有機極性溶劑包括但不限於有機極性溶劑如環丁 砜（四氫噻吩-1，1·二氧化物）、3_甲基環丁砜、正丙基颯、二 100317.doc 曱基亞砜（DMSO)、甲基颯、正丁基砜、3-甲基環丁砜、醯 胺類如1-(2-羥基乙基）-2-吡咯烷酮（HEP)、二曱基哌啶酮 (DMPD)、N-甲基-2-吡咯烷酮（NMP)、二曱基乙醯胺（DMAc) 及二甲基甲醯胺（DMF)及其混合物。作為有機極性溶劑特 佳者為N-甲基吡咯烷酮、環丁砜、DMSO及此三種溶劑之 二或以上種之混合物。 有機羥基化胺成份可為一或多種任何適當羥基化胺，較 佳為羥基胺或烷醇胺，較佳為烷醇胺。可用於本發明組合 物之適當有機羥基化胺包括但不限於羥基胺、單乙醇胺、 二乙醇胺、三乙醇胺，特別是2-胺基乙醇、1-胺基-2-丙醇、 1-胺基-3-丙醇、2-(2-胺基乙氧基）乙醇、二乙醇胺、2-(2-胺基乙基胺基）乙醇、2-(2-胺基乙基胺基）乙胺等及其混合 物。最佳的是，有機羥基化胺成份為單乙醇胺、二乙醇胺、 三乙醇胺及1-胺基-2-丙醇及其混合物。 本發明清潔組合物之腐蝕抑制化合物為具有與聚合物主 鏈側連之多側鏈羥基或胺基之聚合物。適當腐蝕抑制劑聚 合物之例包括但不限於聚乙烯亞胺聚合物及共聚物、聚乙 稀醇聚合物及共聚物、聚苯乙稀聚合物及共聚物、聚（經基 烷基丙烯酸酯或曱基丙烯酸酯）聚合物及共聚物等。聚合物 較佳為聚乙烯亞胺聚合物、聚乙烯醇聚合物及聚乙烯醇-乙 烯共聚合物。 本發明之組合物亦可視需要包含一或多種任何適當有機 含羥基或多羥基脂肪族化合物作為共溶劑。任何適當有機 含羥基共溶劑可用於本發明之組合物内。該有機含羥基共 100317.doc 丄妁3380 Z劑之例包括但不限於，適抑㈣ 阿拉伯醇、㈣醇、木糖醇、甘露醇、山梨醇^限 醇、甘油醇、1>4.丁二醇 乙- 田*丄、 农A 一每 12-環己二醇、 2甲基戊二醇、果糖、二乙二醇之單與二燒基醚，已知為 卡必醇（2-(2-乙氧基乙氧基）乙醇） mrn^ τ ^ 叶17王物’及飽和 作為丘-㈣丙醇、丁醇、己醇及六氟異丙醇及其混合物。 J劑者為（2♦乙氧基乙氧基）乙醇奸必醇）。 二劑可存在於本發明組合物内之量以組合物之全部量計 至：1二重量％，較佳為約0.1至約1〇重量％，最佳為約。.5 至約5重量〇/〇。 劍之组合物亦可包含一或多種任何適當其他腐姓抑 ~ ’較佳為芳基化合物，其包含二或多個直接鍵合至芳 m ΓΗ、⑽6及/或S〇2R6R7基，其中R6、R㈣各分 別為貌基，較佳為具有丄至6個碳原子之烧基，或芳基，較 佳為具有⑴4個碳料之祕。關於該較佳錢抑制劑之 例’可述及兒茶紛、五倍子紛、五倍子酸、間苯二盼等。 其它靠抑制劑可存在之量，以組合物之重量計，為〇至約 ίο重罝％ ’季父佳為約01至約10重量％，最佳為約〇 5至約5 重量％。 有機或無機螯合劑或金屬錯合劑並非必要，但可提供實 質益處如改良的產品穩定性…或多種該無機聲合劑或金 屬錯合劑可用於本發明之組合物内。適當螯合劑或錯合劑 之例包括但不限於反式_1，2_環己二胺四醋酸(。沖丁a)、乙 二胺四醋酸（EDTA)、錫酸鹽、焦磷酸鹽、亞烧基_二鱗酸衍 100317.doc •10- 1353380 生物（例如，乙烷-：l_羥基二磷酸鹽）、含乙二胺、二乙 • 二胺或三乙二胺官能基團之膦酸鹽，例如，乙二胺四（亞甲 基膦酸）(EDTMP)、二乙三胺五（亞f基膦酸）及三乙四胺六 (亞甲基膦酸）及其混合物。螯合劑存在於組合物内之量以組 合物之重量計為約〇至約5重量％，較佳為約〇1至約2重量 %。各種膦酸鹽之金屬螯合劑或錯合劑如乙二胺四（亞甲基 膦酸）(EDTMP)提供在酸及鹼性條件下含有氧化劑之本^ 明清潔組合物之改良極多的安定性，因而其通常較佳。 • 視需要：其他不同金屬腐蝕抑制劑如苯并三唑可使用之 量以組合物之重量計為約〇至約5重量％，較佳為約〇ι至約2 重量％。 清潔組合物視需要亦可包含—或多種適當界面活性劑， 如二甲基己炔醇（Surfyn相）、乙氧化四甲基癸快二醇 (Surfyn〇i_465)、…乙稀…丙基甜菜驗(Zonyl FSK)、ZonylFSH等。界面活性劑通當 |王削通^存在之量以組合物之 重量計為0至約5重量％，較佳為約〇1至約3重量％。 #本發明清潔組合物之例包括但不限於下表1所示之組合 物及不具聚合腐姓抑制劑之比較性抑制劑顯示於表 1及2中，所用之縮寫如下： & NMP=N-曱基0比洛院酮 SFL=環丁石風 DMSO=二曱基亞颯 AMP=1-胺基-2-丙醇 DEA=二乙醇胺
100317.doc • 1U 1353380 PEI =無水、高分子量的聚乙烯亞胺-Adrich 2003-2004目 錄#40,872-7 PVA-E=聚（乙烯醇-共-乙烯），乙稀含量445-Adrich 2003-2004 目錄#41,407-7 表1 组合物/重量份 成份 1 2 NMP 64.67 60 SFL 32.33 15 DMSO 15 AMP 2.7 DEA 5 PEI 0.3 PVA-E 1
表2 组合物/重量份
成份 A B NMP 64.67 60 SFL 32.33 15 DMSO 15 AMP 3 DEA 5 PEI PVA-E
【實施方式】 用本發明含腐蝕抑制劑聚合物之清潔組合物獲得之抗腐 蝕結果係以以下本發明之組合物之以下試驗結果獲得。 製備一片塗銅之矽晶圓（約20x20毫米）供實驗用。此片於 緩衝氧化物独刻物（其包含35 w/w°/。NH4F及6 w/w% HF)内 100317.doc -12- 1353380 清潔1分鐘，接著在去離子水中清洗1分鐘，及在氮喷霧内 乾燥。然後，晶圓片浸潰於150毫升其中有1〇〇克試驗溶液 之燒杯内，溶液在60°C下加熱、用磁性攪拌器在2〇〇 rpm下 攪拌’ 62或63分鐘後’自試驗溶液移除此片、用去離子水 清洗1分鐘並用氮喷霧乾燥。銅層之厚度（在實驗前、後）係 由 ResMap Creative Design Engineering，Sunnyvale ’ 加州）4-點探針系 統測定。
試驗溶液（清潔組合物）為表丨之本發明組合物丨及2而比較 性組合物為表2之組合物A及B。比較性組合物類似於本發 明之組合物但不包含本發明之腐蝕抑制聚合物。 表3 组合物號數 1 處理時間 分鐘 Cu蝕刻速率(埃/分鐘） 1 Λ 63 7.2 Ά 63 56.7 ~2 62 Γ 6.5 62 12.3
關於光阻劑汽提，本發明之相同試驗組合物係在相同溫 度（6〇°C)下使用相_拌速率⑽啊）…片具有正光阻 劑層（約1GGG埃）>儿積於上之玻璃片浸潰於試驗溶液内以測 疋光阻劑由本發明之組合物移除。 除了本發明之清潔組合物對銅金屬化微電子基材本質上 為非腐録並可清潔光阻劑、電毁及自該基材之姓刻殘餘 物以外，該组合物亦可以類似非靠方式清㈣金屬化微 電子基材。 雖然本發”照其特定具體例說明，惟可知在不脫離本 100317.doc 1353380 文揭示之本發明觀念之精神及範圍以外可對其作各種改 變、改良及變易。因此，希望涵蓋所有在所附請求項之精 神及範圍内之該改變、改良及變易。
100317.doc • 14· ⑧
Claims (1)
1353380 ^ g〇94108992號專利申請案 、十、ΐ請專利範圍請專纖月) 叫 K 一種清潔光阻劑.及自微電子基材之殘餘物潔 組合物’該清潔組合物包含'· 以組合物重量計80%或以上之一或多種極性有機溶劑， • 以組合物重量計1%至15%之一或多種有機羥基化胺， - 及以组合物重量計〇· 1 %至1 〇%之腐蝕抑制量之一或多 . 種腐蝕抑制劑聚合物，其具有與聚合物主鏈側連之多官 能基且其中該官能側基係選自胺基及羥基。 2. 如請求項1之清潔組合物，其中該腐蝕抑制劑聚合物係選 自聚乙烯亞胺聚合物及共聚物、聚乙烯醇聚合物及共聚 物、聚苯乙烯聚合物及共聚物、及聚（羥基烷基丙烯酸酯 或甲基丙烯酸酯）聚合物及共聚物。 3. 如請求項1之清潔組合物，其中極性有機溶劑係選自環丁 砜、3-甲基環丁砜、正丙基砜、二甲基亞砜、曱基砜、正 丁基砜、環丁颯、3-甲基環丁砜、丨·^·羥基乙基）_2_吡咯 烷酮（HEP)、二甲基哌啶酮、Ν·曱基·2·吡咯烷酮、二甲基 乙醯胺及二甲基甲醯胺所組成之群。 4. 如凊求項1之清潔組合物，其中羥基化胺係選自羥基胺及 烧醇胺所組成之群。 5. 如凊求項4之清潔組合物，其中羥基化胺係選自羥基胺、 單乙醇胺、二乙醇胺、三乙醇胺，2_胺基乙醇、丨_胺基-2一 丙醇、1-胺基-3-丙醇、2_(2_胺基乙氧基）乙醇、2·(2_胺基 乙基胺基）乙醇及2-(2-胺基乙基胺基）乙胺及其混合物所 組成之群。 100317-1000908.doc 1353380 &如請求項5之清潔組合物，其中經基化胺 及卜胺基士丙醇所組成之群。 自-乙醇胺 7.如請求項1之清潔紐人私 、‘、σ物，其令有機極性溶劑係選自n-甲 基。比洛貌綱、環丁碼、 a ? 群’祕化胺“ 其混合物所組成之 群。土化胺係選自二乙醇胺及！·胺基·2•丙醇所組成之 8.如凊求们之清潔組合物，其中聚合腐钮抑制劑係選自聚 乙烯亞胺及聚（乙烯醇-共_乙烯）所組成之群。 9·如請求項7之清潔組合物，其中聚合腐银抑制劑係選自聚 乙烯亞胺及聚（乙烯醇-共_乙烯）所組成之群。 1〇.如請求項1之清潔組合物，其中聚合腐钱抑制劑為聚乙婦 亞胺。 U.如請求項7之清潔組合物，其中聚合相抑制劑為聚 亞胺。 &如請求们之清潔組合物，纟中聚合錢抑制劑為聚（乙稀 醇-共-乙烯）。 13.如請求項7之清潔組合物，其中聚合腐料制劑為聚（乙稀 醇-共··乙烯^ 如請求们之清潔組合物，其包含沐曱基吡咯烷酮、環丁 颯、二甲基亞颯、二乙醇胺及聚（乙烯醇·共-乙烯）。 15·如請求们之清潔組合物，其包奸·甲基。比略燒酌、環丁 颯、二甲基亞颯、1-胺基-2-丙醇及聚乙烯亞胺。 16.如請求们之清潔組合物，其包含一或多種成份，選自以 下所組成之群： 100317-1000908.doc !35338〇 丨月6日修正本I 含羥基或多羥基脂肪族共溶劑， — 包含二或多個直接鍵合至芳香族環之OH、〇R6及/或 S〇2R0R7基團之腐蝕抑制芳基化合物，其中R6、心及 Re各刀別選自烧基及芳基所組成之群， 金屬錯合劑， (a) (b) (c) (d) 不同金屬腐蝕抑制化合物，及 (e) 界面活性劑。 17. —種清潔光阻劑或自微電子基材之殘餘物之方法，該方 法包括將基材與清潔組合物接觸一段足以清潔光阻劑或 自基材之殘餘物之時間，其中清潔組合物包含請求項1至 16中任一項之組合物。 18. 如請求項17之方法，其中欲清潔之微電子基材具有銅金 屬化存在之特性。 100317-1000908.doc
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| EP1828848B1 (en) * | 2004-12-10 | 2010-04-07 | MALLINCKRODT BAKER, Inc. | Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors |
| KR101088568B1 (ko) * | 2005-04-19 | 2011-12-05 | 아반토르 퍼포먼스 머티리얼스, 인크. | 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 |
| CN101126053A (zh) * | 2006-08-17 | 2008-02-20 | 安集微电子（上海）有限公司 | 用于半导体工业中等离子刻蚀残留物的清洗液组合物 |
| US8168577B2 (en) * | 2008-02-29 | 2012-05-01 | Avantor Performance Materials, Inc. | Post plasma etch/ash residue and silicon-based anti-reflective coating remover compositions containing tetrafluoroborate ion |
| TWI591158B (zh) * | 2008-03-07 | 2017-07-11 | 恩特葛瑞斯股份有限公司 | 非選擇性氧化物蝕刻濕清潔組合物及使用方法 |
| JP5305803B2 (ja) * | 2008-09-19 | 2013-10-02 | 株式会社カネカ | ポリエーテル類の製造方法 |
| KR101579846B1 (ko) * | 2008-12-24 | 2015-12-24 | 주식회사 이엔에프테크놀로지 | 포토레지스트 패턴 제거용 조성물 및 이를 이용한 금속 패턴의 형성 방법 |
| SG173834A1 (en) * | 2009-02-25 | 2011-09-29 | Avantor Performance Mat Inc | Multipurpose acidic, organic solvent based microelectronic cleaning composition |
| WO2013052809A1 (en) | 2011-10-05 | 2013-04-11 | Avantor Performance Materials, Inc. | Microelectronic substrate cleaning compositions having copper/azole polymer inhibition |
| CN102618900B (zh) * | 2012-04-14 | 2016-12-14 | 烟台恒迪克能源科技有限公司 | 一种三极管表面处理液及其制备方法 |
| CN109971565B (zh) * | 2017-12-27 | 2021-10-22 | 安集微电子（上海）有限公司 | 一种含氟清洗液 |
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| MY143658A (en) | 2011-06-30 |
| ATE463763T1 (de) | 2010-04-15 |
| EP1828848A1 (en) | 2007-09-05 |
| IL183699A (en) | 2012-10-31 |
| BRPI0518420A2 (pt) | 2008-11-25 |
| KR100744223B1 (ko) | 2007-07-30 |
| NO20073497L (no) | 2007-07-06 |
| US20110207645A1 (en) | 2011-08-25 |
| JP2007514984A (ja) | 2007-06-07 |
| WO2006065256A1 (en) | 2006-06-22 |
| CN101076760B (zh) | 2010-12-22 |
| PL1828848T3 (pl) | 2010-09-30 |
| US20090156453A1 (en) | 2009-06-18 |
| KR20060065412A (ko) | 2006-06-14 |
| EP1828848B1 (en) | 2010-04-07 |
| US7947639B2 (en) | 2011-05-24 |
| IL183699A0 (en) | 2007-09-20 |
| PT1828848E (pt) | 2010-05-21 |
| CN101076760A (zh) | 2007-11-21 |
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