ZA200209993B - Mobile plating system and method. - Google Patents
Mobile plating system and method. Download PDFInfo
- Publication number
- ZA200209993B ZA200209993B ZA200209993A ZA200209993A ZA200209993B ZA 200209993 B ZA200209993 B ZA 200209993B ZA 200209993 A ZA200209993 A ZA 200209993A ZA 200209993 A ZA200209993 A ZA 200209993A ZA 200209993 B ZA200209993 B ZA 200209993B
- Authority
- ZA
- South Africa
- Prior art keywords
- mobile
- vacuum chamber
- operable
- pump
- plating system
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims description 162
- 238000000034 method Methods 0.000 title claims description 114
- 239000000758 substrate Substances 0.000 claims description 150
- 238000003860 storage Methods 0.000 claims description 66
- 230000008569 process Effects 0.000 claims description 60
- 238000009792 diffusion process Methods 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000011324 bead Substances 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 238000007733 ion plating Methods 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 238000001771 vacuum deposition Methods 0.000 claims description 4
- 238000005468 ion implantation Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 68
- 230000008021 deposition Effects 0.000 description 67
- 239000007789 gas Substances 0.000 description 34
- 238000005516 engineering process Methods 0.000 description 28
- 150000002500 ions Chemical class 0.000 description 26
- 230000008901 benefit Effects 0.000 description 23
- 239000000463 material Substances 0.000 description 20
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 230000007704 transition Effects 0.000 description 13
- 229910052786 argon Inorganic materials 0.000 description 12
- -1 argon ions Chemical class 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 229910052763 palladium Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000009428 plumbing Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052756 noble gas Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001361 White metal Inorganic materials 0.000 description 1
- 238000005270 abrasive blasting Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- VJYFKVYYMZPMAB-UHFFFAOYSA-N ethoprophos Chemical compound CCCSP(=O)(OCC)SCCC VJYFKVYYMZPMAB-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005596 ionic collisions Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001960 metal nitrate Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000009528 severe injury Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/576,640 US6503379B1 (en) | 2000-05-22 | 2000-05-22 | Mobile plating system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200209993B true ZA200209993B (en) | 2004-01-26 |
Family
ID=24305307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200209993A ZA200209993B (en) | 2000-05-22 | 2002-12-10 | Mobile plating system and method. |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US6503379B1 (zh) |
| EP (1) | EP1290715A2 (zh) |
| JP (1) | JP2003534458A (zh) |
| KR (1) | KR100819089B1 (zh) |
| CN (1) | CN1291060C (zh) |
| AU (2) | AU2001264782B2 (zh) |
| CA (1) | CA2410347A1 (zh) |
| MX (1) | MXPA02011506A (zh) |
| WO (1) | WO2001090436A2 (zh) |
| ZA (1) | ZA200209993B (zh) |
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| US7250196B1 (en) * | 1999-10-26 | 2007-07-31 | Basic Resources, Inc. | System and method for plasma plating |
| US6521104B1 (en) | 2000-05-22 | 2003-02-18 | Basic Resources, Inc. | Configurable vacuum system and method |
| US6503379B1 (en) * | 2000-05-22 | 2003-01-07 | Basic Research, Inc. | Mobile plating system and method |
| US6893506B2 (en) * | 2002-03-11 | 2005-05-17 | Micron Technology, Inc. | Atomic layer deposition apparatus and method |
| US20030180450A1 (en) * | 2002-03-22 | 2003-09-25 | Kidd Jerry D. | System and method for preventing breaker failure |
| DE10348639B4 (de) * | 2003-10-15 | 2009-08-27 | Von Ardenne Anlagentechnik Gmbh | Schleusensystem für eine Vakuumanlage |
| WO2005109472A2 (en) * | 2004-05-07 | 2005-11-17 | Oc Oerlikon Balzers Ag | Mobile pvd/cvd coating center |
| US7115832B1 (en) * | 2005-07-26 | 2006-10-03 | United Technologies Corporation | Microplasma spray coating apparatus |
| KR101277667B1 (ko) * | 2005-02-24 | 2013-06-21 | 오를리콘 트레이딩 아크티엔게젤샤프트, 트뤼프바흐 | 띠톱 및 띠톱의 제조 방법 |
| US9177843B2 (en) * | 2007-06-06 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Preventing contamination in integrated circuit manufacturing lines |
| CN102246263A (zh) * | 2008-12-12 | 2011-11-16 | 应用材料股份有限公司 | 生产线式涂布系统中的处理台的整合 |
| US20100147217A1 (en) * | 2008-12-12 | 2010-06-17 | Edgar Haberkorn | Integration of a processing bench in an inline coating system |
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| DE102013205889B3 (de) | 2013-04-03 | 2014-05-28 | Kennametal Inc. | Kupplungsteil, insbesondere Schneidkopf für ein Rotationswerkzeug sowie ein derartiges Rotationswerkzeug |
| DE102013220884B4 (de) | 2013-10-15 | 2022-02-17 | Kennametal Inc. | Modulares Trägerwerkzeug sowie Werkzeugkopf |
| DE102014206796B4 (de) | 2014-04-08 | 2020-10-15 | Kennametal Inc. | Rotationswerkzeug, insbesondere Bohrer sowie Schneidkopf für ein solches Rotationswerkzeug |
| DE102015211744B4 (de) | 2015-06-24 | 2023-07-20 | Kennametal Inc. | Rotationswerkzeug, insbesondere Bohrer, und Schneidkopf für ein solches Rotationswerkzeug |
| USD798922S1 (en) | 2015-10-07 | 2017-10-03 | Kennametal Inc. | Cutting head for rotary drill |
| US9937567B2 (en) | 2015-10-07 | 2018-04-10 | Kennametal Inc. | Modular drill |
| USD798921S1 (en) | 2015-10-07 | 2017-10-03 | Kennametal Inc. | Cutting head for modular drill |
| US10071430B2 (en) | 2015-10-07 | 2018-09-11 | Kennametal Inc. | Cutting head, rotary tool and support for the rotary tool and for the accommodation of the cutting head |
| US10294579B2 (en) | 2016-04-05 | 2019-05-21 | Snap-On Incorporated | Portable and modular production electroplating system |
| US10196951B2 (en) * | 2016-05-31 | 2019-02-05 | Boiler Tube Company Of America | Selective catalytic reactor (SCR) door systems |
| DE102017205166B4 (de) | 2017-03-27 | 2021-12-09 | Kennametal Inc. | Modulares Rotationswerkzeug und modulares Werkzeugsystem |
| WO2018184690A1 (en) * | 2017-04-07 | 2018-10-11 | Applied Materials, Inc. | Supply line guide for a vacuum processing system |
| DE102017212054B4 (de) | 2017-07-13 | 2019-02-21 | Kennametal Inc. | Verfahren zur Herstellung eines Schneidkopfes sowie Schneidkopf |
| US10799958B2 (en) | 2017-08-21 | 2020-10-13 | Kennametal Inc. | Modular rotary cutting tool |
| CN112077370A (zh) | 2019-06-13 | 2020-12-15 | 肯纳金属印度有限公司 | 可转位钻头刀片 |
| JP7228612B2 (ja) | 2020-03-27 | 2023-02-24 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、基板処理方法及びプログラム |
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-
2000
- 2000-05-22 US US09/576,640 patent/US6503379B1/en not_active Expired - Lifetime
-
2001
- 2001-05-22 CN CNB018198546A patent/CN1291060C/zh not_active Expired - Fee Related
- 2001-05-22 WO PCT/US2001/016463 patent/WO2001090436A2/en active IP Right Grant
- 2001-05-22 KR KR1020027015852A patent/KR100819089B1/ko not_active IP Right Cessation
- 2001-05-22 CA CA002410347A patent/CA2410347A1/en not_active Abandoned
- 2001-05-22 MX MXPA02011506A patent/MXPA02011506A/es active IP Right Grant
- 2001-05-22 EP EP01939243A patent/EP1290715A2/en not_active Withdrawn
- 2001-05-22 AU AU2001264782A patent/AU2001264782B2/en not_active Ceased
- 2001-05-22 AU AU6478201A patent/AU6478201A/xx active Pending
- 2001-05-22 JP JP2001586629A patent/JP2003534458A/ja active Pending
-
2002
- 2002-12-10 ZA ZA200209993A patent/ZA200209993B/en unknown
-
2003
- 2003-01-06 US US10/337,642 patent/US7189437B2/en not_active Expired - Lifetime
- 2003-01-06 US US10/337,534 patent/US6858119B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6503379B1 (en) | 2003-01-07 |
| EP1290715A2 (en) | 2003-03-12 |
| AU2001264782B2 (en) | 2005-10-13 |
| CA2410347A1 (en) | 2001-11-29 |
| US20030136670A1 (en) | 2003-07-24 |
| US6858119B2 (en) | 2005-02-22 |
| US7189437B2 (en) | 2007-03-13 |
| US20030121776A1 (en) | 2003-07-03 |
| WO2001090436A3 (en) | 2002-03-14 |
| MXPA02011506A (es) | 2004-09-10 |
| CN1291060C (zh) | 2006-12-20 |
| AU6478201A (en) | 2001-12-03 |
| WO2001090436A2 (en) | 2001-11-29 |
| CN1478292A (zh) | 2004-02-25 |
| KR20030091652A (ko) | 2003-12-03 |
| KR100819089B1 (ko) | 2008-04-02 |
| JP2003534458A (ja) | 2003-11-18 |
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