YU37042B - Semiconductor device wherein a first flat surface of a semiconductor chip is jointed to a second plat surface of a heat sink by a fusible bonding material - Google Patents

Semiconductor device wherein a first flat surface of a semiconductor chip is jointed to a second plat surface of a heat sink by a fusible bonding material

Info

Publication number
YU37042B
YU37042B YU2431/74A YU243174A YU37042B YU 37042 B YU37042 B YU 37042B YU 2431/74 A YU2431/74 A YU 2431/74A YU 243174 A YU243174 A YU 243174A YU 37042 B YU37042 B YU 37042B
Authority
YU
Yugoslavia
Prior art keywords
heat sink
flat surface
chip
jointed
semiconductor chip
Prior art date
Application number
YU2431/74A
Other languages
English (en)
Other versions
YU243174A (en
Inventor
A J Stoeckert
J M Hunt
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of YU243174A publication Critical patent/YU243174A/xx
Publication of YU37042B publication Critical patent/YU37042B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
YU2431/74A 1973-09-12 1974-09-09 Semiconductor device wherein a first flat surface of a semiconductor chip is jointed to a second plat surface of a heat sink by a fusible bonding material YU37042B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US396565A US3860949A (en) 1973-09-12 1973-09-12 Semiconductor mounting devices made by soldering flat surfaces to each other

Publications (2)

Publication Number Publication Date
YU243174A YU243174A (en) 1982-06-18
YU37042B true YU37042B (en) 1984-08-31

Family

ID=23567745

Family Applications (1)

Application Number Title Priority Date Filing Date
YU2431/74A YU37042B (en) 1973-09-12 1974-09-09 Semiconductor device wherein a first flat surface of a semiconductor chip is jointed to a second plat surface of a heat sink by a fusible bonding material

Country Status (13)

Country Link
US (1) US3860949A (https=)
JP (2) JPS5057579A (https=)
BE (1) BE819707A (https=)
BR (1) BR7407411D0 (https=)
CA (1) CA1001326A (https=)
DE (1) DE2442159A1 (https=)
FR (1) FR2243242B1 (https=)
GB (1) GB1440545A (https=)
IN (1) IN142824B (https=)
IT (1) IT1020252B (https=)
NL (1) NL7411774A (https=)
SE (1) SE403851B (https=)
YU (1) YU37042B (https=)

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US4152175A (en) * 1978-07-24 1979-05-01 The United States Of America As Represented By The United States Department Of Energy Silicon solar cell assembly
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US4566170A (en) * 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4759829A (en) * 1985-06-27 1988-07-26 Rca Corporation Device header and method of making same
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
GB2194477A (en) * 1986-08-28 1988-03-09 Stc Plc Solder joint
DE4107660C2 (de) * 1991-03-09 1995-05-04 Bosch Gmbh Robert Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen
DE4110318C2 (de) * 1991-03-28 2001-10-11 Bosch Gmbh Robert Verfahren zum Zusammenlöten zweier Bauteile
JPH06188385A (ja) * 1992-10-22 1994-07-08 Mitsubishi Electric Corp 半導体装置およびその製造方法
DE29510336U1 (de) * 1995-06-26 1995-08-24 Siemens AG, 80333 München Leistungshybridschaltung
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US7011378B2 (en) 1998-09-03 2006-03-14 Ge Novasensor, Inc. Proportional micromechanical valve
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WO2001022489A2 (de) * 1999-09-22 2001-03-29 Siemens Aktiengesellschaft Steuergerät, insbesondere für die kraftfahrzeugtechnik
US6845962B1 (en) * 2000-03-22 2005-01-25 Kelsey-Hayes Company Thermally actuated microvalve device
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US6822318B2 (en) * 2001-05-14 2004-11-23 Lightconnect, Inc. Stress isolating die attach structure and method
US7164585B2 (en) * 2003-03-31 2007-01-16 Intel Corporation Thermal interface apparatus, systems, and methods
US8011388B2 (en) * 2003-11-24 2011-09-06 Microstaq, INC Thermally actuated microvalve with multiple fluid ports
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US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond
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Also Published As

Publication number Publication date
DE2442159A1 (de) 1975-03-13
SE7411472L (https=) 1975-03-13
FR2243242A1 (https=) 1975-04-04
SE403851B (sv) 1978-09-04
IN142824B (https=) 1977-08-27
JPS5392385U (https=) 1978-07-28
US3860949A (en) 1975-01-14
BR7407411D0 (pt) 1975-07-08
FR2243242B1 (https=) 1978-09-15
NL7411774A (nl) 1975-03-14
YU243174A (en) 1982-06-18
JPS5057579A (https=) 1975-05-20
BE819707A (fr) 1974-12-31
CA1001326A (en) 1976-12-07
GB1440545A (en) 1976-06-23
AU7304474A (en) 1976-03-11
IT1020252B (it) 1977-12-20

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