JPS54139558A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS54139558A JPS54139558A JP4646078A JP4646078A JPS54139558A JP S54139558 A JPS54139558 A JP S54139558A JP 4646078 A JP4646078 A JP 4646078A JP 4646078 A JP4646078 A JP 4646078A JP S54139558 A JPS54139558 A JP S54139558A
- Authority
- JP
- Japan
- Prior art keywords
- film system
- thick film
- substrate
- multilayer wiring
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
PURPOSE:To make effective use of the respective advantages that thin film system and thick film system possess by making heating element parts by the thin film system and common lead multilayer wiring parts and driver multilayer wiring parts by the thick film system. CONSTITUTION:In the thermal head provided with the heating element part consisting of a multiplicity of heating resistance elements and mulilayer wiring parts for high speed driving of the heating resistance elements by dividing them to blocks on a high resistance substrate; a thin film substrate 10 formed with heating resistance elements 8 and electrodes 9 by a thin film system, a thick film substrate 11 formed with the mount portions of separating diodes 2 on ceramics, common lead multilayer wiring part 3, common lead terminal part 4 on ceramics by a thick film system and a thick film substrate 12 formed with the mount portions of the separating diodes 2, driver multilayer wiring part 5, driver terminal part 6 by a thick film system on ceramics are disposed and bonded by means of adhesives on a heat sink 7 composed of metal of good heat conductivity as a substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4646078A JPS54139558A (en) | 1978-04-21 | 1978-04-21 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4646078A JPS54139558A (en) | 1978-04-21 | 1978-04-21 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54139558A true JPS54139558A (en) | 1979-10-30 |
Family
ID=12747766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4646078A Pending JPS54139558A (en) | 1978-04-21 | 1978-04-21 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54139558A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6254423B1 (en) * | 2001-01-04 | 2001-07-03 | Chin-Feng Lin | Power diode terminal holder mounting arrangement |
-
1978
- 1978-04-21 JP JP4646078A patent/JPS54139558A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6254423B1 (en) * | 2001-01-04 | 2001-07-03 | Chin-Feng Lin | Power diode terminal holder mounting arrangement |
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