JPS57123071A - Heat-sensitive recording head - Google Patents

Heat-sensitive recording head

Info

Publication number
JPS57123071A
JPS57123071A JP843681A JP843681A JPS57123071A JP S57123071 A JPS57123071 A JP S57123071A JP 843681 A JP843681 A JP 843681A JP 843681 A JP843681 A JP 843681A JP S57123071 A JPS57123071 A JP S57123071A
Authority
JP
Japan
Prior art keywords
layer wiring
wiring
individual
boards
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP843681A
Other languages
Japanese (ja)
Other versions
JPH0218989B2 (en
Inventor
Kiyoharu Yamashita
Masaji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP843681A priority Critical patent/JPS57123071A/en
Publication of JPS57123071A publication Critical patent/JPS57123071A/en
Publication of JPH0218989B2 publication Critical patent/JPH0218989B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Electronic Switches (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To form individual matrix wiring members having the same number as multi-layer wiring boards, by a method wherein in a heat-sensitive recording head including matrix wiring of a plurality of heaters, a wiring board is formed by lamination of a plurality of L-shaped resilient substances. CONSTITUTION:A multi-layer wiring board 13a comprising L-shaped resilient films for constituting multi-layer wiring portion is laminated on a substrate 14 and another multi-layer wiring board 13b is further laminated thereby multi- layer wiring boards haing a plurality of individual multi-layer wiring members are formed. Multi-layer wiring by film carriers 20 is formed between electrodes 22 on the two individual wiring boards 13a, 13b and an electrode 17b having a heater 16 on a substrate 12. Thus wiring of two individual matrices is formed as blocks having the same number as diodes in a diode chip by the two multi- layer wiring boards 13a, 13b, and arbitrary plural number of the matrix wiring members are made practicable by increasing the multi-layer wiring boards.
JP843681A 1981-01-22 1981-01-22 Heat-sensitive recording head Granted JPS57123071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP843681A JPS57123071A (en) 1981-01-22 1981-01-22 Heat-sensitive recording head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP843681A JPS57123071A (en) 1981-01-22 1981-01-22 Heat-sensitive recording head

Publications (2)

Publication Number Publication Date
JPS57123071A true JPS57123071A (en) 1982-07-31
JPH0218989B2 JPH0218989B2 (en) 1990-04-27

Family

ID=11693067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP843681A Granted JPS57123071A (en) 1981-01-22 1981-01-22 Heat-sensitive recording head

Country Status (1)

Country Link
JP (1) JPS57123071A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014008689A (en) * 2012-06-29 2014-01-20 Brother Ind Ltd Liquid discharge device, connection structure of wiring, and manufacturing method for the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588270U (en) * 1978-12-13 1980-06-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588270U (en) * 1978-12-13 1980-06-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014008689A (en) * 2012-06-29 2014-01-20 Brother Ind Ltd Liquid discharge device, connection structure of wiring, and manufacturing method for the same

Also Published As

Publication number Publication date
JPH0218989B2 (en) 1990-04-27

Similar Documents

Publication Publication Date Title
DE59400691D1 (en) Resistor in SMD design and process for its manufacture
TW370764B (en) Method for producing an apparatus that includes a print circuit board
ATE39788T1 (en) DEVICE FOR COOLING A NUMBER OF INTEGRATED COMPONENTS COMBINED TO FORM FLAT ASSEMBLIES.
EP0149317A3 (en) Circuit packaging
JPS5772867A (en) Liquid injecting recording apparatus
IE802648L (en) Electrical component
JPS57123071A (en) Heat-sensitive recording head
JPS5752143A (en) Mounting method and device for semiconductor pellet
JPS57116665A (en) Thermal head incorporated in driving circuit
ATE29330T1 (en) METHOD OF MANUFACTURING ELECTRICAL CHIP COMPONENTS.
JPS64794A (en) Multilayer interconnection board
JPS56178A (en) Thermal recording head and its control system
JPS57165272A (en) Connecting method for wire bonding
JPS54139558A (en) Thermal head
IT1129279B (en) CHARACTER GENERATION METHOD AND EQUIPMENT FOR ELECTRONIC PRINTERS WITH SINGLE TRACKING ELEMENT
JPS57165273A (en) Thermal printing head
JPS5611280A (en) Thermal recording head
JPS56157053A (en) Manufacture of thick film hybrid ic plate
JPS5474757A (en) Heat-sensitive recording head
JPS6480095A (en) Printed wiring board
JPS5715985A (en) Thermal head device
JPS5612787A (en) Matrix indicator by light emitting diode and manufacture therefor
JPS5525863A (en) Magnetic bubble memory chip
JPS5331143A (en) Thermal recording head
JPS57105684A (en) Device for heat transfer