GB1440545A - Semiconductor device including a chip bonded to a metal surface - Google Patents

Semiconductor device including a chip bonded to a metal surface

Info

Publication number
GB1440545A
GB1440545A GB3842874A GB3842874A GB1440545A GB 1440545 A GB1440545 A GB 1440545A GB 3842874 A GB3842874 A GB 3842874A GB 3842874 A GB3842874 A GB 3842874A GB 1440545 A GB1440545 A GB 1440545A
Authority
GB
United Kingdom
Prior art keywords
heat sink
coating
grooves
flat surface
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3842874A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1440545A publication Critical patent/GB1440545A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB3842874A 1973-09-12 1974-09-03 Semiconductor device including a chip bonded to a metal surface Expired GB1440545A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US396565A US3860949A (en) 1973-09-12 1973-09-12 Semiconductor mounting devices made by soldering flat surfaces to each other

Publications (1)

Publication Number Publication Date
GB1440545A true GB1440545A (en) 1976-06-23

Family

ID=23567745

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3842874A Expired GB1440545A (en) 1973-09-12 1974-09-03 Semiconductor device including a chip bonded to a metal surface

Country Status (13)

Country Link
US (1) US3860949A (https=)
JP (2) JPS5057579A (https=)
BE (1) BE819707A (https=)
BR (1) BR7407411D0 (https=)
CA (1) CA1001326A (https=)
DE (1) DE2442159A1 (https=)
FR (1) FR2243242B1 (https=)
GB (1) GB1440545A (https=)
IN (1) IN142824B (https=)
IT (1) IT1020252B (https=)
NL (1) NL7411774A (https=)
SE (1) SE403851B (https=)
YU (1) YU37042B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
US4700879A (en) * 1984-06-01 1987-10-20 Brown, Boveri & Cie Ag Method for manufacturing semiconductor power modules with an insulated contruction
GB2194477A (en) * 1986-08-28 1988-03-09 Stc Plc Solder joint
GB2254278A (en) * 1991-03-09 1992-10-07 Bosch Gmbh Robert Method of mounting silicon chips on metallic mounting surfaces

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100589A (en) * 1975-07-17 1978-07-11 Harris Corporation Microcircuit device including hybrid circuit carrier
DE2556469C3 (de) * 1975-12-15 1978-09-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement mit Druckkontakt
US4152175A (en) * 1978-07-24 1979-05-01 The United States Of America As Represented By The United States Department Of Energy Silicon solar cell assembly
JPS5568661A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Structure for mounting power transistor
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
DE3040867C2 (de) * 1980-10-30 1985-01-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur Herstellung einer Halbleiteranordnung
US4566170A (en) * 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4759829A (en) * 1985-06-27 1988-07-26 Rca Corporation Device header and method of making same
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
DE4110318C2 (de) * 1991-03-28 2001-10-11 Bosch Gmbh Robert Verfahren zum Zusammenlöten zweier Bauteile
JPH06188385A (ja) * 1992-10-22 1994-07-08 Mitsubishi Electric Corp 半導体装置およびその製造方法
DE29510336U1 (de) * 1995-06-26 1995-08-24 Siemens AG, 80333 München Leistungshybridschaltung
KR19980024134A (ko) * 1996-09-18 1998-07-06 모기 쥰이찌 반도체 패키지
US6081426A (en) * 1996-09-18 2000-06-27 Shinko Electric Industries Co., Ltd. Semiconductor package having a heat slug
EP0873809A1 (fr) * 1997-04-23 1998-10-28 AML Microtechnique Lorraine Société Anonyme Pièces destinées à être assemblées par soudure au bain de sel
DE19735247C2 (de) * 1997-08-14 2001-12-20 Winkelmann & Pannhoff Gmbh Verfahren zum Verlöten von Bauteilen und Bauteil zur Durchführung des Verfahrens
US6523560B1 (en) 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
WO2000014415A2 (en) 1998-09-03 2000-03-16 Lucas Novasensor Proportional micromechanical device
US7011378B2 (en) * 1998-09-03 2006-03-14 Ge Novasensor, Inc. Proportional micromechanical valve
WO2001022489A2 (de) * 1999-09-22 2001-03-29 Siemens Aktiengesellschaft Steuergerät, insbesondere für die kraftfahrzeugtechnik
US6845962B1 (en) * 2000-03-22 2005-01-25 Kelsey-Hayes Company Thermally actuated microvalve device
US6505811B1 (en) 2000-06-27 2003-01-14 Kelsey-Hayes Company High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
US6822318B2 (en) * 2001-05-14 2004-11-23 Lightconnect, Inc. Stress isolating die attach structure and method
US7164585B2 (en) * 2003-03-31 2007-01-16 Intel Corporation Thermal interface apparatus, systems, and methods
EP1694990A4 (en) * 2003-11-24 2009-12-09 Microstaq Inc MICRO-VALVE DEVICE FOR CONTROLLING A VARIABLE DISPLACEMENT COMPRESSOR
US8011388B2 (en) * 2003-11-24 2011-09-06 Microstaq, INC Thermally actuated microvalve with multiple fluid ports
US20070251586A1 (en) * 2003-11-24 2007-11-01 Fuller Edward N Electro-pneumatic control valve with microvalve pilot
KR20070012375A (ko) * 2004-02-27 2007-01-25 알루미나 마이크로 엘엘씨 하이브리드 마이크로/매크로 평판 밸브
JP5196422B2 (ja) * 2004-03-05 2013-05-15 ドゥンアン、マイクロスタック、インク マイクロバルブ形成のための選択的ボンディング
US7156365B2 (en) * 2004-07-27 2007-01-02 Kelsey-Hayes Company Method of controlling microvalve actuator
EP1836399A1 (en) * 2005-01-14 2007-09-26 Alumina Micro LLC System and method for controlling a variable displacement compressor
US7265977B2 (en) * 2005-01-18 2007-09-04 International Business Machines Corporation Active liquid metal thermal spreader
US7239517B2 (en) * 2005-04-11 2007-07-03 Intel Corporation Integrated heat spreader and method for using
US8156962B2 (en) 2006-12-15 2012-04-17 Dunan Microstaq, Inc. Microvalve device
CN101675280B (zh) 2007-03-30 2013-05-15 盾安美斯泰克公司(美国) 先导式微型滑阀
WO2008121365A1 (en) 2007-03-31 2008-10-09 Microstaq, Inc. Pilot operated spool valve
JP2011530683A (ja) * 2008-08-09 2011-12-22 マイクラスタック、インク 改良型のマイクロバルブ・デバイス
US8113482B2 (en) * 2008-08-12 2012-02-14 DunAn Microstaq Microvalve device with improved fluid routing
CN102308131B (zh) 2008-12-06 2014-01-08 盾安美斯泰克有限公司 流体流动控制组件
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
WO2010117874A2 (en) 2009-04-05 2010-10-14 Microstaq, Inc. Method and structure for optimizing heat exchanger performance
US20120145252A1 (en) 2009-08-17 2012-06-14 Dunan Microstaq, Inc. Micromachined Device and Control Method
WO2011094300A2 (en) 2010-01-28 2011-08-04 Microstaq, Inc. Process and structure for high temperature selective fusion bonding
US8956884B2 (en) 2010-01-28 2015-02-17 Dunan Microstaq, Inc. Process for reconditioning semiconductor surface to facilitate bonding
US8996141B1 (en) 2010-08-26 2015-03-31 Dunan Microstaq, Inc. Adaptive predictive functional controller
JP5631775B2 (ja) * 2011-02-24 2014-11-26 新光電気工業株式会社 複合めっき液
US8925793B2 (en) 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
US9140613B2 (en) 2012-03-16 2015-09-22 Zhejiang Dunan Hetian Metal Co., Ltd. Superheat sensor
US9188375B2 (en) 2013-12-04 2015-11-17 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly
US20180292143A1 (en) * 2015-10-06 2018-10-11 Linde Aktiengesellschaft Edge strips with surface structure for plate heat exchanger

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond
DE2060933C3 (de) * 1970-12-10 1978-08-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Sockel für ein Halbleiterbauelementgehäuse und Verfahren zu seiner Herstellung

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
US4700879A (en) * 1984-06-01 1987-10-20 Brown, Boveri & Cie Ag Method for manufacturing semiconductor power modules with an insulated contruction
GB2194477A (en) * 1986-08-28 1988-03-09 Stc Plc Solder joint
US4793543A (en) * 1986-08-28 1988-12-27 Stc Plc Solder joint
GB2254278A (en) * 1991-03-09 1992-10-07 Bosch Gmbh Robert Method of mounting silicon chips on metallic mounting surfaces
GB2254278B (en) * 1991-03-09 1994-08-03 Bosch Gmbh Robert A method of manufacturing a valve, and a valve manufactured by the method

Also Published As

Publication number Publication date
SE403851B (sv) 1978-09-04
CA1001326A (en) 1976-12-07
YU37042B (en) 1984-08-31
AU7304474A (en) 1976-03-11
BR7407411D0 (pt) 1975-07-08
DE2442159A1 (de) 1975-03-13
NL7411774A (nl) 1975-03-14
US3860949A (en) 1975-01-14
IT1020252B (it) 1977-12-20
BE819707A (fr) 1974-12-31
IN142824B (https=) 1977-08-27
FR2243242A1 (https=) 1975-04-04
JPS5392385U (https=) 1978-07-28
JPS5057579A (https=) 1975-05-20
SE7411472L (https=) 1975-03-13
YU243174A (en) 1982-06-18
FR2243242B1 (https=) 1978-09-15

Similar Documents

Publication Publication Date Title
GB1440545A (en) Semiconductor device including a chip bonded to a metal surface
US3228104A (en) Method of attaching an electric connection to a semiconductor device
EP0935286A4 (en) COPPER CIRCUIT CONNECTING SUBSTRATE AND ITS MANUFACTURE
FR1179416A (fr) Jonction d'un métal à des semi-conducteurs par thermo-compression
GB881833A (en) Improvements in or relating to semiconductor devices and in methods of making such devices
GB1031436A (en) Improvements in and relating to methods of soft-soldering
GB795478A (en) Improvements in or relating to the production of semi-conductor elements
CA2000838A1 (en) Method of soldering semiconductor substrate on supporting plate
ES353405A1 (es) Un metodo de fabricacion de dispositivo semiconductores.
HK87679A (en) A process for attaching a lead member to a semi-conductor device and product thereof
US3280383A (en) Electronic semiconductor device
GB1275153A (en) Semiconductor device
US3942244A (en) Semiconductor element
GB1190290A (en) Method of Fitting Semiconductor Pellet on Metal Body
US2962639A (en) Semiconductor devices and mounting means therefor
ES337005A1 (es) Un metodo de fabricar un dispositivo semiconductor.
US3823469A (en) High heat dissipation solder-reflow flip chip transistor
GB1331028A (en) Method of soldering a semiconductor plate
GB1116186A (en) Improved method of manufacturing semi-conductor devices
GB1199955A (en) Improvements in or relating to Methods of Manufacturing Semiconductor Devices
US3378735A (en) Semiconductor device housing with spring contact means and improved thermal characteristics
JPS56101752A (en) Semiconductor device
GB1091561A (en) Electrical assemblies
GB1156146A (en) Method of making Contact to Semiconductor Components
JPS57111054A (en) Semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee