Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
  • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/04—Homopolymers or copolymers of esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/38—Pressure-sensitive adhesives [PSA]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
  • C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive

Definitions

• the present invention relates to an adhesive tape that can be used to fix or join adherends and can be stretched and peeled off from the adherends.
• the present invention also relates to an article using the adhesive tape, a method for peeling off the tape, and a method for manufacturing a part (e.g., a processed product) using the adhesive tape.
• adhesive tapes are also used in various processing steps for manufacturing ultra-small electronic components such as semiconductor wafers, multilayer ceramic capacitors (hereinafter sometimes referred to as MLCCs), and inductors.
• MLCCs multilayer ceramic capacitors
• adhesive tapes are used to temporarily fix raw substrates when they are ground, cut, or divided.
• the adhesive tapes used in such processing steps must have adhesion to prevent them from peeling off during processing, but they also need to be able to be peeled off after processing is complete without contaminating the electronic components.
• heat-foaming adhesive tapes which contain heat-foaming balloons in the adhesive layer, and the balloons foam when heated, reducing the adhesive strength
• active energy ray-curing adhesive tapes which are irradiated with active energy rays such as ultraviolet (UV) light and the adhesive layer hardens, reducing the adhesive strength
• a stretch-release type adhesive tape that can be peeled off by stretching and elongating it in at least one direction as an adhesive tape that does not use heat or light for the peeling operation
• Patent Document 3 a stretch-release type adhesive tape
• the adhesive tape is peeled off from the adherends by stretching the end of the tape at a desired angle, for example horizontally or perpendicularly, to the adhesive surface when two adherends are joined together. More specifically, with a stretch-release type adhesive tape, the adhesive area between the adhesive layer and the adherend decreases during the stretching process, and the tape peels off when it reaches a limit area where the adherend can no longer follow the adhesive layer of the adhesive tape.
• An adsorption tape comprising: a base material having extensibility; and an adsorption layer provided on at least one side of the base material and having a plurality of recesses on the surface opposite the base material.
• the adsorption tape according to any one of the above [1] to [9] having an elongation at peeling within the range of 101% to 400%.
• a method for manufacturing a component comprising at least a peeling step of stretching the suction tape according to any one of [1] to [13] above in at least one direction to peel off a component fixed on an adsorption layer of the suction tape.
• the peeling step includes a transfer step of placing a recipient on a surface of the component opposite to the suction tape side, and stretching the suction tape in at least one direction from a composite having the suction tape, the component, and the recipient in this order to peel the suction tape from the component and simultaneously transfer the component to the recipient.
• a method for producing a processed product comprising the steps of: processing an adherend (workpiece) provided on a surface of the adsorption layer of the adsorption tape according to any one of [1] to [13] above; and stretching the adsorption tape in at least one direction to peel the processed adherend (workpiece) from the adsorption layer.
• the present invention provides an adhesive tape that can adhere to and temporarily fix an adherend, and can be peeled off with little elongation without excessive stress when stretched to peel off.
• Figures 2 and 3 are schematic diagrams showing the state in which an adherend has been temporarily fixed to the adsorption tape of the present invention, with Figure 2 being a top view of the adsorption tape as viewed from the side on which the adherend is placed, and Figure 3 being a cross-sectional view along line A-A in Figure 2. Note that the multiple recesses 4 on the surfaces of the substrate 2 and the adsorption layer 3 have been omitted from Figure 2. As illustrated in Figures 2 and 3, this tape 1 has multiple recesses 4 formed on the surface 6 of the adsorption layer 3 opposite the substrate 2, and the recesses 4 allow the adherend 5, such as a part, to be fixed on the surface 6. In other words, the surface 6 of the adsorption layer 3 opposite the substrate 2 is the fixing surface (placement surface) for the adherend 5.
• the recesses on the surface of the adsorption layer deform, allowing the air to escape between the adherend and the adsorption layer and forming an airtight space.
• the pressure difference between the airtight space and the outside causes the recesses to act as suction cups and adhere to the adherend, allowing the tape to be attached to the adherend and maintaining the adherend in a fixed state.
• the stress of the stretching deforms the recesses on the surface of the adsorption layer, causing greater distortion, and air enters between the adherend and the recesses, releasing the airtight space.
• the suction cup function of the recesses in the adsorption layer disappears, allowing the tape to be quickly peeled off from the adherend.
• the present tape has a substrate having extensibility (hereinafter, also referred to as the present substrate).
• the present substrate only needs to have extensibility in at least one direction, and preferably has extensibility (stretchability) in all directions within the plane.
• the above acrylic block copolymer may be modified with functional groups such as hydroxyl groups, carboxyl groups, acid anhydride groups, amino groups, and trimethoxysilyl groups in the molecular side chains or at the molecular main chain terminals, if necessary.
• functional groups such as hydroxyl groups, carboxyl groups, acid anhydride groups, amino groups, and trimethoxysilyl groups in the molecular side chains or at the molecular main chain terminals, if necessary.
• the average opening diameter of the recesses formed on the surface of the adsorption layer may be the same or different.
• the average opening diameter of the recesses is not particularly limited as long as the recesses can exhibit a suction cup function on the surface of the adsorption layer, but from the viewpoint of the adsorption force of the recesses on the adherend and the strength of the adsorption layer, it can be, for example, 300 ⁇ m or less, and preferably 250 ⁇ m or less, 200 ⁇ m or less, 150 ⁇ m or less, 120 ⁇ m or less, 100 ⁇ m or less, 80 ⁇ m or less, or 50 ⁇ m or less.
• the average opening diameter of the recesses is not particularly limited as long as it can exhibit a suction cup function, and can be, for example, 0.1 ⁇ m or more, preferably 0.5 ⁇ m or more, and more preferably 1.0 ⁇ m or more, more preferably 5.0 ⁇ m or more, and even more preferably 10 ⁇ m or more.
• the upper limit of the number of recesses on one surface of the adsorption layer is not particularly limited, but from the viewpoint of the mechanical strength of the adsorption layer, the number of recesses is preferably 1000000/cm2 or less per unit area, preferably 500000/ cm2 or less, preferably 200000/ cm2 or less, preferably 100000/ cm2 or less, and more preferably 50000/ cm2 or less per unit area.
• the aperture ratio of the recesses was measured by photographing the surface of the adsorption layer at 200x magnification (auto brightness adjustment, 1.27mm length x 1.7mm width) using an electron microscope (Keyence Corporation, Digital Microscope VHX6000), calculating the area of the black parts of the image and the total area of the image using software analysis, and dividing the area of the projected black parts by the total area to obtain the aperture ratio.
• the black parts are recesses formed on the surface of the adsorption layer, and the area of the black parts corresponds to the projected area of the recesses.
• bubbles when bubbles are generated by a method for generating fine bubbles or microbubbles described below, it can be adjusted by selecting an appropriate generation principle from the generation principles described below, adjusting the swirl speed and flow rate of the fluid containing the resin composition for forming the adsorption layer in the bubble generator, and the gas flow rate injected into the resin composition for forming the adsorption layer.
• the adsorption layer is sometimes called a micro-suction cup layer because a large number of the above-mentioned minute recesses (micropores) are formed at least on the surface opposite to the substrate, and the recesses (micropores) on the surface exert a suction cup function.
• the adsorption layer may be a porous body in which a large number of micropores (also called voids or bubbles) are formed inside the adsorption layer, or a non-porous body in which no micropores are formed inside the adsorption layer.
• the adsorption layer may have a closed cell structure or a continuous cell structure, but it is more preferable that the adsorption layer has a continuous cell structure because it can exhibit better bubble escape properties.
• a continuous cell structure is one in which adjacent bubbles have through holes between them and the bubbles are connected to each other.
• FIG. 4(b) is a cross-sectional view of the adsorption layer 3, showing an example of an adsorption layer having an open-cell structure in which micropores 8 are formed inside the layer and the micropores are interconnected.
• the degree of formation of the micropores inside can be evaluated, for example, by the specific gravity or apparent density of the adsorption layer.
• the specific gravity of the adsorption layer can be, for example, 0.1 g/cm 3 or more and 1.0 g/cm 3 or less, preferably 0.15 g/cm 3 or more and 0.95 g/cm 3 or less, preferably 0.2 g/cm 3 or more and 0.9 g/cm 3 or less, and more preferably 0.3 g/cm 3 or more and 0.8 g/cm 3 or less.
• the apparent density of the adsorption layer can be, for example, 0.1 g/cm 3 or more and 1.0 g/cm 3 or less, preferably 0.15 g/cm 3 or more and 0.95 g/cm 3 or less, more preferably 0.2 g/cm 3 or more and 0.9 g/cm 3 or less, and more preferably 0.3 g/cm 3 or more and 0.85 g/cm 3 or less.
• the specific gravity and/or apparent density of the adsorption layer within the above range, air bubbles are less likely to become trapped when the layer is attached to the adherend, and the recesses formed on the surface of the adsorption layer are effectively utilized, improving the initial and long-term surface adhesion.
• the strength of the adsorption layer can be ensured without excessive recesses, making it easier to prevent the adsorption layer from remaining on the adherend due to cohesive failure of the adsorption layer, or the adhesive from remaining if the adsorption layer has tackiness.
• the specific gravity of the present adsorption layer can be calculated by the following method. (Measuring method) A specific gravity cup (Allgood 066 series) and the above-mentioned resin composition for forming an adsorption layer were kept at 23°C ⁇ 2°C, and the mass of the empty specific gravity cup was measured. The resin composition for forming an adsorption layer was filled into the specific gravity cup, and the lid was gently closed so that no air bubbles due to poor filling of the resin composition for forming an adsorption layer remained inside the specific gravity cup.
• the resin composition for forming an adsorption layer that has been mechanically foamed is referred to.
• Specific gravity of adsorption layer [g/cm 3 ] ⁇ (mass of specific gravity cup filled with the resin composition for forming an adsorption layer [g]) ⁇ (mass of empty specific gravity cup [g]) ⁇ /volume of specific gravity cup [cm 3 ]
• the apparent density of the adsorption layer is a value calculated in accordance with JIS K6767, and is calculated by preparing a test piece of the adsorption layer cut into a rectangle of 4 cm length x 5 cm width, measuring the mass [g] of the test piece, calculating the apparent volume (length x width x thickness) [ cm3 ] of the test piece, and dividing the mass by the apparent volume.
• the specific gravity and apparent density of the adsorption layer can be adjusted, for example, by adjusting the blending ratio of the surfactant and thickener in the resin composition for forming the adsorption layer, or by adjusting the foaming conditions when foaming the resin composition for forming the adsorption layer and the bubble formation conditions such as the degree of crushing of the generated bubbles when forming the adsorption layer, as described in detail below, or by adjusting the thickness of the adsorption layer.
• the degree of crushing of the bubbles can be adjusted, for example, by increasing the number of beaters in the mixer of the foaming device or lengthening the stirring time when bubbles are generated by the stirring and mixing method described below.
• the adsorption layer is preferably flexible and pliable.
• the adsorption layer is also preferably elastic.
• the elastic recovery rate of the adsorption layer is not particularly limited and can be the same as that of a conventional micro-suction cup layer, but can be, for example, within the range of 50% to 100%, preferably within the range of 70% to 100%, more preferably within the range of 80% to 100%, even more preferably within the range of 90% to 100%, and particularly preferably within the range of 95% to 100%.
• elastic recovery rate means the ratio of restored thickness to the initial thickness, calculated by applying pressure to the adsorption layer in the thickness direction to compress it to 60% or less of the initial thickness (thickness before pressure), releasing the pressure, and measuring the thickness (restored thickness) 10 minutes later.
• the thickness of the adsorption layer is not particularly limited as long as it is thick enough to exhibit the suction cup function, and can be, for example, 1 ⁇ m or more. From the viewpoint of excellent surface adhesion, 10 ⁇ m or more is preferable, of which 30 ⁇ m or more is more preferable, 40 ⁇ m or more is even more preferable, 50 ⁇ m or more is even more preferable, and 60 ⁇ m or more is particularly preferable.
• the thickness of the adsorption layer can be 1000 ⁇ m or less, preferably 500 ⁇ m or less, and more preferably 300 ⁇ m or less.
• the thickness of the adsorption layer is preferably less than 300 ⁇ m, more preferably 250 ⁇ m or less, and particularly preferably 200 ⁇ m or less. More specifically, from the viewpoint of fixing the adherend, the thickness of the adsorption layer can be in the range of 1 ⁇ m to 1000 ⁇ m, preferably in the range of 10 ⁇ m to 1000 ⁇ m, more preferably in the range of 10 ⁇ m to 500 ⁇ m, and even more preferably in the range of 10 ⁇ m to 300 ⁇ m.
• the thickness of the adsorption layer is more preferably in the range of 10 ⁇ m to 250 ⁇ m from the viewpoint of excellent surface adhesion and holding power.
• the thickness of the adsorption layer means the average thickness of the adsorption layer on one side of the substrate in the present tape.
• the thickness of the adsorption layer on one side of the substrate and the thickness of the adsorption layer on the other side of the substrate may be the same or different.
• the thickness of the adsorption layer is measured by the method described in the Examples below. That is, the thickness of the adsorption layer is measured at 5 locations at 10 mm intervals in the length direction and at 5 locations at 10 mm intervals in the width direction using a dial thickness gauge (manufactured by Ozaki Manufacturing Co., Ltd., model G-0.4N or model G-2.4N), and the thicknesses at these 10 locations are averaged to obtain the value.
• the adsorption layer is formed on a release liner, the combined thickness of the adsorption layer and the release liner is measured, and the average value is calculated by subtracting the thickness of the release liner from the combined thickness.
• the thickness of the adsorption layer is the length between the two opposing surfaces of the adsorption layer, as shown by symbol d in Figures 3 and 4, between the planes on which no recesses are formed. Note that the portions of the surface of the adsorption layer where recesses are formed are located in the same plane as the planes on which no recesses are formed in the cross section of the adsorption layer, with the virtual surface (the surface when it is assumed that no recesses are formed, symbol 7 in Figure 1) being located.
• the resin constituting the adsorption layer is not particularly limited as long as it can exhibit the function of the adsorption layer, and examples thereof include acrylic resins such as acrylic polymers (including acrylic rubber), urethane resins (including urethane rubber), silicone resins (including silicone rubber), butadiene rubber (polybutadiene, acrylonitrile butadiene rubber, styrene butadiene rubber, methyl methacrylate-butadiene rubber, etc.), polyisoprene, ethylene propylene rubber (EPR), ethylene propylene diene terpolymer rubber (EPDM), polynorbornene, nitrile rubber, chloroprene rubber, butyl rubber, halogenated butyl rubber, ethylene-vinyl acetate rubber (EVA), fluororubber, ethylene acrylic rubber, polyester elastomer, epichlorohydrin rubber, polysulfide rubber, and other synthetic rubbers; natural rubber, chlorinated polymers (including acrylic
• the above resins may be used alone or in combination of two or more.
• the resin constituting the adsorption layer may be a resin other than the above-exemplified resins, as long as the adsorption layer can be formed into a desired structure.
• the resin constituting the adsorption layer is preferably one or more resins selected from the group consisting of acrylic resins (acrylic polymers), butadiene rubber, and urethane resins.
• the acrylic polymer may be a (meth)acrylic acid ester polymer containing one or more structural units derived from (meth)acrylic acid ester.
• the acrylic polymer is a polymer of one or more (meth)acrylic acid alkyl esters and, if necessary, other monomers other than the (meth)acrylic acid alkyl esters.
• (meth)acrylic means acrylic and methacrylic.
• the acrylic polymer is not particularly limited as long as the adsorption layer can exhibit the desired function, but acrylic rubber is preferred.
• a (meth)acrylic acid alkyl ester having 1 to 14 carbon atoms in the alkyl group is preferred, specifically, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate such as n-butyl (meth)acrylate and sec-butyl (meth)acrylate, isobutyl (meth)acrylate, n-amyl (meth)acrylate, isoamyl (meth)acrylate, n-heptyl acrylate, n-hexyl (meth)acrylate, n-octyl acrylate,
• the methacrylic acid ester monomer include (meth)acrylic acid ester monomers having a chain or cyclic saturated hydrocarbon group such as ethyl, 2-ethylhex
• the proportion of the (meth)acrylic acid alkyl ester in the acrylic polymer is not particularly limited, but is preferably 70 to 99.9% by mass, and more preferably 90 to 99.5% by mass, of the total amount of the acrylic polymer.
• the acrylic polymer preferably contains one or more (meth)acrylic acid derivative monomers in addition to the (meth)acrylic acid alkyl ester and functional group-containing (meth)acrylic acid ester monomers.
• (meth)acrylic acid derivative monomers include (meth)acrylonitrile and (meth)acrylamide.
• the acrylic polymer preferably contains one or more vinyl monomers other than (meth)acrylic acid derivative monomers.
• vinyl monomers other than (meth)acrylic acid derivative monomers include vinyl acetate, vinyl propionate, vinylidene chloride, vinylidene bromide, styrene, ⁇ -methylstyrene, vinyltoluene, chlorostyrene, 2,4-dibromostyrene, vinyl chloride, ethylene, etc.
• the acrylic polymer can be produced by polymerizing a composition containing an alkyl (meth)acrylate ester and, if necessary, a monomer, and further containing, if necessary, a polymerization initiator, an emulsifier, a dispersant, etc.
• Polymerization methods include, for example, solution polymerization, emulsion polymerization, suspension polymerization, bulk polymerization, etc., but other methods may also be used. Among these, in the production of the present adsorption layer, it is preferable to use an emulsion polymerization method from the viewpoint of forming desired recesses on the surface of the layer by mechanical foaming.
• the urethane resin is not particularly limited, and examples thereof include urethane polymers obtained by at least reacting a polyol, a polyisocyanate, and a compound having an active hydrogen group and a hydrophilic group in the molecule.
• the polyol is not particularly limited as long as it has two or more hydroxyl groups, and examples thereof include polyether polyol, polyester polyol, polycaprolactone polyol, polybutadiene polyol, polycarbonate polyol, polythioether polyol, etc.
• the above polyol compounds may be used alone or in combination of two or more kinds.
• Compounds that have an active hydrogen group and a hydrophilic group in the molecule include compounds that contain active hydrogen and an anionic group, compounds that have active hydrogen and a cationic group in the molecule, and compounds that have active hydrogen and a nonionic hydrophilic group in the molecule.
• Examples of compounds that contain active hydrogen and an anionic group include dimethylolalkanoic acids such as ⁇ , ⁇ -dimethylolpropionic acid, ⁇ , ⁇ -dimethylolbutyric acid, and dimethylolacetic acid.
• Examples of compounds that have active hydrogen and a nonionic hydrophilic group in the molecule include polyethylene glycol, alkyl alcohol alkylene oxide adducts, etc.
• the polyisocyanate is not particularly limited as long as it has two or more isocyanate groups in the molecule, and examples thereof include aliphatic polyisocyanates, alicyclic polyisocyanates, aromatic polyisocyanates, triisocyanates, etc. In addition, examples thereof include dimers and trimers (isocyanurate bonds) of these polyisocyanate compounds, and biuret bodies obtained by reacting these polyisocyanates with amines. Furthermore, polyisocyanates having urethane bonds obtained by reacting these polyisocyanates with polyols can also be used.
• the urethane resin can be formed from a composition that contains at least a polyol, a polyisocyanate, and a compound having an active hydrogen group and a hydrophilic group in the molecule, and optionally further contains a low molecular weight polyol, a chain extender, a polymerization terminator, and other additives.
• the chain extender include the chain extenders disclosed in WO 2019/092984 and the like.
• butadiene rubber is preferably a copolymer having, as a constituent unit, an aliphatic conjugated diene monomer and one or more vinyl monomers copolymerizable with the aliphatic conjugated diene monomer.
• butadiene rubber examples include styrene butadiene rubber, acrylonitrile butadiene rubber, and (meth)acrylic ester butadiene rubber.
• the butadiene rubber may contain other monomers as constituent units, if necessary, in addition to the above-mentioned aliphatic conjugated diene monomers and vinyl monomers.
• the other monomers include (meth)acrylamide, styrene, ⁇ -methylstyrene, chlorostyrene, vinyltoluene, vinyl acetate, (meth)acrylic acid, and (meth)acrylic acid esters.
• the butadiene rubber can be prepared by mixing the above-mentioned aliphatic conjugated diene monomer and vinyl monomer, as well as other monomers as necessary, and emulsion polymerizing the mixture in the presence of a polymerization initiator.
• the present adsorption layer may contain a tackifying resin as necessary. This can impart tackiness at room temperature to the present adsorption layer, and in addition to the adsorption force due to the recesses, it can further improve the adhesion to the adherend and the surface adhesive strength.
• the type of the tackifying resin is not particularly limited, and a general-purpose tackifying resin can be used.
• the tackifying resin include rosin-based tackifying resins, polymerized rosin-based tackifying resins, polymerized rosin ester-based tackifying resins, rosin phenol-based tackifying resins, stabilized rosin ester-based tackifying resins, disproportionated rosin ester-based tackifying resins, hydrogenated rosin ester-based tackifying resins, terpene-based tackifying resins, terpene phenol-based tackifying resins, petroleum resin-based tackifying resins, and (meth)acrylate-based tackifying resins. These may be used alone or in combination of two or more.
• the shape of the filler may be regular or irregular.
• Specific examples of the filler shape include polygonal, cubic, elliptical, spherical, needle-like, flat, and scaly shapes.
• elliptical, spherical, and polygonal shapes are preferred because they improve the sliding of the adsorption layer against the adherend when the tape is stretched, improving the peelability of the tape.
• Fillers of these shapes may be used alone or in combination of two or more types.
• the average particle size of the filler is preferably 0.1 ⁇ m or more.
• the average particle size of the filler is preferably 40 ⁇ m or less, more preferably 35 ⁇ m or less, even more preferably 33 ⁇ m or less, even more preferably 20 ⁇ m or less, and particularly preferably 10 ⁇ m or less.
• the average particle size of the particles refers to the volume average particle size, and is the particle size at the point where the cumulative curve is 50%, measured using a measuring device (Microtrac) that uses the laser diffraction scattering method.
• the present adsorption layer may contain any additives within a range that does not impair the adsorption properties.
• additives include crosslinking agents, curing agents, surfactants, thickeners, antiaging agents, UV absorbers, fillers, polymerization inhibitors, surface conditioners, antistatic agents, defoamers, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, antioxidants, leveling agents, foaming agents, foaming assistants, foaming agents, foam stabilizers, organic pigments, inorganic pigments, pigment dispersants, plasticizers, softeners, flame retardants, metal deactivators, silicone compounds, and the like. These may be used alone or in combination of two or more.
• the content of the additives in the present adsorption layer may be appropriately set within a range that does not impair the properties of the present adsorption layer.
• the method for producing the adsorption layer is not particularly limited as long as it is a method capable of forming a large number of recesses capable of expressing an adsorption function at least on the surface, but examples thereof include a method of forming an adsorption layer by applying and drying a resin composition for forming an adsorption layer to form a layer and roughening the surface (Method 1), a method of forming an adsorption layer using a resin composition for forming an adsorption layer in which a filler is mixed with a resin component, and then applying tension in at least one direction to the adsorption layer to form recesses starting from the filler (Method 2), a method of applying a mechanically foamed resin composition for forming an adsorption layer and heating and drying it (Method 3), and a method of foaming a resin composition for forming an adsorption layer in a sheet shape using a foaming agent
• the above-mentioned Method 3 or Method 4 is preferred because it is possible to form desired recesses on the surface and to form an adsorption layer with a closed cell structure or an open cell structure in which bubbles are formed in the layer, and among these, the above-mentioned Method 3, which is a method of mechanically foaming a resin composition for forming an adsorption layer and heating and drying it, is more preferred.
• the adsorption layer may also be produced by combining several of the above-mentioned Methods 1 to 4.
• the resin composition for forming the adsorption layer used to form the adsorption layer may be any composition containing at least the resin (polymer) that is the main component of the adsorption layer described above, and may be appropriately selected depending on the method for forming the adsorption layer.
• the method for forming the adsorption layer is a method in which the mechanically foamed resin composition for forming the adsorption layer of method 3 is formed into a sheet and then heated and dried
• the resin composition for forming the adsorption layer is preferably a resin emulsion.
• an adsorption layer containing an acrylic polymer can be formed by mechanically foaming a (meth)acrylic acid ester polymer emulsion and then heating and drying it.
• the resin composition for forming the adsorption layer before mechanical foaming is referred to as a "resin emulsion”
• the mechanically foamed resin composition for forming the adsorption layer is referred to as a "foamed resin emulsion”.
• the resin emulsion contains at least the polymer and dispersion medium for forming the above-mentioned adsorption layer, and may contain other components as necessary.
• a resin emulsion containing an acrylic polymer can be obtained by emulsion polymerization of one or more (meth)acrylic acid esters and, if necessary, other monomers other than the (meth)acrylic acid esters in a dispersion medium in the presence of a polymerization initiator, an emulsifier, a dispersion stabilizer, etc.
• a resin emulsion containing a urethane resin can be prepared, for example, by a forced emulsification method using an emulsifier and mechanical shear force on a composition containing the above-mentioned polyol and polyisocyanate, or a self-emulsification method using an ionic or nonionic hydrophilic component linked in the urethane resin skeleton.
• dispersion medium examples include water, alcohols such as ethanol, ketones such as acetone, esters such as ethyl acetate, ethers such as dipropyl ether, and glycol ethers such as ethylene glycol monomethyl ether.
• the resin emulsion may contain the components described in the ⁇ Composition of the adsorption layer> section above under (Plasticizer), (Tackifier resin), and (Filler), as well as any components in (Additives), such as surfactants, silicone compounds, foam stabilizers, thickeners, foaming agents, crosslinking agents, hardeners, and foaming assistants.
• additives such as surfactants, silicone compounds, foam stabilizers, thickeners, foaming agents, crosslinking agents, hardeners, and foaming assistants.
• the resin emulsion is turned into a foam-like resin emulsion by dispersing and mixing air bubbles in the resin emulsion through mechanical processing, i.e., by mechanically foaming the resin emulsion.
• a known method can be used for mechanical processing of the resin emulsion, such as a known air bubble generating method (stirring and mixing method) such as stirring and mixing the emulsion, or a known method for generating fine bubbles or microbubbles.
• Known methods for generating fine bubbles or microbubbles include, for example, a method using a generation principle such as entraining gas by fluidizing the liquid, or blowing gas into the liquid while the liquid is stationary.
• the method for applying the foam resin emulsion to the surface of the substrate, such as a release liner or a substrate is not particularly limited, and examples include the casting head method, roll coating method, comma coating method, die coating method, air knife coating method, gravure roll coating method, doctor roll coating method, doctor knife coating method, curtain flow coating method, spray method, brush coating method, etc.
• the thickness of the coating layer formed by applying the foam resin emulsion is appropriately selected so that the thickness of the adsorption layer formed by heating and drying is the desired value.
• the size and number of the micropores formed in the adsorption layer can be adjusted.
• the size and shape of the recesses formed on the surface of the adsorption layer, as well as the opening diameter and opening rate of the recesses can be controlled.
• the amount of the foaming agent and, if necessary, the amount of the foaming assistant the specific gravity and apparent density of the adsorption layer can be set to the desired values.
• the present tape may be a laminate having a substrate, an intermediate layer adjacent to at least one side of the substrate, and an adsorption layer adjacent to the intermediate layer.
• the present tape may be a laminate having a substrate, an intermediate layer adjacent to one side of the substrate and an adsorption layer adjacent to the intermediate layer on the opposite side of the substrate, and an intermediate layer adjacent to the other side of the substrate and an adsorption layer adjacent to the intermediate layer on the opposite side of the substrate.
• the adsorption layers provided on both sides of the substrate may be the same or different in composition and physical properties.
• the intermediate layer is not particularly limited as long as it is a layer capable of adhering the substrate and the adsorption layer, and examples thereof include an adhesive layer, a primer layer, etc.
• the storage modulus (G'23) of the intermediate layer can be adjusted by changing the gel fraction of the intermediate layer through the structure of the polymer that constitutes the intermediate layer, the molecular weight of the polymer, the crosslinking agent, and its amount.
• the polymer structure can be controlled by the type and amount of monomer.
• the tape may have a release liner on the surface of the adsorption layer opposite to the substrate.
• a release liner By providing a release liner, the surface of the adsorption layer can be protected until the tape is used, and the handling before use can be improved.
• the release liner is peeled off and removed when the tape is used, for example, when it is attached to an adherend.
• a known one can be used, for example, paper, a plastic film, a polytetrafluoroethylene (PTFE) film, a plastic film whose surface has been subjected to a release treatment such as silicone treatment or silicone fluoride treatment, etc.
• the 180° peel strength of this tape can be measured by attaching a 20 mm wide piece of tape to a stainless steel plate at 23°C with the adhesive layer facing up, pressing it back and forth with a 2 kg roller once, leaving it to rest for 1 hour at 23°C, and then pulling it in the 180° direction at a tensile speed of 300 mm/min using a Tensilon tensile tester.
• the rate of change in the surface adhesive strength P2 relative to the surface adhesive strength P1 is preferably 210% or less, more preferably 200% or less, even more preferably 180% or less, even more preferably 160% or less, particularly preferably 140% or less, and particularly preferably 120% or less.
• the elongation at peeling of the present tape is preferably in the range of 101% to 400%, more preferably in the range of 105% to 300%, and even more preferably in the range of 110% to 250%.
• the adherend when the adherend is a small part (for example, a part whose surface area in contact with the tape is 500 mm2 or less, particularly 100 mm2 or less, further 50 mm2 or less, and particularly 1 mm2 or less), the present tape can be peeled from the adherend without excessive stretching.
• a small part for example, a part whose surface area in contact with the tape is 500 mm2 or less, particularly 100 mm2 or less, further 50 mm2 or less, and particularly 1 mm2 or less
• the present tape can be peeled from the adherend without excessive stretching.
• the method for producing the present tape may include, for example, a step of forming an intermediate layer on a release liner using a composition for forming an intermediate layer, a step of forming an adsorption layer on the release liner using a resin composition for forming an adsorption layer, a step of laminating the intermediate layer to the surface of the substrate to form a laminated intermediate body, and a step of peeling off the release liner from the surface of the intermediate layer and laminating an adsorption layer.
• Another example of a method for producing the present tape in the above embodiment may include a method of forming an intermediate layer directly on the substrate using a composition for forming an intermediate layer, and forming an adsorption layer on the intermediate layer using a resin composition for forming an adsorption layer.
• the adsorption layer may be formed by applying a resin composition for forming an adsorption layer (foamed resin emulsion) containing air bubbles by mechanical foaming to the release liner and drying it, or the adsorption layer may be formed by applying a resin composition for forming an adsorption layer that does not contain air bubbles, such as a resin emulsion, to the release liner and then foaming it.
• a resin composition for forming an adsorption layer foaming a resin composition for forming an adsorption layer that does not contain air bubbles, such as a resin emulsion
• the tape is preferably manufactured from a productivity standpoint by forming an adhesive layer on the rolled substrate using the above method while unrolling the substrate and then rerolling it into a roll, or by forming an adhesive layer on a release liner in the same manner as above, transferring it to the substrate, and then rerolling it into a roll.
• the tape is subjected to stress during stretching, and the recesses on the surface of the adsorption layer are deformed, and the adsorption layer is also stretched to create a gap between the tape and the adherend, so that the adhesion state (adhesion state) between the tape and the adherend due to the suction function of the adsorption layer is released, and the tape is detached from the adherend.
• the tape is peeled off from the adherend.
• the adsorption tape of the present disclosure is a tape that can be peeled off by stretching.
• the tape can be used, for example, as a temporary fixing tape for temporarily fixing a part (adherend) on an adsorption layer during the manufacturing process of parts.
• the temporary fixing tape can be used, for example, as a process tape for temporarily fixing a part (workpiece and/or processed product) before and after processing during the manufacturing process of the part (processed product) as described below.
• More specific examples of process tapes include tape for electronic part manufacturing processes such as manufacturing multilayer ceramic capacitors from green sheets, tape for semiconductor manufacturing processes, and process tapes used for masking purposes such as solder reflow processes and sputtering processes in the manufacturing processes of various electronic parts, etc.
• the tape when the tape has an adhesive layer on both sides of the substrate, the tape can also be used as a joining tape for joining two or more parts (adherends).
• the article of the present disclosure includes one or more components on the adsorption layer of the adsorption tape (the present tape) described in the above section "1.
• Adsorption Tape Figure 2, which has already been described, corresponds to a schematic top view showing one example of the article of the present disclosure.
• this tape may have a double-sided specification having an adsorption layer on one side of the substrate and an adhesive layer on the other side.
• the component temporarily fixed to this tape may be a component before processing (workpiece) or a component after processing (processed product), and is not particularly limited.
• Specific examples of the above-mentioned components include electronic components such as semiconductor wafers, semiconductor elements, packages, green sheets, multilayer ceramic capacitors, inductors, and various chips, and optical components such as optical glass and polarizing plates.
• the method for peeling off an adsorption tape according to the present disclosure is a method in which the adsorption tape explained in the above section "1.
• Adsorption tape that has been attached to an adherend is stretched in at least one direction and peeled off from the adherend.
• the method for peeling off the present tape attached to an adherend is preferably a method in which the present tape is stretched in at least one direction and peeled off from the adherend to which the adsorption layer is attached.
• the present tape is stretched in at least one direction, a gap is generated between the adherend attached to the adsorption layer and the adsorption layer, and the suction effect of the recesses on the surface of the adsorption layer is reduced, causing the adherend to detach, and the present tape can be peeled off more easily.
• the direction in which the tape is stretched (drawn) may be horizontal, vertical, or oblique to the adhesive surface between the tape and the adherend, or a combination of these directions.
• the tape may be stretched simultaneously or sequentially in two or more different directions.
• the tape can be peeled off by stretching in at least one direction at the contact surface (adhesive surface) between the tape and the adherend, but two or more directions are preferable, and stretching in all directions is even more preferable because it can be stretched uniformly and multiple adherends joined or temporarily fixed to the tape can be peeled off simultaneously.
• the direction in which the tape is stretched (drawn) is preferably within the range of -90° to 90°, with the direction in which the end of the tape is pulled as the axis.
• the axis When the angle ⁇ is 0°, the axis is horizontal to the adhesive surface, when the angle ⁇ is 90°, the axis is vertical to the adhesive surface side of the tape and adherend, and when the angle ⁇ is -90°, the axis is vertical to the side opposite the adhesive surface.
• the method of stretching the tape is not particularly limited, and examples include a method of gripping the end of the tape and stretching it, a method of clamping the tape with a jig or the like and pulling it in a certain direction, a method of pulling the tape while winding it up on a roll, a method of stretching the tape by utilizing the difference in peripheral speed between two rolls, a method of attaching a jig having a space surrounding the adherend to the side of the tape that is to be attached to the adherend, and a method of pushing the tape with a convex jig from the side opposite the side of the adherend toward the side of the adherend to stretch the tape, etc.
• the removal method may involve the adherend falling under its own weight, or it may be removed from the tape by mechanical operation.
• mechanical removal methods include suction, clamping, sweeping, etc.
• examples of the suction means include a suction cup, a suction machine, a suction collet, etc.
• examples of the clamping means include tweezers, a clamp, etc.
• examples of the sweeping method include a swinging plate, air pressure, a brush, etc.
• the direction of the adhesive surface between the adhesive layer of this tape and the adherend can be selected appropriately according to the manufacturing equipment and manufacturing method of the part in which this tape is used, such as a vertically upward direction with the adherend facing upward, a vertically downward direction with the adherend facing downward, or a direction in which the adhesive surface is parallel to the vertical direction. Furthermore, if the adherend is to be removed from the tape by falling under its own weight, it is preferable to install this tape so that the adhesive surface is parallel to the vertical direction or facing vertically downward.
• the adherend in the present tape peeling method is not particularly limited, and when the present tape peeling method is used in a part (processed product) manufacturing process, it may be a part before processing or after processing. More specific examples of the adherend include the parts (small electronic parts) and examples of adherends described in the above sections "1. Adsorption tape” to "2. Articles", as well as examples of parts and/or processed products described below.
• Figure 6 is a process diagram showing an example of a manufacturing method for a part disclosed herein, in which a part 5 is fixed onto the suction layer 3 of the suction tape 1, and the suction tape 1 is stretched in one direction (stretching direction D) to peel the part 5 off from the suction tape 1 ( Figures 6(a) and (b)). Note that in Figure 6, the stretching direction D is bidirectional.
• the suction tape used in the manufacturing method of parts of the present disclosure and the method for peeling it off are similar to the contents already explained in each of the above sections "1. Suction tape” to “3. Method for peeling off suction tape”, and therefore will not be explained here. Furthermore, there are no particular limitations on the parts that can be manufactured by the manufacturing method of parts of the present disclosure, and the contents already explained in each of the above sections "1. Suction tape” to “3. Method for peeling off suction tape” can be applied.
• the parts peeled off from the suction tape in the peeling step may be processed (may be a processed product) or may not be processed (may be a workpiece). Specific examples of parts before and after processing include, for example, the parts explained in the above section "2. Article", the parts already exemplified, and the processed products described below.
• the size of the component peeled off from the suction tape in the peeling step is not particularly limited, but the surface area of the component in contact with the suction tape is preferably 500 mm2 or less, more preferably 100 mm2 or less, more preferably 50 mm2 or less, more preferably 30 mm2 or less, even more preferably 10 mm2 or less, and particularly preferably 1 mm2 or less.
• a component having the above surface area in contact with the tape can be called a small component.
• a micro component having a surface area in contact with the tape of 1 mm2 or less is preferred, and the above micro component has a surface area in contact with the tape of 0.5 mm2 or less, more preferably 0.2 mm2 or less, and particularly preferably 0.1 mm2 or less.
• the lower limit of the size of the component is not particularly limited, but it can be, for example, 0.001 mm2 or more, preferably 0.005 mm2 or more, preferably 0.01 mm2 or more, and preferably 0.05 mm2 or more.
• the adhesive tape is stretched in at least one direction.
• the stretching direction can be set arbitrarily in a plan view of the adhesive tape.
• the stretching direction may be the longitudinal direction, the transverse direction, a direction roughly perpendicular to the longitudinal direction, or another direction such as a direction inclined at a desired angle to the longitudinal direction.
• one or more stretching directions may be set based on any one point in the plane of the tape. When one stretching direction and the other stretching direction are located 180° opposite to each other, the stretching directions are considered to be the same direction in both directions.
• the stretching direction D shown in Figure 6(a) shows an example of a bidirectional stretching from both sides of the tape.
• the stretching direction may also be unidirectional (for example, only one of the two arrow directions D in Figure 6(a)). Note that "approximately perpendicular" does not have to be exactly 90 degrees to the stretch direction; it can be approximately 90 degrees, and directions that form angles of 85° to 95°, and even 88° to 92° to the stretch direction are acceptable.
• suction tape 1 is stretched in one or more directions from a complex having the suction tape 1, component 5, and transferee 200 in this order to peel off the component 5, and transfer the component 5 to the transferee 200 (FIGS. 7(b) and (c)).
• the object to which the part is transferred is not particularly limited as long as it can directly or indirectly fix the transferred part, and examples include adhesive tape, sticky tape, other parts coated with adhesive, etc.
• the number of pre-processed parts (workpieces) placed on the adhesive layer of the tape is not particularly limited, and can be one or more.
• the method of processing the pre-processed parts (workpieces) in the above processing step is not particularly limited, and examples include cutting, polishing, cutting, etching, etc., and the desired processed product is obtained by processing the workpieces.
• the parts to be processed in this step may have already undergone a pre-processing step.
• the processed product is not particularly limited, but examples include electronic components such as semiconductor chips, multilayer ceramic capacitors, various chips, and inductors. Among these, small electronic components are preferred. Examples of processed materials that are precursors to the processed products include semiconductor wafers and green sheets.
• the size of the workpiece is not particularly limited, but the smaller the workpiece, the smaller the surface area of the surface that contacts the tape per workpiece, and the more pronounced the effect of using the present tape, especially the effect of the peeling process, is, so it is preferable. This is because when the size of each workpiece is small, the surface area (adhesive area) of the surface that contacts the tape is small, but when a stretch-release tape having an adhesive layer is used, it is difficult to obtain the effect of reducing the adhesive area between the tape and the workpiece relative to the elongation of the tape when stretched, and the workpiece may not be sufficiently peeled off unless the tape is stretched excessively.
• a workpiece (part after processing) having the above surface area of the surface in contact with the tape can be called a small part.
• a micro part having a surface area of the surface in contact with the tape of 1 mm 2 or less is preferable, and among them, a surface area of 0.5 mm 2 or less is more preferable, 0.2 mm 2 or less is even more preferable, and 0.1 mm 2 or less is particularly preferable.
• the lower limit of the size of the workpiece is not particularly limited, but it can be, for example, 0.001 mm 2 or more, preferably 0.005 mm 2 or more, preferably 0.01 mm 2 or more, and preferably 0.05 mm 2 or more.
• the workpiece is peeled off from the tape by stretching the tape in at least one direction.
• the peeling method can be the method already described. From the viewpoint of uniformly peeling the workpiece off from the tape and preventing the workpiece from remaining on the tape, it is preferable to stretch the tape in two or more different directions, and it is preferable to stretch the tape uniformly in all directions within the attachment surface between the adsorption layer and the workpiece (adherend).
• the manufacturing method of the processed product disclosed herein may include at least the above processing step and the above peeling step, and may also include other steps in addition to these steps, such as a cleaning step, a curing step, and a removal step of removing the peeled processed product from the tape.
• the method for removing the processed product in the removal step may be the same as the method for removing the adherend described above.
• the obtained processed product may be sent to other steps such as further processing, assembly of processed products together, or joining with other processed products.
• the other steps may be performed before the processing step, between the processing step and the peeling step, or after the peeling step, depending on the type of step.
• the present tape is not limited to the configurations of the above-mentioned embodiments.
• any other configuration may be added, or any other configuration that exhibits a similar function may be substituted.
• the peeling method of this tape and the manufacturing method using this tape may include any other process, or may be replaced with any process that exhibits a similar function.
• Opening ratio at the surface of the adsorption layer Using an electron microscope (Keyence Corporation, Digital Microscope VHX6000), the surface of the adsorption layer was photographed at a magnification of 200 times (automatic brightness adjustment, 1.27 mm long x 1.7 mm wide), and the area of the black parts and the total area of the imaged were calculated by software analysis, and the opening ratio was calculated by dividing the area of the black parts by the total area. Note that in the above image, the black parts are recesses formed on the surface of the adsorption layer, and the area of the black parts corresponds to the projected area of the recesses.
• Storage modulus G′ of intermediate layer The intermediate layers were overlapped to a thickness of about 2 mm to prepare a test specimen. Parallel plates having a diameter of 7.9 mm were attached to a viscoelasticity tester (Rheometrics, Inc., Ares 2kSTD) to clamp the test specimen and measure the storage modulus G' at a frequency of 1 Hz and 23°C.
• a test piece (substrate, tape) punched into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm was prepared, and measured by pulling in the length direction at a tensile speed of 500 mm/min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under the conditions of a measurement atmosphere of 23 ° C. and 50% RH.
• the value obtained by dividing the stress value (unit: N) obtained at 50% elongation by the thickness (unit: mm) and width (unit: mm) of the test piece used for the measurement was taken as the 50% modulus.
• Substrate (2) A mixture of a styrene-isoprene copolymer and a styrene-isoprene-styrene copolymer was used as the substrate material (2).
• the mixture contained 25% by weight of a structural unit derived from styrene represented by the following chemical formula (1), and the proportion of the styrene-isoprene copolymer in the total amount of the mixture was 17% by weight.
• the breaking strengths of the substrates 1 to 4 are as shown in the table below, and the breaking strengths per unit width of the substrates 1 to 4 are as follows: Substrate 1 (thickness 100 ⁇ m): 7.75 N / mm Substrate 2 (thickness 400 ⁇ m): 7.52 N / mm Substrate 3 (thickness 100 ⁇ m): 3.21 N / mm Substrate 4 (thickness 100 ⁇ m): 5.64 N / mm
• the intermediate layer was prepared by applying the intermediate layer-forming resin composition (1) to a release liner (1) (Film Bina 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) with an applicator so that the thickness after drying was 10 ⁇ m, and drying for 3 minutes at 80° C.
• the intermediate layer was then attached to a substrate (1) that had been corona-treated so that the wet tension was 56 mN/m, and laminated under a pressure of 0.2 MPa to prepare a laminated intermediate.

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• 2023
  • 2023-12-28 CN CN202380078526.9A patent/CN120112608A/zh active Pending
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