KR20250130290A - 흡착 테이프, 물품, 흡착 테이프의 박리 방법, 및 부품의 제조 방법 - Google Patents

흡착 테이프, 물품, 흡착 테이프의 박리 방법, 및 부품의 제조 방법

Info

Publication number
KR20250130290A
KR20250130290A KR1020257017571A KR20257017571A KR20250130290A KR 20250130290 A KR20250130290 A KR 20250130290A KR 1020257017571 A KR1020257017571 A KR 1020257017571A KR 20257017571 A KR20257017571 A KR 20257017571A KR 20250130290 A KR20250130290 A KR 20250130290A
Authority
KR
South Korea
Prior art keywords
tape
adsorption layer
adsorption
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257017571A
Other languages
English (en)
Korean (ko)
Inventor
다이스케 와타나베
시아 얼 탄
유토 이케다
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20250130290A publication Critical patent/KR20250130290A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020257017571A 2022-12-29 2023-12-28 흡착 테이프, 물품, 흡착 테이프의 박리 방법, 및 부품의 제조 방법 Pending KR20250130290A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-212840 2022-12-29
JP2022212840 2022-12-29
PCT/JP2023/047184 WO2024143523A1 (ja) 2022-12-29 2023-12-28 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Publications (1)

Publication Number Publication Date
KR20250130290A true KR20250130290A (ko) 2025-09-01

Family

ID=91717955

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257017571A Pending KR20250130290A (ko) 2022-12-29 2023-12-28 흡착 테이프, 물품, 흡착 테이프의 박리 방법, 및 부품의 제조 방법

Country Status (5)

Country Link
JP (2) JP7776027B2 (https=)
KR (1) KR20250130290A (https=)
CN (1) CN120112608A (https=)
TW (1) TW202432773A (https=)
WO (1) WO2024143523A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002121511A (ja) 2000-10-19 2002-04-26 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
JP2010229399A (ja) 2009-03-04 2010-10-14 Nitto Denko Corp 積層セラミックシート切断用熱剥離型粘着シート及び積層セラミックシートの切断加工方法
WO2021149569A1 (ja) 2020-01-21 2021-07-29 Dic株式会社 粘着テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072951A (ja) 1999-09-02 2001-03-21 Dainippon Ink & Chem Inc 耐衝撃性に優れる両面粘着テープ及び固定方法
JP2013233691A (ja) * 2012-05-08 2013-11-21 Akebono Kikai Kogyo Kk 表面保護フィルム
JP6183666B2 (ja) * 2015-08-21 2017-08-23 共和工業株式会社 吸着シートの製造方法と吸着シート
JP6666778B2 (ja) * 2016-04-06 2020-03-18 日東電工株式会社 吸着仮固定材
JP2020097212A (ja) * 2018-12-17 2020-06-25 セーレン株式会社 養生テープ
JPWO2024143522A1 (https=) 2022-12-29 2024-07-04

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002121511A (ja) 2000-10-19 2002-04-26 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
JP2010229399A (ja) 2009-03-04 2010-10-14 Nitto Denko Corp 積層セラミックシート切断用熱剥離型粘着シート及び積層セラミックシートの切断加工方法
WO2021149569A1 (ja) 2020-01-21 2021-07-29 Dic株式会社 粘着テープ

Also Published As

Publication number Publication date
TW202432773A (zh) 2024-08-16
JP7776027B2 (ja) 2025-11-26
JP2026027409A (ja) 2026-02-18
CN120112608A (zh) 2025-06-06
JPWO2024143523A1 (https=) 2024-07-04
WO2024143523A1 (ja) 2024-07-04

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PG1501 Laying open of application

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Q12 Application published

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