JPWO2024143522A1 - - Google Patents
Info
- Publication number
- JPWO2024143522A1 JPWO2024143522A1 JP2024567969A JP2024567969A JPWO2024143522A1 JP WO2024143522 A1 JPWO2024143522 A1 JP WO2024143522A1 JP 2024567969 A JP2024567969 A JP 2024567969A JP 2024567969 A JP2024567969 A JP 2024567969A JP WO2024143522 A1 JPWO2024143522 A1 JP WO2024143522A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cleaning In General (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022212839 | 2022-12-29 | ||
| PCT/JP2023/047183 WO2024143522A1 (ja) | 2022-12-29 | 2023-12-28 | 仮固定用テープの剥離方法、剥離部材および部品（部材）の製造装置および部品（部材）の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143522A1 true JPWO2024143522A1 (https=) | 2024-07-04 |
| JPWO2024143522A5 JPWO2024143522A5 (https=) | 2025-07-11 |
Family
ID=91717877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567969A Pending JPWO2024143522A1 (https=) | 2022-12-29 | 2023-12-28 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024143522A1 (https=) |
| KR (1) | KR20250130591A (https=) |
| CN (1) | CN120188274A (https=) |
| TW (1) | TW202510015A (https=) |
| WO (1) | WO2024143522A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7776027B2 (ja) * | 2022-12-29 | 2025-11-26 | Dic株式会社 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010212269A (ja) * | 2009-03-06 | 2010-09-24 | Shin Etsu Polymer Co Ltd | 電子部品保持具及び電子部品の剥離方法 |
| JP2020061529A (ja) * | 2018-10-12 | 2020-04-16 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
| WO2020162204A1 (ja) * | 2019-02-04 | 2020-08-13 | Dic株式会社 | 電子部品 |
| JP2021068762A (ja) * | 2019-10-18 | 2021-04-30 | 株式会社ディスコ | シートの拡張方法 |
| JP2021174934A (ja) * | 2020-04-28 | 2021-11-01 | 株式会社ディスコ | チップの製造方法及びエッジトリミング装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5572418B2 (ja) | 2009-03-04 | 2014-08-13 | 日東電工株式会社 | 積層セラミックシート切断用熱剥離型粘着シート |
| JP5826238B2 (ja) | 2013-12-03 | 2015-12-02 | デンカ株式会社 | 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法 |
-
2023
- 2023-12-28 CN CN202380079149.0A patent/CN120188274A/zh active Pending
- 2023-12-28 TW TW112151349A patent/TW202510015A/zh unknown
- 2023-12-28 JP JP2024567969A patent/JPWO2024143522A1/ja active Pending
- 2023-12-28 WO PCT/JP2023/047183 patent/WO2024143522A1/ja not_active Ceased
- 2023-12-28 KR KR1020257019071A patent/KR20250130591A/ko active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010212269A (ja) * | 2009-03-06 | 2010-09-24 | Shin Etsu Polymer Co Ltd | 電子部品保持具及び電子部品の剥離方法 |
| JP2020061529A (ja) * | 2018-10-12 | 2020-04-16 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
| WO2020162204A1 (ja) * | 2019-02-04 | 2020-08-13 | Dic株式会社 | 電子部品 |
| JP2021068762A (ja) * | 2019-10-18 | 2021-04-30 | 株式会社ディスコ | シートの拡張方法 |
| JP2021174934A (ja) * | 2020-04-28 | 2021-11-01 | 株式会社ディスコ | チップの製造方法及びエッジトリミング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120188274A (zh) | 2025-06-20 |
| WO2024143522A1 (ja) | 2024-07-04 |
| KR20250130591A (ko) | 2025-09-02 |
| TW202510015A (zh) | 2025-03-01 |
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