JPWO2024143522A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024143522A5 JPWO2024143522A5 JP2024567969A JP2024567969A JPWO2024143522A5 JP WO2024143522 A5 JPWO2024143522 A5 JP WO2024143522A5 JP 2024567969 A JP2024567969 A JP 2024567969A JP 2024567969 A JP2024567969 A JP 2024567969A JP WO2024143522 A5 JPWO2024143522 A5 JP WO2024143522A5
- Authority
- JP
- Japan
- Prior art keywords
- temporary fixing
- fixing tape
- peeling
- stretching
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022212839 | 2022-12-29 | ||
| PCT/JP2023/047183 WO2024143522A1 (ja) | 2022-12-29 | 2023-12-28 | 仮固定用テープの剥離方法、剥離部材および部品(部材)の製造装置および部品(部材)の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143522A1 JPWO2024143522A1 (https=) | 2024-07-04 |
| JPWO2024143522A5 true JPWO2024143522A5 (https=) | 2025-07-11 |
Family
ID=91717877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567969A Pending JPWO2024143522A1 (https=) | 2022-12-29 | 2023-12-28 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024143522A1 (https=) |
| KR (1) | KR20250130591A (https=) |
| CN (1) | CN120188274A (https=) |
| TW (1) | TW202510015A (https=) |
| WO (1) | WO2024143522A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7776027B2 (ja) * | 2022-12-29 | 2025-11-26 | Dic株式会社 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5572418B2 (ja) | 2009-03-04 | 2014-08-13 | 日東電工株式会社 | 積層セラミックシート切断用熱剥離型粘着シート |
| JP5318615B2 (ja) * | 2009-03-06 | 2013-10-16 | 信越ポリマー株式会社 | 電子部品保持具及び電子部品の剥離方法 |
| JP5826238B2 (ja) | 2013-12-03 | 2015-12-02 | デンカ株式会社 | 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法 |
| JP7250468B6 (ja) * | 2018-10-12 | 2023-04-25 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
| WO2020162204A1 (ja) * | 2019-02-04 | 2020-08-13 | Dic株式会社 | 電子部品 |
| JP7377671B2 (ja) * | 2019-10-18 | 2023-11-10 | 株式会社ディスコ | シートの拡張方法 |
| JP7515292B2 (ja) * | 2020-04-28 | 2024-07-12 | 株式会社ディスコ | チップの製造方法及びエッジトリミング装置 |
-
2023
- 2023-12-28 CN CN202380079149.0A patent/CN120188274A/zh active Pending
- 2023-12-28 TW TW112151349A patent/TW202510015A/zh unknown
- 2023-12-28 JP JP2024567969A patent/JPWO2024143522A1/ja active Pending
- 2023-12-28 WO PCT/JP2023/047183 patent/WO2024143522A1/ja not_active Ceased
- 2023-12-28 KR KR1020257019071A patent/KR20250130591A/ko active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102269133B1 (ko) | 플렉서블 디스플레이 장치 및 그 제조방법 | |
| JP5689066B2 (ja) | 高度に伸縮可能な電子部品 | |
| KR100820170B1 (ko) | 플렉시블 기판의 적층 방법 | |
| CN108847134B (zh) | 一种可拉伸显示屏装置及其制造方法 | |
| JP2010538462A5 (https=) | ||
| PH12021553038A1 (en) | Method for manufacturing electronic device | |
| JPWO2024143522A5 (https=) | ||
| EP1598864A3 (en) | Hardenable pressure-senstitive adhesive sheet for semiconductors and process for producing a semiconductor device | |
| EP2830095A3 (en) | Organic light-emitting display apparatus and manufacturing method thereof | |
| EP1840970A3 (en) | Composite semiconductor device, led head that employs the composite semiconductor device, and image forming apparatus that employs the led head | |
| US20210097902A1 (en) | Stretchable display and the manufacturing method thereof | |
| WO2005106937A1 (ja) | シート剥離装置及び剥離方法 | |
| JP2009267409A (ja) | 集積回路デバイス用のパッケージ構造およびパッケージ方法 | |
| JP2005085705A5 (https=) | ||
| EP3279965A1 (en) | Method for manufacturing oled panel | |
| WO2018024032A1 (zh) | 用于半导体器件的薄膜及半导体器件的制作方法 | |
| KR20160071735A (ko) | 필름 터치 센서 및 그의 제조 방법 | |
| JP4550510B2 (ja) | シート剥離装置及び剥離方法 | |
| WO2008157108A3 (en) | Metal plugged substrates with no adhesive between metal and polyimide | |
| JP2010232230A5 (https=) | ||
| JP2007046053A5 (https=) | ||
| KR101614750B1 (ko) | 세라믹 적층체의 제조 장치 및 그 제조 방법 | |
| JP7155529B2 (ja) | 伸縮性回路基板 | |
| JP6532978B1 (ja) | 伸縮性回路基板 | |
| JPH07235583A (ja) | 粘着シート |