CN120188274A - 临时固定用带的剥离方法、剥离构件和部件（构件）的制造装置以及部件（构件）的制造方法 - Google Patents

临时固定用带的剥离方法、剥离构件和部件（构件）的制造装置以及部件（构件）的制造方法 Download PDF

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Publication number
CN120188274A
CN120188274A CN202380079149.0A CN202380079149A CN120188274A CN 120188274 A CN120188274 A CN 120188274A CN 202380079149 A CN202380079149 A CN 202380079149A CN 120188274 A CN120188274 A CN 120188274A
Authority
CN
China
Prior art keywords
temporary fixing
fixing tape
peeling
component
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380079149.0A
Other languages
English (en)
Chinese (zh)
Inventor
下冈澄生
渡边大亮
谭西亚尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN120188274A publication Critical patent/CN120188274A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cleaning In General (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202380079149.0A 2022-12-29 2023-12-28 临时固定用带的剥离方法、剥离构件和部件（构件）的制造装置以及部件（构件）的制造方法 Pending CN120188274A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022212839 2022-12-29
JP2022-212839 2022-12-29
PCT/JP2023/047183 WO2024143522A1 (ja) 2022-12-29 2023-12-28 仮固定用テープの剥離方法、剥離部材および部品（部材）の製造装置および部品（部材）の製造方法

Publications (1)

Publication Number Publication Date
CN120188274A true CN120188274A (zh) 2025-06-20

Family

ID=91717877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380079149.0A Pending CN120188274A (zh) 2022-12-29 2023-12-28 临时固定用带的剥离方法、剥离构件和部件（构件）的制造装置以及部件（构件）的制造方法

Country Status (5)

Country Link
JP (1) JPWO2024143522A1 (https=)
KR (1) KR20250130591A (https=)
CN (1) CN120188274A (https=)
TW (1) TW202510015A (https=)
WO (1) WO2024143522A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7776027B2 (ja) * 2022-12-29 2025-11-26 Dic株式会社 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572418B2 (ja) 2009-03-04 2014-08-13 日東電工株式会社 積層セラミックシート切断用熱剥離型粘着シート
JP5318615B2 (ja) * 2009-03-06 2013-10-16 信越ポリマー株式会社 電子部品保持具及び電子部品の剥離方法
JP5826238B2 (ja) 2013-12-03 2015-12-02 デンカ株式会社 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法
JP7250468B6 (ja) * 2018-10-12 2023-04-25 三井化学株式会社 電子装置の製造方法および粘着性フィルム
WO2020162204A1 (ja) * 2019-02-04 2020-08-13 Dic株式会社 電子部品
JP7377671B2 (ja) * 2019-10-18 2023-11-10 株式会社ディスコ シートの拡張方法
JP7515292B2 (ja) * 2020-04-28 2024-07-12 株式会社ディスコ チップの製造方法及びエッジトリミング装置

Also Published As

Publication number Publication date
WO2024143522A1 (ja) 2024-07-04
JPWO2024143522A1 (https=) 2024-07-04
KR20250130591A (ko) 2025-09-02
TW202510015A (zh) 2025-03-01

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