KR20250130591A - 가고정용 테이프의 박리 방법, 박리 부재 및 부품(부재)의 제조 장치 및 부품(부재)의 제조 방법 - Google Patents

가고정용 테이프의 박리 방법, 박리 부재 및 부품(부재)의 제조 장치 및 부품(부재)의 제조 방법

Info

Publication number
KR20250130591A
KR20250130591A KR1020257019071A KR20257019071A KR20250130591A KR 20250130591 A KR20250130591 A KR 20250130591A KR 1020257019071 A KR1020257019071 A KR 1020257019071A KR 20257019071 A KR20257019071 A KR 20257019071A KR 20250130591 A KR20250130591 A KR 20250130591A
Authority
KR
South Korea
Prior art keywords
temporary fixing
fixing tape
peeling
stretching
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257019071A
Other languages
English (en)
Korean (ko)
Inventor
스미오 시모오카
다이스케 와타나베
시아 얼 탄
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20250130591A publication Critical patent/KR20250130591A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H01L21/67132—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01L21/6836—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H01L2221/68327—
    • H01L2221/68381—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cleaning In General (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020257019071A 2022-12-29 2023-12-28 가고정용 테이프의 박리 방법, 박리 부재 및 부품(부재)의 제조 장치 및 부품(부재)의 제조 방법 Pending KR20250130591A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022212839 2022-12-29
JPJP-P-2022-212839 2022-12-29
PCT/JP2023/047183 WO2024143522A1 (ja) 2022-12-29 2023-12-28 仮固定用テープの剥離方法、剥離部材および部品（部材）の製造装置および部品（部材）の製造方法

Publications (1)

Publication Number Publication Date
KR20250130591A true KR20250130591A (ko) 2025-09-02

Family

ID=91717877

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257019071A Pending KR20250130591A (ko) 2022-12-29 2023-12-28 가고정용 테이프의 박리 방법, 박리 부재 및 부품(부재)의 제조 장치 및 부품(부재)의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2024143522A1 (https=)
KR (1) KR20250130591A (https=)
CN (1) CN120188274A (https=)
TW (1) TW202510015A (https=)
WO (1) WO2024143522A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7776027B2 (ja) * 2022-12-29 2025-11-26 Dic株式会社 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572418B2 (ja) 2009-03-04 2014-08-13 日東電工株式会社 積層セラミックシート切断用熱剥離型粘着シート
JP2015108044A (ja) 2013-12-03 2015-06-11 電気化学工業株式会社 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5318615B2 (ja) * 2009-03-06 2013-10-16 信越ポリマー株式会社 電子部品保持具及び電子部品の剥離方法
JP7250468B6 (ja) * 2018-10-12 2023-04-25 三井化学株式会社 電子装置の製造方法および粘着性フィルム
WO2020162204A1 (ja) * 2019-02-04 2020-08-13 Dic株式会社 電子部品
JP7377671B2 (ja) * 2019-10-18 2023-11-10 株式会社ディスコ シートの拡張方法
JP7515292B2 (ja) * 2020-04-28 2024-07-12 株式会社ディスコ チップの製造方法及びエッジトリミング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572418B2 (ja) 2009-03-04 2014-08-13 日東電工株式会社 積層セラミックシート切断用熱剥離型粘着シート
JP2015108044A (ja) 2013-12-03 2015-06-11 電気化学工業株式会社 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法

Also Published As

Publication number Publication date
CN120188274A (zh) 2025-06-20
WO2024143522A1 (ja) 2024-07-04
JPWO2024143522A1 (https=) 2024-07-04
TW202510015A (zh) 2025-03-01

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