Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
  • B32B43/006—Delaminating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
  • B65H41/00—Machines for separating superposed webs
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Definitions

• Patent Document 1 discloses a method of peeling off a part (component) by heating a part (component) temporarily fixed to a heat-foaming peeling tape, thereby reducing the adhesive function of the adhesive layer by foaming or expanding balloons in the adhesive layer (see Patent Document 1, for example).
• Patent Document 2 discloses a method of peeling off a part (component) by irradiating an active energy ray such as UV light with a part (component) temporarily fixed to an active energy ray-curing peeling tape, thereby reducing the adhesive function through a curing reaction of the adhesive layer (see Patent Document 2, for example).
• the present invention has been made in consideration of the above-mentioned circumstances, and aims to provide a method for peeling temporary fixing tape that is easy and efficient to peel from parts (components) without causing contamination of the parts (components) due to residual glue, a peeling member, a part (component) manufacturing device that includes the peeling member, and a method for manufacturing parts (also called components or processed products).
• the present invention has the following aspects.
• a peeling member used for peeling off a temporary fixing tape which has an extensible base material and a temporary fixing layer on one surface of the extensible base material and which is peelable by stretching, the peeling member having a holding part which holds the temporary fixing tape, a hollow part formed by the holding part, and stretching means, the holding part being disposed so that the temporary fixing tape covers the hollow part, and the stretching means having a function of stretching in at least one direction within the plane of the temporary fixing tape which covers the hollow part.
• the stretching means is a roll, and the roll is disposed in the first stretching direction.
• the components fixed to one side of the tape can be peeled off easily and simply by simply pulling and stretching the temporary fixing tape in one or more desired directions. Therefore, when peeling off the tape from the components, it is not necessary to apply external stimuli such as light or heat, which is used in conventional methods for peeling off temporary fixing tapes, making the peeling operation easy and preventing adhesive residue on the components.
• the present invention can provide a method for peeling a temporary fixing tape that is easy and efficient to peel from a part (component) without causing contamination of the part (component) due to residual glue, a peeling member, a part (component) manufacturing device that includes the peeling member, and a method for manufacturing a part (component, processed product).
• FIG. 2 is a schematic diagram showing an example of a method for peeling off the temporary fixing tape of the present disclosure.
• FIG. 2 is a schematic diagram showing an example of a method for peeling off the temporary fixing tape of the present disclosure.
• FIG. 2 is a schematic diagram showing an example of a method for peeling off the temporary fixing tape of the present disclosure.
• FIG. 2 is a schematic diagram showing an example of a method for peeling off the temporary fixing tape of the present disclosure.
• 1 is a schematic diagram showing one embodiment of a peeling member according to the present disclosure.
• 1 is a schematic diagram showing one embodiment of a peeling member according to the present disclosure.
• 1 is a schematic diagram showing one embodiment of a peeling member according to the present disclosure.
• FIG. 1 is a schematic diagram for explaining the vertical movement distance of the stretching means (stretching member) (the protrusion distance of the tape by the stretching means) when a component (member) is peeled off from the temporary fixing tape.
• FIG. 2 is a schematic diagram showing a method for measuring the surface adhesive strength of a temporary fixing tape.
• Figure 1 is a schematic diagram showing an example of a method for peeling off a temporary process tape according to the present disclosure, with Figure 1(a) being a perspective view and Figures 1(b) and (c) being side views.
• this peeling method is a method in which one or more parts (members) 3 are temporarily fixed on the temporary fixing layer 1 of a temporary fixing tape 100 that has a temporary fixing layer 1 on one side of an extensible substrate 2 and is peelable by stretching, and the temporary fixing tape 100 is stretched in at least one direction (arrow P) by a stretching means, thereby peeling it off from the part (member) 3 ( Figures 1(b) and (c)).
• Fig. 2 is a schematic diagram showing an example of the peeling method of the temporary fixing tape of the present disclosure, and corresponds to a view of the temporary fixing tape on which the component is placed (temporarily fixed) from the mounting surface (top surface) of the component.
• the adhesive surface 4 between the temporary fixing layer (not shown) of the temporary fixing tape 100 and the component 3 (not shown) is stretched in a first stretching direction (arrow P).
• Fig. 2 shows a schematic case where the first stretching direction P is one direction parallel to the longitudinal direction of the temporary fixing tape 100.
• Temporary fixing tapes are usually stretched by applying tension, but if the directions of tension are different, they are considered to be stretched in different directions. If the directions of tension are the same or 180° opposite, the stretching directions are considered to be the same.
• the parts (members) to be temporarily fixed to the temporary fixing tape may be temporarily fixed to the upper surface of the temporary fixing tape, or may be temporarily fixed to the lower surface of the temporary fixing tape.
• the upper surface of the temporary fixing tape refers to the surface above the substrate when viewed from the side (cross section) of the temporary fixing tape, and the parts are temporarily fixed to the temporary fixing layer located above the substrate of the temporary fixing tape.
• the lower surface of the temporary fixing tape refers to the surface below the substrate when viewed from the side (cross section) of the temporary fixing tape, and the parts are temporarily fixed to the temporary fixing layer located below the substrate of the temporary fixing tape.
• the temporary fixing tape When the parts are temporarily fixed to the lower surface of the temporary fixing tape, the temporary fixing tape is stretched to peel off from the parts, and at the same time, the parts fall under their own weight and can be detached from the temporary fixing tape, which is preferable because it eliminates the need for work such as picking up the parts after peeling.
• the temporary fixing layer may have an excess portion (hereinafter also referred to as "excess portion") which is an area other than the adhesive surface with the component.
• the temporary fixing tape including the adhesive surface can be stretched by applying tension to the excess portion and stretching it.
• the ratio (L'/L) of the length L of the temporary fixing tape after stretching in the direction generally perpendicular to the stretching direction to the length L of the temporary fixing tape before stretching in the direction generally perpendicular to the stretching direction is set to 0.9 or more, so that the temporary fixing tape can be efficiently peeled off from the components while suppressing collisions between the components due to necking.
• L'/L is preferably 1 or more, more preferably greater than 1, and even more preferably 1.1 or more.
• L'/L is usually 2 or less, and from the viewpoint of performing this peeling method quickly, 1.5 or less is more preferable.
• the first stretching direction is preferably a direction intersecting the transport direction of the temporary fixing tape, and more preferably a direction approximately perpendicular to the transport direction. This is because the temporarily fixed parts can be peeled off while the temporary fixing tape is being transported. Furthermore, when this peeling method is performed on a manufacturing line for parts, the stretching direction may be omnidirectional.
• the stretching method that allows the stretching direction to be omnidirectional on the manufacturing line
• an example of this method is a method in which a stretching member is pressed against the transported temporary fixing tape from the side opposite to the side on which the parts are placed, and the temporary fixing tape is pushed out so as to be convex toward the side on which the parts are placed (a method of pushing up or down).
• the term "performing this peeling method on a manufacturing line for parts” refers to, for example, the manufacturing of parts before processing on the temporary fixing tape, or processing such as cutting or dicing of the parts before processing, and then peeling the parts off from the temporary fixing tape using this peeling method in succession.
• the stretching means may stretch the temporary fixing tape in two or more different directions. That is, the stretching means may stretch the temporary fixing tape in one direction (first stretching direction) and one or more directions (also referred to as "different stretching directions") different from the one direction (first stretching direction).
• the stretching direction may be one direction, two or more directions, or all directions.
• the device for this peeling method can peel the temporary fixing tape simply and efficiently.
• the different stretching directions are two or more directions (particularly all directions)
• the adhesive surface is stretched in two or more directions, so that the temporary fixing tape can be peeled off uniformly from the part.
• the holder may function as a stretching means by being driven.
• the stretching in each direction may be performed simultaneously (simultaneous stretching) or sequentially (sequential stretching).
• the stretching means can be appropriately selected depending on the stretching method, and examples include rolls, grippers, stages, pins, etc., and these are preferably movable. For example, it is preferable that the stage and pins are vertically movable.
• the stretching ratio in the different directions is not particularly limited, but is preferably 1.1 or more. From the viewpoint of the efficiency of the peeling operation, a stretching ratio of 2 or less is preferable. When there are two or more different directions, the respective stretching ratios may be the same or different.
• the temporary fixing tape may be stretched in two different directions. At this time, it is preferable that the two stretching directions form an angle of approximately 90°.
• the stretching means stretches the temporary fixing tape in two directions, one direction P and one direction P2 different from the one direction P1, and it is preferable that the two directions P1 and P2 form an angle of approximately 90°, that is, that the two directions are approximately perpendicular, because this enables uniform stretching.
• the range of the angle of approximately 90° is the same as the range of "approximately perpendicular" described above. Note that when the angle formed by the direction P1 and the direction P2 is 180°, the directions P1 and P2 are bidirectional and are the same stretching direction.
• Figure 4 is a schematic diagram showing an example of this peeling method, viewed from the side of the mounting surface (top surface) of the part (member).
• two rolls are arranged facing each other in the first stretching direction P1 as the stretching means 8, and one roll is moved in the first stretching direction P1 in one direction to stretch the temporary fixing tape 100 in the first stretching direction P1 in one direction.
• the temporary process tape may be stretched in the first stretching direction in both directions by making the peripheral speeds of the two rolls that are the stretching means 8 in Figure 4 different.
• a stretching means using two or more rolls is preferred for stretching in the first stretching direction. As shown in FIG.
• a holding part 9 that holds the temporary fixing tape is provided in a direction intersecting with the first stretching direction P1.
• the holding part 9 may also function as a stretching means.
• FIG. 4(b) shows an example in which two rolls are arranged as the first stretching means 8A facing each other in the first stretching direction P1, and two rolls are arranged as the second stretching means 8B facing each other in a stretching direction (second stretching direction) P2 different from the first stretching direction P1.
• first stretching means 8A moves in one direction in the first stretching direction P1
• second stretching means 8B moves in one direction in the second stretching direction P2
• the tape is stretched in two axes in the directions P1 and P2.
• the temporary fixing tape 100 may be stretched in one or both directions in the first stretching direction P1 by the first stretching means 8A, or in one or both directions in the second stretching direction P2 by the second stretching means 8B, or both.
• the different stretching direction (second stretching direction) P2 is a direction that is roughly perpendicular to the first stretching direction P1, but this peeling method is not limited to this, and the angle between the first stretching direction and the second stretching direction may be greater than 0 and less than 360°.
• cases where the angle between the first stretching direction and the different stretching direction is 180° are excluded because they are regarded as the same stretching direction in both directions.
• the different stretching direction is roughly perpendicular to the first stretching direction.
• the adhesive surface between the part (member) and the temporary fixing layer is stretched, for example, by applying tension to the excess portion.
• tension is applied to the tape by a method of gripping and pulling the temporary fixing tape with a stretching means, a method of pulling the temporary fixing tape while winding it with a stretching means, a method of pressing (pushing) a movable stage against the temporary fixing tape as a stretching means to push the temporary fixing tape (pushing it up or down), or the like.
• the stretching means may apply tension horizontally to the adhesive surface between the part and the temporary fixing layer, or may apply tension in the direction opposite to the side of the temporary fixing tape on which the part is placed.
• the stretching means can stretch the adhesive surface between the component (member) and the temporary fixing layer by directly applying tension in the horizontal direction.
• the stretching means can also stretch the temporary fixing tape by applying tension in three-dimensional directions, including the vertical direction, to the adhesive surface between the component and the temporary fixing layer by pressing a stretching member against the surface of the temporary fixing tape opposite the component placement surface. Of these, the latter is preferred from the standpoint of space saving for the device.
• the movements of the two can be linked by providing a control unit (not shown) that controls the movements of the holder 9 and the stretching member 10.
• a control unit not shown
• the component 3 is placed on the upper surface of the temporary fixing tape 10
• the tension direction Q is downward relative to the temporary fixing tape, but the component 3 may be placed on the lower surface of the temporary fixing tape 10.
• the same operation can be performed by arranging the holder 9 and the stretching member 10 on the upper surface side of the temporary fixing tape 100 and making the tension direction Q upward relative to the temporary fixing tape 100.
• the movements of the two can be linked by providing a control unit (not shown) that controls the movements of the holder 9' and the stretching member 10.
• a control unit not shown
• the member 3 is placed on the upper surface of the temporary fixing tape 10, and the tension direction Q is downward relative to the temporary fixing tape, but the member 3 may be placed on the lower surface of the temporary fixing tape 10.
• a micro part having a surface area of 1 mm 2 or less in contact with the temporary fixing tape has a surface area of more preferably 0.5 mm 2 or less, even more preferably 0.2 mm 2 or less, particularly preferably 0.1 mm 2 or less, and preferably 0.2 mm 2 or less.
• the lower limit of the size of the part (component) is not particularly limited, but is, for example, 0.001 mm 2 or more, preferably 0.005 mm 2 or more, preferably 0.01 mm 2 or more, and preferably 0.05 mm 2 or more.
• the stress at 25% elongation (25% modulus) of the temporary fixing tape is preferably in the range of 0.15 MPa to 10 MPa, more preferably in the range of 0.16 MPa to 10 MPa, more preferably in the range of 0.17 MPa to 5 MPa, and even more preferably in the range of 0.18 MPa to 4.5 MPa. This allows the temporary fixing tape to exhibit good temporary fixing properties and reduces the tension in the initial stage of stretching.
• the breaking elongation of the temporary fixing tape refers to the elongation measured when it breaks after being punched out into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled lengthwise at a tensile speed of 500 mm/min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of 23°C and 50% RH in the measurement atmosphere [(gauge length after stretching - gauge length before stretching) / gauge length before stretching ⁇ x 100 (%)].
• the elongation at peeling of the temporary fixing tape is preferably in the range of 101% to 1500%, more preferably in the range of 105% to 800%, and even more preferably in the range of 110% to 500%.
• the temporary fixing layer of the temporary fixing tape is an adhesive layer
• the elongation at peeling of the temporary fixing tape is preferably in the range of 101% to 1500%, more preferably in the range of 105% to 1000%, and even more preferably in the range of 110% to 500%.
• initial gauge length + stretched length of tape refers to the gauge length of the tape after stretching when all the aluminum blocks have fallen.
• ⁇ (initial gauge length + stretched length of tape) / initial gauge length ⁇ ⁇ 100 elongation at peeling [%]
• the substrate has at least extensibility that allows it to stretch under tension, but it may also have elasticity that allows it to stretch under tension and then shrink back to its original shape when the tension is released, and it does not have to return to its original shape once it has been stretched. From the viewpoint of having extensibility, it is preferable that the substrate has at least one of the following physical properties.
• the breaking elongation of the substrate is preferably 200% or more from the viewpoint of expressing extensibility (stretchability), more preferably 300% or more, more preferably 400% or more, and even more preferably 500% or more.
• the breaking elongation of the substrate is not particularly limited as long as it can be stretched, but can be, for example, 2000% or less, preferably 1800% or less, more preferably 1700% or less, and even more preferably 1500% or less.
• the breaking elongation of the substrate By having the breaking elongation of the substrate within the above range, even if the adhesive strength between the temporary fixing tape and the part (component) is high, the temporary fixing tape can be stretched while suppressing breakage, and the stretching distance of the tape (peel elongation of the tape) until the adhesive state between the temporary fixing tape and the part is released is not too long, making it possible to work in a small space.
• the breaking elongation of the substrate can be adjusted by a method such as appropriately selecting the material or applying stretching during the manufacturing process of the substrate.
• the breaking elongation of the base material refers to the elongation at break when it is punched out into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the length direction at a tensile speed of 500 mm/min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of 23°C and 50% RH in the measurement atmosphere [(gauge length at break - gauge length before stretching) / gauge length before stretching) x 100 (%)].
• the breaking strength of the substrate is preferably 20 MPa or more, more preferably 30 MPa or more, and even more preferably 40 MPa or more, while the breaking strength of the substrate is preferably 120 MPa or less, more preferably 100 MPa or less, even more preferably 90 MPa or less, and even more preferably 85 MPa or less.
• the breaking strength of the substrate can be adjusted by a method such as appropriately selecting the material or applying stretching during the manufacturing process of the substrate.
• the 50% modulus of the substrate is preferably 0.1 MPa or more, preferably 0.3 MPa or more, more preferably 1.0 MPa or more, and even more preferably 5.0 MPa or more, while the 50% modulus of the substrate is preferably 20.0 MPa or less, more preferably 18.0 MPa or less, and more preferably 15.0 MPa or less.
• the 50% modulus of the substrate can be adjusted by a method such as appropriately selecting the material or applying stretching during the manufacturing process of the substrate.
• the 100% modulus of the substrate is preferably 0.1 MPa or more, preferably 0.3 MPa or more, more preferably 0.5 MPa or more, and even more preferably 1 MPa or more, while the 100% modulus of the substrate is preferably 25.0 MPa or less, more preferably 22 MPa or less, and more preferably 20.0 MPa or less.
• the 100% modulus of the substrate can be adjusted by a method such as appropriately selecting the material or applying stretching during the manufacturing process of the substrate.
• the 50% and 100% modulus of the substrate refer to the stress values when the elongation is 50% and 100% when the substrate is punched into a dumbbell shape with a gauge length of 20 mm and a width of 5 mm, and pulled in the length direction at a tensile speed of 500 mm/min using a Tensilon tensile tester (model: RTF-1210, manufactured by A&D Co., Ltd.) under conditions of measurement atmosphere of 23°C and 50% RH.
• the elongation in the above modulus is the ratio of the elongated length to the gauge length before elongation [ ⁇ (gauge length after elongation - gauge length before elongation) / gauge length before elongation ⁇ x 100 (%)].
• the rubber hardness of the substrate is preferably 25A or more, more preferably 30A or more, even more preferably 50A or more, and even more preferably 85A or more, while the rubber strength of the substrate is preferably 100A or less, and more preferably 98A or less.
• the rubber hardness of the substrate can be adjusted by, for example, changing the molecular weight of the resin constituting the substrate, changing the monomer units constituting the copolymer, selecting the composition, or by selecting an appropriate material.
• the rubber hardness of the base material is Shore A hardness, and refers to the value measured in accordance with JIS K 6253 using a durometer (spring type rubber hardness tester) (model: GS-719G, manufactured by Tecrock Corporation).
• the thickness of the substrate is the average value of the thickness measured using a dial thickness gauge (manufactured by Ozaki Manufacturing Co., Ltd., model G-0.4N or model G-2.4N) at 5 locations at 10 mm intervals in the length direction and 5 locations at 10 mm intervals in the width direction, for a total of 10 points.
• a dial thickness gauge manufactured by Ozaki Manufacturing Co., Ltd., model G-0.4N or model G-2.4N
• the substrate is composed of a substrate composition containing a resin as a main component.
• a resin layer such as a resin film or a resin sheet can be used.
• the substrate may be composed of only a resin, or may contain any component other than the resin.
• the resin constituting the substrate examples include styrene resin, urethane resin, polyolefin resin, polyester resin, polystyrene, polycarbonate, polymethylpentene, polysulfone, polyether ether ketone, polyether sulfone, polyether imide, polyimide, fluororesin, nylon, acrylic resin, etc. These resins may be used alone or in combination of two or more.
• the resin preferably has hard segments X and soft segments Y, and the soft segments Y are preferably block copolymers composed of a random copolymer of linear structural units and structural units having side chains.
• the linear structural units that contribute to crystallinity and structural units having side chains that contribute to extensibility are randomly present in the soft segments Y constituting the block copolymer, which makes it easier to improve both extensibility (stretchability) and breaking strength.
• the loss of extensibility due to steric hindrance of the structural units having side chains in the soft segments Y can be suppressed, and the extensibility due to the soft segments Y is maintained.
• the block copolymer is preferably a copolymer of triblock or more, and a triblock copolymer is preferable, since it is easier to exert the effects of the hard segments X and the soft segments Y.
• Such resins include styrene resins that are styrene block copolymers having hard segment X and soft segment Y and/or hydrogenated products thereof, urethane resins that are urethane block copolymers having hard segment X and soft segment Y and/or hydrogenated products thereof, and acrylic resins that are acrylic block copolymers having hard segment X and soft segment Y and/or hydrogenated products thereof.
• the block copolymer is a triblock copolymer, since it can achieve both excellent breaking strength and extensibility due to excellent cohesive force.
• the resin is preferably a thermoplastic resin, and among the above-mentioned resins, styrene-based resins, urethane-based resins, and acrylic-based resins are preferred from the viewpoint of being easily adjustable to suitable breaking stress and breaking elongation.
• the substrate is preferably mainly composed of a resin selected from the group consisting of styrene-based resins, urethane-based resins, and acrylic-based resins, since it is easy to obtain a substrate with excellent moldability and excellent breaking elongation and breaking stress.
• the content of the resin selected from the above group contained in 100% by mass of all resin components constituting the substrate is preferably 50% by mass to 100% by mass, and more preferably within the range of 70% by mass to 100% by mass, more preferably within the range of 80% by mass to 100% by mass, and even more preferably within the range of 90% by mass to 100% by mass. It is particularly preferable that the content is substantially 100% by mass, that is, the substrate is composed of a resin selected from the above group.
• the styrene resin may have one or more functional groups, such as carboxyl groups, hydroxyl groups, acid anhydride groups, amino groups, epoxy groups, etc., in the molecular chain and/or at the molecular terminals, as long as the purpose and effect of the invention are not impaired, or may have no functional groups.
• the hydrogen on the benzene ring of the styrene resin may be substituted with alkyl groups such as methyl and ethyl, and the number of alkyl groups to be substituted may be any number from 1 to 5.
• the preferred range of the proportion of the styrene-derived structural unit represented by the above general formula (1) in the styrene-based block copolymer can be the same as the preferred range of the styrene-derived structural unit represented by the above general formula (1) in the above-mentioned styrene-based resin. This is because the breaking elongation and breaking stress of the substrate are more likely to be in the preferred range.
• the styrene-based block copolymer may be a styrene-based diblock copolymer, a styrene-based triblock copolymer, or a tetrablock or higher styrene-based block copolymer.
• the styrene-based block copolymer may also be a mixture of a diblock copolymer and a triblock copolymer. Of these, it is more preferable that the styrene-based resin contains at least a styrene-based triblock copolymer, from the viewpoint of achieving both excellent cohesive strength and extensibility of the substrate.
• the styrene block copolymer may also be a hydrogenated styrene block copolymer.
• a hydrogenated styrene block copolymer is a copolymer in which the double bonds in the main chain of the styrene block copolymer are hydrogenated.
• a hydrogenated styrene block copolymer composed of a polymer block A mainly composed of styrene compound units and a polymer block B which is a block composed of a random copolymer of units in which a linear butadiene structure is hydrogenated and units in which an isoprene structure is hydrogenated is preferred.
• the polymer block B has linear structural units that contribute to crystallinity and structural units having side chains that contribute to extensibility present randomly, which makes it easier to achieve both improved extensibility and breaking strength of the tape.
• the polyol can be appropriately selected depending on the purpose, and examples thereof include polyester polyol, polyether polyol, polycarbonate polyol, acrylic polyol, etc.
• One type of polyol may be used, or two or more types may be used in combination.
• polyester polyols and polyether polyols are preferred as polyols from the viewpoint of obtaining the mechanical properties of the substrate.
• heat resistance is required for the substrate, it is preferred to use polyester polyols, and when water resistance and biodegradability are required, it is preferred to use polyether polyols.
• polyether polyol examples include those obtained by addition polymerization of alkylene oxide using one or more compounds having two or more active hydrogen atoms as an initiator.
• Examples of the carbonate esters include methyl carbonate, dimethyl carbonate, ethyl carbonate, diethyl carbonate, cyclocarbonate, and diphenyl carbonate.
• low molecular weight polyols that can be used to produce the above polycarbonate polyols and that can react with carbonate esters and/or phosgene include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, 1,2-propanediol, 1,3-propanediol, dipropylene glycol, tripropylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,5-hexanediol, 1,6-hexanediol, and 2,5-hexanediol.
• the polyisocyanate can be appropriately selected depending on the purpose.
• alicyclic polyisocyanates, aliphatic polyisocyanates, aromatic polyisocyanates, etc. can be used, and examples thereof include alicyclic polyisocyanates.
• One type of polyisocyanate may be used, or two or more types may be used in combination.
• alicyclic polyisocyanate examples include isophorone diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, 4,4'-dicyclohexylmethane diisocyanate, 2,4-methylcyclohexane diisocyanate, 2,6-methylcyclohexane diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate, bis(2-isocyanatoethyl)-4-cyclohexylene-1,2-dicarboxylate, 2,5-norbornane diisocyanate, 2,6-norbornane diisocyanate, dimer acid diisocyanate, and bicycloheptane triisocyanate.
• Alicyclic polyisocyanates may be used alone or in combination of two or more.
• the above urethane resin preferably has an equivalent ratio (NCO/OH equivalent ratio) between the isocyanate group (NCO) of the polyisocyanate and the hydroxyl group (OH) of the polyol in the range of 1 to 20, more preferably 1.1 to 13, even more preferably 1.2 to 5, and particularly preferably 1.5 to 3.
• a known method can be used to produce a urethane resin by reacting a polyol with a polyisocyanate.
• a method can be used in which the polyol placed in a reaction vessel is heated under normal or reduced pressure conditions to remove moisture, and then the polyisocyanate is supplied in one or divided portions and reacted.
• the reaction conditions between the polyol and the polyisocyanate can be appropriately selected taking into consideration various conditions such as safety, quality, and cost, but the reaction temperature is preferably 70°C to 120°C, and the reaction time is preferably 30 minutes to 5 hours.
• the acrylic polymer used in the substrate is not particularly limited, but preferably contains an acrylic block polymer.
• the acrylic block copolymer may be a diblock copolymer, a triblock copolymer, or a tetrablock or higher block copolymer.
• two or more acrylic block copolymers having different block structures may be used in combination.
• an acrylic triblock copolymer is more preferable because it can achieve both breaking strength and extensibility due to excellent cohesive force.
• acrylic block copolymer a triblock copolymer having a repeating unit represented by general formula (2) can be used.
• A, B, and C each independently represent a repeating unit, and A and C each independently represent a methacrylic acid alkyl ester monomer unit.
• B represents an acrylic acid alkyl ester monomer unit.
• p, q, and r each independently represent the degree of polymerization of each monomer unit.
• a and C may be methacrylic acid alkyl ester monomer units having the same chemical structure or methacrylic acid alkyl ester monomer units having different chemical structures.
• * represents a bond with another atom, and the same applies below.
• the B in the above general formula (2) represents an acrylic acid alkyl ester monomer unit.
• the term "acrylic acid alkyl ester monomer unit” refers to a structural unit derived from an acrylic acid alkyl ester monomer when an acrylic acid alkyl ester monomer is (co)polymerized or graft polymerized, i.e., a repeating unit derived from an acrylic acid ester monomer.
• the acrylic acid alkyl ester monomer unit is preferably an acrylic acid alkyl ester monomer unit represented by the following general formula (4).
• R3 is preferably a linear or branched alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, an octyl group, a nonyl group, a decyl group, an undecyl group, or a dodecyl group, or a cyclic alkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, a cyclodecyl group, a dicyclopentanyl group, or an adamantyl
• Preferred forms of the acrylic triblock copolymer include polymethyl methacrylate block-polyn-butyl acrylate block-polymethyl methacrylate block, polyethyl methacrylate block-polyn-butyl acrylate block-polyethyl methacrylate block, polypropyl methacrylate block-polyn-butyl acrylate block-polypropyl methacrylate block, polymethyl methacrylate block-polyt-butyl acrylate block-polymethyl methacrylate block, and polymethyl methacrylate block-polypropyl acrylate block-polymethyl methacrylate block.
• the above acrylic block copolymer may be modified with functional groups such as hydroxyl groups, carboxyl groups, acid anhydride groups, amino groups, and trimethoxysilyl groups in the molecular side chains or at the molecular main chain terminals, as necessary.
• functional groups such as hydroxyl groups, carboxyl groups, acid anhydride groups, amino groups, and trimethoxysilyl groups in the molecular side chains or at the molecular main chain terminals, as necessary.
• the method for producing the acrylic block copolymer can be appropriately selected from conventionally known production methods, and examples of such methods include a method in which the block copolymer is sequentially polymerized by an anionic living polymerization method or a cationic living polymerization method.
• a known method using an organometallic complex may be used.
• the acrylic polymer may be a cured product of the acrylic block copolymer.
• the cured product of the acrylic block copolymer can be formed, for example, by irradiating an active energy ray such as ultraviolet light to a composition containing an acrylic block copolymer, a polymerizable monomer, and a photopolymerization initiator.
• the polymerizable monomer is not particularly limited as long as it can be polymerized by irradiation with active energy rays, but polyfunctional (meth)acrylates are preferred. There are no particular limitations on the polyfunctional (meth)acrylate, and known polyfunctional (meth)acrylates can be used.
• 1,2-ethanediol diacrylate, 1,2-propanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, neopentyl glycol diacrylate, tripropylene glycol diacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, tris(2-acryloyloxy)isocyanurate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, di(trimethylolpropane)tetraacrylate, di(pentaerythritol)pentaacrylate, di(pentaerythritol)hexaacrylate, and other polyfunctional (meth)acrylates having two or more polymerizable double bonds in one molecule can be mentioned.
• urethane acrylate, polyester acrylate, epoxy acrylate, and the like can also be exemplified as polyfunctional acrylates. These may be used alone or in combination of two or more.
• the polymerizable monomer is preferably 0.5 to 50 parts by weight, more preferably 1 to 40 parts by weight, 1.5 to 30 parts by weight, or 2 to 25 parts by weight, per 100 parts by weight of the acrylic block copolymer.
• the substrate may contain other components as necessary in addition to the various resins described above.
• other components include tackifier resins, crosslinking agents, antiaging agents, UV absorbers, fillers, polymerization inhibitors, surface conditioners, antistatic agents, defoamers, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, antioxidants, leveling agents, additives such as organic pigments, inorganic pigments, pigment dispersants, silica beads, and organic beads, and inorganic fillers, which will be described later.
• inorganic fillers include silicon oxide, aluminum oxide, titanium oxide, zirconia, and antimony pentoxide. These may be used alone or in combination of two or more.
• the content of other components contained in the substrate may be appropriately selected within a range that does not impair the properties of the tape.
• the average thickness of the temporary fixing layer is preferably 1 ⁇ m or more, more preferably 10 ⁇ m or more, even more preferably 30 ⁇ m or more, and particularly preferably 40 ⁇ m or more. Also, it is preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, even more preferably 200 ⁇ m or less, and particularly preferably 100 ⁇ m or less.
• the average thickness of the temporary fixing layer on one side of the substrate and the average thickness of the temporary fixing layer on the other side may be the same or different, but it is preferable that they are the same thickness.
• the average thickness of the temporary fixing layer is determined by cutting the layer to an arbitrary size, measuring the thickness at 5 locations at 10 mm intervals in the length direction and 5 locations at 10 mm intervals in the width direction using a dial thickness gauge (Ozaki Manufacturing Co., Ltd., Model G-0.4N or Model G-2.4N), and averaging the thicknesses at these 10 locations.
• a dial thickness gauge Ozaki Manufacturing Co., Ltd., Model G-0.4N or Model G-2.4N
• the combined thickness of the temporary fixing layer and the release liner is measured using a release liner as a support, and the thickness is determined by subtracting the thickness of the support.
• the portions of the surface of the adsorption layer where recesses are formed are assumed to have virtual surfaces.
• the virtual surfaces are located in the same plane as the plane where no recesses are formed in the cross section of the adsorption layer.
• the storage modulus G' (23 ° C) of the adhesive layer at 23 ° C is preferably 1 ⁇ 10 4 Pa or more, more preferably 1.5 ⁇ 10 4 Pa or more, even more preferably 1.5 ⁇ 10 5 Pa or more, and particularly preferably 2 ⁇ 10 5 Pa or more.
• 1 ⁇ 10 7 Pa or less is preferable, more preferably 1 ⁇ 10 6 Pa or less, even more preferably 9 ⁇ 10 5 Pa or less, and particularly preferably 2 ⁇ 10 5 Pa or less.
• the storage modulus G' of the adhesive layer is determined by stacking the adhesive layers to a thickness of approximately 2 mm to prepare a test piece, attaching parallel plates with a diameter of 7.9 mm to a viscoelasticity tester (Ares 2kSTD manufactured by Rheometrics), clamping the test piece, and measuring the value at a frequency of 1 Hz and 23°C.
• Adhesives constituting the adhesive layer include acrylic adhesives, silicone adhesives, urethane adhesives, and rubber adhesives. Among these adhesives, adhesives selected from acrylic adhesives, rubber adhesives, and urethane adhesives are preferred.
• the adhesive resin which is the main component of acrylic adhesives, contains one or more acrylic polymers.
• the acrylic polymer may be a block copolymer, a random copolymer, or a mixture of a block copolymer and a random copolymer.
• the acrylic polymer may also have a crosslinked structure (it may be a reaction product of an acrylic copolymer and a crosslinking agent).
• the acrylic block copolymer may be a diblock copolymer, a triblock copolymer, or a tetrablock or higher block copolymer.
• the acrylic adhesive resin may be a combination of two or more acrylic block copolymers having different block structures. Among them, it is preferable to use at least one of an acrylic diblock copolymer and an acrylic triblock copolymer as the acrylic block copolymer, and it is more preferable to use an acrylic triblock copolymer because it is easy to obtain cohesive force and has excellent retention force.
• the preferred acrylic block copolymer may be the same as the acrylic block copolymer disclosed in, for example, WO 2021/149567, WO 2021/149568, WO 2021/149569, etc.
• the acrylic random copolymer can be produced, for example, by polymerizing (meth)acrylate monomers.
• the term "(meth)acrylate” refers collectively to acrylate and methacrylate.
• (meth)acryloyl refers collectively to acryloyl and methacryloyl
• (meth)acrylic refers collectively to acrylic and methacrylic.
• Preferred acrylic random copolymers and monomers constituting the copolymers can be similar to the acrylic polymers disclosed in, for example, WO 2019/003933, WO 2021/039877, WO 2021/039878, etc.
• the adhesive resin which is the main component of rubber-based adhesives, contains one or more types of rubber-based resins.
• the rubber-based resin may be synthetic or natural rubber, and may be a rubber material that can be used as an adhesive resin.
• rubber-based resins include non-diene rubber and diene rubber.
• non-diene rubber include silicone rubber.
• diene rubber include homopolymers of conjugated diene compounds, and copolymers of conjugated diene compounds with other compounds.
• Examples of the homopolymers include polybutadiene, polyisoprene, polyisobutylene, and chloroprene rubber.
• Examples of the copolymers include acrylonitrile-butadiene rubber, styrene-butadiene rubber (SBR), styrene-based resins, and the like.
• the rubber-based adhesive resin is preferably a styrene-based resin.
• the styrene-based resin the above-mentioned styrene-based block copolymer is preferable, and among them, a block copolymer of an aromatic vinyl compound and a conjugated diene compound is preferable, and a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound is preferable.
• the above-mentioned monovinyl-substituted aromatic compound refers to a compound in which one functional group having a vinyl group is bonded to an aromatic ring.
• a representative example of the above-mentioned aromatic ring is a benzene ring.
• the benzene ring may be a benzene ring that does not have a vinyl group and is substituted with a functional group such as an alkyl group.
• the above-mentioned monovinyl-substituted aromatic compound constitutes a hard segment (A segment) in the block copolymer, and specific examples include styrene, ⁇ -methylstyrene, vinyltoluene, and vinylxylene. Among them, styrene is preferable.
• the above-mentioned conjugated diene compound constitutes a soft segment (B segment) in the block copolymer, and specific examples include 1,3-butadiene and isoprene.
• the copolymerization ratio of the aromatic vinyl compound in the styrene-based block copolymer is preferably 70% by mass or more, more preferably 90% by mass or more, and may be substantially 100% by mass, with the total mass of the block copolymer being 100% by mass. Two or more types of aromatic vinyl compounds may be used in combination.
• the copolymerization ratio of the conjugated diene compound in the styrene-based block copolymer is preferably 70% by mass or more, more preferably 90% by mass or more, and may be substantially 100% by mass, with the total mass of the block copolymer being 100% by mass. Two or more types of conjugated dienes may be used in combination.
• the block copolymer may be in the form of a diblock, triblock, radial, or a mixture of these.
• Triblock and radial copolymers preferably have an A segment, such as a styrene block, at the end of the polymer chain.
• the A segments at the end of the polymer chain tend to come together to form domains, which is thought to form a pseudo-crosslinked structure and improve the cohesiveness of the adhesive.
• the block copolymer may also be a hydrogenated block copolymer.
• a urethane-based polymer which is a reaction product of a polyol and a polyisocyanate
• the urethane-based polymer is not particularly limited as long as it can function as an adhesive, and examples thereof include ether-based polyurethane, ester-based polyurethane, and carbonate-based polyurethane.
• the polyol that constitutes the urethane-based polymer include polyether polyol, polyester polyol, polycarbonate polyol, and polycaprolactone polyol.
• the polyisocyanate compound include diphenylmethane diisocyanate, tolylene diisocyanate, and hexamethylene diisocyanate.
• the adhesive constituting the adhesive layer may contain a crosslinking agent such as an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, or an aziridine-based crosslinking agent in addition to the adhesive resin described above.
• a crosslinking agent such as an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, or an aziridine-based crosslinking agent in addition to the adhesive resin described above.
• a crosslinking agent such as an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, or an aziridine-based crosslinking agent in addition to the adhesive resin described above.
• the gel fraction of the adhesive layer can be set appropriately depending on the purpose, but from the viewpoint of obtaining an adhesive layer with good cohesiveness and adhesiveness, the gel fraction of the adhesive layer is preferably 10% by mass or more and 70% by mass or less, more preferably 25% by mass or more and 65% by mass or less, and even more preferably 35% by mass or more and 60% by mass or less.
• the gel fraction refers to a value measured by the following method.
• the adhesive is applied to a release sheet so that the thickness after drying is 50 ⁇ m, dried at 100 ° C for 3 minutes, and aged at 40 ° C for 2 days, and cut into 50 mm squares to be used as samples.
• the mass of the sample before immersion in toluene is measured in advance.
• the toluene-insoluble portion of the sample is separated by filtering through a 300 mesh wire net, and the mass (G2) of the residue after drying at 110 ° C for 1 hour is measured.
• the gel fraction is calculated according to the following formula (3).
• Gel fraction (mass%) G2/G1 ⁇ 100 (3)
• G1 is the mass of the sample before immersion in toluene
• G2 is the mass of the residue after drying at 110° C. for 1 hour.
• the adhesive constituting the adhesive layer may contain a tackifier resin in addition to the above-mentioned adhesive resin.
• a tackifier resin in addition to the above-mentioned adhesive resin.
• the above-mentioned tackifier resin include rosin-based tackifier resins, polymerized rosin-based tackifier resins, polymerized rosin ester-based tackifier resins, rosin phenol-based tackifier resins, stabilized rosin ester-based tackifier resins, disproportionated rosin ester-based tackifier resins, hydrogenated rosin ester-based tackifier resins, terpene-based tackifier resins, terpene phenol-based tackifier resins, petroleum resin-based tackifier resins, (meth)acrylate-based tackifier resins, etc.
• tackifier resins include tackifier resins disclosed in, for example, WO 2021/039877, WO 2021/039878, WO 2021/149567, WO 2021/149568, WO 2021/149569, etc.
• the content of the tackifier resin is preferably within the range of 5 to 65 parts by mass, and more preferably within the range of 8 to 55 parts by mass, per 100 parts by mass of the adhesive resin.
• the adhesive constituting the adhesive layer may contain a filler in addition to the adhesive resin described above.
• a filler in addition to the adhesive resin described above.
• the above-mentioned filler may be an inorganic filler made of an inorganic material such as a metal or metal compound, carbon or graphite, an organic filler made of an organic material such as a resin filler, or an organic-inorganic composite filler such as a silicone resin filler. These may be used alone or in combination of two or more.
• the above-mentioned filler may be hollow or solid, and may be a core-shell type in which a shell is formed on the surface of a core.
• a core-shell type filler in which a shell formed of silicone resin is coated on the surface of a core part formed of a rubber elastic body such as silicone rubber can be exemplified.
• Specific examples of fillers include various fillers disclosed in, for example, WO 2021/039877, WO 2021/039878, WO 2021/149567, WO 2021/149568, WO 2021/149569, etc.
• the content of the filler can be 5 parts by mass or more and 100 parts by mass or less per 100 parts by mass of the adhesive resin, from the viewpoint of dispersing the filler in the adhesive layer and suppressing the occurrence of residual glue, and can be preferably 10 parts by mass or more and 75 parts by mass or less, 12 parts by mass or more and 70 parts by mass or less, 15 parts by mass or more and 60 parts by mass or less, or 20 parts by mass or more and 55 parts by mass or less.
• the adhesive layer may contain any optional components such as additives such as polymer components other than the adhesive resin, crosslinking agents, antiaging agents, UV absorbers, fillers, polymerization inhibitors, surface conditioners, antistatic agents, defoamers, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispersants, plasticizers, softeners, flame retardants, metal deactivators, silica beads, organic beads, etc.; inorganic fillers such as silicon oxide, aluminum oxide, titanium oxide, zirconia, antimony pentoxide, etc.
• additives such as polymer components other than the adhesive resin, crosslinking agents, antiaging agents, UV absorbers, fillers, polymerization inhibitors, surface conditioners, antistatic agents, defoamers, viscosity modifiers, light stabilizers, weather stabilizers, heat stabilizers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispers
• the temporary fixing layer is an adsorption layer
• a large number of recesses are formed on the surface of the adsorption layer, and the recesses exhibit a suction cup function to temporarily fix the part (component), and the tape is stretched to release the suction cup function and become peelable from the part.
• the adsorption layer may have recesses formed at least on the surface that is to be attached to the part, and recesses may be formed on both sides of the layer.
• the adsorption layer may have a large number of recesses formed at least on the surface, but it is preferable that micropores (also called voids or bubbles) are formed in the layer.
• the adsorption layer may have a closed bubble structure or an open bubble structure, and it is preferable that the layer has a porous structure having a continuous bubble structure. Since the adsorption layer adheres to the part by the suction cup function, it usually does not have tackiness, but it may have tackiness by blending a tackifier resin or the like. Among them, it is preferable that the adsorption layer does not have tackiness because glue residue is less likely to occur when the tape is stretched.
• the adsorption layer is also called a micro-suction cup layer due to the suction cup function due to the recesses on the surface.
• the average opening diameter of the recesses formed on the surface of the adsorption layer is not particularly limited as long as the recesses can exhibit a suction cup function on the surface of the adsorption layer, but can be, for example, 300 ⁇ m or less, and preferably 250 ⁇ m or less, 200 ⁇ m or less, 150 ⁇ m or less, 120 ⁇ m or less, 100 ⁇ m or less, 80 ⁇ m or less, or 50 ⁇ m or less.
• the number of recesses present on one surface of the adsorption layer is, for example, 300 recesses/ cm2 or more per unit area, more preferably 500 recesses/ cm2 or more per unit area, even more preferably 1000 recesses/ cm2 or more per unit area, and even more preferably 10000 recesses/ cm2 or more per unit area.
• the upper limit of the number of recesses present on one surface of the adsorption layer is not particularly limited, but from the viewpoint of the mechanical strength of the adsorption layer, the number of recesses is preferably 1000000 recesses/ cm2 or less per unit area, preferably 500000 recesses/ cm2 or less, preferably 200000 recesses/ cm2 or less, preferably 100000 recesses/ cm2 or less, and more preferably 50000 recesses/ cm2 or less per unit area.
• the apparent density of the adsorption layer is a value calculated in accordance with JIS K6767, and is calculated by preparing a test piece of the adsorption layer cut into a rectangle of 4 cm long x 5 cm wide, measuring the mass [g] of the test piece, calculating the apparent volume (longitudinal length x horizontal length x thickness) [cm 3 ] of the test piece, and dividing the mass by the apparent volume.
• the above resins may be used alone or in combination of two or more. Among them, from the viewpoint of exhibiting good flexibility and deformability and easily performing the suction cup function, a resin selected from the group consisting of acrylic resin (acrylic polymer), butadiene rubber, and urethane resin is preferred.
• the resin constituting the above adsorption layer preferably contains one or more resins selected from these groups as the main component, and is preferably contained in an amount of 50% by mass or more, more preferably contained in an amount of 80% by mass or more, even more preferably contained in an amount of 90% by mass or more, and particularly preferably contained in an amount of 100% by mass.
• the resin constituting the above adsorption layer is preferably rubber or elastomer from the viewpoint of exhibiting good flexibility and deformability and easily performing the suction cup (adsorption) function.
• the adsorption layer may contain a crosslinking agent, a tackifier resin, a filler, and other optional components, similar to the adhesive layer described above.
• the rate of change is preferably 210% or less, more preferably 200% or less, even more preferably 180% or less, even more preferably 160% or less, particularly preferably 140% or less, and more particularly preferably 120% or less.
• the rate of change of F2 relative to F1 within the above range, the change in the surface adhesive force over time is suppressed, and the stress required for peeling by elongation and stretching is not excessive, and peeling can be performed with low elongation and low stress.
• the occurrence of adhesive residue on the adherend due to an increase in the surface adhesive force over time can be suppressed.
• the surface adhesive forces F1 and F2 can be measured by the method described in the examples below.
• peeling member of the present disclosure (hereinafter also referred to as the present peeling member) has a holding part that holds the temporary fixing tape, a hollow part formed by the holding part, and a stretching means, the holding part is disposed so that the temporary fixing tape covers the hollow part, and the stretching means has a function of stretching the temporary fixing tape surface covering the hollow part in at least one direction.
• a member temporarily fixed to the temporary fixing tape is also referred to as a part.
• FIGS 10 to 17 are schematic diagrams showing an example of a specific embodiment of the present peeling member. Each of the drawings will be described in detail later.
• the present peeling member is preferably used to efficiently carry out the peeling method described in "1. Method for peeling temporary process tape" above.
• the present peeling member has an extensible substrate and a temporary fixing layer on one side of the extensible substrate, and is used to peel off a temporary fixing tape that can be peeled off by stretching.
• the holding part in this peeling member can hold the excess part of the temporary fixing tape (e.g., the end of the tape) and apply tension to the temporary fixing tape.
• the holding part may be a movable holder.
• the holding part (holder) may have a function of stretching the temporary fixing tape in addition to the function of holding the temporary fixing tape.
• the holding part also serves as a stretching means, so that the temporary fixing tape can be stretched in one or more stretching directions while being held.
• the holding part is not particularly limited, but may be any of the holding parts exemplified in the above section "1.
• Method for peeling off temporary fixing tape such as a roll, a frame having a rectangular or circular cavity (e.g., a ring-shaped disk, an O-ring, etc.), a clamping tool such as a clip, etc.
• the material of the holding part (holding tool) is not particularly limited as long as it does not inhibit the extension of the temporary fixing tape, and examples include metal, plastic, wood, minerals, etc., with metal or plastic being preferred from the standpoint of corrosion resistance and effects on parts, etc.
• the stretching means in this peeling member has a function of stretching the temporary fixing tape covering the hollow portion in at least one direction.
• the stretching means directly or indirectly stretches the region of the temporary fixing tape that overlaps with the hollow portion.
• the stretching means only needs to have a function of stretching the temporary fixing tape, and may also serve as a holding portion (holding tool).
• the stretching means may have a function of stretching in only one direction, or may have a function of stretching the temporary fixing tape covering the hollow portion in one direction and at least one direction different from the one direction. This is because the temporary fixing tape covering the hollow portion can be stretched multiaxially. Of these, it is preferable that the stretching means has a function of stretching the temporary fixing tape covering the hollow portion in all directions. This is because the temporary fixing tape can be stretched uniformly in all directions, and multiple components fixed to the area of the temporary fixing tape that overlaps with the hollow portion in a plan view can be peeled off simultaneously and collectively.
• the stretching means when stretching the temporary fixing tape covering the hollow portion in two or more directions, may have a function of stretching in two or more directions simultaneously, or may have a function of stretching in each direction sequentially. In this peeling member, the stretching means may have a function of simultaneously stretching the temporary fixing tape covering the hollow portion in a first stretching direction and in at least one direction different from the first stretching direction.
• the stretching means 10 is a stretching member that can be driven up and down within the hollow portion and that can pass through the hollow portion and press the temporary fixing tape 100 covering the hollow portion in the passing direction.
• the stretching member is a stage.
• the area of the top of the stretching means (stretching member) that comes into contact with the temporary fixing tape is larger than the surface area of the surface of the part (component) on the opposite side of the stretching means of the temporary fixing tape that comes into contact with the tape.
• the area of the top of the stretching means (stretching member) is larger than the sum of the surface areas of the faces of the multiple parts (components) that come into contact with the tape.
• the material of the stretching means is not particularly limited as long as it does not inhibit the stretching of the temporary fixing tape, and may be any of metal, plastic, wood, and minerals. From the viewpoints of corrosion resistance and effects on members, metal or plastic is preferred.
• the manufacturing method of a component of the present disclosure (hereinafter, sometimes referred to as the present manufacturing method) has at least a peeling step of peeling off a component fixed on a temporary fixing tape using the method for peeling off a temporary fixing tape described in the above section "1. Method for peeling off a temporary fixing tape".
• the component obtained by this manufacturing method may be a processed product or an unprocessed workpiece.
• the manufacturing method further includes a processing step described below, in the peeling step, the part processed in the processing step (also called the processed product or the processed member) is peeled off from the temporary fixing tape using the peeling method described in the above section "1. Method for peeling off temporary fixing tape.” In the peeling step, it is preferable to use the peeling member described in the above section "2. Peeling member.”
• This manufacturing method may include at least the peeling step described above, but may also include other steps.
• this manufacturing method may include a processing step of processing the parts (also called workpieces or pre-processed members) temporarily fixed on the temporary fixing tape prior to the peeling step.
• the type of processing applied to the parts is not particularly limited, and examples include cutting, polishing, cutting, etching, etc., as already explained in section "3. Parts Manufacturing Apparatus" above. The parts before processing (workpieces) and the parts after processing (workpieces) have already been explained, so a description thereof will be omitted here.
• Substrate (2) Toluene was added to a hydrogenated styrene-isoprene-styrene triblock copolymer (SEPS, "Septon 2063", manufactured by Kuraray Co., Ltd.), and the mixture was stirred to be homogeneous. The mixture was then applied to a release liner (Film Bina 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) with an applicator so that the thickness after drying would be 100 ⁇ m, and the mixture was dried at 60° C. for 5 minutes to obtain the substrate (2).
• SEPS hydrogenated styrene-isoprene-styrene triblock copolymer
• the mixture was then applied to a release liner (Film Bina 75E-0010GT, manufactured by Fujimori Kogyo Co., Ltd.) with an applicator so that the thickness after drying would be 100 ⁇ m, and the mixture was dried at 60° C. for 5 minutes
• the weight average molecular weight (Mw) and molecular weight distribution (Mw/Mn) of the resulting acrylic triblock copolymer (1) were determined by GPC measurement according to the above-mentioned method, and the weight average molecular weight (Mw) was 100,000 and the molecular weight distribution (Mw/Mn) was 1.2.
• the obtained substrate material was applied to a release liner (PET38x1, A3, manufactured by Nippa) with an applicator so that the average thickness after drying was 100 ⁇ m, and then dried for 2 minutes in a dryer at 80° C.
• the substrate was irradiated with ultraviolet light using an electrodeless UV lamp system manufactured by Heraeus so that the accumulated light amount was 1,000 mJ/cm 2 , thereby preparing a substrate (3).
• Substrate (4) As the non-extensible substrate (4), a polyester film (Toray Industries, Inc., Lumirror S10, thickness 100 ⁇ m) was used.
• Amidair M-3 (DIC Corporation, melamine crosslinking agent) was added to 100 parts by mass of the above aqueous acrylic emulsion (1), followed by 6 parts by mass of Sunspearl RA-33 (San Nopco Ltd., surfactant) and 5 parts by mass of RHEOBYK-H 7625-VF (BYK Japan, thickener) and stirred uniformly.
• the adsorption layer-forming resin composition (1) was applied by an applicator onto a release liner (2) (Film Vina 50E-0010NSD, manufactured by Fujimori Kogyo Co., Ltd.) so that the thickness after drying was 110 ⁇ m, and the adsorption layer having an open-cell structure with many recesses formed on the surface was prepared by drying at 100 ° C for 5 minutes.
• the release liner (1) of the laminated intermediate body was peeled off, and the adsorption layer was attached to the exposed surface of the intermediate layer, and the layers were laminated under a pressure of 0.2 MPa to prepare a temporary fixing tape A (I) having an adsorption layer on one side of the substrate via the intermediate layer.
• Examples 1-1 to 1-6, Comparative Examples 1-1 to 1-2 The obtained tape was cut to a length of 200 mm x width of 20 mm, and both ends of the length of 50 mm x width of 20 mm were laminated with a PET film having a thickness of 50 ⁇ m to form a gripping tab for stretching the tape in the longitudinal direction.
• Three aluminum blocks having a length of 10 mm, a width of 10 mm, and a thickness of 4 mm were prepared, and the aluminum blocks were aligned in series in the longitudinal direction of the tape at the center of the adsorption layer surface of the tape (the adhesive layer surface in Comparative Examples 1 and 2), and the test piece was made by pressing the aluminum blocks with a load of 1 kg/3 pieces for 10 seconds.
• the tab at one end of the tape was placed on a fixture while the aluminum block of the test piece was horizontally facing downward, and then the tab on the opposite side of the tape was gripped and stretched horizontally at a speed of 300 mm/min.
• the peeling evaluation criteria were as follows: ⁇ if the elongation of the tape when peeled off was less than 400%, ⁇ if it was between 400% and 1000%, ⁇ if it was 1000% or more, and ⁇ if it was impossible to peel off.
• Examples 2-1 to 2-5, Comparative Examples 2-1 to 2-3 ⁇ Removal method in which tension is applied perpendicular to the adhesive surface of the tape to stretch it>
• the tape was cut to a length of 250 mm x width of 250 mm, and nine aluminum blocks measuring 10 mm in length, 10 mm in width and 4 mm in thickness were prepared. These were arranged in a checkerboard pattern in the centre of the adsorption layer surface of the tape (the adhesive layer surface in Comparative Examples 1 and 2), and pressed with a rubber roller at a speed of 300 mm/min under a load of 2 kg/30 mm to prepare test pieces.
• the above test piece was placed on a fixed ring (inner cavity ⁇ 150 mm) for placing the tape of the device used as a stretching member.
• a stretching member A for protruding the tape of the above device (outer circumference ⁇ 138 mm, spoke shape, covering parts made of PP bands with a width of 10 mm on the outer rim of the spoke are arranged at 16 equal positions so as to be rotatable along the outer circumferential surface of the outer rim.
• ⁇ (initial gauge length + stretched length of tape) / initial gauge length ⁇ ⁇ 100 elongation at peeling [%]
• the height of the extension member A when all nine aluminum blocks were peeled off was defined as the travel distance of the extension means (the distance the tape was extended by the extension means).
• Example 3 The temporary fixing tapes A(I) and B(I) were stretched in the same manner as in Example 2, except that the stretching member A was replaced with any of the following stretching members B to E.
• Stretched member B Stretched member having a flat surface and roughened by hard anodizing.
• Stretched member D Stretched member having an annular shape in a plan view having an outer periphery and an inner hollow region surrounded by the outer periphery (FIG. 18(a), an embodiment not having a covering portion of stretched member A).

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Cleaning In General (AREA)
• Adhesive Tapes (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

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• 2023
  • 2023-12-28 CN CN202380079149.0A patent/CN120188274A/zh active Pending
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  • 2023-12-28 WO PCT/JP2023/047183 patent/WO2024143522A1/ja not_active Ceased
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