JPWO2024143523A1 - - Google Patents
Info
- Publication number
- JPWO2024143523A1 JPWO2024143523A1 JP2024567970A JP2024567970A JPWO2024143523A1 JP WO2024143523 A1 JPWO2024143523 A1 JP WO2024143523A1 JP 2024567970 A JP2024567970 A JP 2024567970A JP 2024567970 A JP2024567970 A JP 2024567970A JP WO2024143523 A1 JPWO2024143523 A1 JP WO2024143523A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025189175A JP2026027409A (ja) | 2022-12-29 | 2025-11-10 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022212840 | 2022-12-29 | ||
| JP2022212840 | 2022-12-29 | ||
| PCT/JP2023/047184 WO2024143523A1 (ja) | 2022-12-29 | 2023-12-28 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025189175A Division JP2026027409A (ja) | 2022-12-29 | 2025-11-10 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143523A1 true JPWO2024143523A1 (https=) | 2024-07-04 |
| JPWO2024143523A5 JPWO2024143523A5 (https=) | 2025-06-30 |
| JP7776027B2 JP7776027B2 (ja) | 2025-11-26 |
Family
ID=91717955
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567970A Active JP7776027B2 (ja) | 2022-12-29 | 2023-12-28 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
| JP2025189175A Pending JP2026027409A (ja) | 2022-12-29 | 2025-11-10 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025189175A Pending JP2026027409A (ja) | 2022-12-29 | 2025-11-10 | 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7776027B2 (https=) |
| KR (1) | KR20250130290A (https=) |
| CN (1) | CN120112608A (https=) |
| TW (1) | TW202432773A (https=) |
| WO (1) | WO2024143523A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001072951A (ja) * | 1999-09-02 | 2001-03-21 | Dainippon Ink & Chem Inc | 耐衝撃性に優れる両面粘着テープ及び固定方法 |
| JP2013233691A (ja) * | 2012-05-08 | 2013-11-21 | Akebono Kikai Kogyo Kk | 表面保護フィルム |
| JP2017039310A (ja) * | 2015-08-21 | 2017-02-23 | 共和工業株式会社 | 吸着シートの製造方法と吸着シート |
| JP2017186458A (ja) * | 2016-04-06 | 2017-10-12 | 日東電工株式会社 | 吸着仮固定材 |
| JP2020097212A (ja) * | 2018-12-17 | 2020-06-25 | セーレン株式会社 | 養生テープ |
| WO2024143522A1 (ja) * | 2022-12-29 | 2024-07-04 | Dic株式会社 | 仮固定用テープの剥離方法、剥離部材および部品(部材)の製造装置および部品(部材)の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4608759B2 (ja) | 2000-10-19 | 2011-01-12 | 住友ベークライト株式会社 | 半導体ウエハ加工用粘着シート |
| JP5572418B2 (ja) | 2009-03-04 | 2014-08-13 | 日東電工株式会社 | 積層セラミックシート切断用熱剥離型粘着シート |
| DE112021000650T5 (de) | 2020-01-21 | 2022-11-24 | Dic Corporation | Klebeband |
-
2023
- 2023-12-28 CN CN202380078526.9A patent/CN120112608A/zh active Pending
- 2023-12-28 WO PCT/JP2023/047184 patent/WO2024143523A1/ja not_active Ceased
- 2023-12-28 JP JP2024567970A patent/JP7776027B2/ja active Active
- 2023-12-28 KR KR1020257017571A patent/KR20250130290A/ko active Pending
- 2023-12-28 TW TW112151362A patent/TW202432773A/zh unknown
-
2025
- 2025-11-10 JP JP2025189175A patent/JP2026027409A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001072951A (ja) * | 1999-09-02 | 2001-03-21 | Dainippon Ink & Chem Inc | 耐衝撃性に優れる両面粘着テープ及び固定方法 |
| JP2013233691A (ja) * | 2012-05-08 | 2013-11-21 | Akebono Kikai Kogyo Kk | 表面保護フィルム |
| JP2017039310A (ja) * | 2015-08-21 | 2017-02-23 | 共和工業株式会社 | 吸着シートの製造方法と吸着シート |
| JP2017186458A (ja) * | 2016-04-06 | 2017-10-12 | 日東電工株式会社 | 吸着仮固定材 |
| JP2020097212A (ja) * | 2018-12-17 | 2020-06-25 | セーレン株式会社 | 養生テープ |
| WO2024143522A1 (ja) * | 2022-12-29 | 2024-07-04 | Dic株式会社 | 仮固定用テープの剥離方法、剥離部材および部品(部材)の製造装置および部品(部材)の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202432773A (zh) | 2024-08-16 |
| JP7776027B2 (ja) | 2025-11-26 |
| JP2026027409A (ja) | 2026-02-18 |
| CN120112608A (zh) | 2025-06-06 |
| WO2024143523A1 (ja) | 2024-07-04 |
| KR20250130290A (ko) | 2025-09-01 |
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