JP7776027B2 - 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 - Google Patents

吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

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Publication number
JP7776027B2
JP7776027B2 JP2024567970A JP2024567970A JP7776027B2 JP 7776027 B2 JP7776027 B2 JP 7776027B2 JP 2024567970 A JP2024567970 A JP 2024567970A JP 2024567970 A JP2024567970 A JP 2024567970A JP 7776027 B2 JP7776027 B2 JP 7776027B2
Authority
JP
Japan
Prior art keywords
tape
adsorption layer
adsorption
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024567970A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024143523A5 (https=
JPWO2024143523A1 (https=
Inventor
大亮 渡辺
シアアー タン
悠人 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of JPWO2024143523A1 publication Critical patent/JPWO2024143523A1/ja
Publication of JPWO2024143523A5 publication Critical patent/JPWO2024143523A5/ja
Priority to JP2025189175A priority Critical patent/JP2026027409A/ja
Application granted granted Critical
Publication of JP7776027B2 publication Critical patent/JP7776027B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024567970A 2022-12-29 2023-12-28 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法 Active JP7776027B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025189175A JP2026027409A (ja) 2022-12-29 2025-11-10 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022212840 2022-12-29
JP2022212840 2022-12-29
PCT/JP2023/047184 WO2024143523A1 (ja) 2022-12-29 2023-12-28 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025189175A Division JP2026027409A (ja) 2022-12-29 2025-11-10 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Publications (3)

Publication Number Publication Date
JPWO2024143523A1 JPWO2024143523A1 (https=) 2024-07-04
JPWO2024143523A5 JPWO2024143523A5 (https=) 2025-06-30
JP7776027B2 true JP7776027B2 (ja) 2025-11-26

Family

ID=91717955

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024567970A Active JP7776027B2 (ja) 2022-12-29 2023-12-28 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法
JP2025189175A Pending JP2026027409A (ja) 2022-12-29 2025-11-10 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025189175A Pending JP2026027409A (ja) 2022-12-29 2025-11-10 吸着テープ、物品、吸着テープの剥離方法、および部品の製造方法

Country Status (5)

Country Link
JP (2) JP7776027B2 (https=)
KR (1) KR20250130290A (https=)
CN (1) CN120112608A (https=)
TW (1) TW202432773A (https=)
WO (1) WO2024143523A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072951A (ja) 1999-09-02 2001-03-21 Dainippon Ink & Chem Inc 耐衝撃性に優れる両面粘着テープ及び固定方法
JP2013233691A (ja) 2012-05-08 2013-11-21 Akebono Kikai Kogyo Kk 表面保護フィルム
JP2017039310A (ja) 2015-08-21 2017-02-23 共和工業株式会社 吸着シートの製造方法と吸着シート
JP2017186458A (ja) 2016-04-06 2017-10-12 日東電工株式会社 吸着仮固定材
JP2020097212A (ja) 2018-12-17 2020-06-25 セーレン株式会社 養生テープ
WO2024143522A1 (ja) 2022-12-29 2024-07-04 Dic株式会社 仮固定用テープの剥離方法、剥離部材および部品（部材）の製造装置および部品（部材）の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4608759B2 (ja) 2000-10-19 2011-01-12 住友ベークライト株式会社 半導体ウエハ加工用粘着シート
JP5572418B2 (ja) 2009-03-04 2014-08-13 日東電工株式会社 積層セラミックシート切断用熱剥離型粘着シート
DE112021000650T5 (de) 2020-01-21 2022-11-24 Dic Corporation Klebeband

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072951A (ja) 1999-09-02 2001-03-21 Dainippon Ink & Chem Inc 耐衝撃性に優れる両面粘着テープ及び固定方法
JP2013233691A (ja) 2012-05-08 2013-11-21 Akebono Kikai Kogyo Kk 表面保護フィルム
JP2017039310A (ja) 2015-08-21 2017-02-23 共和工業株式会社 吸着シートの製造方法と吸着シート
JP2017186458A (ja) 2016-04-06 2017-10-12 日東電工株式会社 吸着仮固定材
JP2020097212A (ja) 2018-12-17 2020-06-25 セーレン株式会社 養生テープ
WO2024143522A1 (ja) 2022-12-29 2024-07-04 Dic株式会社 仮固定用テープの剥離方法、剥離部材および部品（部材）の製造装置および部品（部材）の製造方法

Also Published As

Publication number Publication date
TW202432773A (zh) 2024-08-16
JP2026027409A (ja) 2026-02-18
CN120112608A (zh) 2025-06-06
JPWO2024143523A1 (https=) 2024-07-04
WO2024143523A1 (ja) 2024-07-04
KR20250130290A (ko) 2025-09-01

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