WO2024083239A1 - 工作组件和电子设备 - Google Patents

工作组件和电子设备 Download PDF

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Publication number
WO2024083239A1
WO2024083239A1 PCT/CN2023/125736 CN2023125736W WO2024083239A1 WO 2024083239 A1 WO2024083239 A1 WO 2024083239A1 CN 2023125736 W CN2023125736 W CN 2023125736W WO 2024083239 A1 WO2024083239 A1 WO 2024083239A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
air outlet
circuit board
heat dissipation
edge
Prior art date
Application number
PCT/CN2023/125736
Other languages
English (en)
French (fr)
Inventor
张少华
杨欢
张楠赓
Original Assignee
北京嘉楠捷思信息技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京嘉楠捷思信息技术有限公司 filed Critical 北京嘉楠捷思信息技术有限公司
Publication of WO2024083239A1 publication Critical patent/WO2024083239A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the field of heat dissipation technology, and in particular to a working component and an electronic device.
  • a circuit board is usually provided with heat generating components including a chip.
  • the heat generating components will generate a lot of heat during operation, so the circuit board needs to be placed in a heat dissipation duct for heat dissipation.
  • the temperature difference between the heat generating components near the air outlet and the heat generating components near the air inlet is usually large, resulting in poor temperature uniformity of the heat generating components.
  • the embodiments of the present application provide a working component and an electronic device to solve or alleviate one or more technical problems in the prior art.
  • an embodiment of the present application provides a working component, which is suitable for working in a heat dissipation duct, wherein the direction from the air inlet to the air outlet of the heat dissipation duct is a first direction, and is characterized in that it includes: a circuit board; a radiator, including a heat dissipation body and a plurality of heat dissipation fins, the heat dissipation body including a first side surface and a second side surface arranged opposite to each other, the circuit board is arranged on the first side surface of the heat dissipation body, and the plurality of heat dissipation fins are arranged on the second side surface of the heat dissipation body, and the plurality of heat dissipation fins are arranged at intervals along a second direction perpendicular to the first direction; wherein, along the first direction, an edge of the heat dissipation body close to the air outlet exceeds an edge of the circuit
  • the size of the heat dissipation body exceeds the size of the circuit board by 10 mm to 20 mm.
  • the size of the heat dissipation fin exceeds the size of the circuit board by 10 mm to 20 mm.
  • the circuit board includes a first side surface and a second side surface that are arranged opposite to each other, and a plurality of heat-generating components are arranged on the first side surface of the circuit board;
  • the heat sink includes a first heat sink arranged on the first side surface of the circuit board, and/or a second heat sink arranged on the second side surface of the circuit board.
  • the edge of the heat dissipation body and/or heat dissipation fins of the first radiator near the air outlet exceeds the edge of the circuit board near the air outlet; the edge of the heat dissipation body and heat dissipation fins of the second radiator near the air outlet does not exceed the edge of the circuit board near the air outlet.
  • the edge of the heat dissipation body and/or heat dissipation fins of the second heat sink near the air outlet exceeds the edge of the circuit board near the air outlet; the edge of the heat dissipation body and heat dissipation fins of the first heat sink near the air outlet does not exceed the edge of the circuit board near the air outlet.
  • the edge of the heat dissipation body and/or heat dissipation fins of the first radiator near the air outlet exceeds the edge of the circuit board near the air outlet
  • the edge of the heat dissipation body and/or heat dissipation fins of the second radiator near the air outlet exceeds the edge of the circuit board near the air outlet
  • At least one groove is formed on the heat dissipation fin.
  • At least one groove penetrates the corresponding heat dissipation fin in the second direction and the third direction to divide the corresponding heat dissipation fin into a plurality of sub-heat dissipation fins, wherein the third direction is perpendicular to the first direction and the second direction.
  • At least one groove does not penetrate the corresponding heat dissipation fin in the second direction and/or the third direction, wherein the third direction is perpendicular to the first direction and the second direction.
  • the groove is disposed at one end of the heat dissipation fin relative to the center of the length direction of the heat sink and close to the air outlet.
  • the plurality of heat dissipating fins are all provided with grooves, and the plurality of grooves form at least one row of grooves in the second direction.
  • a plurality of heat-generating components are disposed on the circuit board, and the plurality of heat-generating components constitute a plurality of heat-generating columns arranged at intervals along a first direction, each heat-generating column includes a plurality of heat-generating components arranged at intervals along a second direction, and at least one groove column is arranged opposite to at least one heat-generating column.
  • a dimension of each groove in the first direction is 2.5 mm to 3.5 mm.
  • At least one heat dissipating fin comprises a chamfered portion, and a height of the chamfered portion gradually increases along the first direction.
  • the chamfered portion is disposed close to the air inlet relative to the center of the radiator.
  • a heat generating component is provided at a position of the circuit board corresponding to the end of the chamfered portion away from the air inlet.
  • the end of the chamfered portion away from the air inlet corresponds to the position of the third column of heat-generating components.
  • an embodiment of the present application provides an electronic device, including working components according to any one of the above-mentioned aspects of the present application.
  • the embodiment of the present application adopts the above-mentioned technical solution to reduce the maximum temperature difference between the heat-generating components close to the air outlet and the heat-generating components close to the air inlet, thereby improving the temperature uniformity of the heat-generating components.
  • FIG1 is a schematic diagram of a three-dimensional structure of an electronic device according to an embodiment of the present application.
  • FIG2 is a perspective view of the electronic device shown in FIG1 from another angle;
  • FIG3 is a front view of the electronic device shown in FIG1 ;
  • FIG4 is a rear view of the electronic device shown in FIG1 ;
  • FIG5 is a left side view of the electronic device shown in FIG1;
  • FIG6 is a right side view of the electronic device shown in FIG1 ;
  • FIG7 is a top view of the electronic device shown in FIG1 ;
  • FIG8 is a bottom view of the electronic device shown in FIG1;
  • FIG9A is an exploded view of the electronic device shown in FIG1 ;
  • FIG9B is an enlarged view of the circled portion A in FIG9A ;
  • FIG10A is a schematic structural diagram of an air outlet panel according to another embodiment of the present application.
  • FIG10B is a partial enlarged view of the air outlet panel shown in FIG10A;
  • FIG11 is another exploded view of the electronic device shown in FIG1 ;
  • FIG12 is a schematic diagram of installing a fan assembly of the electronic device shown in FIG1 ;
  • FIG13 is a cross-sectional view of the electronic device shown in FIG1 ;
  • FIG14 is a schematic diagram of cable connection of a fan module of the electronic device shown in FIG1 ;
  • FIG15 is a perspective view of a fan assembly of the electronic device shown in FIG1 ;
  • FIG16 is an enlarged view of the circled portion B in FIG15 ;
  • FIG17 is a perspective view of the fan assembly of the electronic device shown in FIG1 from another angle;
  • FIG18 is a perspective view of the mounting member of the fan assembly shown in FIG17;
  • FIG19 is a perspective view of the flexible protective cover of the fan assembly shown in FIG17;
  • FIG20 is a schematic diagram of the internal structure of the electronic device shown in FIG1 ;
  • FIG21 is a schematic diagram of cable connection of the electronic device shown in FIG1 ;
  • FIG22 is a schematic diagram of the structure of a first conductive connector and a second conductive connector according to an embodiment of the present application
  • FIG23 is a cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG24 is an enlarged view of the circled portion C in FIG23;
  • FIG25A is a cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG25B is an enlarged view of the circled portion D in FIG25A;
  • FIG26A is a cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG26B is a partial enlarged view of the electronic device shown in FIG26A;
  • FIG27 is a schematic diagram of installing a power module according to an embodiment of the present application.
  • FIG28 is a schematic diagram of installation of a power module from another angle according to an embodiment of the present application.
  • FIG29A is a schematic diagram showing the connection between a power module and a housing according to an embodiment of the present application.
  • FIG29B is an enlarged view of the circled portion E in FIG29A ;
  • FIG30A is a schematic diagram of installing a power module of an electronic device according to another embodiment of the present application.
  • FIG30B is a partial enlarged view of the electronic device shown in FIG30A;
  • FIG30C is a schematic structural diagram of a threaded fastener of the electronic device shown in FIG30A ;
  • FIG31 is a schematic diagram of a three-dimensional structure of a working component according to an embodiment of the present application.
  • FIG32 is a perspective view of the working assembly shown in FIG31 from another angle;
  • Fig. 33 is a front view of the working assembly shown in Fig. 31;
  • Fig. 34 is a rear view of the working assembly shown in Fig. 31;
  • Fig. 35 is a left side view of the working assembly shown in Fig. 31;
  • Fig. 36 is a right side view of the working assembly shown in Fig. 31;
  • Fig. 37 is a top view of the working assembly shown in Fig. 31;
  • Fig. 38 is a bottom view of the working assembly shown in Fig. 31;
  • Fig. 39A is an exploded view of the working assembly shown in Fig. 31;
  • FIG39B is a schematic diagram of a working component according to another embodiment of the present application.
  • FIG40 is a schematic structural diagram of a first connecting socket of a working assembly according to an embodiment of the present application.
  • FIG41 is a schematic structural diagram of a first connecting socket of a working assembly according to an embodiment of the present application.
  • FIG42 is a schematic diagram of a partial structure of a seal of a working assembly according to an embodiment of the present application.
  • FIG43 is a schematic diagram of installing a seal of a working assembly according to an embodiment of the present application.
  • FIG44 is a schematic structural diagram of a spring screw of a working assembly according to an embodiment of the present application.
  • FIG45 is a schematic diagram of a three-dimensional structure of a working component according to another embodiment of the present application.
  • Fig. 46 is a front view of the working assembly shown in Fig. 45;
  • Fig. 47 is a rear view of the working assembly shown in Fig. 45;
  • Fig. 48 is a left side view of the working assembly shown in Fig. 45;
  • Fig. 49 is a right side view of the working assembly shown in Fig. 45;
  • Fig. 50 is a top view of the working assembly shown in Fig. 45;
  • Fig. 51 is a bottom view of the working assembly shown in Fig. 45;
  • Figure 52 is a schematic diagram of the structure of a circuit board according to an embodiment of the present application.
  • the working component 100 according to the first embodiment of the present application is described below in conjunction with Figures 1 to 52.
  • the working component 100 is suitable for working in a heat dissipation duct to achieve heat dissipation of the working component 100.
  • the direction from the air inlet to the air outlet of the heat dissipation duct is the first direction.
  • the working component 100 includes a circuit board 110 and a heat sink 120.
  • the heat sink 120 includes a heat sink body 121 and a plurality of heat sink fins 122, the heat sink body 121 is disposed on the circuit board 110, and the plurality of heat sink fins 122 are disposed on a side of the heat sink body 121 away from the circuit board 110 (for example, the heat sink body 121 includes a first side surface and a second side surface that are disposed oppositely, the circuit board is disposed on the first side surface of the heat sink body 121, and the plurality of heat sink fins 122 are disposed on the second side surface of the heat sink body 121), and the plurality of heat sink fins 122 are arranged at intervals along a second direction perpendicular to the first direction.
  • "plurality" means two or more.
  • the circuit board 110 includes a first side and a second side arranged opposite to each other, and a plurality of heat-generating components are arranged on the first side of the circuit board;
  • the heat sink includes a first heat sink arranged on the first side of the circuit board, and/or a second heat sink arranged on the second side of the circuit board.
  • the working assembly 100 includes a circuit board 110 and at least one heat sink 120. Specifically, a plurality of heat generating components 111 are disposed on at least one side surface of the circuit board 110, and the heat sink 120 is disposed on the circuit board 110.
  • "plurality" means two or more.
  • Multiple heat sinks 120 may include a first heat sink 123 and a second heat sink 124.
  • first heat sink 123 is arranged on the first surface of the circuit board 110
  • second heat sink 124 is arranged on the second surface of the circuit board 110.
  • the first surface is parallel to the first direction and the second direction.
  • a plurality of heating components 111 may be arranged on the circuit board 110, and the plurality of heating components 111 may include a plurality of chips arranged on the first surface of the circuit board 110, and the first heat sink 123 may be arranged corresponding to the chip, and the first heat sink 123 may be in direct or indirect contact with the chip through a thermally conductive material (such as silicone grease).
  • a plurality of bosses are arranged on the first heat sink 123, and the bosses are arranged corresponding to the chip.
  • the bosses may be arranged in multiple rows or columns, and each row of the multiple rows of bosses corresponds to each row of chips; each column of the multiple columns of bosses corresponds to each column of chips; the bosses may also be independent structures of an array, and each independent boss corresponds to a single chip, and each independent boss cross-sectional area may cover a single chip or be smaller than a single chip.
  • the first heat sink 123 may include a plurality of independently arranged sub-heat sinks.
  • the heat of the first surface of the circuit board 110 can be effectively transferred to the first heat sink 123, and the heat of the second surface of the circuit board 110 can be effectively transferred to the second heat sink 124.
  • the heat of the first heat sink 123 and the second heat sink 124 can be effectively taken away, thereby achieving the circuit board 110 Effective heat dissipation.
  • the edge of the heat dissipation body 121 close to the air outlet exceeds the edge of the circuit board 110 close to the air outlet
  • the edge of the heat dissipation fin 122 close to the air outlet exceeds the edge of the circuit board 110 close to the air outlet
  • the edge of the heat dissipation body 121 close to the air outlet exceeds the edge of the circuit board 110 close to the air outlet, and the edge of the heat dissipation fin 122 close to the air outlet does not exceed the edge of the circuit board 110 close to the air outlet; or, along the first direction, the edge of the heat dissipation fin 122 close to the air outlet exceeds the edge of the circuit board 110 close to the air outlet, and the edge of the heat dissipation body 121 close to the air outlet does not exceed the edge of the circuit board 110 close to the air outlet; of course, it may also be that along the first direction, the edge of the heat dissipation body 121 close to the air outlet exceeds the edge of the circuit board 110 close to the air outlet, and the edge of the heat dissipation fin 122 close to the air outlet exceeds the edge of the circuit board 110 close to the air outlet.
  • a plurality of heat generating components on the first surface constitute six heat generating columns arranged at intervals along the first direction.
  • the six heat generating columns can be divided into two parts, each part includes three heat generating columns, one of the two parts is arranged near the air inlet, and the other of the two parts is arranged near the air outlet.
  • the edge of the heat dissipation body 121 and/or the heat dissipation fins 122 of the first radiator 123 near the air outlet exceeds the edge of the circuit board 110 near the air outlet; the edges of the heat dissipation body 121 and the heat dissipation fins 122 of the second radiator 124 near the air outlet do not exceed the edge of the circuit board 110 near the air outlet; or; along the first direction, the edge of the heat dissipation body 121 and/or the heat dissipation fins 122 of the second radiator 124 near the air outlet exceeds the edge of the circuit board 110 near the air outlet; the edges of the heat dissipation body 121 and the heat dissipation fins 122 of the first radiator 123 near the air outlet do not exceed the edge of the circuit board 110 near the air outlet; of course, it can also be that along the first direction, the edge of the heat dissipation body 121 and/or the heat dissipation fins
  • Such a configuration can increase the area of the radiator 120 at the air outlet, so that the heat of the heat-generating components near the air outlet can be better conducted to the corresponding radiator 120, reducing the maximum temperature difference between the heat-generating components in the three columns of heat-generating columns near the air outlet.
  • the heat dissipation effect of the three columns of heat-generating columns near the air outlet can be improved, which is beneficial to reducing the maximum temperature difference between the two parts of the heat-generating components, thereby improving the overall temperature uniformity of multiple heat-generating components.
  • the size of the heat dissipation body 121 and/or the heat dissipation fins 122 close to the air outlet in the first direction can be lengthened, thereby reducing the maximum temperature difference between the heat-generating components close to the air outlet and the heat-generating components close to the air inlet, thereby improving the temperature uniformity of the heat-generating components on the circuit board 110.
  • FIG. 31 to FIG. 39A show two heat sinks 120 for illustrative purposes, but after reading the technical solution of the present application, ordinary technicians can obviously understand that the solution can be applied to heat dissipation or more heat sinks. In the technical solution of 120, this also falls within the protection scope of this application.
  • the size of at least one heat sink 120 in the first direction is larger than the size of the circuit board 110 in the first direction, and the first direction is the direction from the air inlet to the air outlet of the heat dissipation duct.
  • the edge of at least one heat sink 120 near the air outlet exceeds the edge of the circuit board 110 near the air outlet.
  • the first surface and the second surface of the circuit board 110 may both be parallel to the first direction.
  • the multiple heat-generating components 111 on the first surface may be arranged in a row, and in the second direction, the centers of at least three or all of the heat-generating components 111 are in a straight line, and the second direction is perpendicular to the first direction.
  • Figure 39A shows six columns of heat-generating components 111, and the six columns of heat-generating components 111 may be divided into two parts, each part including three columns of heat-generating components 111, one of the two parts is arranged near the air inlet, and the other of the two parts is arranged near the air outlet.
  • the edges of the first radiator 123 and the second radiator 124 near the air outlet may both extend beyond the edge of the circuit board 110 near the air outlet.
  • Such a configuration can increase the area of the radiator 120 at the air outlet, so that the heat of a group of heat-generating components 111 near the air outlet can be better conducted to the corresponding radiator 120, reducing the maximum temperature difference between the three rows of heat-generating components 111 near the air outlet.
  • the heat dissipation effect of the three rows of heat-generating components 111 near the air outlet can be improved, which is beneficial to reducing the maximum temperature difference between the two groups of heat-generating components 111, thereby improving the overall temperature uniformity of multiple heat-generating components 111.
  • the heat dissipation body 121 and/or the heat dissipation fins 122 of at least one radiator 120 can be lengthened in the first direction close to the air outlet, thereby reducing the maximum temperature difference between the heat-generating component 111 close to the air outlet and the heat-generating component 111 close to the air inlet, thereby improving the temperature uniformity of the heat-generating component 111.
  • the size of the heat sink body 121 exceeds the size of the circuit board 110 by 10 mm to 20 mm (including the end value). Specifically, for example, the size of the heat sink body 121 exceeds the size of the circuit board 110 by L1.
  • L1 can be 15 mm, but is not limited thereto.
  • the edge of the heat dissipation fin 122 near the air outlet exceeds the edge of the circuit board 110 near the air outlet.
  • the size of the heat dissipation fin 122 exceeds the size L2 of the circuit board 110 by 10 mm to 20 mm (including the end point values).
  • the heat dissipation fins 122 extend too far beyond the circuit board 110 in the first direction, resulting in poor heat dissipation of the heat-generating components near the air outlet, and the temperature uniformity of the heat-generating components cannot be effectively improved; when L2 is greater than 20 mm, the heat dissipation fins 122 extend too far beyond the circuit board 110 in the first direction, and the radiator 120 occupies too much space at the air outlet, which may also increase the volume of the shell and cause the radiator 120 to be too heavy.
  • L2 can be 15 mm, but is not limited thereto.
  • the size range of L1 and L2 is not limited to 10 mm to 20 mm.
  • the method of extending the length of the heat dissipation body 121 and/or the heat dissipation fins 122 in the present invention can be applied to adaptively adjust the lengths L1 and L2 according to different usage scenarios.
  • each heat sink 120 includes a heat sink body 121 and a plurality of heat sink fins 122 disposed on the heat sink body 121.
  • the heat sink body 121 is parallel to the circuit board 110, and the heat sink fins 122 are perpendicular to the circuit board 110.
  • At least one heat sink fin 122 is formed with at least one groove 1222.
  • one heat sink fin 122 may be formed with one groove 1222; or one heat sink fin 122 may be formed with multiple grooves 1222; or at least two heat sink fins 122 may be formed with grooves 1222, and the number of grooves 1222 on each heat sink fin 122 may be one or more.
  • each groove 1222 can penetrate the corresponding heat sink fin 122 in the second direction and the third direction to divide the heat sink fin 122 into a plurality of sub-heat sink fins, wherein the third direction is perpendicular to the first direction and the second direction.
  • the groove 1222 can divide the entire heat sink fin 122 into a plurality of sub-heat sink fins spaced apart in the first direction. The air will expand and then contract before and after flowing through this area. After the air passes through the groove 1222 area, the disturbance becomes stronger, the convective heat transfer coefficient becomes larger, and the thermal resistance is reduced.
  • At least one groove 1222 does not penetrate the corresponding heat dissipation fin 122 in the second direction and/or the third direction, and each heat dissipation fin 122 is not divided into a plurality of sub-fins. In other words, at least one groove 1222 does not penetrate the corresponding heat dissipation fin 122 in the second direction and penetrates the corresponding heat dissipation fin in the third direction.
  • the second direction is the arrangement direction of the plurality of heat dissipation fins 122
  • the third direction is the direction perpendicular to the surface of the circuit board 110.
  • the overall weight of the heat sink 122 can be reduced, and the wind resistance of the wind flowing through the radiator 120 can be effectively reduced, the ventilation volume can be increased, and the amount of dust accumulated on the heat sink 122 can be reduced while improving the heat dissipation effect.
  • the amount of dust accumulated on the side of the radiator 120 close to the air inlet is usually greater than the amount of dust accumulated on the side close to the air outlet.
  • the groove 1222 is provided at one end of the heat sink 122 close to the air inlet, the amount of dust accumulated at the end of the radiator 120 close to the air inlet may be further increased.
  • the groove 1222 is disposed at the end of the heat dissipation fin 122 that is close to the air outlet relative to the center of the radiator 120, that is, "the end close to the air outlet” refers to the end close to the air outlet with the center of the radiator 120 as a reference standard. Therefore, since the temperature of the wind at the air outlet is usually higher, after the wind exchanges heat with the end of the radiator 120 close to the air outlet, the heat generated during the operation of the heat-generating component 111 cannot be effectively taken away.
  • the convection heat transfer coefficient of the air outlet area can be increased, and the thermal resistance at the air outlet can be reduced, so that the ventilation volume at the air outlet can be increased, and the heat dissipation effect of the heat-generating component 111 at the air outlet can be improved, while suppressing the deposition of dust, thereby improving the temperature uniformity of the heat-generating component 111.
  • the plurality of heat dissipating fins 122 are each provided with grooves 1222 , and the plurality of grooves 1222 form at least one groove column in the second direction.
  • each heat dissipating fin 122 when a groove 1222 is formed on each heat dissipating fin 122, multiple grooves 1222 are correspondingly arranged in the second direction to form a row of grooves; when multiple grooves 1222 are at least partially formed in multiple heat dissipating fins 122, at least one groove 1222 on each heat dissipating fin 122 is correspondingly arranged in the second direction with the grooves 1222 on other heat dissipating fins 122 to form at least one row of grooves.
  • the size of the groove 1222 on each heat dissipating fin 122 may gradually increase; or, along the first direction, the size of the groove 1222 on each heat dissipating fin 122 may gradually decrease; or, along the first direction, the size of the groove 1222 on each heat dissipating fin 122 may be completely equal. It is also possible that the size of the groove 1222 is positively correlated or negatively correlated with the width of the heat dissipating fin 122. Of course, the present application is not limited thereto. For example, the size of the groove 1222 on each heat dissipating fin 122 may be set as required, and the width of the heat dissipating fin between two grooves 122 may be combined and changed. It is understandable that the size, number, and specific position of the groove 1222 on each heat dissipating fin 122 may be specifically set according to actual needs to better meet actual applications.
  • the grooves 1222 are arranged corresponding to the heat generating components 111.
  • each heat dissipating fin 122 of at least one heat sink 120 is provided with a groove 1222, a plurality of grooves 1222 are arranged in a row, and at least one row of grooves 1222 is arranged opposite to at least one row of heat generating components 111.
  • the grooves 1222 on the plurality of heat dissipating fins 122 may correspond to each other in the arrangement direction of the heat dissipating fins 122, so that the grooves 1222 on the plurality of heat dissipating fins 122 are arranged in a row.
  • only the heat dissipating fins 122 of the first heat sink 123 may be provided with grooves 1222; or, only the heat dissipating fins 122 of the second heat sink 124 may be provided with grooves 1222, as shown in Figure 39B; or, both the heat dissipating fins 122 of the first heat sink 123 and the second heat sink 124 may be provided with grooves 1222, in which case the grooves 1222 on the heat dissipating fins 122 on the first heat sink 123 and the second heat sink 124 may be different.
  • a plurality of heat generating components constitute a plurality of heat generating columns arranged at intervals along a first direction
  • each heat generating column includes a plurality of heat generating components arranged at intervals along a second direction
  • at least one column of grooves is arranged opposite to at least one column of heat generating columns.
  • the wind resistance can be effectively reduced, thereby increasing the air volume at the heat generating components opposite to the grooves 1222, and improving the heat dissipation effect of the heat generating components opposite to the grooves 1222.
  • the size of the groove 1222 in the first direction can be 2.5mm to 3.5mm (including the endpoint values). But not limited to this.
  • the width of the groove 1222 is too small, which may reduce the weight reduction effect;
  • the size of the groove 1222 in the first direction is greater than 3.5mm, the width of the groove 1222 is too large, which may cause the surface area of the heat sink 122 to be too small, reducing the heat dissipation.
  • the weight of the radiator 120 can be effectively reduced while ensuring the heat dissipation effect of the radiator 120.
  • the size of the groove 1222 on each heat dissipating fin 122 may gradually increase; or, along the first direction, the size of the groove 1222 on each heat dissipating fin 122 may gradually decrease; or, along the first direction, the size of the groove 1222 on each heat dissipating fin 122 may be completely equal. It is also possible that the size of the groove 1222 is positively correlated or negatively correlated with the width of the heat dissipating fin 122. Of course, the present application is not limited thereto. For example, the size of the groove 1222 on each heat dissipating fin 122 may be set as required, and the width of the heat dissipating fin between two grooves 122 may be combined and changed. It is understandable that the size, number, and specific position of the groove 1222 on each heat dissipating fin 122 may be specifically set according to actual needs to better meet actual applications.
  • the heat generated during the operation of the heat-generating component 111 opposite to the groove 1222 can be transferred to the heat-dissipating body 121, and the wind flowing through the heat-dissipating body 121 can be heated. It can directly exchange heat with the heat dissipation body 121 to achieve heat dissipation of the heat-generating component 111. Since the convection heat transfer coefficient at the groove 1222 is large, the wind resistance can be effectively reduced, thereby increasing the air volume at the heat-generating component 111 opposite to the groove 1222, and improving the heat dissipation effect of the heat-generating component 111 opposite to the groove 1222.
  • At least one heat dissipating fin 122 includes a chamfered portion 1221 , and a height of the chamfered portion 1221 gradually increases along the first direction.
  • the chamfered portion 1221 is arranged near the air inlet relative to the center of the heat sink 120, and the end of the chamfered portion 1221 away from the air inlet corresponds to the position of the third column of the heat generating components 111, that is, the end of the chamfered portion 1221 away from the air inlet is located near the middle of the circuit board 110 along the first direction.
  • the above-mentioned “third column of heat generating components 111" refers to the heat dissipation components located in the third column along the first direction.
  • all the heat dissipation fins 122 of the first heat sink 123 and the second heat sink 124 include a chamfered portion 1221, and the chamfered portion 1221 is arranged near the air inlet.
  • the first three columns of heat generating components 111 can be arranged opposite to the chamfered portion 1221, and the last three columns of heat generating components 111 can be arranged opposite to the corresponding grooves 1222, and the last three columns of heat generating components can be arranged opposite to the corresponding grooves 1222.
  • third column of heat-generating components 111 may also be the fourth column of heat-generating components 111 located near the middle of the circuit board 110 along the first direction. If the total number of heat-generating components 111 is 8 columns, then "the end of the chamfered portion 1221 away from the air inlet is located near the middle of the circuit board 110 along the first direction" corresponds to the fourth column of heat-generating components 111 or the fifth column of heat-generating components 111.
  • the weight of the entire heat dissipation fin 122 can be effectively reduced, and the thermal resistance at the air inlet can be reduced, thereby increasing the ventilation volume at the air inlet, improving the heat dissipation effect of the heat-generating component 111 at the air inlet, and at the same time suppressing the deposition of dust and improving the temperature uniformity of the heat-generating component 111.
  • An electronic device such as a computing device, according to an embodiment of the second aspect of the present application includes a working component 100 according to any implementation of the first aspect of the present application.
  • the maximum temperature difference between the heat-generating components near the air outlet and the heat-generating components near the air inlet can be reduced, thereby improving the temperature uniformity of the heat-generating components.
  • the working component 100 and other components of the electronic device in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.
  • the size of the first heat sink 123 is the same as the size of the second heat sink 124. In this way, while achieving heat dissipation on the first surface and the second surface of the circuit board 110, the sizes of the first heat sink 123 and the second heat sink 124 can be consistent, thereby improving the versatility of the heat sink 120 and facilitating the processing of the heat sink 120.
  • the density of the heat dissipation fins 122 of the first heat sink 123 is the same as the density of the heat dissipation fins 122 of the second heat sink 124, and the height of the heat dissipation fins 122 of the first heat sink 123 is different from the height of the heat dissipation fins 122 of the second heat sink 124.
  • the height of the heat dissipation fins 122 of the first heat sink 123 can be greater than the height of the heat dissipation fins 122 of the second heat sink 124.
  • the first heat sink 123 Since the first heat sink 123 is in contact with a plurality of heat-generating components 111, by making the height of the heat dissipation fins 122 of the first heat sink 123 greater than the height of the heat dissipation fins 122 of the second heat sink 124, the area of the heat dissipation fins 122 of the first heat sink 123 can be greater than the area of the heat dissipation fins 122 of the second heat sink 124, and the heat dissipation fins 122 of the first heat sink 123 can effectively absorb the heat generated during the operation of the plurality of heat-generating components 111, thereby improving the heat dissipation effect.
  • the height of the heat dissipation fins 122 of the first heat sink 123 is the same as the height of the heat dissipation fins 122 of the second heat sink 124, and the density of the heat dissipation fins 122 of the first heat sink 123 is different from the density of the heat dissipation fins 122 of the second heat sink 124.
  • the density of the heat dissipation fins 122 of the first heat sink 123 may be greater than the density of the heat dissipation fins 122 of the second heat sink 124.
  • the first radiator 123 is in contact with multiple heat-generating components 111, by making the density of the heat-generating fins 122 of the first radiator 123 greater than the density of the heat-generating fins 122 of the second radiator 124, the area of the heat-generating fins 122 of the first radiator 123 can be greater than the area of the heat-generating fins 122 of the second radiator 124, and the heat-generating fins 122 of the first radiator 123 can also effectively absorb the heat generated by the multiple heat-generating components 111 during operation, which is beneficial to improving the heat dissipation effect; or, the density of the heat-generating fins 122 of the first radiator 123 can be less than the density of the heat-generating fins 122 of the second radiator 124, so that there is a larger heat-dissipating space between adjacent heat-generating fins 122 of the first radiator 123, and the first radiator 123 shares more wind, thereby reducing wind resistance, increasing ventilation volume, and improving dust accumulation, and can also effectively dissipate the heat generated
  • the total surface area of the heat dissipation fins 122 of the first heat sink 123 is greater than the total surface area of the heat dissipation fins 122 of the second heat sink 124. This is conducive to reducing the overall temperature of the plurality of heat-generating components 111 and reducing the maximum temperature of the plurality of heat-generating components 111.
  • the present application is not limited thereto, and in another optional embodiment, the total surface area of the heat dissipation fins 122 of the first heat sink 123 may be smaller than the total surface area of the heat dissipation fins 122 of the second heat sink 124. In this way, the dust accumulation of the first heat sink 123 can be further improved, and the heat generated by the multiple heat-generating components 111 during operation can be effectively dissipated.
  • the number of heat dissipation fins 122 of the first heat sink 123 may be less than the number of heat dissipation fins 122 of the second heat sink 124. In this way, the total surface area of the heat dissipation fins 122 of the first heat sink 123 may be relatively small, thereby increasing the ventilation volume, improving dust accumulation, and also effectively dissipating the heat generated by the multiple heat generating components 111 during operation.
  • the end of the second heat sink 124 exceeds the corresponding end of the first heat sink 123.
  • the size of the second heat sink 124 is larger than the size of the first heat sink 123, and both ends of the second heat sink 124 exceed the corresponding ends of the first heat sink.
  • the number of the first heat sink 123 can be relatively small, and the total surface area of the heat dissipation fins 122 is relatively small, which can further improve the problem of serious dust accumulation of the first heat sink 123, increase the ventilation volume of the first heat sink 123, and further improve the heat dissipation effect.
  • the density of the heat generating components 111 near the air inlet of the heat dissipation air duct may be greater than the density of the heat generating components 111 near the air outlet. Since the air entering from the air inlet is cold air and the air discharged from the air outlet is hot air, by making the density of the heat generating components 111 at the air inlet larger, the heat generated by the heat generating components 111 at the air inlet can be increased, and by making the density of the heat generating components 111 at the air outlet smaller, the heat generated by the heat generating components 111 at the air outlet can be reduced, thereby further reducing the maximum temperature difference between the heat generating components 111 near the air outlet and the heat generating components 111 near the air inlet, thereby improving the temperature uniformity of the heat generating components 111.
  • a plurality of heat-generating components 111 near the air outlet are divided into a plurality of heat-generating component groups along the second direction, and a gap between two adjacent heat-generating component groups is larger than a gap between two adjacent heat-generating components 111 in each heat-generating component group.
  • the six columns of heat-generating components 111 are shown in the example of FIG. 52 .
  • the six columns of heat-generating components 111 arranged in sequence along the first direction are respectively referred to as the first heat-generating column, the second heat-generating column...the sixth heat-generating column.
  • the number of heat-generating components 111 in the first to third heat-generating columns is 21, and the number of heat-generating components 111 in the fourth to sixth heat-generating columns is 19. Among them, the 21 heat-generating components 111 in the first to third heat-generating columns are evenly spaced.
  • the 19 heat-generating components 111 in the fourth to sixth heat-generating columns are divided into three groups of heat-generating component groups, and the number of heat-generating components 111 in the heat-generating component groups at the two ends of the second direction in the three groups of heat-generating component groups is the same, and the number of heat-generating components 111 in the heat-generating component group located in the middle of the second direction is less than the number of heat-generating components 111 in the heat-generating component groups at the two ends.
  • the arrangement of the heat generating components 111 can be in various forms. From the first row near the air inlet (such as the first heat generating row mentioned above) to the last row at the air outlet (such as the sixth heat generating row mentioned above), the number of chips in each row is not completely equal.
  • the number of chips in each row can be gradually reduced, such as 21, 20, 19, 18, 17, 16; it can be partially decremented, such as 21, 21, 21, 19, 19, 19; it can also be a jump in quantity, such as 21, 21, 20, 19, 20, 21; or 21, 21, 20, 19, 18, 21; other numbers of chip arrays can also be set according to heat dissipation requirements, so that the total number of chips in the front half near the air inlet is greater than the total number of chips in the back half near the air outlet.
  • the front half and the back half here can be a half-division of the number of chip columns, or a half-division of the size of the circuit board 110. As shown in Figure 52, the total number of chips in the first three columns near the air inlet is set to be greater than the total number of chips in the back three columns near the air outlet.
  • the arrangement of each row of chips can also be combined in different forms, and the number of chips in each row can be different.
  • some rows of chips are arranged in a straight line with the center points of the chips, and the center points of some rows of chips do not form a straight line, such as a step arrangement (such as in accordance with the above-mentioned "the number of chips in each column gradually decreases, for example, 21, 20, 19, 18, 17, 16" and the row direction presents a step arrangement).
  • the number of chips in each row For example, in the second direction, the number of row chips near the two ends of the circuit board 110 is greater than the number of row chips near the center of the circuit board 110. In short, the total chip distribution and/or quantity is divided, and the total number of chips in each part of the division meets the preset distribution requirements.
  • the number of chips in the first heating column is used as the basis for division, and the circuit board 110 is divided from left to right into three parts, namely, the first part, the second part, and the third part.
  • the total number of chips in the first part or the third part close to both ends of the circuit board 110 is greater than the number of chips in the middle second part.
  • the number of chips in the first heating column is used as the basis for division in the second direction, and the circuit board 110 is divided from left to right into two parts, the number of chips in the first part is less than or equal to the number of chips in the second part.
  • the division method is average division.
  • the circuit board 110 is divided into three parts from left to right. There are 21 chips in the first heating column.
  • the circuit board 110 is divided into three parts from left to right. Each of the 7 chips in the first heating column is divided into a part.
  • the total number of chips in the first part is 42
  • the total number of chips in the second part is 36
  • the total number of chips in the third part is 42.
  • the total number of chips in the first part (42) or the third part (42) near the two ends of the circuit board 110 is greater than the number of chips in the middle second part (36); if the circuit board 110 is divided into two parts from left to right based on the number of chips in the first heating column in the second direction, the central axis of the 11th chip in the middle of the first heating column can be used as the division point to divide the circuit board 110 from left to right into two parts, then the number of chips in the first part (57) is equal to the number of chips in the second part (57).
  • the division method is not limited to the above description. When the total number of chips in the first heating column is an odd number or an even number, the division method can be flexibly selected. Of course, the overall area formed by the edges of the chips arranged on the circuit board can also be used as a reference for division. The division can be averaged or divided according to other proportions. Make the total number of chips in each part meet the preset distribution requirements.
  • the arrangement of the chips can be set in combination with the heat dissipation conditions of various positions in the air duct. For example, if the ambient temperature of the air inlet is low and the overall heat dissipation efficiency is high, more chips can be arranged; if the ambient temperature of the air outlet is high and the overall heat dissipation efficiency is low, fewer chips can be arranged, and the total number of chips near the air outlet is less than the total number of chips at the air inlet.
  • the temperatures at both ends are lower than the temperature at the center of the circuit board 110, then more chips can be arranged at both ends, and fewer chips can be arranged at the center, the total number of chips at both ends is greater than the total number of chips in the center, or after being divided into two parts, the total number of chips in the lower half is greater than the total number of chips in the upper half.
  • a first connection seat 140 and a second connection seat 150 are provided at one end of the circuit board 110 in the second direction, and the first connection seat 140 and the second connection seat 150 are spaced apart in the first direction, wherein the second direction is perpendicular to the first direction.
  • the first connection seat 140 and the second connection seat 150 may be an aluminum seat or a copper seat, and the thickness of the connection seat in the case of the aluminum seat may be greater than the thickness of the connection seat in the case of the copper seat.
  • the structure of the first connection seat 140 and the second connection seat 150 is simpler and convenient to process, which can effectively improve the assembly efficiency of the working component 100.
  • the first connection seat 140 and the second connection seat 150 each include a connection body 141 and an extension portion 142.
  • the connection body 141 is connected to the first surface of the circuit board 110
  • one end of the extension portion 142 is connected to the connection body 141
  • the other end of the extension portion 142 extends away from the circuit board 110 along a third direction, and the third direction is perpendicular to the first surface.
  • the extension portion 142 may include a first connection segment, a second connection segment, and a third connection segment.
  • One end of the first connection segment may be connected to the connection body 141, and the other end of the first connection segment may be tilted in a direction away from the circuit board 110.
  • One end of the second connection segment may be connected to the other end of the first connection segment, and the second connection segment may be arranged away from the first connection segment in a direction parallel to the first surface.
  • One end of the third connection segment may be connected to the other end of the second connection segment, and the other end of the third connection segment may be arranged away from the circuit board 110 in a direction perpendicular to the first surface.
  • the connecting body 141 can realize a secure connection between the entire connecting seat (that is, the above-mentioned first connecting seat 140 and the second connecting seat 150) and the circuit board 110, and the extension part 142 can extend outward to connect with the conductive connecting part, thereby realizing power supply for the circuit board 110.
  • an avoidance groove 143 may be defined between the extension portion 142 and the first surface.
  • the avoidance groove 143 is defined by the first connecting section, the second connecting section, and the first surface of the circuit board 110. In this way, the wiring harness can pass through the avoidance groove 143, thereby effectively avoiding the wiring.
  • the edge of the connecting body 141 has a direction away from the circuit board 110
  • the flange 1411 extends in the direction of. In this way, the flange 1411 can effectively resist bending, so that the connection between the connecting body 141 and the circuit board 110 is more secure, and the edge of the connecting body 141 is prevented from warping, and the reliability is higher.
  • a plurality of heat generating components 111 are provided on the first surface of the circuit board 110, and a seal 160 is provided between the first heat sink 123 and the circuit board 110, and the seal 160 is provided near the air inlet.
  • the seal 160 may be a rubber member.
  • the seal 160 in conjunction with FIG. 39A , FIG. 42 and FIG. 43 , includes a first seal portion 161 and a second seal portion 162.
  • the first seal portion 161 abuts against the edge of the circuit board 110 and the first heat sink 123 near the air inlet
  • the second seal portion 162 is disposed on a side surface of the first seal portion 161 away from the air inlet
  • the second seal portion 162 is located at the gap between the first heat sink 123 and the circuit board 110.
  • the second seal portion 162 divides the first seal portion 161 into two parts, one part of the first seal portion 161 at least contacts the edge of the heat dissipation body 121 of the first heat sink 123, and the other part of the first seal portion 161 at least contacts the edge of the circuit board 110.
  • An inlet is provided between the edge of the heat dissipation body 121 of the first heat sink 123 near the air inlet and the edge of the circuit board 110 near the air inlet, and the second seal portion 162 extends into the gap between the first heat sink 123 and the circuit board 110 through the inlet.
  • the first sealing portion 161 has a better shielding effect, preventing moisture at the air inlet from directly contacting the heat dissipation body 121 of the first radiator 123 or the circuit board 110, and the second sealing portion 162 has an effective sealing effect, further preventing moisture from entering the gap between the first radiator 123 and the circuit board 110, thereby further improving the sealing of the first radiator 123 and the circuit board 110 at the air inlet.
  • the working assembly 100 may not be provided with the seal 160 , thereby ensuring the heat dissipation performance of the entire working assembly 100 .
  • the circuit board 110 and the heat sink 120 may be connected via a connector, for example, the connector may be a screw, an elastic connector, or the like.
  • the circuit board 110 and the heat sink 120 are connected by a spring screw 170, and the spring screw 170 includes a screw 172 and a spring 171 sleeved on the screw 172, and the end of the spring 171 close to the circuit board 110 extends in a direction away from the circuit board 110.
  • the tail of the spring 171 is folded in a direction away from the circuit board 110.
  • the above arrangement can prevent the end of the spring 171 from scraping aluminum chips due to the contact between the end of the spring 171 and the surface of the circuit board 110, thereby avoiding damage to the circuit board 110 and improving the integrity and reliability of the circuit board 110.
  • An electronic device 200 such as a computing device according to an embodiment of the second aspect of the present application, as shown in FIGS. 1-9A , includes a working component 100 according to any implementation of the first aspect of the present application.
  • the electronic device 200 of the embodiment of the present application such as a computing device, by adopting the above-mentioned working component 100, the maximum temperature difference between the heat-generating component 111 near the air outlet and the heat-generating component 111 near the air inlet can be reduced, thereby improving the temperature uniformity of the heat-generating component 111.
  • an electronic device 200 includes a housing 210 and a fan assembly 220.
  • a heat dissipation duct having an air inlet and an air outlet is defined in the housing 210, and at least one working component 100 is disposed in the heat dissipation duct.
  • the working component 100 includes a circuit board 110 and a plurality of heat sinks 120, and the plurality of heat sinks 120 are disposed on at least one side of the circuit board 110.
  • heat sinks 120 may be disposed on both sides of the circuit board 110.
  • the surface of the circuit board 110 is parallel to the first direction from the air inlet to the air outlet.
  • the fan assembly 220 is disposed on one side of the housing 210 close to the air inlet.
  • Each heat sink 120 may include a heat dissipation body 121 and a plurality of heat dissipation fins 122, and the plurality of heat dissipation fins 122 are arranged at intervals on a side surface of the heat dissipation body 121 in a second direction (e.g., the up-down direction in FIG9A ), the second direction is perpendicular to the first direction, and the second direction is parallel to the surface of the circuit board 110.
  • a second direction e.g., the up-down direction in FIG9A
  • the heat dissipation body 121 of the first radiator 123 can be in contact with the heat-generating component 111 on the first surface, and the heat dissipation body 121 of the second radiator 124 can be in contact with the second surface of the circuit board 110.
  • the heat generated during the operation of the heat-generating component 111 can be conducted to the first radiator 123 and the second radiator 124.
  • a heat dissipation channel extending along the first direction can be defined between two adjacent heat dissipation fins 122 and the heat dissipation body 121.
  • the fan assembly 220 By arranging the fan assembly 220 on the side of the shell 210 close to the air inlet, and the fan assembly 220 and the air outlet are located on both sides of the shell 210, when part of the working assembly 100 is damaged, it is only necessary to remove the damaged working assembly 100 and take it out from the air outlet, and then put the working assembly 100 with intact function into the shell 210 through the air outlet and install it, without removing the fan assembly 220, thereby making the installation and disassembly of the working assembly 100 more convenient, and can effectively improve the inspection and replacement efficiency of the working assembly 100.
  • the fan assembly 220 includes a mounting member 221 and a plurality of fans. Module 222.
  • the mounting member 221 is connected to the housing 210, and a plurality of fan modules 222 are connected to the side of the mounting member 221 that is away from the housing 210.
  • the outer contour size of the mounting member 221 is larger than the outer contour size of the fan module 222.
  • a plurality of air inlet holes are formed on the portion of the mounting member 221 that is opposite to the fan module 222.
  • the external wind enters the heat dissipation air duct through the plurality of air inlet holes under the action of the fan module 222, and flows out from the air outlet after heat exchange with the first radiator 123 and the second radiator 124.
  • the mounting member 221 can firmly fix the fan module 222 on the housing 210, thereby improving the structural stability and reliability of the entire electronic device 200, and the multiple fan modules 222 can increase the ventilation volume of the heat dissipation duct, reduce wind resistance, and inhibit the deposition of dust on the radiator 120, thereby effectively improving the heat dissipation effect of the working component 100.
  • At least one first elastic component is provided on the mounting member 221, and the first elastic component is pressed between the mounting member 221 and the corresponding side wall of the shell 210 to achieve a secure installation between the mounting member 221 and the shell 210 and prevent the mounting member 221 from falling off the shell 210.
  • the mounting member 221 includes a mounting body, a mounting top plate and a mounting bottom plate that are arranged opposite to each other, two mounting side plates and a first bending portion.
  • the fan module 222 is connected to the mounting body, and a plurality of air inlet holes are formed on the mounting body.
  • the mounting top plate and the mounting bottom plate are arranged on the side of the mounting body that is away from the fan module, and the mounting top plate is connected to the upper part of the mounting body, and the mounting bottom plate is connected to the lower part of the mounting body.
  • the two mounting side plates are arranged on the side of the mounting body that is away from the fan module 222, and the two mounting side plates are respectively connected to the two sides of the mounting body, and the first elastic component is arranged on at least one of the two mounting side plates.
  • the first bending portion is connected to one end of the mounting top plate that is away from the mounting body.
  • the top plate, the bottom plate and the side plates can all be perpendicular to the main body.
  • the top plate is connected between the main body and the first bending portion, and the first bending portion is parallel to the main body.
  • the working component 100 can abut against the first bending portion, so that, on the one hand, the mounting member 221 and the working component 100 have a certain gap in the first direction.
  • the external wind enters the heat dissipation duct from the fan module 222, it can flow evenly in the gap between the mounting member 221 and the working component 100, and then flow through the first radiator 123 and the second radiator 124 to improve the heat dissipation effect.
  • the first bending portion can play an effective wind shielding role, so that the wind entering from the air inlet can flow into the working component 100 as much as possible, avoiding the waste of air volume.
  • a plurality of I-shaped reinforcing ribs can be provided on the mounting top plate and the mounting bottom plate to prevent the mounting top plate and the mounting bottom plate from bending and warping, thereby improving the structural strength of the entire mounting component 221 and ensuring the structural stability of the electronic device 200.
  • At least one first elastic component includes a plurality of first elastic clips spaced apart from each other. Buckle 230, the free end of each first elastic buckle is pressed between the mounting side plate and the corresponding side wall of the shell.
  • a plurality of through holes spaced apart from each other may be formed on the mounting side plate, and a plurality of first elastic buckles 230 are disposed in the plurality of through holes in a one-to-one correspondence.
  • One end of each first elastic buckle 230 is connected to the edge of the corresponding through hole, and the other end of each first elastic buckle 230 (i.e., the above-mentioned free end) extends in the opposite direction of the first direction.
  • each first elastic buckle 230 may include a connecting portion 231 and a stop portion 232.
  • One end of the connecting portion 231 is connected to the first edge of the corresponding via hole.
  • One end of the stop portion 232 is connected to the other end of the connecting portion 231, and the other end of the stop portion 232 is spaced from the opposite side edge of the first edge, and the stop portion 232 stops at the corresponding side wall of the housing 210.
  • the mounting member 221 and the housing 210 can be electrically connected through a plurality of first elastic buckles 230, thereby playing an effective role in shielding and grounding, and improving the safety of the electronic device 200.
  • the at least one first elastic component includes a first conductive foam 240 extending in the up-down direction, and the mounting member 221 and the corresponding side wall of the housing 210 are elastically contacted through the first conductive foam 240.
  • the first conductive foam 240 can be adhered to the two mounting side panels by an adhesive.
  • the first conductive foam 240 can be a conductive foam, but is not limited thereto. In this way, the mounting member 221 and the housing 210 can be electrically connected through the first conductive foam 240, thereby also playing an effective role in shielding and grounding, and improving the safety of the electronic device 200.
  • the fan module 222 and the working assembly 100 are spaced apart in the first direction.
  • the mounting member 221 and the working assembly 100 have a certain gap in the first direction.
  • the gap between the fan module 222 and the working assembly 100 can allow the wind to flow into the radiator 120 more evenly, thereby improving the heat dissipation effect.
  • a flexible protective cover 250 is provided on one side of the fan module 222 away from the mounting plate, and the flexible protective cover 250 is sleeved on the outer periphery of the fan module 222.
  • the flexible protective cover 250 provided in this way can effectively protect the edges and corners of the fan module 222, prevent the fan module 222 from being worn, and prevent the edges and corners of the fan module 222 from scratching the staff, thereby improving safety.
  • the material of the flexible protective cover 250 can be a soft rubber material, but is not limited thereto.
  • a control panel 260 is disposed on the top of the housing 210, and a plurality of fan interfaces 262 are disposed on the control panel 260.
  • the plurality of fan interfaces 262 are connected to the plurality of fan modules 222 in a one-to-one correspondence, wherein the plurality of fan interfaces 262 are disposed close to the air inlet, so that the plurality of fan interfaces 262 are close to the plurality of fan modules 222.
  • the fan module 222 is provided to facilitate wiring between the plurality of fan interfaces 262 and the plurality of fan modules 222 .
  • the circuit board 110 is provided with a first signal socket 112, and the control board 260 is provided with a second signal socket 261, and the second signal socket 261 is connected to the first signal socket 112.
  • the control board 260 can control the operation of the circuit board 110.
  • the second signal socket 261 is close to the first signal socket 112.
  • the number of the second signal sockets 261 is three
  • the number of the first signal sockets 112 is three
  • the three second signal sockets 261 are arranged on the side of the control board 260 close to the first signal socket 112. Such an arrangement can facilitate the connection between the second signal socket 261 and the first signal socket 112 with the shortest connection line.
  • the four fan interfaces 262 can be connected to the four fan modules 222 in a one-to-one correspondence through four second cables, so that the control board 260 can control the operation of the working modules.
  • the four fan modules 222 are divided into two groups, and the two fan modules 222 in each group are connected together by screws, and fixed to the mounting member 221 by screws.
  • through holes are set on the four corners of each fan module 222 for screws to pass through
  • threaded holes 2211 are correspondingly set on the mounting member 221 for screws to pass through to achieve assembly between the fan module 222 and the mounting member.
  • the mounting member 221 is also provided with a plurality of fixing holes 2212 for fixing the mounting member 221 to the housing 210, for example, four fixing holes 2212 are set on the four corners of the mounting member 221, and corresponding fixing holes are set on the housing 210.
  • the signal connection between the control board 260 and the fan module 222 and the control board 260 and the circuit board 110 can be realized; on the other hand, by arranging multiple fan interfaces 262 close to the air inlet, multiple fan interfaces 262 can be centrally arranged on the control board 260, and the structure is more compact, occupying less space, and facilitating the spatial layout of other modules on the control board 260.
  • a top shell 212 is provided on the top of the housing 210, a control board 260 is provided in the top shell 212, and a temperature sensor 263 is provided on the control board 260, and the temperature sensor 263 is used to sense the temperature at the air inlet.
  • the user can know the temperature at the air inlet in real time, avoid the temperature of the wind entering from the air inlet being too high, and make the working component 100 have a better heat dissipation effect, thereby ensuring the normal operation of the working component 100 and effectively extending the service life of the entire electronic device 200.
  • the temperature sensor 263 is disposed at the bottom of the control board 260, and the temperature sensor 263 is located in the top shell 212.
  • the top surface of the shell 210 is formed with a vent 211 connected to the heat dissipation duct, and the vent 211 corresponds to the position of the temperature sensor 263.
  • the mounting member 221 A first ventilation hole is formed on the top of the housing 211 and penetrates in the thickness direction. The first ventilation hole, the ventilation hole 211 and the temperature sensor 263 correspond to each other in the up and down directions.
  • the temperature sensor 263 in the above embodiment can sense the temperature at the air inlet through the vent 211, thereby ensuring that the air input from the air inlet is cold air. Moreover, the temperature sensor 263 can be hidden in the top case 212 to prevent the temperature sensor 263 from directly contacting the external environment, so that the top case 212 can effectively protect the temperature sensor 263 and prevent the temperature sensor 263 from being damaged, and can make the appearance of the electronic device 200 more neat and beautiful.
  • the temperature sensor 263 is disposed on the top of the control board 260, and the temperature sensor 263 extends from the side of the top shell 212 close to the fan assembly 220.
  • a through hole may be formed on the side of the top shell 212 close to the air inlet, and the temperature sensor 263 may be disposed on the side of the control board 260 close to the air inlet, and the temperature sensor 263 extends out of the top shell 212 from the through hole.
  • the temperature sensor 263 can directly extend out of the top shell 212 to sense the temperature at the air inlet, and there is no need to open holes on the shell 210 and the mounting member 221, thereby making the structure of the shell 210 simpler and convenient for processing.
  • the present application is not limited thereto, and in another embodiment, as shown in FIG. 26A and FIG. 26B , the free end of the temperature sensor 263 can pass through the top of the housing 210 and extend into the housing 210 and face the fan assembly 220. In this way, the free end of the temperature sensor 263 can extend into the air inlet cavity of the housing 210 to detect the temperature of the wind input by the fan assembly 220, and can more accurately sense the temperature of the air inlet.
  • the indicator light of the electronic device 200 is usually set in the middle of the control board of the electronic device 200.
  • multiple fans are connected in series (for example, 4 fans) and installed on the front face of the electronic device 200, due to the viewing angle, the fan will block the indicator light and affect the observation of the operation and maintenance personnel.
  • the electronic device 200 needs to be placed on a rack, and sometimes the placement position is higher. At this time, the fan will more easily block the indicator light.
  • the electronic device 200 may further include an indicator light 264 to indicate the working state of the electronic device 200.
  • the indicator light 264 is disposed on a side of the control panel close to the air inlet, and the indicator light 264 is located at the end of the control panel close to the side of the air inlet.
  • the indicator light 264 is disposed at the end of the side of the control panel, the indicator light can be observed from one side of the electronic device 200, thus avoiding the situation where the fan blocks the indicator light.
  • the electronic device 200 also includes: a power module 270, which is arranged on one side of the housing 210 in a third direction, and the power module 270 is used to supply power to the circuit board 110 and the fan assembly 220, wherein the third direction is perpendicular to the surface of the circuit board 110.
  • a power module 270 which is arranged on one side of the housing 210 in a third direction, and the power module 270 is used to supply power to the circuit board 110 and the fan assembly 220, wherein the third direction is perpendicular to the surface of the circuit board 110.
  • the housing 210 is generally a rectangular parallelepiped structure, and the housing 210 may include a top surface, a bottom surface, and four side surfaces, and the four side surfaces are respectively connected between the top surface and the bottom surface.
  • the top surface and the bottom surface are opposite to each other in the second direction.
  • the top of the power module 270 is connected to the top shell 212, and the side of the power module 270 is connected to the side of the housing 210.
  • the top shell 212 includes two first side surfaces that are opposite to each other and two second side surfaces that are opposite to each other, wherein one of the two first side surfaces is flush with the corresponding fourth side surface of the shell 210, the other of the two first side surfaces is flush with the corresponding side surface of the power module 270, each second side surface is flush with the corresponding side surfaces of the shell 210 and the power module 270 at the same time, and the bottom surface of the power module 270 is flush with the bottom surface of the shell 210.
  • the two first side surfaces of the top shell 212 may be the front side surface and the rear side surface, respectively, and the two second side surfaces of the top shell 212 may be the left side surface and the right side surface, respectively.
  • the front side surface of the top shell 212 may be flush with the front side surface of the housing 210 and the front side surface of the power module 270
  • the rear side surface of the top shell 212 may be flush with the rear side surface of the housing 210 and the rear side surface of the power module 270
  • the left side surface of the top shell 212 may be flush with the left side surface of the housing 210
  • the right side surface of the top shell 212 may be flush with the right side surface of the power module 270
  • the bottom surface of the power module 270 may be flush with the bottom surface of the housing 210.
  • front refers to the direction close to the air inlet of the heat dissipation duct
  • opposite direction is defined as “rear”, that is, the direction close to the air outlet of the heat dissipation duct.
  • Left refers to the direction along the power module 270 toward the shell 210;
  • right refers to the direction along the shell 210 toward the power module 270.
  • front side refers to the side close to the air inlet of the heat dissipation duct, and the “rear side” refers to the side close to the air outlet of the heat dissipation duct.
  • left side refers to the side in the direction from the power module 270 to the shell 210
  • the “right side” refers to the side in the direction from the shell 210 to the power module 270.
  • the power module 270 can effectively utilize the space between the top shell 212 and the shell 210, thereby making the structure of the entire electronic device 200 more compact and the appearance more neat and beautiful.
  • At least one positioning hole 271 is formed on one of the power module 270 and the top shell 212, and at least one positioning protrusion is provided on the other of the power module 270 and the top shell 212, and the positioning protrusion is matched in the corresponding positioning hole 271.
  • At least one through hole 272 is formed on one of the power module 270 and the housing 210, and at least one threaded hole corresponding to the through hole 272 is formed on the other of the power module 270 and the housing 210, and the threaded fastener 273 is suitable for passing through the through hole 272 and being threadedly connected with the threaded hole.
  • two positioning holes 271 are formed on the top of the power module 270, and the two positioning holes 271 are spaced apart along the first direction.
  • two positioning protrusions spaced apart in the first direction may be provided on the bottom surface of the top shell 212, and the two positioning protrusions correspond one-to-one to the two positioning holes 271.
  • Four through holes 272 are formed on the side of the power module 270, and the four through holes 272 are respectively located at the four corners of the power module 270.
  • Four threaded holes corresponding one-to-one to the four through holes 272 are formed on the second side of the shell 210.
  • the two positioning protrusions can be respectively fitted into the corresponding positioning holes 271 to achieve the positioning of the power module 270.
  • the four threaded fasteners 273 are respectively passed through the corresponding through holes 272 and threadedly connected to the corresponding threaded holes to achieve The power module 270 is fixed.
  • each threaded fastener 273 can be a short screw. At this time, each threaded fastener 273 can pass through one of the side walls of the power module 270 and be threadedly connected to the threaded hole on the housing 210, and at this time, one of the side walls of the power module 270 is pressed between the head of the threaded fastener 273 and the housing 210.
  • each threaded fastener 273 may be a long screw.
  • each threaded fastener 273 may pass through two side walls of the power module 270 and be threadedly connected to a threaded hole on the housing 210, and the entire power module 270 is pressed between the head of the threaded fastener 273 and the housing 210.
  • This fixing method has better visibility and facilitates the installation and removal of the threaded fastener 273, such as a screw.
  • threaded fasteners 273 may be short screws, and other threaded fasteners 273 may be long screws, and this application does not limit this.
  • the power module 270 can be positioned relative to the housing 210 in advance by cooperating with the positioning protrusion and the positioning hole 271, so as to avoid displacement of the power module 270 during the process of being connected with the housing 210, thereby improving the installation efficiency.
  • the power module 270 and the housing 210 can be directly threadedly connected by the threaded fastener 273, and there is no need to set a bracket between the power module 270 and the housing 210, so the structure is simpler.
  • the electronic device 200 further includes a first conductive connector 280 and a second conductive connector 290.
  • a portion of the first conductive connector 280 is electrically connected to the power module 270, and another portion of the first conductive connector 280 is electrically connected to the first connection socket 140 of the working component 100.
  • a portion of the second conductive connector 290 is electrically connected to the power module 270, and another portion of the second conductive connector 290 is electrically connected to the second connection socket 150 of the working component 100.
  • the bottom surface of the above-mentioned other part of the first conductive connector 280 can contact the top surface of the third connection segment of the three first connection seats 140, and the first fastener is suitable for passing through the first conductive connector 280 to connect with the corresponding third connection segment of the first connection seat 140.
  • the bottom surface of the above-mentioned other part of the second conductive connector 290 can contact the top surface of the second connection segment of the three second connection seats 150, and the second fastener is suitable for passing through the second conductive connector 290 to connect with the corresponding third connection segment of the second connection seat 150.
  • the above-mentioned other part of the first conductive connector 280 can be parallel to the above-mentioned other part of the second conductive connector 290, and both extend along the third direction.
  • the first conductive connector 280 can be a positive conductive bar
  • the second conductive connector 290 can be a negative conductive bar.
  • the electrical connection between the power module 270 and the circuit board 110 can be achieved, so that the current can be input from the power module 270 into the circuit board 110 to power the circuit board 110.
  • the structure of the first conductive connector 280 and the second conductive connector 290 is simple. Single, convenient layout.
  • an air outlet panel 213 is provided at the air outlet of the housing 210, and at least one second elastic component is provided at the edge of the air outlet panel 213, and the second elastic component is pressed between the air outlet panel 213 and the corresponding side wall of the housing 210.
  • the second elastic component can be squeezed into the housing 210, so that the connection between the air outlet panel 213 and the housing 210 is more stable, and the air outlet panel 213 is prevented from falling off from the housing 210.
  • the air outlet panel 213 includes an air outlet body, an air outlet top plate and an air outlet bottom plate that are arranged opposite to each other, two air outlet side plates, and a second bending portion.
  • the air outlet body is formed with a plurality of air outlet holes, the air outlet top plate and the air outlet bottom plate are arranged on one side surface of the air outlet body, and the air outlet top plate is connected to the upper part of the air outlet body, the air outlet bottom plate is connected to the lower part of the air outlet body, the two air outlet side plates are arranged on one side surface of the air outlet body, and the two air outlet side plates are respectively connected to the two sides of the air outlet body, the second elastic component is arranged on at least one of the two air outlet side plates, the second bending portion is connected to the end of the air outlet top plate that is away from the air outlet body, and the second bending portion is located between the air outlet top plate and the air outlet bottom plate.
  • the air outlet bottom plate and each air outlet side plate may be perpendicular to the air outlet body.
  • the air outlet top plate is connected between the air outlet body and the second bending portion. After installation, the working component 100 may abut against the second bending portion, so that the wind flowing through the first radiator 123 and the second radiator 124 can flow out through the air outlet better, further improving the heat dissipation effect.
  • the at least one second elastic component includes a plurality of second elastic clips 214 spaced apart along the second direction, and each second elastic clip 214 is pressed between the air outlet panel 213 and the corresponding side wall of the shell 210 .
  • the air outlet side plate may be formed with a plurality of spacing grooves arranged in an upper and lower interval, and the portion of the air outlet side plate between two adjacent spacing grooves is the second elastic buckle 214.
  • the two air outlet side plates are squeezed into the corresponding side walls of the housing 210, and the plurality of second elastic buckles 214 are elastically deformed, and then the air outlet panel 213 is threadedly connected to the housing 210 through a threaded fastener.
  • the at least one second elastic component includes a second conductive foam 215 extending along the second direction.
  • the air outlet panel 213 and the housing 210 can be firmly connected, and the air outlet panel 213 and the housing 210 can be electrically connected through the second conductive foam 215, thereby achieving effective shielding and grounding, further improving the safety of the electronic device 200.
  • At least one baffle is disposed on the top of the housing 210, and the baffle corresponds to the position of the radiator 120. In this way, the wind blown out by the fan module 222 can be blown to multiple radiators 120, avoiding some wind from blowing into
  • the top shell 212 at the top of the shell 210 can increase the ventilation volume in the heat dissipation duct, avoid dust accumulation on the radiator 120, and further improve the heat dissipation effect.
  • first and second are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
  • installed can be a fixed connection, a detachable connection, or an integral connection
  • it can be a mechanical connection, an electrical connection, or a communication
  • it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
  • a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them.
  • a first feature being “above”, “above” and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.
  • a first feature being “below”, “below” and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

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Abstract

一种工作组件（100）和电子设备（200），其中，工作组件（100）包括：电路板（110）；散热器（120），散热器（120）包括散热主体（121）和多个散热翅片（122），散热主体（121）包括相对设置的第一侧面和第二侧面，电路板（110）设置于第一侧面，多个散热翅片（122）设置于第二侧面，多个散热翅片（122）沿垂直于第一方向的第二方向间隔排布；其中，沿第一方向，散热主体（121）靠近出风口的边缘超过电路板（110）靠近出风口的边缘，和/或沿第一方向，散热翅片（122）靠近出风口的边缘超过电路板（110）靠近出风口的边缘。工作组件（100）和电子设备（200）可以降低靠近出风口的发热元器件（111）与靠近入风口的发热元器件（111）的最大温差，从而提升发热元器件的均温性。

Description

工作组件和电子设备
本申请要求于2022年10月20日提交中国专利局、申请号为202211291965.1、名称为“工作组件和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请要求于2022年11月11日提交中国专利局、申请号为202211414794.7、名称为“工作组件和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及散热技术领域，尤其涉及一种工作组件和电子设备。
背景技术
相关技术中，电路板上通常设置有包括芯片的发热元器件。发热元器件在工作过程中会产生大量热量，因而需要将电路板放置于散热风道中进行散热。然而，靠近出风口的发热元器件的温度与靠近入风口的发热元器件的温度差值通常较大，使发热元器件的均温性较差。
发明内容
本申请实施例提供一种工作组件和电子设备，以解决或缓解现有技术中的一项或更多项技术问题。
作为本申请实施例的一个方面，本申请实施例提供一种工作组件，适于工作在散热风道中，散热风道的入风口到出风口的方向为第一方向，其特征在于，包括：电路板；散热器，包括散热主体和多个散热翅片，散热主体包括相对设置的第一侧面和第二侧面，电路板设置于散热主体的第一侧面，多个散热翅片设置于散热主体的第二侧面，多个散热翅片沿垂直于第一方向的第二方向间隔排布；其中，沿第一方向，散热主体靠近出风口的边缘超过电路板靠近出风口的边缘，和/或沿第一方向，散热翅片靠近出风口的边缘超过电路板靠近出风口的边缘。
在一种实施方式中，在散热主体靠近出风口的边缘超过电路板靠近出风口的边缘的情况下，沿第一方向，散热主体的尺寸超过电路板的尺寸为10mm～20mm。
在一种实施方式中，在散热翅片靠近出风口的边缘超过电路板靠近出风口的边缘的情况下，沿第一方向，散热翅片的尺寸超过电路板的尺寸为10mm～20mm。
在一种实施方式中，电路板包括相对设置的第一侧面和第二侧面，电路板的第一侧面上设置有多个发热元器件；散热器包括设置于电路板的第一侧面的第一散热器，和/或设置于电路板的第二侧面的第二散热器。
在一种实施方式中，沿第一方向，第一散热器的散热主体和/或散热翅片的靠近出风口的边缘超过电路板靠近出风口的边缘；第二散热器的散热主体和散热翅片靠近出风口的边缘均未超过电路板靠近出风口的边缘。
在一种实施方式中，沿第一方向，第二散热器的散热主体和/或散热翅片的靠近出风口的边缘超过电路板靠近出风口的边缘；第一散热器的散热主体和散热翅片靠近出风口的边缘均未超过电路板靠近出风口的边缘。
在一种实施方式中，沿第一方向，第一散热器的散热主体和/或散热翅片的靠近出风口的边缘超过电路板靠近出风口的边缘，第二散热器的散热主体和/或散热翅片的靠近出风口的边缘超过电路板靠近出风口的边缘。
在一种实施方式中，散热翅片上形成有至少一个凹槽。
在一种实施方式中，至少一个凹槽在第二方向和第三方向上贯穿对应的散热翅片，以将对应的散热翅片划分为多个子散热翅片，其中，第三方向垂直于第一方向和第二方向。
在一种实施方式中，至少一个凹槽在第二方向和/或第三方向上未穿透对应的散热翅片，其中，第三方向垂直于第一方向和第二方向。
在一种实施方式中，凹槽设置于散热翅片的相对于散热器长度方向的中心靠近出风口的一端。
在一种实施方式中，多个散热翅片均设置有凹槽，多个凹槽在第二方向上形成至少一列凹槽列。
在一种实施方式中，电路板上设置有多个发热元器件，多个发热元器件构成沿第一方向间隔排布的多个发热列，各发热列包括沿第二方向间隔设置的多个发热元器件，至少一列凹槽列与至少一列发热列相对设置。
在一种实施方式中，各凹槽在第一方向上的尺寸为2.5mm～3.5mm。
在一种实施方式中，至少一个散热翅片包括斜切部，沿第一方向，斜切部的高度逐渐增加。
在一种实施方式中，斜切部相对于散热器的中心靠近入风口设置。
在一种实施方式中，沿第一方向，电路板在斜切部远离入风口的端部对应的位置设置有发热元器件。
在一种实施方式中，沿第一方向，斜切部远离入风口的端部与第三列发热元器件的位置相对应。
作为本申请实施例的另一个方面，本申请实施例提供一种电子设备，包括根据本申请上述各方面任一实施方式的工作组件。
本申请实施例采用上述技术方案可以降低靠近出风口的发热元器件与靠近入风口的发热元器件的最大温差，从而提升发热元器件的均温性。
上述概述仅仅是为了说明书的目的，并不意图以任何方式进行限制。除上述描述的示意性的方面、实施方式和特征之外，通过参考附图和以下的详细描述，本申请进一步的方面、实施方式和特征将会是容易明白的。
附图说明
在附图中，除非另外规定，否则贯穿多个附图相同的附图标记表示相同或相似的部件或元素。这些附图不一定是按照比例绘制的。应该理解，这些附图仅描绘了根据本申请公开的一些实施方式，而不应将其视为是对本申请范围的限制。
图1为根据本申请一实施例的电子设备的立体结构示意图；
图2为图1中所示的电子设备的另一个角度的立体图；
图3为图1中所示的电子设备的主视图；
图4为图1中所示的电子设备的后视图；
图5为图1中所示的电子设备的左视图；
图6为图1中所示的电子设备的右视图；
图7为图1中所示的电子设备的俯视图；
图8为图1中所示的电子设备的仰视图；
图9A为图1中所示的电子设备的爆炸图；
图9B为图9A中圈示的A部的放大图；
图10A为根据本申请另一实施例的出风面板的结构示意图；
图10B为图10A中所示的出风面板的局部放大图；
图11为图1中所示的电子设备的另一个爆炸图；
图12为图1中所示的电子设备的风扇组件的安装示意图；
图13为图1中所示的电子设备的剖视图；
图14为图1中所示的电子设备的风扇模块的线缆连接示意图；
图15为图1中所示的电子设备的风扇组件的立体图；
图16为图15中圈示的B部的放大图；
图17为图1中所示的电子设备的风扇组件的另一个角度的立体图；
图18为图17中所示的风扇组件的安装件的立体图；
图19为图17中所示的风扇组件的柔性保护罩的立体图；
图20为图1中所示的电子设备的内部结构示意图；
图21为图1中所示的电子设备的线缆连接示意图；
图22为根据本申请一实施例的第一导电连接件和第二导电连接件的结构示意图；
图23为根据本申请一实施例的电子设备的剖视图；
图24为图23中圈示的C部的放大图；
图25A为根据本申请一实施例的电子设备的剖视图；
图25B为图25A中圈示的D部的放大图；
图26A为根据本申请一实施例的电子设备的剖视图；
图26B为图26A中所示的电子设备的局部放大图；
图27为根据本申请一实施例的电源模块的安装示意图；
图28为根据本申请一实施例的电源模块的另一个角度的安装示意图；
图29A为根据本申请一实施例的电源模块与壳体的连接示意图；
图29B为图29A中圈示的E部的放大图；
图30A为根据本申请另一实施例的电子设备的电源模块的安装示意图；
图30B为图30A中所示的电子设备的局部放大图；
图30C为图30A中所示的电子设备的螺纹紧固件的结构示意图；
图31为根据本申请一实施例的工作组件的立体结构示意图；
图32为图31中所示的工作组件的另一个角度的立体图；
图33为图31中所示的工作组件的主视图；
图34为图31中所示的工作组件的后视图；
图35为图31中所示的工作组件的左视图；
图36为图31中所示的工作组件的右视图；
图37为图31中所示的工作组件的俯视图；
图38为图31中所示的工作组件的仰视图；
图39A为图31中所示的工作组件的爆炸图；
图39B为根据本申请另一实施例的工作组件的示意图；
图40为根据本申请一实施例的工作组件的第一连接座的结构示意图；
图41为根据本申请一实施例的工作组件的第一连接座的结构示意图；
图42为根据本申请一实施例的工作组件的密封件的局部结构示意图；
图43为根据本申请一实施例的工作组件的密封件的安装示意图；
图44为根据本申请一实施例的工作组件的弹簧螺钉的结构示意图；
图45为根据本申请另一实施例的工作组件的立体结构示意图；
图46为图45中所示的工作组件的主视图；
图47为图45中所示的工作组件的后视图；
图48为图45中所示的工作组件的左视图；
图49为图45中所示的工作组件的右视图；
图50为图45中所示的工作组件的俯视图；
图51为图45中所示的工作组件的仰视图；
图52为根据本申请一实施例的电路板的结构示意图。
附图标记说明：
100：工作组件；
110：电路板；111：发热元器件；112：第一信号插座；120：散热器；121：散热
主体；122：散热翅片；1221：斜切部；1222：凹槽；123：第一散热器；124：第二散热器；140：第一连接座；141：连接本体；1411：翻边；142：延伸部；143：避让槽；150：第二连接座；160：密封件；161：第一密封部；162：第二密封部；170：弹簧螺钉；171：弹簧；172：螺钉；
200：电子设备；
210：壳体；211：通风孔；212：顶壳；213：出风面板；214：第二弹性卡扣；215：
第二导电泡棉；220：风扇组件；221：安装件；2211：螺纹孔；2212：固定孔；222：风扇模块；230：第一弹性卡扣；231：连接部；232：止抵部；240：第一导电泡棉；250：柔性保护罩；260：控制板；261：第二信号插座；262：风扇接口；263：温感器；264：指示灯；270：电源模块；271：定位孔；272：通孔；273：螺纹紧固件；280：第一导电连接件；290：第二导电连接件。
具体实施方式
在下文中，仅简单地描述了某些示例性实施例。正如本领域技术人员可认识到的那样，在不脱离本申请的精神或范围的情况下，可通过各种不同方式修改所描述的实 施例。因此，附图和描述被认为本质上是示例性的而非限制性的。
下面结合图1-图52描述根据本申请第一方面实施例的工作组件100。工作组件100适于工作在散热风道中，以实现工作组件100的散热。其中，散热风道的入风口到出风口的方向为第一方向。
如图31、图37和图38所示，工作组件100包括电路板110和散热器120。其中，散热器120包括散热主体121和多个散热翅片122，散热主体121设置于电路板110，多个散热翅片122设置于散热主体121的背离电路板110的一侧(例如，散热主体121包括相对设置的第一侧面和第二侧面，所述电路板设置于散热主体121的第一侧面，多个散热翅片122设置于散热主体121的第二侧面)，多个散热翅片122沿垂直于第一方向的第二方向间隔排布。在本申请的描述中，“多个”的含义是两个或两个以上。
示例性地，电路板110包括相对设置的第一侧面和第二侧面，电路板的第一侧面上设置有多个发热元器件；散热器包括设置于电路板的第一侧面的第一散热器，和/或设置于电路板的第二侧面的第二散热器。
如图9、图31-图39A所示，工作组件100包括电路板110和至少一个散热器120。具体而言，电路板110的至少一侧表面上设有多个发热元器件111，散热器120设置于电路板110上。在本申请的描述中，“多个”的含义是两个或两个以上。
示例性地，散热器120可以为多个。多个散热器120可以包括第一散热器123和第二散热器124。例如，图31-图39A的示例中示出了两个散热器120，两个散热器120分别为第一散热器123和第二散热器124。第一散热器123设置于电路板110的第一表面，第二散热器124设置于电路板110的第二表面。第一表面平行于第一方向和第二方向。电路板110上可以设置有多个发热元器件111，多个发热元器件111可以包括设置于电路板110的第一表面的多个芯片，第一散热器123可以与芯片对应设置，第一散热器123可以与芯片直接或间接通过导热材料(如硅脂)接触。第一散热器123上设置有多个凸台，凸台与芯片对应设置。凸台的设置可以为多行或者多列，多行凸台的每一行与每一行芯片对应设置；多列凸台的每一列与每一列芯片对应设置；凸台也可以为阵列的独立结构，每个独立的凸台与单个芯片对应设置，每个独立的凸台截面积可以覆盖单个芯片，也可以小于单个芯片。第一散热器123可以包括独立设置的多个子散热器。
电路板110的第一表面的热量可以有效传导至第一散热器123，电路板110的第二表面的热量可以有效传导至第二散热器124，在风从散热风道的入风口吹向出风口的过程中，可以有效带走第一散热器123和第二散热器124的热量，从而实现电路板110 的有效散热。
其中，沿第一方向，散热主体121靠近出风口的边缘超过电路板110靠近出风口的边缘，和/或沿第一方向，散热翅片122靠近出风口的边缘超过电路板110靠近出风口的边缘。
也就是说，可以是沿第一方向，散热主体121靠近出风口的边缘超过电路板110靠近出风口的边缘，散热翅片122靠近出风口的边缘未超过电路板110靠近出风口的边缘；或者，沿第一方向，散热翅片122靠近出风口的边缘超过电路板110靠近出风口的边缘，散热主体121靠近出风口的边缘未超过电路板110靠近出风口的边缘；当然，还可以是沿第一方向，散热主体121靠近出风口的边缘超过电路板110靠近出风口的边缘，且散热翅片122靠近出风口的边缘超过电路板110靠近出风口的边缘。
例如，以第一表面上的多个发热元器件构成沿第一方向间隔排布的六列发热列为例进行说明。六列发热列可以分为两部分，每部分包括三列发热列，两部分中的其中一部分靠近入风口设置，两部分中的另一部分靠近出风口设置。或者，沿第一方向，第一散热器123的散热主体121和/或散热翅片122的靠近出风口的边缘超过电路板110靠近出风口的边缘；第二散热器124的散热主体121和散热翅片122靠近出风口的边缘均未超过电路板110靠近出风口的边缘；又或者；沿第一方向，第二散热器124的散热主体121和/或散热翅片122的靠近出风口的边缘超过电路板110靠近出风口的边缘；第一散热器123的散热主体121和散热翅片122靠近出风口的边缘均未超过电路板110靠近出风口的边缘；当然，还可以是沿第一方向，第一散热器123的散热主体121和/或散热翅片122的靠近出风口的边缘超过电路板110靠近出风口的边缘，第二散热器124的散热主体121和/或散热翅片122的靠近出风口的边缘超过电路板110靠近出风口的边缘。
如此设置，可以增大散热器120在出风口处的面积，使靠近出风口的发热元器件的热量能够更好地传导至对应的散热器120，降低靠近出风口的三列发热列中发热元器件之间的最大温差，同时可以提升靠近出风口的三列发热列的散热效果，有利于降低两部分发热元器件之间的最大温差，从而提升多个发热元器件的整体均温性。
根据本申请实施例的工作组件100，可以拉长散热主体121和/或散热翅片122在第一方向上靠近出风口的尺寸，从而降低靠近出风口的发热元器件与靠近入风口的发热元器件的最大温差，从而提升电路板110上发热元器件的均温性。
图31-图39A中显示了两个散热器120用于示例说明的目的，但是普通技术人员在阅读了本申请的技术方案之后，显然可以理解将该方案应用到散热或者更多个散热器 120的技术方案中，这也落入本申请的保护范围之内。
其中，在散热风道的出风口处，至少一个散热器120在第一方向上的尺寸大于电路板110在第一方向上的尺寸，第一方向为散热风道的入风口到出风口的方向。至少一个散热器120靠近出风口的边缘超过电路板110靠近出风口的边缘。
示例性地，电路板110的第一表面和第二表面可以均平行于第一方向。第一表面上的多个发热元器件111可以呈列排布，且在第二方向上，至少三个或全部发热元器件111的中心在一条直线上，第二方向与第一方向垂直。图39A中示出了六列发热元器件111，六列发热元器件111可以分为两部分，每部分包括三列发热元器件111，两部分中的其中一部分靠近入风口设置，两部分中的另一部分靠近出风口设置。第一散热器123和第二散热器124的靠近出风口的边缘可以均延伸至超过电路板110的靠近出风口的边缘。如此设置，可以增大散热器120在出风口处的面积，使靠近出风口的一组发热元器件111的热量能够更好地传导至对应的散热器120，降低靠近出风口的三列发热元器件111之间的最大温差，同时可以提升靠近出风口的三列发热元器件111的散热效果，有利于降低两组发热元器件111之间的最大温差，从而提升多个发热元器件111的整体均温性。
根据本申请实施例的工作组件100，可以拉长至少一个散热器120的散热主体121和/或散热翅片122在第一方向上靠近出风口的尺寸，从而降低靠近出风口的发热元器件111与靠近入风口的发热元器件111的最大温差，从而提升发热元器件111的均温性。
在一种实施方式中，在散热主体121靠近出风口的边缘超过电路板110靠近出风口的边缘的情况下，沿第一方向，散热器主体121的尺寸超过电路板110的尺寸为10mm～20mm(包括端点值)。具体地，例如，散热器主体121的尺寸超过电路板110的尺寸为L1，当L1＜10mm时，在散热风道的出风口处，散热器主体121在第一方向上超出电路板110的尺寸过小，导致靠近出风口的发热元器件111的散热效果较差，无法有效提升发热元器件111的均温性；当L1＞20mm时，散热器主体121在第一方向上超出电路板110的尺寸过大，散热器主体121在出风口处的占用空间过大，会增大壳体210的体积，并且导致散热器120的重量过大。
由此，通过使10mm≤L1≤20mm，散热器主体121超出电路板110的靠近出风口的一端的部分的尺寸合理，在有效提升发热元器件111的均温性的同时，可以减小工作组件100的整体占用空间，且避免工作组件100的重量过大。可选地，L1可以为15mm，但不限于此。
在一种实施方式中，在散热翅片122靠近出风口的边缘超过电路板110靠近出风 口的边缘的情况下，沿第一方向，散热翅片122的尺寸超过电路板110的尺寸L2为10mm～20mm(包括端点值)。
类似地，例如，当L2＜10mm时，在散热风道的出风口处，散热翅片122在第一方向上超出电路板110的尺寸过小，导致靠近出风口的发热元器件的散热效果较差，无法有效提升发热元器件的均温性；当L2＞20mm时，散热翅片122在第一方向上超出电路板110的尺寸过大，散热器120在出风口处的占用空间过大，同样可能会增大壳体的体积，并且导致散热器120的重量过大。
由此，通过使10mm≤L2≤20mm，散热翅片122超出电路板110的靠近出风口的一端的部分的尺寸合理，同样可以有效提升发热元器件的均温性，同时减小工作组件100的整体占用空间，避免工作组件100的重量过大。可选地，L2可以为15mm，但不限于此。
本领域技术人员可以理解的是，上述L1、L2的尺寸范围并不仅限于为10mm～20mm，当存在需要增加电路板110或发热源后半部分的散热时，都可以适用本发明中的延长散热主体121和/或散热翅片122长度的方法，根据不同使用场景适应性调整长度L1和L2。
在一种实施方式中，结合图39A和图39B，各散热器120包括一个散热主体121和设置在散热主体121的多个散热翅片122，散热主体121与电路板110平行，散热翅片122与电路板110垂直，至少一个散热翅片122上形成有至少一个凹槽1222。例如，可以是一个散热翅片122上形成有一个凹槽1222；或者，一个散热翅片122上形成有多个凹槽1222；又或者，至少两个散热翅片122上形成有凹槽1222，且各散热翅片122上的凹槽1222数量可以为一个或多个。
在一个示例中，各凹槽1222可以在第二方向和第三方向上贯穿对应的散热翅片122，以将散热翅片122划分为多个子散热翅片，其中，第三方向垂直于第一方向和第二方向。散热翅片122与空气环境之间的对流热阻的计算公式为：R＝1/(hA)，其中，R为散热翅片与空气环境之间的对流热阻，h为对流换热系数，A为散热面积。凹槽1222可以将整片散热翅片122划分为在第一方向上间隔设置的多个子散热翅片，空气流经此区域前后会先膨胀再收缩，空气穿过凹槽1222区域后扰动变强，对流换热系数变大，从而热阻减小。
在一个示例中，至少一个凹槽1222在第二方向和/或第三方向上未穿透对应的散热翅片122，此时各散热翅片122并未被划分为多个子翅片。也就是说，至少一个凹槽1222在第二方向上未穿透对应的散热翅片122且在第三方向上穿透对应的散热翅片 122；或者，至少一个散热凹槽1222在第三方向上未穿透对应的散热翅片122且在第二方向上穿透对应的散热翅片122；还可以是至少一个凹槽1222在第二方向和第三方向上均未穿透对应的散热翅片122。其中，第二方向为多个散热翅片122的排布方向，第三方向为垂直于电路板110的表面的方向。
由此，通过设置上述的凹槽1222，可以降低散热翅片122的整体重量，且可以有效减小风流过散热器120的风阻，增大通风量，在提升散热效果的同时，可以减小散热翅片122上的积灰量。具体地，散热器120靠近入风口的一侧的积灰量通常大于靠近出风口一侧的积灰量。在凹槽1222设置于散热翅片122的靠近入风口的一端的情况下，可能会进一步增加散热器120靠近入风口的一端的积灰量。通过使凹槽1222设置于散热翅片122靠近出风口的一端，可以避免增加散热器120入风口处的积灰量，提升散热器120的局部散热效果。
在一种实施方式中，凹槽1222设置于散热翅片122的相对于散热器120的中心靠近出风口的一端，即“靠近出风口的一端”指的是以散热器120的中心为参考标准，靠近出风口的一端。由此，由于出风口处的风的温度通常较高，在风与散热器120靠近出风口的一端进行换热后，无法有效带走发热元器件111工作过程中产生的热量，通过使凹槽1222靠近出风口设置，可以增大出风口区域的对流换热系数，减小出风口处的热阻，从而可以增大出风口处的通风量，提升出风口处的发热元器件111的散热效果，同时抑制粉尘的沉积，进而提升发热元器件111的均温性。
在一种实施方式中，结合图39B，多个散热翅片122均设置有凹槽1222，多个凹槽1222在第二方向上形成至少一列凹槽列。
示例性地，当各散热翅片122上分别形成有一个凹槽1222时，多个凹槽1222在第二方向上对应设置，以形成一列凹槽列；当多个散热翅片122中至少部分形成有多个凹槽1222时，各散热翅片122上的至少一个凹槽1222与其他散热翅片122上的凹槽1222在第二方向上对应设置，以形成至少一列凹槽列。
示例性地，沿第一方向，各散热翅片122上的凹槽1222的尺寸可以逐渐增大；或者，沿第一方向，各散热翅片122上的凹槽1222的尺寸可以逐渐减小；又或者，沿第一方向，各散热翅片122上的凹槽1222的尺寸可以完全相等。还可以凹槽1222尺寸与散热翅片122宽度尺寸呈正相关或负相关，当然，本申请不限于此，例如，各散热翅片122上的凹槽1222的尺寸可以按需设置，同时配合两个凹槽1222间的散热片宽度组合变化。可以理解的是，各散热翅片122上的凹槽1222的尺寸、数量、具体位置可以根据实际需求具体设置，以更好地满足实际应用。
在一种实施方式中，凹槽1222与发热元器件111对应设置。示例性地，至少一个散热器120的各散热翅片122均设置有凹槽1222，多个凹槽1222呈列排布，至少一列凹槽1222与至少一列发热元器件111相对设置。例如，多个散热翅片122上的凹槽1222可以在散热翅片122的排布方向上相对应，使多个散热翅片122上的凹槽1222呈列排布。
其中，可以仅第一散热器123的各散热翅片122设置有凹槽1222；或者，仅第二散热器124的各散热翅片122上设置有凹槽1222，如图39B所示；还可以是第一散热器123和第二散热器124的各散热翅片122上均设置有凹槽1222，此时第一散热器123和第二散热器124上的各散热翅片122上的凹槽1222可以不同。
在一种实施方式中，多个发热元器件构成沿第一方向间隔排布的多个发热列，各发热列包括沿第二方向间隔设置的多个发热元器件，至少一列凹槽列与至少一列发热列相对设置。如此设置，与凹槽1222相对的发热元器件工作过程中产生的热量可以传导至散热主体121，流经散热主体121的风可以与散热主体121直接换热，以实现发热元器件的散热，由于凹槽1222处的对流换热系数较大，可以有效减小风阻，从而增大与凹槽1222相对的发热元器件处的风量，提升与凹槽1222相对的发热元器件的散热效果。
可选地，凹槽1222在第一方向上的尺寸可以为2.5mm～3.5mm(包括端点值)。但不限于此。例如，当凹槽1222在第一方向上的尺寸小于2.5mm时，凹槽1222的宽度过小，可能会降低减重效果；当凹槽1222在第一方向上的尺寸大于3.5mm时，凹槽1222的宽度过大，可能会导致散热翅片122的表面积过小，降低散热下过。通过使凹槽1222在第一方向上的尺寸可以为2.5mm～3.5mm，能够在保证散热器120的散热效果的同时，有效减小散热器120的重量。
示例性地，沿第一方向，各散热翅片122上的凹槽1222的尺寸可以逐渐增大；或者，沿第一方向，各散热翅片122上的凹槽1222的尺寸可以逐渐减小；又或者，沿第一方向，各散热翅片122上的凹槽1222的尺寸可以完全相等。还可以凹槽1222尺寸与散热翅片122宽度尺寸呈正相关或负相关，当然，本申请不限于此，例如，各散热翅片122上的凹槽1222的尺寸可以按需设置，同时配合两个凹槽1222间的散热片宽度组合变化。可以理解的是，各散热翅片122上的凹槽1222的尺寸、数量、具体位置可以根据实际需求具体设置，以更好地满足实际应用。
由此，通过使凹槽1222与发热元器件111的位置相对应，与凹槽1222相对的发热元器件111工作过程中产生的热量可以传导至散热主体121，流经散热主体121的风 可以与散热主体121直接换热，以实现发热元器件111的散热，由于凹槽1222处的对流换热系数较大，可以有效减小风阻，从而增大与凹槽1222相对的发热元器件111处的风量，提升与凹槽1222相对的发热元器件111的散热效果。
在一种实施方式中，结合图35、图36和图39A，至少一个散热翅片122包括斜切部1221，沿第一方向，斜切部1221的高度逐渐增加。
在一种实施方式中，斜切部1221相对于散热器120的中心靠近入风口设置，斜切部1221远离入风口的端部与第三列发热元器件111的位置相对应，即斜切部1221远离入风口的端部处于电路板110沿第一方向靠近中部的位置。其中，上述“第三列发热元器件111”指的是沿第一方向，位于第三列的散热元器件。例如，在图35、图36和图39A的示例中，第一散热器123和第二散热器124的所有散热翅片122均包括斜切部1221，斜切部1221靠近入风口设置。电路板110上共设有六列发热元器件111，沿第一方向，前三列发热元器件111可以与斜切部1221相对设置，后三列发热元器件111可以与对应的凹槽1222相对设置，后三列发热元器件可以与对应的凹槽1222相对设置。
需要说明的是，上述“第三列发热元器件111”也可是电路板110沿第一方向靠近中部的位置的第四列发热元器件111。若发热元器件111总数为8列，则“斜切部1221远离入风口的端部处于电路板110沿第一方向靠近中部的位置”与第四列发热元器件111或第五列发热元器件111对应。
由此，通过设置上述的斜切部1221，可以有效减小整个散热翅片122的重量，减小入风口处的热阻，从而增大入风口处的通风量，提升入风口处的发热元器件111的散热效果，同时抑制粉尘的沉积，提升发热元器件111的均温性。
根据本申请第二方面实施例的电子设备例如计算设备，包括根据本申请上述第一方面任一实施方式的工作组件100。
根据本申请实施例的电子设备，通过采用上述的工作组件100，可以降低靠近出风口的发热元器件与靠近入风口的发热元器件最大温差，从而提升发热元器件的均温性。
上述实施例的工作组件100和电子设备的其他构成可以采用于本领域普通技术人员现在和未来知悉的各种技术方案，这里不再详细描述。
在一种实施方式中，如图35和图36所示，沿第一方向，第一散热器123的尺寸与第二散热器124的尺寸相同。如此设置，在实现电路板110的第一表面和第二表面的散热的同时，第一散热器123和第二散热器124的尺寸可以相一致，从而可以提升散热器120的通用性，方便散热器120的加工。
在一种实施方式中，第一散热器123的散热翅片122密度与第二散热器124的散热翅片122密度相同，第一散热器123的散热翅片122高度与第二散热器124的散热翅片122高度不同。例如，第一散热器123的散热翅片122的高度可以大于第二散热器124的散热翅片122的高度。由于第一散热器123与多个发热元器件111接触，通过使第一散热器123的散热翅片122的高度大于第二散热器124的散热翅片122的高度，第一散热器123的散热翅片122的面积可以大于第二散热器124的散热翅片122的面积，第一散热器123的散热翅片122可以有效吸收多个发热元器件111工作过程中产生的热量，从而提升散热效果。
在另一种实施方式中，第一散热器123的散热翅片122高度与第二散热器124的散热翅片122高度相同，第一散热器123的散热翅片122密度与第二散热器124的散热翅片122密度不同。例如，第一散热器123的散热翅片122的密度可以大于第二散热器124的散热翅片122的密度。由于第一散热器123与多个发热元器件111接触，通过使第一散热器123的散热翅片122的密度大于第二散热器124的散热翅片122的密度，第一散热器123的散热翅片122的面积可以大于第二散热器124的散热翅片122的面积，第一散热器123的散热翅片122同样可以有效吸收多个发热元器件111工作过程中产生的热量，有利于提升散热效果；或者，第一散热器123的散热翅片122的密度可以小于第二散热器124的散热翅片122的密度，这样，第一散热器123的相邻散热翅片122之间具有更大的散热空间，第一散热器123分享到的风更多，从而降低风阻，增大通风量，改善积灰，同样可以有效散发多个发热元器件111工作过程中产生的热量。
在一种可选的实施方式中，第一散热器123的散热翅片122总表面积大于第二散热器124的散热翅片122总表面积。这样，有利于降低多个发热元器件111的整体温度，同时降低多个发热元器件111的最高温度。
当然，本申请不限于此，在另一种可选的实施方式中，第一散热器123的散热翅片122总表面积可以小于第二散热器124的散热翅片122总表面积。这样，可以进一步改善第一散热器123的积灰量，有效散发多个发热元器件111工作过程中产生的热量。
在一种实施方式中，如图45-图51所示，第一散热器123的散热翅片122数量可以小于第二散热器124的散热翅片122数量。这样，第一散热器123的的散热翅片122的总表面积可以相对较小，从而可以增大通风量，改善积灰，同样可以有效散发多个发热元器件111工作过程中产生的热量。
在一种实施方式中，参照图45-图51，沿第二方向，第二散热器124的端部超过第一散热器123的对应端。例如，在图45-图51的示例中，沿第二方向，第二散热器124的尺寸大于第一散热器123的尺寸，第二散热器124的两端均超过第一散热器的对应端。如此设置，第二散热器124的散热翅片122数量较大，散热翅片122的总表面积相对较大，电路板110工作过程中产生的热量可以通过第二散热器124的散热翅片122有效排出，同时第一散热器123的数量可以相对较小，散热翅片122的总表面积相对较小，可以进一步改善第一散热器123积灰严重的问题，增大第一散热器123的通风量，进一步提升散热效果。
在一种实施方式中，靠近散热风道入风口的发热元器件111的密度可以大于靠近出风口的发热元器件111的密度。由于从入风口进入的风为冷风，从出风口排出的风为热风，通过使入风口处的发热元器件111的密度较大，可以增大入风口处的发热元器件111的发热量，通过使出风口处的发热元器件111的密度较小，可以减少出风口处的发热元器件111的发热量，从而可以进一步降低靠近出风口的发热元器件111与靠近入风口的发热元器件111的最大温差，从而提升发热元器件111的均温性。
在一种实施方式中，如图52所示，靠近出风口的多个发热元器件111沿第二方向划分为多组发热元器件组，相邻两组发热元器件组之间的间隙大于各发热元器件组中相邻两个发热元器件111之间的间隙。
例如，在图52的示例中示出了六列发热元器件111。为方便描述，将沿第一方向依次排布的六列发热元器件111分别称为第一发热列、第二发热列……第六发热列。第一发热列至第三发热列中的发热元器件111的数量为21个，第四发热列至第六发热列中的发热元器件111的数量为19个。其中，第一发热列至第三发热列中的21个发热元器件111均匀间隔设置。第四发热列至第六发热列中的19个发热元器件111划分为三组发热元器件组，且三组发热元器件组中位于第二方向两端的发热元器件组中的发热元器件111的数量相同，位于第二方向中部的发热元器件组中的发热元器件111的数量小于两端的发热元器件组中的发热元器件111的数量。
本实施例中，出风口处的相邻两组发热元器件组之间可以具有较大的散热间隙，可以降低靠近出风口的温度，进而可以降低入风口与出风口的最大温差，从而提升工作组件100的均温性。
在一种实施方式中，发热元器件111例如芯片阵列的排布方式可以有多种形式。靠近入风口的第一列(如上述第一发热列)至出风口的最后一列(如上述第六发热列)，每列芯片数量不完全相等。可以为每列芯片数量逐渐递减，例如21个、20个、19个、 18个、17个、16个；可以为部分递减，例如21个，21个，21个，19个、19个、19个；也可以为数量跳变，例如21个，21个，20个，19个，20个，21个；或者21个，21个，20个，19个，18个，21个；还可以根据散热需求，设置其他数量的芯片阵列，使得靠近入风口的前半部分芯片总数，大于靠近出风口的后半部分芯片总数，这里的前半部分和后半部分，可以是芯片列数的对半分割，也可以是电路板110尺寸上的对半分割。如图52，设置靠近入风口的前三列芯片总数大于靠近出风口的后三列芯片总数。
由于每列芯片数量的变化，每行芯片的排布也可以进行不同形式的组合，且每行芯片的数量可以不同。例如，部分行芯片以芯片中心点呈一直线排列，部分行芯片的中心点未形成一直线，例如阶梯排布(如配合上述“每列芯片数量逐渐递减，例如21个、20个、19个、18个、17个、16个”行方向呈现阶梯排布)。每行芯片的数量也存在不同实施例，例如第二方向上，靠近电路板110两端的行芯片数量大于靠近电路板110中心位置行芯片数量。总之，对总芯片分布和/或数量进行分割，分割成的各部分芯片总数，符合预设分布要求。
具体的，第二方向上，以第一发热列芯片数量为分割依据，将电路板110从左至右分割为三部分，第一部分，第二部分及第三部分，靠近电路板110两端的第一部分或第三部分的芯片总数，大于中间第二部分的芯片数量。在另一实施例中，若第二方向上，以第一发热列芯片数量为分割依据，将电路板110从左至右分割为两部分，则第一部分的芯片数量小于或者等于第二部分的芯片数量。
上述具体的分割，参考图52，第二方向上，以第一发热列芯片数量为分割依据，在一种实施例中，分割方式为平均分割，将电路板110从左至右分割为三部分，第一发热列共有21个芯片，将电路板110从左至右分割为三部分，每第一发热列中的7个芯片对应分割为一部分，则第一部分的芯片总数为42个，第二部分的芯片总数为36个，第三部分的芯片总数为42个。靠近电路板110两端的第一部分(42个)或第三部分的芯片总数(42个)，大于中间第二部分的芯片数量(36个)；若第二方向上，以第一发热列芯片数量为分割依据，将电路板110从左至右分割为两部分，可以以第一发热列的中间第11个芯片中心轴为分割点，将电路板110从左至右分割为两部分，则第一部分的芯片数量(57个)等于第二部分的芯片数量(57个)。本领域技术人员可以理解的是，分割方式不限于上述记载，当第一发热列芯片总数为奇数或者偶数时，可以灵活选择分割的方式。当然，也可以以电路板排布芯片的边沿，所形成的整体面积为基准，对其进行分割划分，可以为平均分割，当然也可以按其他比例进行分割，以 使得每一部分的芯片总数符合预设分布要求。
总之，芯片的排布方式，可以结合风道中各个位置的散热情况而设置。例如入风口环境温度低，整体散热效率高，则可以多布置芯片数量，出风口环境温度高，整体散热效率低，则可以少布置芯片数量，靠近出风口芯片总数小于入风口芯片总数。同时，电路板110的上下两端，与风的方向垂直的方向上，两端的温度低于电路板110中心的温度，则两端可以多布置芯片，中心位置少布置芯片，两端芯片总数大于中心芯片总数，也可以分成两部分后，下半部分的芯片总数大于上半部分的芯片总数。这与通常改变散热器的热阻实现均温，是完全不同的设计思路。
在一种实施方式中，参照图31、图39A-图42，电路板110的在第二方向上的一端设有第一连接座140和第二连接座150，第一连接座140和第二连接座150在第一方向上间隔设置，其中，第二方向垂直于第一方向。例如，第一连接座140和第二连接座150可以为铝座或铜座，连接座为铝座的情况下的厚度可以大于连接座为铜座的情况下的厚度。由此，通过设置第一连接座140和第二连接座150，与现有技术中设置多个连接片的方式相比，第一连接座140和第二连接座150的结构更加简单，方便加工，可以有效提升工作组件100的组装效率。
进一步地，如图39A-图42所示，第一连接座140和第二连接座150均包括连接本体141和延伸部142。其中，连接本体141连接于电路板110的第一表面，延伸部142的一端连接于连接本体141，延伸部142的另一端沿第三方向远离电路板110延伸，第三方向垂直于第一表面。例如，延伸部142可以包括第一连接段、第二连接段和第三连接段。其中，第一连接段的一端可以连接于连接本体141，第一连接段的另一端可以朝向远离电路板110的方向倾斜设置。第二连接段的一端可以连接与第一连接段的上述另一端，第二连接段可以沿平行于第一表面的方向远离第一连接段设置。第三连接段的一端可以连接于第二连接段的另一端，第三连接段的另一端可以沿垂直于第一表面的方向远离电路板110设置。
由此，通过设置上述的连接本体141和延伸部142，连接本体141可以实现整个连接座(即上述第一连接座140和第二连接座150)与电路板110的牢靠连接，延伸部142可以向外延伸，以与导电连接件连接，从而实现为电路板110的供电。
在一种实施方式中，延伸部142与第一表面之间可以限定出避让槽143。例如，避让槽143由上述第一连接段、第二连接段和电路板110的第一表面共同限定出。这样，线束可以通过避让槽143穿出，从而有效起到避让走线的作用。
在一种实施方式中，如图40所示，连接本体141的边缘具有朝向远离电路板110 的方向延伸的翻边1411。如此设置，翻边1411可以有效起到抗弯的作用，从而使连接本体141与电路板110之间的连接更加牢靠，避免连接本体141的边缘翘起，可靠性更高。
在一种实施方式中，参照图39A、图42和图43，电路板110的第一表面上设有多个发热元器件111，第一散热器123与电路板110之间设置有密封件160，密封件160靠近入风口设置。例如，密封件160可以为橡胶件。由此，通过设置上述的密封件160，可以提升第一散热器123与电路板110在入风口处的密封性，避免潮气从第一散热器123与电路板110之间的间隙处进入，从而可以保护靠近入风口处的发热元器件111，同时避免漏风。
在一种实施方式中，结合图39A、图42和图43，密封件160包括第一密封部161和第二密封部162。第一密封部161抵靠于电路板110和第一散热器123靠近入风口的边缘，第二密封部162设置于第一密封部161的背离入风口的一侧表面，且第二密封部162位于第一散热器123与电路板110之间的间隙处。示例性地，第二密封部162将第一密封部161分为两个部分，第一密封部161的其中一个部分至少与第一散热器123的散热主体121边缘接触，第一密封部161的另一个部分至少与电路板110的边缘接触。第一散热器123的散热主体121靠近入风口的边缘与电路板110的靠近入风口的边缘之间具有进口，第二密封部162通过进口伸入第一散热器123与电路板110之间的间隙处。
由此，通过设置上述的第一密封部161和第二密封部162，第一密封部161具有较好的遮挡作用，避免入风口处的潮气与第一散热器123的散热主体121或电路板110直接接触，第二密封部162具有有效的密封作用，进一步避免潮气进入第一散热器123与电路板110之间的间隙处，从而进一步提升第一散热器123与电路板110在入风口处的密封性。
在一种实施方式中，结合图45至图51，工作组件100可不设置密封件160，从而保证整个工作组件100的散热性能。
在一种实施方式中，如图39A和图44所示，电路板110和散热器120可通过连接件进行连接，例如，连接件可以是螺钉、弹性连接件等。
在一种实施方式中，如图39A和图44所示，电路板110和散热器120通过弹簧螺钉170连接，弹簧螺钉170包括螺钉172和套设于螺钉172的弹簧171，弹簧171的靠近电路板110的端部朝向远离电路板110的方向延伸。例如，在图39A和图44的示例中，弹簧171的尾部朝向远离电路板110的方向折起。由此，由于弹簧171的端部较 为锋利，通过上述设置，可以避免由于弹簧171的端部与电路板110的表面接触而导致弹簧171的端部刮铝屑，从而避免损伤电路板110，提升电路板110的完整性和可靠性。
根据本申请第二方面实施例的电子设备200例如计算设备，如图1-图9A所示，包括根据本申请上述第一方面任一实施方式的工作组件100。
根据本申请实施例的电子设备200例如计算设备，通过采用上述的工作组件100，可以降低靠近出风口的发热元器件111与靠近入风口的发热元器件111最大温差，从而提升发热元器件111的均温性。
在一种实施方式中，参照图1-图9A，电子设备200包括壳体210和风扇组件220。其中，壳体210内限定出具有入风口和出风口的散热风道，散热风道内设置有至少一个工作组件100，工作组件100包括电路板110和多个散热器120，多个散热器120设置于电路板110的至少一侧。例如，电路板110的两侧均可以设置有散热器120。电路板110的表面平行于入风口到出风口的第一方向。风扇组件220设置于壳体210靠近入风口的一侧。
示例性地，图9A中示出了三个工作组件100，三个工作组件100沿垂直于电路板110的表面的方向间隔排布。各散热器120可以包括散热主体121和多个散热翅片122，多个散热翅片122沿第二方向(例如，图9A中的上下方向)间隔设置在散热主体121的一侧表面上，第二方向垂直于第一方向，且第二方向平行于电路板110的表面。
第一散热器123的散热主体121可以与第一表面的发热元器件111接触，第二散热器124的散热主体121可以与电路板110的第二表面接触，发热元器件111工作过程中产生的热量可以传导至第一散热器123和第二散热器124。相邻两个散热翅片122与散热主体121之间可以限定出沿第一方向延伸的散热通道。在风扇组件220工作的情况下，冷风从入风口进入，沿第一散热器123和第二散热器124的散热通道流动，并与第一散热器123和第二散热器124换热，换热后的热风从出风口流出，从而实现工作组件100的散热。
通过使风扇组件220设置于壳体210靠近入风口的一侧，风扇组件220与出风口位于壳体210的两侧，在部分工作组件100出现损坏的情况下，只需将损坏的工作组件100拆下并从出风口处取出，然后将功能完好的工作组件100通过出风口放入壳体210内并进行安装，无需拆除风扇组件220，从而使工作组件100的安装和拆卸更加方便，能够有效提高工作组件100的检修和更换效率。
在一种实施方式中，结合图9A-图15，风扇组件220包括安装件221和多个风扇 模块222。其中，安装件221连接于壳体210，多个风扇模块222连接于安装件221的背离壳体210的一侧。例如，在图15、图17和图18的示例中，安装件221的外轮廓尺寸大于风扇模块222的外轮廓尺寸。安装件221的与风扇模块222相对的部分形成有多个进风孔，在风扇模块222工作的情况下，外部风在风扇模块222的作用下通过多个进风孔进入散热风道，与第一散热器123和第二散热器124发生热交换后，从出风口流出。
由此，通过设置上述的安装件221和多个风扇模块222，安装件221可以将风扇模块222牢靠地固定在壳体210上，从而提升整个电子设备200的结构稳定性和可靠性，多个风扇模块222可以增大散热风道的通风量，减小风阻，抑制粉尘在散热器120上的沉积，从而有效改善工作组件100的散热效果。
在一种实施方式中，如图11、图14-图16所示，安装件221上设置有至少一个第一弹性部件，第一弹性部件压紧在安装件221和壳体210的对应侧壁之间，以实现安装件221与壳体210之间的牢靠安装，避免安装件221从壳体210上脱落。
在一种实施方式中，如图11、图14-图16所示，安装件221包括安装主体、相对设置的安装顶板和安装底板、两个安装侧板和第一弯折部。其中，风扇模块222连接于安装主体，安装主体上形成有多个进风孔。安装顶板和安装底板设置于安装主体的背离风扇模块的一侧，且安装顶板连接于安装主体的上部，安装底板连接于安装主体的下部。两个安装侧板设置于安装主体的背离风扇模块222的一侧，且两个安装侧板分别连接于安装主体的两侧，第一弹性部件设置于两个安装侧板中的至少一个上。第一弯折部连接于安装顶板的背离安装主体的一端。
示例性地，结合图11、图13-图16，安装顶板、安装底板和各安装侧板可以均垂直于安装主体。安装顶板连接于安装主体和第一弯折部之间，第一弯折部平行于安装主体。安装后，工作组件100可以抵接于第一弯折部，这样，一方面，安装件221与工作组件100在第一方向上具有一定的间隙。当外部风从风扇模块222进入散热风道后，可以在安装件221与工作组件100之间的间隙处流动均匀，然后流经第一散热器123和第二散热器124，提升散热效果。另一方面，第一弯折部可以起到有效的挡风作用，使从入风口进入的风尽可能全部流入工作组件100，避免产生风量的浪费。
其中，安装顶板和安装底板上可以设置有多个工字形的加强筋，以避免安装顶板和安装底板产生弯折翘曲，提升整个安装件221的结构强度，从而保证电子设备200的结构稳定。
在一种实施方式中，至少一个第一弹性部件包括上下间隔设置的多个第一弹性卡 扣230，各第一弹性卡扣的自由端压紧在安装侧板与壳体的对应侧壁之间。
示例性地，安装侧板上可以形成有上下间隔设置的多个过孔，多个第一弹性卡扣230一一对应地设置于多个过孔内。其中，各第一弹性卡扣230的一端连接于对应的过孔的边缘，各第一弹性卡扣230的另一端(即上述自由端)朝向第一方向的反方向延伸。当安装件221安装于壳体210时，壳体210的侧壁按压各第一弹性卡扣230的另一端，使各第一弹性卡扣230的产生弹性形变。当将安装件221从壳体210拆下时，第一弹性卡扣230恢复原状。其中，各第一弹性卡扣230为金属卡扣。
在一个示例中，如图16所示，各第一弹性卡扣230可以包括连接部231和止抵部232。其中，连接部231的一端连接于对应的过孔的第一边缘。止抵部232的一端连接于连接部231的另一端，止抵部232的另一端与第一边缘的对侧边缘间隔设置，止抵部232止抵于壳体210的对应侧壁。
由此，安装件221与壳体210之间可以通过多个第一弹性卡扣230电连接，从而起到有效的屏蔽、接地作用，提高电子设备200的安全性。在另一种实施方式中，参照图18并结合图11，上述至少一个第一弹性部件包括沿上下方向延伸的第一导电泡棉240，安装件221与壳体210的对应侧壁通过第一导电泡棉240弹性接触。例如，第一导电泡棉240可以通过胶粘剂粘贴于两个安装侧板。可选地，第一导电泡棉240可以为导电泡棉，但不限于此。这样，安装件221与壳体210之间可以通过第一导电泡棉240电连接，从而同样可以起到有效的屏蔽、接地作用，提高电子设备200的安全性。
在一种实施方式中，如图13所示，风扇模块222与工作组件100在第一方向上间隔设置。例如，在图13的示例中，安装件221与工作组件100在第一方向上具有一定的间隙。当外部风从风扇模块222进入散热风道后，可以在安装件221与工作组件100之间的间隙处流动均匀，然后流经第一散热器123和第二散热器124。由此，风扇模块222与工作组件100之间的间隙可以使风更均匀的流入散热器120，提升散热效果。
在一种实施方式中，参照图14-图19，风扇模块222的远离安装板的一侧设置有柔性保护罩250，柔性保护罩250套设于风扇模块222的外周。由此，如此设置的柔性保护罩250能够有效保护风扇模块222的棱角，避免风扇模块222磨损，且可以避免风扇模块222的边角划伤工作人员，从而提升安全性。可选地，柔性保护罩250的材质可以为软胶材质，但不限于此。
在一种实施方式中，如图20和图21所示，壳体210的顶部设置有控制板260，控制板260上设置有多个风扇接口262，多个风扇接口262与多个风扇模块222一一对应连接，其中，多个风扇接口262均靠近入风口设置，使得多个风扇接口262靠近多个 风扇模块222设置，便于多个风扇接口262与多个风扇模块222之间的布线。
示例性地，电路板110上设置有第一信号插座112，控制板260上设置有第二信号插座261，第二信号插座261与第一信号插座112连接。例如，在图20和图21的示例中，第二信号插座261为三个，三个第二信号插座261可以通过三个第一线缆与三个工作组件100的电路板110一一对应连接，以使控制板260能够控制电路板110的工作。
示例性地，第二信号插座261靠近第一信号插座112。示例性地，当第二信号插座261的数量为三个时，第一信号插座112的数量为三个，其中三个第二信号插座261设置在控制板260靠近第一信号插座112的侧边上。这样的设置可以便于第二信号插座261与第一信号插座112之间以最短的连接线实现连接。
示例性地，风扇接口262和风扇模块222均为四个，四个风扇接口262可以通过四个第二线缆和四个风扇模块222一一对应连接，以使控制板260能够控制工作模块的工作。
示例性地，四个风扇模块222分为两组，每组两个风扇模块222之间通过螺钉连接在一起，并且通过螺钉固定在安装件221上。其中，每个风扇模块222的四个角上设置有通孔，用于螺钉穿过，相应的在安装件221上设置有螺纹孔2211，用于螺钉穿过实现风扇模块222与安装件之间的装配。示例性地，安装件221上还设置有多个用于将安装件221固定到壳体210上固定孔2212，例如在安装件221的四个角上设置有四个固定孔2212，相应的在壳体210上设置有固定孔。
由此，通过上述设置，一方面，能够实现控制板260与风扇模块222以及控制板260与电路板110的信号连接；另一方面，通过使多个风扇接口262均靠近入风口设置，多个风扇接口262能够在控制板260上集中设置，结构更加紧凑，占用空间更小，方便控制板260上其它模块的空间布局。
在一种实施方式中，参照图23-图25B，壳体210的顶部设置有顶壳212，控制板260设置于顶壳212内，控制板260上设置有温感器263，温感器263用于感测入风口处的温度。这样，用户可以实时知晓入风口处的温度，避免从入风口进入的风的温度过高，使工作组件100具有较好的散热效果，从而保证工作组件100的正常工作，有效延长整个电子设备200的使用寿命。
在一种实施方式中，如图23和图24所示，温感器263设置于控制板260的底部，且温感器263位于顶壳212内，壳体210的顶面形成有与散热风道连通的通风孔211，通风孔211与温感器263的位置对应。例如，在图23和图24的示例中，安装件221 的顶部形成有沿厚度方向贯通的第一通风孔，第一通风孔、通风孔211和温感器263在上下方向上相对应。
由此，上述实施方式中的温感器263能够通过通风孔211感测入风口处的温度，从而保证从入风口输入的风为冷风。而且，温感器263可以隐藏在顶壳212内，避免温感器263与外部环境直接接触，使顶壳212可以对温感器263起到有效的保护作用，防止温感器263损坏，并且可以使电子设备200的外观更加整齐美观。
在另一种实施方式中，参照图25A和图25B，温感器263设置于控制板260的顶部，且温感器263从顶壳212的靠近风扇组件220的侧面伸出。例如，在图25A和图25B的示例中，顶壳212的靠近入风口的侧面可以形成有通过孔，温感器263可以设置于控制板260的靠近入风口的一侧，且温感器263从通过孔伸出顶壳212外。如此设置，温感器263能够直接伸出顶壳212外感测入风口处的温度，壳体210和安装件221上可以无需开孔，从而使壳体210的结构更加简单，方便加工。
当然，本申请不限于此，在又一种实施方式中，如图26A和图26B所示，温感器263的自由端可以穿过壳体210的顶部伸入壳体210内且与风扇组件220相对。这样，温感器263的自由端能够伸入壳体210的进风腔内对风扇组件220输入的风的温度进行检测，能够更加准确地感测入风口的温度。
在实现本发明的过程中发明人发现，电子设备200的指示灯通常设置在电子设备200控制板的中部，当将多个风扇串联(例如4个风扇)安装在电子设备200的前端面时，由于视角的原因，风扇会挡住指示灯，影响运维人员的观察，尤其是电子设备200需要放置在机架上，有时放置的位置较高，这时风扇将会更容易遮挡指示灯。
基于此，在一种实施方式中，如图23和图24所示，电子设备200还可以包括指示灯264，以指示电子设备200的工作状态。指示灯264设置在控制板靠近入风口的一侧，且指示灯264位于控制板靠近入风口侧边的端部。
由于将指示灯264设置在了控制板侧边的端部，这样可以从电子设备200的一侧便可以观察到指示灯，避免了风扇遮挡指示灯的情况。
在一种实施方式中，如图27-图29B所示，电子设备200还包括：电源模块270，电源模块270设置于壳体210在第三方向上的一侧，电源模块270用于为电路板110和风扇组件220供电，其中，第三方向垂直于电路板110的表面。
示例性地，壳体210大体为长方体结构，壳体210可以包括顶面、底面和四个侧面，四个侧面分别连接于顶面和底面之间。顶面和底面在第二方向上彼此相对。电源模块270的顶部连接于顶壳212，电源模块270的侧面连接于壳体210的侧面。
沿第三方向，顶壳212包括相对设置的两个第一侧面和相对设置的两个第二侧面，其中，两个第一侧面中的其中一个与壳体210的对应第四侧面齐平，两个第一侧面中的另一个与电源模块270的对应侧面齐平，各第二侧面同时与壳体210和电源模块270的对应侧面齐平，电源模块270的底面与壳体210的底面齐平。
具体地，例如，顶壳212的两个第一侧面可以分别为前侧面和后侧面，顶壳212的两个第二侧面可以分别为左侧面和右侧面。顶壳212的前侧面可以与壳体210的前侧面以及电源模块270的前侧面相平齐，顶壳212的后侧面可以与壳体210的后侧面以及电源模块270的后侧面相平齐，顶壳212的左侧面可以与壳体210的左侧面相平齐，顶壳212的右侧面可以与电源模块270的右侧面相平齐，电源模块270的底面与壳体210的底面平齐。
需要说明的是，上述“前”指的是靠近散热风道入风口的方向，其相反方向被定义为“后”，即靠近散热风道出风口的方向。“左”指的是沿电源模块270朝向壳体210的方向；“右”指的是沿壳体210朝向电源模块270的方向。相应地，“前侧面”指的是靠近散热风道入风口的侧面，“后侧面”指的是靠近散热风道出风口的侧面。“左侧面”指的是在电源模块270朝向壳体210的方向上的侧面，“右侧面”指的是在壳体210朝向电源模块270的方向上的侧面。
由此，通过上述的电源模块270，在为电路板110和风扇组件220供电的同时，电源模块270可以有效利用顶壳212与壳体210之间的空间，从而使整个电子设备200的结构更加紧凑，外形更加整齐美观。
在一种实施方式中，如图27-图30B所示，电源模块270和顶壳212中的其中一个上形成有至少一个定位孔271，电源模块270和顶壳212中的另一个上设置有至少一个定位凸起，定位凸起配合在对应的定位孔271内。电源模块270和壳体210中的其中一个上形成有至少一个通孔272，电源模块270和壳体210中的另一个上形成有与通孔272对应的至少一个螺纹孔，螺纹紧固件273适于穿过通孔272与螺纹孔螺纹连接。
例如，在图27-图30B的示例中，电源模块270的顶部上形成有两个定位孔271，两个定位孔271沿第一方向间隔设置，对应地，顶壳212的底面上可以设置有两个在第一方向上间隔设置的定位凸起，两个定位凸起与两个定位孔271一一对应。电源模块270的侧面形成有四个通孔272，四个通孔272分别位于电源模块270的四个角处。壳体210的第二侧面上形成有与四个通孔272一一对应的四个螺纹孔。安装时，可以先使两个定位凸起分别配合在对应的定位孔271内，以实现电源模块270的定位。然后使四个螺纹紧固件273分别穿过对应的通孔272与对应的螺纹孔螺纹连接，以实现 电源模块270的固定。
在一个示例中，如图29A和图29B所示，各螺纹紧固件273可以为短螺钉。此时各螺纹紧固件273可以穿过电源模块270的其中一个侧壁与壳体210上的螺纹孔螺纹连接，此时电源模块270的其中一个侧壁压紧在螺纹紧固件273的头部和壳体210之间。
在另一个示例中，如图30A-图30C所示，各螺纹紧固件273可以为长螺钉。此时各螺纹紧固件273可以穿过电源模块270的两个侧壁与壳体210上的螺纹孔螺纹连接，此时整个电源模块270压紧在螺纹紧固件273的头部和壳体210之间。这种固定方式的可视性更好，方便螺纹紧固件273例如螺钉的安装和拆卸。
当然，还可以是其中一部分螺纹紧固件273为短螺钉，另一部分螺纹紧固件273为长螺钉，本申请对此不作限定。
由此，可以预先通过定位凸起与定位孔271的配合实现电源模块270相对于壳体210的定位，避免电源模块270在与壳体210的过程中产生移位，从而可以提升安装效率。而且，电源模块270与壳体210之间可以通过螺纹紧固件273直接螺纹连接，电源模块270与壳体210之间无需设置支架，结构更加简单。
在一种实施方式中，参照图20-图22，电子设备200还包括第一导电连接件280和第二导电连接件290。具体地，第一导电连接件280的其中一部分电连接于电源模块270，第一导电连接件280的另一部分电连接于工作组件100的第一连接座140。第二导电连接件290的其中一部分电连接于电源模块270，第二导电连接件290的另一部分电连接于工作组件100的第二连接座150。
例如，在图20-图22的示例中，第一导电连接件280的上述另一部分的底面可以与三个第一连接座140的第三连接段的顶面接触，第一紧固件适于穿过第一导电连接件280与对应的第一连接座140的第三连接段连接。第二导电连接件290的上述另一部分的底面可以与三个第二连接座150的第二连接段的顶面接触，第二紧固件适于穿过第二导电连接件290与对应的第二连接座150的第三连接段连接。第一导电连接件280的上述另一部分可以平行于第二导电连接件290的上述另一部分，二者均沿第三方向延伸。其中，第一导电连接件280可以为正极导电排，第二导电连接件290可以为负极导电排。
由此，通过设置上述的第一导电连接件280和第二导电连接件290，可以实现电源模块270与电路板110之间的电连接，使电流可以从电源模块270输入电路板110，实现为电路板110的供电。而且，第一导电连接件280和第二导电连接件290的结构简 单，方便布置。
在一种实施方式中，如图9A-图10B所示，壳体210的出风口处设置有出风面板213，出风面板213的边缘处设置有至少一个第二弹性部件，第二弹性部件压紧在出风面板213和壳体210的对应侧壁之间。由此，通过设置上述的第二弹性部件，第二弹性部件可以挤入壳体210内部，从而使出风面板213与壳体210之间的连接更加稳定，避免出风面板213从壳体210上脱落。
在一种实施方式中，出风面板213包括出风主体、相对设置的出风顶板和出风底板、两个出风侧板和第二弯折部。其中，出风主体上形成有多个出风孔，出风顶板和出风底板设置于出风主体的一侧表面，且出风顶板连接于出风主体的上部，出风底板连接于出风主体的下部，两个出风侧板，设置于出风主体的一侧表面，且两个出风侧板分别连接于出风主体的两侧，第二弹性部件设置于两个出风侧板中的至少一个上，第二弯折部连接于出风顶板的背离出风主体的一端，且第二弯折部位于出风顶板和出风底板之间。
示例性地，出风底板和各出风侧板可以均垂直于出风主体。出风顶板连接于出风主体和第二弯折部之间。安装后，工作组件100可以抵接于第二弯折部，这样，使流经第一散热器123和第二散热器124的风能够更好地通过出风孔流出，进一步提升散热效果。
在一个示例中，如图9A和图9B所示，上述至少一个第二弹性部件包括沿第二方向间隔设置的多个第二弹性卡扣214，各第二弹性卡扣214压紧在出风面板213和壳体210的对应侧壁之间。
例如，出风侧板上可以形成有上下间隔排布的多个间隔槽，出风侧板的位于相邻两个间隔槽之间的部分为第二弹性卡扣214。安装时，使两个出风侧板挤入壳体210的对应侧壁，此时多个第二弹性卡扣214产生弹性变形，然后将出风面板213与壳体210通过螺纹紧固件螺纹连接。拆卸时，只需拆下螺纹紧固件，然后将出风面板213拉出，此时多个第二弹性卡扣214恢复原状。
在另一个示例中，上述至少一个第二弹性部件包括沿第二方向延伸的第二导电泡棉215。如此设置，可以在实现出风面板213与壳体210之间的牢靠连接的同时，使出风面板213与壳体210之间可以通过第二导电泡棉215电连接，从而可以起到有效的屏蔽、接地作用，进一步提高电子设备200的安全性。
在一种实施方式中，壳体210的顶部设置有至少一个挡片，挡片与散热器120的位置对应。这样，风扇模块222吹出的风可以均吹向多个散热器120，避免部分风吹入 壳体210顶部的顶壳212内，从而可以增大散热风道内的通风量，避免散热器120上积灰，进一步提升散热效果。
在本说明书的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者多个该特征。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接，还可以是通信；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
上文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，上文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到其各种变化或替换，这些都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种工作组件，适于工作在散热风道中，所述散热风道的入风口到出风口的方向为第一方向，其特征在于，包括：
    电路板；
    散热器，包括散热主体和多个散热翅片，所述散热主体包括相对设置的第一侧面和第二侧面，所述电路板设置于所述散热主体的第一侧面，所述多个散热翅片设置于所述散热主体的第二侧面，所述多个散热翅片沿垂直于所述第一方向的第二方向间隔排布；
    其中，沿所述第一方向，所述散热主体靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘，和/或沿所述第一方向，所述散热翅片靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘。
  2. 根据权利要求1所述的工作组件，其特征在于，在所述散热主体靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘的情况下，沿所述第一方向，所述散热主体的尺寸超过所述电路板的尺寸为10mm～20mm。
  3. 根据权利要求1所述的工作组件，其特征在于，在所述散热翅片靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘的情况下，沿所述第一方向，所述散热翅片的尺寸超过所述电路板的尺寸为10mm～20mm。
  4. 根据权利要求1所述的工作组件，其特征在于，所述电路板包括相对设置的第一侧面和第二侧面，所述电路板的第一侧面上设置有多个发热元器件；所述散热器包括设置于所述电路板的第一侧面的第一散热器，和/或设置于所述电路板的第二侧面的第二散热器。
  5. 根据权利要求4所述的工作组件，其特征在于，沿所述第一方向，所述第一散热器的散热主体和/或散热翅片的靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘；所述第二散热器的散热主体和散热翅片靠近所述出风口的边缘均未超过所述电路板靠近所述出风口的边缘。
  6. 根据权利要求4所述的工作组件，其特征在于，沿所述第一方向，所述第二散热器的散热主体和/或散热翅片的靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘；所述第一散热器的散热主体和散热翅片靠近所述出风口的边缘均未超过所述电路板靠近所述出风口的边缘。
  7. 根据权利要求4所述的工作组件，其特征在于，沿所述第一方向，所述第一散热器的散热主体和/或散热翅片的靠近所述出风口的边缘超过所述电路板靠近所述出风 口的边缘，所述第二散热器的散热主体和/或散热翅片的靠近所述出风口的边缘超过所述电路板靠近所述出风口的边缘。
  8. 根据权利要求1所述的工作组件，其特征在于，所述散热翅片上形成有至少一个凹槽。
  9. 根据权利要求8所述的工作组件，其特征在于，至少一个所述凹槽在所述第二方向和第三方向上贯穿对应的散热翅片，以将对应的散热翅片划分为多个子散热翅片，其中，所述第三方向垂直于所述第一方向和所述第二方向。
  10. 根据权利要求8所述的工作组件，其特征在于，至少一个所述凹槽在所述第二方向和/或第三方向上未穿透对应的散热翅片，其中，所述第三方向垂直于所述第一方向和所述第二方向。
  11. 根据权利要求8所述的工作组件，其特征在于，所述凹槽设置于所述散热翅片的相对于所述散热器长度方向的中心靠近所述出风口的一端。
  12. 根据权利要求8所述的工作组件，其特征在于，所述多个散热翅片均设置有所述凹槽，多个所述凹槽在所述第二方向上形成至少一列凹槽列。
  13. 根据权利要求12所述的工作组件，其特征在于，所述电路板上设置有多个发热元器件，所述多个发热元器件构成沿所述第一方向间隔排布的多个发热列，各所述发热列包括沿所述第二方向间隔设置的多个所述发热元器件，至少一列所述凹槽列与至少一列所述发热列相对设置。
  14. 根据权利要求8所述的工作组件，其特征在于，各所述凹槽在所述第一方向上的尺寸为2.5mm～3.5mm。
  15. 根据权利要求1-14中任一项所述的工作组件，其特征在于，至少一个所述散热翅片包括斜切部，沿所述第一方向，所述斜切部的高度逐渐增加。
  16. 根据权利要求15所述的工作组件，其特征在于，所述斜切部相对于所述散热器的中心靠近所述入风口设置。
  17. 根据权利要求16所述的工作组件，其特征在于，沿所述第一方向，所述电路板在所述斜切部远离所述入风口的端部对应的位置设置有发热元器件。
  18. 根据权利要求16所述的工作组件，其特征在于，沿所述第一方向，所述斜切部远离所述入风口的端部与第三列发热元器件的位置相对应。
  19. 一种电子设备，其特征在于，包括权利要求1至18任一项所述的工作组件。
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