WO2016165504A1 - 机柜和散热系统 - Google Patents

机柜和散热系统 Download PDF

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Publication number
WO2016165504A1
WO2016165504A1 PCT/CN2016/075405 CN2016075405W WO2016165504A1 WO 2016165504 A1 WO2016165504 A1 WO 2016165504A1 CN 2016075405 W CN2016075405 W CN 2016075405W WO 2016165504 A1 WO2016165504 A1 WO 2016165504A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
compartment
server
disposed
Prior art date
Application number
PCT/CN2016/075405
Other languages
English (en)
French (fr)
Inventor
曲中江
池善久
钟杨帆
王晋
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2016165504A1 publication Critical patent/WO2016165504A1/zh
Priority to US15/785,159 priority Critical patent/US10278309B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20181—Filters; Louvers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Definitions

  • the present invention relates to the field of electronic devices, and more particularly to cabinets and heat dissipation systems.
  • general-purpose servers and custom servers generally use air conditioners to dissipate heat in data centers, but cooling air with air conditioners is expensive, resulting in excessive energy consumption in the data center.
  • the PUE value (Power Usage Effectiveness) of traditional data centers is around 2.0, and the energy consumption of air conditioners accounts for about 30% of data center energy. Because the energy consumption of air conditioners accounts for a large proportion of data center energy, There is a need to provide a measure to improve heat dissipation efficiency to reduce the energy consumption of air conditioners, thereby reducing the PUE value of the data center and improving the energy efficiency of the data center.
  • Embodiments of the present invention provide a cabinet and a heat dissipation system, which can improve heat dissipation efficiency, reduce energy consumption, and thereby improve energy use efficiency.
  • a cabinet in a first aspect, includes: a working compartment disposed on one side of the heat dissipation substrate, the work compartment is for accommodating a server; a heat dissipation compartment is disposed on the other side of the heat dissipation substrate, and the heat dissipation compartment is shared with the work compartment
  • the heat dissipation substrate is used as a bulkhead, and the working compartment and the heat dissipation compartment are separated by the heat dissipation substrate, wherein the heat dissipation compartment houses a plurality of heat dissipation fins, and the plurality of heat dissipation fins are connected to the heat dissipation substrate.
  • the heat dissipation substrate is configured to conduct heat generated by the server in the working compartment to the plurality of heat dissipation fins, and an air inlet is disposed on a first side bulkhead of the heat dissipation compartment, and the heat dissipation compartment is An air outlet is disposed on the second bulkhead for allowing natural wind to enter the heat dissipation chamber from the air inlet, and the heat on the plurality of heat dissipating fins is discharged through the air outlet through the plurality of heat dissipating fins.
  • the first bulkhead and the second bulkhead are bulkheads outside the heat dissipation substrate in the heat dissipation compartment.
  • a side of the server chassis connected to the heat dissipation substrate is a heat conductive wall, and the server a heat conducting device is disposed therein, one end of the heat conducting device is connected to the heat conducting wall, and the other end of the heat conducting device is connected to a device of the server, so that heat generated by the device of the server passes through the heat conducting The device and the thermally conductive wall are conducted onto the heat sink substrate.
  • the cabinet further includes: a heat conducting medium disposed on a surface of the heat conducting wall on the side of the working compartment.
  • the server further includes:
  • a first guiding plate disposed on one side of the heat conducting wall and located outside the chassis of the server;
  • a first cam mechanism disposed between the first guide plate and the heat conducting wall
  • a second guiding plate disposed on a side of the second sidewall opposite to the heat conducting wall and located outside the chassis of the server;
  • the first guiding plate, the first cam mechanism and the first wrench are configured to: when the first wrench is set to a first state, the first cam mechanism causes the first guiding plate and the Between the heat conducting walls being separated by a first distance;
  • the first guide plate, the first cam mechanism and the first wrench are further configured to: when the first wrench is set to the second state, the first cam mechanism causes the first guide plate and The heat conducting walls are spaced apart by a second distance, and a difference between the first distance and the second distance is a preset value;
  • the second guiding plate, the second cam mechanism and the second wrench are configured to: when the second wrench is set to the first state, the second cam mechanism causes the second guiding plate And a third distance between the second sidewall;
  • the second guiding plate, the second cam mechanism and the second wrench are further configured to: when the second wrench is set to the second state, the second cam mechanism makes the second guiding A fourth distance is spaced between the board and the second sidewall, and a difference between the third distance and the fourth distance is the preset value.
  • a heat dissipating medium is not disposed on the first region of the surface of the working chamber side, and the first region is provided with a recess for accommodating the first guiding plate, wherein the first region is the An area where the first guide plate contacts the heat dissipation substrate when the server is placed in the work compartment.
  • a fan is disposed in the heat dissipation compartment.
  • the heat dissipation chamber further includes a heat pipe, and one end of the heat pipe The heat pipe is connected to the heat dissipation substrate, and the other end of the heat pipe is connected to the plurality of heat dissipation fins, and the heat pipe is configured to conduct heat on the heat dissipation substrate to the plurality of heat dissipation fins.
  • a venting hole is disposed on a bulkhead other than the heat dissipation substrate in the working compartment, and the working compartment is disposed There is a fan, the fan of the work compartment and the venting opening of the working compartment for discharging at least a portion of the heat in the working compartment through the venting opening.
  • a heat dissipation system for dissipating heat from a server in a data center, the heat dissipation system comprising: at least one of the first aspect or the first to seventh possible implementations It is possible to implement the cabinet; the air supply passage, the inside of the air passage of the air supply passage is isolated from the interior of the data center, and the air inlet of the air supply passage is disposed outside the data center, and the air supply passage is At least one air outlet is respectively connected to the air inlet of the heat dissipation compartment of the at least one cabinet, for allowing natural wind to enter the heat dissipation compartment of the cabinet through the air supply passage; the air exhaust passage, the passage of the air exhaust passage Internally being isolated from the interior of the data center, at least one air inlet of the exhaust passage is respectively connected to an air outlet of the heat dissipation compartment of the at least one cabinet, and an air outlet of the air outlet is disposed outside the data center And passing the natural wind through the heat dissip
  • the heat dissipating system further includes: a filtering device disposed between the air outlet of the air supply passage and the air inlet of the heat dissipation chamber, The natural wind is filtered.
  • the cabinet further includes: a cooling device disposed at an air outlet of the air supply channel The air inlets of the heat dissipation compartment are configured to start to lower the temperature of the natural wind when the temperature of the natural wind is higher than a first preset value.
  • the above technical solution of the present invention is to dissipate heat generated by a server in a work cabin by heat dissipation
  • the substrate is conducted to the heat dissipating fins in the heat dissipation chamber, and the heat on the heat dissipating fins is discharged by the natural wind, which can improve the heat dissipation efficiency, reduce the energy consumption, and further improve the energy use efficiency.
  • FIG. 1 is a schematic plan view of a cabinet in accordance with an embodiment of the present invention.
  • FIG. 2 is a schematic plan view of a cabinet in accordance with another embodiment of the present invention.
  • FIG. 3 is a schematic plan view of the interior of a server in accordance with an embodiment of the present invention.
  • FIG. 4 is a schematic side view of the interior of a server in accordance with an embodiment of the present invention.
  • Figure 5 is a schematic top plan view of a cabinet in accordance with another embodiment of the present invention.
  • Figure 6 is a schematic top plan view of a server in accordance with an embodiment of the present invention.
  • Figure 7 is another schematic top plan view of a server in accordance with an embodiment of the present invention.
  • Figure 8 is a schematic illustration of a thermally conductive wall side of a server in accordance with an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of an open state of two wrenches after a server is inserted into a cabinet according to an embodiment of the invention.
  • FIG. 10 is a schematic diagram of a state in which two wrenches are closed after a server is inserted into a cabinet according to an embodiment of the invention.
  • Figure 11 is a schematic plan view of a heat dissipation system in accordance with an embodiment of the present invention.
  • FIG. 12 is a schematic diagram showing the planning and design of a data center in which a heat dissipation system is located according to an embodiment of the present invention.
  • Figure 13 is a schematic plan view of a heat dissipation system in accordance with another embodiment of the present invention.
  • FIG. 1 is a schematic plan view of a cabinet 100 in accordance with an embodiment of the present invention.
  • the cabinet 100 can be used to dissipate heat from servers in the data center.
  • the cabinet 100 includes a working compartment 120 disposed on one side of the heat dissipation substrate 110, a working compartment 120 for accommodating the server 121, a heat dissipation compartment 130 disposed on the other side of the heat dissipation substrate 110, and a heat dissipation compartment 130 and
  • the heat dissipation substrate 110 is shared by the working space 120 as a bulkhead, and the working space 120 and the heat dissipation chamber 130 are separated by a heat dissipation substrate 110.
  • the heat dissipation chamber 130 houses a plurality of heat dissipation fins 131, and the plurality of heat dissipation fins 131 and the heat dissipation substrate 131 are combined with the heat dissipation substrate 110.
  • the heat dissipation substrate 132 transmits heat generated by the server 121 in the work space 120 to the plurality of heat dissipation fins 131.
  • the first bulkhead of the heat dissipation chamber 130 is provided with an air inlet, and the second bulkhead of the heat dissipation chamber 130 is disposed.
  • the tuyere is configured to allow natural wind to enter the heat dissipation chamber 130 from the air inlet, and exhaust heat from the plurality of heat dissipation fins through the air outlet after passing through the plurality of heat dissipation fins.
  • the heat conducting device 123 may include a heat pipe having thermal conductivity.
  • first bulkhead and the second bulkhead are bulkheads outside the heat dissipation substrate 110 in the heat dissipation compartment 130.
  • the first bulkhead and the second bulkhead may be bulkheads on the same side or bulkheads on different sides. That is to say, the air inlet and the air outlet cannot be disposed on the heat dissipation substrate 110 between the work space 120 and the heat dissipation chamber 130, and the heat dissipation chamber 130 and the work space 120 are isolated by the heat dissipation substrate 110.
  • natural wind refers to wind in the natural environment outside (such as outside the data center).
  • the heat generated by the server in the working cabin is transmitted to the heat dissipating fins in the heat dissipation chamber through the heat dissipation substrate, and the heat on the heat dissipating fins is discharged by the natural wind, thereby improving heat dissipation efficiency and reducing energy consumption. Thereby improving energy efficiency.
  • FIG. 1 only the relative positional relationship between the plurality of heat dissipating fins 131 and the heat dissipating substrate 110 is shown in FIG. 1 , and in the actual application scenario, a plurality of heat dissipating fins 131 may be disposed according to the air duct design of the cabinet 100 .
  • the arrangement on the substrate 110 For example, the air passage formed by the adjacent heat radiating fins 131 and the heat dissipation substrate 110 shown in FIG. 1 may be perpendicular to the paper surface direction or the vertical direction.
  • the heat dissipation compartment 130 is sealed from the working compartment 120 and the data center.
  • the air inlet of the heat dissipation compartment 130 is connected to the air supply passage, and the air outlet of the heat dissipation compartment 130 is connected with the air exhaust passage, so that the airflow in the heat dissipation compartment 130 can be ensured. Enter the workspace 120 and the data center where the cabinet 100 is located. Even if the natural air quality is poor, it will not degrade the reliability of the server.
  • the maintenance server is usually carried out in the work compartment, making maintenance easier. Moreover, there is no impact on the sealing of the radiator compartment during maintenance.
  • the hermetic design of this cooling compartment is also relatively easy to implement.
  • the side of the chassis of the server 121 connected to the heat dissipation substrate 110 is a heat conductive wall 122, and the heat dissipation device 123 is disposed in the server 121, and the heat conduction device is disposed.
  • One end of the 123 is connected to the heat conducting wall 122, and the other end of the heat conducting device 123 is connected to the device of the server 121 so that the heat generated by the device of the server 121 is conducted to the heat radiating substrate through the heat conducting device 123 and the heat conducting wall 122.
  • the heat conductive wall 122 may be an aluminum plate or an aluminum profile of 5 to 10 mm.
  • the embodiment of the present invention does not limit the arrangement of the heat conducting device 123 and the server 121, and the heat conducting device 123 can be connected to a large power consumption device (such as a CPU and a memory) inside the server 121.
  • a large power consumption device such as a CPU and a memory
  • the cabinet 100 may further include: a heat conductive medium 140 disposed on a surface of the heat dissipation substrate 110 on the side of the work space 120.
  • the surface of the heat dissipation substrate 110 on the side of the working compartment 120 may be filled with a heat conductive medium.
  • a heat conductive gasket with a single surface is attached on the surface of the heat dissipation substrate 110 on the side of the work space 120 for maintenance.
  • the heat dissipating fins 131 are aluminum profile heat dissipating fins or solder fins. It should be understood that the heat dissipating fins 131 may also be heat dissipating fins of other materials, which are not limited in the embodiment of the present invention.
  • a fan 132 is disposed in the heat dissipation compartment 130.
  • the fan in the cooling compartment can speed up the flow of air in the cooling compartment and improve the heat dissipation efficiency.
  • the embodiment of the present invention does not limit the number of fans and the installation position in the heat dissipation compartment.
  • One or more fans may be disposed in the heat dissipation compartment 130, and the one or more fans may be installed on either side of the heat dissipation fins 131, or Mounted on both sides of the heat dissipating fins 131.
  • a venting hole is disposed in a bulkhead outside the heat dissipation substrate 110 in the working compartment 120, and a fan 124 is disposed in the working compartment 120, and the fan of the working compartment 120 and the venting hole of the working compartment 120 are used to heat at least part of the heat in the working compartment 120.
  • the work compartment is discharged through the vents.
  • most of the heat in the working compartment 120 is conducted to the heat dissipation compartment through the thermal pad, and the remaining heat in the working compartment 120 can be dissipated through the air conditioner.
  • the air can be supplied through the floor of the data center where the cabinet 100 is located. The ceiling returns to the heat.
  • the heat transfer device 123 in the server 121 will be described in detail below with reference to FIGS. 3 and 4.
  • the thermal device 123 may include a CPU thermally conductive substrate 123a and a heat pipe 123b.
  • the heat pipe 123b is connected to the heat transfer wall 122, and the CPU heat conductive substrate 123a is in contact with the heat pipe 123b and the CPU 125, so that the heat of the CPU chip 125 is conducted to the heat transfer wall 122 through the heat conductive substrate 123a and the heat pipe 123b.
  • the 126 shown in Figure 3 can be a memory heat sink.
  • Other units or modules in the server such as a hard disk or a power source, may be disposed in the dotted line box on the right side of the server 121 as shown in FIG.
  • the heat conducting device 123 may further include a heat conducting plate 123c disposed above the memory heat sink 126.
  • the heat pipe 123b may further be disposed above the heat conducting plate 123c to conduct heat generated by the memory to the heat conducting wall 122 through the memory heat sink 126 and the heat pipe 123b.
  • the heat conducting plate 123c may be a heat conducting aluminum plate or a heat conducting plate of other materials.
  • a thermal pad may be disposed between the memory heat sink 126 and the heat conducting plate 123c to further improve the heat conduction efficiency.
  • FIGS. 3 and 4 only show an implementation of a possible heat conducting device 123, and those skilled in the art will appreciate that other implementations of the heat conducting device inside the server fall within the embodiment of the present invention. Within the scope of protection.
  • the inside of the server in the embodiment of the present invention conducts heat generated by each component inside the server through the heat pipe, the memory heat sink and the heat conducting plate, instead of conducting heat through the liquid loop, liquid leakage can be avoided. The reliability risk brought by the server.
  • FIG. 5 is a schematic plan view of a cabinet in accordance with another embodiment of the present invention.
  • the cabinet shown in Figure 5 is an example of the cabinet shown in Figures 1 and 2.
  • 133a and 133b may respectively be the front door and the rear door of the heat dissipation compartment 130, and the front door 133a and the rear door 133b of the heat dissipation compartment 130 are sealed and isolated to prevent the airflow of the heat dissipation compartment 130 from being crosstalked to the outside of the heat dissipation compartment.
  • a fan 132 is disposed on one side of the heat dissipating fin 131. The fan 132 introduces the natural wind in the external environment into the heat dissipation chamber 130 through the air supply passage of the data center of the cabinet 100. After the natural wind passes through the heat dissipating fins 131, the data center passes through the data center.
  • the exhaust ducts are routed outside the data center.
  • the heat dissipation substrate 110 shown in FIG. 5 is equal in length to the server 121.
  • the heat dissipation chamber 130 may be further provided with a sealing partition 134a and a sealing partition 134b to prevent airflow in the heat dissipation chamber 130 from being crosstalked to the working compartment 120.
  • the heat dissipation substrate 110 may also extend to both ends in the vertical direction shown in FIG. 5 to the positions of the sealing spacers 134a and 134b shown in FIG.
  • 127a and 127b are the front door and the rear door of the work compartment 120, respectively, the front door 127a is provided with a vent hole, and the rear door 127b side is provided with a fan, and most of the heat in the work space 120 is conducted to the heat radiating fin 131 of the heat dissipation chamber 130 through the heat dissipation substrate 130. The remaining part of the heat is discharged to the machine room through the ventilation hole of the front door 127a by using the fan 124. Air conditioning and cooling.
  • Fig. 5 shows that natural wind enters from the front door 133a of the heat dissipation compartment 130 and is discharged from the rear door 133b. It should be understood that natural wind may also enter from the rear door 133b of the radiator compartment 130 and be discharged from the front door 133a.
  • FIG. 5 is intended to help those skilled in the art to better understand the embodiments of the present invention and not to limit the scope of the embodiments of the present invention.
  • a person skilled in the art will be able to make various modifications or changes in the embodiments according to the example of FIG. 5, and such modifications or variations are also within the scope of the embodiments of the present invention.
  • the embodiment of the present invention does not limit the connection manner of the heat dissipating fins and the heat dissipating substrate.
  • the heat dissipating fins may be connected to the heat dissipating substrate by soldering, or the heat dissipating fins may be connected to the heat dissipating substrate by using specific components.
  • the heat dissipation chamber 130 may further include a heat pipe 135.
  • One end of the heat pipe 135 is connected to the heat dissipation substrate 110, and the other end of the heat pipe 135 is connected to the plurality of heat dissipation fins 131, and the heat pipe 135 is used for heat dissipation.
  • the heat on the substrate 110 is conducted to the plurality of heat dissipating fins 131.
  • one end of the heat pipe 135 may be soldered on the heat dissipation substrate 110, and may be connected to the heat dissipation substrate 110 through other connection elements.
  • the plurality of heat dissipating fins 131 may be perforated, and the other end of the heat pipe 135 may connect the plurality of heat dissipating fins 131 through the holes of the plurality of heat dissipating fins 131.
  • the heat pipe 135 can also connect the plurality of heat dissipating fins 131 in other manners, which is not limited in the embodiment of the present invention.
  • FIG. 1 to FIG. 5 only show the case where the working compartment 120 is located on the right side of the heat dissipation compartment 130, and the working compartment 120 may also be located on the left side of the heat dissipation compartment 130, which is not limited by the embodiment of the present invention.
  • FIG. 6 and 7 are schematic plan views of the server 121, respectively.
  • the server 121 may further include:
  • the first guiding plate 128a is disposed on one side of the heat conducting wall 122 and located outside the chassis of the server 121;
  • the first cam mechanism 128b is disposed between the first guiding plate 128a and the heat conducting wall 122;
  • the second guiding plate 129a is disposed on a side of the second sidewall opposite to the heat conducting wall 122 and located outside the chassis of the server 121;
  • a second cam mechanism 129b disposed between the second guide plate 129a and the second side wall;
  • the first wrench 128c and the second wrench 129c are respectively connected to the first cam mechanism 128b and the second cam mechanism 129b;
  • the first guiding plate 128a, the first cam mechanism 128b and the first wrench 128c are used when the first wrench When the hand 128c is set to the first state, the first cam mechanism 128b is such that the first guiding plate 128a and the heat conducting wall 122 are separated by a first distance L1;
  • the first guiding plate 128a, the first cam mechanism 128b and the first wrench 128c are further configured to: when the first wrench 128c is set to the second state, the first cam mechanism 128b spaces the first guiding plate 128a and the heat conducting wall 122 a second distance L2, a difference between the first distance L1 and the second distance L2 is a preset value;
  • the second guide plate 129a, the second cam mechanism 129b, and the second wrench 129c are configured to allow the second guide mechanism 129a and the second side wall to be spaced apart when the second wrench 129c is set to the first state.
  • the second guiding plate 129a, the second cam mechanism 129b and the second wrench 129c are further configured to: when the second wrench 129c is set to the second state, the second cam mechanism 129b is between the second guiding plate 129a and the second side wall
  • the fourth distance R2 is spaced apart, and the difference between the third distance R1 and the fourth distance R2 is a preset value.
  • the first state can be an open state and the second state can be a closed state.
  • Figure 6 is a schematic plan view of the server 121 when the two wrenches 128c and 129c are in an open state.
  • Fig. 7 is a schematic plan view of the server 121 when the two wrenches 128c and 129c are in a closed state.
  • the height of the first guide plate 128a and the second guide plate 129a is smaller than the height of the side wall of the server 121, as shown in FIG. 8, and
  • FIG. 8 is a view of the heat transfer wall 122 side of the server 121.
  • a connecting rod is disposed between the cam mechanism and the wrench, and a spring is disposed between the guiding plate and the side wall of the chassis.
  • Figure 9 is a schematic front elevational view of the two wrenches 128c and 129c in the open state after the server 121 is inserted into the work compartment 120.
  • the two wrenches 128c and 129c are opened, the server 121 is inserted into the working compartment 120, and the server 121 is inserted into the working compartment 120 under the guiding action of the left and right guiding plates 128a and 129a.
  • the left guiding plate 128a is designed such that the heat conducting wall 122 and the heat conducting substrate 110 are thermally lining.
  • X predetermined distance
  • the heat-dissipating substrate 110 is not disposed on the first region of the surface on the side of the working compartment 120, and the first region is provided with a recess for accommodating the first guiding plate 128a, wherein the first region is the server 121 The area where the first guide plate 128a contacts the heat dissipation substrate 110 when entering the work space 120.
  • the place corresponding to the guide plate 128a is not provided with a thermal pad, the same
  • the groove on the heat dissipation substrate 110 is partially grooved in contact with the guide plate 128a.
  • FIG. 10 is a schematic plan view showing the two wrenches 128c and 129c after the server 121 is inserted into the work compartment 120. It should be noted that, during maintenance, the right wrench 128c is first opened, the right guide 129a is reduced to the left by a predetermined distance, and then the left wrench 128c is opened.
  • the entire server 121 Under the action of the left wrench 128c and the cam mechanism 128b, the entire server 121 The predetermined distance is shifted to the right such that the thermally conductive wall 122 is spaced from the thermal pad 140 by a predetermined distance, and then the server 121 is removed from the work space 120, thereby preventing the thermal pad 140 from being destroyed when the server 121 is withdrawn.
  • the server of the embodiment of the present invention can be detached or pressed from the heat conducting wall of the server and the heat dissipating substrate without ensuring damage to the thermal conductive pad by sequentially opening and closing the wrench.
  • the heat generated by the server in the working cabin is transmitted to the heat dissipating fins in the heat dissipation chamber through the heat dissipation substrate, and the heat on the heat dissipating fins is discharged by the natural wind, thereby improving heat dissipation efficiency and reducing energy consumption. Thereby improving energy efficiency.
  • the present invention also provides a heat dissipation system 1100.
  • the heat dissipation system 1100 includes: at least one cabinet 100 including a working compartment 120 and a heat dissipation compartment 130; a ventilation duct 150 and an exhaust duct 151.
  • the inside of the channel of the air supply channel 150 is isolated from the interior of the data center, and the air inlet of the air supply channel 150 is disposed outside the data center, and at least one air outlet of the air supply channel 150 and the heat dissipation compartment of at least one cabinet 100
  • the air inlets are connected to allow natural wind to enter the heat dissipation compartment of the cabinet 100 through the air supply passage 150.
  • the inside of the passage of the exhaust duct 151 is isolated from the inside of the data center, and at least one air inlet of the exhaust duct 151 is connected to the air outlet of the heat sink of at least one cabinet 100, and the air outlet of the exhaust duct 151 is disposed outside the data center. After the natural wind passes through the heat dissipating fins inside the heat dissipation chamber, the data center is discharged through the exhaust passage 151.
  • the insides of the air supply channel 150 and the air exhaust channel 151 are respectively isolated from the inside of the data center, which can ensure that the natural wind does not enter the data center, thereby preventing the natural wind from the outside from affecting the reliability of the data center.
  • the natural wind is sent to the heat dissipation compartment of the cabinet inside the data center through the air supply passage, and the natural wind passes through the heat dissipation cabin to dissipate the heat dissipation fins, and then is discharged through the exhaust passage. Outside the data center.
  • the heat dissipation system of the embodiment of the present invention uses the natural wind sent by the air supply passage to dissipate heat, thereby reducing the energy consumption of the data center air conditioner, thereby improving the energy use efficiency of the data center.
  • FIG. 12 is a schematic diagram showing the planning and design of a data center in which the heat dissipation system 1100 is located according to an embodiment of the present invention.
  • 12 is a top view of the data center.
  • the data center can accommodate a plurality of cabinets 100.
  • the plurality of cabinets 100 can be placed side by side.
  • the heat dissipation compartment 130 of the cabinet 100 can be disposed on the left side of the working compartment 120, and the air supply passage is provided.
  • the 150 and the exhaust duct 151 can supply and exhaust air to each row of cabinets.
  • the air supply passage 150 and the exhaust air passage 151 may be disposed between the top of the cabinet and the ceiling, as shown in FIG. 11, 200 is a ceiling, and 210 is a floor.
  • the air supply passage 150 sends the natural cold air to the inside of the data center and distributes between the cabinets 100.
  • the natural air-cooled air enters through the air inlet of the heat dissipation chamber 130, and passes through the heat dissipation fins in the heat dissipation chamber 130 of the cabinet 100.
  • Hot air exits the air outlet of the heat sink compartment 130 and is discharged to the outside of the data center via the exhaust duct 151.
  • At least part of the heat of the working compartment 120 can be dissipated by the air conditioner, and the cold air is blown through the floor. After passing through the working compartment 120, the hot air enters the air conditioner from the ceiling to complete a cycle.
  • heat sink 130 of the cabinet may also be disposed on the right side of the work space 120. It should also be understood that the dimensional ratio of the heat dissipation compartment 130 and the work compartment 120 shown in FIG. 12 can be specifically set according to actual needs.
  • FIG. 11 and FIG. 12 are intended to help those skilled in the art to better understand the embodiments of the present invention and not to limit the scope of the embodiments of the present invention.
  • a person skilled in the art will be able to make various modifications or changes in the embodiments according to the examples given, and such modifications or variations are also within the scope of the embodiments of the invention.
  • a switch 152 is disposed at a connection between the air inlet of the heat dissipation chamber 130 and the air supply passage 150, and a switch 153 is disposed at a connection between the air outlet of the heat dissipation chamber and the air outlet passage 150.
  • the switch 152 and the switch 153 are turned on.
  • the switch 152 and the switch 153 can be turned off.
  • the heat dissipation system 1100 can still operate normally while the server 121 is being maintained, without having to turn off the switch 152 and the switch 153.
  • the heat dissipation system 1100 may further include a filtering device 160 disposed between the air outlet of the air supply passage 150 and the air inlet of the heat dissipation chamber 130 for filtering natural wind.
  • the heat dissipation system 1100 may further include a cooling device 170, and the cooling device 170 is disposed at Between the air outlet of the air supply passage 150 and the air inlet of the heat dissipation chamber 130, it is set to start to lower the temperature of the natural wind when the temperature of the natural wind is higher than the first preset value.
  • the cooling device 170 can be a spray cooling device.
  • spray cooling is turned on to lower the temperature of the natural wind.
  • the heat dissipation system 1100 may further include a guiding device disposed between the air supply passage 150 and the exhaust air passage 151, and configured to make the air exhaust passage 151 if the temperature of the natural wind is lower than a second preset value.
  • a part of the discharged hot air is returned to the air supply passage 150 to increase the temperature of the natural wind.
  • the guiding device can return at least part of the hot air to the air supply passage to increase the temperature of the natural wind.
  • the guiding device may be a return conduit, one end of the return conduit is in communication with the air supply passage 150, and the other end of the return conduit is in communication with the exhaust passage 151.
  • the exhaust passage 151 is in communication with the supply passage 150, and a switch is provided at a position where the exhaust passage 151 communicates with the supply passage 150, such as the switch 154 and the switch 155 shown in FIG.
  • the switch 154 and the switch 155 are arranged to be in a closed state in a normal working state, and the cold air introduced from the outside of the data center of the air supply passage 150 enters the heat dissipation chamber 130, and the hot air discharged from the heat dissipation chamber 130 is discharged to the data center through the exhaust passage 151, and is sent.
  • the cold air in the air passage 150 and the hot air in the exhaust passage 151 do not flow with each other; when the natural air temperature introduced from outside the data center is lower than the second preset value, the air supply passage 150 is in an open state, so that the exhaust air is exhausted. At least a portion of the hot air in the passage 151 flows back into the air supply passage 150 to increase the temperature of the natural wind.
  • the switch 154 and the switch 155 are in a closed state.
  • the heat dissipation system of the embodiment of the present invention uses the natural wind sent by the air supply passage to dissipate heat from the heat dissipation compartment of the cabinet, thereby reducing the energy consumption of the data center air conditioner, thereby improving the energy efficiency of the data center. Moreover, reduced air conditioning energy consumption can reduce infrastructure costs in the data center.
  • the filtering device, the cooling device, and the guiding device to process the natural wind sent by the air supply passage, the heat dissipation efficiency can be enhanced, and the reliability of the heat dissipation system can be enhanced.
  • a particular component when it is described that a particular component is located between the first component and the second component, there may be an intervening component between the particular component and the first component or the second component, or there may be no intervening component;
  • the particular component when a particular component is connected to other components, the particular component can be directly connected to the other component without the intervening component, or can be directly connected to the other component without having the intervening component.

Abstract

本发明实施例提供了一种机柜和散热系统。该机柜包括：工作舱，设置在散热基板的一侧，工作舱用于容纳服务器；散热舱，设置在散热基板的另一侧，散热舱与工作舱共用散热基板作为舱壁，工作舱和散热舱之间通过散热基板进行隔离，散热舱内容纳多个散热翅片，多个散热翅片与散热基板相连接，散热基板用于将工作舱内的服务器产生的热量传导到多个散热翅片上，散热舱的第一侧舱壁上设置进风口，散热舱的第二侧舱壁上设置出风口，用于使自然风从进风口进入散热舱，经过多个散热翅片后通过出风口将多个散热翅片上的热量排出，其中第一侧舱壁和第二侧舱壁为散热舱内散热基板之外的舱壁。本发明实施例的机柜利用自然风对服务器进行散热，能够提高散热效率，减少能耗，进而能够提高能源使用效率。

Description

机柜和散热系统
本申请要求于2015年04月17日提交中国专利局、申请号为201510185495.4、发明名称为“机柜和散热系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子设备领域，尤其涉及机柜和散热系统。
背景技术
目前通用服务器和定制服务器在数据中心中一般用空调散热，但用空调冷却空气是昂贵的，会导致数据中心的能耗过高。目前一般传统数据中心的PUE值(Power Usage Effectiveness，能源使用效率指标)在2.0左右，空调的耗能占数据中心能源的30％左右，由于空调的耗能占数据中心能源的比重较大，因此需要提供一种措施来提高散热效率，以减少空调的能耗，进而降低数据中心的PUE值，提高数据中心的能源使用效率。
发明内容
本发明实施例提供一种机柜和散热系统，能够提高散热效率，减少能耗，进而提高能源使用效率。
第一方面，提供了一种机柜。该机柜包括：工作舱，设置在散热基板的一侧，所述工作舱用于容纳服务器；散热舱，设置在所述散热基板的另一侧，所述散热舱与所述工作舱共用所述散热基板作为舱壁，所述工作舱和所述散热舱通过所述散热基板相隔离，所述散热舱内容纳多个散热翅片，所述多个散热翅片与所述散热基板相连接，所述散热基板用于将所述工作舱内的所述服务器产生的热量传导到所述多个散热翅片上，所述散热舱的第一侧舱壁上设置进风口，所述散热舱的第二舱壁上设置出风口，用于使自然风从所述进风口进入所述散热舱，经过所述多个散热翅片后通过所述出风口将所述多个散热翅片上的热量排出，其中所述第一舱壁和所述第二舱壁为所述散热舱内所述散热基板之外的舱壁。
结合第一方面，在第一种可能的实现方式中，在所述工作舱中容纳有所述服务器时，所述服务器的机箱与所述散热基板相连接的一侧为导热壁，所述服务器内设置有导热装置，所述导热装置的一端与所述导热壁相连接，所述导热装置的另一端与所述服务器的器件相连接，以使所述服务器的器件产生的热量通过所述导热装置和所述导热壁传导到所述散热基板上。
结合第一方面或第一种可能的实现方式，在第二种可能的实现方式中，该机柜还包括：导热介质，设置在所述导热壁位于所述工作舱侧的表面上。
结合第一种或第二种可能的实现方式，在第三种可能的实现方式中，所述服务器还包括：
第一导向板，设置在所述导热壁的一侧，且位于所述服务器的机箱外；
第一凸轮机构，设置在所述第一导向板与所述导热壁之间；
第二导向板，设置在与所述导热壁正对的第二侧壁的一侧，且位于所述服务器的机箱外；
第二凸轮机构，设置在所述第二导向板与所述第二侧舱壁之间；
第一扳手和第二扳手，分别与所述第一凸轮机构和所述第二凸轮机构相连接；
所述第一导向板、所述第一凸轮机构和所述第一扳手用于，当所述第一扳手设置为第一状态时，所述第一凸轮机构使得所述第一导向板和所述导热壁之间间隔第一距离；
所述第一导向板、所述第一凸轮机构和所述第一扳手还用于，当所述第一扳手设置为第二状态时，所述第一凸轮机构使得所述第一导向板和所述导热壁之间间隔第二距离，所述第一距离与所述第二距离之间的差值为预设值；
所述第二导向板、所述第二凸轮机构和所述第二扳手用于，当所述第二扳手设置为所述第一状态时，所述第二凸轮机构使得所述第二导向板和所述第二侧壁之间间隔第三距离；
所述第二导向板、所述第二凸轮机构和所述第二扳手还用于，当所述第二扳手设置为所述第二状态时，所述第二凸轮机构使得所述第二导向板和所述第二侧壁之间间隔第四距离，所述第三距离与所述第四距离之间的差值为所述预设值。
结合第二种或第三种可能的实现方式，在第四种可能的实现方式中，所 述散热基板位于所述工作舱侧的表面的第一区域上不设置导热介质，且所述第一区域设置有凹槽用于容纳所述第一导向板，其中所述第一区域为所述服务器放入所述工作舱时所述第一导向板与所述散热基板接触的区域。
结合第一方面或第一种至第四种可能的实现方式中的任一种可能的实现方式，在第五种可能的实现方式中，所述散热舱内设置有风扇。
结合第一方面或第一种至第五种可能的实现方式中的任一种可能的实现方式，在第六种可能的实现方式中，所述散热舱内还包括热管，所述热管的一端与所述散热基板相连接，所述热管的另一端与所述多个散热翅片相连接，所述热管用于将所述散热基板上的热量传导至所述多个散热翅片上。
结合第一方面或上述任一种可能的实现方式，在第七种可能的实现方式中，所述工作舱内所述散热基板之外的舱壁上设置有通风孔，所述工作舱内设置有风扇，所述工作舱的风扇以及所述工作舱的通风孔用于将所述工作舱内的至少部分热量通过所述通风孔排出所述工作舱。
第二方面，提供了一种散热系统，用于对数据中心的服务器进行散热，所述散热系统包括：至少一个如第一方面或第一种至第七种可能的实现方式中的任一种可能的实现所述的机柜；送风通道，所述送风通道的通道内部与所述数据中心的内部隔离，所述送风通道的进风口设置在所述数据中心外，所述送风通道的至少一个出风口分别与所述至少一个机柜的散热舱的进风口连通，用于使自然风通过所述送风通道进入所述机柜的散热舱；排风通道，所述排风通道的通道内部与所述数据中心的内部隔离，所述排风通道的至少一个进风口分别与所述至少一个机柜的散热舱的出风口连通，所述排风通道的出风口设置在所述数据中心外，用于使所述自然风经过所述散热舱内的散热翅片后通过所述排风通道排出所述数据中心。
结合第二方面，在第二方面的第一种可能的实现方式中，该散热系统还包括：过滤装置，设置在所述送风通道的出风口与所述散热舱的进风口之间，用于对所述自然风进行过滤。
结合第二方面或第二方面的第一种可能的实现方式，在第二方面的第二种可能的实现方式中，该机柜还包括：冷却装置，设置在所述送风通道的出风口与所述散热舱的进风口之间，用于在自然风的温度高于第一预设值的情况下启动以降低所述自然风的温度。
本发明的上述技术方案，通过将工作舱内的服务器产生的热量通过散热 基板传导到散热舱内的散热翅片上，利用自然风将散热翅片上的热量排出，能够提高散热效率，减少能耗，进而提高能源使用效率。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对本发明实施例中所需要使用的附图作简单地介绍，显而易见地，下面所描述的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是根据本发明实施例的机柜的示意性平面图。
图2是根据本发明另一实施例的机柜的示意性平面图。
图3是根据本发明实施例的服务器内部的示意性平面图。
图4是根据本发明实施例的服务器内部的示意性侧视图。
图5是根据本发明另一实施例的机柜的示意性俯视图。
图6是根据本发明实施例的服务器的示意性俯视图。
图7是根据本发明实施例的服务器的另一示意性俯视图。
图8是根据本发明实施例的服务器的导热壁侧的示意图。
图9是根据本发明实施例的服务器插入机柜后两扳手打开状态的示意图。
图10是根据本发明实施例的服务器插入机柜后两扳手关闭状态的示意图。
图11是根据本发明实施例的散热系统的示意性平面图。
图12是根据本发明实施例的散热系统所在的数据中心的规划设计示意图。
图13是根据本发明另一实施例的散热系统的示意性平面图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本发明保护的范围。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、 “第三”和“第四”等是用于区别不同对象，而不是用于描述特定顺序。
图1是根据本发明实施例的机柜100的示意性平面图。机柜100可以用于对数据中心的服务器进行散热。如图1所示，机柜100包括：工作舱120，设置在散热基板110的一侧，工作舱120用于容纳服务器121；散热舱130，设置在散热基板110的另一侧，散热舱130与工作舱120共用散热基板110作为舱壁，工作舱120和散热舱130之间通过散热基板110进行隔离，散热舱130内容纳多个散热翅片131，多个散热翅片131与散热基板110相连接，散热基板132将工作舱120内的服务器121产生的热量传导到多个散热翅片131上，散热舱130的第一舱壁上设置进风口，散热舱130的第二舱壁上设置出风口，用于使自然风从进风口进入散热舱130，经过多个散热翅片后通过出风口将所述多个散热翅片上的热量排出。其中,导热装置123可以包括具有导热性能的热管。
其中，第一舱壁和第二舱壁是散热舱130内散热基板110之外的舱壁。第一舱壁和第二舱壁可以是同一侧的舱壁，也可以是不同侧的舱壁。也就是说，进风口和出风口不能设置在工作舱120与散热舱130之间的散热基板110上，散热舱130和工作舱120通过散热基板110进行隔离。
当机柜110放置在室内(如数据中心内)时，自然风指的是室外(如数据中心外)的自然环境中的风。
本发明实施例的机柜，通过将工作舱内的服务器产生的热量通过散热基板传导到散热舱内的散热翅片上，利用自然风将散热翅片上的热量排出，能够提高散热效率，减少能耗，进而提高能源使用效率。
需要说明的是，图1中仅示出了多个散热翅片131与散热基板110的相对位置关系，可以在实际应用场景中根据机柜100的风道设计来设置多个散热翅片131在散热基板110上的排列方式。例如，图1所示的相邻散热翅片131与散热基板110形成的风道可以沿着垂直于纸面方向或竖直方向。
散热舱130与工作舱120和数据中心密封隔离，散热舱130的进风口与送风通道相连通，散热舱130的出风口与排风通道相连通，这样能够保证散热舱130中的气流不会进入工作舱120以及机柜100所在的数据中心内。即使自然风的空气质量较差，也不会使服务器可靠性降低。
由于工作舱和散热舱是相互独立的，平时维护服务器只需在工作舱内进行，使得维护更加方便。而且进行维护时也不会对散热舱的密封有影响，因 此散热舱的密封性设计也比较容易实现。
可选地，如图2所示，在工作舱120中容纳有服务器121时，服务器121的机箱与散热基板110相连接的一侧为导热壁122，服务器121内设置有导热装置123，导热装置123的一端与导热壁122相连接，导热装置123的另一端与服务器121的器件相连接，以使服务器121的器件产生的热量通过导热装置123和导热壁122传导到所述散热基板上。
例如，导热壁122可以为5～10mm的铝板或铝型材。
应理解，本发明实施例对导热装置123和服务器121的设置方式不做限定，导热装置123可以与服务器121内部的大功耗器件(例如CPU、内存)相连接。
可选地，如图2所示，机柜100还可以包括：导热介质140，设置在散热基板110位于工作舱120侧的表面上。
具体可以在散热基板110位于工作舱120侧的表面上填充导热介质，例如在散热基板110位于工作舱120侧的表面上贴有单面粘性的导热衬垫，以便于维护。
可选地，散热翅片131为铝型材散热翅片或焊接散热翅片。应理解，散热翅片131还可以为其他材料的散热翅片，本发明实施例对此不做限定。
可选地，如图2所示，散热舱130内设置有风扇132。散热舱内的风扇可以加快散热舱中空气的流动，提高散热效率。本发明实施例对散热舱中风扇的数量和安装位置不做限定，散热舱130中可以设置有一个或多个风扇，该一个或多个风扇可以安装在散热翅片131的任意一侧，或者安装在散热翅片131的两侧。
工作舱120内散热基板110之外的舱壁上设置有通风孔，工作舱120内设置有风扇124，工作舱120的风扇以及工作舱120的通风孔用于将工作舱120内的至少部分热量通过通风孔排出工作舱。
本发明实施例中，工作舱120中的大部分热量通过导热垫传导至散热舱中，工作舱120中的剩余热量可通过空调器散热，例如，可以通过机柜100所在数据中心的地板送风和天花板回风散热。
下面结合图3和图4详细描述根据本发明实施例的服务器121内的导热装置123。
图3是根据本发明实施例的服务器内部的示意性平面图。如图3所示导 热装置123可以包括CPU导热基板123a和热管123b。热管123b与导热壁122相连接，CPU导热基板123a与热管123b和CPU 125接触，使CPU芯片125的热量通过导热基板123a和热管123b传导至导热壁122。图3中所示126可以为内存散热器。如图3所示服务器121右侧虚线框内可以设置服务器内的其他单元或模块，例如硬盘或电源等。
图4是根据本发明实施例的服务器内部的示意性侧视图。导热装置123还可以包括设置在内存散热器126上方的导热板123c，导热板123c上方还可以设置热管123b，以使内存产生的热量通过内存散热器126、热管123b传导到导热壁122上。其中，导热板123c可以是导热铝板，还可以是其他材料的导热板。在内存散热器126与导热板123c之间还可以设置导热垫，以进一步提高导热效率。
为了描述方便，图3和图4仅示出了一种可能的导热装置123的实现方式，本领域技术人员应理解的是，服务器内部的导热装置的其他实现方式均落入本发明的实施例的保护范围之内。
由于本发明实施例中的服务器内部通过设置热管、内存散热器和导热板将服务器内部的各个元器件产生的热量传导导热壁上，而非通过设置液体环路传导热量，因此能够避免液体泄露对服务器带来的可靠性风险。
图5是本发明另一实施例的机柜的示意性俯视图。图5所示机柜是图1和图2所示机柜的例子。
如图5所示，133a和133b可以分别为散热舱130的前门和后门，散热舱130的前门133a和后门133b均进行密封隔离处理，避免散热舱130的气流串扰到散热舱外面。散热翅片131的一侧装有风扇132，风扇132通过机柜100所在数据中心的送风通道将外部环境中的自然风引入到散热舱130内，自然风通过散热翅片131后，经过数据中心的排风通道排到数据中心外面。图5所示散热基板110与服务器121的长度相等，此时散热舱130内部还可以设置有密封隔板134a和密封隔板134b，避免散热舱130内的气流串扰到工作舱120。应理解，散热基板110也可以在图5所示的竖直方向上向两端延伸到图5所示密封隔板134a和134b的位置。127a和127b分别为工作舱120的前门和后门，前门127a上设置有通风孔，后门127b侧设置有风扇，工作舱120内的大部分热量通过散热基板传导到散热舱130的散热翅片131上，剩余部分热量使用风扇124通过前门127a的通风孔排到机房中，通 过空调制冷散热。
图5示出了自然风从散热舱130的前门133a进入，从后门133b排出。应理解，自然风也可以从散热舱130的后门133b进入，从前门133a排出。
应注意，图5的这个例子是为了帮助本领域技术人员更好地理解本发明实施例，而非要限制本发明实施例的范围。本领域技术人员根据所给出的图5的例子，显然可以进行各种等价的修改或变化，这样的修改或变化也落入本发明实施例的范围内。
本发明实施例对散热翅片与散热基板的连接方式不做限定。例如，可以采用焊接的方式将散热翅片与散热基板连接起来，也可以采用特定部件将散热翅片与散热基板连接起来。
例如，如图5所示，散热舱130内还可以包括热管135，热管135的一端与散热基板110相连接，热管135的另一端与多个散热翅片131相连接，热管135用于将散热基板110上的热量传导至多个散热翅片131上。
例如，热管135的一端可以焊接在散热基板110上，还可以通过其他连接元件连接在散热基板110上。多个散热翅片131上可以打孔，热管135的另一端可以穿过多个散热翅片131的孔将该多个散热翅片131连接起来。热管135还可以通过其他方式将多个散热翅片131连接起来，本发明实施例对此不做限定。
应理解，图1至图5仅示出了工作舱120位于散热舱130右侧的情形，工作舱120还可以位于散热舱130的左侧，本发明实施例对此并不做限制。
图6和图7分别是服务器121的示意性俯视图。可选地，如图6和7所示，服务器121还可以包括：
第一导向板128a，设置在导热壁122的一侧，且位于服务器121的机箱外；
第一凸轮机构128b，设置在第一导向板128a与导热壁122之间；
第二导向板129a，设置在与导热壁122正对的第二侧壁的一侧，且位于服务器121的机箱外；
第二凸轮机构129b，设置在第二导向板129a与第二侧壁之间；
第一扳手128c和第二扳手129c，分别与第一凸轮机构128b和第二凸轮机构129b相连接；
第一导向板128a、第一凸轮机构128b和第一扳手128c用于，当第一扳 手128c设置为第一状态时，第一凸轮机构128b使得第一导向板128a和导热壁122之间间隔第一距离L1；
第一导向板128a、第一凸轮机构128b和第一扳手128c还用于，当第一扳手128c设置为第二状态时，第一凸轮机构128b使得第一导向板128a和导热壁122之间间隔第二距离L2，第一距离L1与第二距离L2之间的差值为预设值；
第二导向板129a、第二凸轮机构129b和第二扳手129c用于，当第二扳手129c设置为第一状态时，第二凸轮机构129b使得第二导向板129a和第二侧壁之间间隔第三距离R1；
第二导向板129a、第二凸轮机构129b和第二扳手129c还用于，当第二扳手129c设置为第二状态时，第二凸轮机构129b使得第二导向板129a和第二侧壁之间间隔第四距离R2，第三距离R1与第四距离R2之间的差值为预设值。
例如，第一状态可以为打开状态，第二状态可以为关闭状态。L1-L2＝X，R2-R1＝X。
图6是两扳手128c和129c打开状态时服务器121的示意性俯视图。图7是两扳手128c和129c关闭状态时服务器121的示意性俯视图。第一导向板128a和第二导向板129a的高度小于服务器121的侧壁的高度，如图8所示，图8为服务器121的导热壁122侧的视图。另外，凸轮机构和扳手之间设置有连杆，导向板和机箱侧壁之间设置有弹簧。
图9所示为服务器121插入工作舱120后两扳手128c和129c在打开状态时的示意性前视图。两扳手128c和129c打开，服务器121插入工作舱120，服务器121在左右导向板128a和129a的导向作用下插入工作舱120，左导向板128a的设计使得导热壁122与散热基板110上的导热衬垫140之间间隔预设的距离X(例如X＝3mm)，避免了服务器121插入工作舱120时碰损导热衬垫140。
相应地，散热基板110位于工作舱120侧的表面的第一区域上不设置导热介质140，且该第一区域设置有凹槽用于容纳第一导向板128a，其中第一区域为服务器121放入工作舱120时第一导向板128a与散热基板110接触的区域。
换句话说，如图9所示，对应导向板128a的地方不设置导热衬垫，同 时在散热基板110上与导向板128a接触的地方局部开槽。服务器121插到位后，先将左扳手128c关闭，导向板128a在弹簧力作用下往右缩预设的距离X，再将右扳手129c关闭，在右扳手129c和凸轮机构129b的作用下，整个服务器左移该预设的距离X，或者略大于X，如3mm+，使得导热壁122与导热衬垫140压紧，能够使服务器121的导热壁122与导热衬垫140良好接触。图10为服务器121插入工作舱120后两扳手128c和129c关闭后的平面示意图。需要说明的是，维护时，相应地要先将右扳手128c打开，右导板129a向左缩预设的距离，再打开左扳手128c，在左扳手128c和凸轮机构128b的作用下，整个服务器121向右移该预设的距离，使得导热壁122与导热衬垫140之间间隔预设的距离，然后将服务器121从工作舱120中取出，避免了抽出服务器121时破坏导热衬垫140。
本发明实施例的服务器，通过扳手的顺序开启与关闭，能够在保证不损坏导热衬垫的前提下完成服务器的导热壁与散热基板的脱离或压紧。
本发明实施例的机柜，通过将工作舱内的服务器产生的热量通过散热基板传导到散热舱内的散热翅片上，利用自然风将散热翅片上的热量排出，能够提高散热效率，减少能耗，进而提高能源使用效率。
本发明还提供了一种散热系统1100，散热系统1100包括：至少一个机柜100，机柜100包括工作舱120和散热舱130；送风通道150和排风通道151。
如图11所示，送风通道150的通道内部与数据中心的内部隔离，送风通道150的进风口设置在数据中心外，送风通道150的至少一个出风口与至少一个机柜100的散热舱的入风口连通，用于使自然风通过送风通道150进入机柜100的散热舱。排风通道151的通道内部与数据中心的内部隔离，排风通道151的至少一个进风口与至少一个机柜100的散热舱的出风口连通，排风通道151的出风口设置在数据中心外，用于使自然风经过散热舱内部的散热翅片后通过排风通道151排出数据中心。
送风通道150和排风通道151的通道内部分别与数据中心的内部隔离，能够保证自然风不进入数据中心，进而能够避免外界的自然风对数据中心的可靠性带来影响。
本发明实施例中，通过送风通道将自然风送到数据中心内部的机柜的散热舱中，自然风经过散热舱对散热翅片进行散热之后，再经过排风通道排到 数据中心外。
因此，本发明实施例的散热系统，利用送风通道送入的自然风进行散热，能够减少数据中心空调的能耗，进而能够提高数据中心的能源使用效率。
图12是根据本发明实施例的散热系统1100所在的数据中心的规划设计示意图。图12是数据中心的俯视图，如图12所示，数据中心可以容纳多个机柜100，多个机柜100可以并排放置，机柜100的散热舱130可以设置在工作舱120的左侧，送风通道150和排风通道151可以对每排的机柜进行送风和排风。
送风通道150和排风通道151可以设置在机柜顶部与天花板之间，如图11所示，200为天花板，210为地板。
送风通道150将自然冷风送到数据中心内部，并在各个机柜100之间进行分配，自然风冷风由散热舱130的进风口进入，通过机柜100的散热舱130中的散热翅片后，热风从散热舱130的出风口出来，经由排风通道151排到数据中心外。工作舱120的至少部分热量可以通过空调散热，冷空气通过地板送风，通过工作舱120后，热风从天花板进入空调，完成一个循环。
应理解，机柜的散热舱130还可以设置在工作舱120的右侧。还应理解，图12中所示的散热舱130和工作舱120的尺寸比例可以根据实际需要具体设置。
图11和图12的的这个例子是为了帮助本领域技术人员更好地理解本发明实施例，而非要限制本发明实施例的范围。本领域技术人员根据所给出的的例子，显然可以进行各种等价的修改或变化，这样的修改或变化也落入本发明实施例的范围内。
可选地，在散热舱130的进风口与送风通道150的连接处设置开关152，在散热舱的出风口与排风通道150的连接处设置开关153。当散热系统1100工作时，打开开关152和开关153。当散热系统1100不工作时，可以关闭开关152和开关153。
由于工作舱120和散热舱130是相互独立的，因此在维护服务器121时，散热系统1100仍可正常工作，无需关闭开关152和开关153。
可选地，如图13所示，散热系统1100还可以包括过滤装置160，设置在送风通道150的出风口与散热舱130的进风口之间，用于过滤自然风。
可选地，散热系统1100还可以包括冷却装置170，冷却装置170设置在 送风通道150的出风口与散热舱130的进风口之间，设置成在自然风的温度高于第一预设值的情况下启动以降低自然风的温度。例如，冷却装置170可以为喷雾冷却装置。例如，在自然风温度高于35℃时，开启喷雾冷却，降低自然风的温度。
可选地，散热系统1100还可以包括导引装置，设置在送风通道150与排风通道151之间，设置成在自然风的温度低于第二预设值的情况下使排风通道151排出的部分热风回流到送风通道150以提高自然风的温度。例如，当自然风温度低于-25℃，导引装置可以使至少部分热风回流到送风通道，提高自然风的温度。例如，导引装置可以为回流管道，回流管道的一端与送风通道150连通，回流管道的另一端与排风通道151连通。
可选地，排风通道151和送风通道150连通，在排风通道151与送风通道150连通的位置设置开关，如图13所示开关154和开关155。开关154和开关155设置成：在正常工作状态下处于关闭状态，送风通道150从数据中心外引入的冷风进入散热舱130，从散热舱130排出的热风通过排风通道151排出数据中心，送风通道150中的冷风和排风通道151中的热风不会互相流窜；在送风通道150从数据中心外引入的自然风温度低于第二预设值的情况下处于开启状态，使得排风通道151中的至少部分热风回流到送风通道150中提高自然风的温度。当送风通道150从数据中心外引入的自然风的温度满足预设条件的情况下，开关154和开关155处于关闭状态。
本发明实施例的散热系统，利用送风通道送入的自然风对机柜的散热舱进行散热，能够减少数据中心空调的能耗，进而能够提高数据中心的能源使用效率。而且，空调能耗减少能够降低数据中心的基础设施成本。
另外，通过设置过滤装置、冷却装置和导引装置对送风通道送入的自然风进行处理，能够增强散热效率，增强散热系统的可靠性。
在本发明中，当描述到特定部件位于第一部件和第二部件之间时，在该特定部件与第一部件或第二部件之间可以存在居间部件，也可以不存在居间部件；当描述到特定部件与其它部件相连接时，该特定部件可以与所述其它部件直接连接而不具有居间部件、也可以不与所述其它部件直接连接而具有居间部件。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易 想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种机柜，其特征在于，包括：
    工作舱，设置在散热基板的一侧，所述工作舱用于容纳服务器；
    散热舱，设置在所述散热基板的另一侧，所述散热舱与所述工作舱共用所述散热基板作为舱壁，所述工作舱和所述散热舱通过所述散热基板相隔离，所述散热舱内容纳多个散热翅片，所述多个散热翅片与所述散热基板相连接，所述散热基板用于将所述工作舱内的所述服务器产生的热量传导到所述多个散热翅片上，所述散热舱的第一舱壁上设置进风口，所述散热舱的第二舱壁上设置出风口，用于使自然风从所述进风口进入所述散热舱，并经过所述多个散热翅片后通过所述出风口将所述多个散热翅片上的热量排出，其中所述第一舱壁和所述第二舱壁为所述散热舱内所述散热基板之外的舱壁。
  2. 根据权利要求1所述的机柜，其特征在于，在所述工作舱中容纳有所述服务器时，所述服务器的机箱与所述散热基板相连接的一侧为导热壁，所述服务器内设置有导热装置，所述导热装置的一端与所述导热壁相连接，所述导热装置的另一端与所述服务器的器件相连接，以使所述服务器的器件产生的热量通过所述导热装置和所述导热壁传导到所述散热基板上。
  3. 根据权利要求1或2所述的机柜，其特征在于，还包括：导热介质，设置在所述散热基板位于所述工作舱侧的表面上。
  4. 根据权利要求2或3所述的机柜，其特征在于，所述服务器还包括：
    第一导向板，设置在所述导热壁的一侧，且位于所述服务器的机箱外，；
    第一凸轮机构，设置在所述第一导向板与所述导热壁之间；
    第二导向板，设置在与所述导热壁正对的第二侧壁的一侧，且位于所述服务器的机箱外；
    第二凸轮机构，设置在所述第二导向板与所述第二侧壁之间；
    第一扳手和第二扳手，分别与所述第一凸轮机构和所述第二凸轮机构相连接；
    所述第一导向板、所述第一凸轮机构和所述第一扳手用于，当所述第一扳手设置为第一状态时，所述第一凸轮机构使得所述第一导向板和所述导热壁之间间隔第一距离；
    所述第一导向板、所述第一凸轮机构和所述第一扳手还用于，当所述第 一扳手设置为第二状态时，所述第一凸轮机构使得所述第一导向板和所述导热壁之间间隔第二距离，所述第一距离与所述第二距离之间的差值为预设值；
    所述第二导向板、所述第二凸轮机构和所述第二扳手用于，当所述第二扳手设置为所述第一状态时，所述第二凸轮机构使得所述第二导向板和所述第二侧壁之间间隔第三距离；
    所述第二导向板、所述第二凸轮机构和所述第二扳手还用于，当所述第二扳手设置为所述第二状态时，所述第二凸轮机构使得所述第二导向板和所述第二侧壁之间间隔第四距离，所述第三距离与所述第四距离之间的差值为所述预设值。
  5. 根据权利要求3或4所述的机柜，其特征在于，所述散热基板位于所述工作舱侧的表面的第一区域上不设置导热介质，且所述第一区域设置有凹槽用于容纳所述第一导向板，其中所述第一区域为所述服务器放入所述工作舱时所述第一导向板与所述散热基板接触的区域。
  6. 根据权利要求1至5中任一项所述的机柜，其特征在于，所述散热舱内设置有风扇。
  7. 根据权利要求1至6中任一项所述的机柜，其特征在于，所述散热舱内还容纳热管，所述热管的一端与所述散热基板相连接，所述热管的另一端与所述多个散热翅片相连接，所述热管用于将所述散热基板上的热量传导至所述多个散热翅片上。
  8. 根据权利要求1至7中任一项所述的机柜，其特征在于，所述工作舱内所述散热基板之外的舱壁上设置有通风孔，所述工作舱内设置有风扇，所述工作舱的风扇以及所述工作舱的通风孔用于将所述工作舱内的至少部分热量通过所述通风孔排出所述工作舱。
  9. 一种散热系统，用于对数据中心的服务器进行散热，其特征在于，包括：
    至少一个如权利要求1至8中任一项所述的机柜；
    送风通道，所述送风通道的通道内部与所述数据中心的内部隔离，所述送风通道的进风口设置在所述数据中心外，所述送风通道的至少一个出风口分别与所述至少一个机柜的散热舱的进风口连通，用于使自然风通过所述送风通道进入所述机柜的散热舱；
    排风通道，所述排风通道的通道内部与所述数据中心的内部隔离，所述排风通道的至少一个进风口分别与所述至少一个机柜的散热舱的出风口连通，所述排风通道的出风口设置在所述数据中心外，用于使所述自然风经过所述散热舱内的散热翅片后通过所述排风通道排出所述数据中心。
  10. 根据权利要求9所述的散热系统，其特征在于，还包括：过滤装置，设置在所述送风通道的出风口与所述散热舱的进风口之间，用于对所述自然风进行过滤。
  11. 根据权利要求9或10所述的散热系统，其特征在于，还包括：冷却装置，设置在所述送风通道的出风口与所述散热舱的进风口之间，用于在自然风的温度高于第一预设值的情况下启动以降低所述自然风的温度。
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