WO2024063126A1 - 素子転写用シート - Google Patents

素子転写用シート Download PDF

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Publication number
WO2024063126A1
WO2024063126A1 PCT/JP2023/034247 JP2023034247W WO2024063126A1 WO 2024063126 A1 WO2024063126 A1 WO 2024063126A1 JP 2023034247 W JP2023034247 W JP 2023034247W WO 2024063126 A1 WO2024063126 A1 WO 2024063126A1
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WIPO (PCT)
Prior art keywords
adhesive layer
sheet
less
resin
transfer sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/034247
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
健太 西嶋
晴樹 末吉
郷 大西
友郁 加藤
智史 川田
貴志 杉野
睦 升本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to KR1020257009969A priority Critical patent/KR20250073626A/ko
Priority to CN202380068125.5A priority patent/CN119948600A/zh
Priority to JP2024545863A priority patent/JP7680640B2/ja
Publication of WO2024063126A1 publication Critical patent/WO2024063126A1/ja
Priority to US19/085,330 priority patent/US20250215267A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
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    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • B32B7/06—Interconnection of layers permitting easy separation
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • C09J7/241—Polyolefin, e.g.rubber
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    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
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    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Definitions

  • the present invention relates to an element transfer sheet.
  • Element transfer sheets used for element transfer are known. Such sheets can be used to temporarily hold objects and transfer them to desired locations. It is also known to expand the element transfer sheet while it holds an object.
  • Patent Document 1 discloses a method of dicing a semiconductor wafer stuck on a dicing film, separating each chip by expanding the dicing film after dicing, and picking up each chip and transferring it to another base material. is listed. Patent Document 1 discloses using a material having a specific density and specific components as a material for a dicing film in order to form uniform gaps between chips in an expanding process. Additionally, Non-Patent Documents 2 and 3 describe that the wafer is cut along the intended cutting area by pasting the wafer on an adhesive tape, irradiating the intended cutting area with a laser beam, and expanding the adhesive tape. ing.
  • the inventors of the present application have considered providing unevenness on the surface of the adhesive layer of the element transfer sheet. According to this configuration, by expanding the sheet, the holding force of the element by the sheet can be reduced, and the element can be easily peeled off from the sheet. On the other hand, it has been found that even if the sheet is expanded while holding the elements on the element transfer sheet provided with such irregularities, the intervals between the elements may not be widened much.
  • An object of the present invention is to further increase the distance between the elements held by the sheet when expanding an element transfer sheet including an adhesive layer having an uneven surface.
  • the inventor of the present invention found that by appropriately adjusting the tensile stress of the base material of the element transfer sheet, the distance between the elements held by the sheet can be increased when the sheet is expanded. In this way, the inventors discovered that the above problems could be solved, and after further various studies, they came to complete the present invention.
  • the present invention relates to the following [1] to [9].
  • An element transfer sheet comprising a base material and an adhesive layer having an uneven surface, The tensile stress in the first direction when the base material is 100% elongated is higher than the tensile stress in the second direction perpendicular to the first direction, and the tensile stress in the first direction is 12 MPa or more, A sheet for device transfer, wherein the tensile stress in the second direction is 9 MPa or more.
  • the adhesive layer has a plurality of convex portions that are defined by concave portions and spaced apart from each other, and the pitch of the plurality of convex portions is 1 ⁇ m or more and 100 ⁇ m or less, [1] to [5] The element transfer sheet according to any one of the above. [7] The element transfer sheet according to any one of [1] to [6], wherein the adhesive layer has a plurality of convex portions, and the height of the plurality of convex portions is uniform. [8] After forming a plurality of elements by dicing the wafer substrate held by the adhesive layer, when the element transfer sheet is expanded by 180% in the first direction and the second direction.
  • the element transfer sheet according to any one of [1] to [7], wherein the coefficient of variation of the spacing between the plurality of elements is 0.2 or less.
  • the element transfer sheet After forming a plurality of elements by dicing the wafer substrate held by the adhesive layer, when the element transfer sheet is expanded by 80 mm in the first direction and the second direction, The element transfer sheet according to any one of items [1] to [8], wherein the average value of the intervals between the plurality of elements is 1 mm or more.
  • FIG. 1 is a cross-sectional view of a sheet according to one embodiment.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the sheet.
  • FIG. 3 is a top view showing an example of unevenness that the sheet has.
  • FIG. 3 is a top view showing an example of unevenness that the sheet has.
  • FIG. 3 is a top view showing an example of unevenness of the sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the sheet.
  • FIG. 3 is a diagram illustrating a sheet expansion method.
  • FIG. 3 is a diagram illustrating a sheet expansion method.
  • mass average molecular weight (Mw) and number average molecular weight (Mn) are values measured by size exclusion chromatography in terms of standard polystyrene, specifically based on JIS K7252-1:2016. It is the value to be measured.
  • (meth)acrylic acid is a term that refers to both "acrylic acid” and “methacrylic acid,” and the same applies to other similar terms.
  • any combination of the lower limit value and upper limit value among them is described.
  • the description of preferably 1 or more, more preferably 2 or more, still more preferably 3 or more, preferably 9 or less, more preferably 8 or less, still more preferably 7 or less means that the numerical range is 1 or more 9 or less, 1 or more and 8 or less, 1 or more and 7 or less, 2 or more and 9 or less, 2 or more and 8 or less, 2 or more and 7 or less, 3 or more and 9 or less, 3 or more and 8 or less, and 3 or more and 7 or less. It clearly means that.
  • the element transfer sheet includes a substrate 120 and an adhesive layer 110 having an uneven surface.
  • the element transfer sheet is used for temporarily holding an element and transferring it to a transfer destination.
  • the element transfer sheet can be used for receiving an element held on another holding substrate, temporarily holding the element, and transferring the element to a desired position on the transfer destination.
  • the substrate 120 can support the adhesive layer 110.
  • the base material 120 functions as a support that supports the adhesive layer 110.
  • the base material 120 is located on the surface opposite to the uneven surface of the adhesive layer 110.
  • a flexible substrate can be used as the substrate 120. Furthermore, by using a flexible substrate as the substrate 120, it is possible to improve the cushioning properties when holding the element, to facilitate stacking of the sheets, or to form the sheet into a roll shape.
  • a resin film can be used as the substrate 120.
  • the resin film is a film in which a resin-based material is used as the main material, and may be made of a resin material, or may contain an additive in addition to the resin material.
  • the resin film may be laser light transparent.
  • the tensile stress in the first direction when the base material 120 is 100% stretched is higher than the tensile stress in the second direction orthogonal to the first direction. Further, in this embodiment, the tensile stress in the first direction and the second direction when the base material 120 is 100% stretched is sufficiently high.
  • the tensile stress in the first direction at 100% elongation of the base material 120 is 12 MPa or more, preferably 14 MPa or more, more preferably 18 MPa or more, and even more preferably 22 MPa or more.
  • the tensile stress in the second direction at the time of 100% elongation of the base material 120 is 9 MPa or more, preferably 12 MPa or more, and more preferably 15 MPa or more.
  • the base material 120 having such tensile stress when the sheet is expanded, the distance between the plurality of elements held by the sheet tends to increase. Further, by using the base material 120 having the tensile stress as described above, when the sheet is expanded, variations in the spacing between the plurality of elements held by the sheet tend to be reduced. By using such a sheet according to this embodiment, it becomes easy to selectively transfer the elements held on the sheet.
  • the tensile stress in the first direction at 100% elongation of the base material 120 is preferably 40 MPa or less, more preferably 30 MPa or less, and even more preferably 25 MPa or less.
  • the tensile stress in the second direction at 100% elongation of the base material 120 is preferably 30 MPa or less, more preferably 25 MPa or less, and even more preferably 20 MPa or less.
  • the first direction when the base material 120 is 100% stretched is The tensile stress is preferably 12 MPa or more, more preferably 14 MPa or more, while it is preferably 40 Ma or less, and more preferably 16 MPa or less.
  • the tensile stress in the second direction at 100% elongation of the base material 120 is preferably 9 MPa or more, more preferably 10 MPa or more, even more preferably 10.5 MPa or more, On the other hand, it is preferably 30 MPa or less, more preferably 15 MPa or less, and even more preferably 12 MPa or less.
  • the first direction may be the direction in which the tensile stress is highest. Further, the first direction may be the MD direction.
  • MD in the MD direction is an abbreviation for Machine Direction, and for example, the MD direction of the base material means the longitudinal direction when manufacturing the base material.
  • the second direction may be the direction in which the tensile stress is lowest.
  • the second direction may be the TD direction.
  • TD in the TD direction is an abbreviation for Transverse Direction, and for example, the TD direction of the base material means the width direction at the time of manufacturing the base material. In this way, the MD direction and the TD direction are orthogonal to each other. Further, in this specification, tensile stress is measured as shown in Examples.
  • the inventors of the present application believe that by increasing the tensile stress of the substrate 120 as described above, the force that the elements receive when the sheet is expanded increases, resulting in a larger spacing between the elements and a smaller variation in spacing.
  • the tensile stress of the substrate 120 can be adjusted, for example, by selecting the resin material or combination of resin materials that make up the substrate 120, or by mixing in additives. Furthermore, when a copolymer is used as the material for the substrate 120, the tensile stress of the substrate 120 can be adjusted by selecting the combination or ratio of constituent units.
  • the absolute value of the difference between the tensile stress in the first direction and the tensile stress in the second direction when the base material 120 is 100% elongated may be 2.0 MPa or more, and 3. It may be 0 MPa or more, or it may be 4.0 MPa or more.
  • resin films include polyethylene films such as low density polyethylene (LDPE) films, linear low density polyethylene (LLDPE) films, and high density polyethylene (HDPE) films, polypropylene films, polybutene films, polybutadiene films, poly( Polyolefin films such as 4-methyl-1-pentene) films, ethylene-norbornene copolymer films, and norbornene resin films; ethylene-vinyl acetate copolymer films, ethylene-(meth)acrylic acid copolymer films, and Ethylene copolymer films such as ethylene-(meth)acrylic acid ester copolymer films; polyvinyl chloride films such as polyvinyl chloride films and vinyl chloride copolymer films; polyethylene terephthalate films and polybutylene terephthalate films, etc.
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • HDPE high density polyethylene
  • polypropylene films polybutene films
  • polyester film examples include polyester film; polyurethane film; polyimide film; polystyrene film; polycarbonate film; and fluororesin film.
  • films containing a mixture of two or more types of materials, crosslinked films in which the resins forming these films are crosslinked, and modified films such as ionomer films may also be used.
  • the base material 120 may be a laminated film in which two or more types of resin films are laminated.
  • the base material 120 is preferably a polyolefin film or a vinyl chloride copolymer film.
  • polyolefin films include polyethylene films, polypropylene films, and copolymers containing unsubstituted olefins such as ethylene or propylene as constituent units, such as ethylene copolymers containing ethylene-methacrylic acid copolymers (EMAA).
  • EMAC ethylene-methacrylic acid copolymers
  • vinyl chloride copolymer films include vinyl chloride-vinylidene chloride copolymer films, vinyl chloride-vinyl acetate copolymer films, and vinyl chloride-ethylene copolymer films.
  • the form of such a copolymer is not particularly limited, and may be any of a block copolymer, random copolymer, alternating copolymer, and graft copolymer. Note that these films may contain other resin components or additives.
  • the thickness of the base material 120 is not particularly limited, but from the viewpoint of achieving both supportability and rollability, it is preferably 10 ⁇ m or more, more preferably 25 ⁇ m or more, even more preferably 40 ⁇ m or more, and preferably 500 ⁇ m.
  • the thickness is more preferably 200 ⁇ m or less, still more preferably 150 ⁇ m or less, even more preferably 150 ⁇ m or less, even more preferably 120 ⁇ m or less, particularly preferably 90 ⁇ m or less.
  • the tensile modulus of the base material 120 is preferably 50 MPa or more, more preferably 80 MPa or more, even more preferably 120 MPa or more, and preferably 2500 MPa or less, more preferably 1000 MPa or less, More preferably, the range is 500 MPa or less.
  • tensile modulus is measured according to JIS K7161-1:2014.
  • the elongation at break of the base material 120 is preferably 105% or more, more preferably 150% or more, and even more preferably 200% or more.
  • elongation at break is measured according to JIS K 7127:1999.
  • the adhesive layer 110 is a layer having adhesive properties and can contain resin. As described above, the adhesive layer 110 has irregularities on its surface. Note that the sheet may have two or more adhesive layers 110. For example, the sheet may have a laminate of one or more types of adhesive layers 110.
  • composition of adhesive layer examples include rubber resins such as polyisobutylene resins, polybutadiene resins, and styrene-butadiene resins, acrylic resins, urethane resins, polyester resins, olefin resins, and silicone resins. Examples include resins, polyvinyl ether resins, and the like.
  • the adhesive layer may have heat resistance, and examples of materials for the adhesive layer 110 having such heat resistance include polyimide resins and silicone resins.
  • the adhesive layer 110 may include a copolymer having two or more types of structural units. The form of such a copolymer is not particularly limited, and may be any of a block copolymer, random copolymer, alternating copolymer, and graft copolymer.
  • the resin contained in the adhesive layer 110 is an adhesive resin that has adhesive properties by itself.
  • the resin is preferably a polymer having a mass average molecular weight (Mw) of 10,000 or more.
  • the weight average molecular weight (Mw) of the resin is preferably 10,000 or more, more preferably 70,000 or more, and still more preferably 140,000 or more from the viewpoint of improving retention.
  • the number average molecular weight (Mn) of the resin is preferably 10,000 or more, more preferably 50,000 or more, and even more preferably 100,000 or more from the viewpoint of improving retention.
  • the adhesive layer 110 includes a resin derived from an energy-reactive resin
  • the mass average molecular weight (Mw) and number average molecular weight (Mn) are the mass average molecular weight (Mw) before crosslinking reaction due to energy application. and number average molecular weight (Mn).
  • the glass transition temperature (Tg) of the resin is preferably -75°C or higher, more preferably -70°C or higher, and preferably 5°C or lower, more preferably -20°C or lower. When Tg is within this range, the retention properties and storage modulus of the resulting adhesive layer 110 can be easily kept within the ranges described below.
  • the amount of resin included in the adhesive layer 110 relative to the total amount of components constituting the adhesive layer 110 can be appropriately set depending on the required retention properties and storage modulus of the adhesive layer 110, but is preferably 30% by mass or more. , more preferably 50% by mass or more, further preferably 70% by mass or more, still more preferably 80% by mass or more, even more preferably 90% by mass or more, preferably 99.99% by mass or less, more preferably 99.95% by mass. It is not more than 99.90% by mass, even more preferably not more than 99.80% by mass, even more preferably not more than 99.50% by mass.
  • the storage modulus of the adhesive layer 110 is preferably 0.001 MPa or more, more preferably 0.01 MPa or more, still more preferably 0.03 MPa or more, and even more preferably 0. It is .07 MPa or more. On the other hand, it is preferable that the storage modulus of the adhesive layer 110 is low because positional shift when holding the element can be suppressed. From this point of view, the storage modulus of the adhesive layer 110 is preferably 100 MPa or less, more preferably 50 MPa or less, still more preferably 20 MPa or less, particularly preferably 5 MPa or less. In this specification, storage modulus is measured according to JIS K7244-1:1998.
  • a cylindrical sample with a thickness of 3 mm and a diameter of 8 mm was prepared, and the storage modulus of the sample was measured using a viscoelasticity measuring device using a torsional shear method at 1 Hz in an environment of 23 ° C. , the storage modulus of the adhesive layer 110 can be measured.
  • the resin contained in the adhesive composition forming the adhesive layer 110 may include a thermoplastic resin. That is, the adhesive layer 110 can be formed from thermoplastic resin. When a thermoplastic resin is used, it becomes easy to form unevenness on the adhesive layer 110 by heating to soften the resin, and it becomes easy to maintain the formed uneven shape by cooling.
  • thermoplastic resins include rubber resins, acrylic resins, urethane resins, and olefin resins. Examples include polybutadiene thermoplastic elastomers using butadiene as a monomer, styrenic thermoplastic elastomers using styrene as a monomer, and (meth)acrylic acid or (meth)acrylic acid esters as monomers. Examples include acrylic thermoplastic elastomers.
  • composition of the adhesive layer 110 is not limited to what is shown below.
  • the adhesive composition forming the adhesive layer 110 contains an acrylic resin.
  • Acrylic resin is a resin containing (meth)acrylic acid or (meth)acrylic acid ester as a monomer.
  • the weight average molecular weight (Mw) of the acrylic resin is preferably 10,000 or more, more preferably 100,000 or more, and still more preferably 500,000 or more from the viewpoint of improving adhesive strength.
  • Mw weight average molecular weight
  • it is preferably 2,000,000 or less, more preferably 1,500,000 or less, and still more preferably 1,200,000 or less.
  • the glass transition temperature (Tg) of the acrylic resin is preferably -75°C or higher, more preferably -70°C or higher, and preferably 5°C or lower, more preferably -20°C or lower. When Tg is within this range, it becomes easier to obtain the adhesive layer 110 having the above storage modulus.
  • the glass transition temperature (Tg) of the acrylic resin can be calculated using the Fox formula.
  • Tg of the monomer used at this time to induce the structural unit the value described in the Polymer Data Handbook or the Adhesive Handbook can be used.
  • Examples of (meth)acrylic esters constituting the acrylic resin include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, and n-butyl (meth)acrylate.
  • alkyl group constituting the alkyl ester such as acrylate, myristyl (meth)acrylate, pentadecyl (meth)acrylate, palmityl (meth)acrylate, heptadecyl (
  • (meth)acrylic acid alkyl esters having a chain structure (meth)acrylic acid cycloalkyl esters such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate; (meth)acrylic acid such as benzyl (meth)acrylate Acid aralkyl ester; (meth)acrylic acid cycloalkenyl ester such as dicyclopentenyl (meth)acrylate; (meth)acrylic acid cycloalkenyloxyalkyl ester such as dicyclopentenyloxyethyl (meth)acrylate; Imide (meth)acrylate; Glycidyl group-containing (meth)acrylic esters such as glycidyl (meth)acrylate; hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate , hydroxyl group-containing (me
  • the acrylic resin is, for example, one or more monomers selected from itaconic acid, vinyl acetate, acrylonitrile, styrene, N-methylolacrylamide, etc. in addition to (meth)acrylic ester or (meth)acrylic acid. It may also be a resin obtained by copolymerizing.
  • the monomers constituting the acrylic resin may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the acrylic resin contains a monomer having a hydroxyl group as a constituent unit.
  • the acrylic resin may have a functional group capable of bonding to other compounds, such as a vinyl group, (meth)acryloyl group, amino group, carboxy group, or isocyanate group.
  • These functional groups, including the hydroxyl groups of the acrylic resin may be bonded to other compounds via a crosslinking agent (C), which will be described later, or may be bonded directly to other compounds without using a crosslinking agent (C). You can leave it there.
  • the amount of acrylic resin in the total amount of resin in the adhesive composition can be appropriately set depending on the required adhesive strength and storage modulus of the adhesive layer 110, but is preferably 0% by mass or more, more preferably is 10% by mass or more, more preferably 20% by mass or more, even more preferably 50% by mass or more, preferably 100% by mass or less, more preferably 95% by mass or less, even more preferably 80% by mass or less, even more preferably It is 60% by mass or less.
  • the adhesive composition forming the adhesive layer 110 includes an energy-reactive resin (B).
  • the energy-reactive resin (B) refers to a resin whose elastic modulus is improved by applying energy.
  • the energy-reactive resin may be a resin derived from an energy-reactive monomer.
  • the energy-responsive resin is a resin obtained by polymerizing energy-responsive monomers by applying energy.
  • Energy-reactive resins include energy-ray-reactive resins and heat-reactive resins.
  • Energy ray-reactive resin refers to a resin whose elastic modulus is improved by irradiation with energy rays.
  • the energy-responsive resin can be an energy-beam curable resin.
  • thermalally reactive resin refers to a resin whose elastic modulus is improved by heating.
  • the resin contained in the adhesive layer 110 is more preferably derived from a thermoplastic energy-reactive resin, and even more preferably derived from a thermoplastic energy-reactive resin.
  • the type of energy ray is not particularly limited, and examples thereof include ultraviolet rays, electron beams, and ionizing radiation.
  • the energy beam is preferably ultraviolet rays, that is, the resin is preferably an ultraviolet-reactive resin.
  • thermoplastic energy-reactive resin refers to an energy-reactive resin that has thermoplasticity at least before energy is applied. Furthermore, the expression that the resin is derived from an energy-reactive resin means that the resin is obtained from an energy-reactive resin. For example, a resin derived from an energy-responsive resin is a crosslinked energy-responsive resin.
  • the formed uneven shape can be easily maintained by applying energy (for example, irradiating with energy rays) after forming unevenness on the resin.
  • a polymerizable functional group is a functional group that is crosslinked by application of energy (for example, irradiation with energy rays).
  • Examples of the polymerizable functional group include alkenyl groups such as vinyl and allyl groups, (meth)acryloyl groups, oxetanyl groups, and epoxy groups.
  • diene rubber composed of a polymer having a polymerizable functional group at the end of the main chain and/or at the side chain can be used as the energy reactive resin.
  • Diene rubber refers to a rubbery polymer having a double bond in the polymer main chain.
  • Specific examples of diene rubber include polymers using butadiene or isoprene as a monomer (i.e., having butenediyl or pentenediyl groups as structural units).
  • Preferred examples of energy reactive resins include polybutadiene resin (PB resin), styrene-butadiene-styrene block copolymer (SBS resin), and styrene-isoprene-styrene block copolymer. These resins can be used as ultraviolet reactive resins.
  • the average number of polymerizable functional groups per molecule in these energy-reactive resins is preferably 1.5 or more, more preferably 2 or more, from the viewpoint of easily maintaining the uneven shape of the adhesive layer 110.
  • this average value is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less.
  • the adhesive layer 110 may contain one type of resin, or may contain two or more types of resin.
  • the adhesive layer 110 is derived from a liquid resin, a resin derived from an energy-responsive liquid resin, or an energy-responsive monomer, in addition to a resin derived from a thermoplastic resin or a thermoplastic energy-responsive resin.
  • the liquid resin refers to a resin that is a liquid at room temperature (25° C.) before mixing.
  • the energy-reactive liquid resin refers to an energy-reactive resin that is a liquid at room temperature (25° C.) before mixing and before applying energy.
  • a resin derived from an energy-reactive monomer is a resin obtained by polymerizing an energy-reactive monomer by applying energy.
  • the adhesive layer 110 contains a resin derived from an energy-reactive liquid resin because the uneven shape of the adhesive layer 110 can be easily maintained.
  • liquid resins include diene rubbers, and specific examples include polybutadiene resins in which butadiene is used as a monomer.
  • the adhesive layer 110 includes a combination of any resin and a resin derived from an energy-reactive liquid resin or an energy-reactive monomer.
  • the adhesive layer 110 may include an acrylic resin (A) and an energy-reactive liquid resin or a resin derived from an energy-reactive monomer.
  • energy can be applied (for example, by irradiating energy rays) after forming irregularities on the film of the mixture of the acrylic resin (A) and the energy-reactive liquid resin or the energy-reactive monomer. This makes it easy to polymerize the energy-reactive liquid resin or the energy-reactive monomer and maintain the formed uneven shape.
  • Examples of energy-reactive monomers include alkenyl groups such as vinyl groups and allyl groups, (meth)acryloyl groups, oxetanyl groups, and difunctional or polyfunctional monomers into which polymerizable functional groups such as epoxy groups are introduced. Examples include compounds. Preferred examples of energy-reactive monomers include polyvalent (meth)acrylates such as difunctional (meth)acrylates. In this way, the adhesive layer 110 can contain an energy ray-curable resin containing polyvalent (meth)acrylate as a constituent unit. Specific examples of polyvalent (meth)acrylates include cycloalkyl di(meth)acrylates, such as tricyclodecane dimethanol diacrylate.
  • the ratio of the energy-reactive resin (B) to the total amount of the components constituting the adhesive layer 110 can be selected depending on the required retention properties and storage modulus of the adhesive layer 110.
  • this ratio is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 8% by mass or more, even more preferably 10% by mass or more, and preferably 30% by mass or less, more preferably 25% by mass or more. % by mass or less.
  • the amount of energy-reactive resin relative to the acrylic resin determines the required retention and storage elasticity of the adhesive layer 110. It can be selected depending on the rate etc.
  • the amount of energy-reactive resin relative to 100 parts by mass of acrylic resin is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 8 parts by mass or more, particularly preferably 10 parts by mass or more, Preferably it is 30 parts by mass or less, more preferably 25 parts by mass or less.
  • the energy-reactive resin is, for example, an energy-beam-curable resin, for example, a resin derived from an energy-beam-curable monomer.
  • parts by mass are based on the mass of the solid content, and the following is also based on the mass unless otherwise specified.
  • the adhesive composition forming the adhesive layer 110 may contain components other than resin.
  • the adhesive composition may contain one or more of a crosslinking agent (C), a photopolymerization initiator (D), and other additives.
  • crosslinking agent (C) examples include isocyanate crosslinking agents, epoxy crosslinking agents, aziridine crosslinking agents, metal chelate crosslinking agents, and the like. These crosslinking agents may be used alone or in combination of two or more.
  • isocyanate-based crosslinking agents are preferred from the viewpoint of increasing cohesive force and improving adhesive strength, ease of availability, and the like.
  • isocyanate crosslinking agent include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; dicyclohexylmethane-4,4'-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, Alicyclic polyisocyanates such as methylcyclohexylene diisocyanate, methylene bis(cyclohexyl isocyanate), 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, hydrogenated xylylene diisocyanate; hexamethylene diisocyanate, trimethylhexamethylene diisocyanate,
  • the adhesive composition may contain one type of crosslinking agent, or may contain two or more types of crosslinking agents.
  • the content of the crosslinking agent in the adhesive composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 0.5% by mass or more, from the viewpoint of appropriately performing the crosslinking reaction. It is particularly preferably at least 0.8% by mass, preferably at most 5% by mass, more preferably at most 4% by mass, even more preferably at most 2% by mass.
  • the crosslinking agent may be a crosslinking agent for the acrylic resin (A).
  • an isocyanate-based crosslinking agent of an isocyanurate-type modified product can be used as a crosslinking agent for an acrylic resin containing a monomer having a hydroxyl group as a constituent unit.
  • the amount of the crosslinking agent relative to the acrylic resin can be selected so that the crosslinking reaction can be carried out appropriately.
  • the amount of the crosslinking agent relative to 100 parts by mass of the acrylic resin is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.5 parts by mass or more, particularly preferably 1.0 parts by mass or more, and is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and even more preferably 2 parts by mass or less.
  • the photopolymerization initiator (D) starts a crosslinking reaction in response to application of energy (for example, irradiation with energy rays).
  • energy for example, irradiation with energy rays.
  • the adhesive layer 110 further contains the photopolymerization initiator (D), so that the crosslinking reaction proceeds even when relatively low energy is applied.
  • photopolymerization initiators (D) include 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, 8-chloroanthraquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.
  • the adhesive composition may contain one type of polymerization initiator, or may contain two or more types of polymerization initiator.
  • the content of the photopolymerization initiator in the adhesive composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and preferably 10% by mass or less, more preferably 5% by mass or less. , more preferably 2% by mass or less.
  • additives that the adhesive layer 110 may contain are not particularly limited, but include, for example, ultraviolet absorbers such as benzotriazole compounds, oxazolic acid amide compounds, or benzophenone compounds; hindered amine compounds, benzophenone compounds, etc. or benzotriazole-based light stabilizers; resin stabilizers such as imidazole-based resin stabilizers, dithiocarbamate-based resin stabilizers, phosphorus-based resin stabilizers, or sulfur ester-based resin stabilizers; hindered phenol-based compounds, etc.
  • Antioxidants such as phenolic compounds, aromatic amine compounds, sulfur compounds, or phosphorus compounds such as phosphoric acid ester compounds, fillers, pigments, extenders, and softeners can be mentioned.
  • the content of the additive in the adhesive layer 110 is preferably 0.0001% by mass or more, more preferably 0.01% by mass or more, and particularly preferably 0.1% by mass. It is at least 1% by mass, more preferably at least 1% by mass, preferably at most 20% by mass, more preferably at most 10% by mass, even more preferably at most 5% by mass.
  • the surface of the adhesive layer 110 has irregularities.
  • the adhesive layer 110 has a plurality of spaced apart protrusions on its surface bounded by depressions. Each of the plurality of convex portions may be separated by a concave portion that is continuous throughout the adhesive layer 110.
  • FIGS. 3A to 3C are top views showing the shape of the adhesive layer 110.
  • 2A and 3A show examples of the adhesive layer 110 before expansion
  • FIGS. 2B and 3B show examples of the adhesive layer 110 after expansion.
  • the element 140 held by the convex part 111 of the adhesive layer 110 is depicted in FIGS. 2A to 2B, the element 140 held by the convex part 111 is omitted in FIGS. 3A to C.
  • protrusions 111 may be regularly arranged on the surface of the adhesive layer 110.
  • the convex portions being regularly arranged means that the convex portions are arranged in a straight line at regular intervals.
  • the convex parts 111 may be arranged so that the intervals vary regularly.
  • the distance between the convex portions may be short at the center of the sheet, and the distance between the convex portions may be long at the periphery of the sheet.
  • the convex portions may be arranged irregularly.
  • FIG. 3C is a top view showing another shape of the adhesive layer 110.
  • striped convex portions 111 may be provided on the surface of the adhesive layer 110.
  • linear convex portions 111 having a constant width are lined up at regular intervals. The width or interval of the linear protrusions 111 may vary regularly, or the linear protrusions 111 may be arranged irregularly.
  • the sheet is expanded and the adhesive layer 110 shown in FIGS. 2A and 3A is transformed into the adhesive layer 110' shown in FIGS. 2B and 3B.
  • the pitch P of each convex part 111 in the adhesive layer 110' has been expanded due to expansion, and the number of convex parts 111 holding one element 140 has decreased. .
  • the force with which the convex portions 111 hold the element 140 is reduced in the adhesive layer 110' compared to the adhesive layer 110.
  • the pitch P of the convex portions 111 before expansion is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, still more preferably 10 ⁇ m or more, and still more preferably 15 ⁇ m or more, from the viewpoint of adjusting the holding force.
  • the pitch P is preferably 100 ⁇ m or less, more preferably 75 ⁇ m or less, still more preferably 50 ⁇ m or less, even more preferably 35 ⁇ m or less, More preferably, it is 25 ⁇ m or less.
  • the pitch P of the convex portions 111 means the distance between the center point of one arbitrarily selected convex portion 111 and the center point of another convex portion 111 that is closest to that convex portion 111.
  • the pitch P of the convex portions 111 is the center point of the convex portion 111 on a straight line in which the convex portions 111 are lined up at regular intervals, and the center point of another convex portion 111 that is closest to that convex portion 111.
  • the pitch P represents the distance between the center points of the protrusions on the straight line in which the protrusions 111 are arranged at the shortest pitch.
  • the distance between the convex portions 111 means the distance between the centers of the convex portions.
  • the specific shape of the convex portion 111 is not particularly limited.
  • the convex portion 111 may have a pillar shape.
  • the convex portion 111 may have a cylindrical shape or a prismatic shape.
  • the convex portion 111 may extend in a line shape, or may extend in a curved shape such as a wave shape.
  • these convex portions 111 may be provided with a taper.
  • FIG. 4A shows a cross-sectional view of the adhesive layer 110 according to one embodiment, passing through the convex portion 111 and perpendicular to the surface of the adhesive layer 110.
  • the convex portion 111 shown in FIG. 4A is tapered, that is, the convex portion 111 is tapered.
  • the tip of the convex portion 111 may have a curved surface. According to such a configuration, the impact when holding the element with the adhesive layer 110 is further alleviated, so that it becomes easier for the adhesive layer 110 to hold the element so that it does not shift.
  • the tip of the convex portion may be flat.
  • the surface of the adhesive layer 110 may have a flat recess and a protrusion 111 protruding from the recess.
  • the plurality of convex portions 111 that the adhesive layer 110 has and are spaced apart from each other may be bounded by concave portions.
  • the convex portion may be hemispherical or part of a sphere as shown in FIG. 4B.
  • the convex portion 111 may also be T-shaped as shown in FIG. 4C.
  • the convex portion 111 may have a shape of a collection of multiple grains, a mushroom shape, the surface of a lotus leaf, or a needle shape.
  • the surface of the adhesive layer 110 may be rough or fibrous, and such a surface may also be said to have unevenness.
  • each convex portion 111 is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, still more preferably 5 ⁇ m or more, and even more preferably 10 ⁇ m or more, from the viewpoint of maintaining the holding force of the element.
  • the thickness is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, still more preferably 30 ⁇ m or less, and still more preferably 20 ⁇ m or less.
  • the width and diameter of the convex portion 111 mean the minimum distance and maximum distance (represented by D in FIG. 4A) between two parallel lines touching from both sides of the convex portion 111 on the surface of the concave portion, respectively. do.
  • each convex portion 111 is preferably 10 ⁇ m 2 or more, more preferably 20 ⁇ m 2 or more, and even more preferably 30 ⁇ m 2 or more, from the viewpoint of maintaining the holding force of the element.
  • the thickness is preferably 2000 ⁇ m 2 or less, more preferably 1000 ⁇ m 2 or less, and even more preferably 500 ⁇ m 2 or less.
  • the area of the convex portion 111 means the area of the portion protruding from the surface of the concave portion (in the case of FIG. 4A, the area of a circle with a diameter D).
  • the height of each convex portion 111 is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, and still more preferably 5 ⁇ m or more, from the viewpoint of improving the ease of peeling the element.
  • the height of each convex portion 111 is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and still more preferably 10 ⁇ m or less. This allows the holding force of the element to be changed.
  • the height of the convex portion 111 is represented by H in FIG. 4A.
  • the heights of the plurality of convex portions included in the adhesive layer 110 are uniform.
  • the adhesive layer 110 may have a first plurality of protrusions having a first uniform height and a second plurality of protrusions having different heights.
  • the second plurality of convex portions may have a second uniform height.
  • the convex portion 111 may include such a first convex portion and a second convex portion.
  • the adhesive layer 110 may have a plurality of protrusions of random height.
  • the total area of the convex portions 111 relative to the area of the adhesive layer 110 is preferably 1% or more, more preferably 5% or more, still more preferably 10% or more, and still more preferably 18% or more. % or more, more preferably 40% or more.
  • the total area of the convex portions relative to the area of the adhesive layer 110 is preferably 95% or less, more preferably 75% or less, and even more preferably 60% or less, from the viewpoint of increasing the ease of peeling the element.
  • the unevenness of the adhesive layer 110 may be designed according to the shape of the element held by the sheet.
  • the ratio of the adhesion area between the adhesive layer 110 and one element to the area of one element is preferably 1% or more with respect to 100% of the area of one element, from the viewpoint of maintaining the holding force of the element. , more preferably 2% or more, still more preferably 3% or more, even more preferably 4% or more, even more preferably 5% or more, still more preferably 7% or more, even more preferably 10% or more.
  • the ratio of the adhesion area between the adhesive layer 110 and one element to the area of one element is preferably 95% or less, more preferably 70% or less, and even more preferably is 50% or less, more preferably 30% or less.
  • the adhesive area corresponds to the area of a circle with diameter T. Note that if the holding position of the element on the sheet shifts, the adhesive area may change. In this case, it is preferable that the bonding area ratio falls within the above range regardless of the position of the object to be treated.
  • the element transfer sheet according to the present embodiment may include a release sheet 150 that is in contact with the adhesive layer 110 and has an uneven surface complementary to the uneven surface of the adhesive layer 110.
  • FIG. 1 shows a state in which the adhesive layer 110 and the release sheet 150 are separated.
  • the release sheet 150 has a release layer 160.
  • the peeling layer 160 is a layer that is easily peelable from the adhesive layer 110.
  • the release layer 160 may have an uneven surface complementary to the uneven surface of the adhesive layer 110. That is, the release layer 160 has a concave portion 161, and the concave portion 161 has a shape complementary to the convex portion 111. However, it is not essential that the recess 161 have a complementary shape to the protrusion 111.
  • the release sheet 150 may include a base material 170 on the surface not in contact with the adhesive layer 110.
  • This substrate 170 can be designed similarly to substrate 120, but need not have the same composition or structure as substrate 120.
  • the material of the base material 120 may be EMAA
  • the material of the base material 170 may be polyethylene terephthalate.
  • the release sheet 150 may include an undercoat layer (not shown) between the release layer 160 and the base material 170.
  • the above sheet may have layers other than the base material and the adhesive layer.
  • an additional adhesive layer may be provided on the surface of the substrate opposite to the adhesive layer.
  • the sheet can be attached to another object via such an adhesive layer.
  • the type of the additional adhesive layer is not particularly limited, and for example, the additional adhesive layer can be formed using a common adhesive.
  • the adhesive strength of the element transfer sheet is preferably 1 mN/50 mm or more, more preferably 5 mN/50 mm or more, even more preferably 10 mN/50 mm or more, even more preferably 15 mN/50 mm or more, even more preferably 20 mN/50 mm or more, from the viewpoint of suppressing misalignment when holding the element, and is preferably 1000 mN/50 mm or less, more preferably 500 mN/50 mm or less, even more preferably 100 mN/50 mm or less, even more preferably 50 mN/50 mm or less, from the viewpoint of peeling off the held element from the adhesive layer 110 without damaging it.
  • the adhesive strength is measured as follows. That is, after cutting the element transfer sheet into a size of 200 mm long x 50 mm wide, the surface of the adhesive layer is pressed onto the mirror surface of the mirror silicon wafer using a laminator. After pressing, the sheet is left to stand for 1 hour in an environment of 23 ° C. and 50% RH (relative humidity), to prepare an adhesive strength measurement sample.
  • the adhesive strength of the adhesive strength measurement sample thus prepared is measured in an environment of 23°C and 50% RH (relative humidity) using a tensile tester (manufactured by A&D Co., Ltd., product name "Tensilon (registered trademark)") with a peel angle of 180° and a tensile speed of 300 mm/min, based on JIS Z0237:2000, except for the measurement conditions mentioned above.
  • a tensile tester manufactured by A&D Co., Ltd., product name "Tensilon (registered trademark)
  • the element transfer sheet can be expanded in the planar direction while holding the element.
  • the method of expanding the sheet is not particularly limited.
  • the sheet may be expanded in one direction, two directions, or multiple other directions.
  • the expansion rate of the element transfer sheet is also not particularly limited. By increasing the amount of expansion, the spacing between elements after expansion tends to increase.
  • the expansion rate of the sheet in one direction may be 50% or more, 100% or more, 150% or more, or 250% or more.
  • the expansion rate of the sheet in two directions orthogonal to each other may be 50% or more, at least 100% or more, 150% or more, or 250% or more. good.
  • the sheet can be expanded by fixing the sheet to a frame and pressing a base against the sheet inside the frame.
  • Figure 5A shows a state in which the sheet holds elements 140a-140d.
  • the outer periphery of the sheet can be fixed to frame 320.
  • the shape of frame 320 is not particularly limited.
  • frame 320 may be a circular or rectangular frame-shaped member having an opening.
  • a circular ring frame is used as the frame.
  • the sheet can be expanded in all directions.
  • the seat can be expanded by bringing the sheet fixed to the frame 320 into contact with the pedestal 310 and further displacing (pulling down) the frame 320 toward the pedestal 310 as shown in FIG. 5B. Furthermore, as the sheet expands, the intervals between the elements 140a to 140d held by the sheet widen.
  • the configuration of the pedestal 310 is not particularly limited, and may have a cylindrical shape or a rectangular parallelepiped shape, for example. Further, the pedestal 310 may have a mesh shape or a ring shape.
  • the frame 320 may be displaced with respect to the pedestal 310, for example, at a speed of 0.1 mm/sec or more, or at a speed of 1 mm/sec or more. In this case, the amount of displacement of the frame 320, that is, the amount of withdrawal, may be, for example, 20 mm or more, or 50 mm or more.
  • the spacing between the elements becomes larger.
  • a plurality of devices are formed by dicing a wafer substrate held by adhesive layer 110.
  • the average value of the spacing between the plurality of elements is preferably 2.5 mm or more, and preferably 3.0 mm or more.
  • the length is more preferably 3.5 mm or more, even more preferably 4.0 mm or more, and particularly preferably 5.0 mm or more.
  • the interval between multiple elements refers to the distance between adjacent elements.
  • the average value of the spacing between a plurality of elements is determined for a data group including the spacing for all pairs of elements adjacent in the first direction and the spacing for all pairs of elements adjacent in the second direction. Corresponds to the average value.
  • the element transfer sheet can be expanded by 80 mm in the first direction and the second direction that are orthogonal to each other.
  • a ring frame with an inner diameter of 194 mm can be used as the frame 320.
  • a cylindrical member having a diameter slightly smaller than the inner diameter of the frame 320 can be used.
  • expanding the transfer sheet by 80 mm in the first direction and the second direction that are perpendicular to each other can be achieved by lowering the frame 320 by 80 mm from the base 310.
  • the intervals between the elements become more uniform.
  • a plurality of devices are formed by dicing a wafer substrate held by adhesive layer 110.
  • the coefficient of variation of the spacing between the plurality of elements is preferably 0.20 or less, and 0.15 It is more preferable that it is below.
  • the coefficient of variation is expressed by mean value/standard deviation. The average value of the spacing between multiple elements is defined as described above.
  • the standard deviation of the spacing between multiple elements is defined as the standard deviation of the spacing between the plurality of elements for a data group including the spacing for all pairs of elements adjacent in the first direction and the spacing for all pairs of elements adjacent in the second direction. Corresponds to the standard deviation.
  • a sheet having an adhesive layer 110 on a substrate 120 can be manufactured as follows. First, an organic solvent is added to a raw material composition containing each component of the adhesive layer 110 described above to prepare a solution of the raw material composition. Then, this solution is applied onto the substrate 120 to form a coating film, and then the solution is dried to provide an adhesive layer on the substrate 120. Furthermore, a treatment is performed to provide irregularities on the surface of the adhesive layer, thereby forming an adhesive layer 110 having irregularities.
  • Examples of the organic solvent used to prepare the solution of the raw material composition include toluene, ethyl acetate, and methyl ethyl ketone.
  • Examples of methods for applying the solution include spin coating, spray coating, bar coating, knife coating, roll coating, roll knife coating, blade coating, die coating, gravure coating, and printing (e.g. screen printing method, inkjet method), etc.
  • unevenness can be provided on the surface of the adhesive layer 110 using an imprint method.
  • a mold having a surface complementary to the unevenness to be provided can be used.
  • unevenness can be provided on the surface of the adhesive layer by heating the adhesive layer while pressing the adhesive layer provided on the base material with a mold.
  • the adhesive layer is pressed with a mold, the adhesive layer is heated and maintained for a predetermined period of time, and then the adhesive layer is cooled and the mold can be removed.
  • the adhesive layer can be heated to a temperature higher than the softening point of the adhesive layer, for example.
  • the time period for maintaining the adhesive layer in the heated state is not particularly limited, but may be maintained for 10 seconds or more, or for 10 minutes or less, for example.
  • a specific method for heating the adhesive layer while pressing it with a mold includes a method of vacuum laminating the adhesive layer provided on the base material and the mold. Note that instead of performing the two-step process of forming an adhesive layer and forming unevenness, an adhesive layer having an uneven surface may be formed on the base material in a one-step process. Moreover, the release sheet 150 provided with the release layer 160 having unevenness as described above may be used as the mold.
  • the adhesive layer 110 having a rough surface can be provided by spray coating a solution of the raw material composition. Furthermore, the adhesive layer 110 having a rough or fibrous surface can be provided by adding a filler to a solution of the raw material composition and applying such a solution. As yet another method, the adhesive layer 110 having an uneven shape can be directly provided on the base material 120 by applying a solution of the raw material composition according to a desired pattern using a printing method such as an inkjet method. .
  • the sheet according to this embodiment can be used to transfer elements.
  • the sheet according to this embodiment can be used to transfer a semiconductor chip obtained by dicing to a desired position.
  • the device transfer method using the sheet according to this embodiment will be described with reference to the flowchart of FIG.
  • the element is held in the adhesive layer of the element transfer sheet according to this embodiment.
  • the type of element is not particularly limited.
  • the element may be, for example, a semiconductor chip such as an LED chip, a semiconductor chip with a protective film, or a semiconductor chip with a die attach film (DAF).
  • the element may be a micro light-emitting diode, a mini light-emitting diode, a power device, a MEMS (Micro Electro Mechanical Systems), or a controller chip, or may be a component thereof.
  • the element may be an individualized object such as a wafer, a panel, or a substrate.
  • the element may have a circuit surface on which an integrated circuit having circuit elements such as transistors, resistors, and capacitors is formed.
  • the element is not necessarily limited to an individualized object, and may be various wafers or various substrates that are not individualized.
  • the size of the element is not particularly limited.
  • the size of the element may be, for example, preferably 100 ⁇ m 2 or more, more preferably 500 ⁇ m 2 or more, and still more preferably 1000 ⁇ m 2 or more.
  • the size of the element may be preferably 100 mm 2 or less, more preferably 25 mm 2 or less, and still more preferably 1 mm 2 or less.
  • wafers examples include silicon wafers, silicon carbide (SiC) wafers, compound semiconductor wafers (e.g., gallium phosphide (GaP) wafers, gallium arsenide (GaAs) wafers, indium phosphide (InP) wafers, gallium nitride (GaN)).
  • semiconductor wafers such as wafers.
  • the size of the wafer is not particularly limited, but is preferably 6 inches (about 150 mm in diameter) or more, more preferably 12 inches (about 300 mm in diameter) or more. Note that the shape of the wafer is not limited to a circle, and may be square or rectangular, for example.
  • the panel examples include fan-out semiconductor packages (for example, FOWLP or FOPLP). That is, the object to be processed may be a semiconductor package before or after singulation in a fan-out type semiconductor package manufacturing technique.
  • the size of the panel is not particularly limited, it may be a rectangular substrate of about 300 to 700 mm, for example.
  • the substrate examples include a glass substrate, a sapphire substrate, a compound semiconductor substrate, and the like.
  • the elements are transferred from the holding substrate to the element transfer sheet, and the element transfer sheet holds the transferred elements.
  • a semiconductor wafer can be attached onto a wafer substrate, and then the semiconductor wafer can be diced. Then, the elements on the wafer substrate obtained by dicing can be brought into close contact with the adhesive layer 110 of the element transfer sheet. Thereafter, by applying an external stimulus such as a laser beam, the adhesiveness between the wafer substrate and the element can be reduced. Through such a process, the elements can be transferred from the wafer substrate to the semiconductor transfer sheet.
  • a holding substrate to which the elements are attached can be obtained. Then, the elements attached to the holding substrate can be transferred to the adhesive layer 110 of the element transfer sheet by the same method.
  • the element attached to the holding substrate may be separated from the holding substrate by external stimulation.
  • the element is separated from the holding substrate.
  • the element approaches relatively to the element transfer sheet. Then, by contact between the element and the adhesive layer 110 of the sheet, the element is separated from the holding substrate and captured on the sheet.
  • the type of external stimulation is not particularly limited, and examples thereof include energy application, cooling, expansion of the holding substrate, and physical stimulation (for example, pressing the back surface of the holding substrate with a pin or the like).
  • the bond between the holding substrate and the device can be reduced and the device can be separated from the holding substrate.
  • the device can be separated from the holding substrate by irradiation with laser light (laser lift-off method).
  • pressure is created between the elements and the adhesive layer 110 as the separated elements approach the adhesive layer 110.
  • the surface of the adhesive layer 110 has irregularities, the pressure generated between the element and the adhesive layer 110 is alleviated, making it easier to capture the element at a desired position on the sheet.
  • a semiconductor wafer is attached to the adhesive layer 110 of the element transfer sheet. Then, elements are formed by dicing the semiconductor wafer on the adhesive layer 110. Also by such a method, the element transfer sheet can hold the elements.
  • S20 Expansion of element transfer sheet
  • the element transfer sheet is expanded in the surface direction. Expanding the sheet increases the spacing between the elements. Therefore, handling of the element in the next step becomes easy. Note that, in one embodiment, the holding force of the element is reduced by expanding the sheet, so that the element can be easily peeled off in the next step.
  • the specific method for expanding the sheet is as described above.
  • the element is peeled off from the adhesive layer 110 of the element transfer sheet.
  • the element is peeled off from the adhesive layer 110 of the element transfer sheet expanded in the plane direction.
  • the method for peeling off the element is not particularly limited.
  • the above-mentioned method can be used to transfer the elements attached to the holding substrate to the element transfer sheet.
  • the element can be moved to the transfer destination by bringing the transfer destination substrate or sheet close to the surface of the element and pressing the surface of the sheet opposite to the element with a pin or the like. can.
  • the element can be peeled off from the adhesive layer 110 of the sheet using a suction member such as a vacuum chuck, and moved to a desired transfer destination position. If the holding force by the adhesive layer 110 is reduced by expanding the sheet, the element may be peeled off from the adhesive layer 110 of the sheet without applying physical stimulation from the opposite side of the adhesive layer 110 of the sheet. Furthermore, by bringing the elements held on the element transfer sheet into close contact with the transfer destination substrate or sheet, and applying external stimulation such as laser light, the adhesiveness between the element transfer sheet and the elements is reduced. You may let them. Also by such a method, the elements can be moved from the element transfer sheet to the transfer destination. In this case, by expanding the element transfer sheet, the relative arrangement of the plurality of elements before the sheet is expanded and the relative arrangement of the plurality of elements at the transfer destination change.
  • a suction member such as a vacuum chuck
  • the element can be transferred to an arbitrary transfer destination using the element transfer sheet. Further, by using such a transfer method, an electronic component or a semiconductor device having an element can be manufactured. Note that processing or processing may be performed on the elements held by the element transfer sheet.
  • crosslinking agent an isocyanurate type polyisocyanate derived from hexamethylene diisocyanate was used.
  • ⁇ (D) component photopolymerization initiator> 2,4,6-trimethylbenzoyldiphenylphosphine oxide was used as a photopolymerization initiator.
  • the tensile stress of the base material used in each example was evaluated as follows. As a test sample, a base material cut into a size of 150 mm in the MD direction x 15 mm in the TD direction was used. The tensile stress of this test sample was measured in an environment of 23° C. and 50% RH (relative humidity) in accordance with JIS K 7161-1:2014 and JIS K 7127:1999. For the measurement, a tensile testing machine (manufactured by Shimadzu Corporation, product name "Autograph (registered trademark) AG-IS 500N”) was used.
  • a tensile test was performed on the test sample at a speed of 200 mm/min, and the tensile stress (MPa) in the MD direction when the support was 100% stretched was measured.
  • MPa tensile stress
  • a similar test was conducted using a base material cut to 150 mm in the TD direction x 15 mm in the MD direction as a test sample, and the tensile stress (MPa) in the TD direction at the time of 100% elongation of the support was measured.
  • the expansion test of the sheet obtained in each Example was carried out as follows: First, the adhesive layer of the sheet obtained in each Example was attached to a ring frame (made of stainless steel, inner diameter 194 mm), and the sheet was cut to fit the outer diameter of the ring frame.
  • a wafer substrate (mirror silicon wafer, 6 inches, thickness 150 ⁇ m) was fixed to a separately prepared dicing tape. Then, by dicing the wafer substrate into squares of 10 mm x 10 mm, a plurality of elements (silicon chips, element size: 10 mm x 10 mm x 150 ⁇ m) were obtained. A plurality of the obtained elements were attached to the adhesive layer of the sheet at the inner center of the ring frame so that the mirror surface was attached to the adhesive layer. The attachment was performed by laminating at room temperature (23°C). Then, by peeling off the dicing tape, a plurality of elements were transferred from the dicing tape to the sheet. In this way, a sheet on which a plurality of elements were placed and supported by a ring frame was obtained as an evaluation sample.
  • a wafer substrate mirror silicon wafer, 6 inches, thickness 150 ⁇ m
  • the obtained evaluation sample was placed in the expanding device shown in FIG. 5A.
  • the frame 320 which is a ring frame, was pushed down at a speed of 1 mm/sec and a withdrawal amount of 80 mm.
  • the distance between each chip was measured using a digital microscope.
  • the interval between each chip refers to the distance between adjacent chips.
  • the average value and coefficient of variation of the spacing between each chip were calculated.
  • the average value and coefficient of variation of the spacing between a plurality of chips are for a data group including the spacing for all sets of chips adjacent in the first direction and the spacing for all sets of chips adjacent in the second direction. corresponds to the average value and coefficient of variation.
  • a pressure-sensitive adhesive composition was prepared by dissolving a portion by weight in toluene. This adhesive composition was coated on the release-treated surface of a release sheet (manufactured by Lintec Corporation, product name: SP-PET382150, polyethylene terephthalate film laminated with a silicone release agent, thickness 38 ⁇ m). The resulting coating film was dried at 100° C. for 2 minutes to form an adhesive layer with a thickness of 25 ⁇ m. The storage modulus of the resulting adhesive layer was 2.04 MPa.
  • FIG. 1 shows the tensile modulus and elongation at break (TD direction and MD direction) of the base material.
  • the adhesive layer was bonded to a replica mold in which a concave shape had been formed in advance, and vacuum laminated at 60° C. for 300 seconds.
  • a sheet having an uneven surface was produced by irradiating ultraviolet rays at an illuminance of 200 mW/cm 2 and a light amount of 800 mJ/cm 2 using an ultraviolet irradiator (manufactured by Heraeus).
  • the uneven shape of the adhesive layer of the sheet was a shape in which pillars were arranged in a lattice pattern as in FIG. 2A.
  • the pitch P between pillars in the sheet was 20 ⁇ m.
  • the ratio of the area of the bonded portion between the adhesive layer and the captured element (that is, the area of the tip surface of the convex portion) to the area of the sheet was approximately 12.6%.
  • the replica mold one having a surface shape complementary to such an uneven shape was used.
  • Table 1 shows the average value and coefficient of variation of the chip spacing obtained. Further, Table 1 further shows the evaluation results of the extended test, which were evaluated based on the size of the chip spacing and the variation in the chip spacing. In Table 1, "A” indicates that the evaluation result was good, and “F” indicates that the evaluation result was not good.
  • Example 2 An EMAA film (ethylene-methacrylic acid copolymer film, acid content 9% by mass, one surface embossed to give a satin finish, thickness 80 ⁇ m) was used as the base material, and a non-embossed EMAA film was used on the adhesive layer.
  • a sheet was produced in the same manner as in Example 1, except that the treated surfaces were bonded together.
  • the adhesive strength of the sheet of Example 2 was 23.5 mN/50 mm.
  • Example 3 A sheet was produced in the same manner as in Example 1, except that a PO film (ethylene-block propylene copolymer, thickness 110 ⁇ m) was used as the base material.
  • a PO film ethylene-block propylene copolymer, thickness 110 ⁇ m
  • Example 1 A sheet was produced in the same manner as in Example 1, except that an LDPE film (amorphous low-density polyethylene, thickness 70 ⁇ m) was used as the base material.
  • LDPE film amorphous low-density polyethylene, thickness 70 ⁇ m
  • the chip spacing becomes particularly large and the variation in the chip spacing becomes particularly small, and particularly good evaluation results are obtained.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Decoration By Transfer Pictures (AREA)
PCT/JP2023/034247 2022-09-22 2023-09-21 素子転写用シート Ceased WO2024063126A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
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