WO2024051021A1 - 一种托盘结构及托盘结构的包胶工艺 - Google Patents
一种托盘结构及托盘结构的包胶工艺 Download PDFInfo
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- WO2024051021A1 WO2024051021A1 PCT/CN2022/138941 CN2022138941W WO2024051021A1 WO 2024051021 A1 WO2024051021 A1 WO 2024051021A1 CN 2022138941 W CN2022138941 W CN 2022138941W WO 2024051021 A1 WO2024051021 A1 WO 2024051021A1
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- Prior art keywords
- frame
- silicone rubber
- tray body
- tray
- structure according
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- 238000000034 method Methods 0.000 title claims abstract description 7
- 230000008569 process Effects 0.000 title claims abstract description 6
- 238000010073 coating (rubber) Methods 0.000 title abstract 2
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 70
- 239000004945 silicone rubber Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 21
- 239000000084 colloidal system Substances 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- -1 FPM Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 229920002943 EPDM rubber Polymers 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 claims description 3
- 229920005560 fluorosilicone rubber Polymers 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 238000004073 vulcanization Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 abstract description 3
- 239000005060 rubber Substances 0.000 abstract description 3
- 230000008602 contraction Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 13
- 230000007306 turnover Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000000704 physical effect Effects 0.000 description 1
- 229920003208 poly(ethylene sulfide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
Definitions
- the invention relates to the field of chip loading, and in particular to a tray structure and a coating process of the tray structure.
- an automated handling device is generally used to place a single chip into the storage space of a pallet, and then a large number of chips are transported to the required location by stacking the pallets.
- soft materials are usually coated on hard materials. However, the surface adhesion of the two is low and it is difficult to bond with the pallet, especially in high temperature environments, due to the shrinkage rate and The difference in shrinkage rates can easily cause hard materials and soft materials to deform each other, causing unstable mechanical structures, substandard dimensions, or even separation of the two.
- the present invention provides a pallet structure and a coating process of the pallet structure to avoid damage to the surface of the chip during turnover or transportation.
- a pallet structure consisting of:
- the tray body is arranged in a stacked manner
- a first frame and a second frame adapted to form a receiving cavity are respectively provided on the upper and lower surfaces of the tray body;
- a silicone rubber layer covering the inner and outer wall surfaces of the first frame and the second frame, with both ends of the silicone rubber layer extending outward.
- a glue layer is provided between the first frame, the second frame and the silicone rubber layer.
- the glue layer is a single-liquid silane coupling agent, which is composed of lower alcohol, fat, organic silicon resin and silane coupling agent.
- the silicone rubber layer is made of liquid silicone rubber, polybutadiene rubber, CSM, vinyl silicone rubber, low phenyl silicone rubber, room temperature vulcanized silicone rubber, EPDM, chloroprene rubber, FPM , fluorosilicone rubber, PE, PP, PVC-U, PVC-C, ABS, PVDF or AB glue.
- the first frame is enclosed by an upper frame, a middle frame and a lower frame to form a placement space for two products, and is arranged in an intermittent manner.
- the upper frame, the middle frame and the lower frame are all provided with chamfered edges near the inner corners.
- the second frames are in a group of two and are arranged in a step shape; a slot that engages with the middle frame is provided between the two second frames.
- the outer corner of the second frame is in contact with the chamfered edge of the first frame.
- the tray body is made of heat-resistant plastic material.
- the tray body is provided with a through hole at the discontinuous middle section of the first frame and the second frame, and the silicone rubber layer is provided in the through hole to connect the space between the first frame and the second frame.
- the silicone rubber layer on the first frame and the second frame.
- a connecting groove filled with silicone rubber is provided in the tray body, and both ends of the silicone rubber are respectively provided on the silicone holes located on the first frame and the second frame. between the rubber layers, and between the silicone rubber layers located on the other of the first frame and the second frame.
- the upper and lower surfaces of the pallet body are provided with baffles that separate the first frame and the second frame, and the baffles include an upper limit plate and a lower limit plate, and Presented in a staggered setting.
- the tray body and the silicone rubber layer contain conductive materials.
- a coating process for pallet structures including:
- the tray body is integrally formed using high-temperature resistant plastic materials through injection molding process;
- the silicone rubber is coated on the above-mentioned parts coated with colloid through the injection process. After vulcanization and shaping, the glue is tightly connected to the tray body.
- the present invention has the following beneficial effects:
- a flexible material is provided on the surface of the tray body that is in contact with the chip.
- the flexible material is elastic and can engage the chip to fix it. It also cooperates with the limited space and structure to reduce relative movement between it and the tray body. , thereby reducing damage to the chip surface during transportation or turnover.
- the tray body and silicone rubber layer are made of high-temperature-resistant materials, and their performance and structure will not change significantly as the temperature rises, ensuring stability.
- Figure 1 is a schematic structural diagram of an existing pallet according to the present invention.
- Figure 2 is a schematic cross-sectional structural view of the tray body with a silicone rubber layer of the present invention.
- Figure 3 is a schematic cross-sectional structural diagram of a tray body with a glue layer according to the present invention.
- Figure 4 is an enlarged structural schematic diagram of Figure 3A of the present invention.
- Figure 5 is a schematic structural diagram of the upper and lower surfaces of the tray body with a silicone rubber layer of the present invention.
- Figure 6 is a schematic structural diagram of the upper and lower surfaces of the tray body of the present invention.
- Base plate 10. Support frame; 11. Storage slot; 2. Tray body; 21. First frame; 210. Chamfered edge; 211. Upper frame; 212. Middle frame; 213. Lower frame; 22. Second Frame; 3. Glue layer; 4. Silicone rubber layer; 5. Baffle; 50. Lower limit plate; 51. Upper limit plate; 6. Through hole; 7. Connection slot; 8. Card slot.
- the base plate 1 has storage slots 11 distributed in the base plate 1 at intervals.
- the storage slots 11 are surrounded by surrounding support frames 10 .
- the side end surface of the chip is engaged with the inner wall of the support frame 10 , and the lower surface of the chip is in contact with the tray body 2 , and the chip is transported or turned over through the stacked substrates 1 .
- tray structure Since the above-mentioned tray structure is in hard contact with the chip, it is easy to damage the surface of the chip during transportation or turnover, reducing the protection of the chip.
- the technical solution of the present invention provides a tray structure and a coating process of the tray structure.
- a flexible material is provided on the surface of the tray body 2 that is in contact with the chip.
- the flexible material is elastic and can be engaged. Hold the chip to fix it, and cooperate with the limited space and structure to reduce relative movement between it and the tray body 2, thereby reducing damage to the surface of the chip during transportation or turnover.
- the tray body 2 is arranged in a stacked manner to facilitate one-time transportation or turnover of batches of chips, thereby improving work efficiency.
- the tray body 2 is made of heat-resistant plastic material.
- the material can be made of CIPI, PEEK, PAI, PBI, PEI, PPS, nylon 46, PSU, PES, PTFE, PVDF and other plastic materials. Its performance and structure will not increase with the temperature. High and large changes occur, ensuring structural stability.
- the upper and lower surfaces of the tray body 2 are respectively provided with a first frame 21 and a second frame 22 adapted to the first frame 21 to form a receiving cavity.
- the position of the first frame 21 varies with the model and structure of the chip. Change.
- the silicone rubber layer 4 covers the inner and outer wall surfaces of the first frame 21 and the second frame 22, and the two ends of the silicone rubber layer 4 extend outward.
- the tray body 2 is provided with a through hole 6 at the discontinuous middle section of the first frame 21 and the second frame 22 , and a silicone rubber layer 4 is provided in the through hole 6 to connect the components located in the first frame 21 and silicone rubber layer 4 on the second frame 22.
- the tray body 2 is provided with a connecting groove 7 filled with silicone rubber.
- the two ends of the silicone rubber are respectively located between the silicone rubber layer 4 on a first frame 21 and a second frame 22. , and between the silicone rubber layer 4 on the other first frame 21 and the second frame 22 .
- the above-mentioned through holes 6 and connecting grooves 7 are provided to integrate the silicone rubber layer 4 on the first frame 21 and the second frame 22 and the silicone rubber layer 4 on each set of the first frame 21 and the second frame 22 Molding increases the stability of the silicone rubber layer 4 and reduces molding steps.
- the silicone rubber and the silicone rubber layer 4 are made of the same material.
- the upper and lower surfaces of the pallet body 2 are provided with baffles 5 that separate the first frame 21 and the second frame 22.
- the baffles 5 include upper limit plates 51 and lower limit plates 50, which are arranged in a staggered manner.
- the silicone rubber located in the connecting groove 7 is pressed by the upper limit plate 51 and the lower limit plate 50 and will not be warped or deformed, thereby avoiding affecting the overall performance of the silicone rubber layer 4 .
- the first frame 21 is surrounded by an upper frame 211, a middle frame 212 and a lower frame 213 to form a placement space for two product chips, and is arranged in an intermittent manner. After the chip is placed in the first frame 21, it can facilitate air circulation on the surface of the chip during baking, prevent heat from being concentrated and difficult to dissipate, and at the same time, it is also convenient to take out the chip from the frame.
- the upper frame 211 , the middle frame 212 and the lower frame 213 are all provided with chamfered edges 210 near the inner corners.
- the chamfered edge 210 has a guiding role.
- the second frames 22 are in a group of two and are arranged in a step shape; a slot 8 engaging with the middle frame 212 is provided between the two second frames 22 .
- the outer corner of the second frame 22 abuts the chamfered edge 210 of the first frame 21 .
- the movement space of the chip is limited to the first frame 21, and the silicone rubber layer 4 is provided on the surrounding walls of this space, which can also better protect the chip and prevent the chip from interacting with the frame except for a small part around it. Other surfaces within the chip come into contact, causing surface damage to the chip.
- the silicone rubber layer 4 is made of liquid silicone rubber, polybutadiene rubber, CSM, vinyl silicone rubber, low phenyl silicone rubber, room temperature vulcanized silicone rubber, EPDM, chloroprene rubber, FPM, fluorosilicone rubber, One or more combinations of PE, PP, PVC-U, PVC-C, ABS, PVDF or AB glue.
- the combination of liquid silicone and AB glue is used, so that the silicone rubber has its own viscosity, and also has excellent tear resistance, resilience, yellowing resistance, thermal stability and heat resistance and aging resistance. It can be combined with the frame surface of the pallet body 2 and expand the applicable scenarios.
- a glue layer 3 is provided between the first frame 21 and the second frame 22 and the silicone rubber layer 4 .
- the glue layer 3 is a single-liquid silane coupling agent, which is composed of lower alcohol, fat, organic silicone resin and silane coupling agent. Among them, the mass fractions are 43%, 49.6%, 6.4% and 1% respectively.
- the function of the above-mentioned glue layer 3 increases the surface adhesion between the tray body 2 and the silicone rubber layer 4, making them well bonded together, and avoiding the shrinkage and shrinkage of the silicone rubber layer 4 caused by the difference. Deformation and shedding.
- the tray body 2 and the silicone rubber layer 4 also contain conductive materials.
- the conductive materials can be polypyrrole, polyphenylene sulfide, polyphthalocyanine compounds, polyaniline, polythiophene, etc.
- the present invention also provides a coating process for the pallet structure, which includes: selecting high-temperature resistant plastic materials to integrally mold the pallet body 2 through an injection molding process.
- the glue is applied to the inner and outer wall surfaces of the first frame 21 and the second frame 22 of the tray body 2 through a coating machine to form a glue layer, and then baked.
- the colloid needs to be selected according to the required ingredient concentration. After application, it needs to be left to dry for 10-30 minutes, or it can be baked in an oven with a temperature of up to 80°C and a time of 3-8 minutes.
- the silicone rubber is coated on the above-mentioned parts coated with colloid through the injection process. After vulcanization and shaping, the glue is closely connected to the tray body 2 connect.
- a coating machine can be used or not to apply colloid on the tray body 2.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
本发明涉及芯片装载领域，公开了一种托盘结构及托盘结构的包胶工艺。包括：托盘本体，位于托盘本体的上下两表面分别设有第一框架和与第一框架相适配以形成容纳空腔的第二框架，包覆于第一框架和第二框架内壁面和外壁面的硅橡胶层，硅橡胶层的两端向外延伸，位于第一框架和第二框架与硅橡胶层之间设有胶层。在托盘本体上与芯片接触的表面设有柔性材料，柔性材料具有弹性，并且能够卡合住芯片，使芯片加以固定，并配合有限的空间和结构，使之与托盘本体之间减少相对运动，从而减少在运输或周转时对芯片表面的损伤。在托盘本体与硅橡胶层之间设有胶层，增大了两者间的表面粘结性，使之很好的粘合在一起，避免缩水率和收缩率的不同造成变形与脱落。
Description
本发明涉及芯片装载领域，特别涉及一种托盘结构及托盘结构的包胶工艺。
近年来，随着国内电子行业的发展，我国已经成为世界第一电子大国，芯片生产数量飞速增长。在对制造完的芯片进行周转或运输时，其为芯片关键的一个步骤。
在现有技术中，一般采用自动化搬运装置将单独的一个芯片放置到托盘的容置空间内，然后通过托盘的层叠放置将大量的芯片运输至所需场所，
然而，本发明人在实施例中发现了如下缺陷：承载芯片的托盘进行移动、周转或运输中，容易使芯片在容置空间内做相对运动，从而损伤芯片，影响使用，增加不良率。同时，部分芯片需要放入烘箱中烘烤，而托盘结构在高温下难以保持原有的物理性质以及机械结构。为了解决上述托盘的问题，通常将软性材料包覆在硬性材料上，但是，两者的表面粘结性低，很难和托盘粘合在一起，尤其是在高温环境下，由于缩水率与收缩率的不同，很容易让硬性材料与软性材料彼此变形，机械结构不稳定，尺寸不达标，甚至二者脱离。
发明内容
为解决上述技术问题，本发明提供了一种托盘结构及托盘结构的包胶工艺，以避免芯片在周转或运输时表面受到损伤。
为达到上述目的，本发明的技术方案如下：
一种托盘结构，包括：
托盘本体，呈堆叠设置；
位于所述托盘本体的上下两表面分别设有第一框架和与所述第一框架相适配以形成容纳空腔的第二框架；
包覆于所述第一框架和第二框架内壁面和外壁面的硅橡胶层，所述硅 橡胶层的两端向外延伸。
作为本发明的一种优选方案，位于所述第一框架和第二框架与硅橡胶层之间设有胶层。
作为本发明的一种优选方案，所述胶层为单液型矽烷耦合剂，其由低级醇、脂肪、有机矽树脂和矽烷偶联剂组成。
作为本发明的一种优选方案，所述硅橡胶层为采用液态硅胶、聚丁二烯橡胶、CSM、乙烯基矽橡胶、低苯基矽橡胶、室温硫化矽橡胶、EPDM、氯丁橡胶、FPM、氟矽橡胶、PE、PP、PVC-U、PVC-C、ABS、PVDF或AB胶。
作为本发明的一种优选方案，所述第一框架由上框、中框和下框围合形成有两产品的放置空间，且呈间断式设置。
作为本发明的一种优选方案，所述上框、中框和下框靠近内侧的边角处均设有倒角边。
作为本发明的一种优选方案，所述第二框架为两个一组，且呈台阶状设置；两所述第二框架之间设有与所述中框相卡合的卡槽。
作为本发明的一种优选方案，所述第二框架靠近外侧的边角处与所述第一框架的倒角边相抵合。
作为本发明的一种优选方案，所述托盘本体采用耐热塑料材质成型。
作为本发明的一种优选方案，所述托盘本体上位于所述第一框架和第二框架的间断中段处设有通孔，所述通孔内设有所述硅橡胶层以连接位于所述第一框架和第二框架上的所述硅橡胶层。
作为本发明的一种优选方案，所述托盘本体内开设有填充硅橡胶的连接槽，该所述硅橡胶的两端分别设于位于一所述第一框架和第二框架上的所述硅橡胶层之间、以及位于另一所述第一框架和第二框架上的所述硅橡胶层之间。
作为本发明的一种优选方案，所述托盘本体的上下两表面设有将所述第一框架和第二框架进行分隔的挡板，所述挡板包含有上限位板和下限位板，且呈交错设置。
作为本发明的一种优选方案，所述托盘本体和硅橡胶层中含有导电材质。
一种托盘结构的包胶工艺，包括：
选用耐高温塑料材料通过注塑工艺一体成型托盘本体；
通过涂覆机将胶体涂抹在托盘本体的第一框架和第二框架的内壁面和外壁面形成胶层，然后进行烘烤；
将烘烤完的托盘本体放入到适配模具的成型槽中，合模后，通过注射工艺将硅橡胶包覆在上述涂抹有胶体的部位，硫化定型后，使胶与托盘本体紧密连接。
综上所述，本发明具有如下有益效果：
在托盘本体上与芯片接触的表面设有柔性材料，该柔性材料具有弹性，并且能够卡合住芯片，使芯片加以固定，并配合有限的空间和结构，使之与托盘本体之间减少相对运动，从而减少在运输或周转时对芯片表面的损伤。
托盘本体和硅橡胶层选用耐高温材料，其性能和结构不会随温度的升高而发生较大的变化，保证了稳定性。
在托盘本体与硅橡胶层之间设有胶层，增大了两者间的表面粘结性，使之很好的粘合在一起，且避免了缩水率和收缩率的不同造成变形与脱落。
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明的现有托盘结构示意图。
图2为本发明的有硅橡胶层的托盘本体剖视结构示意图。
图3为本发明图有胶层的托盘本体剖视结构示意图。
图4为本发明图3A的放大结构示意图。
图5为本发明的带有硅橡胶层的托盘本体上下两表面结构示意图。
图6为本发明的托盘本体本身的上下两表面结构示意图。
图中数字和字母所表示的相应部件名称：
1、基板；10、支撑架；11、置物槽；2、托盘本体；21、第一框架； 210、倒角边；211、上框；212、中框；213、下框；22、第二框架；3、胶层；4、硅橡胶层；5、挡板；50、下限位板；51、上限位板；6、通孔；7、连接槽；8、卡槽。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1所示，为现有技术的托盘结构，现结合具体的实施例进行说明。
基板1，间隔分布于基板1内的置物槽11，置物槽11由周围的支撑架10围合形成。
芯片的侧端面与支撑架10的内壁相卡抵，并且芯片的下表面与托盘本体2相接触，并通过堆叠的基板1，对芯片进行运输或周转。
而上述的托盘结构因与芯片为硬接触，容易在运输或周转的过程中损伤芯片表面，减少了对芯片的保护。
为了解决上述问题，本发明的技术方案提供了一种托盘结构及托盘结构的包胶工艺，通过在托盘本体2上与芯片接触的表面设有柔性材料，该柔性材料具有弹性，并且能够卡合住芯片，使芯片加以固定，并配合有限的空间和结构，使之与托盘本体2之间减少相对运动，从而减少在运输或周转时对芯片表面的损伤。
如图2所示，下面为本发明的具体实施例
托盘本体2，呈堆叠设置，以方便成批的芯片进行一次性的运输或周转，提升了工作效率。
托盘本体2采用耐热塑料材质成型，该材料可选用CIPI、PEEK、PAI、PBI、PEI、PPS、尼龙46、PSU、PES、PTFE、PVDF等塑料材质，其性能和结构不会随温度的升高而发生较大的变化，保证了结构稳定性。
位于托盘本体2的上下两表面分别设有第一框架21和与第一框架21相适配以形成容纳空腔的第二框架22，该第一框架21的位置随芯片的型 号结构不同而发生改变。
包覆于第一框架21和第二框架22内壁面和外壁面的硅橡胶层4，硅橡胶层4的两端向外延伸。
具体地，如图6所示，托盘本体2上位于第一框架21和第二框架22的间断中段处设有通孔6，通孔6内设有硅橡胶层4以连接位于第一框架21和第二框架22上的硅橡胶层4。
如图5和6所示，托盘本体2内开设有填充硅橡胶的连接槽7，该硅橡胶的两端分别设于位于一第一框架21和第二框架22上的硅橡胶层4之间、以及位于另一第一框架21和第二框架22上的硅橡胶层4之间。
上述通孔6及连接槽7的设置为了使第一框架21和第二框架22上的硅橡胶层4，以及每一组第一框架21和第二框架22上的硅橡胶层4之间一体成型，增加硅橡胶层4的稳定性，减少成型步骤，上述硅橡胶与硅橡胶层4的材质相同。
托盘本体2的上下两表面设有将第一框架21和第二框架22进行分隔的挡板5，挡板5包含有上限位板51和下限位板50，且呈交错设置。
在两托盘本体2进行堆叠时，通过上限位板51和下限位板50的限制，使位于连接槽7内的硅橡胶得到压覆，不会翘起变形，避免影响硅橡胶层4的整体性能。
第一框架21由上框211、中框212和下框213围合形成有两产品芯片的放置空间，且呈间断式设置。在芯片放置到第一框架21后，能够利于在烘烤时芯片表面的空气流通，防止热量集中不易散发，同时，也方便从框架内取出芯片。
其中，上框211、中框212和下框213靠近内侧的边角处均设有倒角边210，为了便于装载芯片的顺畅性，防止芯片放置不平稳或卡设在第一框架21的内壁表面，所以该倒角边210具有导向作用。
第二框架22为两个一组，且呈台阶状设置；两第二框架22之间设有与中框212相卡合的卡槽8。
使得两托盘本体2的堆叠定位更加精准且牢固，避免在周转或运输过程中，托盘稍稍偏移一段距离，即发生两托盘之间的错位，造成托盘放置不稳定。
第二框架22靠近外侧的边角处与第一框架21的倒角边210相抵合。使芯片的运动空间限制在第一框架21内，其该空间内的四周壁面上都设置有硅橡胶层4，也能够更好地保护好芯片，避免了芯片除四周小部分外还会与框架内的其他表面相接触，从而造成芯片表面损伤。
上述实施例中，硅橡胶层4为采用液态硅胶、聚丁二烯橡胶、CSM、乙烯基矽橡胶、低苯基矽橡胶、室温硫化矽橡胶、EPDM、氯丁橡胶、FPM、氟矽橡胶、PE、PP、PVC-U、PVC-C、ABS、PVDF或AB胶的其中一种或多种组合。在本发明中，选用液态硅胶和A B胶的结合，使得硅橡胶自带粘性，同时还兼备优异的抗撕裂程度、回弹性、抗变黄性、热稳定性和耐热抗老化性，能够与托盘本体2的框架表面进行结合及扩大适用场景。
如图3和4所示，为了使上述硅橡胶层4与框架的结合更加连接牢固，位于第一框架21和第二框架22与硅橡胶层4之间设有胶层3。胶层3为单液型矽烷耦合剂，其由低级醇、脂肪、有机矽树脂和矽烷偶联剂组成。其中，质量分数分别为43％、49.6％、6.4％和1％。
上述胶层3的作用增大了托盘本体2和硅橡胶层4间的表面粘结性，使之很好的粘合在一起，且避免了缩水率和收缩率的不同造成硅橡胶层4的变形与脱落。
托盘本体2和硅橡胶层4中还含有导电材质。防止电荷累积或放电，以减少对芯片造成损伤，而导电材质可选用为聚吡咯、聚苯硫醚、聚酞菁类化合物、聚苯胺、聚噻吩等。
相应地，本发明还提供一种托盘结构的包胶工艺，包括：选用耐高温塑料材料通过注塑工艺一体成型托盘本体2。
再通过涂覆机将胶体涂抹在托盘本体2的第一框架21和第二框架22的内壁面和外壁面，以形成胶层，然后进行烘烤。
其中，胶体需要选取与所需相应地成份浓度，在涂抹完后，需要放置干燥10-30min，或选择放置到烘箱中烘烤，温度为最多80℃，时间为3-8min，
将烘烤完的托盘本体2放入到适配模具的成型槽中，合模后，通过注射工艺将硅橡胶包覆在上述涂抹有胶体的部位，硫化定型后，使胶与托盘本体2紧密连接。
上述工艺中，根据实际所需，可使用或不使用涂覆机在托盘本体2上 涂抹有胶体。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。
Claims (14)
- 一种托盘结构，其特征在于，包括：托盘本体，呈堆叠设置；位于所述托盘本体的上下两表面分别设有第一框架和与所述第一框架相适配以形成容纳空腔的第二框架；包覆于所述第一框架和第二框架内壁面和外壁面的硅橡胶层，所述硅橡胶层的两端向外延伸。
- 根据权利要求1所述的托盘结构，其特征在于，位于所述第一框架和第二框架与硅橡胶层之间设有胶层。
- 根据权利要求2所述的托盘结构，其特征在于，所述胶层为单液型矽烷耦合剂，其由低级醇、脂肪、有机矽树脂和矽烷偶联剂组成。
- 根据权利要求1所述的托盘结构，其特征在于，所述硅橡胶层为采用液态硅胶、聚丁二烯橡胶、CSM、乙烯基矽橡胶、低苯基矽橡胶、室温硫化矽橡胶、EPDM、氯丁橡胶、FPM、氟矽橡胶、PE、PP、PVC-U、PVC-C、ABS、PVDF或AB胶。
- 根据权利要求1所述的托盘结构，其特征在于，所述第一框架由上框、中框和下框围合形成有两产品的放置空间，且呈间断式设置。
- 根据权利要求5所述的托盘结构，其特征在于，所述上框、中框和下框靠近内侧的边角处均设有倒角边。
- 根据权利要求5所述的托盘结构，其特征在于，所述第二框架为两个一组，且呈台阶状设置；两所述第二框架之间设有与所述中框相卡合的卡槽。
- 根据权利要求6所述的托盘结构，其特征在于，所述第二框架靠近外侧的边角处与所述第一框架的倒角边相抵合。
- 根据权利要求1所述的托盘结构，其特征在于，所述托盘本体采用耐热塑料材质成型。
- 根据权利要求1所述的托盘结构，其特征在于，所述托盘本体上位于所述第一框架和第二框架的间断中段处设有通孔，所述通孔内设有所述硅橡胶层以连接位于所述第一框架和第二框架上的所述硅橡胶层。
- 根据权利要求1所述的托盘结构，其特征在于，所述托盘本体内开设有填充硅橡胶的连接槽，该所述硅橡胶的两端分别设于位于一所述第 一框架和第二框架上的所述硅橡胶层之间、以及位于另一所述第一框架和第二框架上的所述硅橡胶层之间。
- 根据权利要求1所述的托盘结构，其特征在于，所述托盘本体的上下两表面设有将所述第一框架和第二框架进行分隔的挡板，所述挡板包含有上限位板和下限位板，且呈交错设置。
- 根据权利要求1所述的托盘结构，其特征在于，所述托盘本体和硅橡胶层中含有导电材质。
- 一种如权利要求1-13中任一项所述的托盘结构的包胶工艺，其特征在于，包括：选用耐高温塑料材料通过注塑工艺一体成型托盘本体；通过涂覆机将胶体涂抹在托盘本体的第一框架和第二框架的内壁面和外壁面形成胶层，然后进行烘烤；将烘烤完的托盘本体放入到适配模具的成型槽中，合模后，通过注射工艺将硅橡胶包覆在上述涂抹有胶体的部位，硫化定型后，使胶与托盘本体紧密连接。
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