WO2024045737A1 - 光模块壳体及其制作方法、光模块和光通信设备 - Google Patents

光模块壳体及其制作方法、光模块和光通信设备 Download PDF

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Publication number
WO2024045737A1
WO2024045737A1 PCT/CN2023/098230 CN2023098230W WO2024045737A1 WO 2024045737 A1 WO2024045737 A1 WO 2024045737A1 CN 2023098230 W CN2023098230 W CN 2023098230W WO 2024045737 A1 WO2024045737 A1 WO 2024045737A1
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WO
WIPO (PCT)
Prior art keywords
optical module
housing
plating layer
module housing
coating
Prior art date
Application number
PCT/CN2023/098230
Other languages
English (en)
French (fr)
Inventor
魏潇赟
杨勇
邓抄军
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024045737A1 publication Critical patent/WO2024045737A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Embodiments of the present application relate to the field of optical modules, and in particular to an optical module housing and a manufacturing method thereof, an optical module and an optical communication device.
  • Optical modules are important components in optical communications and are used for mutual conversion between optical signals and electrical signals.
  • technologies such as cloud computing, big data, 5G, and autonomous driving
  • the power of optical modules is becoming larger and larger, which results in the amount of heat generated by the optical modules becoming larger and larger.
  • the optical module When in use, the optical module is plugged into the optical module connector, and the optical module housing contacts the heat sink of the optical module connector for heat dissipation.
  • the contact between the optical module housing and the radiator has a great impact on the heat dissipation of the optical module. If there is a large gap, it will affect the heat exchange between the optical module housing and the radiator, causing the temperature of the optical module to be too high. , affecting the performance and service life of the optical module.
  • the present application provides an optical module housing and a manufacturing method thereof, an optical module and an optical communication device, which facilitates the formation of good contact between the optical module housing and the radiator, and promotes heat exchange between the optical module housing and the radiator. It is helpful to improve the heat dissipation effect.
  • the technical solutions are as follows:
  • an optical module housing In a first aspect, an optical module housing is provided.
  • the optical module housing has a contact area.
  • the optical module housing is installed on the optical module connector.
  • the optical module housing includes a housing body and a coating layer, and the coating layer is located on the surface of the housing body. At least in the contact area, the roughness Ra of the coating does not exceed 0.6 ⁇ m.
  • the roughness Ra of the coating of the contact area is set to no more than 0.6 ⁇ m, so that when the optical module is connected to the optical module connector, there is a gap between the contact area of the optical module housing and the heat sink.
  • the gap is smaller, which reduces the contact thermal resistance, facilitates heat exchange between the optical module housing and the radiator, accelerates the heat dissipation of the optical module, and prevents the temperature of the optical module from being too high.
  • the hardness of the coating is not less than 900HV0.1.
  • the optical module housing can have better wear resistance.
  • the hardness of the coating is 950HV0.1.
  • the thickness of the plating layer is 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating is 10 ⁇ m.
  • the thickness of the coating affects the wear resistance and corrosion resistance of the optical module housing. If it is set too thin, the improvement of the wear resistance and corrosion resistance is unknown. Obviously, setting it too thick will increase the manufacturing cost of the optical module housing.
  • the hardness of the coating is 7.9g/cm 3 to 8.5g/cm 3 .
  • 8.0g/cm 3 makes the coating dense enough to better protect the optical module housing.
  • the outer surface of the optical module housing has an anti-fingerprint structure.
  • the surface of the optical module housing can be prevented from being scratched and stained by fingerprints. Since the coating has a small roughness and is relatively smooth, it is easy to form fine scratches, causing the surface of the optical module housing to be scratched. Traces such as fingerprints and palmprints are also easily formed on the surface of the coating, and the anti-fingerprint structure can avoid the occurrence of these problems.
  • the surface of the coating is a frosted surface
  • the anti-fingerprint structure includes the frosted surface
  • a frosted surface to avoid scratches on the surface of the coating can also prevent fingerprint contamination and improve the appearance quality of the optical module.
  • the anti-fingerprint structure includes an anti-fingerprint film, and the anti-fingerprint film is located on the surface of the coating.
  • the anti-fingerprint film includes, but is not limited to, nanoparticle coating, self-assembled monomolecular film, and oxide coating.
  • the use of the anti-fingerprint film on the surface of the coating can also prevent the surface of the optical module housing from being scratched, and prevent the surface of the optical module housing from being stained to form fingerprints. , palm prints and other traces to improve the appearance quality of the optical module.
  • a method for manufacturing an optical module housing is provided.
  • the optical module housing has a contact area, and the contact area is used to contact a heat sink.
  • the manufacturing method includes:
  • a shell body is provided; a plating layer is formed on the surface of the shell body. Wherein, at least in the contact area, the roughness Ra of the coating layer does not exceed 0.6 ⁇ m.
  • the roughness Ra of the coating of the contact area is set to no more than 0.6 ⁇ m, so that when the optical module is connected to the optical module connector, there is a gap between the contact area of the optical module housing and the heat sink.
  • the gap is smaller, which reduces the contact thermal resistance, facilitates heat exchange between the optical module housing and the radiator, accelerates the heat dissipation of the optical module, and prevents the temperature of the optical module from being too high.
  • the surface of the housing body is first polished before forming a plating layer on the surface of the housing body.
  • the surface of the housing body is first polished. By polishing the surface of the housing body, at least in the contact area, the roughness Ra of the housing body does not exceed 0.6 ⁇ m.
  • the surface of the housing body is mechanically polished or laser polished.
  • the roughness of the housing body is reduced, so that the coating layer formed on the surface of the housing body is smoother and the roughness is smoother. Low.
  • polishing is not performed before the plating layer is formed on the surface of the housing body. After the plating layer is formed on the surface of the housing body, the plating layer formed on the housing body is polished.
  • the plating layer formed on the housing body is mechanically polished or laser polished.
  • the surface of the housing body is relatively rough, so that the formed plating layer can be more closely combined with the housing body. After the plating layer is formed, the plating layer is polished, thereby reducing the roughness of the formed plating layer.
  • the plating layer is also annealed to increase the hardness of the plating layer, thereby Improve the wear resistance of the optical module housing.
  • the coating is frosted.
  • the surface of the coating layer can be turned into a frosted surface through frosting treatment, so that the frosted surface can be used to avoid scratches on the surface of the coating layer, avoid fingerprint contamination, and improve the appearance quality of the optical module.
  • an anti-fingerprint film is formed on the surface of the plating layer.
  • the purpose of preventing the surface of the optical module housing from being scratched can also be achieved, and the surface of the optical module housing can be prevented from being stained to form fingerprints, palms, etc. lines and other traces to improve the appearance quality of the optical module.
  • an optical module in a third aspect, includes a circuit board and an optical module housing as described in the first aspect.
  • the circuit board is located in the optical module housing.
  • an optical communication device in a fourth aspect, includes an optical module connector and an optical module as described in the third aspect, and the optical module is connected to the optical module connector.
  • the side wall of the optical module connector has an opening, and the heat sink installed on the side wall of the optical module connector contacts the housing of the optical module through the opening, so that the housing of the optical module contacts the heat dissipation
  • the gap between the radiators is smaller, which reduces the contact thermal resistance, facilitates heat exchange between the optical module housing and the radiator, accelerates the heat dissipation of the optical module, and prevents the temperature of the optical module from being too high. .
  • the optical communication device further includes a motherboard and a heat sink.
  • the optical module connector is connected to the main board
  • the heat sink is connected to the optical module connector
  • the heat dissipating boss is located in the opening and contacts the surface of the optical module housing.
  • Figure 1 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • Figure 2 is a partial structural schematic diagram of an optical communication device provided by an embodiment of the present application.
  • Figure 3 is a schematic cross-sectional view of an optical module housing provided by an embodiment of the present application.
  • Figure 4 is a schematic cross-sectional view of an optical module housing provided by an embodiment of the present application.
  • Figure 5 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application.
  • Figure 6 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application.
  • Figure 7 is a schematic diagram of the manufacturing process of an optical module housing provided by an embodiment of the present application.
  • Figure 8 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application.
  • Figure 9 is a schematic diagram of the manufacturing process of an optical module housing provided by an embodiment of the present application.
  • FIG. 11 Optical module 11.
  • Optical module housing 11a contact area 110.
  • FIG 1 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • the optical module 10 may be, but is not limited to, a small form-factor pluggable transceiver (SFP), a four-channel small form-factor pluggable transceiver (quad small form-factor pluggable transceiver, QSFP), C form-factor pluggable transceiver (CFP).
  • SFP small form-factor pluggable transceiver
  • QSFP quad small form-factor pluggable transceiver
  • CFP C form-factor pluggable transceiver
  • the optical module 10 includes an optical module housing 11 and a circuit board (not shown in Figure 1). Electronic components are connected to the circuit board, such as related chips, light sources, etc.
  • One end of the optical module housing 11 has an interface. When in use, the end of the optical module housing 11 where the interface is located is inserted into the optical module connector.
  • the optical module 10 shown in FIG. 1 also includes a handle 12 , which is located at the end of the optical module housing 11 away from the interface.
  • the handle 12 is used to facilitate the insertion and removal of the optical module 10 .
  • the optical module 10 may also be without the handle 12 .
  • FIG. 2 is a partial structural schematic diagram of an optical communication device provided by an embodiment of the present application.
  • the optical communication device includes an optical module 10 , an optical module connector 20 , a heat sink 30 and a mainboard 40 .
  • the optical module connector 20 is also called an optical cage.
  • the optical module connector 20 is connected to the main board 40 , where the main board 40 can be a printed circuit board.
  • the optical module connector 20 is welded to the main board 40 .
  • the optical module 10 is connected to the optical module connector 20 .
  • Figure 2 shows the connection process of the optical module 10 and the optical module connector 20.
  • One end of the optical module connector 20 has a socket 20a, and the optical module 10 is inserted into the socket 20a.
  • the side wall of the optical module connector 20 has an opening 20b.
  • the heat sink 30 includes a heat sink body 32 , a boss 31 and a plurality of heat dissipation structures 33 .
  • the boss 31 and the heat dissipation structure 33 are respectively located on opposite sides of the radiator body 32 .
  • the heat sink 30 is connected to the optical module connector 20, for example, by snapping.
  • the boss 31 of the heat sink 30 extends into the opening 20 b, and the bottom surface of the boss 31 contacts the optical module housing 11 of the optical module 10 , so that the heat generated by the optical module 10 can be conducted to the heat sink 30 .
  • the heat dissipation structure 33 is a heat dissipation fin.
  • the heat dissipation structure 33 may also be a columnar heat dissipation tooth.
  • the heat sink 30 may be a metal structural component, such as metal aluminum or aluminum alloy.
  • the radiator main body 32, the boss 31 and the plurality of heat dissipation structures 33 can be an integrally formed structure or a welded structure.
  • the force required when plugging the optical module 10 is about 40N. Remove the optical module 10 from the optical module connector. 20, the required force needs to be about 30N, that is, more than 40N of force is needed to insert the optical module 10 into place, and more than 30N of force is needed to pull out the optical module 10.
  • the required force may also be different, and 40N and 30N are only used as examples here.
  • the optical module housing 11 has a contact area 11a, which is an area of the optical module housing that is used to contact the heat sink.
  • the optical module housing 11 may include an upper housing 111 and a lower housing 112 arranged oppositely.
  • the upper housing 111 is connected to the lower housing 112, and the contact area 11a is located on the upper housing 111.
  • the upper housing 111 and the lower housing 112 are separate components, and they are detachably or fixedly connected.
  • the upper housing 111 and the lower housing 112 are an integral component, that is, they are one overall.
  • the optical module 10 is inserted into the optical module connector 20 , and the contact area 11 a is in contact with the boss 31 .
  • the heat generated during the operation of the optical module 10 is transferred to the boss 31 and dissipated through the heat sink 30 .
  • the heat dissipation effect can prevent the temperature of the optical module 10 from being too high.
  • the power of the optical module 10 is getting larger and larger, making the optical module 10 prone to overheating and affecting its service life.
  • Figure 3 is a schematic cross-sectional view of an optical module housing provided by an embodiment of the present application. This section is the A-A section in Figure 2.
  • the optical module housing 11 includes a housing body 110 and a coating 120.
  • the coating 120 is located on the surface of the housing body 110, at least in the contact area 11a.
  • the roughness Ra of the coating 120 does not exceed 0.6 ⁇ m.
  • the roughness Ra of the outer surface of the optical module housing 11 is 1.6 ⁇ m.
  • the contact thermal resistance between the optical module housing 11 and the heat sink 30 is larger, causing the optical module to be easily damaged during operation. Temperature is too high.
  • the roughness Ra of the plating layer 120 in the contact area 11a is set to no more than 0.6 ⁇ m, so that the gap existing between the optical module housing 11 and the heat sink 30 is smaller, which reduces the contact thermal resistance and is beneficial to the optical module.
  • the heat exchange between the module housing 11 and the radiator 30 accelerates the heat dissipation of the optical module and prevents the temperature of the optical module from being too high.
  • the heat sink 30 and the optical module connector 20 are usually connected by a snap connection. After the roughness of the plating layer 120 is reduced, a tighter buckle can be used to connect the heat sink 30 and the optical module connector 20 to increase the pressure between the contact area 11a and the heat sink 30, so that the optical module and the optical module can be connected. There is still enough friction between the module connectors. Increasing the pressure between the contact area 11a and the heat sink 30 can further reduce the gap between the contact area 11a and the heat sink 30, which is beneficial to the heat exchange between the optical module housing 11 and the heat sink 30, and accelerates the heat exchange between the optical module housing 11 and the heat sink 30. Heat dissipation of optical modules.
  • the optical module 10 has a contact area 11a.
  • the optical module 10 may also have multiple contact areas 11a.
  • the multiple contact areas 11a may be located on the same side wall of the optical module housing 11, or may be on different side walls.
  • the optical module connector 20 adapted to the optical module 10 may have multiple openings 20b, and may be installed with multiple heat sinks 30.
  • the protrusions of the multiple heat sinks 30 The stages 31 are respectively located in the plurality of openings 20b so as to be in contact with the plurality of contact areas 11a respectively.
  • the same side wall of the optical module connector 20 may have two or more openings 20b.
  • One heat sink 30 may have two or more bosses 31 , and each boss 31 of the heat sink 31 is respectively located in each opening 20 b of the optical module connector 20 .
  • the shell body 110 is an aluminum structural part, a zinc structural part or a copper structural part, and is soft in texture.
  • the coating 120 can play a protective role and improve the hardness of the optical module housing 11, thereby improving the wear resistance of the optical module housing 11.
  • the plating layer 120 may be located on the upper housing 111 or on the upper housing 111 and the lower housing 112 .
  • the housing body 110 can also be made of other materials.
  • the plating layer 120 may cover the entire surface of the housing body 110 , and the entire surface of the housing body 110 includes the inner surface and the outer surface of the housing body 110 .
  • the roughness Ra of the plating layer 120 covering the outer surface of the housing body 110 does not exceed 0.6 ⁇ m. Since the plating layer 120 covering the inner surface of the housing body 110 is not in contact with the heat sink 30 , even if the roughness Ra exceeds 0.6 ⁇ m, it will not affect the heat exchange between the optical module housing and the heat sink 30 . Unless otherwise specified, in the embodiment of the present application, the surface of the plating layer 120 refers to the surface of the plating layer 120 located on the outer surface of the housing body 110 .
  • the roughness Ra of the plating layer 120 covering the inner surface of the housing body 110 can also be set to no more than 0.6 ⁇ m, so that the components in the optical module housing 11 can be in closer contact with the inner surface of the optical module housing 11 .
  • plating 120 may be a nickel plating.
  • the nickel plating can make the optical module housing 11 have better corrosion resistance, which is beneficial to extending the service life of the optical module.
  • the coating 120 can also be a coating formed of other materials, such as chromium plating or other coatings with wear resistance and corrosion resistance. Chromium plating also has high hardness and corrosion resistance, and can also extend the life of the coating. The role of the service life of the optical module.
  • the hardness of the plating layer 120 is not less than 900HV0.1.
  • the optical module housing 11 can have better wear resistance.
  • the thickness of the coating 120 can be 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating 120 affects the wear resistance and corrosion resistance of the optical module housing 11. If the thickness is set too thin, the improvement of the wear resistance and corrosion resistance will not be obvious. The thickness setting If it is too thick, it will increase the production cost.
  • the density of the coating layer 120 may be greater than or equal to 7g/cm 3 , such as 7.9g/cm 3 to 8.5g/cm 3 , so that the coating layer 120 is sufficiently dense to better protect the optical module housing.
  • the outer surface of the optical module housing also has an anti-fingerprint structure.
  • the anti-fingerprint structure can prevent the surface of the optical module housing 11 from being scratched and can also avoid being stained by fingerprints.
  • the surface of the coating 120 is a frosted surface
  • the anti-fingerprint structure includes the frosted surface
  • the frosted surface can avoid scratches on the surface of the coating 120 and avoid being stained by fingerprints, thereby improving the appearance quality of the optical module.
  • the roughness Ra of the frosted surface does not exceed 0.6 ⁇ m, so that the gap between the optical module housing 11 and the heat sink 30 is small, and heat exchange between the optical module housing 11 and the heat sink 30 can still be performed quickly.
  • the anti-fingerprint structure includes an anti-fingerprint film 130 .
  • the anti-fingerprint film 130 is located on the surface of the coating 120 .
  • the anti-fingerprint film 130 By providing the anti-fingerprint film 130 on the surface of the coating 120, it can also prevent the surface of the optical module housing 11 from being scratched, and prevent the surface of the optical module housing 11 from being stained to form fingerprints, palm prints and other traces. Improve the appearance quality of optical modules.
  • the anti-fingerprint film 130 may include, but is not limited to, a nanoparticle coating, a self-assembled monomolecular film, and an oxide coating.
  • the anti-fingerprint film 130 may cover part or all of the surface of the coating 120 .
  • the entire surface area of the plating layer 120 is covered, so that any area on the surface of the optical module housing that may be touched will not be contaminated.
  • An embodiment of the present application also provides an optical module, which includes a circuit board and any optical module housing 11 as shown in Figures 3 to 4 .
  • the circuit board is located in the optical module housing 11 .
  • Electronic components are connected to the circuit board, such as light sources, optical digital signal processor (ODSP) chips, integrated coherent transmitter (ICT) chips, integrated coherent receivers (ICR) chip.
  • ODSP optical digital signal processor
  • ICT integrated coherent transmitter
  • ICR integrated coherent receivers
  • An embodiment of the present application also provides an optical communication device.
  • the optical communication device includes an optical module connector and the aforementioned optical module.
  • the optical module is connected to the optical module connector.
  • the optical module provided in the embodiment of the present application is compared with the same type of optical module in the related art.
  • the pressure between the two optical modules and the radiator is 20N.
  • the two optical modules When working at an ambient temperature of 25°C, the two optical modules
  • the power consumption is 26.5W, and the cooling air volume is 10CFM.
  • the temperature of the ODSP chip in the optical module provided by the embodiment of the present application is 76.6°C
  • the temperature of the light source is 42.4°C
  • the temperature of the ICT chip is 49.5°C
  • the temperature of the ICR chip is 49°C
  • the temperatures of the optical modules in the technology were 83.37°C, 44.27°C, 52.17°C and 51.57°C, which were reduced by 6.77°C, 1.87°C, 2.67°C and 2.57°C respectively.
  • Figure 5 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application. This method is used to make the optical module housing shown in Figure 3 or Figure 4. As shown in Figure 5, the production method includes:
  • step S11 a housing body 110 is provided.
  • the optical module housing includes an upper housing 111 and a lower housing 112. Taking the upper housing 111 and the lower housing 112 as separate components as an example, the housing body 110 is also a separate structure, including an upper housing body 1101 and a lower housing body 1102 . The upper housing body 1101 and the lower housing body 1102 can be manufactured separately.
  • the upper housing body 1101 and the lower housing body 1102 are made by die casting.
  • the upper housing body 1101 and the lower housing body 1102 are also integrated, and can be manufactured by die-casting as a whole.
  • step S12 the plating layer 120 is formed on the surface of the housing body 110.
  • the roughness Ra of the plating layer 120 does not exceed 0.6 ⁇ m.
  • the upper housing body 1101 and the lower housing body 1102 can be processed separately to form the plating layer 120.
  • electroless plating may be used to form the plating layer 120 on the surface of the upper housing body 1101 and the surface of the lower housing body 1102 respectively.
  • the roughness Ra of the outer surface of the optical module housing 11 is 1.6 ⁇ m.
  • the contact thermal resistance between the optical module housing 11 and the heat sink 30 is larger, causing the optical module to be easily damaged during operation. Temperature is too high.
  • the roughness Ra of the plating layer 120 in the contact area 11a is set to no more than 0.6 ⁇ m, so that the gap existing between the optical module housing 11 and the heat sink 30 is smaller, which reduces the contact thermal resistance and is beneficial to the optical module.
  • the heat exchange between the module housing 11 and the radiator 30 accelerates the heat dissipation of the optical module and prevents the temperature of the optical module from being too high.
  • the thickness of the coating 120 formed on the surface of the upper housing body 1101 and the surface of the lower housing body 1102 can be 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating 120 affects the wear resistance and corrosion resistance of the optical module housing 11, and the thickness is set too thin. , the improvement in wear resistance and corrosion resistance is not obvious, and setting the thickness too thick will increase the production cost.
  • FIG. 6 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application. This method is used to make the optical module housing shown in Figure 3 or Figure 4. The method proceeds after step S11.
  • FIG. 7 is a schematic diagram of the manufacturing process of an optical module housing provided by an embodiment of the present application. The figure takes the production of the upper housing 111 with the plating layer 120 as a nickel plating as an example to illustrate the manufacturing process of the optical module housing. In other examples, the plating layer 120 may also be a chromium plating. As shown in Figure 6 and Figure 7, the production Methods include:
  • step S21 the housing body 110 is polished.
  • polishing the housing body 110 to reduce the roughness of the housing body 110 is beneficial to reducing the roughness of the subsequently formed plating layer 120 .
  • polishing is performed so that the roughness Ra of the housing body 110 does not exceed 0.6 ⁇ m at least in the contact area 11a, so that the roughness Ra of the subsequently formed plating layer 120 in the contact area 11a does not exceed 0.6 ⁇ m.
  • the upper housing 111 and the lower housing 112 are separate components, and the upper housing 111 is made as an example.
  • the upper housing body 1101 can be polished to reduce the contact area 11 a of roughness.
  • the outer surface of the upper housing 111 may be polished, or the outer surface and the inner surface of the upper housing 111 may be polished.
  • the roughness of the inner surface can be greater than the roughness of the outer surface. Since the inner surface is not exposed and does not come into contact with the radiator, there is no need to control the roughness to a very low level. To reduce workload and reduce costs.
  • polishing the housing body 110 mechanical polishing and/or laser polishing may be used.
  • step S22 electroless nickel plating is performed on the surface of the housing body 110 to form a plating layer 120 .
  • the thickness of the plating layer 120 formed by electroless plating is more uniform and the cost is lower.
  • the thickness of the coating 120 formed on the surface of the housing body 110 can be 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating 120 affects the wear resistance and corrosion resistance of the optical module housing 11. If the thickness is set too thin, the wear resistance and corrosion resistance will be affected. The improvement is not obvious, and setting the thickness too thick will increase the production cost.
  • the density of the coating 120 may be greater than or equal to 7g/cm 3 , for example, 7.9g/cm 3 to 8.5g/cm 3 .
  • step S23 the housing body 110 is annealed.
  • the hardness of the coating layer 120 can be increased, thereby improving the wear resistance of the coating layer 120 .
  • the hardness of the coating 120 is not less than 900HV0.1.
  • step S24 or step S25 may also be performed.
  • step S24 the plating layer 120 is frosted.
  • the frosted surface can serve as an anti-fingerprint structure to prevent the surface of the coating 120 from being contaminated by fingerprints.
  • the frosted surface can also prevent scratches on the surface of the coating 120 and improve the appearance quality of the optical module.
  • Frosting can be done by shot peening or sand blasting. During the frosting process, the particle size and hardness of the abrasive are reasonably selected, the diameter of the spray gun muzzle is reasonably selected, and the spray air pressure, the distance between the spray gun muzzle and the surface of the coating 120, and the processing time are reasonably set, so that After the frosting process, the roughness Ra of the frosted surface does not exceed 0.6 ⁇ m, so that the gap between the optical module housing 11 and the heat sink 30 is small, and the optical module housing 11 and the heat sink 30 can still quickly exchange heat. .
  • the abrasive may be rounded steel grit.
  • step S25 an anti-fingerprint film 130 is formed on the surface of the plating layer 120.
  • the anti-fingerprint film 130 may be, but is not limited to, a nanoparticle coating, a self-assembled monomolecular film, or an oxide coating.
  • the anti-fingerprint film 130 By forming the anti-fingerprint film 130 on the surface of the coating layer 120 as an anti-fingerprint structure, the surface of the coating layer 120 is prevented from being contaminated by fingerprints.
  • the anti-fingerprint film 130 can also prevent scratches on the surface of the coating 120 and improve the appearance quality of the optical module.
  • the anti-fingerprint film 130 may be formed on any area of the surface of the plating layer 120 that may be touched, or may cover all areas of the surface of the plating layer 120 .
  • Figure 8 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application. This method is used to make the optical module housing shown in Figure 3 or Figure 4. The method proceeds after step S11.
  • Figure 9 is an optical mode provided by an embodiment of the present application. Schematic diagram of the manufacturing process of the block shell. The figure takes the production of the upper housing 111 as an example to illustrate the manufacturing process of the optical module housing. As shown in Figures 8 and 9, the production method includes:
  • step S31 electroless nickel plating is performed on the surface of the housing body 110 to form a plating layer 120 .
  • the upper housing 111 and the lower housing 112 are separate components, and the upper housing 111 is produced.
  • a plating layer 120 can be formed on the surface of the upper housing body 1101 .
  • the manner of forming the plating layer 120 may be similar to the aforementioned step S22 and will not be described in detail here.
  • the thickness of the plating layer 120 formed in step S31 may be greater than the thickness of the plating layer 120 formed in step S22.
  • the thickness of the plating layer 120 formed in step S31 may be 25 ⁇ m to 50 ⁇ m.
  • step S32 the plating layer 120 is polished.
  • step S31 a thicker plating layer 120 is formed so that sufficient margin is reserved for polishing the plating layer 120 to prevent the local area of the plating layer 120 from being completely removed during the polishing process.
  • the plating layer 120 is polished to reduce the roughness of the plating layer 120, so that at least in the contact area 11a, the roughness Ra of the plating layer 120 does not exceed 0.6 ⁇ m.
  • the thickness of the plating layer 120 after polishing may be 1 ⁇ m to 20 ⁇ m.
  • the plating layer 120 on the outer surface of the upper housing body 1101 can be polished, or the outer surface and the outer surface of the upper housing body 1101 can be polished.
  • the plating 120 on the inner surface is polished.
  • the roughness of the inner surface can be greater than the roughness of the outer surface. Since the inner surface is not exposed and does not come into contact with the radiator, there is no need to control the roughness to a very low level. To reduce workload and reduce costs.
  • polishing the plating layer 120 mechanical polishing and/or laser polishing may be used.
  • the plating layer 120 is first formed on the housing body 110 and then polished. Since the shell body 110 is not polished before forming the plating layer 120 , the surface of the shell body 110 is relatively rough, which allows the plating layer 120 to adhere more closely to the surface of the shell body 110 . Polishing is performed after the plating layer 120 is formed to ensure that the roughness of the plating layer 120 meets the requirements.
  • step S33 the housing body 110 is annealed.
  • Step S33 may be the same as the aforementioned step S22, and will not be described in detail here.
  • step S34 or step S35 may also be performed.
  • step S34 the plating layer 120 is frosted.
  • Step S34 may be the same as the aforementioned step S24, and will not be described in detail here.
  • step S35 the anti-fingerprint film 130 is formed on the surface of the plating layer 120.
  • Step S35 may be the same as the aforementioned step S25 and will not be described in detail here.

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Abstract

一种光模块壳体（11），其包括外壳本体（110）和镀层（120），镀层（120）位于外壳本体（110）表面，至少在接触区（11a），镀层（120）的粗糙度Ra不超过0.6μm，接触区（11a）为光模块壳体（11）用于与散热器（30）接触的区域。将接触区（11a）的镀层（120）的粗糙度Ra设置为不超过0.6μm，使得光模块（10）与光模块连接器（20）相连时，光模块壳体（11）的接触区（11a）与散热器（30）之间存在的缝隙更小，降低了接触热阻，有利于光模块壳体（11）与散热器（30）之间的热交换，加速光模块（10）的散热，避免光模块（10）温度过高。还包括光模块壳体的制作方法、光模块（10）和光通信设备。

Description

光模块壳体及其制作方法、光模块和光通信设备
本申请要求于2022年8月31日提交的申请号为202211056496.5、发明名称为“光模块壳体及其制作方法、光模块和光通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及光模块领域，特别涉及一种光模块壳体及其制作方法、光模块和光通信设备。
背景技术
光模块是光通信中的重要元器件，用于光信号与电信号之间的相互转换。随着云计算、大数据和5G、自动驾驶等技术的高速发展，光模块的功率也越来越大，这导致光模块的发热量也越来越大。
光模块在使用时插接在光模块连接器中，光模块壳体与光模块连接器的散热器接触进行散热。
光模块壳体与散热器之间的接触情况对光模块的散热有较大影响，如果存在较大的缝隙，会影响光模块壳体与散热器之间的热交换，导致光模块温度过高，影响光模块的性能和使用寿命。
发明内容
本申请提供了一种光模块壳体及其制作方法、光模块和光通信设备，有利于光模块壳体与散热器之间形成良好接触，促进光模块壳体与散热器之间的热交换，有利于提高散热效果。所述技术方案如下：
第一方面，提供了一种光模块壳体，所述光模块壳体具有接触区，所述接触区为光模块与光模块连接器相连时，光模块壳体与安装在光模块连接器上的散热器接触的区域。所述光模块壳体包括外壳本体和镀层，所述镀层位于所述外壳本体表面。至少在所述接触区，所述镀层的粗糙度Ra不超过0.6μm。
基于上述特征，将所述接触区的镀层的粗糙度Ra设置在不超过0.6μm，使得所述光模块与光模块连接器相连时，所述光模块壳体的接触区与散热器之间存在的缝隙更小，降低了接触热阻，有利于所述光模块壳体与所述散热器之间的热交换，加速光模块的散热，避免光模块温度过高。
可选地，所述镀层的硬度不小于900HV0.1。通过设置较高硬度的所述镀层，能够使所述光模块壳体具有较好的耐磨性。
示例性地，所述镀层的硬度为950HV0.1。
此外，所述镀层的厚度为1μm～20μm。例如，所述镀层的厚度为10μm。所述镀层的厚度影响所述光模块壳体的耐磨性和抗腐蚀性，设置的过薄，对于耐磨性和抗腐蚀性的提升不明 显，设置的过厚，会增加所述光模块壳体的制作成本。
所述镀层的硬度为7.9g/cm3～8.5g/cm3。例如8.0g/cm3，使所述镀层足够致密，更好地保护所述光模块壳体。
在一些示例中，所述光模块壳体的外表面具有防指纹结构。
基于上述特征，能够避免所述光模块壳体的表面被刮花，也能够避免被指纹沾污。由于所述镀层的粗糙度较小，比较光滑，因此容易形成细小的划痕，导致所述光模块壳体的表面被刮花。在所述镀层表面也容易形成指纹、掌纹等痕迹，所述防指纹结构可以避免这些问题的产生。
作为一种示例，所述镀层的表面为磨砂面，所述防指纹结构包括所述磨砂面。
通过磨砂处理使所述镀层的表面出现凹痕或凸起，成为磨砂面。利用磨砂面避免所述镀层的表面产生划痕，也能避免被指纹沾污，提高光模块的外观质量。
作为另一种示例，所述防指纹结构包括防指纹膜，所述防指纹膜位于所述镀层的表面。
示例性地，所述防指纹膜包括，但不限于是纳米颗粒涂层、自组装单分子膜、氧化物涂层。
基于上述特征，利用所述镀层表面的所述防指纹膜，也能够起到避免所述光模块壳体的表面被刮花的目的，并且避免所述光模块壳体的表面被沾污形成指纹、掌纹等痕迹，提高光模块的外观质量。
第二方面，提供了一种光模块壳体的制作方法，所述光模块壳体具有接触区，所述接触区用于与散热器接触，所述制作方法包括：
提供一外壳本体；在所述外壳本体的表面形成镀层。其中，至少在所述接触区，所述镀层的粗糙度Ra不超过0.6μm。
基于上述特征，将所述接触区的镀层的粗糙度Ra设置在不超过0.6μm，使得所述光模块与光模块连接器相连时，所述光模块壳体的接触区与散热器之间存在的缝隙更小，降低了接触热阻，有利于所述光模块壳体与所述散热器之间的热交换，加速光模块的散热，避免光模块温度过高。
在一些示例中，在所述外壳本体的表面形成镀层之前，先对所述外壳本体的表面进行抛光。通过对所述外壳本体的表面进行抛光，使得至少在所述接触区，所述外壳本体的粗糙度Ra不超过0.6μm。
示例性地，对所述外壳本体的表面进行机械抛光或激光抛光。
基于上述特征，通过在形成所述镀层之间，先对所述外壳本体进行抛光，以降低所述外壳本体的粗糙度，从而使所述外壳本体表面形成的所述镀层更光滑，粗糙度更低。
在另一些示例中，在所述外壳本体的表面形成镀层之前不进行抛光，在所述外壳本体的表面形成镀层之后，对形成在所述外壳本体的所述镀层进行抛光。
示例性地，对形成在所述外壳本体的所述镀层进行机械抛光或激光抛光。
基于上述特征，由于形成所述镀层之前没有进行抛光，所述外壳本体的表面比较粗糙，因此能够使形成的所述镀层更加紧密地与所述外壳本体结合。通过在形成所述镀层之后，对所述镀层进行抛光，从而降低形成的所述镀层的粗糙度。
可选地，在形成所述镀层之后，还对所述镀层进行退火，以提高所述镀层的硬度，从而 提高所述光模块壳体的耐磨性。
作为一种示例，在对所述镀层退火后，对所述镀层进行磨砂处理。
通过磨砂处理能够使所述镀层的表面变为磨砂面，从而利用磨砂面避免所述镀层的表面产生划痕，也能避免被指纹沾污，提高光模块的外观质量。
作为另一种示例，在对所述镀层退火后，在所述镀层的表面形成防指纹膜。
通过在所述镀层的表面形成所述防指纹膜，也能够起到避免所述光模块壳体的表面被刮花的目的，并且避免所述光模块壳体的表面被沾污形成指纹、掌纹等痕迹，提高光模块的外观质量。
第三方面，提供了一种光模块，所述光模块包括电路板和如第一方面所述的光模块壳体，所述电路板位于所述光模块壳体中。
第四方面，提供了一种光通信设备，所述光通信设备包括光模块连接器和如第三方面所述的光模块，所述光模块与所述光模块连接器相连。所述光模块连接器的侧壁具有开口，安装在所述光模块连接器侧壁的散热器通过所述开口与所述光模块的壳体接触，使得所述光模块壳体与所述散热器之间存在的缝隙更小，降低了接触热阻，有利于所述光模块壳体与所述散热器之间的热交换，加速所述光模块的散热，避免所述光模块温度过高。
作为一种示例，所述光通信设备还包括主板和散热器。所述光模块连接器连接在所述主板上，所述散热器与所述光模块连接器相连，所述散热且的凸台位于所述开口中，与所述光模块壳体的表面接触。
附图说明
图1是本申请实施例提供的一种光模块的结构示意图；
图2是本申请实施例提供的一种光通信设备的局部结构示意图；
图3是本申请实施例提供的一种光模块壳体的截面示意图；
图4是本申请实施例提供的一种光模块壳体的截面示意图；
图5是本申请实施例提供的一种光模块壳体的制作方法流程图；
图6是本申请实施例提供的一种光模块壳体的制作方法流程图；
图7是本申请实施例提供的一种光模块壳体的制作过程示意图；
图8是本申请实施例提供的一种光模块壳体的制作方法流程图；
图9是本申请实施例提供的一种光模块壳体的制作过程示意图。
图例说明
10、光模块
11、光模块壳体  11a、接触区
110、外壳本体  111、上壳体  112、下壳体
1101、上外壳本体  1102、下外壳本体
120、镀层
130、防指纹膜
20、光模块连接器  20a、插口  20b、开口
30、散热器  31、凸台  32、散热器主体  33、散热结构
40、主板
具体实施方式
图1是本申请实施例提供的一种光模块的结构示意图。示例性地，该光模块10可以是但不限于是小型封装可插拔收发器(small form-factor pluggable transceiver，SFP)、四通道小封装可插拔收发器(quad small form-factor pluggable transceiver，QSFP)、C封装可插拔收发器(C form-factor pluggabletransceiver，CFP)。如图1所示，该光模块10包括光模块壳体11和电路板(图1中未示出)。在电路板上连接有电子元器件，例如相关的芯片、光源等。光模块壳体11的一端具有接口，在使用时，光模块壳体11的接口所在的一端插接到光模块连接器中。
作为示例，图1中所示的光模块10还包括拉手12，拉手12位于光模块壳体11远离接口所在的一端。拉手12用于方便光模块10的插拔。在其他示例中，光模块10也可以没有拉手12。
图2是本申请实施例提供的一种光通信设备的局部结构示意图。如图2所示，该光通信设备包括光模块10、光模块连接器20、散热器30和主板40。光模块连接器20也叫做光笼子，光模块连接器20连接在主板40上，其中该主板40可以是印刷电路板，光模块连接器20与主板40焊接。光模块10与光模块连接器20相连。图2中示出了光模块10与光模块连接器20的连接过程。光模块连接器20的一端具有插口20a，光模块10插接在该插口20a中。光模块连接器20的侧壁具有开口20b。
散热器30包括散热器主体32、凸台31和多个散热结构33。凸台31和散热结构33分别位于散热器主体32相反的两侧。散热器30与光模块连接器20相连，例如通过卡扣相连。散热器30的凸台31伸入开口20b中，凸台31的底面与光模块10的光模块壳体11接触，使得光模块10产生的热量能够传导至散热器30。
作为示例，本申请实施例中，散热结构33为散热翅片，在其他示例中，散热结构33还可以是柱状的散热齿。
散热器30可以为金属结构件，例如金属铝或铝合金。散热器主体32、凸台31和多个散热结构33可以为一体成型结构，也可以为焊接结构。
光模块10与光模块连接器20之间具有一定的摩擦力要求，以避免光模块10松动，例如，插接光模块10时需要的作用力在40N左右，将光模块10从光模块连接器20中拔出，所需要的作用力需要在30N左右，即需要施加40N以上的作用力才能将光模块10插接到位，需要施加30N以上的作用力才能将光模块10拔出。对于不用的光模块10，所需要的作用力大小也可能不同，此处40N、30N仅作为示例。
光模块壳体11具有接触区11a，该接触区11a即光模块壳体用于与散热器接触的区域。光模块壳体11可以包括相对布置的上壳体111和下壳体112，上壳体111与下壳体112相连，接触区11a位于上壳体111。在一些示例中，上壳体111与下壳体112为分体构件，两者可拆卸相连或固定相连，在另一些示例中，上壳体111与下壳体112为一体构件，即为一个整体。光模块10插接到光模块连接器20中，接触区11a与凸台31贴合。光模块10工作过程中产生的热量传递到凸台31，通过散热器30散发。光模块壳体11与凸台31之间的接触越紧密， 越有利于光模块壳体11与凸台31之间的热交换，相反，光模块壳体11与凸台31之间存在的缝隙越大，就越不利于光模块10的散热。对于功率较小的光模块10，即使光模块壳体11与散热器30之间存在比较明显的缝隙，散热效果也能够避免光模块10温度过高。但是随着这种技术的不断发展，光模块10的功率越来越大，使得光模块10容易温度过高，影响使用寿命。
图3是本申请实施例提供的一种光模块壳体的截面示意图。该截面为图2中的A-A截面。如图3所示，该光模块壳体11包括外壳本体110和镀层120，镀层120位于外壳本体110表面，至少在接触区11a，镀层120的粗糙度Ra不超过0.6μm。
通常光模块壳体11外表面的粗糙度Ra在1.6μm，对于功率较大的光模块，光模块壳体11与散热器30之间的接触热阻较大，导致光模块在工作过程中容易温度过高。本申请实施例通过将接触区11a的镀层120的粗糙度Ra设置在不超过0.6μm，使得光模块壳体11与散热器30之间存在的缝隙更小，降低了接触热阻，有利于光模块壳体11与散热器30之间的热交换，加速光模块的散热，避免光模块温度过高。
由于镀层120的粗糙度Ra更低了，摩擦系数减小，因此会降低光模块10受到的摩擦力。散热器30与光模块连接器20之间通常采用卡扣连接。在镀层120的粗糙度降低后，散热器30与光模块连接器20之间可以采用更紧的卡扣进行连接，以增大接触区11a与散热器30之间的压力，使光模块与光模块连接器之间仍然有足够大的摩擦力。而增大接触区11a与散热器30之间的压力，又能够进一步减小接触区11a与散热器30之间的缝隙，有利于光模块壳体11与散热器30之间的热交换，加速光模块的散热。
在图2所示示例中，光模块10具有一个接触区11a。在另一些示例中，光模块10也可以具有多个接触区11a。多个接触区11a可以位于光模块壳体11的同一侧壁，也可以为与不同的侧壁。对于具有多个接触区11a的光模块10，与该光模块10相适配的光模块连接器20可以具有多个开口20b，并且可以安装有多个散热器30，多个散热器30的凸台31分别位于多个开口20b中，从而分别与多个接触区11a接触。
在一些示例中，光模块连接器20的同一侧壁可以具有两个或两个以上的开口20b。一个散热器30可以具有两个或两个以上的凸台31，该散热器31的各个凸台31分别位于光模块连接器20的各个开口20b中。
外壳本体110为铝结构件、锌结构件或铜结构件，质地较软。镀层120能够起到保护的作用，提高光模块壳体11的硬度，从而提高光模块壳体11的耐磨性。镀层120可以位于上壳体111，也可以位于上壳体111和下壳体112。
上述对于外壳本体110的制作材料仅为举例，在其他示例中，外壳本体110还可以采用其他的材料进行制作。
作为一种示例，镀层120可以覆盖外壳本体110的全部表面，外壳本体110的全部表面包括外壳本体110的内表面和外表面。
覆盖外壳本体110的外表面的镀层120的粗糙度Ra不超过0.6μm。由于覆盖外壳本体110的内表面的镀层120不与散热器30接触，因此即使粗糙度Ra超过0.6μm，也不会影响光模块壳体与散热器30之间的热交换。如无特殊说明，本申请实施例中，镀层120的表面均指代位于外壳本体110外表面的镀层120的表面。
当然，为了促进光模块10中，光模块壳体11内的器件与光模块壳体11之间的热交换， 也可以使覆盖外壳本体110的内表面的镀层120的粗糙度Ra不超过0.6μm，使光模块壳体11内的器件与光模块壳体11的内表面能更紧密的接触。
在一些示例中，镀层120可以为镍镀层。镍镀层能够使光模块壳体11具有较好的抗腐蚀性，有利于延长光模块的使用寿命。
在其他示例中，镀层120还可以是其他材料形成的镀层，例如铬镀层或其他具有耐磨性和抗腐蚀性的镀层，铬镀层也具有较高的硬度和抗腐蚀性，也能够起到延长光模块的使用寿命的作用。
示例性地，镀层120的硬度不小于900HV0.1，通过设置较高的硬度，能够使光模块壳体11具有较好的耐磨性。
镀层120的厚度可以为1μm～20μm，镀层120的厚度影响光模块壳体11的耐磨性和抗腐蚀性，厚度设置的过薄，对于耐磨性和抗腐蚀性的提升不明显，厚度设置的过厚，会增加制作成本。
镀层120的密度可以大于或等于7g/cm3，例如7.9g/cm3～8.5g/cm3，使镀层120足够致密，以更好地保护所述光模块壳体。
可选地，光模块壳体的外表面还具有防指纹结构。
由于镀层120的粗糙度Ra较小，比较光滑，因此在光模块的插拔过程中，在镀层120表面容易形成细小的划痕，导致光模块壳体11的表面被刮花。在镀层120表面也容易形成指纹、掌纹等痕迹。通过防指纹结构能够避免光模块壳体11的表面被刮花，也能够避免被指纹沾污。
在一些示例中，镀层120的表面为磨砂面，防指纹结构包括该磨砂面。
即通过对镀层120的表面进行磨砂处理，使镀层120的表面出现凹痕或凸起，成为磨砂面。磨砂面能够避免镀层120的表面产生划痕，也能避免被指纹沾污，提高光模块的外观质量。
磨砂面的粗糙度Ra不超过0.6μm，以使光模块壳体11与散热器30之间存在的缝隙较小，光模块壳体11与散热器30之间仍然能够快速进行热交换。
在另一些示例中，例如图4所示，防指纹结构包括防指纹膜130。防指纹膜130位于镀层120的表面。
通过在镀层120的表面设置防指纹膜130，也能够起到避免光模块壳体11的表面被刮花的目的，并且避免光模块壳体11的表面被沾污形成指纹、掌纹等痕迹，提高光模块的外观质量。
示例性地，防指纹膜130可以包括，但不限于是纳米颗粒涂层、自组装单分子膜、氧化物涂层。
防指纹膜130可以覆盖镀层120的表面的部分区域，或者全部区域。例如，覆盖镀层120的表面的全部区域，使得光模块壳体表面任何可能被触碰到的区域都不会被沾污。
本申请实施例还提供了一种光模块，该光模块包括电路板和如图3～图4所示的任一种光模块壳体11。该电路板位于光模块壳体11中。
电路板上连接有电子元器件，例如光源、光数字信号处理(optical digital signal processor，ODSP)芯片、集成相干发射机(integrated coherent transmitter，ICT)芯片、集成相干接收机(integrated coherent receiver，ICR)芯片。
本申请实施例还提供了一种光通信设备，该光通信设备包括光模块连接器和前述的光模块，该光模块与光模块连接器相连。
本申请实施例所提供的光模块与相关技术中相同型号的光模块进行对比，两个光模块与散热器之间的压力均为20N，在25℃的环境温度下工作，两个光模块的功耗均为26.5W，散热风量均为10CFM。工作相同的时间后，本申请实施例所提供的光模块中的ODSP芯片的温度为76.6℃，光源的温度为42.4℃，ICT芯片的温度为49.5℃，ICR芯片的温度为49℃，而相关技术中的光模块的温度分别为83.37℃、44.27℃、52.17℃和51.57℃，分别降低了6.77℃、1.87℃、2.67℃和2.57℃。
可见，通过降低光模块壳体11表面的粗糙度，尤其是接触区11a的粗糙度，将粗糙度Ra降低至不超过0.6μm，就能够明显地提高光模块10的散热效果，并且该方案还具有成本低的特点。
图5是本申请实施例提供的一种光模块壳体的制作方法流程图。该方法用于制作图3或图4所示的光模块壳体。如图5所示，该制作方法包括：
在步骤S11中，提供一外壳本体110。
光模块壳体包括上壳体111和下壳体112。以上壳体111与下壳体112为分体构件为例，外壳本体110也为分体结构，包括上外壳本体1101和下外壳本体1102。上外壳本体1101和下外壳本体1102可以分别制作。
例如，采用压铸的方式制作出上外壳本体1101和下外壳本体1102。对于上壳体111与下壳体112为一个整体的光模块壳体，上外壳本体1101和下外壳本体1102也为一个整体，可以整体通过压铸的方式进行制作。
在步骤S12中，在外壳本体110的表面形成镀层120。
其中，至少在接触区11a，镀层120的粗糙度Ra不超过0.6μm。
在外壳本体110的表面形成镀层120时，可以分别对上外壳本体1101和下外壳本体1102进行处理，形成镀层120。
例如，可以采用化学镀的方式分别在上外壳本体1101的表面和下外壳本体1102的表面形成镀层120。
通常光模块壳体11外表面的粗糙度Ra在1.6μm，对于功率较大的光模块，光模块壳体11与散热器30之间的接触热阻较大，导致光模块在工作过程中容易温度过高。本申请实施例通过将接触区11a的镀层120的粗糙度Ra设置在不超过0.6μm，使得光模块壳体11与散热器30之间存在的缝隙更小，降低了接触热阻，有利于光模块壳体11与散热器30之间的热交换，加速光模块的散热，避免光模块温度过高。
上外壳本体1101的表面和下外壳本体1102的表面形成的镀层120的厚度均可以为1μm～20μm，镀层120的厚度影响光模块壳体11的耐磨性和抗腐蚀性，厚度设置的过薄，对于耐磨性和抗腐蚀性的提升不明显，厚度设置的过厚，会增加制作成本。
图6是本申请实施例提供的一种光模块壳体的制作方法流程图。该方法用于制作图3或图4所示的光模块壳体。该方法在步骤S11之后进行。图7是本申请实施例提供的一种光模块壳体的制作过程示意图。图中以制作镀层120为镍镀层的上壳体111为例，示意了光模块壳体的制作过程，在其他示例中，镀层120还可以是铬镀层。结合图6和图7所示，该制作 方法包括：
在步骤S21中，对外壳本体110进行抛光。
通过对外壳本体110抛光，以降低外壳本体110的粗糙度，有利于降低后续形成的镀层120的粗糙度。在步骤S21中，通过抛光，使得至少在接触区11a，外壳本体110的粗糙度Ra不超过0.6μm，如此使后续形成的镀层120在接触区11a的粗糙度Ra能够不超过0.6μm。
作为示例，以上壳体111与下壳体112为分体构件，制作上壳体111为例，如图7所示，在步骤S21中，可以对上外壳本体1101进行抛光，以降低接触区11a的粗糙度。
在抛光时，可以对上壳体111的外表面进行抛光，也可以对上壳体111的外表面和内表面进行抛光。在抛光外表面和内表面时，内表面的粗糙度可以大于外表面的粗糙度，由于内表面并不暴露在外，不与散热器进行接触，因此不需要将粗糙度控制在很低的水平，以减少工作量，降低成本。
在对外壳本体110进行抛光时，可以采用机械抛光和/或激光抛光。
在步骤S22中，在外壳本体110的表面进行化学镀镍，形成镀层120。
化学镀相比于电镀，形成的镀层120的厚度更加均匀，并且成本更低。在外壳本体110表面形成的镀层120的厚度可以为1μm～20μm，镀层120的厚度影响光模块壳体11的耐磨性和抗腐蚀性，厚度设置的过薄，对于耐磨性和抗腐蚀性的提升不明显，厚度设置的过厚，会增加制作成本。镀层120的密度可以大于或等于7g/cm3，例如7.9g/cm3～8.5g/cm3。
在步骤S23中，对外壳本体110进行退火。
通过退火处理，能够提高镀层120的硬度，从而提高镀层120的耐磨性。通过退火处理，使镀层120的硬度不小于900HV0.1。
对外壳本体110退火后，还可以进行步骤S24或步骤S25。
在步骤S24中，对镀层120进行磨砂处理。
通过磨砂处理，使镀层120的表面出现凹痕或凸起，将镀层120的表面处理成磨砂面。磨砂面可以作为防指纹结构，避免镀层120的表面被指纹沾污。磨砂面还能够避免镀层120的表面产生划痕，提高光模块的外观质量。
磨砂处理可以通过喷丸工艺或喷砂工艺进行。通过对磨砂处理过程中，磨料的粒径、硬度进行合理选择，对喷枪枪口直径进行合理选择，对喷射气压、喷枪枪口与镀层120的表面之前的距离以及处理时间等进行合理设置，使磨砂处理后，磨砂面的粗糙度Ra不超过0.6μm，使得光模块壳体11与散热器30之间存在的缝隙较小，光模块壳体11与散热器30之间仍然能够快速进行热交换。
示例性地，磨料可以为圆角钢砂。
在步骤S25中，在镀层120的表面形成防指纹膜130。
该防指纹膜130可以是，但不限于是纳米颗粒涂层、自组装单分子膜、氧化物涂层。
通过在镀层120的表面形成防指纹膜130作为防指纹结构，避免镀层120的表面被指纹沾污。防指纹膜130也能够避免镀层120的表面产生划痕，提高光模块的外观质量。
防指纹膜130可以形成在镀层120的表面任何可能被触碰到的区域，或者可以覆盖镀层120的表面的所有区域。
图8是本申请实施例提供的一种光模块壳体的制作方法流程图。该方法用于制作图3或图4所示的光模块壳体。该方法在步骤S11之后进行。图9是本申请实施例提供的一种光模 块壳体的制作过程示意图。图中以制作上壳体111为例，示意了光模块壳体的制作过程。结合图8和图9所示，该制作方法包括：
在步骤S31中，在外壳本体110的表面进行化学镀镍，形成镀层120。
作为示例，以上壳体111与下壳体112为分体构件，制作上壳体111为例，如图9所示，在步骤S31中，可以在上外壳本体1101的表面形成镀层120。
形成镀层120的方式可以与前述的步骤S22类似，此处不再详述。
在步骤S31中形成的镀层120的厚度可以大于步骤S22中形成的镀层120的厚度。例如在步骤S31中形成的镀层120的厚度可以为25μm～50μm。
在步骤S32中，对镀层120进行抛光。
在步骤S31中形成较厚的镀层120，使得预留有足够的余量对镀层120进行抛光，避免局部区域的镀层120在抛光过程中被完全去除。
通过对镀层120抛光，以降低镀层120的粗糙度，使得至少在接触区11a，镀层120的粗糙度Ra不超过0.6μm。抛光后镀层120的厚度可以为1μm～20μm。
作为示例，以上壳体111与下壳体112为分体构件为例，在抛光时，可以对上外壳本体1101的外表面上的镀层120进行抛光，也可以对上外壳本体1101的外表面和内表面上的镀层120进行抛光。在抛光外表面和内表面时，内表面的粗糙度可以大于外表面的粗糙度，由于内表面并不暴露在外，不与散热器进行接触，因此不需要将粗糙度控制在很低的水平，以减少工作量，降低成本。
在对镀层120进行抛光时，可以采用机械抛光和/或激光抛光。
本示例与图6所示示例的区别在于，本示例中，先在外壳本体110上形成镀层120，然后再进行抛光。由于形成镀层120前，外壳本体110没有进行抛光，因此外壳本体110的表面比较粗糙，可以使镀层120更加紧密地附着在外壳本体110的表面。在形成镀层120后进行抛光，又能够确保镀层120的粗糙度满足要求。
在步骤S33中，对外壳本体110进行退火。
步骤S33可以与前述的步骤S22相同，此处不再详述。
对外壳本体110退火后，还可以进行步骤S34或步骤S35。
在步骤S34中，对镀层120进行磨砂处理。
步骤S34可以与前述的步骤S24相同，此处不再详述。
在步骤S35中，在镀层120的表面形成防指纹膜130。
步骤S35可以与前述的步骤S25相同，此处不再详述。
本申请的实施方式部分使用的术语仅用于对本申请的实施例进行解释，而非旨在限定本申请。除非另作定义，本申请的实施方式使用的技术术语或者科学术语应当为本申请所属领域内具有一般技能的人士所理解的通常意义。本申请专利申请说明书以及权利要求书中使用的“第一”、“第二”、“第三”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连 接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。
以上所述仅为本申请一个实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (12)

  1. 一种光模块壳体，其特征在于，包括外壳本体(110)和镀层(120)，所述镀层(120)位于所述外壳本体(110)表面，至少在接触区(11a)，所述镀层(120)的粗糙度Ra不超过0.6μm，所述接触区(11a)为所述光模块壳体用于与散热器接触的区域。
  2. 根据权利要求1所述的光模块壳体，其特征在于，所述镀层(120)的硬度不小于900HV0.1。
  3. 根据权利要求1或2所述的光模块壳体，其特征在于，所述光模块壳体的外表面具有防指纹结构。
  4. 根据权利要求3所述的光模块壳体，其特征在于，所述镀层(120)的表面为磨砂面，所述防指纹结构包括所述磨砂面。
  5. 根据权利要求3所述的光模块壳体，其特征在于，所述防指纹结构包括防指纹膜(130)，所述防指纹膜(130)位于所述镀层(120)的表面。
  6. 一种光模块壳体的制作方法，其特征在于，所述光模块壳体具有接触区(11a)，所述接触区(11a)用于与散热器接触，包括：
    提供一外壳本体(110)；
    在所述外壳本体(110)的表面形成镀层(120)，至少在所述接触区(11a)，所述镀层(120)的粗糙度Ra不超过0.6μm。
  7. 根据权利要求6所述的制作方法，其特征在于，在所述外壳本体(110)的表面形成镀层(120)之前，还包括：
    对所述外壳本体(110)进行抛光，使得至少在所述接触区(11a)，所述外壳本体(110)的粗糙度Ra不超过0.6μm。
  8. 根据权利要求6或7所述的制作方法，其特征在于，在所述外壳本体(110)的表面形成镀层(120)之后，还包括：
    对所述镀层(120)进行抛光。
  9. 根据权利要求6～8任一项所述的制作方法，其特征在于，还包括：
    对所述镀层(120)进行磨砂处理。
  10. 根据权利要求6～8任一项所述的制作方法，其特征在于，还包括：
    在所述镀层(120)的表面形成防指纹膜(130)。
  11. 一种光模块，其特征在于，包括电路板和如权利要求1～5任一项所述的光模块壳体(11)，所述电路板位于所述光模块壳体(11)中。
  12. 一种光通信设备，其特征在于，包括光模块连接器和如权利要求11所示的光模块，所述光模块与所述光模块连接器相连。
PCT/CN2023/098230 2022-08-31 2023-06-05 光模块壳体及其制作方法、光模块和光通信设备 WO2024045737A1 (zh)

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