WO2021037236A1 - 金属板材及制备的方法，壳体和电子设备 - Google Patents

金属板材及制备的方法，壳体和电子设备 Download PDF

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Publication number
WO2021037236A1
WO2021037236A1 PCT/CN2020/112232 CN2020112232W WO2021037236A1 WO 2021037236 A1 WO2021037236 A1 WO 2021037236A1 CN 2020112232 W CN2020112232 W CN 2020112232W WO 2021037236 A1 WO2021037236 A1 WO 2021037236A1
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WO
WIPO (PCT)
Prior art keywords
groove
metal
antenna
metal sheet
base
Prior art date
Application number
PCT/CN2020/112232
Other languages
English (en)
French (fr)
Inventor
黄志勇
Original Assignee
Oppo广东移动通信有限公司
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Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021037236A1 publication Critical patent/WO2021037236A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • This application relates to the field of electronic equipment, in particular to metal plates and preparation methods, housings and electronic equipment.
  • 5G communication has more stringent requirements for the antennas used to receive and send communication signals in electronic equipment than 3G/4G communication. Therefore, in order to adapt to the advent of the 5G era, the antennas, Structures such as housings also need to be improved according to 5G communication methods.
  • Metal casings are widely used to prepare casings for electronic devices due to their good metallic luster, better heat dissipation performance and mechanical strength. In order to prevent the metal shell from shielding the communication signal, it is usually necessary to form an antenna slot penetrating the metal shell on the metal shell, and fill the antenna slot with an insulating material.
  • the filling of the above-mentioned insulating material will cause the appearance of the metal shell at the antenna slot to be non-uniform
  • the above-mentioned problem of non-uniform appearance can be alleviated by narrowing the antenna slot.
  • the antenna slot needs to have a certain width.
  • This application aims to solve one of the technical problems in the related technology at least to a certain extent.
  • this application proposes a metal sheet.
  • the metal plate includes: a base, the base is formed of metal, the base has an antenna groove, the bottom of the antenna groove is formed of metal oxide, and the The antenna groove is filled with an insulating layer. Therefore, the antenna groove of the metal sheet can also have an anodized metal appearance on the appearance surface, so that a more consistent overall appearance effect can be obtained, without the need to narrow the width of the antenna groove to achieve the uniformity of the overall appearance, and then It can meet the requirements of 5G communication.
  • the present application proposes a method for preparing a metal sheet.
  • the method includes: providing a substrate, the substrate being formed of metal; forming a groove on the substrate, converting the metal at the bottom of the groove into a metal oxide through anodizing treatment, and forming a metal oxide in the groove.
  • An insulating layer is formed in the groove to form an antenna groove, and the metal sheet is obtained.
  • the method can easily obtain the metal plate, and the appearance surface of the antenna groove of the obtained metal plate can also have the appearance of metal anodization.
  • this application proposes a housing.
  • the case is formed of the aforementioned metal sheet, or is formed of a metal sheet obtained by the aforementioned method, and the case includes a bottom surface and a side wall.
  • the bottom surface And the side wall defines an accommodating space, and the insulating layer in the antenna groove of the metal plate is arranged toward one side of the accommodating space. Therefore, the antenna groove of the housing can also have the appearance of metal anode oxidation, the overall appearance of the housing is consistent, and the width of the antenna groove can be adapted to the requirements of 5G communication.
  • this application proposes an electronic device.
  • the electronic device includes the aforementioned housing, the insulating layer in the antenna groove of the housing is located on the side facing the housing space of the housing, a main board and a display screen, the main board and the display screen It is electrically connected and is located inside the accommodating space, and an antenna, and the antenna is located inside the accommodating space. Therefore, the electronic device can have a more consistent appearance effect, and the width of the antenna groove of the housing can be adapted to the requirements of 5G communication.
  • Fig. 1 shows a schematic diagram of the structure of a metal sheet according to an embodiment of the present application
  • Figure 2 shows a schematic diagram of the structure of a metal sheet according to another embodiment of the present application.
  • Fig. 3 shows a schematic structural diagram of a sheet metal according to another embodiment of the present application.
  • Figure 4 shows a schematic flow chart of a method for preparing a metal sheet according to an embodiment of the present application
  • Fig. 5 shows a schematic flow chart of a method for preparing a metal sheet according to an embodiment of the present application
  • Fig. 6 shows a schematic flow chart of a method for preparing a metal sheet according to another embodiment of the present application
  • Fig. 7 shows a schematic flow chart of a method for preparing a metal sheet according to another embodiment of the present application.
  • Fig. 8 shows a schematic flow chart of a method for preparing a metal sheet according to another embodiment of the present application
  • Figure 9 shows a schematic structural diagram of a housing according to an embodiment of the present application.
  • Fig. 10 shows a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • 100 substrate; 110: groove; 10: bottom; 11: first anodized layer; 12: hard anodized layer; 120: insulating layer; 200: antenna groove; 300: injection molded part; 1100: shell; 1000: Electronic equipment.
  • this application proposes a metal sheet.
  • the metal plate includes a base 100 with an antenna groove, the bottom 10 of the antenna groove is formed of metal oxide, and an insulating layer 120 is filled in the antenna groove.
  • the base 100 is formed of metal.
  • metal should be understood in a broad sense, and it can be referred to as a simple metal or an alloy.
  • the material forming the base 100 may include at least one of aluminum, aluminum alloy, magnesium alloy, and stainless steel.
  • aluminum or aluminum alloy may be used to form the base 100.
  • the metal plate has at least one of the following advantages: the antenna groove of the metal plate can also have an anodized metal appearance on the appearance surface, so that a more consistent overall appearance effect can be obtained without narrowing. The width of the antenna groove can then adapt to the requirements of 5G communication.
  • the commonly used processing method is to form a through slit on the base of the metal sheet, and inject insulating plastic and other materials in the slit to form an antenna slit.
  • One disadvantage of this technology is that the appearance of the plastic part formed by injection molding is difficult to be consistent with the appearance of the metal part of the metal shell.
  • anodizing technology is often used to form an anodized appearance with a certain color or showing the natural color of the metal.
  • the metal shell Even if the plastic part is dyed, it is difficult to obtain a color similar to the anodized appearance of the metal, so the metal shell usually has a relatively obvious antenna slit.
  • 5G communication has higher requirements for signal transmission, such as narrowing antennas. The width of the slit will easily lead to a decrease in the signal transmission effect.
  • the bottom of the antenna groove is formed of metal oxide. Therefore, the antenna groove and the insulating layer filled in the antenna groove can prevent the metal shell from shielding communication signals. .
  • the appearance of the metal oxide can be better consistent with the appearance of other parts of the metal substrate: if the other parts of the metal substrate need to obtain a certain appearance effect, the common treatment method is anodizing treatment, and the result of anodizing treatment That is, an oxide film with a specific color is formed on the surface of the metal substrate. Therefore, the bottom of the antenna groove made of metal oxide can make the metal sheet have a more consistent appearance.
  • the bottom 10 of the antenna groove may be formed by anodizing the base at the position.
  • the bottom 10 of the antenna groove and the base 100 are actually an integrated structure, which can simplify the manufacturing process, and only need to process the base 100 at a specific position without introducing additional evaporation or sputtering. The process forms the bottom 10.
  • a groove 110 that does not penetrate the base 100 can be formed on the side of the base first, and then the bottom 10 of the groove 110 may be anodized.
  • an insulating material such as plastic can be filled in the groove to form an insulating layer 120 (as shown in (d) in FIG. 7).
  • the antenna groove in the metal plate is composed of the insulating layer 120 and the bottom 10 made of metal oxide, which can prevent the base 100 formed of metal from shielding the signal, and at the same time, the antenna groove of the metal plate is far away
  • the surface of the antenna groove opening (that is, away from the insulating layer 120) is formed by the bottom 10, and the appearance of the metal oxide at the bottom 10 can provide a more consistent appearance for the board.
  • the thickness of the bottom of the antenna groove may not be less than 160 microns. Therefore, on the one hand, the precision requirements of the preparation process can be simplified, and on the other hand, the reliability of the bottom of the antenna groove can be ensured, and the metal oxide at this position can be prevented from being too thin and peeling and peeling of the metal oxide in practical applications can be prevented. rupture.
  • the bottom of the antenna groove may be composed of a layer of metal oxide film, or may include two stacked metal oxide films.
  • the bottom of the antenna groove may be composed of a laminated hard anodized layer 12 and a first anodized layer 11, and the hard anodized layer 12 is disposed toward the side of the insulating layer 120.
  • the thickness of the hard anodized layer 12 may be 150-300 microns, and the thickness of the first anodized layer 11 may be 10-30 microns.
  • the metal sheet can use the side facing away from the opening of the groove 110 as the appearance surface, that is to say, the surface facing the side of the opening of the groove 110 is invisible to the user, and the later The location will be covered by the insulating layer 120 filled in the groove 110. Therefore, it is possible to first perform hard anodizing treatment on the side of the groove 110 facing the opening to form the hard anodizing layer 12 (refer to (a)-(c) in FIG. 8.
  • Hard anodizing treatment is a kind of Thick film anodizing can be performed on the surface of substrates such as aluminum and aluminum alloys. Compared with the conventional anodizing process, this process can form a thicker anodized layer, but the color of the formed anodized layer is limited For example, it can only be made in specific colors such as black and gray. However, since the hard anodized layer 12 is not located on the outer surface of the metal sheet, this limitation will not have a negative impact on the metal sheet.
  • the side of the substrate 100 away from the insulating layer 120 can be anodized to form the first anodized layer 11.
  • the thickness of the first anodized layer 11 can be relatively thin, and The color can also be more abundant than that of the hard anodized layer. For example, the thickness of the first anodized layer 11 can be 10-30 microns.
  • the specific position of the metal oxide in the antenna groove and the formation technology are not particularly limited.
  • the metal substrate may have the shape shown in FIG. 1 or FIG. structure.
  • the metal substrate may also have a metal oxide film on the sidewall of the antenna groove, more specifically, it may have a hard anodized film 12.
  • the hard anodic oxide film 12 when the hard anodic oxide film 12 is formed, the hard anodic oxide film 12 can be simultaneously formed on the inner bottom and sidewalls of the groove.
  • the metal sheet proposed in this application only needs to be made of metal oxide on the surface of the antenna groove on the side of the appearance surface.
  • the specific composition, thickness, color, layered structure and order of the metal oxide can be based on actual conditions. The situation is adjusted.
  • the bottom of the antenna groove of the metal sheet can also be composed of a hard metal anodized layer, that is, the bottom 10 shown in FIG. 1 can be made by hard anodizing the substrate at this position, and All the metal at the bottom of the groove is oxidized to form a hard anodic oxide film.
  • the hard anodized film has certain limitations on the appearance color, but when the overall color of the appearance surface of the metal sheet is the color that can be obtained by hard anodizing, the bottom 10 can also be completely made of It is composed of metal oxide formed by hard anodizing. In general, the total thickness of the metal oxide at the bottom of the antenna groove can be 160-600 microns.
  • the width of the antenna groove may be greater than 2 microns.
  • the metal sheet may have multiple antenna grooves. As mentioned above, since the appearance surface of the antenna groove is made of metal oxide, it is not necessary to narrow the width of the antenna groove to improve the integration effect of the plate at the antenna groove. Therefore, the width of the antenna groove in the metal sheet can be wider.
  • the present application proposes a method for preparing a metal sheet.
  • the metal sheet prepared by this method may have the same features and advantages as the aforementioned metal sheet, and will not be repeated here. Specifically, referring to FIG. 4, the method includes:
  • a substrate is first provided.
  • the substrate may be formed of metal.
  • the material constituting the matrix has been described in detail above, and will not be repeated here.
  • the base may have a first surface and a second surface, and the first surface and the second surface are arranged opposite to each other.
  • the first surface and the second surface may be two main surfaces perpendicular to the thickness direction of the plate.
  • first surface and second surface are only used to distinguish two opposite surfaces of the substrate for ease of understanding, and should not be construed as a limitation of the substrate described in the method of the present application.
  • the metal sheet obtained by this method may have the same characteristics as the aforementioned metal sheet, so the groove formed in the subsequent steps of the method is also a non-penetrating groove.
  • the method will be described in detail below by taking the side of the groove opening facing the first surface as an example. That is, the following formation of grooves on the first surface of the base is only for distinguishing the direction of the opening of the grooves, and should not be understood as a limitation of the present application.
  • a groove is first formed on the first surface of the substrate. It should be noted here that the groove formed in this step does not penetrate the base body, but a groove with a depth less than the thickness of the base body and a bottom is formed on one side of the base body.
  • the side of the bottom of the groove facing the groove opening is the inner surface of the groove bottom, and the bottom of the groove is away from the side of the groove opening, that is, the surface of the second surface of the base corresponding to the groove and the rest of the second surface of the base
  • the location is one.
  • the structure of the substrate formed with the grooves may be as shown in FIG. 7(b) and FIG. 8(b).
  • the metal at the bottom of the groove is converted into metal oxide, and an insulating layer is filled in the groove.
  • the insulating layer can be formed by injection molding plastic to obtain the antenna groove to obtain the metal sheet . Therefore, the antenna groove of the metal sheet can also have an anodized metal appearance on the appearance surface, so as to obtain a more consistent overall appearance effect without narrowing the width of the antenna groove, thereby adapting to the requirements of 5G communication .
  • first surface and second surface are only used to distinguish two surfaces of the substrate, and cannot be understood as a limitation of the present application.
  • the specific steps of forming the antenna groove are not particularly limited, as long as all the metal at the bottom of the groove can be converted into metal oxide, and the insulating layer can be filled.
  • the antenna groove may be formed by the following steps:
  • a groove is first formed on the first surface of the base body.
  • the specific process for forming the groove is not particularly limited.
  • the preparation of the groove can be realized by CNC machine cutting (CNC).
  • the base can be roughed by CNC machining, that is, rough machining, so as to process the base into a shape roughly consistent with the final metal sheet to be obtained.
  • a machining allowance can be reserved on the side of the substrate used to form the appearance surface of the metal sheet, that is, a machining allowance can be reserved on the second surface of the substrate to facilitate subsequent processing.
  • an anodic oxidation process is first performed on the substrate at the groove to convert part of the metal at the bottom of the groove into metal oxide.
  • a hard anodic oxidation treatment may be performed on the side of the groove facing the first surface to form a hard anodic oxidation film on the inner surface of the bottom of the groove.
  • the hard anodic oxide film is inside the metal plate, it will be filled with plastic in the subsequent steps, so the thickness of the oxide film can be appropriately thick in this step.
  • hard anodic oxidation can be used to achieve a film thickness of 150-300 microns.
  • the reliability of the substrate can be ensured, and the finally formed metal sheet can be prevented from peeling off due to the thickness of the anodic oxide film being too thin.
  • the thickness of the groove needs to be strictly controlled in the previous step of CNC machining the groove, which will greatly increase the cost of CNC machine tool processing and affect production efficiency And product yield.
  • the insulating layer is formed, specifically, the groove may be filled by injection molding to form the insulating layer.
  • the specific chemical composition of the injection molded plastic is not particularly limited, and those skilled in the art can make a selection according to actual needs, as long as it can prevent the metal matrix from shielding the communication signal.
  • the insulating layer formed in this step is not located on the appearance surface of the finally obtained metal sheet, that is, the insulating layer is ultimately invisible to the user. Therefore, the selection of the insulating layer does not need to consider the requirements of appearance, wear resistance, etc., as long as the material can form a part of the insulated antenna slot.
  • the first anodizing treatment is performed on the part of the second surface of the base body corresponding to the groove, so as to convert all the remaining metal at the bottom of the groove. It is a metal oxide.
  • the first anodic oxidation treatment can be detected to ensure that all the metals there are converted into metal oxides.
  • the thickness of the first anodic oxide film formed in this step may be 10-30 microns.
  • the specific steps of forming the antenna groove are not particularly limited, as long as the bottom of the finally formed antenna groove is made of non-metallic materials, that is, metal oxides.
  • the step of forming an insulating layer in the groove (S10 and S20 as shown in FIG. 6) can also be directly performed. Then, anodize the part on the second surface of the substrate corresponding to the groove to directly convert the bottom of the groove into metal oxide at one time.
  • a hard anodic can be applied to the corresponding part of the second surface. Oxidation treatment forms a thick hard anodic oxide film.
  • two hard anodic oxidation treatments can also be carried out to form two thick hard anodic oxidation films.
  • the first hard anodic oxidation treatment may be performed on the side of the groove facing the first surface first, and then an insulating layer may be formed in the groove.
  • a second hard anodic oxidation treatment is performed on the portion of the second surface of the substrate corresponding to the groove to convert the residual metal at the bottom of the groove into metal oxide.
  • a relatively thick anodized film can be obtained.
  • the total thickness of the metal oxide at the bottom of the antenna groove is finally obtained (formed by two hard anodizing treatments) It can be 200-600 microns.
  • the method may also have a step of a second cutting process to finely sculpt the base body to obtain a base body whose shape and size conform to the predetermined size of the product. Specifically, after the insulating layer is formed and before the subsequent steps, the following steps may be further included:
  • a second cutting process is performed on the second surface of the base body, and the cutting accuracy of the second cutting process is controlled.
  • the thickness of the corresponding substrate at the bottom of the groove is controlled.
  • the metal sheet obtained by this method can have the same characteristics as the metal sheet mentioned above. Therefore, it can be understood that the thickness of the bottom of the groove controlled by the second cutting process is the same as that of the bottom of the finally formed groove.
  • the total thickness that is, the thickness includes the sum of the part of the metal oxide treated by anodization before forming the insulating layer, and the thickness of the remaining metal on the side of the substrate away from the opening of the groove (ie, the second surface of the substrate).
  • the thickness of the substrate can be specifically controlled to be not less than 160 microns.
  • the bottom of the groove will be completely converted into metal oxide by anodizing in the subsequent steps, so the thickness controlled by the second cutting process is actually the final metal substrate antenna obtained.
  • the total thickness of the metal oxide at the groove If the accuracy of the thickness control is inaccurate, and the anodizing process is not strictly tested during the subsequent anodizing process, it may cause some residual metal at the bottom of the groove to not be oxidized, resulting in the failure of the antenna groove preparation .
  • the thickness at the bottom of the groove can be controlled more accurately through the second cutting process, and the second cutting process can be performed on the appearance side of the substrate, that is, the first cutting process is performed on the first surface of the substrate.
  • the second cutting process can be performed on the appearance side of the substrate, that is, the first cutting process is performed on the first surface of the substrate.
  • Only the shape of the inner surface of the groove is formed, and the substrate is cut again from the side of the second surface through the second cutting process, so as to finally obtain a groove whose thickness matches the predetermined size.
  • controlling the cutting accuracy of the second cutting process can be achieved by arranging one or more probes for monitoring the cutting position on the second surface of the substrate.
  • the above-mentioned use of the probe to control the accuracy of the second cutting process can be achieved as follows: during the first cutting process, a structure and recess can be reserved at a specific position of the substrate.
  • the groove is the same reserved groove, and when the insulating layer is subsequently formed, the reserved groove will not be injection molded, that is to say, one more reserved groove is processed on the inner surface of the substrate.
  • the depth of the reserved groove It is the same as the groove filled with the insulating layer.
  • the structure position of the reserved groove is obtained by the probe probe as a reference, and then the thickness of the substrate that needs to be removed in the second cutting process is determined accordingly, and the probe is used to control the second cutting process Accuracy.
  • the method may further include performing a second anodizing treatment on the substrate formed with the antenna groove.
  • a second anodizing treatment on the substrate formed with the antenna groove.
  • this application proposes a housing.
  • the housing 1100 may be formed of the aforementioned metal sheet or the metal sheet obtained by the aforementioned method.
  • the housing may have an antenna groove 200, for example, there may be a plurality of antenna grooves 200.
  • the housing 1100 may have a bottom surface and a side wall, the bottom surface and the side wall define an accommodating space, and the insulating layer in the antenna groove in the plate is disposed toward one side of the accommodating space (not shown in the figure).
  • the housing 1100 may also have an injection molding part 300, and the injection molding part 300 may be located in the accommodating space for defining various components that need to be accommodated in the housing 1100 later.
  • the housing has all the features and advantages of the metal sheet described above.
  • the antenna groove of the housing can also have a metal anodized appearance, the overall appearance of the housing is consistent, and the antenna The groove width can be adapted to the requirements of 5G communication.
  • the electronic device 1000 may include the aforementioned housing 1100, as well as a main board and a display screen (the main board and the display screen are not shown in the figure).
  • the main board and the display screen are electrically connected, and are accommodated (located) in the housing space of the housing, and the insulating layer in the antenna groove of the housing is located on the side facing the housing space.
  • the electronic device also has an antenna. The antenna is located inside the accommodating space and can transmit and receive signals from the antenna groove of the housing.
  • the side of the antenna groove 200 of the housing 1100 facing the user may be oxidized by metal Therefore, the electronic device 1000 can adopt a metal shell to obtain better appearance and mechanical strength, and at the same time, it can ensure the heat dissipation of the electronic device.
  • the shell since the shell uses the aforementioned metal sheet, the width of the antenna groove 200 is not narrowed while maintaining the consistency of the appearance of the shell, which is suitable for 5G communication.
  • FIG. 10 only shows a schematic structural diagram of an electronic device according to the present application, the specific type of the electronic device, the shape of the housing 1100, and the number and shape of the antenna grooves 200 in the housing The positions on the 1100 are not particularly limited.
  • the above-mentioned electronic device may be any of various types of computer system devices that are mobile or portable and perform wireless communication.
  • the electronic device may be a mobile phone or a smart phone (for example, a phone based on iPhone TM, a phone based on Android TM), a portable game device (for example, Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop Computers, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, such as watches, earphones, pendants, headsets, etc.
  • electronic devices can also be other wearable devices (such as electronic Glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos or head-mounted devices (HMD) for smart watches).
  • HMD head-mounted devices
  • the electronic device may also be any one of multiple electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, and other media Players, music recorders, video recorders, cameras, other media recorders, radios, medical equipment, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital Assistant (PDA), Portable Multimedia Player (PMP), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) player, portable medical equipment, digital camera and combinations thereof.
  • PDA personal digital Assistant
  • PMP Portable Multimedia Player
  • MPEG-1 or MPEG-2 Moving Picture Experts Group Audio Layer 3
  • the electronic device can perform multiple functions (for example, playing music, displaying videos, storing pictures, and receiving and sending phone calls).
  • the electronic device may be a portable device such as a cell phone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device.

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Abstract

提出了金属板材及制备的方法，壳体和电子设备。该金属板材包括：基体，所述基体是由金属形成的，所述基体上具有天线凹槽，所述天线凹槽的底部是由金属氧化物形成的，并且所述天线凹槽内填充有绝缘层。

Description

金属板材及制备的方法，壳体和电子设备 技术领域
本申请涉及电子设备领域，具体地，涉及金属板材及制备的方法，壳体和电子设备。
背景技术
5G通讯对于电子设备中用于接收和发送通讯信号的天线具有比3G/4G通讯更加严苛的要求，因此，为了适应5G时代的来临，目前电子设备中基于3G/4G通讯而设计的天线、壳体等结构也需要根据5G的通讯方式而进行改进。金属壳体由于具有良好的金属光泽，以及较优的散热性能和机械强度，被广泛用于制备电子设备的壳体。为了防止金属壳体屏蔽通讯信号，通常需要在金属壳体上形成贯穿金属壳体的天线缝，并在天线缝中填充绝缘材料。虽然上述绝缘材料的填充会造成金属壳体在天线缝处的外观不统一，但对于3G/4G通讯而言，可通过窄化天线缝等方式缓解上述外观不统一的问题。然而对于5G通讯而言，为了保证通讯质量和信号的传输，要求天线缝需要具有一定的宽度。
因此，目前的金属板材及制备方法，壳体和电子设备仍有待改进。
发明内容
本申请旨在至少在一定程度上解决相关技术中的技术问题之一。
有鉴于此，在本申请的一个方面，本申请提出了一种金属板材。根据本申请的实施例，该金属板材包括：基体，所述基体是由金属形成的，所述基体上具有天线凹槽，所述天线凹槽的底部是由金属氧化物形成的，并且所述天线凹槽内填充有绝缘层。由此，该金属板材的天线凹槽在外观面也可具有阳极氧化的金属外观，从而可获得较为一致的整体外观效果，而无需通过窄化天线凹槽的宽度实现整体外观的一致性，进而可适应5G通讯的要求。
在本申请的另一方面，本申请提出了一种制备金属板材的方法。该方法包括：提供基体，所述基体是由金属形成的；在所述基体上形成凹槽，将所述凹槽的底部处的金属通过阳极氧化处理转换为金属氧化物，并在所述凹槽中形成绝缘层，以形成天线凹槽，并获得所述金属板材。该方法可简便的获得金属板材，且获得的金属板材的天线凹槽的外观面也可以具有金属阳极氧化的外观。
在本申请的又一方面，本申请提出了一种壳体。该壳体，所述壳体的至少一部分是由前面所述的金属板材形成的，或是利用前面所述的方法获得的金属板材形成的，所述壳体包括底面以及侧壁，所述底面以及所述侧壁限定出容纳空间，所述金属板材中位于天线凹槽内的绝缘层，朝向所述容纳空间一侧设置。由此，该壳体的天线凹槽处也可具有金属阳 极氧化外观，壳体整体外观一致性较好，且天线凹槽宽度可适于5G通讯的要求。
在本申请的又一方面，本申请提出了一种电子设备。该电子设备包括前面所述的壳体，所述壳体中位于天线凹槽内的绝缘层位于朝向所述壳体的容纳空间的一侧，主板和显示屏，所述主板和所述显示屏电连接，并位于所述容纳空间内部，以及天线，所述天线位于所述容纳空间内部。由此，该电子设备可具有较为一致的外观效果，且壳体天线凹槽的宽度可适于5G通讯的要求。
附图说明
图1显示了根据本申请一个实施例的金属板材的结构示意图；
图2显示了根据本申请另一个实施例的金属板材的结构示意图；
图3显示了根据本申请又一个实施例的金属板材的结构示意图；
图4显示了根据本申请一个实施例的制备金属板材的方法的流程示意图；
图5显示了根据本申请一个实施例的制备金属板材的方法的流程示意图；
图6显示了根据本申请另一个实施例的制备金属板材的方法的流程示意图；
图7显示了根据本申请另一个实施例的制备金属板材的方法的流程示意图；
图8显示了根据本申请另一个实施例的制备金属板材的方法的流程示意图；
图9显示了根据本申请一个实施例的壳体的结构示意图；以及
图10显示了根据本申请一个实施例的电子设备的结构示意图。
附图标记说明：
100：基体；110：凹槽；10：底部；11：第一阳极氧化层；12：硬质阳极氧化层；120：绝缘层；200：天线凹槽；300：注塑部；1100：壳体；1000：电子设备。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，术语“相连”、“连接”、“连通”等术语应做广义理解，例如，可以是直接相连，也可以通过中间媒介或部件间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义，只要满足根据本申请实施例的结构关系即可。
在本申请的一个方面，本申请提出了一种金属板材。参考图1，该金属板材包括基体100，基体100上具有天线凹槽，天线凹槽的底部10是由金属氧化物形成的，且天线凹槽 内填充有绝缘层120。基体100是由金属形成的。此处需要特别说明的是，在本申请中“金属”应做广义理解，即可以为金属单质，或是合金。例如，形成基体100的材料可以包括铝、铝合金、镁合金以及不锈钢的至少之一。例如，可采用铝或铝合金形成基体100。总的来说，该金属板材具有以下优点的至少之一：该金属板材的天线凹槽在外观面也可具有阳极氧化的金属外观，从而可获得较为一致的整体外观效果，而无需通过窄化天线凹槽的宽度，进而可适应5G通讯的要求。
为了方便理解，下面首先对该金属板材可实现上述有益效果的原理进行简单说明：
如前所述，当采用金属板材为电子设备的壳体时，需要在金属板材上设置天线凹槽，以防止金属壳体屏蔽通讯信号。目前常用的处理方式是在金属板材的基体上形成贯穿的狭缝，并在狭缝中注塑绝缘的塑胶等材料，形成天线缝。该技术的一个缺点是注塑形成的塑胶部分在外观上难以和金属壳体的金属部分外观保持一致。对于金属壳体而言，多采用阳极氧化技术形成具有一定颜色或是呈现金属本色的阳极氧化外观。而塑胶部分即便是通过染色处理，也难以获得与金属的阳极氧化外观相近似的颜色，因此金属壳体通常具有较为明显的天线缝。虽然上述问题可以通过将天线缝的宽度缩小，并设置多个天线缝的策略而得到一定程度的缓解，但该策略难以适用于5G通讯：5G通讯对于信号传输的要求较高，如窄化天线缝的宽度，则容易导致信号传输效果的下降。
根据本申请实施例的金属板材，天线凹槽的底部是由金属氧化物形成的，因此首先该天线凹槽和填充于天线凹槽中的绝缘层可以起到防止金属壳体屏蔽通讯信号的作用。并且，金属氧化物的外观可以更好地与该金属基体其他部分的外观相一致：金属基体其余部分如需要获得一定的外观效果，常用的处理方式即为阳极氧化处理，而阳极氧化处理的结果即是在金属基体表面形成一层具有特定颜色的氧化膜。因此，由金属氧化物构成的天线凹槽的底部可令该金属板材具有更加一致的外观效果。
下面根据本申请的具体实施例，对该金属板材的各个结构进行详细说明：
根据本申请的实施例，天线凹槽的底部10可以是通过对该位置处的基体进行阳极氧化而形成的。由此，天线凹槽的底部10与基体100实际上是一体化的结构，进而可以简化制备工艺，仅需对特定位置处的基体100进行处理即可，无需额外引入蒸镀或是溅射的工艺形成底部10。
根据本申请的实施例，参考图7中的(a)-(c)，可以首先在基体一侧形成不贯穿基体100的凹槽110，随后对凹槽110底部10的部分进行阳极氧化处理，以将底部处的金属基体转换为金属氧化物。随后可在凹槽内填充塑料等绝缘物质，形成绝缘层120(如图7中的(d)所示出的)。由此，在该金属板材的天线凹槽由绝缘层120，以及由金属氧化物构成的底部10共同组成，可防止金属形成的基体100对信号的屏蔽，同时该金属板材的天线凹槽在远 离天线凹槽开口(即远离绝缘层120)一侧的表面由底部10构成，底部10处金属氧化物的外观可以为该板材提供较为一致的外观效果。
根据本申请的实施例，天线凹槽的底部的厚度可不小于160微米。由此，一方面可简化制备工艺对于精度的要求，另一方面可保证天线凹槽底部处的可靠程度，防止该位置处的金属氧化物过薄而在实际应用中发生金属氧化物的剥离和破裂。
根据本申请的具体实施例，天线凹槽的底部处可以由一层金属氧化物膜构成，也可包括层叠的两层金属氧化物膜。具体地，参考图2，天线凹槽的底部可以由层叠的硬质阳极氧化层12以及第一阳极氧化层11构成，硬质阳极氧化层12朝向绝缘层120一侧设置。
根据本申请的具体实施例，硬质阳极氧化层12的厚度可以为150-300微米，第一阳极氧化层11的厚度可以为10-30微米。具体地，参考图8，由于该金属板材可利用背离凹槽110开口的一侧作为外观面，因此也即是说，朝向凹槽110开口一侧的表面是对用户不可见的，且后期该位置处会被填充在凹槽110中的绝缘层120覆盖。因此，可以首先将凹槽110朝向开口的一侧进行硬质阳极氧化处理，以形成硬质阳极氧化层12(参考图8中的(a)-(c)。硬质阳极氧化处理是一种厚膜阳极氧化法，可在铝和铝合金等基体的表面进行。此种工艺与常规的阳极氧化工艺相比，可形成较厚的阳极氧化层，但形成的阳极氧化层的颜色有局限性，例如只能做黑色、灰色等特定颜色。但鉴于硬质阳极氧化层12并非位于该金属板材的外观面上，因此这一局限性并不会对该金属板材造成负面影响。在向凹槽110中填充塑料并形成绝缘层120之后，可以对该基体100远离绝缘层120的一侧进行阳极氧化处理，以形成第一阳极氧化层11。第一阳极氧化层11的厚度可以较薄，且颜色也可较硬质阳极氧化层更为丰富。例如，第一阳极氧化层11的厚度可以为10-30微米。
根据本申请的实施例，上述天线凹槽中金属氧化物的具体位置以及形成的技术不受特别限制，例如如前所述，该金属基板可以具有如图1或是图2中所示出的结构。或者，参考图3，该金属基板在天线凹槽的侧壁处也可以具有金属氧化物膜，更具体地，可具有硬质阳极氧化膜12。也即是说，在形成硬质阳极氧化膜12时，可同步在凹槽的内底部以及侧壁处形成硬质阳极氧化膜12。
需要特别说明的是，本申请提出的金属板材只要天线凹槽在外观面一侧的表面由金属氧化物构成即可，金属氧化物的具体组成、厚度、颜色、层叠结构和顺序均可根据实际情况进行调节。例如，该金属板材的天线凹槽底部也可以由一层硬质金属阳极氧化层构成，即图1中所示出的底部10可以是通过对该位置处的基体进行硬质阳极氧化，并将凹槽底部处的全部金属均氧化为硬质阳极氧化膜而形成的。虽然如前所述，硬质阳极氧化膜在外观颜色上具有一定局限性，但当该金属板材的外观面的整体颜色为硬质阳极氧化处理可获得的颜色时，该底部10也可全部由硬质阳极氧化形成的金属氧化物构成。总的来说，天线凹 槽的底部处金属氧化物的总厚度，可以为160-600微米。
根据本申请的一些实施例，天线凹槽的宽度可以大于2微米。该金属板材中可具有多个天线凹槽。如前所述，由于该天线凹槽的外观面由金属氧化物构成，因此不必通过窄化天线凹槽的宽度的策略来提升天线凹槽处的板材的一体化效果。因此，该金属板材中天线凹槽的宽度可以较宽。
在本申请的另一方面，本申请提出了一种制备金属板材的方法。根据本申请的实施例，该方法制备的金属板材可以具有与前面所述的金属板材相同的特征以及优点，在此不再赘述。具体地，参考图4，该方法包括：
S100：提供基体，所述基体是由金属形成的
根据本申请的实施例，在该步骤中，首先提供基体。如前所述，基体可以是由金属形成的。关于构成基体的材料前面已经进行了详细的说明，在此不再赘述。例如，基体可具有第一表面和第二表面，第一表面以及第二表面相对设置。具体地，当基体为板材时，第一表面和第二表面可以是垂直于板材厚度方向的两个主面。
此处需要特别说明的是，上述第一表面和第二表面仅用于区分基体相对的两个表面以方便理解，而不应理解为对本申请的方法所述的基体的限制。如前所述，本方法获得的金属板材可具有与前述的金属板材相同的特征，因此该方法后续步骤中形成的凹槽也为非贯穿性的凹槽。下面以凹槽开口朝向第一表面一侧为例，对该方法进行详细描述。即：下述的在基体的第一表面上形成凹槽仅为了区分凹槽开口的方向，而不能理解为对本申请的限制。
S200：在所述基体上形成凹槽，将所述凹槽的底部处的金属通过阳极氧化处理转换为金属氧化物，并在所述凹槽中注塑塑料形成绝缘层
根据本申请的实施例，在该步骤中，首先在基体的第一表面上形成凹槽。此处需要特别说明的是，该步骤中形成凹槽，并不贯穿基体，而是在基体的一侧形成深度小于基体厚度，并且具有底部的凹槽。凹槽底部朝向凹槽开口的一侧为凹槽底部的内表面，凹槽的底部背离凹槽开口的一侧，即基体第二表面与凹槽相对应处的表面与基体第二表面的其余位置是一体的。形成有凹槽的基体的结构可以如图7中的(b)以及图8中的(b)所示出的。
随后，通过阳极氧化处理，将凹槽底部处的金属转换为金属氧化物，并在凹槽中填充绝缘层，例如可通过注塑塑料以形成绝缘层，进而获得天线凹槽，以便获得该金属板材。由此，该金属板材的天线凹槽在外观面也可具有阳极氧化的金属外观，从而可获得较为一致的整体外观效果，而无需通过窄化天线凹槽的宽度，进而可适应5G通讯的要求。
需要特别说明的是，前述的第一表面以及第二表面，仅为了区分基体的两个面，而不能够理解为对本申请的限制。
根据本申请的实施例，形成天线凹槽的具体步骤不受特别限制，只要能够将凹槽底部处的金属全部转换为金属氧化物，并实现绝缘层的填充即可。例如，根据本申请的一些具体示例，参考图5，形成天线凹槽可以是通过以下步骤实现的：
S10：对基体进行第一切割处理，并在第一表面上形成凹槽
根据本申请的实施例，在该步骤中首先在基体的第一表面上形凹槽。形成凹槽的具体工艺不受特别限制，例如，可通过数控机床切割(CNC)而实现凹槽的制备。例如，在该步骤中可以对基体进行开粗CNC加工，即粗加工，以将基体加工成和最终需要获得的金属板材大致相符的形状。此时可在基体用于形成金属板材的外观面的一侧留有加工余量，即在基体的第二表面上，预留有加工余量，以方便后续处理。
S20：对所述凹槽处进行硬质阳极氧化处理
根据本申请的实施例，在该步骤中，对凹槽处的基体先进行一次阳极氧化处理，以将凹槽底部处的部分金属转换为金属氧化物。具体地，可对凹槽朝向第一表面的一侧进行硬质阳极氧化处理，以在凹槽底部的内表面处形成硬质阳极氧化膜。如前所述，由于硬质阳极氧化膜是在金属板材的内部，后续步骤中会用塑胶填满，因此该步骤中可以将氧化膜的厚度适当做厚。例如可以采用硬质阳极氧化，将膜厚做到150-300微米。由此，可保证该处基体的可靠性，防止最终形成的金属板材由于阳极氧化膜厚度过薄而发生剥离脱落。另一方面，如凹槽的底部厚度过低，则在前一步进行CNC加工凹槽的步骤中，需要对凹槽的厚度进行严格的控制，将大幅提高数控机床加工的成本，且影响生产效率和产品良率。
S30：在所述凹槽中注塑塑料以形成所述绝缘层
根据本申请的实施例，在该步骤中，形成绝缘层，具体可以通过注塑，填满凹槽以形成绝缘层。在该步骤中，注塑的塑料的具体化学组成不受特别限制，本领域技术人员可根据实际需要进行选择，只要能够防止金属基体对通讯信号造成屏蔽即可。此处需要特别说明的是，该步骤中形成的绝缘层并不位于最终获得的金属板材的外观面上，即该绝缘层最终是对于用户不可见的。因此，对绝缘层的选择可以不考虑外观、耐磨等要求，只要该种材料可以构成绝缘的天线缝的一部分即可。
S40：对基体的第二表面上与凹槽相对应的部分进行第一阳极氧化处理
根据本申请的实施例，在该步骤中，对所述基体中所述第二表面上和所述凹槽相对应的部分进行第一阳极氧化处理，以将凹槽底部处剩余的金属全部转换为金属氧化物。具体地，在该步骤中可对第一阳极氧化处理进行检测，以保证该处的金属全部转换为金属氧化物。根据本申请的一些实施例，该步骤中形成的第一阳极氧化膜的厚度可以为10-30微米。由此，可实现天线凹槽的制备，进而获得金属板材。获得的金属板材可以具有如图8中的(e)所示出的结构。
如前所述，本申请提出的方法中，形成天线凹槽的具体步骤不受特别限制，只要保持最终形成的天线凹槽的底部全部由非金属材料，即金属氧化物构成即可。参考图6，该方法在形成凹槽之后，还可以直接在凹槽中进行形成绝缘层的步骤(如图6中所示出的S10以及S20)。随后再对基体中第二表面上和凹槽相对应的部分进行阳极氧化处理，直接将凹槽的底部一次性全部转换为金属氧化物。需要特别说明的是，在该实施例中，由于仅进行一次阳极氧化处理，为了保证最终形成的金属基体的外观面可以具有较好的可靠性，可对第二表面的相应部分进行硬质阳极氧化处理，形成一层较厚的硬质阳极氧化膜。
或者，也可进行两次硬质阳极氧化处理，形成两层较厚的硬质阳极氧化膜。具体地，可首先对凹槽朝向第一表面的一侧进行第一次硬质阳极氧化处理，随后在凹槽中形成绝缘层。随后，对基体中第二表面上和凹槽相对应的部分进行第二次硬质阳极氧化处理，将凹槽底部的残余金属转换为金属氧化物。由此，可获得相对较厚的阳极氧化膜，例如，根据本申请的一些具体实施例，最终获得的天线凹槽底部的金属氧化物的总厚度(由两次硬质阳极氧化处理共同形成)可以为200-600微米。
根据本申请的实施例，为了进一步提该方法的产品良率，如前所述，加工形成凹槽时可进行开粗CNC处理，并在基体的外观面一侧留有一定的加工余量，即在基体的第二表面一侧留有一定的加工余量。因此该方法还可以具有第二切割处理的步骤，以对基体进行精雕，获得形状、尺寸符合产品预订尺寸的基体。具体而言，可以在形成绝缘层之后，进行后续步骤之前，进一步包括以下步骤：
对基体的第二表面进行第二切割处理，并控制第二切割处理的切割精度。由此，控制凹槽底部处对应的基体的厚度。如前所述，该方法获得的金属板材可具有与前面提出的金属板材相同的特征，因此可以理解的是，此处第二切割处理控制的凹槽底部的厚度为最终形成的凹槽底部的总厚度，即：该厚度包括形成绝缘层之前的阳极氧化处理的部分金属氧化物，以及基体远离凹槽开口一侧(即基体的第二表面)残留的金属的厚度之和。例如具体地可控制基体的厚度不小于160微米。本领域技术人员能够理解的是，切割之后凹槽的底部将在后续步骤中完全通过阳极氧化处理而转变为金属氧化物，因此第二切割处理控制的厚度，实际为最终获得的金属基体的天线凹槽处金属氧化物的总厚度。而如果该厚度控制的精度不准确，且后续的阳极氧化处理过程中也没有对阳极氧化过程进行严格检测，将可能会导致凹槽底部处有部分残留金属没有被氧化，导致天线凹槽制备失败。
由此，通过第二切割处理可以较为精确的控制凹槽底部处的厚度，第二切割处理可以对该基体的外观面一侧进行的，即：第一切割处理是对基体的第一表面进行的，仅形成凹槽内表面的形状，通过第二切割处理，从第二表面一侧对基体进行再次切割，从而最终获得厚度与预定尺寸相符合的凹槽。具体地，控制第二切割处理的切割精度可以是通过设置 一个或多个探针而实现的，该探针用于监测基体第二表面处的切割位置。
根据本申请一些具体的实施例，上述利用探针控制第二切割处理的精度可以是如以下操作实现的：在进行第一切割处理时，可以在基体的特定位置预留出一处结构与凹槽相同的预留凹槽，而在后续形成绝缘层时该预留凹槽不做注塑处理，也即是说在基体的内表面多加工出一个预留凹槽，该预留凹槽的深度与填充绝缘层的凹槽相同。随后，在进行第二切割处理时，通过探针探头获取此预留凹槽的结构位置作为参考，再相应的确定第二切割处理需要去除的基体的厚度并利用探针控制第二切割处理的精度。
根据本申请的实施例，该方法还可以进一步包括对形成有天线凹槽的基体进行第二阳极氧化的处理。由此，可以在基体的外观面上形成具有一定颜色的外观。例如，在将凹槽的底部处的全部金属转换为金属氧化物，即实现了天线凹槽的制备之后，可以再对该基体，即壳体的外观面做整体的阳极氧化处理，将最外层的金属也氧化为金属氧化物膜。由此，一方面可提升该金属板材的外观效果，另一方面，也可以确保天线性能，防止有残余的金属没有转换为金属氧化物。
在本申请的又一方面，本申请提出了一种壳体。参考图9，该壳体1100的至少一部分可由前面所述的金属板材形成的，或是利用前面所述的方法获得的金属板材形成的。具体地，该壳体上可具有天线凹槽200，例如，可具有多个天线凹槽200。壳体1100可具有底面以及侧壁，底面以及侧壁限定出容纳空间，板材中的天线凹槽内的绝缘层朝向容纳空间一侧设置(图中未示出)。该壳体1100还可以具有注塑部300，注塑部300可位于容纳空间内，用于限定后续需要收纳在该壳体1100中的各个部件。
总的来说，该壳体具有前面描述的金属板材所具有的全部特征以及优点，例如该壳体的天线凹槽处也可具有金属阳极氧化外观，壳体整体外观一致性较好，且天线凹槽宽度可适于5G通讯的要求。
在本申请的又一方面，本申请提出了一种电子设备。参考图10，该电子设备1000可以包括前面所述的壳体1100，以及主板和显示屏(主板和显示屏图中未示出)。主板和显示屏电连接，并收纳于(位于)壳体的容纳空间内部，壳体中位于天线凹槽内的绝缘层，位于朝向容纳空间的一侧。该电子设备还具有天线，天线位于容纳空间内部，可自壳体的天线凹槽处进行信号的收发。
根据本申请的实施例，该壳体1100的天线凹槽200朝向用户的一侧(图10中示出的一侧)，即与前述板材的第二表面相对应的一侧，可以由金属氧化物构成，因此，该电子设备1000可以采用金属材质的壳体，进而获得较好的外观效果以及机械强度，同时能够保证电子设备的散热。同时，由于该壳体采用了前述的金属板材，因此可以在不窄化天线凹槽200的宽度的同时，保持壳体外观的一致性，从而可适于5G通讯。此处需要特别说明的是， 图10中仅示出了根据本申请的一个电子设备的结构示意图，电子设备的具体类型、壳体1100的形状以及天线凹槽200的数量、形状、在壳体1100上的位置均不受特别限制。
根据本申请的实施例，上述电子设备可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种。具体的，电子设备可以为移动电话或智能电话(例如，基于iPhone TM，基于Android TM的电话)，便携式游戏设备(例如Nintendo DS TM，PlayStation Portable TM，Gameboy Advance TM，iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备，其他手持设备以及诸如手表、入耳式耳机、吊坠、头戴式耳机等，电子设备还可以为其他的可穿戴设备(例如，诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身或智能手表的头戴式设备(HMD))。
根据本申请的实施例，电子设备还可以是多个电子设备中的任何一个，多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、照相机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器，便携式医疗设备以及数码相机及其组合。
根据本申请的实施例，在一些情况下，电子设备可以执行多种功能(例如，播放音乐，显示视频，存储图片以及接收和发送电话呼叫)。如果需要，电子设备可以是诸如蜂窝电话、媒体播放器、其他手持设备、腕表设备、吊坠设备、听筒设备或其他紧凑型便携式设备的便携式设备。
在本说明书的描述中，参考术语“一个实施例”、“另一个实施例”等的描述意指结合该实施例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (17)

  1. 一种金属板材，包括：
    基体，所述基体是由金属形成的，所述基体上具有天线凹槽，所述天线凹槽的底部是由金属氧化物形成的，
    并且所述天线凹槽内填充有绝缘层。
  2. 根据权利要求1所述的金属板材，所述天线凹槽的底部是通过对所述基体进行阳极氧化而形成的。
  3. 根据权利要求1或2所述的金属板材，所述天线凹槽的底部的厚度不小于160微米。
  4. 根据权利要求1-3任一项所述的金属板材，所述天线凹槽的底部包括硬质阳极氧化层以及第一阳极氧化层，所述硬质阳极氧化层朝向所述绝缘层一侧设置。
  5. 根据权利要求4所述的金属板材，所述硬质阳极氧化层的厚度为150-300微米，所述第一阳极氧化层的厚度为10-30微米。
  6. 根据权利要求1-5任一项所述的金属板材，所述天线凹槽的侧壁处具有金属氧化物膜。
  7. 根据权利要求1-6任一项所述的金属板材，所述天线凹槽的宽度大于2微米，所述金属板材中具有多个所述天线凹槽。
  8. 根据权利要求1-6任一项所述的金属板材，形成所述基体的材料包括铝、铝合金、镁合金以及不锈钢的至少之一。
  9. 一种制备金属板材的方法，包括：
    提供基体，所述基体是由金属形成的，所述基体具有相对设置的第一表面和第二表面；
    在所述基体的所述第一表面上形成凹槽，将所述凹槽的底部处的金属通过阳极氧化处理转换为金属氧化物，并在所述凹槽中形成绝缘层，以形成天线凹槽，并获得所述金属板材。
  10. 根据权利要求9所述的方法，包括：
    对所述基体进行第一切割处理，并在所述基体的所述第一表面上形成所述凹槽；
    对所述凹槽处进行硬质阳极氧化处理，以至少将所述凹槽的底部朝向所述第一表面一侧的金属转化为金属氧化物；
    在所述凹槽中注塑塑料以形成所述绝缘层；
    对所述基体中所述第二表面上和所述凹槽相对应的部分进行第一阳极氧化处理，以令所述凹槽的底部处残余的金属转化为金属氧化物，从而形成所述天线凹槽。
  11. 根据权利要求9所述的方法，所述方法包括：
    对所述基体进行第一切割处理，并在所述基体的所述第一表面上形成所述凹槽；
    在所述凹槽中注塑塑料以形成所述绝缘层；
    对所述基体的所述第二表面上和所述凹槽相对应的部分进行硬质阳极氧化处理，以令所述凹槽的底部处的金属转化为金属氧化物，从而形成所述天线凹槽。
  12. 根据权利要求9所述的方法，所述方法包括：
    对所述基体进行第一切割处理，并在所述基体的所述第一表面上形成所述凹槽；
    对所述凹槽处的所述基体进行第一硬质阳极氧化处理，以至少将所述凹槽的底部朝向所述第一表面一侧的金属转化为金属氧化物；
    在所述凹槽中注塑塑料以形成所述绝缘层；
    对所述基体的所述第二表面上与所述凹槽相对应的部分进行第二硬质阳极氧化处理，以令所述凹槽的底部处的残余金属转化为金属氧化物，从而形成所述天线凹槽。
  13. 根据权利要求9-12任一项所述的方法，形成所述绝缘层之后，进行后续阳极氧化处理之前，所述方法进一步包括：
    对所述基体的所述第二表面进行第二切割处理，并控制所述第二切割处理的切割精度，以令所述凹槽底部处的厚度不小于160微米。
  14. 根据权利要求13所述的方法，控制所述第二切割处理的切割精度，是通过设置一个或多个探针而实现的，所述探针用于监测所述第二表面处的切割位置。
  15. 根据权利要求9-14任一项所述的方法，所述方法进一步包括：对形成有所述天线凹槽的基体进行第二阳极氧化。
  16. 一种壳体，所述壳体的至少一部分是由权利要求1-8任一项所述的金属板材形成的，或是利用权利要求9-15任一项所述的方法获得的金属板材形成的，
    所述壳体包括底面以及侧壁，所述底面以及所述侧壁限定出容纳空间，所述金属板材中位于天线凹槽内的绝缘层朝向所述容纳空间一侧设置。
  17. 一种电子设备，包括：
    权利要求16所述的壳体，所述壳体中位于天线凹槽内的绝缘层位于朝向所述壳体的容纳空间的一侧，
    主板和显示屏，所述主板和所述显示屏电连接，并位于所述容纳空间内部，以及
    天线，所述天线位于所述容纳空间内部。
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