WO2019137279A1 - 板材及制备方法、壳体、电子设备 - Google Patents

板材及制备方法、壳体、电子设备 Download PDF

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Publication number
WO2019137279A1
WO2019137279A1 PCT/CN2019/070090 CN2019070090W WO2019137279A1 WO 2019137279 A1 WO2019137279 A1 WO 2019137279A1 CN 2019070090 W CN2019070090 W CN 2019070090W WO 2019137279 A1 WO2019137279 A1 WO 2019137279A1
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WO
WIPO (PCT)
Prior art keywords
substrate
layer
plating layer
film layer
housing
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PCT/CN2019/070090
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English (en)
French (fr)
Inventor
蒋正南
Original Assignee
Oppo广东移动通信有限公司
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Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019137279A1 publication Critical patent/WO2019137279A1/zh

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5806Thermal treatment

Definitions

  • the present application relates to the field of electronic device manufacturing, and in particular to a board and a preparation method, a housing, and an electronic device.
  • the electronic device such as the housing of the electronic device, can be described by providing a logo, such as a specific pattern, text, letters, etc., and communicating the information of the product.
  • a logo such as a specific pattern, text, letters, etc.
  • the user can identify the information of the product through a logo or the like, and clearly distinguish the type of the product. Plates used to prepare other products can also be illustrated by setting some marks.
  • printing or laser engraving can be used to prepare the logo pattern on the electronic device.
  • the marking pattern prepared by the printing method is difficult to achieve a high-brightness effect, and in the course of use, the marking pattern is easy to wear and fall off, causing dissatisfaction of the user.
  • the laser engraving method cannot prepare a logo pattern having a plurality of colors, and the logo pattern prepared by the method has a rough surface and poor fineness, which seriously affects the user experience.
  • the present application proposes a method of making a sheet.
  • the method includes: providing a substrate; providing a masking film layer in a region other than the predetermined region of the substrate; setting a plating layer on the predetermined region of the substrate; removing the masking film layer; and coating the coating layer with The substrate is subjected to a sintering treatment.
  • the predetermined area of the prepared sheet material can be brought to a color highlighting effect, and the abrasion resistance can be improved.
  • the application proposes a sheet of material.
  • the sheet material is prepared by the method described above, whereby the sheet material has all the features and advantages of the sheet material prepared by the method described above, and will not be described herein.
  • the predetermined area of the sheet has a color-brightening effect and good wear resistance.
  • the application proposes a sheet of material.
  • the substrate of the plate material is formed of ceramic, and a predetermined region of the substrate has a plating layer, and the plating layer is melted integrally with the substrate by a sintering process. Thereby, the plating layer is melted integrally with the ceramic substrate, so that a predetermined region of the plate material has a color highlighting effect, and wear resistance is good.
  • the application proposes a housing.
  • at least a portion of the housing is formed from the previously described sheet material, whereby the housing has all of the features and advantages of the panel described above and will not be described again.
  • the predetermined area of the casing has a color-brightening effect and good wear resistance.
  • the application proposes an electronic device.
  • the electronic device includes the housing described above, whereby the electronic device has all of the features and advantages of the housing described above, and details are not described herein.
  • the electronic device has a bright, wear-resistant logo pattern to enhance the user experience.
  • FIG. 1 shows a schematic flow chart of a method of preparing a board according to an embodiment of the present application
  • FIG. 2 shows a schematic structural view of a housing according to an embodiment of the present application
  • FIG. 3 shows a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the present application proposes a method of making a sheet.
  • a plating layer is first formed at a predetermined position on the substrate, and then the plating layer is sintered on the surface of the substrate, so that the plating layer is melted into the substrate by a process such as crystallization, by Thereby, the predetermined area of the substrate can be made to have a color highlighting effect, and the abrasion resistance at the plating layer of the sheet material, particularly the sheet material, can be improved.
  • a plating layer is then disposed in a predetermined region by a vacuum coating method, then the mask film layer is removed, and finally, the plating layer and the substrate are subjected to sintering treatment, thereby The coating layer is melted into the substrate.
  • the predetermined area can be made to have a color highlighting effect, and wear resistance can be improved, thereby improving the user experience.
  • the method includes:
  • a substrate is provided.
  • the substrate may be formed of at least one of ceramic, glass, and stainless steel.
  • the substrate may be formed of a ceramic, glass or stainless steel material, or may be formed of two or three materials of ceramic, glass, and stainless steel. That is, a part of the substrate may be formed of one of ceramic, glass, and stainless steel, and other regions may be formed of the other two of the above three materials.
  • the inventors have found that a substrate formed of the above materials, particularly a substrate formed of a ceramic material, is difficult to form a substrate by laser engraving or printing due to the substrate material when preparing a pattern, a letter or a logo (LOGO). Their own appearance matches.
  • a substrate made of ceramic can be used to form a casing of a tablet computer, a mobile phone, a watch, etc., and a predetermined area formed on the substrate in a subsequent step can form a tablet computer, a mobile phone, a watch, or the like.
  • the trademark pattern, the pattern of the predetermined area prepared by the method can have the effect of color highlighting, the difference in appearance effect from the substrate itself can be made smaller, and the wear resistance is high, thereby improving the user's product The experience of using.
  • the substrate may be cleaned by ultrasonic cleaning, or the substrate may be cleaned by manual wiping to remove contaminants such as oil on the substrate.
  • a masking film layer is provided in a region other than the predetermined region where the substrate is removed.
  • the masking film layer can be a water soluble ink.
  • the method of forming the masking film layer is not particularly limited, and those skilled in the art can design according to specific conditions.
  • the masking film layer may be provided by printing: the water-soluble ink is printed on a region other than the predetermined region, thereby forming a masking film layer.
  • the predetermined region may be a logo area (trademark area or identification area) of the housing.
  • a plating layer is provided in a predetermined region of the substrate by a vacuum plating method.
  • a substrate having a masking film layer is first mounted in a vacuum coating apparatus, followed by vacuuming, placing the substrate in a vacuum environment, and then using the ion beam to face the surface of the substrate (for example, may be a predetermined area) Cleaning is performed, and finally the plating material is sputtered to form a plating layer.
  • the plating layer can be formed by a simple method.
  • the plating layer may include at least one of silicon oxide, Si, Cr, TiO 2 , Nb 2 O 5 , silicon nitride, and silicon carbide.
  • predetermined regions having various colors can be formed.
  • silicon oxide and Si, Cr, TiO 2 , and Nb 2 O 5 may form silver, gold, gray, and blue, respectively.
  • the silicon oxide may also form a plating layer with the high refractive index material, for example, silicon oxide and silicon nitride or silicon carbide to form a plating layer.
  • silicon oxide in sputter coating material, silicon oxide (SiO 2 ) may be first sputter-plated, followed by sputtering of materials such as Si, Cr, TiO 2 , Nb 2 O 5 , or sputtering.
  • a refractive index substance such as silicon nitride or silicon carbide.
  • the specific structure of the coating layer is not particularly limited, and those skilled in the art can select and adjust according to the appearance requirements of the board, the material and the color of the substrate, so as to obtain the appearance and the uniformity of the appearance of the substrate, and the brightness.
  • a better coating layer can include a plurality of sub-layer structures. That is, in this step, a plurality of sub-layers which are sequentially stacked in a predetermined region of the substrate can be formed, whereby a plating layer having a color highlighting effect can be formed.
  • the masking film layer is removed.
  • the removal of the masking film layer may be achieved by a water washing method, and the temperature of the water washing may be 40 to 80 °C.
  • the temperature of the water washing may be 60 °C.
  • a substrate having a masking film layer and a plating layer is placed in water, and the water-soluble ink is dissolved in water to completely dissolve the masking film layer in water, thereby shielding film at a predetermined region boundary.
  • the layer is also completely soluble in the water, so that a predetermined area with a clear boundary can be obtained.
  • the plating layer is subjected to a sintering treatment to melt the plating layer and the substrate.
  • the substrate with the plating layer is subjected to a sintering treatment, and the sintering temperature may be 600 to 700 °C.
  • the sintering temperature may be 650 °C.
  • a protective film layer may also be disposed in a predetermined region.
  • the method of setting the protective film layer is not particularly limited, and those skilled in the art can design according to specific conditions.
  • a protective film material may be vapor-deposited to a predetermined region by a vapor deposition method.
  • the protective film layer may be formed by spin coating, roll coating, or the like.
  • the specific material about the protective film layer may be selected according to the needs of the actual environment.
  • the protective film layer may be a high transparent anti-fingerprint film layer.
  • the predetermined area can be made to have an oil-proof and fingerprint-proof effect.
  • the protective film layer may also cover a region other than the predetermined region, that is, the protective film layer may cover the exposed portion of the substrate, and the previously formed plating layer. Thereby, the substrate can be protected, so that the service life of the plate can be further improved.
  • the present application adopts a printing masking method and a vacuum coating and sintering process to first print a water-soluble ink as a masking layer in a region other than a predetermined area, and then sequentially stack layers to form a coating layer having a desired color.
  • a desired color for example, silver, gold, gray, blue, etc.
  • the water-soluble ink is removed by water washing, and finally the coating layer is sintered on the surface of the substrate, so that the coating layer and the substrate are melted into one body, thereby making the sheet predetermined
  • the area achieves the desired color highlighting effect and has better wear resistance.
  • the application proposes a sheet of material.
  • the sheet material is prepared by the method described above, whereby the sheet material has all of the features and advantages of the sheet material prepared by the method described above, and will not be described herein.
  • the predetermined area of the sheet has a color-brightening effect and good wear resistance.
  • the application proposes a sheet of material.
  • the substrate of the plate material is formed of ceramic, and a predetermined region of the substrate has a plating layer, and the plating layer and the substrate are integrally melted by a sintering process. Thereby, the plating layer and the ceramic substrate are integrally melted, so that a predetermined region of the plate material has a color highlighting effect, and wear resistance is good.
  • the plating layer on the ceramic substrate may include at least one of silicon oxide, Si, Cr, TiO 2 , Nb 2 O 5 , silicon nitride, and silicon carbide.
  • predetermined regions having various colors can be formed.
  • silicon oxide and Si, Cr, TiO 2 , and Nb 2 O 5 may form silver, gold, gray, and blue, respectively.
  • the silicon oxide may also form a plating layer with the high refractive index material, for example, silicon oxide and silicon nitride or silicon carbide to form a plating layer.
  • the plating layer may include a plurality of sub-layer structures including silicon oxide and a high refractive index substance formed over the silicon oxide.
  • silicon oxide SiO 2
  • a high refractive index material such as silicon nitride or silicon carbide.
  • the coating layer on the ceramic substrate and the ceramic substrate are melted by sintering, and the sintering treatment can enhance the bonding force between the coating layer and the ceramic substrate, thereby achieving strong corrosion resistance, and better Wear resistance.
  • the predetermined region may be a logo area (trademark area or identification area) of the housing.
  • the sheet material may have the same features and advantages as the sheet material prepared by the method described above, and will not be described herein.
  • the application proposes a housing.
  • the housing 1000 is formed from the previously described sheet material, whereby the housing has all of the features and advantages of the previously described sheet material and will not be described herein.
  • the predetermined area 100 of the housing has the effect of color highlighting and better wear resistance.
  • the substrate of the housing 1000 may be formed of ceramic, and a predetermined area 100 of the ceramic surface (the area shown by the dashed box in the figure) has a coating layer exhibiting a desired color, the coating The layer and the ceramic are melted by the sintering process, whereby the predetermined area of the casing can achieve a color highlighting effect and the wear resistance is good.
  • the specific position, size, shape, and the like of the predetermined region are not particularly limited, and those skilled in the art can select as needed.
  • the predetermined area may be a logo area (trademark area or identification area) of the housing.
  • the application proposes an electronic device.
  • the electronic device 5000 includes the housing 1000 described above, whereby the electronic device has all of the features and advantages of the housing described above, and details are not described herein.
  • the electronic device has a bright, wear-resistant logo pattern that enhances the user experience.
  • the electronic device may be a tablet computer, a mobile phone, a watch, or the like, whereby the electronic device may have a color highlighting effect and a wear-resistant logo pattern (as may be a predetermined area as shown in FIG. 3). 100 places), easy to convey information of electronic devices, easy for user identification, and can enhance the user experience.
  • the electronic device is a mobile phone, and the electronic device may further include a screen for displaying, a motherboard electrically connected to the screen, and the like.
  • the screen is disposed above the casing, and the motherboard is received by the screen and the electronic device defined by the casing.
  • the housing can be formed of a ceramic material, whereby the housing of this type does not affect the transmission of signals, and thus the electronic device can have better communication performance.
  • the ceramic formed housing does not need to be provided with a complicated antenna groove or the like on the casing, and the appearance of the casing can be better maintained.
  • the electronic device 1000 can be any of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is shown by way of example in FIG. 3).
  • the electronic device 1000 may be a mobile phone or a smart phone (eg, iPhoneTM based, AndroidTM based phone), a portable gaming device (eg, Nintendo DSTM, PlayStation PortableTM, Gameboy AdvanceTM, iPhoneTM), laptop Computers, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, and such as watches, electronic devices 1000 may also be other wearable devices (eg, such as electronic glasses, electronic clothes, electronic bracelets, electronics) Headset device (HMD) for equipment or smart watches.
  • HMD Headset device
  • the electronic device 1000 can also be any one of a plurality of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders , video recorders, cameras, other media recorders, radios, medical equipment, vehicle transport equipment, calculators, programmable remote controls, pagers, laptops, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable Multimedia Player (PMP), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) player, portable medical device and digital camera and combinations thereof.
  • PDAs personal digital assistants
  • PMP portable Multimedia Player
  • MPEG-1 or MPEG-2 Moving Picture Experts Group Audio Layer 3

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  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
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  • Mechanical Engineering (AREA)
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  • Organic Chemistry (AREA)
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  • Other Surface Treatments For Metallic Materials (AREA)
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Abstract

提出了板材及制备方法、壳体(1000)、电子设备(5000)。该方法包括:提供基板;在所述基板中除去预定区域(100)以外的区域,设置遮蔽膜层;在所述基板的所述预定区域设置镀膜层;去除所述遮蔽膜层;以及将形成有所述镀膜层的所述基板进行烧结处理。

Description

板材及制备方法、壳体、电子设备
优先权信息
本申请请求2018年01月11日向中国国家知识产权局提交的、专利申请号为201810026824.4的申请专利的优先权和权益,并且通过参照将其全文并入此处。
技术领域
本申请涉及电子设备制造领域,具体地,涉及板材及制备方法、壳体、电子设备。
背景技术
电子设备,例如电子设备的壳体上,可以通过设置标识,例如特定的图案、文字、字母等等,对电子设备进行说明,并传达该商品的信息。例如,手机、电脑或者手表上的商标图案(LOGO)。用户可以通过商标图案等标识,了解商品的信息,清晰的辨别商品的种类。用于制备其他产品的板材,也可以通过设置一些标识,来起到说明的作用。
然而,目前的板材及制备方法、壳体、电子设备仍有待改进。
申请内容
本申请是基于发明人对以下事实和问题的发现和认识作出的:
目前,可采用印刷或者镭雕的方式来制备电子设备上的标识图案。其中,印刷方法制备的标识图案,难以达到高亮的效果,且在使用过程中,标识图案容易磨损脱落,造成用户的不满。而镭雕方法不能制备具有多种颜色的标识图案,且由该方法制备的标识图案表面粗糙,精细度较差,严重影响用户的使用体验。
在本申请的一个方面,本申请提出了一种制备板材的方法。该方法包括:提供基板;在所述基板除去预定区域以外的区域,设置遮蔽膜层;在所述基板的所述预定区域设置镀膜层;去除所述遮蔽膜层;以及将所述镀膜层与所述基板进行烧结处理。由此,可以使制备的板材的预定区域达到颜色高亮的效果,并且提高耐磨性能。
在本申请的另一方面,本申请提出了一种板材。根据本申请的实施例,该板材是由前面所述的方法制备的,由此,该板材具有前面所述方法制备的板材的全部特征以及优点,在此不再赘述。总的来说,该板材的预定区域具有颜色高亮的效果,并且耐磨性能较好。
在本申请的另一方面,本申请提出了一种板材。根据本申请的实施例,所述板材的基板是由陶瓷形成的,所述基板的预定区域具有镀膜层,所述镀膜层与所述基板通过烧结处理熔为一体。由此,镀膜层与陶瓷基板熔为一体,可以使该板材的预定区域具有颜色高亮的 效果,并且耐磨性能较好。
在本申请的另一方面,本申请提出了一种壳体。根据本申请的实施例,所述壳体的至少一部分是由前面所述的板材形成的,由此,该壳体具有前面所述的板材的全部特征以及优点,在此不再赘述。总的来说,该壳体的预定区域具有颜色高亮的效果,并且耐磨性能较好。
在本申请的另一方面,本申请提出了一种电子设备。根据本申请的实施例,该电子设备包括前面所述的壳体,由此,该电子设备具有前面所述的壳体的全部特征以及优点,在此不再赘述。总的来说,该电子设备具有颜色高亮、耐磨的标识图案,提升用户的使用体验。
附图说明
图1显示了根据本申请一个实施例的制备板材的方法的流程示意图;
图2显示了根据本申请实施例的壳体的结构示意图;以及
图3显示了根据本申请实施例的电子设备的结构示意图。
具体实施方式
下面详细描述本申请的实施例,所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的,旨在用于解释本申请,而不能理解为对本申请的限制。
在本申请的一个方面,本申请提出了一种制备板材的方法。根据本申请的一些示例,通过采用遮蔽与真空镀膜的方式,首先在基板上的预定位置形成镀层,再将镀层烧结在基板表面,使镀膜层通过诸如结晶等过程,与基板熔为一体,由此,可以使基板的预定区域具有颜色高亮的效果,并且提高板材,特别是板材的镀膜层处的耐磨性。
为了便于理解,下面首先对该方法进行简单说明:
根据本申请的示例,通过对具有标识图案的预定区域以外的区域进行遮蔽,随后通过真空镀膜方法在预定区域设置镀膜层,随后将遮蔽膜层去除,最后将镀膜层与基板进行烧结处理,使镀膜层与基板熔为一体。由此,可以使预定区域具有颜色高亮的效果,并且提高耐磨性,进而提升用户的使用体验。
下面根据本申请的具体示例,对该方法的各个步骤进行详细说明。参考图1,该方法包括:
S100:提供基板
根据本申请的示例,在该步骤中,提供基板。该基板可以是由陶瓷、玻璃以及不锈钢的至少之一形成的。例如,基板可由陶瓷、玻璃或者不锈钢材料形成,也可以由陶瓷、玻璃以及不锈钢中的两种或三种材料形成。即:基板的一部分区域可以由陶瓷、玻璃以及不锈钢中的一种材料形成,其他区域可以由上述三种材料中的另外两种形成。发明人发现,上 述材料形成的基板,特别是陶瓷材料形成的基板,在制备图案、文字或商标(LOGO)时,由于基板材料的原因,导致通过镭雕或是印刷形成的图案,难以和基板自身的外观效果相匹配。例如,根据本申请的实施例,由陶瓷构成的基板可以用于形成平板电脑、手机、手表等的壳体,后续步骤在该基板上形成的预定区域,可以形成平板电脑、手机、手表等的商标图案,利用该方法制备的预定区域的图案,可以具有颜色高亮的效果,与基板自身的外观效果差距可做到较小,且耐磨性较高,由此,可以提升用户对上述商品的使用体验。
根据本申请的示例,在进行后续步骤(在基板上设置遮蔽膜层)之前,需要对基板进行清洗处理。关于清洗的具体方式不受特别限制,本领域技术人员可以根据具体情况进行选择。例如,可以采用超声波清洗的方式对基板进行清洗,或者还可以采用人工擦拭的方式对基板进行清洗,以便去除基板上的油污等污染物。
S200:在基板除去预定区域以外的区域,设置遮蔽膜层
根据本申请的实施例,在该步骤中,在基板除去预定区域以外的区域,设置遮蔽膜层。由此,在后续步骤中制备预定区域的标识图案时,可以不对预定区域以外的区域造成影响。根据本申请的一些示例,该遮蔽膜层可以为水溶性油墨。由此,可以方便在后续步骤中去除该遮蔽膜层。关于遮蔽膜层的形成方法不受特别限制,本领域技术人员可以根据具体情况进行设计。例如,可以通过印刷的方式设置遮蔽膜层:将水溶性油墨印刷在预定区域以外的区域,从而形成遮蔽膜层。
需要特别说明的是,上述预定区域的具体位置、尺寸、形状等均不受特别限制,本领域技术人员可以根据需要进行选择。例如,根据本申请一个具体实施例,上述预定区域可以为该壳体的logo区(商标区或标识区)。
S300:利用真空镀膜方法,在基板的预定区域设置镀膜层
根据本申请的实施例,在该步骤中,利用真空镀膜方法,在基板的预定区域设置镀膜层。根据本申请的实施例,首先将具有遮蔽膜层的基板装挂在真空镀膜设备中,随后进行抽真空,使基板处于真空环境中,随后利用离子束对基板的表面(例如,可为预定区域)进行清洁,最后溅射镀膜材料以便形成镀膜层。由此,可以利用简单的方法形成镀膜层。
根据本申请的实施例,镀膜层可以包括氧化硅、Si、Cr、TiO 2、Nb 2O 5、氮化硅以及碳化硅的至少之一。由此,可以形成具有各种颜色的预定区域。例如,氧化硅与Si、Cr、TiO 2、Nb 2O 5可以分别形成银色、金色、灰色、蓝色。由此,可以提升由该板材构成的商品的效果。根据本申请的实施例,氧化硅还可以与高折射率物质形成镀膜层,例如,氧化硅与氮化硅或者碳化硅形成镀膜层。
根据本申请的实施例,在溅射镀膜材料时,还可以首先溅射镀氧化硅(SiO 2),随后溅射镀Si、Cr、TiO 2、Nb 2O 5等材料,或者溅射镀高折射率物质,例如氮化硅、碳化硅。由此,可以令预定区域具有高亮度的外观效果。
根据本申请的实施例,镀膜层的具体结构不受特别限制,本领域技术人员可以根据该板材的外观需求,基板的材料以及颜色进行选择调节,以获得外观能够与基板的外观统一,且亮度较好的镀膜层。例如,根据本申请的具体实施例,该镀膜层可以包括多个亚层结构。即:在该步骤中,可以在基板的预定区域形成多个依次层叠设置的亚层,由此,可以形成具有颜色高亮效果的镀膜层。
S400:去除遮蔽膜层
根据本申请的实施例,在该步骤中,去除遮蔽膜层。根据本申请的实施例,去除遮蔽膜层可以是通过水洗方式实现的,水洗的温度可以为40-80℃。由此,可以利用简单的方法将遮蔽膜层去掉。例如,根据本申请的具体实施例,水洗的温度可以为60℃。
根据本申请的实施例,将带有遮蔽膜层以及镀膜层的基板,放入水中,利用水溶性油墨溶于水的特性,使遮蔽膜层完全溶于水中,从而预定区域边界处的遮蔽膜层也能够完全溶于水中,进而可以获得边界清晰的预定区域。
S500:对镀膜层进行烧结处理,以便使镀膜层与基板熔为一体
根据本申请的实施例,在该步骤中,对镀膜层进行烧结处理,以便使镀膜层与基板熔为一体。根据本申请的实施例,对带有镀膜层的基板进行烧结处理,烧结的温度可以为600-700℃。由此,可以使镀膜层与基板熔为一体,使预定区域具有较好的耐磨性能。例如,根据本申请的具体实施例,烧结的温度可以为650℃。由此,可以防止镀膜层在使用过程中发生剥离掉落,进而可以提升板材的寿命以及板材的用户体验。
根据本申请的实施例,在烧结处理完成之后,还可以在预定区域设置保护膜层。关于保护膜层的设置方法不受特别限制,本领域技术人员可以根据具体情况进行设计。例如,根据本申请的实施例,可以采用蒸镀的方法,将保护膜材料蒸镀到预定区域。或者,也可以通过旋涂、滚涂等方式,形成保护膜层。关于保护膜层的具体材料可以根据实际环境的需要进行选择,例如,根据本申请的实施例,保护膜层可以为高透防指纹膜层。由此,可以使预定区域具有防油、防指纹的效果。在本申请的另一些示例中,保护膜层也可以覆盖除预定区域以外的区域,即保护膜层可覆盖基板暴露在外的部分,以及前面形成的镀膜层。由此可以对基板进行防护,从而可以进一步提高该板材的使用寿命。
综上,本申请通过采用印刷遮蔽与真空镀膜加烧结的工艺方式,先将预定区域以外的区域印刷水溶性油墨做遮蔽膜层,再利用多层亚层依次叠加形成具有需要的颜色的镀膜层,(例如,银色、金色、灰色、蓝色等),再将水溶性油墨通过水洗去除,最后将镀膜层烧结在基板表面,使镀膜层与基板熔为一体,由此,可以使板材的预定区域达到所需的颜色高亮效果,又具有较好的耐磨性。
在本申请的另一方面,本申请提出了一种板材。根据本申请的实施例,该板材是由前面 描述的方法制备的,由此,该板材具有前面描述方法制备的板材的全部特征以及优点,在此不再赘述。总的来说,该板材的预定区域具有颜色高亮的效果,并且耐磨性能较好。
在本申请的另一方面,本申请提出了一种板材。根据本申请的实施例,该板材的基板是由陶瓷形成的,基板的预定区域具有镀膜层,镀膜层与基板通过烧结处理熔为一体。由此,镀膜层与陶瓷基板熔为一体,可以使该板材的预定区域具有颜色高亮的效果,并且耐磨性能较好。
根据本申请的实施例,陶瓷基板上的镀膜层可以包括氧化硅、Si、Cr、TiO 2、Nb 2O 5、氮化硅以及碳化硅的至少之一。由此,可以形成具有各种颜色的预定区域。例如,氧化硅与Si、Cr、TiO 2、Nb 2O 5可以分别形成银色、金色、灰色、蓝色。由此,可以提升由该板材构成的商品的效果。根据本申请的实施例,氧化硅还可以与高折射率物质形成镀膜层,例如,氧化硅与氮化硅或者碳化硅形成镀膜层。即:镀膜层可包括多个亚层结构,多个亚层结构包括氧化硅以及形成在氧化硅上方的高折射率物质。具体的,可以首先溅射镀氧化硅(SiO 2),随后溅射镀高折射率物质,例如氮化硅、碳化硅。由此,可以令预定区域具有高亮度的外观效果。
根据本申请的实施例,陶瓷基板上的镀膜层与陶瓷基板通过烧结处理熔为一体,烧结处理可以增强镀膜层与陶瓷基板之间的结合力,达到较强的抗腐蚀性,及较好的耐磨性。
需要特别说明的是,上述预定区域的具体位置、尺寸、形状等均不受特别限制,本领域技术人员可以根据需要进行选择。例如,根据本申请一个具体实施例,上述预定区域可以为该壳体的logo区(商标区或标识区)。
根据本申请的实施例,该板材可以具有和前面描述的方法制备的板材相同的特征以及优点,在此不再赘述。
在本申请的另一方面,本申请提出了一种壳体。根据本申请的实施例,参考图2,该壳体1000的至少一部分是由前面描述的板材形成的,由此,该壳体具有前面描述的板材的全部特征以及优点,在此不再赘述。总的来说,该壳体的预定区域100具有颜色高亮的效果,并且耐磨性能较好。
根据本申请的实施例,该壳体1000的基板可以是由陶瓷形成的,在陶瓷表面的预定区域100(如图中虚线框所示出的区域)具有呈现所需颜色的镀膜层,该镀膜层与陶瓷通过烧结处理熔为一体,由此,该壳体的预定区域可以达到颜色高亮的效果,并且耐磨性能较好。需要特别说明的是,上述预定区域的具体位置、尺寸、形状等均不受特别限制,本领域技术人员可以根据需要进行选择。例如,根据本申请一个具体实施例,上述预定区域可以为该壳体的logo区(商标区或标识区)。
在本申请的另一方面,本申请提出了一种电子设备。参考图3,根据本申请的实施例,该电子设备5000包括前面描述的壳体1000,由此,该电子设备具有前面描述的壳体的全部 特征以及优点,在此不再赘述。总的来说,该电子设备具有颜色高亮、耐磨的标识图案,可提升用户的使用体验。
根据本申请的实施例,该电子设备可以为平板电脑、手机、手表等,由此,上述电子设备可以具有颜色高亮效果以及耐磨的标识图案(如可以图3中所示出的预定区域100处),便于传达电子设备的信息,便于用户识别,以及可以提升用户的使用体验。
以电子设备为手机为例,该电子设备还可包括用于显示的屏幕、与屏幕电连接的主板等结构,屏幕设置于壳体上方,主板收容于屏幕以及壳体所限定出的电子设备的内部空间中。如前所述,壳体可以为陶瓷材料形成的,由此,该类型的壳体不影响信号的传输,进而该电子设备可以具有较好的通信性能。并且,陶瓷形成的壳体,无需在壳体上设置复杂的天线槽等结构,进而可以较好的保持壳体外观的一致性。
示例性的,电子设备1000可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图3中只示例性的示出了一种形态)。具体的,电子设备1000可以为移动电话或智能电话(例如,基于iPhone TM,基于Android TM的电话),便携式游戏设备(例如Nintendo DS TM,PlayStation Portable TM,Gameboy Advance TM,iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备,其他手持设备以及诸如手表等,电子设备1000还可以为其他的可穿戴设备(例如,诸如电子眼镜、电子衣服、电子手镯、电子设备或智能手表的头戴式设备(HMD))。
电子设备1000还可以是多个电子设备中的任何一个,多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、照相机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器,便携式医疗设备以及数码相机及其组合。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。

Claims (16)

  1. 一种制备板材的方法,包括:
    提供基板;
    在所述基板中除去预定区域以外的区域,设置遮蔽膜层;
    在所述基板的所述预定区域设置镀膜层;
    去除所述遮蔽膜层;以及
    将形成有所述镀膜层的所述基板进行烧结处理。
  2. 根据权利要求1所述的方法,所述基板是由陶瓷、玻璃以及不锈钢的至少之一形成的。
  3. 根据权利要求1或2所述的方法,所述镀膜层包括氧化硅、Si、Cr、TiO 2、Nb 2O 5、氮化硅以及碳化硅的至少之一。
  4. 根据权利要求1-3任一项所述的方法,所述镀膜层包括多个依次层叠设置的亚层。
  5. 根据权利要求1-4任一项所述的方法,所述遮蔽膜层为水溶性油墨。
  6. 根据权利要求5所述的方法,去除所述遮蔽膜层是通过对所述遮蔽膜层进行水洗实现的,所述水洗的温度为40-80℃。
  7. 根据权利要求1-6任一项所述的方法,所述烧结的温度为600-700℃。
  8. 根据权利要求1-7任一项所述的方法,所述烧结处理之后,进一步包括:
    采用蒸镀方法,设置保护膜层。
  9. 根据权利要求8所述的方法,所述保护膜层为高透防指纹膜层。
  10. 根据权利要求1-9项中任意一项所述的方法,所述预定区域为logo区域。
  11. 根据权利要求1-10任一项所述的方法,包括:
    提供基板,所述基板是由陶瓷形成的;
    在所述基板中除去预定区域以外的区域,设置遮蔽膜层,所述遮蔽层是通过印刷水性油墨而形成的;
    在所述基板的所述预定区域,通过溅射设置镀膜层,所述镀膜层包括多个亚层,所述多个亚层包括设置在所述基板上的氧化硅亚层,以及形成在所述氧化硅亚层远离所述基板一侧的高折射率物质亚层;
    水洗去除所述遮蔽膜层;
    将形成有所述镀膜层的所述基板进行烧结处理,所述烧结处理的温度为600-700℃。
  12. 一种板材,所述板材的基板是由陶瓷形成的,所述基板的预定区域具有镀膜层,所述镀膜层与所述基板通过烧结处理熔为一体。
  13. 根据权利要求12所述的板材,所述预定区域为logo区域。
  14. 根据权利要求12或13所述的板材,所述镀膜层包括多个亚层,所述多个亚层包括 设置在所述基板上的氧化硅亚层,以及形成在所述氧化硅亚层远离所述基板一侧的高折射率物质亚层。
  15. 一种壳体,其特征在于,所述壳体的至少一部分是由权利要求12-14任一项所述的板材而形成的。
  16. 一种电子设备,其特征在于,包括权利要求15所述的壳体,以及用于显示的屏幕、与屏幕电连接的主板,所述屏幕设置于所述壳体上方,所述主板收容于所述屏幕以及所述壳体所限定出的内部空间中。
PCT/CN2019/070090 2018-01-11 2019-01-02 板材及制备方法、壳体、电子设备 WO2019137279A1 (zh)

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