WO2021056195A1 - 电子烟雾化组件及其制备方法 - Google Patents

电子烟雾化组件及其制备方法 Download PDF

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Publication number
WO2021056195A1
WO2021056195A1 PCT/CN2019/107562 CN2019107562W WO2021056195A1 WO 2021056195 A1 WO2021056195 A1 WO 2021056195A1 CN 2019107562 W CN2019107562 W CN 2019107562W WO 2021056195 A1 WO2021056195 A1 WO 2021056195A1
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WIPO (PCT)
Prior art keywords
substrate
electronic cigarette
plated
positions
heating layer
Prior art date
Application number
PCT/CN2019/107562
Other languages
English (en)
French (fr)
Inventor
黄惠华
郭美玲
周波
Original Assignee
昂纳自动化技术（深圳）有限公司
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Publication date
Application filed by 昂纳自动化技术（深圳）有限公司 filed Critical 昂纳自动化技术（深圳）有限公司
Priority to PCT/CN2019/107562 priority Critical patent/WO2021056195A1/zh
Priority to US17/636,025 priority patent/US20220279853A1/en
Priority to EP19946474.4A priority patent/EP4000434A4/en
Publication of WO2021056195A1 publication Critical patent/WO2021056195A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/70—Manufacture
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/20—Devices using solid inhalable precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/021—Heaters specially adapted for heating liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/022—Heaters specially adapted for heating gaseous material

Definitions

  • the invention relates to the technical field of electronic cigarettes, in particular to an electronic cigaretteification component and a preparation method thereof.
  • the wire winding process of the automatic wire winding machine is usually used to prepare atomized components such as spring coils, cotton winding, and glass fiber winding. It can be subdivided into three processes: simple winding, butt welding, and riveting. Product resistance and pitch , The uniformity of the diameter of the heating wire coil is relatively poor, and the atomization component is formed individually, and the production efficiency is relatively low.
  • the co-firing process is usually used to prepare low-temperature ceramic atomization components.
  • the specific operation steps of the process are: placing the heating element in the ceramic mold; preparing the ceramic green body; sintering the finished product at a low temperature of 500-800 °C after dewaxing.
  • This method requires the heating element to have a certain supporting force, so it is impossible to prepare high-resistance atomized components.
  • it has the problems of easy ceramic powder drop, heating element peeling, and poor consistency.
  • the atomized components are formed individually, and the production efficiency is relatively low.
  • the thick film printing process is usually used to prepare high-temperature ceramic atomized components. Compared with the co-firing process, the ceramics are not easy to lose powder, the mass production process is simpler and the production efficiency is higher.
  • the specific operation steps of the printing process preparing high-temperature porous ceramics; grinding to the required size and cleaning and drying; printing and drying; sintering; cutting into the required atomized components. Because the ceramic surface is uneven, the paste adhesion is poor, and the heating element is easy to fall off after sintering; the ceramic absorbs the paste, and the thickness of the resistive film obtained by the printing process is uneven, resulting in poor product resistance uniformity and easy local burnout.
  • the sintered slurry contains certain metal oxides, glass powders, etc., so during the production and use of the product, resistance drift will occur when heated.
  • the technical problem to be solved by the present invention is to provide a method for preparing an electronic cigarette atomization component with high production efficiency, excellent product consistency and stability, and an electronic cigarette atomization component prepared in response to the above-mentioned defects in the prior art.
  • the technical solution adopted by the present invention to solve its technical problem is to provide a method for preparing an electronic cigarette atomization component, which includes the following steps:
  • a heating layer is plated on the positions to be plated by a vacuum coating method
  • a plurality of the positions to be plated are arranged at intervals on the surface of the substrate;
  • step S2 The following steps are also included before step S2:
  • step S3 It also includes the following steps before step S3:
  • step S1 the substrate is a liquid-conducting substrate with a pore diameter of 5 ⁇ m-200 ⁇ m and a porosity of 20%-80% .
  • step S2 the following steps are further included before step S2:
  • step S2 the heating layer is plated on the adhesive layer.
  • the material of the adhesion layer includes one or more of Si, TiN, ZrN, TiC, TiO, Cr 2 O 3 , Al 2 O 3 , Fe 3 C, Mn 2 O 4 , TiO 2 and SiO 2
  • the materials of the heating layer include one or more of Ti, Ag, Cr, Ni, Fe, Al metals and their alloy materials, carbon, and graphite.
  • the substrate is a sheet substrate with a smooth and flat surface.
  • the heating layer includes two electrode contacts spaced apart and a heating circuit connected between the two electrode contacts.
  • the substrate is a sheet substrate with a smooth and flat surface
  • Step S1 also includes: processing at least two opposite sides of the base material according to the outer peripheral shape of the base in the atomization assembly;
  • the position to be plated includes two opposite surfaces of the substrate and side surfaces on opposite sides of the substrate.
  • the material of the heating layer includes one or more of Ti, Ag, Cr, Ni, Fe, Al metal and alloy materials thereof, carbon, and graphite.
  • the present invention also provides an electronic cigarette atomizing component, which is prepared by using any of the above-mentioned preparation methods.
  • the method for preparing the electronic cigarette vaporization component of the present invention attaches the heating layer to the base material by vacuum coating.
  • the coating layer is uniform and dense, has high dimensional accuracy, strong adhesion, and is not easy to fall off. Then, the heating layer will be heated by cutting.
  • the base material of the layer is cut into multiple independent atomization components, which has higher production efficiency, better product consistency and more stability.
  • FIG. 1 is a schematic diagram of the process structure of the method for preparing the electronic cigarette vaporization assembly according to the first embodiment of the present invention
  • FIG. 2 is a schematic diagram of the process structure of the manufacturing method of the electronic cigarette vaporization assembly according to the second embodiment of the present invention
  • FIG. 3 is a schematic diagram of the process structure of the method for preparing the electronic cigarette vaporization assembly according to the third embodiment of the present invention.
  • the method for preparing the electronic cigarette vaporization assembly according to the first embodiment of the present invention includes the following steps:
  • the substrate 1 is a liquid-conducting substrate, which has micropores for liquid-conduction.
  • the pore size of the liquid-conducting substrate is 5 ⁇ m-200 ⁇ m, and the porosity is 20%-80%.
  • the liquid-conducting substrate may be porous ceramic or foamed metal.
  • a corresponding number of positions 110 to be coated are selected on the surface of the substrate 1.
  • a plurality of positions 110 to be coated are selected on a surface of the substrate 1.
  • a plurality of positions 110 to be plated are arranged at intervals, and may be arranged in a matrix (multiple rows and multiple columns).
  • tooling or film 11 can be used for shielding, and the tooling or film 11 has multiple hollow parts; the tooling or film 11 is covered on the surface of the substrate 1, and the substrate where the multiple positions 110 to be coated are located The other parts of the surface of the material 1 are shielded, and the hollow part exposes the position 110 to be plated.
  • the tooling or film 11 can be made by laser cutting, chemical etching, and photolithography after coating.
  • the adhesion layer 130 is plated on the position 110 to be coated by vacuum coating, as shown in (2) of Figure 1.
  • the substrate 1 is a porous material
  • the surface morphology of the porous material fluctuates greatly. If the heating layer is directly plated on it, the heating layer formed by vacuum coating will fluctuate (discontinuous) with the morphology of the porous material.
  • the thin area is easy to burn and cause an open circuit, which will be damaged and unable to work. Therefore, before plating the heating layer, the adhesion layer 130 is plated on the position 110 to be coated to modify the surface of the substrate 1.
  • the adhesive layer 130 is made of hard film material with good hardness, strength, thermal stability, stable physical and chemical properties, and insulation. Its function is to strengthen the substrate of the position 110 to be plated, and improve the surface hardness and smoothness of the substrate of the position 110 to be plated. It enhances the adhesion between the substrate 1 and the subsequent heating layer 120.
  • the material of the adhesion layer 130 may include one of Si, TiN, ZrN, TiC, TiO, Cr 2 O 3 , Al 2 O 3 , Fe 3 C, Mn 2 O 4 , TiO 2 and SiO 2, etc. Or multiple.
  • a heating layer 120 is plated on the positions 110 to be coated by a vacuum coating method.
  • the heating layer 120 is plated on the adhesive layer 130, as shown in (3) in FIG. 1.
  • the function of the heating layer 120 is to energize to dissipate heat and atomize the smoke liquid.
  • the material of the heating layer 120 includes Ti, Ag, Cr, Ni, Fe, Al metal, alloy materials of the aforementioned metals (Ti, Ag, Cr, Ni, Fe, Al) (such as stainless steel, nickel chromium, iron chromium aluminum, etc.), One or more of the resistive materials with relatively high thermal efficiency such as carbon and graphite.
  • the heating layer 120 may include two electrode contacts 121 spaced apart and a heating circuit 122 connected between the two electrode contacts 121.
  • the heating circuit 122 may have a shape such as a linear shape, a curved shape, a wave shape, and the like.
  • the two electrode contacts 121 may be located on one side or both sides of the heating circuit 122.
  • the tooling or film 11 is used according to the shading, and the tooling is removed correspondingly, or the film is uncovered or removed by solvent dissolution and high temperature decomposition.
  • Cutting can be achieved by using a dicing machine or a laser cutting machine.
  • a cutting alignment mark 12 can be provided around the substrate 1 corresponding to the size of each atomization component, and two opposite cutting alignment marks 12 are connected to form a cutting line during cutting.
  • Each substrate 100 formed after cutting is a polyhedron, such as a rectangular parallelepiped.
  • the atomizing assembly prepared in this embodiment is suitable for e-cigarettes of the e-liquid type.
  • the method for preparing the electronic cigarette vaporization component according to the second embodiment of the present invention includes the following steps:
  • the substrate 2 is a thin substrate with a smooth and flat surface. Its function is to support the heating layer with low thermal conductivity, which can prevent non-heating parts from failing due to excessively high temperature, and facilitate the control of product stability.
  • the sheet substrate is made of ceramic materials with low thermal conductivity and high strength, such as zirconia, glass-ceramics, etc., with a thickness of 0.1 mm -0.5mm.
  • a corresponding number of positions 210 to be coated are selected on the surface of the substrate 2.
  • a plurality of positions 210 to be plated are selected on a surface of the substrate 1.
  • a plurality of positions 210 to be plated are arranged at intervals, and may be arranged in a matrix (multiple rows and multiple columns).
  • tooling or film 21 can be used for the shielding.
  • the tooling or film 21 has multiple hollow parts; the tooling or film 21 is covered on the surface of the substrate 2, and the substrate where the positions 210 to be coated are located are The other parts of the surface of the material 2 are shielded, and the hollow part exposes the position 210 to be plated.
  • the tooling or film 21 can be made by laser cutting, chemical etching, and photolithography after coating.
  • a heating layer 220 is plated on the positions 210 to be plated by vacuum coating, as shown in (2) of FIG. 2.
  • the function of the heating layer 220 is to energize to dissipate heat, and to bake and atomize the smoke sheet.
  • the material of the heating layer 220 includes Ti, Ag, Cr, Ni, Fe, Al metal, alloy materials of the aforementioned metals (Ti, Ag, Cr, Ni, Fe, Al) (such as stainless steel, nickel chromium, iron chromium aluminum, etc.), One or more of the resistive materials with relatively high thermal efficiency such as carbon and graphite.
  • the heating layer 220 may include two electrode contacts 221 spaced apart, and a heating circuit 222 connected between the two electrode contacts 221.
  • the heating circuit 222 may have a linear shape, a curved shape, a wave shape, and the like.
  • the two electrode contacts 221 may be located on one side or both sides of the heating circuit 222.
  • the tooling or film 21 is used according to the shielding, and the tooling is removed correspondingly, or the film is uncovered or removed by solvent dissolution and high temperature decomposition.
  • Cutting can be achieved by using a dicing machine or a laser cutting machine.
  • a cutting alignment mark 22 can be provided around the substrate 2 corresponding to the size of each atomization component, and the two opposite cutting alignment marks 22 are connected to form a cutting line during cutting.
  • Each substrate 200 formed after cutting is in the shape of a single sheet or the like.
  • one end of the base 200 is tapered, so that the whole base 200 has a pentagonal shape.
  • the atomizing assembly prepared in this embodiment is suitable for baking-type electronic cigarettes.
  • the method for preparing the electronic cigarette vaporization component of the third embodiment of the present invention includes the following steps:
  • the substrate 3 is a thin substrate with a smooth and flat surface. Its function is to support the heating layer with low thermal conductivity, which can prevent non-heat-generating parts from failing due to excessively high temperature and facilitate the control of product stability.
  • the sheet substrate is made of ceramic materials with low thermal conductivity and high strength, such as zirconia, glass-ceramics, etc., with a thickness of 0.1 mm -0.5mm.
  • a corresponding number of positions 310 to be coated are selected on the surface of the substrate 3.
  • the position 310 to be coated includes two opposite surfaces of the substrate 3 and side surfaces on opposite sides of the substrate 3.
  • step S1 also includes: processing opposite sides of the substrate 3 to form a predetermined shape corresponding to the end of the substrate in the atomization assembly, and the purpose is to expose the position where the heating layer needs to be plated, and the substrate The two opposite surfaces of 3 form a position 310 to be plated.
  • the processing on the opposite sides of the substrate 3 can be achieved by cutting with a dicing machine or a laser cutting machine.
  • the opposite sides of the substrate 3 are respectively in the shape of a broken line, and they may also be connected with multiple inverted V, inverted U, or arc-shaped sides.
  • Each inverted V, inverted U or arc-shaped side corresponds to the end of the base in an atomization assembly. Therefore, after processing, the substrate 3 may include two rows of substrates that are connected, and each row of substrates includes a plurality of substrates that are connected in sequence.
  • a heating layer 320 is plated on the positions to be plated by a vacuum coating method, as shown in (2) of FIG. 3.
  • the function of the heating layer 20 is to energize to dissipate heat, and to bake and atomize the smoke sheet.
  • the material of the heating layer 20 includes Ti, Ag, Cr, Ni, Fe, Al metal, alloy materials of the aforementioned metals (Ti, Ag, Cr, Ni, Fe, Al) (such as stainless steel, nickel-chromium, iron-chromium-aluminum, etc.), One or more of the resistive materials with relatively high thermal efficiency such as carbon and graphite.
  • Cutting can be achieved by using a dicing machine or a laser cutting machine.
  • Each substrate 300 formed after cutting is in the shape of a single sheet or the like.
  • each atomization assembly includes a first heating layer 321 on two opposite surfaces of the base 300 and a second heating layer 322 on the side surface of the tapered end of the base 300.
  • the heating layer 320 also includes two electrode contacts 323.
  • the electrode contacts 323 can be located at any position of the heating layer 320, such as on the ends of the first heating layer 321 on the opposite surfaces of the base 300 (as shown in Figure 3(2)) The position shown in the dashed box).
  • the heating layer 320 has a large distribution area on the base 300, so that the heating area is large, so that the smoke sheet can be heated more uniformly, and the atomization temperature can be controlled more accurately.
  • the side surface of the other end of the base body 300 and the two opposite side surfaces in the length direction are not provided with heat generating layers.
  • a conductor layer (not shown) may be plated on the selected electrode contact 323 position.
  • the specific operation is as follows: the position of the heating layer 320 outside the electrode contact 323 is shielded, at least one conductive layer is plated on the electrode contact 323 by vacuum plating, and the shield is removed after completion.
  • Masking can use tooling or film. When removing the mask, the tooling can be removed correspondingly, or the film can be uncovered or removed by solvent dissolution and high temperature decomposition.
  • the material of the conductor layer can be metal materials such as gold, silver, and copper.
  • a protective layer (not shown) may be plated on the heating layer 320 outside the electrode contact 323.
  • the specific operation is as follows: shield the electrode contacts, coat the protective layer on the unshielded position of the heating layer 320 by vacuum plating, and remove the shield after completion.
  • Masking can use tooling or film. When removing the cover, the tooling can be removed correspondingly, or the film can be uncovered or removed by solvent dissolution and high temperature decomposition.
  • the protective layer can be formed of materials with good thermal conductivity and wear resistance, such as aluminum oxide, silicon carbide, silicon nitride, and mullite.
  • the atomizing assembly prepared in this embodiment is suitable for baking-type electronic cigarettes.

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Abstract

一种电子烟雾化组件及其制备方法，制备方法包括以下步骤：S1、提供基材（1，2，3）；S2、根据基材（1，2，3）表面上选定的多个待镀层位置（110，210，310），通过真空镀膜方式在待镀层位置（110，210，310）上镀发热层（120，220，320）；S3、根据多个发热层（120，220，320）所在位置将基材（1，2，3）切割成多个独立的基体（100，200，300），每一基体（100，200，300）与其上的发热层（120，220，320）形成一个雾化组件。电子烟雾化组件的制备方法，通过真空镀膜的方式将发热层（120，220，320）附着到基材（1，2，3）上，镀层均匀、致密，尺寸精度高，附着力强，不易脱落，再通过切割的方式将带有发热层（120，220，320）的基材（1，2，3）切割为多个独立的雾化组件，生产效率更高，产品一致性更好、更稳定。

Description

电子烟雾化组件及其制备方法 技术领域
本发明涉及电子烟技术领域，尤其涉及一种电子烟雾化组件及其制备方法。
 背景技术
目前，电子烟的雾化组件主要通过以下三种工艺实现：
1、自动绕丝机绕丝工艺，通常用于制备弹簧圈、绕棉、绕玻纤类的雾化组件，可以细分成简易绕线、碰焊、铆接三种工艺，产品阻值、螺距、发热丝圈径一致性都比较差，雾化组件单个成型，生产效率比较低。
2、共烧工艺，通常用于制备低温陶瓷雾化组件，该工艺具体操作步骤是：发热体放到陶瓷模具内；制备陶瓷生坯；排蜡后在500-800℃低温下烧结成成品。此法要求发热体具有一定支撑力，因此不能制备高阻值的雾化组件，同时具有陶瓷易掉粉、发热体剥离，一致性差等问题，雾化组件单个成型，生产效率比较低。
3、厚膜印刷工艺，通常用于制备高温陶瓷雾化组件，相比共烧工艺，陶瓷不容易掉粉，批量生产工艺更简单，生产效率更高。印刷工艺具体操作步骤：制备高温多孔陶瓷；研磨成所需要尺寸后清洗干燥；印刷并干燥；烧结；切割成所需雾化组件。因为陶瓷表面不平，所以浆料附着力差，烧结后发热体容易脱落；陶瓷吸附浆料，印刷工艺得到的电阻膜厚度不均匀，导致产品阻值一致性差，容易局部烧断。此外，因为浆料不是纯金属材料，烧结后的浆料内含有一定的金属氧化物、玻璃粉等，因此产品制作使用过程中，受热时会出现电阻漂移等现象。
 技术问题
本发明要解决的技术问题在于，针对现有技术存在的上述缺陷，提供一种生产效率高、产品一致性及稳定性优的电子烟雾化组件的制备方法以及制得的电子烟雾化组件。
 技术解决方案
本发明解决其技术问题所采用的技术方案是：提供一种电子烟雾化组件的制备方法，包括以下步骤：
S1、提供基材；
S2、根据所述基材表面上选定的多个待镀层位置，通过真空镀膜方式在所述待镀层位置上镀发热层；
S3、根据多个所述发热层所在位置将所述基材切割成多个独立的基体，每一所述基体与其上的发热层形成一个雾化组件。
优选地，多个所述待镀层位置在所述基材表面上间隔排布；
步骤S2之前还包括以下步骤：
S1.1、根据所述基材表面上选定的多个间隔排布的待镀层位置，将所述基材表面进行遮挡，裸露出所述待镀层位置；
步骤S3之前还包括以下步骤：
S2.1、将所述基材表面上用于遮挡的遮挡物移除。
3、根据权利要求2所述的电子烟雾化组件的制备方法，其特征在于，步骤S1中，所述基材为导液基材，其孔径为5μm-200μm，孔隙率为20%-80%。
优选地，步骤S2之前还包括以下步骤：
S1.2、通过真空镀膜方式在所述待镀膜位置上镀粘合层；
步骤S2中，所述发热层镀在所述粘合层上。
优选地，所述粘合层的材料包括Si、TiN、ZrN、TiC、TiO、Cr 2O 3、Al 2O 3、Fe 3C、Mn 2O 4、TiO 2和SiO 2中一种或多种；所述发热层的材料包括Ti、Ag、Cr、Ni、Fe、Al金属及其合金材料、碳、石墨中一种或多种。
优选地，步骤S1中，所述基材为表面光滑平整的薄片基材。
优选地，所述发热层包括相间隔的两个电极触点、连接在两个所述电极触点之间的发热线路。
优选地，步骤S1中，所述基材为表面光滑平整的薄片基材；
步骤S1还包括：根据雾化组件中基体的外周形状对所述基材的至少相对两侧进行加工；
所述待镀层位置包括所述基材的相对两个表面和所述基材相对两侧的侧面。
优选地，所述发热层的材料包括Ti、Ag、Cr、Ni、Fe、Al金属及其合金材料、碳、石墨中一种或多种。
本发明还提供一种电子烟雾化组件，采用以上任一项所述的制备方法制得。
 有益效果
本发明的电子烟雾化组件的制备方法，通过真空镀膜的方式将发热层附着到基材上，镀层均匀、致密，尺寸精度高，附着力强，不易脱落，再通过切割的方式将带有发热层的基材切割为多个独立的雾化组件，生产效率更高，产品一致性更好、更稳定。
 附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明第一实施例的电子烟雾化组件的制备方法的过程结构示意图；
图2是本发明第二实施例的电子烟雾化组件的制备方法的过程结构示意图；
图3是本发明第三实施例的电子烟雾化组件的制备方法的过程结构示意图。
 本发明的实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
如图1所示，本发明第一实施例的电子烟雾化组件的制备方法，包括以下步骤：
S1、提供基材1。
本实施例中，基材1为导液基材，具有微孔可进行导液。优选导液基材的孔径为5μm-200μm，孔隙率为20%-80%。
作为选择，导液基体可以是多孔陶瓷或泡沫金属。
根据基材1以及所要制成的单个雾化组件的大小以及数量，在基材1表面上选定对应数量的待镀层位置110。根据雾化组件中发热层所在基体的一表面，在基材1的一表面选定多个待镀层位置110。本实施例中，多个待镀层位置110间隔排布，可呈矩阵排布（多行多列）。
S1.1、根据基材1表面上选定的多个间隔排布的待镀层位置110，将基材1表面进行遮挡，裸露出待镀层位置110。
如图1中（1）所示，遮挡可选用工装或薄膜11，工装或薄膜11具有多个镂空部；将工装或薄膜11覆盖在基材1表面上，将多个待镀层位置110所在基材1表面的其他部分进行遮挡，镂空部裸露出待镀层位置110。工装或薄膜11可以通过激光切割或化学腐蚀、涂覆后光刻的方式制得。
S1.2、通过真空镀膜方式在待镀膜位置110上镀粘合层130，如图1中（2）所示。
由于基材1是多孔材料，多孔材料表面形貌起伏较大，若直接在其上镀发热层，真空镀膜而成的发热层会随着多孔材料形貌起伏（不连续），在发热层较薄的地方易烧断而造成开路，从而损坏无法工作。因此，镀发热层之前，在待镀膜位置110上镀粘合层130，对基材1的表面进行修饰。
粘合层130选用硬度、强度、热稳定性好、物理化学性质稳定、绝缘的硬质薄膜材料制成，其作用是强化待镀层位置110的基底，提高待镀层位置110的基底表面硬度和平整性，增强基材1和后续的发热层120的粘合力。
作为选择，粘合层130的材料可包括Si、TiN、ZrN、TiC、TiO、Cr 2O 3、Al 2O 3、Fe 3C、Mn 2O 4、TiO 2和SiO 2等中的一种或多种。
S2、根据基材1表面上选定的多个待镀层位置110，通过真空镀膜方式在待镀层位置110上镀发热层120。
本实施例中，发热层120镀在粘合层130上，如图1中（3）所示。
发热层120的作用是通电散发热量，将烟液雾化。发热层120的材料包括Ti、Ag、Cr、Ni、Fe、Al金属、前述金属（Ti、Ag、Cr、Ni、Fe、Al）的合金材料（如不锈钢、镍铬、铁铬铝等）、碳、石墨等热效率比较高的电阻材料中一种或多种。
参考图1中（6），发热层120可包括相间隔的两个电极触点121、连接在两个电极触点121之间的发热线路122。发热线路122可以是直线形、曲线形、波浪形等形状。两个电极触点121可以位于发热线路122的一侧或两侧。
S2.1、将基材1表面上用于遮挡的遮挡物移除，移除后如图1中（4）、（5）所示。
根据遮挡使用工装或薄膜11，对应地将工装移除，或将薄膜揭开或通过溶剂溶解、高温分解剔除。
S3、根据多个发热层120所在位置将基材1切割成多个独立的基体100，从而一次可制得多个雾化组件。每一基体100与其上的发热层120形成一个雾化组件，如图1中（5）至（6）所示。
切割可以采用划片机、激光切割机实现。为准确切割，可在基材1四周对应每一个雾化组件的尺寸设置切割对齐标记12，切割时将正相对的两个切割对齐标记12连成切割线。切割后形成的每一个基体100为多面体，如长方体等。
该实施例的制备方法进一步还可包括以下步骤：
S4、对雾化组件进行清洗、干燥，包装。
本实施例制得的雾化组件适用于烟液型的电子烟。
如图2所示，本发明第二实施例的电子烟雾化组件的制备方法，包括以下步骤：
S1、提供基材2。
本实施例中，基材2为薄片基材，表面光滑平整，其作用是支撑发热层，导热性较低，可以防止非发热部位由于温度过高而失效，便于控制产品使用稳定性。该薄片基材选用导热性较低、强度较高的陶瓷材料如氧化锆、微晶玻璃等制成，厚度为0.1 mm -0.5mm。
根据基材2以及所要制成的单个雾化组件的大小以及数量，在基材2表面上选定对应数量的待镀层位置210。根据雾化组件中发热层所在基体的一表面，在基材1的一表面选定多个待镀层位置210。本实施例中，多个待镀层位置210间隔排布，可呈矩阵排布（多行多列）。
S1.1、根据基材2表面上选定的多个间隔排布的待镀层位置210，将基材2表面进行遮挡，裸露出待镀层位置210。
如图2中（1）所示，遮挡可选用工装或薄膜21，工装或薄膜21具有多个镂空部；将工装或薄膜21覆盖在基材2表面上，将多个待镀层位置210所在基材2表面的其他部分进行遮挡，镂空部裸露出待镀层位置210。工装或薄膜21可以通过激光切割或化学腐蚀、涂覆后光刻的方式制得。
S2、根据基材2表面上选定的多个待镀层位置210，通过真空镀膜方式在待镀层位置210上镀发热层220，如图2中（2）所示。
发热层220的作用是通电散发热量，将烟片烘烤雾化。发热层220的材料包括Ti、Ag、Cr、Ni、Fe、Al金属、前述金属（Ti、Ag、Cr、Ni、Fe、Al）的合金材料（如不锈钢、镍铬、铁铬铝等）、碳、石墨等热效率比较高的电阻材料中一种或多种。
参考图2中（5），发热层220可包括相间隔的两个电极触点221、连接在两个电极触点221之间的发热线路222。发热线路222可以是直线形、曲线形、波浪形等形状。两个电极触点221可以位于发热线路222的一侧或两侧。
S2.1、将基材2表面上用于遮挡的遮挡物移除，移除后如图2中（3）、（4）所示。
根据遮挡使用工装或薄膜21，对应地将工装移除，或将薄膜揭开或通过溶剂溶解、高温分解剔除。
S3、S3、根据多个发热层220所在位置将基材2切割成多个独立的基体200，从而一次可制得多个雾化组件。每一基体200与其上的发热层220形成一个雾化组件，如图2中（3）至（4）所示。
切割可以采用划片机、激光切割机实现。为准确切割，可在基材2四周对应每一个雾化组件的尺寸设置切割对齐标记22，切割时将正相对的两个切割对齐标记22连成切割线。切割后形成的每一个基体200为单个薄片状等。
本实施例制得的雾化组件，基体200的一端呈锥形，使得基体200整体为五边形。
该实施例的制备方法进一步还可包括以下步骤：
S4、对雾化组件进行清洗、干燥，包装。
本实施例制得的雾化组件适用于烘烤型的电子烟。
如图3所示，本发明第三实施例的电子烟雾化组件的制备方法，包括以下步骤：
S1、提供基材3。
本实施例中，基材3为薄片基材，表面光滑平整，其作用是支撑发热层，导热性较低，可以防止非发热部位由于温度过高而失效，便于控制产品使用稳定性。该薄片基材选用导热性较低、强度较高的陶瓷材料如氧化锆、微晶玻璃等制成，厚度为0.1 mm -0.5mm。
根据基材3以及所要制成的单个雾化组件的大小以及数量，在基材3表面上选定对应数量的待镀层位置310。
根据基材3以及所要制成的单个雾化组件的大小以及数量，在基材3表面上选定对应数量的待镀层位置310。本实施例中，待镀层位置310包括基材3的相对两个表面和基材3相对两侧的侧面。
本实施例中，步骤S1还包括：对基材3的相对两侧进行加工，形成与雾化组件中基体的端部对应的预定形状，目的是裸露出需要镀发热层的位置，与基材3的相对两个表面形成待镀层位置310。对基材3的相对两侧进行加工可以采用划片机、激光切割机切割实现。
具体地，如图3中（1）所示，加工后，基材3的相对两侧分别呈折线状，也可以是多倒V、倒U或弧形边相接。每一个倒V、倒U或弧形边对应为一个雾化组件中基体的端部。因此，加工后，基体3可包括相接的两列基体，每一列基体包括多个依次相接的基体。
S2、根据基材1表面上选定的多个待镀层位置310，通过真空镀膜方式在待镀层位置上镀发热层320，如图3中（2）所示。
发热层20的作用是通电散发热量，将烟片烘烤雾化。发热层20的材料包括Ti、Ag、Cr、Ni、Fe、Al金属、前述金属（Ti、Ag、Cr、Ni、Fe、Al）的合金材料（如不锈钢、镍铬、铁铬铝等）、碳、石墨等热效率比较高的电阻材料中一种或多种。
S3、根据多个发热层320所在位置将基材1切割成多个独立的基体300，每一基体300与其上的发热层320形成一个雾化组件。
切割可以采用划片机、激光切割机实现。切割后形成的每一个基体300为单个薄片状等。
本实施例制得的雾化组件，基体300的一端呈锥形，使得基体300整体为五边形。每一雾化组件的发热层320包括位于基体300相对两个表面上的第一发热层321、位于基体300的锥形端部侧面上的第二发热层322。发热层320还包括两个电极触点323，电极触点323可以在发热层320的任意位置上，如基体300相对两个表面上第一发热层321的端部上（如图3（2）中虚线框所示位置）。
发热层320在基体300上分布面积大，从而发热面积大，可以使烟片受热更均匀，雾化温度控制更精确。基体300另一端部的侧面以及在长度方向上的相对两侧面不设发热层。
进一步地，步骤S3之前，还可以在选定的电极触点323位置上再镀覆导体层（未图示）。具体操作如下：将电极触点323外的发热层320位置进行遮挡，通过真空镀的方式在电极触点323上镀覆至少一层导体层，完成后再将遮挡物去除。遮挡可使用工装或薄膜，去除遮挡物时可以对应地将工装移除，或将薄膜揭开或通过溶剂溶解、高温分解剔除。导体层的材料可以是金、银、铜等金属材料。
此外，还可以在电极触点323外的发热层320位置镀覆保护层（未图示）。具体操作如下：将电极触点进行遮挡，通过真空镀的方式将保护层镀覆在发热层320未遮挡的位置上，完成后再将遮挡物去除。遮挡可使用工装或薄膜，去除遮挡物时可以对应地将工装移除，或将薄膜揭开或通过溶剂溶解、高温分解剔除。保护层可以采用氧化铝、碳化硅、氮化硅、莫来石等导热性能比较好又耐磨的材料形成。
该实施例的制备方法进一步还可包括以下步骤：
S4、对雾化组件进行清洗、干燥，包装。
本实施例制得的雾化组件适用于烘烤型的电子烟。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种电子烟雾化组件的制备方法，其特征在于，包括以下步骤：
    S1、提供基材；
    S2、根据所述基材表面上选定的多个待镀层位置，通过真空镀膜方式在所述待镀层位置上镀发热层；
    S3、根据多个所述发热层所在位置将所述基材切割成多个独立的基体，每一所述基体与其上的发热层形成一个雾化组件。
  2. 根据权利要求1所述的电子烟雾化组件的制备方法，其特征在于，多个所述待镀层位置在所述基材表面上间隔排布；
    步骤S2之前还包括以下步骤：
    S1.1、根据所述基材表面上选定的多个间隔排布的待镀层位置，将所述基材表面进行遮挡，裸露出所述待镀层位置；
    步骤S3之前还包括以下步骤：
    S2.1、将所述基材表面上用于遮挡的遮挡物移除。
  3. 根据权利要求2所述的电子烟雾化组件的制备方法，其特征在于，步骤S1中，所述基材为导液基材，其孔径为5μm-200μm，孔隙率为20%-80%。
  4. 根据权利要求3所述的电子烟雾化组件的制备方法，其特征在于，步骤S2之前还包括以下步骤：
    S1.2、通过真空镀膜方式在所述待镀膜位置上镀粘合层；
    步骤S2中，所述发热层镀在所述粘合层上。
  5. 根据权利要求4所述的电子烟雾化组件的制备方法，其特征在于，所述粘合层的材料包括Si、TiN、ZrN、TiC、TiO、Cr 2O 3、Al 2O 3、Fe 3C、Mn 2O 4、TiO 2和SiO 2中一种或多种；所述发热层的材料包括Ti、Ag、Cr、Ni、Fe、Al金属及其合金材料、碳、石墨中一种或多种。
  6. 根据权利要求2所述的电子烟雾化组件的制备方法，其特征在于，步骤S1中，所述基材为表面光滑平整的薄片基材。
  7. 根据权利要求2所述的电子烟雾化组件的制备方法，其特征在于，所述发热层包括相间隔的两个电极触点、连接在两个所述电极触点之间的发热线路。
  8. 根据权利要求1所述的电子烟雾化组件的制备方法，其特征在于，步骤S1中，所述基材为表面光滑平整的薄片基材；
    步骤S1还包括：根据雾化组件中基体的外周形状对所述基材的至少相对两侧进行加工；
    所述待镀层位置包括所述基材的相对两个表面和所述基材相对两侧的侧面。
  9. 根据权利要求1-8任一项所述的电子烟雾化组件的制备方法，其特征在于，所述发热层的材料包括Ti、Ag、Cr、Ni、Fe、Al金属及其合金材料、碳、石墨中一种或多种。
  10. 一种电子烟雾化组件，其特征在于，采用权利要求1-9任一项所述的制备方法制得。
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