WO2021228153A1 - 发热组件及加热雾化装置 - Google Patents

发热组件及加热雾化装置 Download PDF

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Publication number
WO2021228153A1
WO2021228153A1 PCT/CN2021/093390 CN2021093390W WO2021228153A1 WO 2021228153 A1 WO2021228153 A1 WO 2021228153A1 CN 2021093390 W CN2021093390 W CN 2021093390W WO 2021228153 A1 WO2021228153 A1 WO 2021228153A1
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WO
WIPO (PCT)
Prior art keywords
heating
conductive
circuit
area
heat
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PCT/CN2021/093390
Other languages
English (en)
French (fr)
Inventor
张蛟
邓金兴
周宏明
Original Assignee
深圳麦克韦尔科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳麦克韦尔科技有限公司 filed Critical 深圳麦克韦尔科技有限公司
Priority to EP21805220.7A priority Critical patent/EP4151104A4/en
Publication of WO2021228153A1 publication Critical patent/WO2021228153A1/zh
Priority to US17/985,741 priority patent/US20230076581A1/en

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/04—Waterproof or air-tight seals for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/20—Devices using solid inhalable precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/022—Heaters specially adapted for heating gaseous material

Definitions

  • the present invention relates to the field of atomization technology, in particular to a heating component and a heating atomization device.
  • Heat-not-burn atomization means that special plant leaf substances are made and added to plant leaves without being ignited by an open flame and baking at 300°C.
  • the similar aroma components evaporate in the form of aerosol, which can be sucked by people to obtain the corresponding taste.
  • a core component that forms aerosols by heating without burning is the heating element, which heats up the aerosol-forming substrates such as plant leaves and the like to bake.
  • the temperature of the heating element may become very high, which increases the difficulty of fixing the heating element.
  • the invention provides a heating component and a heating atomization device, which fix a fixing seat in an overlapping area and increase the electrical connection stability of the heating circuit and the conductive circuit.
  • the first technical solution provided by the present invention is to provide a heating assembly, including: a heating element, the heating element includes a base and is located on the base and distributed in sequence along the axial direction of the base. Connected heating area, overlapping area and conductive area, wherein the heating area is provided with a heating circuit and extends to the overlapping area, and the conductive area is provided with a conductive circuit and extends to the overlapping area and is overlapped or connected in parallel with the heating circuit; A seat, one end of the fixing seat fixes the heating element, and the fixing seat is at least partially in contact with the overlapping area.
  • the substrate is a sheet-shaped substrate; or the substrate is a columnar substrate.
  • the temperature when the overlapping area generates heat is lower than the temperature when the heat generating area and the conductive area generate heat.
  • the heating circuit in the overlapping area is laminated on the conductive circuit in the overlapping area.
  • the fixing seat further includes: a flange and a base, wherein the middle of the flange has a through groove, and the heating element passes through the through groove to at least partially fix the flange to the base.
  • the flange plate fixes the heating element on the base.
  • the outer side of the columnar base is wrapped with a heating film, and the heating area, the overlapping area and the conductive area are arranged on a surface of the heating film close to the base; and the heating film is far away from the
  • the surface of the substrate is provided with a conductive disk corresponding to the conductive area, the conductive disk corresponding to the conductive area has a through hole penetrating the heating film, and the through hole contains a conductive material to connect the conductive disk with The conductive lines in the conductive area are electrically connected.
  • one surface of the sheet-shaped substrate is provided with the heating area, the overlapping area, the conductive area, and a conductive plate; wherein the conductive plate is located on the side of the conductive area away from the heating area .
  • the heating circuit includes a first heating circuit, the conductive circuit includes a first conductive circuit, and the first heating circuit and the first conductive circuit overlap in the overlapping area; wherein, the first heating circuit Distributed in a U shape, the first conductive circuit is respectively connected to both ends of the U-shaped first heating circuit; the conductive plate includes a first positive conductive plate and a first negative conductive plate, the first positive conductive plate And the first negative conductive plate are respectively connected to one end of the first conductive circuit away from the first heating circuit.
  • the heating circuit further includes a second heating circuit
  • the conductive circuit further includes a second conductive circuit, and the second heating circuit and the second conductive circuit overlap in the overlapping area; wherein, the second The heating circuits are distributed in a U shape, and the second conductive circuits are respectively connected to both ends of the U-shaped second heating circuit;
  • the conductive disk includes a second positive conductive disk and a second negative conductive disk, the second positive The conductive disk and the second negative conductive disk are respectively connected to one end of the second conductive circuit away from the second heating circuit.
  • the first heating circuit is a circuit connected in series with the first conductive circuit, and the second heating circuit and the second conductive circuit are located between the first heating circuit and the first conductive circuit.
  • the first heating circuit is a plurality of circuits connected in parallel with the first conductive circuit, and the second heating circuit and the second conductive circuit are located in the plurality of the first heating circuit and the first Between a conductive line.
  • first heating circuit and the second heating circuit share the first positive conductive disk or the second positive conductive disk; or the first heating circuit and the second heating circuit share the first A negative conductive disk or the second negative conductive disk.
  • the sheet-shaped base and the columnar base both include a base and a pointed portion at one end of the base, and the heating area is close to the pointed portion.
  • the heating area, the overlapping area, and the side of the conductive area away from the base are provided with a covering protection layer, and the protection layer exposes part of the conductive area.
  • the end of the conductive plate away from the heating circuit is further connected with an electrode lead, and the electrode lead is used to connect a power supply device, and further connect the heating element and the power supply device.
  • two surfaces of the sheet-shaped substrate are respectively provided with insulating layers, and the heating region, the overlapping region, the conductive region, and the conductive disk are provided on the insulating layer on one surface of the substrate.
  • the thickness of the heating film is 0.02-0.5 mm; or the thickness of the heating film is 0.05-0.2 mm.
  • the resistance of the first heating circuit is 0.5 ohm to 2 ohms; and/or the resistance of the second heating circuit is 5 ohms to 20 ohms.
  • the second technical solution provided by the present invention is to provide a heating atomization device, including: a heating component and a power supply device; wherein the heating component is the heating component as described in any one of the above
  • the power supply device is connected to the heating component to supply power to the heating component.
  • the heating component proposed by the present invention fixes the fixing seat in the overlapping area of the heating circuit and the conductive circuit to ensure the electrical connection of the heating circuit and the conductive circuit while fixing the heating component stability.
  • Fig. 1 is a schematic structural diagram of a first embodiment of a heat generating component of the present invention
  • Figure 3 is a schematic structural view of a third embodiment of the heating component of the present invention.
  • Figure 4 is a schematic structural view of a fourth embodiment of the heating component of the present invention.
  • 5a and 5b are schematic diagrams of the first embodiment of the two surfaces of the heating film in the columnar substrate
  • Fig. 5c is a schematic view of the structure of at least one surface of the sheet-shaped substrate
  • 6a and 6b are schematic diagrams of the second embodiment of the two surfaces of the heating film in the columnar substrate
  • Fig. 6c is a schematic structural view of a third embodiment of a surface of a heating film in a columnar substrate
  • FIG. 7a and 7b are schematic diagrams of a fourth embodiment of the two surfaces of the heating film in the columnar substrate
  • Fig. 8 is a schematic structural diagram of an embodiment of the heating atomization device of the present invention.
  • FIG. 1 is a schematic structural diagram of a first embodiment of a heat generating component provided by the present invention.
  • the heating component includes a heating element and a fixing seat.
  • the heating element includes a base 11, and the base 11 may be cylindrical or sheet-shaped, which is not specifically limited.
  • the base 11 of the heating element is a columnar base, and the connected heating area 13, the overlapping area 14 and the conductive area 15 are sequentially distributed from top to bottom along the axial direction of the base 11.
  • the base 11 is a columnar base
  • the surface of the base 11 is provided with a heating film 12, the heating film 12 surrounds the outside of the base 11 and covers the base 11, and the heating film 12 is located in the heating area 13, the overlapping area 14, and the conductive area 15.
  • the heating film 12 wraps the cylindrical substrate 11, the heating area 13, the overlapping area 14, and the conductive area 15 on the heating film 12 are in contact with the outer surface of the substrate 11, that is, the heating area 13, the overlapping area 14 and the conductive
  • the area 15 is located on a surface of the heating film 12 close to the base 11.
  • the base 11 may be a ceramic base, and its material is, for example, zirconia, alumina ceramics, and the like.
  • the material of the heating film 12 is different from the material of the substrate 11, and a flexible film can be formed by a casting process.
  • the composition of the heating film 12 can be glass-ceramic, glass-ceramic (such as lime borosilicate glass-oxide Silicon), one or any combination of low-temperature ceramics (barium tin borate ceramics and barium zirconium borate ceramics), which can be sintered below 1000°C.
  • the material of the heating film 12 is preferably glass- Ceramic material.
  • a surface of the heating film 12 away from the base 11 is further provided with a conductive disk 17 connected to the conductive area 15 for connecting with an external power supply device, and further connecting the heating element with the power supply device, so that the power supply device supplies power for the heating element.
  • the base 11 of the heating element is a sheet-like base, wherein the base 11 may be a conductive material or a non-conductive insulating material.
  • the base 11 is a non-conductive insulating material, and its thickness may be 0.2-0.8.
  • the thickness of the base 11 is 0.3-0.6 mm. If the base 11 is made of an insulating material, the heating area 13, the overlapping area 14 and the conductive area 15 can be directly arranged on a surface of the base 11, and the conductive disk 17 can be arranged on the side of the conductive area 15 away from the heating area 13, and is electrically conductive. Area 15 is connected.
  • the base 11 is a sheet-like base
  • the heating area 13, the overlapping area 14 and the conductive area 15 are exposed, so the heating area 13, the overlapping area 14 and the conductive area 15 are also provided with a covering heating area 13 on the side away from the base 11
  • the protective layer 21 exposes part of the conductive area 15.
  • the exposed part of the conductive area 15 is used to connect the electrode lead 19, and then the power supply device is connected through the electrode lead 19, and the The heating element is connected with the power supply device.
  • the protective layer 21 may be a glaze layer, which can isolate the heating area 13, the overlapping area 14, and the conductive area 15 from the outside air, and prevent the heating area 13 from being oxidized when the temperature is high, so that the heating area 13 is long-term Maintain a good heating effect, further improve the service life and stability of the heating element, and reduce the surface roughness of the heating element.
  • the base 11 may be a conductive material, as shown in FIG. 3, which differs from the embodiment shown in FIG. 2 in that the base 11 is a conductive material.
  • the base body 11 can be made of general-purpose metal materials such as stainless steel and titanium alloy. Because the metal material has good toughness, it can withstand long-term high temperature and mechanical shock, and at the same time, it has good heat conduction, which can make the overall temperature of the heating element uniform.
  • the material of the base 11 is preferably stainless steel, such as one of 430 and 304 stainless steel.
  • the base 11 is made of a metal material, which has high mechanical strength, which can effectively prevent the heating element from breaking under long-term high temperature and mechanical impact.
  • the metal material has good thermal conductivity and ensures the surface of the heating element. The uniformity of temperature is conducive to heating the non-burning substrate to obtain a better taste.
  • the base 11 is made of a conductive material
  • the material of the insulating layer 22 is a glass layer with aluminum oxide and calcium oxide as the main components, which can make the substrate 11 non-conductive, and prevent the heating area 13, the overlapping area 14 and the conductive area due to the electrical conductivity of the substrate 11 15 The conductive path is short-circuited.
  • the insulating layer 22 can be formed by coating the insulating layer 22 with slurry on the surface of the substrate 11 by spraying or screen printing, and then firing.
  • the thickness of the insulating layer 22 can be designed according to the withstand voltage requirements between the conductive path and the base 11. In an embodiment, the thickness of the insulating layer 22 may be less than 0.1 mm.
  • the insulating layer 22 may be provided on one surface of the base body 11 where the heating area 13, the overlapping area 14 and the conductive area 15 are provided, and the other surface may not be provided. Specifically, as shown in FIG. 3, in this embodiment, only one surface of the base 11 is provided with a heating area 13, an overlapping area 14 and a conductive area 15. Therefore, the insulating layer 22 can be provided on only one surface of the base 11. In another embodiment, even if only one surface of the base 11 is provided with the heating area 13, the overlapping area 14, and the conductive area 15, the insulating layer 22 can be provided on both surfaces of the base 11 to prevent the base 11 from being exposed to high temperatures. The surface is oxidized, and an insulating layer 22 is provided. The insulating layer 22 protects the substrate 11 and isolates the air.
  • heating areas 13 may also be provided on both surfaces of the base 11. , The overlapping area 14 and the conductive area 15, as shown in FIG. 4 in detail. Both surfaces of the base 11 are provided with a heating area 13, an overlapping area 14 and a conductive area 15.
  • the base 11 may also be a non-conductive and insulating material, and the same as the embodiment shown in FIG.
  • the thickness of the base 11 can be set as the base in the embodiment shown in FIGS. 2 and 3
  • the thickness of 11 is twice or greater than twice, and there is no specific limitation.
  • the substrate 11 is a columnar substrate
  • the surface of the substrate is provided with a heating film 12
  • a surface of the heating film 12 close to the substrate 11 is provided with a heating area 13, an overlapping area 14 and a conductive area 15, and the heating film 12 is away from a surface of the substrate 11.
  • a conductive plate 17 is provided, and an electrode lead 19 connected to the conductive area 15 is provided at one end of the conductive plate 17 away from the heating area 13, the overlapping area 14 and the conductive area 15, and the electrode lead 19 is connected to the power supply device.
  • the substrate 11 is a sheet-like substrate and conductive
  • at least one surface of the substrate 11 is provided with an insulating layer 22, and the heating area 13, the overlapping area 14 and the conductive area 15 are provided on the surface of the insulating layer 22 away from the substrate 11; if the substrate 11 is not When conductive and insulating, the heating area 13, the overlapping area 14 and the conductive area 15 are arranged on the base 11.
  • a conductive disk 17 is provided at the end of the conductive area 15 away from the heating area 13.
  • a protective layer 21 is provided.
  • the protective layer 21 exposes part of the conductive area 15 and an electrode lead 19 is provided at the end of the exposed part away from the heating area 13, and the electrode lead 19 is connected to the power supply device.
  • the base body 11 may be provided with a heating area 13, an overlapping area 14, and a conductive area 15 on one side, and may also be provided with a heating area 13, an overlapping area 14 and a conductive area 15 on both sides, which is not specifically limited.
  • the heating component as shown in Figs. 1 to 4 further includes a fixing seat 16 for fixing the heating element.
  • the temperature of the heating area 13 during heating is higher than the temperature of the overlapping area 14 and the conductive area 15. Further, the temperature of the overlapping area 14 during heating is lower than the temperature of the conductive area 15, that is, When the heating element generates heat, the temperature of the overlapping area 14 is the lowest.
  • the fixing seat 16 is fixed at the position of the overlapping area 14 of the heating element, and further, the fixing seat 16 is at least partially in contact with the overlapping area 14.
  • all the flanges 161 can be arranged in the overlapping area 14, and then all the conductive areas 15 are contained in the base 162, so as to further reduce the heat and energy loss of the conductive area.
  • the overlapping area 14 may be completely in contact with the flange 161, or a part of the overlapping area 14 may be in contact with the flange 161, so that the flange 161 is all located in the overlapping area 14.
  • a heating circuit is correspondingly provided in the heating area 13
  • a conductive circuit is provided in the conductive area 15, and the heating circuit and the conductive circuit are overlapped in the overlapping area 14.
  • the heating circuit can be one or multiple, and it can be connected in parallel or in series; the conductive circuit is set corresponding to the heating circuit, which can be set according to the connection end formed by the heating circuit, for example, a conductive circuit is connected to the heating circuit. One connection end.
  • FIG. 5a, FIG. 5b and FIG. 5c where FIG. 5a and FIG. 5b are schematic diagrams of the two surfaces of the heating film in the columnar substrate shown in FIG. 1.
  • Fig. 5c is a schematic diagram of the structure of at least one surface of the sheet-like substrate shown in Figs. 2 to 4.
  • the heating area 13 is provided with a heating circuit and extends to the overlap area 14.
  • the conductive area 15 is provided with a conductive circuit and extends to the overlap area 14 and overlaps or connects in parallel with the heating circuit. Overlapping connection means that one of them is located above the other, and Parallel connection means that the two are arranged horizontally and connected by edges.
  • the heating circuit can be arranged above the conductive circuit, or the conductive circuit can be arranged above the heating circuit. If the heating circuit and the conductive circuit are connected side by side in the overlap area 14, the heating circuit and the conductive circuit can be separated and the edge of the heating circuit can be connected with the edge of the conductive circuit, or the heating circuit can be crossed with the conductive circuit. , And connect the edge of the heating circuit with the edge of the conductive circuit, which is not specifically limited.
  • the heating area 13 is provided with a heating circuit, that is, the first heating circuit 131.
  • the first heating circuit 131 is distributed in a U-shape in the heating area 13 and the overlapping area 14 of the base 11, so that the first heating circuit 131 has two connecting ends in the overlapping area 14.
  • the conductive circuit includes the first A conductive circuit 151, the first conductive circuit 151 is respectively connected to two ends of the U-shaped distributed first heating circuit 131, and both ends of the U-shaped distributed first heating circuit 131 and the first conductive circuit 151 are not connected to each other.
  • the first conductive line 151 extends from the conductive area 15 to the overlap area 14 and overlaps with the two connection ends of the first heating line 131 in the overlap area 14.
  • the heating area where the overlapping area overlaps is located on the conductive circuit.
  • the first heating circuit 131 is a resistance heating circuit, which generates Joule heat when an electric current passes, which can raise the temperature of the heating element, thereby heating the non-combustible substrate.
  • the first heating circuit 131 may transfer the electronic paste to the heating film 12 by means of screen printing thick film paste, and then sinter the heating film 12 onto the base 11. Specifically, in this embodiment, when the heating film 12 wraps the base 11, only the base 112 of the base 11 is wrapped. Therefore, when the base 11 is a columnar base, the pointed portion 111 is not distributed with the heating area 13.
  • the resistance value of the first heating line 131 may be between 0.5 ohm and 2 ohm.
  • the resistance value of the first heating circuit 131 can be set according to the material of the electronic paste, the length, width, thickness of the heating circuit, and the shape of the pattern, which is not limited here.
  • the lines located in different areas are made of different materials.
  • the resistivity coefficients of the first heating circuit 131 in the heating region 13 and the first conductive circuit 151 in the conductive region 15 are different.
  • the resistivity coefficient of the material of the first heating circuit 131 disposed in the heating area 13 is greater than the resistivity coefficient of the material of the first conductive circuit 151 located in the conductive area 15.
  • the material of the first heating circuit 131 located in the heating area 13 is a high-resistance conductive paste, for example, the dominant electrical component is Ni (nickel), Ag-Pd (silver-palladium), Ag-Pt (silver-platinum).
  • the material of the first conductive circuit 151 located in the conductive region 15 is a conductive paste with low resistivity, for example, a metal or alloy with relatively low resistivity such as the main conductive component Ag (silver) and Au (gold), and a low ratio Inorganic adhesive.
  • the melting point of highly conductive metals such as Ag (silver) and Au (gold) is relatively low (Tc (Ag) is about 960°C, Tc (Au) is about 1064°C)
  • Tc (Ag) is about 960°C
  • Tc (Au) is about 1064°C
  • conventional ceramics alumina, aluminum nitride
  • the material of the first heating circuit 131 with a low resistivity located in the overlapping area 14 can be set according to the heating film 12.
  • the corresponding resistance can be set according to the shape of the heating circuit and the conductive circuit, but regardless of the resistance value of the heating circuit and the conductive circuit, the overlapping area of the heating circuit and the conductive circuit is the smallest.
  • the lengths of the first heating circuit 131 and the first conductive circuit 151 can be flexibly controlled.
  • the distribution of the first heating circuit 131 in the heating area 13 is from bottom to top, and then from top to bottom, as shown in Figure 5a
  • the U-shaped distribution shown can make the heating area 13 of the heating element have better temperature uniformity.
  • the sheet-shaped base and the columnar base include a base 112 and a pointed portion 111 located at one end of the base 112, and the heating area 13 is close to the pointed portion 111.
  • the base body 11 is provided with a pointed portion 111 so that the heating element can be easily inserted into the heating and non-combustible substrate.
  • a surface of the heating film 12 away from the base 11 has a conductive disk 17, as shown in FIG. 5b, the conductive disk 17 is arranged corresponding to the conductive area 15.
  • the conductive disk 17 includes a first positive conductive disk 171 and a first negative conductive disk 172, wherein the first positive conductive disk 171 and the first negative conductive disk 172 are respectively connected to the first conductive circuit 151 away from the first heating circuit 131 One end.
  • the first positive conductive disk 171 and the first negative conductive disk 172 have a through hole 18 penetrating the heating film 12 at a position corresponding to the first conductive circuit 151, and the through hole 18 is filled with a conductive material, and the first positive The conductive disk 171 and the first negative conductive disk 172 are electrically connected to the first conductive circuit 15 respectively.
  • an electrode lead 19 is also provided on the same surface of the heating film 12 as the conductive plate 17, and the electrode lead 19 is connected to the conductive plate 17. Specifically, one end of the electrode lead 19 is respectively connected to the first positive conductive plate 171 and the first positive conductive plate 171 and the first positive conductive plate 171.
  • the negative conductive plate 172 and the electrode lead 19 are used to connect the other end of the power supply device, and then connect the heating element to the power supply device.
  • FIG. 5c is a schematic diagram of the structure of at least one surface of the sheet-like substrate.
  • the sheet-shaped base 11 also includes a base 112 and a pointed portion 111.
  • the pointed portion 111 of the base 11 is distributed with a heating area 13.
  • the pointed portion 111 is provided with a first heating circuit 131.
  • the difference from FIG. 5a is that in this embodiment, the conductive plate 17 and the heating area 13, the overlapping area 14, and the conductive area 15 are arranged on the same surface of the base 11. Specifically, the same as that shown in FIG.
  • the first The heating circuits 131 are distributed in a U-shape, and the first conductive circuit 151 is connected to both ends of the first heating circuit 131 in the U-shape distribution.
  • the conductive disk 17 includes a first positive conductive disk 171 and a first negative conductive disk 172.
  • the first positive conductive disk 171 and the first negative conductive disk 172 are connected to the end of the first conductive circuit 151 away from the first heating circuit 131, and the electrode lead 19 Connect the first positive conductive disk 171 and the first negative conductive disk 172 away from one end of the first conductive circuit 151 to further connect the heating element to the power supply device.
  • the first heating circuit 131 and the first conductive circuit 151 can be deposited on the base 11 or on the insulating layer 22 covering the surface of the base 11 by PVD (Physical Vapor Deposition) or electroplating.
  • the conductive paste can also be printed on the substrate 11 or the insulating layer 22 covered on the surface of the substrate 11 by screen printing, and then fired; preferably by screen printing and sintering, the first heating circuit 131 can be used Commonly used silver-palladium resistor paste, ruthenium-palladium resistor paste, platinum paste and other precious metal pastes, nickel-based and other base metal pastes can also be used, and the first conductive line 151 can be silver-based with relatively low resistivity Slurry.
  • the pattern of the first heating circuit 131 can be flexibly set to match the characteristics of the conductive paste and the thickness of the first heating circuit 131 to obtain a suitable resistance value for the heating element.
  • the resistance value of the heating element is generally 0.3-2.0 ⁇ Between; the thickness of the first heating circuit 131 is generally less than 0.1mm, preferably less than 20um.
  • the first heating circuit 131 includes multiple, and the multiple first heating circuits 131 are arranged in parallel.
  • the plurality of first heating circuits 131 are all distributed in a U shape and distributed in the heating area 13 and the overlapping area 14, and the first conductive circuits 151 are distributed in the conductive area 15 and the overlapping area 14.
  • the first conductive circuit 151 is connected to the first heating circuit 131 in the overlapping area 14, and the two first heating circuits 131 are connected in parallel through the first conductive circuit 151.
  • the second heating circuit 132 and the second conductive circuit 152 are further included.
  • the second heating circuit 132 and the second conductive circuit 152 are located inside the first heating circuit 131 and the first conductive circuit 151, and further, the second heating circuit 132 and the second conductive circuit 152 are located in a parallel connection. Between the first heating circuit 131. As shown in FIG. 6a, in an embodiment, the heating area 13, overlapping area 14, and conductive area 15 at the location of the second heating circuit 132 may be the same as the heating area 13, overlapping area 14 and conductive area at the location of the first heating circuit 131. The position of the area 15 corresponds to the position, and the position can also be staggered. For example, as shown in FIG. The position of the area 14 and the conductive area 15 are staggered.
  • the second heating circuit 132 may be a temperature measurement circuit, which has a resistance TCR characteristic, that is, there is a specific correspondence between temperature and resistance, and a certain power supply device is connected to the second heating circuit 132 through the second conductive circuit 152 When a certain voltage is applied, a specific current value is obtained, so as to obtain the resistance value of the second conductive line 152, and the current temperature of the second conductive line 152 is reversed.
  • the first heating circuit 131 may also have the TCR characteristic.
  • the advantage of providing the second heating circuit 132 is that the second heating circuit 132 has less self-heating, and the current heating introduces less miscellaneous signals, which is beneficial to the precise control of the temperature of the electronic components.
  • its initial resistance is usually larger than that of the first heating circuit 131.
  • the resistance value of the second heating circuit 132 can range from 5 ohms to 20 ohms, and its resistance value is also set according to the material of the electronic paste, the length, width, thickness, and pattern of the heating track, etc.
  • arranging the second heating circuit 132 between the first heating circuit 131 can concentrate the temperature measurement part in the higher temperature range of the heating element, which is more conducive to accurate temperature control.
  • the first heating circuit 131 and the second heating circuit 132 are arranged in the manner shown in FIG. 6a, and four pins are formed at the first conductive circuit 151 and the second conductive circuit 152. Therefore, the conductive disk 17 on the other surface of the heating film 12 includes four conductive disks corresponding to the four pins.
  • the difference from FIG. 5b is that it also includes a second positive conductive disk and a second negative conductive disk. The two positive conductive disks and the second negative conductive disk are respectively connected to an end of the second conductive circuit 152 away from the second heating circuit 132. Similar to the embodiment shown in FIG. 5b, the second positive conductive disk and the second negative conductive disk are also connected to the electrode lead 19.
  • the substrate 11 is a sheet-like substrate
  • the first heating circuit 131 and the second heating circuit 132, the first conductive circuit 151 and the second conductive circuit 152, and the conductive plate 17 are located on the same surface, which are the same as those shown in FIG. 5c.
  • the embodiments are the same, and will not be repeated here.
  • first heating circuit 131 there may be only one first heating circuit 131, and the second heating circuit 132 is located inside the first heating circuit 131, as shown in FIG. 6c.
  • the conductive plate 17 on the other surface of the heating film 12 is as shown in FIG. 6b. I won't repeat them here.
  • first heating circuit 131 and the second heating circuit 132 share the first positive conductive plate 171 or the second positive conductive plate, and the first heating circuit 131 and the second heating circuit 132 share the first negative conductive plate. Disk 172 or the second negative conductive disk.
  • first heating circuit 131 can be connected in parallel with the second heating circuit 132, that is, the first heating circuit 131
  • the positive pole is connected to the positive pole of the second heating line 132, or the negative pole of the first heating line 131 is connected to the negative pole of the second heating line 132.
  • the heating component in the prior art fixes the fixing seat to the conductive circuit or heating circuit of the heating component, which will affect the electrical connection stability of the conductive circuit and the heating circuit.
  • the flange of the fixing seat is installed in the overlapping area of the conductive circuit of the heating component and the heating circuit to prevent the conductive circuit or the heating circuit from breaking when the heating component is fixed, thereby ensuring the conductive circuit And the electrical connection stability of the heating circuit.
  • a heating circuit and a temperature measuring circuit are provided on the heating element, which can realize precise temperature control.
  • FIG. 8 is a schematic structural diagram of an embodiment of the heating atomization device provided by the present invention.
  • the heating and atomizing device includes a power supply device 32 and a heating component 31.
  • the power supply device 32 is used to supply power to the heating component 31.
  • the heating component 31 is the heating component described in FIGS. 1 and 2, 3, and 4 above. Repeat it again.

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Abstract

一种发热组件（31）及加热雾化装置，其中，发热组件（31）包括：发热元件，发热元件包括基体（11）及位于基体（11）上且沿基体（11）轴向依次分布且相连的发热区域（13）、重叠区域（14）及导电区域（15），其中，发热区域（13）设置有发热线路并延伸至重叠区域（14）、导电区域（15）设置有导电线路并延伸至重叠区域（14）且与发热线路重叠或并列连接；固定座（16），固定座（16）的一端固定发热元件，且固定座（16）至少部分与重叠区域（14）接触。通过将固定座（16）设置在发热组件（31）的导电线路和发热线路重叠的重叠区域（14），保证了导电线路及发热线路的电连接稳定性。

Description

发热组件及加热雾化装置 技术领域
本发明涉及雾化技术领域，特别是涉及一种发热组件及加热雾化装置。
背景技术
随着健康理念普及，加热不燃烧雾化装置趋于流行，加热不燃烧雾化就是指不需通过明火点燃，在300℃的发热烘烤下，使得特制的植物叶类物质及添加至植物叶类的香味成分以气溶胶形式蒸发出来，可供人抽吸，获取相应的口感。
而通过加热不燃烧形成气溶胶的一个核心部件为发热元件，其升温后对植物叶类等气溶胶形成基材进行烘烤。但是由于其在进行发热时为了满足需求，发热元件的温度或变得很高，这就为发热元件的固定增加了难度。
发明内容
本发明提供一种发热组件及加热雾化装置，其将固定座固定在重叠区域，增加了发热线路及导电线路的电连接稳定性。
为解决上述技术问题，本发明提供的第一个技术方案为：提供一种发热组件，包括：发热元件，所述发热元件包括基体及位于所述基体上且沿所述基体轴向依次分布且相连的发热区域、重叠区域及导电区域，其中，所述发热区域设置有发热线路并延伸至重叠区域、所述导电区域设置有导电线路并延伸至重叠区域且与发热线路重叠或并列连接；固定座，所述固定座的一端固定所述发热元件，且所述固定座至少部分与所述重叠区域接触。
其中，所述基体为片状基体；或所述基体为柱状基体。
其中，所述重叠区域发热时的温度小于所述发热区域及所述导电区域发热时的温度。
其中，所述重叠区域的发热线路层叠于重叠区域的导电线路上。
其中，所述固定座进一步包括：法兰盘及底座，其中，所述法兰盘中间位置具有通槽，所述发热元件穿过所述通槽以将所述法兰盘至少部分固定于所述发热元件的重叠区域，所述法兰盘将所述发热元件固定于所述底座上。
其中，所述法兰盘全部与所述重叠区域接触。
其中，柱状的所述基体的外侧包裹有发热膜，所述发热区域、所述重叠区域及所述导电区域设置于所述发热膜靠近所述基体的一表面；且所述发热膜远离所述基体的表面设置有与所述导电区域对应的导电盘，所述导电盘对应所述导电区域具有贯穿所述发热膜的通孔，所述通孔中具有导电物质，以将所述导电盘与所述导电区域中的导电线路电连接。
其中，片状的所述基体的一表面设置有所述发热区域、所述重叠区域及所述导电区域、导电盘；其中，所述导电盘位于所述导电区域远离所述发热区域的一侧。
其中，所述发热线路包括第一发热线路，所述导电线路包括第一导电线路，所述第一发热线路与所述第一导电线路在所述重叠区域重合；其中，所述第一发热线路呈U型分布，所述第一导电线路分别连接U型的所述第一发热线路的两端；所述导电盘包括第一正导电盘及第一负导电盘，所述第一正导电盘及所述第一负导电盘分别连接所述第一导电线路远离所述第一发热线路的一端。
其中，所述发热线路还包括第二发热线路，所述导电线路还包括第二导电线路，所述第二发热线路与所述第二导电线路在所述重叠区域重合；其中，所述第二发热线路呈U型分布，所述第二导电线路分别连接U型的所述第二发热线路的两端；所述导电盘包括第二正导电盘及第二负导电盘，所述第二正导电盘及所述第二负导电盘分别连接所述第二导电线路远离所述第二发热线路的一端。
其中，所述第一发热线路为与所述第一导电线路串联的一条线路， 且所述第二发热线路与所述第二导电线路位于所述第一发热线路及所述第一导电线路的内侧；或者所述第一发热线路为与所述第一导电线路并联的多条线路，且所述第二发热线路与所述第二导电线路位于多条所述第一发热线路及所述第一导电线路之间。
其中，所述第一发热线路及所述第二发热线路共用所述第一正导电盘或所述第二正导电盘；或所述第一发热线路及所述第二发热线路共用所述第一负导电盘或所述第二负导电盘。
其中，所述片状基体及所述柱状基体均包括基部及位于所述基部一端的尖型部，所述发热区域靠近所述尖型部。
其中，所述柱状基体的所述基部远离所述尖型部的一端具有内凹的槽体。
其中，所述发热区域、所述重叠区域及所述导电区域远离所述基体的一侧设置有覆盖保护层，所述保护层将部分所述导电区域裸露出来。
其中，所述导电盘远离所述发热线路的一端进一步连接有电极引线，所述电极引线用于连接供电装置，进而将所述发热元件与所述供电装置连接。
其中，所述片状基体的两表面分别设置有绝缘层，所述发热区域、所述重叠区域及所述导电区域、导电盘设置于所述基体的一表面的绝缘层上。
其中，所述发热膜的厚度为0.02～0.5mm；或所述发热膜的厚度为0.05～0.2mm。
其中，所述第一发热线路的电阻为0.5欧姆～2欧姆；和/或所述第二发热线路的电阻为5欧姆～20欧姆。
其中，位于所述发热区域的所述第二发热线路的电阻率大于位于所述发热区域的所述第一发热线路的电阻率；和/或位于所述导电区域的所述第一发热线路的电阻等于位于所述导电区域的所述第二发热线路的电阻。
为解决上述技术问题，本发明提供的第二个技术方案为：提供一种加热雾化装置，包括：发热组件及供电装置；其中，所述发热组件为如 上述任意一项所述的发热组件；所述供电装置连接所述发热组件，以为所述发热组件进行供电。
本发明的有益效果：区别于现有技术，在本发明提出的发热组件通过将固定座固定在发热线路与导电线路的重叠区域，以在固定发热组件的同时保证发热线路与导电线路的电连接稳定性。
附图说明
图1为本发明发热组件的第一实施例的结构示意图；
图2为本发明发热组件的第二实施例的结构示意图；
图3是本发明发热组件的第三实施例的结构示意图；
图4是本发明发热组件的第四实施例的结构示意图；
图5a及图5b为柱状基体中的发热膜的两表面的第一实施例的结构示意图；
图5c为片状基体中的至少一表面的结构示意图；
图6a及图6b为柱状基体中的发热膜的两表面的第二实施例的结构示意图；
图6c为柱状基体中的发热膜的一表面的第三实施例的结构示意图；
图7a及图7b为柱状基体中的发热膜的两表面的第四实施例的结构示意图；
图8为本发明加热雾化装置的一实施例的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参见图1，为本发明提供的发热组件的第一实施例的结构示意图。其中，发热组件包括发热元件及固定座。其中，发热元件包括基体11，基体11可以为圆柱状，还可以为片状，具体不做限定。如图1所示， 发热元件的基体11为柱状基体，其沿基体11的轴向方向自上而下依次分布有相连的发热区域13、重叠区域14及导电区域15。具体的，若基体11为柱状基体，其基体11的表面设置有发热膜12，发热膜12围绕基体11的外侧且覆盖基体11，且发热膜12位于发热区域13、重叠区域14及导电区域15。具体的，在发热膜12包裹圆柱状的基体11时，该发热膜12上的发热区域13、重叠区域14及导电区域15与基体11的外表面接触，即发热区域13、重叠区域14及导电区域15位于发热膜12靠近基体11的一表面。在一实施例中，基体11可为陶瓷基体，其材料为例如氧化锆、氧化铝陶瓷等。其中，基体11采用陶瓷材料能够为发热膜12的发热区域13提供刚性机械支撑与热量传导均匀的作用，可以防止其断裂或热量分布不均匀。具体的，在发热膜12的一表面设置发热区域13、重叠区域14及导电区域15，将发热膜12通过烧结的方式设置在基体11的表面，并使得发热区域13、重叠区域14及导电区域15靠近基体11的表面。由于发热膜12通过卷绕的方式形成于直径较小的基体11的外侧，为了防止发热膜12断裂，需要使发热膜12具有较薄的厚度，在一具体实施例中，发热膜12的厚度为0.02～0.5mm，进一步的，发热膜的厚度还可以为0.05～0.2mm。
在一实施例中，发热膜12的材质与基体11的材质不同，可通过流延工艺形成柔性的薄膜，发热膜12的成分可以是微晶玻璃，玻璃-陶瓷(如钙硼硅玻璃-氧化硅)，低温陶瓷(硼酸锡钡陶瓷和硼酸锆钡陶瓷)中一种或任意组合，其能够在低于1000℃以下进行烧结即可，在一实施例中，发热膜12的材质优选玻璃-陶瓷材料。
进一步的，发热膜12远离基体11的一表面还设置有与导电区域15连接导电盘17，用于与外部供电装置连接，进而将发热元件与供电装置连接，以使得供电装置为发热元件供电。
进一步地，导电盘17远离发热区域13的一端设置有电极引线19，通过电极引线19连接供电装置，进而将所述发热元件与所述供电装置连接。
如图2所示，发热元件的基体11为片状基体，其中，基体11可以 为导电材料或者为不导电的绝缘材料。具体的，如图2所示，基体11为不导电的绝缘材料，其厚度可以为0.2～0.8，优选的，基体11的厚度为0.3～0.6mm。若基体11为绝缘的材料，发热区域13、重叠区域14与导电区域15可以直接设置于基体11的一表面，而导电盘17可以设置于导电区域15远离发热区域13的一侧，且与导电区域15连接。进一步的，由于基体11为片状基体，发热区域13、重叠区域14与导电区域15裸露，因此发热区域13、重叠区域14与导电区域15远离基体11的一侧还设置有覆盖发热区域13、重叠区域14与导电区域15的保护层21，保护层21将部分导电区域15裸露出来，裸露出来的部分导电区域15用于连接电极引线19，进而通过电极引线19连接供电装置，进而将所述发热元件与所述供电装置连接。
在一实施例中，保护层21可以为釉料层，其能够使得发热区域13、重叠区域14与导电区域15与外界空气隔绝，防止发热区域13温度较高时发生氧化，使得发热区域13长期保持良好的发热效果，进一步提升发热元件的使用寿命和稳定性，同时减少发热元件的表面粗糙度。
在一实施例中，设置与导电盘17连接的电极引线19时，可通过银铜焊料在600-1100℃下采用高温钎焊的方式将导电盘17与电极引线19连接。还可以通过高温焊膏(使用温度大于300℃)以锡焊方式将电极引线19焊接于导电盘17的位置处。
在一实施例中，基体11可以为导电材料，如图3所示，其与图2所示的实施例区别在于：基体11为导电材料。具体的，基体11可以选用不锈钢和钛合金等通用金属材料，由于金属材料韧性好，能耐长期高温和机械冲击，同时导热良好，能够使得发热元件整体温度均匀。在一实施例中，基体11的材料优选不锈钢，如430和304不锈钢等其中一种。
在一优选实施例中，基体11采用金属材料，金属材料具有高机械强度，从而可以有效防止发热元件在长期高温和机械冲击下出现断裂，同时金属材料具有良好的导热性能，保证了发热元件表面温度的均匀性，有利于加热不燃烧基质获得较佳的口感。
具体的，在基体11为导电材料时，在设置发热区域13、重叠区域14及导电区域15之前需要在基体11的两表面设置绝缘层22，将发热区域13、重叠区域14及导电区域15设置在绝缘层22上。在一实施例中，绝缘层22的材料为以氧化铝、氧化钙为主要成分的玻璃层，其能够使得基体11不导电，防止因基体11导电而造成发热区域13、重叠区域14及导电区域15导电通路短路。绝缘层22可以通过喷涂或丝网印刷的方式，将绝缘层22浆料覆盖在基体11的表面，然后烧制而成。可以根据导电通路与基体11间的耐压要求，设计绝缘层22的厚度。在一实施例中，可以设置绝缘层22的厚度小于0.1mm。
在一实施例中，绝缘层22可以设置于基体11的设置发热区域13、重叠区域14及导电区域15的一表面，而另一表面可以不设置。具体的，如图3所示，本实施例中，基体11仅有一表面设置有发热区域13、重叠区域14及导电区域15，因此，绝缘层22可只在基体11的一表面设置。在另一实施例中，即便基体11仅有一表面设置有发热区域13、重叠区域14及导电区域15，也可以在基体11的两表面均设置绝缘层22，以此能够防止基体11在高温时表面被氧化，设置绝缘层22，绝缘层22对基体11进行保护，隔绝空气。
图2及图3所示的实施例中，基体11仅一表面设置有发热区域13、重叠区域14及导电区域15，在一实施例中，还可以在基体11的两表面均设置发热区域13、重叠区域14及导电区域15，具体如图4所示。基体11的两表面均设置有发热区域13、重叠区域14及导电区域15。具体的，与图2所示的实施例相同，基体11同样可以为不导电且绝缘材料，且与图3所示的实施例相同，基体11同样可以为导电材料，若基体11为导电材料时，与图3所示相同，在基体11的两表面设置绝缘层22，再在绝缘层22上设置发热区域13、重叠区域14及导电区域15。
在本实施例中，由于基体11双面均设置有发热区域13、重叠区域14及导电区域15，考虑发热温度的影响，可以设置基体11的厚度为图2及图3所示实施例中基体11的厚度的2倍，或者大于2倍，具体不做限定。
具体的，若基体11为柱状基体，则基体表面设置发热膜12，发热膜12靠近基体11的一表面设置有发热区域13、重叠区域14及导电区域15，发热膜12远离基体11的一表面设置有导电盘17，导电盘17远离发热区域13、重叠区域14及导电区域15的一端设置有与导电区域15连接的电极引线19，电极引线19与供电装置连接。若基体11为片状基体且导电时，基体11的至少一表面设置有绝缘层22，发热区域13、重叠区域14及导电区域15设置于绝缘层22远离基体11的表面上；若基体11不导电且绝缘时，发热区域13、重叠区域14及导电区域15设置于基体11上。在设置发热区域13、重叠区域14及导电区域15的表面上，导电区域15远离发热区域13的一端设置有导电盘17，发热区域13、重叠区域14及导电区域15远离基体11的一表面进一步设置保护层21，保护层21将导电区域15部分裸露出来，且裸露出的部分远离发热区域13的一端设置有电极引线19，电极引线19与供电装置连接。其中，基体11可以一面设置有发热区域13、重叠区域14及导电区域15，还可以双面均设置有发热区域13、重叠区域14及导电区域15设置于，具体不做限定。
如图1至图4所述的发热组件，其还包括固定座16，用于固定发热元件。具体的，在一实施例中，发热区域13在进行发热时的温度高于重叠区域14及导电区域15的温度，进一步的，重叠区域14在发热时的温度小于导电区域15的温度，即在发热元件进行发热时，重叠区域14的温度最低。在一具体实施例中，将固定座16固定在发热元件的重叠区域14的位置处，进一步，固定座16至少部分与重叠区域14接触。
具体的，固定座16包括法兰盘161及底座162。其中，法兰盘161中间位置具有通槽163，发热元件穿过通槽163以将法兰盘161至少部分固定于发热元件的重叠区域14，法兰盘161将发热元件固定于底座162上。具体的，将固定座16的法兰盘161至少部分安装在重叠区域14，另一部分安装在导电区域15，即固定座16的法兰盘161不安装在发热区域13上，这样有利于平衡发热区域的温度的均匀性，而将导电区域15固定于固定座16内，可以减少发热和能量的损耗。在一实施例 中，若重叠区域14尺寸足够，还可以将法兰盘161全部设置于重叠区域14，进而将导电区域15全部收容于底座162内，以进一步减少导电区域的发热和能量的损耗。在一实施例中，重叠区域14可以完全与法兰盘161接触，或者，重叠区域14部分与法兰盘161接触，使得法兰盘161全部位于重叠区域14。
在一实施例中，在发热区域13对应设置有发热线路，在导电区域15设置有导电线路，而在重叠区域14中发热线路与导电线路重合。其中，发热线路可以为一条，也可以为多条，可以并联，也可以串联；导电线路对应于发热线路设置，其可以根据发热线路形成的连接端进行设置，例如，一条导电线路连接发热线路的一个连接端。
具体的，请参见图5a、图5b及图5c，其中，图5a及图5b为图1所示的柱状基体中的发热膜的两表面的结构示意图。图5c为图2至图4所示的片状基体中的至少一表面的结构示意图。发热区域13设置有发热线路并延伸至重叠区域14、所述导电区域15设置有导电线路并延伸至重叠区域14且与发热线路重叠或并列连接，重叠连接是指其中一个位于另一个上方，而并列连接是指两者水平并列设置，通过边缘连接。具体的，发热线路与导电线路在重叠区域14重叠连接，则可以将发热线路设置于导电线路上方，或者将导电线路设置与发热线路上方。发热线路与导电线路在重叠区域14并列连接，则可以将将发热线路与导电线路分离设置，且使得发热线路的边缘处与导电线路的边缘处连接，或者还可以将发热线路与导电线路交叉设置，并且使得发热线路的边缘处与导电线路的边缘处连接，具体不做限定。
具体的，请参见图5a，发热区域13设置有一条发热线路，即第一发热线路131。具体的，第一发热线路131在基体11的发热区域13及重叠区域14呈U型分布，使得第一发热线路131在重叠区域14具有两个连接端，在本实施例中，导电线路包括第一导电线路151，第一导电线路151分别连接U型分布的第一发热线路131的两端，且U型分布的第一发热线路131的两端与第一导电线路151互不连接。第一导电线路151自导电区域15延伸至重叠区域14，且在重叠区域14与第一发热线 路131的两个连接端重合。在一实施例中，重叠区域重叠的发热区域位于导电线路之上。
在一实施例中，第一发热线路131为电阻发热线路，其在电流通过时产生焦耳热，能够使得发热元件升温，进而对加热不燃烧基质进行加热。在一实施例中，第一发热线路131可以通过丝印厚膜浆料的方式将电子浆料转移至发热膜12上，然后将发热膜12烧结至基体11上。具体的，在本实施例中，发热膜12在包裹基体11时，仅包裹基体11的基部112，由此，当基体11为柱状基体时，其尖型部111不分布有发热区域13。
在一实施例中，为了匹配常用的供电装置，进而使得发热元件获得更高的发热功率，第一发热线路131的电阻值可以为0.5欧姆～2欧姆之间。具体的，第一发热线路131的电阻值可以根据电子浆料的材料、发热线路的长度、宽度、厚度和图案的形状来设定，在此不做限定。为了使得发热元件上的温度比较均匀，以便于在对加热不燃烧基质进行加热时能获得较大的气溶胶量和较好的口感，并且使得能量被充分利用，位于不同区域的线路由不同材料制成，具体的，例如在一实施例中，发热区域13中的第一发热线路131与导电区域15内的第一导电线路151的电阻率系数不同。具体的，设置于发热区域13内的第一发热线路131的材料的电阻率系数大于位于导电区域15内的第一导电线路151的材料的电阻率系数。例如位于发热区域13内的第一发热线路131的材料为高电阻的导电浆料，例如采用主导点电成分为Ni(镍)、Ag-Pd(银-钯)、Ag-Pt(银-铂)、Ag-RuO(银-氧化钌)等电阻率相对较高的金属或合金，以及较高比例无机粘接剂。而位于导电区域15内的第一导电线路151的材料为低电阻率的导电浆料，例如采用主导电成分Ag(银)，Au(金)等电阻率相对低的金属或合金，以及低比例无机粘接剂。
在一实施例中，因为Ag(银)、Au(金)等高导电金属的熔点较低(Tc(Ag)约960℃，Tc(Au)约1064℃)，其必须在1000℃以下温度烧结，而常规陶瓷(氧化铝、氮化铝)通常烧结温度在1400-1600℃， 因此，位于重叠区域14的低电阻率的第一发热线路131的材料可以根据发热膜12进行设置。
在一实施例中，可以根据发热线路及导电线路的形状设置相应的电阻，但是无论发热线路及导电线路的电阻值为多少，发热线路及导电线路重叠的区域最小。
在一实施例中，第一发热线路131及第一导电线路151的长度可以灵活控制，通常第一发热线路131在发热区域13的分布由下往上，再由上往下分布，例如图5a所示的U型分布，以此能够使得发热元件的发热区域13具有较好的温度均匀性。
在一实施例中，片状基体及柱状基体包括基部112及位于基部112一端的尖型部111，发热区域13靠近尖型部111。具体的，基体11设置尖型部111以使得发热元件便于插入加热不燃烧基质中。
请参见图5b，发热膜12远离基体11的一表面具有导电盘17，如图5b所示，导电盘17对应于导电区域15设置。具体的，导电盘17包括第一正导电盘171及第一负导电盘172，其中，第一正导电盘171及第一负导电盘172分别连接在第一导电线路151远离第一发热线路131的一端。具体的，第一正导电盘171及第一负导电盘172对应于第一导电线路151的位置处具有贯穿发热膜12的通孔18，通孔18内填充有导电物质，进而将第一正导电盘171及第一负导电盘172分别与第一导电线路15电连接。进一步的，在发热膜12的与导电盘17的同一面上还设置有电极引线19，电极引线19连接导电盘17，具体的，电极引线19的一端分别连接第一正导电盘171及第一负导电盘172，电极引线19用于另一端连接供电装置，进而将发热元件与供电装置连接。
请参见图5c，其为片状基体的至少一表面的结构示意图。具体的，该片状基体11同样包括基部112及尖型部111，在本实施例中，基体11的尖型部111分布有发热区域13，具体的，尖型部111设置有第一发热线路131。进一步的，与图5a的区别在于，本实施例中，导电盘17与发热区域13、重叠区域14及导电区域15设置于基体11的同一表面，具体的，与图5a所示相同，第一发热线路131U型分布，第一导电线路 151连接U型分布的第一发热线路131的两端。导电盘17包括第一正导电盘171及第一负导电盘172，第一正导电盘171及第一负导电盘172连接第一导电线路151远离第一发热线路131的一端，且电极引线19连接第一正导电盘171及第一负导电盘172远离第一导电线路151的一端，进一步将发热元件连接至供电装置。
具体的，在本实施例中，第一发热线路131、第一导电线路151可以通过PVD(物理气相沉积)或电镀的方式沉积在基体11上或沉积在基体11表面覆盖的绝缘层22上，也可以通过丝网印刷方式印刷导电浆料于基体11上或基体11表面覆盖的绝缘层22上，然后烧制而成；优选采用丝网印刷和烧结的方式，其中第一发热线路131可采用常用的银-钯电阻浆料、钌-钯电阻浆料、铂浆等贵金属浆料，亦可选用镍基等贱金属浆料，而第一导电线路151可采用电阻率相对较低的银基浆料。其中第一发热线路131的图案可以灵活设置，配合导电浆料特性，以及第一发热线路131的厚度，获得用于发热元件所需的合适阻值，发热元件的阻值一般在0.3-2.0Ω之间；第一发热线路131的厚度一般小于0.1mm，优选是小于20um。
请参见图6a，与图5a所示的实施例相比，区别在于，本实施例中第一发热线路131包括多条，且多条第一发热线路131并联设置。具体的，多条第一发热线路131均呈U型分布，且分布于发热区域13及重叠区域14，第一导电线路151分布在导电区域15及重叠区域14。第一导电线路151在重叠区域14连接第一发热线路131，并且通过第一导电线路151将两条第一发热线路131并联。具体的，在本实施例中，还包括第二发热线路132及第二导电线路152。在一实施例中，第二发热线路132及第二导电线路152位于第一发热线路131及第一导电线路151的内侧，进一步地，第二发热线路132及第二导电线路152位于并联的多条第一发热线路131之间。如图6a所示，在一实施例中，第二发热线路132所在位置的发热区域13、重叠区域14及导电区域15可以与第一发热线路131所在位置的发热区域13、重叠区域14及导电区域15位置对应，还可以位置错开，例如图6a所示，第二发热线路132所在位置的 发热区域13、重叠区域14及导电区域15可以与第一发热线路131所在位置的发热区域13、重叠区域14及导电区域15位置错开。
在一实施例中，第二发热线路132可以为测温线路，其存在电阻TCR特性，即温度与电阻之间存在特定对应关系，在第二发热线路132通过第二导电线路152外接一定供电装置时，在施加一定电压时，获得特定电流数值，从而获得第二导电线路152的阻值，反推第二导电线路152目前所在温度。
在一实施例中，第一发热线路131也可以存在该TCR特性。在本实施例中，设置第二发热线路132的优势在于，第二发热线路132的自发热少，电流加热引入杂信号少，有利于电子元件对于温度的精确控制。同时，由于第二发热线路132不需要加热，其初始阻值通常相比第一发热线路131要大。室温下，第二发热线路132的电阻值可以为从5欧姆到20欧姆的范围内的值，其电阻值同样根据电子浆料的材料，发热轨迹的长度、宽度、厚度、和图案等来设定。
在一实施例中，为了温度的精准控制，可以设定位于发热区域13的第二发热线路132的材料的电阻率高于位于发热区域13的第一发热线路131的材料的电阻率。进而使得位于发热区域13的第二发热线路132具有更高的电阻，同时也有更好的电阻温度系数(TCR)，以保证电阻对于温度变化的灵敏性。而位于导电区域15的第二导电线路152的材料可以与位于导电区域15的第一导电线路151的材料相同，或者材料性质相近，都可以为低电阻率的导电材料，其方阻可以低于5mΩ。
本实施例中，将第二发热线路132设置于第一发热线路131之间能够将测温部分集中于发热元件的较高温度区间内，更有利于温度的精确控制。
请参见图6b，结合图6a，第一发热线路131及第二发热线路132通过图6a所示的方式设置，其在第一导电线路151及第二导电线路152处形成四个引脚。因此发热膜12另一表面的导电盘17包括与四个引脚对应的四个导电盘，与图5b所示的区别在于，还包括第二正导电盘及第二负导电盘，其中，第二正导电盘及第二负导电盘分别连接第二导电 线路152远离第二发热线路132的一端。与图5b所示实施例相同，其第二正导电盘及第二负导电盘同样连接电极引线19。
可以理解的，若基体11为片状基体，第一发热线路131及第二发热线路132、第一导电线路151及第二导电线路152、导电盘17位于同一表面，其与上述图5c所示实施例相同，在此不再赘述。
在另一实施例中，第一发热线路131可以仅只有一条，且第二发热线路132位于第一发热线路131的内侧，具体如图6c所示。具体的，在发热膜12一表面的发热区域13、重叠区域14及导电区域15具体为如图6c所示的实施例时，发热膜12另一表面的导电盘17为如图6b所示，在此不再赘述。
在另一实施例中，第一发热线路131及第二发热线路132共用第一正导电盘171或所述第二正导电盘，第一发热线路131及第二发热线路132共用第一负导电盘172或所述第二负导电盘。具体的，请参见图7a，其中，第一发热线路131及第二发热线路132的一端相互连接，具体的，第一发热线路131可以与第二发热线路132并联，即第一发热线路131的正极连接第二发热线路132的正极，或者，第一发热线路131的负极连接第二发热线路132的负极。
请参见图7b，在第一发热线路131可以与第二发热线路132并联后，会在导电区域15形成三个引脚，导电盘17对应于引脚设置。
现有技术中的发热组件，其将固定座固定于发热组件的导电线路或发热线路，这会影响导电线路及发热线路的电连接稳定性。而本申请提供的发热组件，通过将固定座的法兰盘安装在发热组件的导电线路和发热线路重叠的重叠区域，以防止在固定发热组件时，导电线路或发热线路断裂，保证了导电线路及发热线路的电连接稳定性。并且，发热元件上设置有发热线路及测温线路，其能够实现温度的精准控制。
请参见图8，为本发明提供的加热雾化装置的一实施例的结构示意图。加热雾化装置包括供电装置32及发热组件31，其中供电装置32用于给发热组件31供电，发热组件31为上述图1及图2、图3、图4所述的发热组件，在此不再赘述。
以上仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (21)

  1. 一种发热组件，其中，包括：
    发热元件，所述发热元件包括基体及位于所述基体上且沿所述基体轴向依次分布且相连的发热区域、重叠区域及导电区域，其中，所述发热区域设置有发热线路并延伸至重叠区域、所述导电区域设置有导电线路并延伸至重叠区域且与发热线路重叠或并列连接；
    固定座，所述固定座的一端固定所述发热元件，且所述固定座至少部分与所述重叠区域接触。
  2. 根据权利要求1所述的发热组件，其中，所述基体为片状基体；或
    所述基体为柱状基体。
  3. 根据权利要求1所述的发热组件，其中，所述重叠区域发热时的温度小于所述发热区域及所述导电区域发热时的温度。
  4. 根据权利要求1所述的发热组件，其中，所述重叠区域的发热线路层叠于重叠区域的导电线路上。
  5. 根据权利要求1所述的发热组件，其中，所述固定座进一步包括：法兰盘及底座，
    其中，所述法兰盘中间位置具有通槽，所述发热元件穿过所述通槽以将所述法兰盘至少部分固定于所述发热元件的重叠区域，所述法兰盘将所述发热元件固定于所述底座上。
  6. 根据权利要求5所述的发热组件，其中，所述法兰盘全部与所述重叠区域接触。
  7. 根据权利要求2所述的发热组件，其中，柱状的所述基体的外侧包裹有发热膜，所述发热区域、所述重叠区域及所述导电区域设置于所述发热膜靠近所述基体的一表面；
    且所述发热膜远离所述基体的表面设置有与所述导电区域对应的导电盘，所述导电盘对应所述导电区域具有贯穿所述发热膜的通孔，所述通孔中具有导电物质，以将所述导电盘与所述导电区域中的导电线路电连接。
  8. 根据权利要求2所述的发热组件，其中，片状的所述基体的一表面设置有所述发热区域、所述重叠区域及所述导电区域、导电盘；
    其中，所述导电盘位于所述导电区域远离所述发热区域的一侧。
  9. 根据权利要求7所述的发热组件，其中，所述发热线路包括第一发热线路，所述导电线路包括第一导电线路，所述第一发热线路与所述第一导电线路在所述重叠区域重合；
    其中，所述第一发热线路呈U型分布，所述第一导电线路分别连接U型的所述第一发热线路的两端；
    所述导电盘包括第一正导电盘及第一负导电盘，所述第一正导电盘及所述第一负导电盘分别连接所述第一导电线路远离所述第一发热线路的一端。
  10. 根据权利要求9所述的发热组件，其中，所述发热线路还包括第二发热线路，所述导电线路还包括第二导电线路，所述第二发热线路与所述第二导电线路在所述重叠区域重合；
    其中，所述第二发热线路呈U型分布，所述第二导电线路分别连接U型的所述第二发热线路的两端；
    所述导电盘包括第二正导电盘及第二负导电盘，所述第二正导电盘及所述第二负导电盘分别连接所述第二导电线路远离所述第二发热线路的一端。
  11. 根据权利要求10所述的发热组件，其中，所述第一发热线路为与所述第一导电线路串联的一条线路，且所述第二发热线路与所述第二导电线路位于所述第一发热线路及所述第一导电线路的内侧；或者
    所述第一发热线路为与所述第一导电线路并联的多条线路，且所述第二发热线路与所述第二导电线路位于多条所述第一发热线路及所述第一导电线路之间。
  12. 根据权利要求11所述的发热组件，其中，所述第一发热线路及所述第二发热线路共用所述第一正导电盘或所述第二正导电盘；或
    所述第一发热线路及所述第二发热线路共用所述第一负导电盘或所述第二负导电盘。
  13. 根据权利要求2所述的发热组件，其中，所述片状基体及所述柱状基体均包括基部及位于所述基部一端的尖型部，所述发热区域靠近所述尖型部。
  14. 根据权利要求13所述的发热组件，其中，所述柱状基体的所述基部远离所述尖型部的一端具有内凹的槽体。
  15. 根据权利要求8所述的发热组件，其中，所述发热区域、所述重叠区域及所述导电区域远离所述基体的一侧设置有覆盖保护层，所述保护层将部分 所述导电区域裸露出来。
  16. 根据权利要求7所述的发热组件，其中，所述导电盘远离所述发热线路的一端进一步连接有电极引线，所述电极引线用于连接供电装置，进而将所述发热元件与所述供电装置连接。
  17. 根据权利要求8所述的发热组件，其中，所述片状基体的两表面分别设置有绝缘层，所述发热区域、所述重叠区域及所述导电区域、导电盘设置于所述基体的一表面的绝缘层上。
  18. 根据权利要求7所述的发热组件，其中，所述发热膜的厚度为0.02～0.5mm；或
    所述发热膜的厚度为0.05～0.2mm。
  19. 根据权利要求10所述的发热组件，其中，所述第一发热线路的电阻为0.5欧姆～2欧姆；和/或
    所述第二发热线路的电阻为5欧姆～20欧姆。
  20. 根据权利要求10所述的发热组件，其中，位于所述发热区域的所述第二发热线路的电阻率大于位于所述发热区域的所述第一发热线路的电阻率；和/或
    位于所述导电区域的所述第一发热线路的电阻等于位于所述导电区域的所述第二发热线路的电阻。
  21. 一种加热雾化装置，其中，包括：发热组件及供电装置；
    其中，所述发热组件为如权利要求1～20任意一项所述的发热组件；
    所述供电装置连接所述发热组件，以为所述发热组件进行供电。
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