WO2024045737A1 - Boîtier de module optique et son procédé de fabrication, et module optique et dispositif de communication optique - Google Patents

Boîtier de module optique et son procédé de fabrication, et module optique et dispositif de communication optique Download PDF

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Publication number
WO2024045737A1
WO2024045737A1 PCT/CN2023/098230 CN2023098230W WO2024045737A1 WO 2024045737 A1 WO2024045737 A1 WO 2024045737A1 CN 2023098230 W CN2023098230 W CN 2023098230W WO 2024045737 A1 WO2024045737 A1 WO 2024045737A1
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WO
WIPO (PCT)
Prior art keywords
optical module
housing
plating layer
module housing
coating
Prior art date
Application number
PCT/CN2023/098230
Other languages
English (en)
Chinese (zh)
Inventor
魏潇赟
杨勇
邓抄军
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024045737A1 publication Critical patent/WO2024045737A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Embodiments of the present application relate to the field of optical modules, and in particular to an optical module housing and a manufacturing method thereof, an optical module and an optical communication device.
  • Optical modules are important components in optical communications and are used for mutual conversion between optical signals and electrical signals.
  • technologies such as cloud computing, big data, 5G, and autonomous driving
  • the power of optical modules is becoming larger and larger, which results in the amount of heat generated by the optical modules becoming larger and larger.
  • the optical module When in use, the optical module is plugged into the optical module connector, and the optical module housing contacts the heat sink of the optical module connector for heat dissipation.
  • the contact between the optical module housing and the radiator has a great impact on the heat dissipation of the optical module. If there is a large gap, it will affect the heat exchange between the optical module housing and the radiator, causing the temperature of the optical module to be too high. , affecting the performance and service life of the optical module.
  • the present application provides an optical module housing and a manufacturing method thereof, an optical module and an optical communication device, which facilitates the formation of good contact between the optical module housing and the radiator, and promotes heat exchange between the optical module housing and the radiator. It is helpful to improve the heat dissipation effect.
  • the technical solutions are as follows:
  • an optical module housing In a first aspect, an optical module housing is provided.
  • the optical module housing has a contact area.
  • the optical module housing is installed on the optical module connector.
  • the optical module housing includes a housing body and a coating layer, and the coating layer is located on the surface of the housing body. At least in the contact area, the roughness Ra of the coating does not exceed 0.6 ⁇ m.
  • the roughness Ra of the coating of the contact area is set to no more than 0.6 ⁇ m, so that when the optical module is connected to the optical module connector, there is a gap between the contact area of the optical module housing and the heat sink.
  • the gap is smaller, which reduces the contact thermal resistance, facilitates heat exchange between the optical module housing and the radiator, accelerates the heat dissipation of the optical module, and prevents the temperature of the optical module from being too high.
  • the hardness of the coating is not less than 900HV0.1.
  • the optical module housing can have better wear resistance.
  • the hardness of the coating is 950HV0.1.
  • the thickness of the plating layer is 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating is 10 ⁇ m.
  • the thickness of the coating affects the wear resistance and corrosion resistance of the optical module housing. If it is set too thin, the improvement of the wear resistance and corrosion resistance is unknown. Obviously, setting it too thick will increase the manufacturing cost of the optical module housing.
  • the hardness of the coating is 7.9g/cm 3 to 8.5g/cm 3 .
  • 8.0g/cm 3 makes the coating dense enough to better protect the optical module housing.
  • the outer surface of the optical module housing has an anti-fingerprint structure.
  • the surface of the optical module housing can be prevented from being scratched and stained by fingerprints. Since the coating has a small roughness and is relatively smooth, it is easy to form fine scratches, causing the surface of the optical module housing to be scratched. Traces such as fingerprints and palmprints are also easily formed on the surface of the coating, and the anti-fingerprint structure can avoid the occurrence of these problems.
  • the surface of the coating is a frosted surface
  • the anti-fingerprint structure includes the frosted surface
  • a frosted surface to avoid scratches on the surface of the coating can also prevent fingerprint contamination and improve the appearance quality of the optical module.
  • the anti-fingerprint structure includes an anti-fingerprint film, and the anti-fingerprint film is located on the surface of the coating.
  • the anti-fingerprint film includes, but is not limited to, nanoparticle coating, self-assembled monomolecular film, and oxide coating.
  • the use of the anti-fingerprint film on the surface of the coating can also prevent the surface of the optical module housing from being scratched, and prevent the surface of the optical module housing from being stained to form fingerprints. , palm prints and other traces to improve the appearance quality of the optical module.
  • a method for manufacturing an optical module housing is provided.
  • the optical module housing has a contact area, and the contact area is used to contact a heat sink.
  • the manufacturing method includes:
  • a shell body is provided; a plating layer is formed on the surface of the shell body. Wherein, at least in the contact area, the roughness Ra of the coating layer does not exceed 0.6 ⁇ m.
  • the roughness Ra of the coating of the contact area is set to no more than 0.6 ⁇ m, so that when the optical module is connected to the optical module connector, there is a gap between the contact area of the optical module housing and the heat sink.
  • the gap is smaller, which reduces the contact thermal resistance, facilitates heat exchange between the optical module housing and the radiator, accelerates the heat dissipation of the optical module, and prevents the temperature of the optical module from being too high.
  • the surface of the housing body is first polished before forming a plating layer on the surface of the housing body.
  • the surface of the housing body is first polished. By polishing the surface of the housing body, at least in the contact area, the roughness Ra of the housing body does not exceed 0.6 ⁇ m.
  • the surface of the housing body is mechanically polished or laser polished.
  • the roughness of the housing body is reduced, so that the coating layer formed on the surface of the housing body is smoother and the roughness is smoother. Low.
  • polishing is not performed before the plating layer is formed on the surface of the housing body. After the plating layer is formed on the surface of the housing body, the plating layer formed on the housing body is polished.
  • the plating layer formed on the housing body is mechanically polished or laser polished.
  • the surface of the housing body is relatively rough, so that the formed plating layer can be more closely combined with the housing body. After the plating layer is formed, the plating layer is polished, thereby reducing the roughness of the formed plating layer.
  • the plating layer is also annealed to increase the hardness of the plating layer, thereby Improve the wear resistance of the optical module housing.
  • the coating is frosted.
  • the surface of the coating layer can be turned into a frosted surface through frosting treatment, so that the frosted surface can be used to avoid scratches on the surface of the coating layer, avoid fingerprint contamination, and improve the appearance quality of the optical module.
  • an anti-fingerprint film is formed on the surface of the plating layer.
  • the purpose of preventing the surface of the optical module housing from being scratched can also be achieved, and the surface of the optical module housing can be prevented from being stained to form fingerprints, palms, etc. lines and other traces to improve the appearance quality of the optical module.
  • an optical module in a third aspect, includes a circuit board and an optical module housing as described in the first aspect.
  • the circuit board is located in the optical module housing.
  • an optical communication device in a fourth aspect, includes an optical module connector and an optical module as described in the third aspect, and the optical module is connected to the optical module connector.
  • the side wall of the optical module connector has an opening, and the heat sink installed on the side wall of the optical module connector contacts the housing of the optical module through the opening, so that the housing of the optical module contacts the heat dissipation
  • the gap between the radiators is smaller, which reduces the contact thermal resistance, facilitates heat exchange between the optical module housing and the radiator, accelerates the heat dissipation of the optical module, and prevents the temperature of the optical module from being too high. .
  • the optical communication device further includes a motherboard and a heat sink.
  • the optical module connector is connected to the main board
  • the heat sink is connected to the optical module connector
  • the heat dissipating boss is located in the opening and contacts the surface of the optical module housing.
  • Figure 1 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • Figure 2 is a partial structural schematic diagram of an optical communication device provided by an embodiment of the present application.
  • Figure 3 is a schematic cross-sectional view of an optical module housing provided by an embodiment of the present application.
  • Figure 4 is a schematic cross-sectional view of an optical module housing provided by an embodiment of the present application.
  • Figure 5 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application.
  • Figure 6 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application.
  • Figure 7 is a schematic diagram of the manufacturing process of an optical module housing provided by an embodiment of the present application.
  • Figure 8 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application.
  • Figure 9 is a schematic diagram of the manufacturing process of an optical module housing provided by an embodiment of the present application.
  • FIG. 11 Optical module 11.
  • Optical module housing 11a contact area 110.
  • FIG 1 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • the optical module 10 may be, but is not limited to, a small form-factor pluggable transceiver (SFP), a four-channel small form-factor pluggable transceiver (quad small form-factor pluggable transceiver, QSFP), C form-factor pluggable transceiver (CFP).
  • SFP small form-factor pluggable transceiver
  • QSFP quad small form-factor pluggable transceiver
  • CFP C form-factor pluggable transceiver
  • the optical module 10 includes an optical module housing 11 and a circuit board (not shown in Figure 1). Electronic components are connected to the circuit board, such as related chips, light sources, etc.
  • One end of the optical module housing 11 has an interface. When in use, the end of the optical module housing 11 where the interface is located is inserted into the optical module connector.
  • the optical module 10 shown in FIG. 1 also includes a handle 12 , which is located at the end of the optical module housing 11 away from the interface.
  • the handle 12 is used to facilitate the insertion and removal of the optical module 10 .
  • the optical module 10 may also be without the handle 12 .
  • FIG. 2 is a partial structural schematic diagram of an optical communication device provided by an embodiment of the present application.
  • the optical communication device includes an optical module 10 , an optical module connector 20 , a heat sink 30 and a mainboard 40 .
  • the optical module connector 20 is also called an optical cage.
  • the optical module connector 20 is connected to the main board 40 , where the main board 40 can be a printed circuit board.
  • the optical module connector 20 is welded to the main board 40 .
  • the optical module 10 is connected to the optical module connector 20 .
  • Figure 2 shows the connection process of the optical module 10 and the optical module connector 20.
  • One end of the optical module connector 20 has a socket 20a, and the optical module 10 is inserted into the socket 20a.
  • the side wall of the optical module connector 20 has an opening 20b.
  • the heat sink 30 includes a heat sink body 32 , a boss 31 and a plurality of heat dissipation structures 33 .
  • the boss 31 and the heat dissipation structure 33 are respectively located on opposite sides of the radiator body 32 .
  • the heat sink 30 is connected to the optical module connector 20, for example, by snapping.
  • the boss 31 of the heat sink 30 extends into the opening 20 b, and the bottom surface of the boss 31 contacts the optical module housing 11 of the optical module 10 , so that the heat generated by the optical module 10 can be conducted to the heat sink 30 .
  • the heat dissipation structure 33 is a heat dissipation fin.
  • the heat dissipation structure 33 may also be a columnar heat dissipation tooth.
  • the heat sink 30 may be a metal structural component, such as metal aluminum or aluminum alloy.
  • the radiator main body 32, the boss 31 and the plurality of heat dissipation structures 33 can be an integrally formed structure or a welded structure.
  • the force required when plugging the optical module 10 is about 40N. Remove the optical module 10 from the optical module connector. 20, the required force needs to be about 30N, that is, more than 40N of force is needed to insert the optical module 10 into place, and more than 30N of force is needed to pull out the optical module 10.
  • the required force may also be different, and 40N and 30N are only used as examples here.
  • the optical module housing 11 has a contact area 11a, which is an area of the optical module housing that is used to contact the heat sink.
  • the optical module housing 11 may include an upper housing 111 and a lower housing 112 arranged oppositely.
  • the upper housing 111 is connected to the lower housing 112, and the contact area 11a is located on the upper housing 111.
  • the upper housing 111 and the lower housing 112 are separate components, and they are detachably or fixedly connected.
  • the upper housing 111 and the lower housing 112 are an integral component, that is, they are one overall.
  • the optical module 10 is inserted into the optical module connector 20 , and the contact area 11 a is in contact with the boss 31 .
  • the heat generated during the operation of the optical module 10 is transferred to the boss 31 and dissipated through the heat sink 30 .
  • the heat dissipation effect can prevent the temperature of the optical module 10 from being too high.
  • the power of the optical module 10 is getting larger and larger, making the optical module 10 prone to overheating and affecting its service life.
  • Figure 3 is a schematic cross-sectional view of an optical module housing provided by an embodiment of the present application. This section is the A-A section in Figure 2.
  • the optical module housing 11 includes a housing body 110 and a coating 120.
  • the coating 120 is located on the surface of the housing body 110, at least in the contact area 11a.
  • the roughness Ra of the coating 120 does not exceed 0.6 ⁇ m.
  • the roughness Ra of the outer surface of the optical module housing 11 is 1.6 ⁇ m.
  • the contact thermal resistance between the optical module housing 11 and the heat sink 30 is larger, causing the optical module to be easily damaged during operation. Temperature is too high.
  • the roughness Ra of the plating layer 120 in the contact area 11a is set to no more than 0.6 ⁇ m, so that the gap existing between the optical module housing 11 and the heat sink 30 is smaller, which reduces the contact thermal resistance and is beneficial to the optical module.
  • the heat exchange between the module housing 11 and the radiator 30 accelerates the heat dissipation of the optical module and prevents the temperature of the optical module from being too high.
  • the heat sink 30 and the optical module connector 20 are usually connected by a snap connection. After the roughness of the plating layer 120 is reduced, a tighter buckle can be used to connect the heat sink 30 and the optical module connector 20 to increase the pressure between the contact area 11a and the heat sink 30, so that the optical module and the optical module can be connected. There is still enough friction between the module connectors. Increasing the pressure between the contact area 11a and the heat sink 30 can further reduce the gap between the contact area 11a and the heat sink 30, which is beneficial to the heat exchange between the optical module housing 11 and the heat sink 30, and accelerates the heat exchange between the optical module housing 11 and the heat sink 30. Heat dissipation of optical modules.
  • the optical module 10 has a contact area 11a.
  • the optical module 10 may also have multiple contact areas 11a.
  • the multiple contact areas 11a may be located on the same side wall of the optical module housing 11, or may be on different side walls.
  • the optical module connector 20 adapted to the optical module 10 may have multiple openings 20b, and may be installed with multiple heat sinks 30.
  • the protrusions of the multiple heat sinks 30 The stages 31 are respectively located in the plurality of openings 20b so as to be in contact with the plurality of contact areas 11a respectively.
  • the same side wall of the optical module connector 20 may have two or more openings 20b.
  • One heat sink 30 may have two or more bosses 31 , and each boss 31 of the heat sink 31 is respectively located in each opening 20 b of the optical module connector 20 .
  • the shell body 110 is an aluminum structural part, a zinc structural part or a copper structural part, and is soft in texture.
  • the coating 120 can play a protective role and improve the hardness of the optical module housing 11, thereby improving the wear resistance of the optical module housing 11.
  • the plating layer 120 may be located on the upper housing 111 or on the upper housing 111 and the lower housing 112 .
  • the housing body 110 can also be made of other materials.
  • the plating layer 120 may cover the entire surface of the housing body 110 , and the entire surface of the housing body 110 includes the inner surface and the outer surface of the housing body 110 .
  • the roughness Ra of the plating layer 120 covering the outer surface of the housing body 110 does not exceed 0.6 ⁇ m. Since the plating layer 120 covering the inner surface of the housing body 110 is not in contact with the heat sink 30 , even if the roughness Ra exceeds 0.6 ⁇ m, it will not affect the heat exchange between the optical module housing and the heat sink 30 . Unless otherwise specified, in the embodiment of the present application, the surface of the plating layer 120 refers to the surface of the plating layer 120 located on the outer surface of the housing body 110 .
  • the roughness Ra of the plating layer 120 covering the inner surface of the housing body 110 can also be set to no more than 0.6 ⁇ m, so that the components in the optical module housing 11 can be in closer contact with the inner surface of the optical module housing 11 .
  • plating 120 may be a nickel plating.
  • the nickel plating can make the optical module housing 11 have better corrosion resistance, which is beneficial to extending the service life of the optical module.
  • the coating 120 can also be a coating formed of other materials, such as chromium plating or other coatings with wear resistance and corrosion resistance. Chromium plating also has high hardness and corrosion resistance, and can also extend the life of the coating. The role of the service life of the optical module.
  • the hardness of the plating layer 120 is not less than 900HV0.1.
  • the optical module housing 11 can have better wear resistance.
  • the thickness of the coating 120 can be 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating 120 affects the wear resistance and corrosion resistance of the optical module housing 11. If the thickness is set too thin, the improvement of the wear resistance and corrosion resistance will not be obvious. The thickness setting If it is too thick, it will increase the production cost.
  • the density of the coating layer 120 may be greater than or equal to 7g/cm 3 , such as 7.9g/cm 3 to 8.5g/cm 3 , so that the coating layer 120 is sufficiently dense to better protect the optical module housing.
  • the outer surface of the optical module housing also has an anti-fingerprint structure.
  • the anti-fingerprint structure can prevent the surface of the optical module housing 11 from being scratched and can also avoid being stained by fingerprints.
  • the surface of the coating 120 is a frosted surface
  • the anti-fingerprint structure includes the frosted surface
  • the frosted surface can avoid scratches on the surface of the coating 120 and avoid being stained by fingerprints, thereby improving the appearance quality of the optical module.
  • the roughness Ra of the frosted surface does not exceed 0.6 ⁇ m, so that the gap between the optical module housing 11 and the heat sink 30 is small, and heat exchange between the optical module housing 11 and the heat sink 30 can still be performed quickly.
  • the anti-fingerprint structure includes an anti-fingerprint film 130 .
  • the anti-fingerprint film 130 is located on the surface of the coating 120 .
  • the anti-fingerprint film 130 By providing the anti-fingerprint film 130 on the surface of the coating 120, it can also prevent the surface of the optical module housing 11 from being scratched, and prevent the surface of the optical module housing 11 from being stained to form fingerprints, palm prints and other traces. Improve the appearance quality of optical modules.
  • the anti-fingerprint film 130 may include, but is not limited to, a nanoparticle coating, a self-assembled monomolecular film, and an oxide coating.
  • the anti-fingerprint film 130 may cover part or all of the surface of the coating 120 .
  • the entire surface area of the plating layer 120 is covered, so that any area on the surface of the optical module housing that may be touched will not be contaminated.
  • An embodiment of the present application also provides an optical module, which includes a circuit board and any optical module housing 11 as shown in Figures 3 to 4 .
  • the circuit board is located in the optical module housing 11 .
  • Electronic components are connected to the circuit board, such as light sources, optical digital signal processor (ODSP) chips, integrated coherent transmitter (ICT) chips, integrated coherent receivers (ICR) chip.
  • ODSP optical digital signal processor
  • ICT integrated coherent transmitter
  • ICR integrated coherent receivers
  • An embodiment of the present application also provides an optical communication device.
  • the optical communication device includes an optical module connector and the aforementioned optical module.
  • the optical module is connected to the optical module connector.
  • the optical module provided in the embodiment of the present application is compared with the same type of optical module in the related art.
  • the pressure between the two optical modules and the radiator is 20N.
  • the two optical modules When working at an ambient temperature of 25°C, the two optical modules
  • the power consumption is 26.5W, and the cooling air volume is 10CFM.
  • the temperature of the ODSP chip in the optical module provided by the embodiment of the present application is 76.6°C
  • the temperature of the light source is 42.4°C
  • the temperature of the ICT chip is 49.5°C
  • the temperature of the ICR chip is 49°C
  • the temperatures of the optical modules in the technology were 83.37°C, 44.27°C, 52.17°C and 51.57°C, which were reduced by 6.77°C, 1.87°C, 2.67°C and 2.57°C respectively.
  • Figure 5 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application. This method is used to make the optical module housing shown in Figure 3 or Figure 4. As shown in Figure 5, the production method includes:
  • step S11 a housing body 110 is provided.
  • the optical module housing includes an upper housing 111 and a lower housing 112. Taking the upper housing 111 and the lower housing 112 as separate components as an example, the housing body 110 is also a separate structure, including an upper housing body 1101 and a lower housing body 1102 . The upper housing body 1101 and the lower housing body 1102 can be manufactured separately.
  • the upper housing body 1101 and the lower housing body 1102 are made by die casting.
  • the upper housing body 1101 and the lower housing body 1102 are also integrated, and can be manufactured by die-casting as a whole.
  • step S12 the plating layer 120 is formed on the surface of the housing body 110.
  • the roughness Ra of the plating layer 120 does not exceed 0.6 ⁇ m.
  • the upper housing body 1101 and the lower housing body 1102 can be processed separately to form the plating layer 120.
  • electroless plating may be used to form the plating layer 120 on the surface of the upper housing body 1101 and the surface of the lower housing body 1102 respectively.
  • the roughness Ra of the outer surface of the optical module housing 11 is 1.6 ⁇ m.
  • the contact thermal resistance between the optical module housing 11 and the heat sink 30 is larger, causing the optical module to be easily damaged during operation. Temperature is too high.
  • the roughness Ra of the plating layer 120 in the contact area 11a is set to no more than 0.6 ⁇ m, so that the gap existing between the optical module housing 11 and the heat sink 30 is smaller, which reduces the contact thermal resistance and is beneficial to the optical module.
  • the heat exchange between the module housing 11 and the radiator 30 accelerates the heat dissipation of the optical module and prevents the temperature of the optical module from being too high.
  • the thickness of the coating 120 formed on the surface of the upper housing body 1101 and the surface of the lower housing body 1102 can be 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating 120 affects the wear resistance and corrosion resistance of the optical module housing 11, and the thickness is set too thin. , the improvement in wear resistance and corrosion resistance is not obvious, and setting the thickness too thick will increase the production cost.
  • FIG. 6 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application. This method is used to make the optical module housing shown in Figure 3 or Figure 4. The method proceeds after step S11.
  • FIG. 7 is a schematic diagram of the manufacturing process of an optical module housing provided by an embodiment of the present application. The figure takes the production of the upper housing 111 with the plating layer 120 as a nickel plating as an example to illustrate the manufacturing process of the optical module housing. In other examples, the plating layer 120 may also be a chromium plating. As shown in Figure 6 and Figure 7, the production Methods include:
  • step S21 the housing body 110 is polished.
  • polishing the housing body 110 to reduce the roughness of the housing body 110 is beneficial to reducing the roughness of the subsequently formed plating layer 120 .
  • polishing is performed so that the roughness Ra of the housing body 110 does not exceed 0.6 ⁇ m at least in the contact area 11a, so that the roughness Ra of the subsequently formed plating layer 120 in the contact area 11a does not exceed 0.6 ⁇ m.
  • the upper housing 111 and the lower housing 112 are separate components, and the upper housing 111 is made as an example.
  • the upper housing body 1101 can be polished to reduce the contact area 11 a of roughness.
  • the outer surface of the upper housing 111 may be polished, or the outer surface and the inner surface of the upper housing 111 may be polished.
  • the roughness of the inner surface can be greater than the roughness of the outer surface. Since the inner surface is not exposed and does not come into contact with the radiator, there is no need to control the roughness to a very low level. To reduce workload and reduce costs.
  • polishing the housing body 110 mechanical polishing and/or laser polishing may be used.
  • step S22 electroless nickel plating is performed on the surface of the housing body 110 to form a plating layer 120 .
  • the thickness of the plating layer 120 formed by electroless plating is more uniform and the cost is lower.
  • the thickness of the coating 120 formed on the surface of the housing body 110 can be 1 ⁇ m to 20 ⁇ m.
  • the thickness of the coating 120 affects the wear resistance and corrosion resistance of the optical module housing 11. If the thickness is set too thin, the wear resistance and corrosion resistance will be affected. The improvement is not obvious, and setting the thickness too thick will increase the production cost.
  • the density of the coating 120 may be greater than or equal to 7g/cm 3 , for example, 7.9g/cm 3 to 8.5g/cm 3 .
  • step S23 the housing body 110 is annealed.
  • the hardness of the coating layer 120 can be increased, thereby improving the wear resistance of the coating layer 120 .
  • the hardness of the coating 120 is not less than 900HV0.1.
  • step S24 or step S25 may also be performed.
  • step S24 the plating layer 120 is frosted.
  • the frosted surface can serve as an anti-fingerprint structure to prevent the surface of the coating 120 from being contaminated by fingerprints.
  • the frosted surface can also prevent scratches on the surface of the coating 120 and improve the appearance quality of the optical module.
  • Frosting can be done by shot peening or sand blasting. During the frosting process, the particle size and hardness of the abrasive are reasonably selected, the diameter of the spray gun muzzle is reasonably selected, and the spray air pressure, the distance between the spray gun muzzle and the surface of the coating 120, and the processing time are reasonably set, so that After the frosting process, the roughness Ra of the frosted surface does not exceed 0.6 ⁇ m, so that the gap between the optical module housing 11 and the heat sink 30 is small, and the optical module housing 11 and the heat sink 30 can still quickly exchange heat. .
  • the abrasive may be rounded steel grit.
  • step S25 an anti-fingerprint film 130 is formed on the surface of the plating layer 120.
  • the anti-fingerprint film 130 may be, but is not limited to, a nanoparticle coating, a self-assembled monomolecular film, or an oxide coating.
  • the anti-fingerprint film 130 By forming the anti-fingerprint film 130 on the surface of the coating layer 120 as an anti-fingerprint structure, the surface of the coating layer 120 is prevented from being contaminated by fingerprints.
  • the anti-fingerprint film 130 can also prevent scratches on the surface of the coating 120 and improve the appearance quality of the optical module.
  • the anti-fingerprint film 130 may be formed on any area of the surface of the plating layer 120 that may be touched, or may cover all areas of the surface of the plating layer 120 .
  • Figure 8 is a flow chart of a method for manufacturing an optical module housing provided by an embodiment of the present application. This method is used to make the optical module housing shown in Figure 3 or Figure 4. The method proceeds after step S11.
  • Figure 9 is an optical mode provided by an embodiment of the present application. Schematic diagram of the manufacturing process of the block shell. The figure takes the production of the upper housing 111 as an example to illustrate the manufacturing process of the optical module housing. As shown in Figures 8 and 9, the production method includes:
  • step S31 electroless nickel plating is performed on the surface of the housing body 110 to form a plating layer 120 .
  • the upper housing 111 and the lower housing 112 are separate components, and the upper housing 111 is produced.
  • a plating layer 120 can be formed on the surface of the upper housing body 1101 .
  • the manner of forming the plating layer 120 may be similar to the aforementioned step S22 and will not be described in detail here.
  • the thickness of the plating layer 120 formed in step S31 may be greater than the thickness of the plating layer 120 formed in step S22.
  • the thickness of the plating layer 120 formed in step S31 may be 25 ⁇ m to 50 ⁇ m.
  • step S32 the plating layer 120 is polished.
  • step S31 a thicker plating layer 120 is formed so that sufficient margin is reserved for polishing the plating layer 120 to prevent the local area of the plating layer 120 from being completely removed during the polishing process.
  • the plating layer 120 is polished to reduce the roughness of the plating layer 120, so that at least in the contact area 11a, the roughness Ra of the plating layer 120 does not exceed 0.6 ⁇ m.
  • the thickness of the plating layer 120 after polishing may be 1 ⁇ m to 20 ⁇ m.
  • the plating layer 120 on the outer surface of the upper housing body 1101 can be polished, or the outer surface and the outer surface of the upper housing body 1101 can be polished.
  • the plating 120 on the inner surface is polished.
  • the roughness of the inner surface can be greater than the roughness of the outer surface. Since the inner surface is not exposed and does not come into contact with the radiator, there is no need to control the roughness to a very low level. To reduce workload and reduce costs.
  • polishing the plating layer 120 mechanical polishing and/or laser polishing may be used.
  • the plating layer 120 is first formed on the housing body 110 and then polished. Since the shell body 110 is not polished before forming the plating layer 120 , the surface of the shell body 110 is relatively rough, which allows the plating layer 120 to adhere more closely to the surface of the shell body 110 . Polishing is performed after the plating layer 120 is formed to ensure that the roughness of the plating layer 120 meets the requirements.
  • step S33 the housing body 110 is annealed.
  • Step S33 may be the same as the aforementioned step S22, and will not be described in detail here.
  • step S34 or step S35 may also be performed.
  • step S34 the plating layer 120 is frosted.
  • Step S34 may be the same as the aforementioned step S24, and will not be described in detail here.
  • step S35 the anti-fingerprint film 130 is formed on the surface of the plating layer 120.
  • Step S35 may be the same as the aforementioned step S25 and will not be described in detail here.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un boîtier de module optique (11), comprenant un corps de boîtier (110) et une couche de gaine (120), la couche de gaine (120) étant située sur la surface du corps de boîtier (110) ; et au moins dans une zone de contact (11a), la rugosité Ra de la couche de gaine (120) ne dépassant pas 0,6 µm, et la zone de contact (11a) étant une zone, qui est utilisée pour venir en contact avec un radiateur (30), du boîtier de module optique (11). La rugosité Ra de la couche de gaine (120) dans la zone de contact (11a) est réglée pour ne pas dépasser 0,6 µm, de telle sorte que lorsqu'un module optique (10) est connecté à un connecteur de module optique (20), un espace entre la zone de contact (11a) du boîtier de module optique (11) et le radiateur (30) est plus petit, réduisant ainsi la résistance thermique de contact, facilitant l'échange de chaleur entre le boîtier de module optique (11) et le radiateur (30) et l'accélération de la dissipation de chaleur à partir du module optique (10), et empêchant ainsi la température du module optique (10) d'être trop élevée. L'invention concerne en outre un procédé de fabrication d'un boîtier de module optique, et un module optique (10) et un dispositif de communication optique.
PCT/CN2023/098230 2022-08-31 2023-06-05 Boîtier de module optique et son procédé de fabrication, et module optique et dispositif de communication optique WO2024045737A1 (fr)

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CN202211056496.5A CN117666044A (zh) 2022-08-31 2022-08-31 光模块壳体及其制作方法、光模块和光通信设备
CN202211056496.5 2022-08-31

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1836829A (zh) * 2005-03-25 2006-09-27 鸿富锦精密工业（深圳）有限公司 散热装置制备方法
JP2008227395A (ja) * 2007-03-15 2008-09-25 Mitsubishi Electric Corp サブマウントおよびその製造方法
CN102612302A (zh) * 2012-03-13 2012-07-25 华为技术有限公司 光模块散热装置及通信设备
CN102656758A (zh) * 2009-12-18 2012-09-05 三菱电机株式会社 激光模块
CN107369660A (zh) * 2016-05-12 2017-11-21 台达电子企业管理（上海）有限公司 功率模块及其制造方法
JP2021139365A (ja) * 2020-03-02 2021-09-16 日本ピストンリング株式会社 バルブガイド
CN216485667U (zh) * 2021-12-25 2022-05-10 苏州松翔电通科技有限公司 一种光模块的散热结构及光模块

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1836829A (zh) * 2005-03-25 2006-09-27 鸿富锦精密工业（深圳）有限公司 散热装置制备方法
JP2008227395A (ja) * 2007-03-15 2008-09-25 Mitsubishi Electric Corp サブマウントおよびその製造方法
CN102656758A (zh) * 2009-12-18 2012-09-05 三菱电机株式会社 激光模块
CN102612302A (zh) * 2012-03-13 2012-07-25 华为技术有限公司 光模块散热装置及通信设备
CN107369660A (zh) * 2016-05-12 2017-11-21 台达电子企业管理（上海）有限公司 功率模块及其制造方法
JP2021139365A (ja) * 2020-03-02 2021-09-16 日本ピストンリング株式会社 バルブガイド
CN216485667U (zh) * 2021-12-25 2022-05-10 苏州松翔电通科技有限公司 一种光模块的散热结构及光模块

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