WO2024034195A1 - Film conducteur et procédé de fabrication de film conducteur - Google Patents

Film conducteur et procédé de fabrication de film conducteur Download PDF

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Publication number
WO2024034195A1
WO2024034195A1 PCT/JP2023/016256 JP2023016256W WO2024034195A1 WO 2024034195 A1 WO2024034195 A1 WO 2024034195A1 JP 2023016256 W JP2023016256 W JP 2023016256W WO 2024034195 A1 WO2024034195 A1 WO 2024034195A1
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Prior art keywords
conductive film
conductive
less
die
young
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PCT/JP2023/016256
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English (en)
Japanese (ja)
Inventor
宏行 野中
一喜 中村
治 丹羽
恭資 丸山
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グンゼ株式会社
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Publication of WO2024034195A1 publication Critical patent/WO2024034195A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/30—Extrusion nozzles or dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/88—Thermal treatment of the stream of extruded material, e.g. cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/92—Measuring, controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Definitions

  • the present invention relates to a conductive film and a method for manufacturing the conductive film.
  • Patent Document 1 JP 2019-179732A discloses a conductive film.
  • This conductive film contains a crystalline olefin resin, a thermoplastic elastomer, and a conductive filler.
  • the conductive film may contain an olefin resin from the viewpoints of moldability, chemical resistance, etc. Furthermore, in order to increase the conductivity of the conductive film, it is necessary to include a relatively large amount of conductive filler (for example, conductive carbon filler) in the conductive film. However, a conductive film containing an olefin resin and a relatively large amount of conductive filler is soft and easily deformed, and therefore is not necessarily easy to handle.
  • conductive filler for example, conductive carbon filler
  • the present invention was made to solve such problems, and its purpose is to provide a conductive film that is relatively easy to handle, and a method for manufacturing the conductive film.
  • a conductive film according to an aspect of the present invention includes an olefin resin and a conductive filler.
  • the surface resistivity of this conductive film is 10,000 ⁇ / ⁇ or less.
  • Young's modulus in at least one of MD (Machine Direction) and TD (Traverse Direction) is 1200 MPa or more.
  • the Young's modulus in at least one of MD (Machine Direction) and TD (Traverse Direction) is 1200 MPa or more. Therefore, since this conductive film has a relatively high Young's modulus in at least one of MD and TD, deformation of the conductive film during use is suppressed. As a result, with this conductive film, the handling properties of the conductive film can be improved.
  • Young's modulus in both MD and TD may be 1200 MPa or more.
  • Young's modulus in both MD and TD is 1200 MPa or more. Therefore, since this conductive film has relatively high Young's modulus in both MD and TD, deformation of the conductive film during use is suppressed. As a result, with this conductive film, the handling properties of the conductive film can be improved.
  • the conductive filler may include conductive carbon filler.
  • this conductive film may have a tear strength of 30 kN/m or more.
  • this conductive film tear strength is relatively high, so tearing of the conductive film during use can be suppressed. As a result, with this conductive film, the handling properties of the conductive film can be improved.
  • the weight percent concentration of the conductive filler may be 20 wt% or more and 50 wt% or less.
  • the concentration of the conductive filler is sufficiently high, the electrical resistance value of the conductive film can be suppressed.
  • a method for manufacturing a conductive film according to another aspect of the present invention includes a step of manufacturing a molten material by heating and melting a material containing an olefin resin and a conductive filler, a step of extruding the molten material through a die, and a step of extruding the molten material through a die.
  • the method includes the steps of drawing the molten material extruded from the die at a predetermined speed, and cooling the molten material by contacting the molten material extruded from the die with a cooling roll to produce a conductive film.
  • the predetermined speed is 3 m/min or more and 15 m/min or less.
  • the temperature of the cooling roll is 50°C or higher and 120°C or lower.
  • the surface resistivity of the conductive film is 10000 ⁇ / ⁇ or less.
  • the Young's modulus of the conductive film in at least one of MD and TD is 1200 MPa or more.
  • the drawing speed of the molten material extruded from the die is slow to some extent, and the temperature of the cooling roll is high to some extent.
  • the molten material is gradually cooled, and a conductive film with relatively high crystallinity can be produced.
  • a conductive film with high crystallinity suppresses deformation of the conductive film during use.
  • the handleability of the conductive film can be improved.
  • the present invention it is possible to provide a conductive film that is relatively easy to handle, and a method for manufacturing the conductive film.
  • FIG. 1 is a diagram schematically showing a cross section of a conductive film according to Embodiment 1.
  • FIG. FIG. 1 is a diagram schematically showing the configuration of a conductive film manufacturing apparatus.
  • FIG. 3 is a diagram schematically showing a cross section of a conductive film according to a second embodiment.
  • FIG. 3 is a diagram schematically showing a T-die included in a conductive film manufacturing apparatus according to a second embodiment.
  • FIG. 2 is a diagram schematically showing the shape of a sample used for measuring tear strength.
  • this embodiment according to one aspect of the present invention will be described in detail using the drawings.
  • the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated.
  • each drawing is schematically drawn with objects omitted or exaggerated as appropriate for ease of understanding.
  • FIG. 1 is a diagram schematically showing a cross section of a conductive film 10 according to the first embodiment. As shown in FIG. 1, the conductive film 10 is a single layer film. The thickness of the conductive film 10 is, for example, 25 ⁇ m or more and 100 ⁇ m or less.
  • the conductive film 10 is used, for example, as a charging film or an antistatic film for copying machines and printers, and various other functional films for electrical/electronic equipment and parts. Note that the conductive film 10 may or may not be subjected to surface processing such as corona, plasma, coating, or sputtering.
  • the conductive film 10 contains an olefin resin and a conductive carbon filler. Note that the conductive film 10 may further contain some or all of additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet inhibitor.
  • additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet inhibitor.
  • olefin resins include polypropylene, polymethylpentene, and cyclic polyolefin.
  • polypropylene include homopolypropylene, random polypropylene, block polypropylene, polypropylene having a long chain branched structure, and acid-modified polypropylene.
  • the cyclic polyolefin contains a cyclic olefin component as a copolymerization component, and is not particularly limited as long as it is a polyolefin resin containing a cyclic olefin component in its main chain.
  • cyclic polyolefins include addition polymers of cyclic olefins or hydrogenated products thereof, addition copolymers of cyclic olefins and ⁇ -olefins, or hydrogenated products thereof.
  • the cyclic polyolefin includes those obtained by grafting and/or copolymerizing the above-mentioned polymer with an unsaturated compound having a hydrophilic group.
  • Examples of polar groups include carboxyl groups, acid anhydride groups, epoxy groups, amino groups, amide groups, ester groups, hydroxyl groups, sulfo groups, phosphono groups, and phosphino groups.
  • Examples of unsaturated compounds having polar groups include , (meth)acrylic acid, maleic acid, maleic anhydride, itaconic anhydride, glycidyl (meth)acrylate, alkyl (meth)acrylate (1 to 10 carbon atoms) ester, alkyl maleate (1 to 10 carbon atoms) ester , (meth)acrylamide and 2-hydroxyethyl (meth)acrylate, etc., preferably carboxyl group, acid anhydride group, epoxy group, amino group, amide group, ester group, hydroxyl group, sulfo group, Examples include phosphono and phosphino groups.
  • As the cyclic olefin resin an addition copolymer of a cyclic olefin
  • Examples of conductive carbon fillers include graphite, carbon black (acetylene black, Ketjen black, furnace black, channel black, thermal lamp black, etc.), carbon nanotubes, and mixtures thereof.
  • Examples of forms of conductive carbon filler include powder and fiber.
  • Examples of powdered conductive carbon fillers include carbon black and graphite.
  • Examples of fibrous conductive carbon fillers include nanotubes and carbon fibers.
  • the conductive film 10 contains an olefin resin. Furthermore, the conductive film 10 contains a relatively large amount of conductive carbon filler in order to improve conductivity. For example, the weight percent concentration of the conductive carbon filler in the conductive film 10 is 20 wt% or more and 50 wt% or less. However, in general, a conductive film containing an olefin resin and a relatively large amount of conductive carbon filler is soft and easily deformed, and thus tends not to be necessarily easy to handle.
  • the present inventors have discovered that it is possible to manufacture a conductive film 10 with good handling properties by devising a manufacturing method as described below.
  • the conductive film 10 according to the first embodiment achieves good handling properties, and specifically has the following characteristics.
  • the surface resistivity of the conductive film 10 according to the first embodiment is 10,000 ⁇ / ⁇ or less, preferably 6,000 ⁇ / ⁇ or less, more preferably 4,500 ⁇ / ⁇ or less, and more preferably 3,500 ⁇ / ⁇ . . That is, the conductive film 10 has sufficient conductivity.
  • the Young's modulus of the conductive film 10 in at least one of MD (Machine Direction) and TD (Traverse Direction) is 1200 MPa or more, preferably 1300 MPa or more, more preferably 1500 MPa or more, and more preferably 1600 MPa. That's all. Further, it is more preferable that the Young's modulus of the conductive film 10 in both MD and TD is 1200 MPa or more. Since the conductive film 10 has relatively high elasticity in at least one of the MD and TD, deformation of the conductive film 10 during use is suppressed. As a result, according to the conductive film 10, the handleability of the conductive film can be improved.
  • the tear strength of the conductive film 10 in at least one of the MD and TD is 30 kN/m or more, preferably 40 kN/m or more, more preferably 80 kN/m or more, and even more preferably 110 kN/m. That's all. Since the conductive film 10 has a relatively high tear strength, tearing of the conductive film 10 during use can be suppressed. As a result, according to the conductive film 10, the handleability of the conductive film can be improved.
  • FIG. 2 is a diagram schematically showing the configuration of a manufacturing apparatus 20 for the conductive film 10. As shown in FIG. 2, the manufacturing apparatus 20 includes a T-die 200, cast rolls 210, 220, and a take-up roll 230.
  • the T-die 200 is configured to produce a molten material by heating and melting a material containing an olefin resin and a conductive carbon filler, and extrude the molten material.
  • Cast rolls 210, 220 are configured to cool the extruded molten material and send it downstream.
  • the winding roll 230 is configured to pull and wind up the molten material cooled by the cast rolls 210 and 220 at a predetermined speed.
  • a rolled body of the conductive film 10 is manufactured through a manufacturing process in the manufacturing apparatus 20.
  • the temperature of the cast roll 210 is 50°C or higher and 120°C or lower, preferably 80°C or higher and 120°C or lower.
  • the predetermined speed at which the molten material is pulled by the winding roll 230 is 3 m/min or more and 15 m/min or less, preferably 9 m/min or more and 13 m/min or less.
  • the drawing speed of the molten material extruded from the T-die 200 is slow to some extent, and the temperature of the cast roll 210 is high to some extent.
  • the molten material is gradually cooled, and the conductive film 10 with relatively high crystallinity can be manufactured.
  • the highly crystalline conductive film 10 deformation of the conductive film 10 during use is suppressed.
  • the handleability of the conductive film can be improved.
  • the Young's modulus in at least one of the MD and TD is 1200 MPa or more. Therefore, since the conductive film 10 has relatively high elasticity in at least one of the MD and TD, deformation of the conductive film 10 during use is suppressed. As a result, according to the conductive film 10, the handleability of the conductive film can be improved.
  • the conductive film 10 according to the first embodiment was a single layer film.
  • the conductive film 10A according to the second embodiment is not a single layer film but includes a plurality of layers.
  • differences from the conductive film 10 according to the first embodiment described above will be mainly explained.
  • FIG. 3 is a diagram schematically showing a cross section of a conductive film 10A according to the second embodiment.
  • the conductive film 10A includes a first layer 100A, a second layer 110A, and an intermediate layer 120A sandwiched between the first layer 100A and the second layer 110A.
  • the thickness of the conductive film 10A is, for example, 25 ⁇ m or more and 100 ⁇ m or less.
  • the first layer 100A and the second layer 110A each contain, for example, an olefin resin and a conductive carbon filler. Regarding each of the olefin resin and the conductive carbon filler, the same ones listed in Embodiment 1 above can be applied. Further, each of the first layer 100A and the second layer 110A may further contain some or all of additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet inhibitor.
  • additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet inhibitor.
  • the intermediate layer 120A includes, for example, a resin having higher flexibility than the olefin resin contained in each of the first layer 100A and the second layer 110A, and a conductive carbon filler.
  • a resin having higher flexibility than the olefin resin contained in the first layer 100A and the second layer 110A include LDPE (Low Density Polyethylene) and LLDPE (Linear Low Density Polyethylene).
  • the intermediate layer 120A may further contain some or all of additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet inhibitor, and at least one of other resins.
  • the surface resistivity of the conductive film 10A according to the second embodiment is 10000 ⁇ / ⁇ or less, preferably 6000 ⁇ / ⁇ or less, more preferably 4500 ⁇ / ⁇ or less, and more preferably 3500 ⁇ / ⁇ . . That is, the conductive film 10A has sufficient conductivity.
  • the Young's modulus of the conductive film 10A in at least one of the MD and TD is 1200 MPa or more, preferably 1300 MPa or more, more preferably 1500 MPa or more, and even more preferably 1600 MPa or more. Further, it is more preferable that the Young's modulus of the conductive film 10A in both MD and TD is 1200 MPa or more. Since the conductive film 10A has relatively high elasticity in at least one of the MD and TD, deformation of the conductive film 10A during use is suppressed. As a result, according to the conductive film 10A, the handleability of the conductive film can be improved.
  • the tear strength of the conductive film 10A in at least one of the MD and TD is 30 kN/m or more, preferably 40 kN/m or more, more preferably 80 kN/m or more, and even more preferably 110 kN/m. That's all.
  • the tear strength is relatively high, so that tearing of the conductive film 10A during use can be suppressed.
  • the handleability of the conductive film can be improved.
  • the apparatus for manufacturing conductive film 10A according to the second embodiment differs from the apparatus for manufacturing conductive film 10 20 (FIG. 2) according to the first embodiment described above in the structure of T-die 200.
  • FIG. 4 is a diagram schematically showing a T-die 200A included in a manufacturing apparatus for a conductive film 10A according to the second embodiment.
  • the T-die 200A includes a T-die main body 201 and raw material input parts 240, 250, and 260.
  • Raw materials for forming the first layer 100A are inputted into the raw material input section 240.
  • an olefin resin and a conductive carbon filler are charged into the raw material input section 240.
  • Raw materials for forming the second layer 110A are charged into the raw material input section 260.
  • an olefin resin and a conductive carbon filler are charged into the raw material input section 260.
  • Raw materials for forming the intermediate layer 120A are charged into the raw material input section 250.
  • a resin having higher flexibility than the olefin resin contained in each of the first layer 100A and the second layer 110A for example, LDPE
  • a conductive carbon filler are input into the raw material input section 250. be done.
  • the T-die main body 201 co-extrudes the raw materials input through the raw material input parts 240, 250, and 260, and fuses together the melts of the raw materials input to each raw material input part to form one integral piece. It is configured to produce a molten film (molten material).
  • the molten material coextruded by T-die body 201 is cooled by cast rolls 210, 220 (FIG. 2) and pulled by take-up roll 230, thereby manufacturing conductive film 10A.
  • the conductive film 10A is manufactured by, for example, laminating the first layer 100A, the intermediate layer 120A, and the second layer 110A using a manufacturing apparatus including the T-die 200A.
  • the temperature of the cast roll 210 is, for example, 50°C or more and 120°C or less, preferably 80°C or more and 120°C or less.
  • the predetermined speed at which the molten material is pulled by the take-up roll 230 is 3 m/min or more and 15 m/min or less, preferably 3 m/min or more and 12 m/min or less.
  • the drawing speed of the molten material extruded from the T-die 200A is slow to some extent, and the temperature of the cast roll 210 is high to some extent.
  • the molten material is gradually cooled, and the conductive film 10A with relatively high crystallinity can be manufactured.
  • the highly crystalline conductive film 10A deformation of the conductive film 10A during use is suppressed.
  • the handleability of the conductive film can be improved.
  • the Young's modulus in at least one of the MD and TD is 1200 MPa or more. Therefore, since the conductive film 10A has relatively high elasticity in at least one of the MD and TD, deformation of the conductive film 10A during use is suppressed. As a result, according to the conductive film 10A, the handleability of the conductive film can be improved.
  • the conductive film 10 may further contain at least one of LDPE and LLDPE.
  • the conductive film 10 according to the first embodiment is a single-layer film
  • the conductive film 10A according to the second embodiment is a three-layer film
  • the layer structure of the conductive film is limited to this. Not done.
  • the conductive film may be a two-layer film, or may be a four-layer film or more. Any layer structure may be used as long as the surface resistivity is 10,000 ⁇ / ⁇ and the Young's modulus in at least one of MD and TD is 1,200 MPa or more.
  • Each conductive film of Examples 1-7 was manufactured using the manufacturing apparatus 20 shown in FIG. 2.
  • Each of PP A, PP B, PP C, and PP D shown below is polypropylene and has different melting points. Specifically, the melting point of PP A is "167.2", the melting point of PP B is "156.2”, the melting point of PP C is “158.5”, and the melting point of PP D is "161.0". Further, CB a was acetylene black, and CB b was furnace black.
  • the melting point was measured by differential scanning calorimetry (DSC) measurement for each resin in accordance with "JIS K 7122-2012 Method for measuring heat of transition of plastics," with the peak top of the endothermic peak taken as the melting point. In addition, if two peaks were observed, the higher temperature side was taken as the melting point.
  • DSC differential scanning calorimetry
  • the conductive film of Example 1 was manufactured by heating and melting PP B and CB a and extrusion molding.
  • Each of the conductive films of Examples 2-4 was manufactured by heating and melting PP B and CB b and extrusion molding.
  • the conductive film of Example 5 was manufactured by heating and melting PPC and CBa and extrusion molding.
  • the conductive film of Example 6 was manufactured by heating and melting PP D and CB a and extrusion molding.
  • the conductive film of Example 7 was manufactured by heating and melting PP B, LDPE, and CB a and extrusion molding.
  • the conductive film of Example 8 was manufactured using a manufacturing apparatus including the T-die 200A shown in FIG. 4 (other than the T-die 200 has the configuration of the manufacturing apparatus 20 shown in FIG. 2). Specifically, the conductive film of Example 8 was manufactured by coextrusion. Each of the first and second layers of the conductive film of Example 8 was formed using PP B and CB a. The intermediate layer of the conductive film of Example 8 was formed with PP B, LDPE and CB a.
  • the weight percent concentration (wt%) of the filler, the layer structure of the conductive film, the total thickness of the conductive film ( ⁇ m), and the drawing speed by the winding roll 230 (m/min) ) and the temperature (°C) of the cast roll (cooling roll) 210 were as shown in Table 1 below.
  • Comparative example The conductive films of Comparative Examples 1 and 2 were manufactured using the manufacturing apparatus 20 shown in FIG. 2.
  • a conductive film of Comparative Example 1 was manufactured by heating and melting LDPE and CB a and extrusion molding.
  • a conductive film of Comparative Example 2 was manufactured by heating and melting PP A and CB a and extrusion molding.
  • the tear strength in MD was measured for each of the conductive films of Examples 1-8 and Comparative Examples 1 and 2. Specifically, the tear strength of each conductive film was measured by a method based on JIS K 6732.
  • FIG. 5 is a diagram schematically showing the shape of a test piece (sample) used for measuring tear strength.
  • tear strength right angle tear strength was measured.
  • the test piece cut out as shown in FIG. 5 is accurately attached to a tensile testing machine with the axial direction of the test piece matching the grip direction of the testing machine.
  • an Autograph Shiadzu precision universal testing machine Autograph AG-X 500N was used.
  • the test speed was 200 mm/min, and the strength at the time of cutting the test piece was measured.
  • each of the conductive films of Examples 1-8 had a higher Young's modulus and higher tear strength than each of the conductive films of Comparative Examples 1 and 2. Further, in each of the conductive films of Examples 1-8, the surface resistivity was 10000 ⁇ / ⁇ or less, and the Young's modulus in at least one of the MD and TD was 1200 MPa or more.

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Conductive Materials (AREA)

Abstract

Ce film conducteur comprend une résine d'oléfine et une charge conductrice. Le film conducteur a une résistivité de surface inférieure ou égale à 10000 Ω/□. Le module de Young dans la direction machine (MD) et/ou la direction transversale (TD) du film conducteur est supérieur ou égal à 1200 MPa.
PCT/JP2023/016256 2022-08-09 2023-04-25 Film conducteur et procédé de fabrication de film conducteur WO2024034195A1 (fr)

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JP2022126849A JP2024024196A (ja) 2022-08-09 2022-08-09 導電性フィルム、及び、導電性フィルムの製造方法
JP2022-126849 2022-08-09

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JP2012097201A (ja) * 2010-11-02 2012-05-24 Tosoh Corp ポリエチレン樹脂組成物
WO2012137828A1 (fr) * 2011-04-04 2012-10-11 株式会社ダイセル Composition photodurcissable, pellicule composite conductrice et leur procédé de fabrication
JP2012204292A (ja) * 2011-03-28 2012-10-22 Daicel Corp 導電性フィルム及びその製造方法
WO2017104482A1 (fr) * 2015-12-16 2017-06-22 三菱瓦斯化学株式会社 Composition de résine, film l'utilisant et ruban support
JP2021004329A (ja) * 2019-06-27 2021-01-14 グンゼ株式会社 巻取体

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001105545A (ja) * 1999-10-13 2001-04-17 Kureha Chem Ind Co Ltd 導電性延伸多層フィルム及びその製造方法
JP2005232227A (ja) * 2004-02-17 2005-09-02 Tosoh Corp ポリエチレン樹脂組成物、それからなるフィルム及びその積層体
JP2007246607A (ja) * 2006-03-14 2007-09-27 Kureha Corp フィルム、シームレスベルト、導電性フィルム、導電性シームレスベルト及びこれらの製造方法
JP2012097201A (ja) * 2010-11-02 2012-05-24 Tosoh Corp ポリエチレン樹脂組成物
JP2012204292A (ja) * 2011-03-28 2012-10-22 Daicel Corp 導電性フィルム及びその製造方法
WO2012137828A1 (fr) * 2011-04-04 2012-10-11 株式会社ダイセル Composition photodurcissable, pellicule composite conductrice et leur procédé de fabrication
WO2017104482A1 (fr) * 2015-12-16 2017-06-22 三菱瓦斯化学株式会社 Composition de résine, film l'utilisant et ruban support
JP2021004329A (ja) * 2019-06-27 2021-01-14 グンゼ株式会社 巻取体

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