WO2024033988A1 - Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique - Google Patents

Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique Download PDF

Info

Publication number
WO2024033988A1
WO2024033988A1 PCT/JP2022/030328 JP2022030328W WO2024033988A1 WO 2024033988 A1 WO2024033988 A1 WO 2024033988A1 JP 2022030328 W JP2022030328 W JP 2022030328W WO 2024033988 A1 WO2024033988 A1 WO 2024033988A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical waveguide
optical
groove
substrate
optical fiber
Prior art date
Application number
PCT/JP2022/030328
Other languages
English (en)
Japanese (ja)
Inventor
貴 山田
百合子 川村
Original Assignee
日本電信電話株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電信電話株式会社 filed Critical 日本電信電話株式会社
Priority to PCT/JP2022/030328 priority Critical patent/WO2024033988A1/fr
Publication of WO2024033988A1 publication Critical patent/WO2024033988A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device

Definitions

  • the present invention relates to a connection structure between an optical fiber and an optical waveguide, and a method for manufacturing an optical waveguide substrate.
  • An optical waveguide structure using silicon photonics technology is created by depositing an insulating layer (SiO 2 ) on a Si substrate and processing the Si layer in the SiO 2 layer into a desired pattern using known photolithography and etching. It is formed.
  • the optical waveguide structure constitutes an optical waveguide substrate, and on the surface of the optical waveguide substrate, electrical wiring for driving a photodiode or the like and pads for fixing the substrate are provided with a metal layer made of Al or Au.
  • the production of such optical waveguide substrates is carried out using silicon photonics, which is a technology that applies microfabrication technology used in the semiconductor industry to integrate elements on a silicon substrate to fabricate optical elements. .
  • Such an optical waveguide substrate is also called a silicon photonics optical waveguide substrate.
  • optical polishing of Si substrates is performed in the same way as the polishing process of ordinary metal products, by changing the type and size of the abrasive grains and using a rough polishing process, a medium polishing process, and a fine silica particle polishing process. It is carried out through a final polishing process.
  • the polishing process is performed using a large-scale polishing apparatus with drainage equipment, and requires a large amount of work time for each polishing process.
  • the SiO 2 cladding layer above the Si waveguide layer of the silicon photonics waveguide substrate is very thin, about several ⁇ m, and is a hard layer. Therefore, there is a possibility that small chips or cracks may occur in the upper layer of the optical waveguide substrate due to chipping that occurs during the above-mentioned polishing process. If chips or cracks occur on the end face of the optical waveguide, optical connection loss will occur due to diffused reflection and the like when connecting optical fibers.
  • a plurality of optical fibers and an end face of an optical waveguide are connected and fixed using an optical fiber array component.
  • the optical fiber array component it is possible to align a plurality of optical fibers with high precision according to the spacing of the optical waveguides, and to optically align and fix the plurality of optical fibers all at once.
  • Typical optical fiber array components are made by placing uncoated optical fibers on a glass substrate with a highly precise V-groove, and placing the optical fibers in close contact with the slope of the V-groove using a glass plate directly above it.
  • Non-Patent Document 1 in order to realize a low-loss optical connection, the parallelism between the connection end surfaces of the optical fiber array and the optical waveguide substrate must be adjusted.
  • Such a process takes several minutes to about 10 minutes, including alignment time and ultraviolet irradiation time from installation of the members.
  • the active alignment method of the optical waveguide end face using a known optical fiber array requires complicated processes from fabrication including polishing to alignment and fixing, and the fabrication time and cost associated with the process are high. It becomes a challenge.
  • flip-chip mounting requires some additional means to confirm the position of the optical waveguide before active alignment.
  • the present disclosure has been made in view of the above points, and provides a connection structure for an optical fiber and an optical waveguide, which allows the optical fiber and the optical waveguide to be easily and quickly aligned and connected.
  • the present invention relates to a method of manufacturing an optical waveguide substrate.
  • an optical waveguide and optical fiber connection structure includes an optical waveguide formed on an optical waveguide substrate having a silicon substrate, and an optical waveguide formed in the optical waveguide substrate.
  • the groove extends in the extending direction of the waveguide, and the groove portion is a V-groove having a V-shaped cross section perpendicular to the surface direction of the optical waveguide substrate, and the depth of the V-shape of the V-groove is equal to the depth of the V-shaped groove.
  • the cores of the optical fibers arranged in the V-groove are set to coincide with the cores of the optical waveguide.
  • a method for manufacturing an optical waveguide substrate includes an optical waveguide substrate including a silicon substrate and an optical waveguide formed on the silicon substrate, such that a groove or groove is formed so that an end of the optical waveguide is exposed. forming a discharge rod insertion portion including at least one of the through holes; and removing a portion of the cladding layer in a region facing the optical waveguide across the discharge rod insertion portion to form a cladding layer-free region.
  • the groove being a V-groove having a V-shaped cross section perpendicular to the surface direction of the optical waveguide substrate;
  • the depth of the V-shape of the V-groove is set so that the core of the optical fiber arranged in the V-groove and the core of the optical waveguide coincide with each other.
  • connection structure between an optical fiber and an optical waveguide and a method for manufacturing an optical waveguide substrate, in which the optical fiber and the optical waveguide can be aligned and connected easily and in a short time. be able to.
  • FIG. 1 is a perspective view for explaining a fiber array according to a first embodiment of the present disclosure.
  • (a) is a top view of the optical fiber array shown in FIG. 1, and
  • (b) is a sectional view along arrows IIb and IIb in (a).
  • 2(a) is a sectional view taken along arrows IIIa and IIIa in FIG. 2(a)
  • FIG. 2(b) is a diagram showing an end surface where the optical waveguide shown in FIG. 2(a) is exposed.
  • FIG. 7 is a diagram for explaining discharge fusion according to the second embodiment.
  • FIG. 3 is a perspective view for explaining an optical fiber array according to a second embodiment of the present disclosure. 6 is an enlarged view showing the discharge rod insertion portion shown in FIG. 5.
  • FIG. 5 is a perspective view for explaining a fiber array according to a first embodiment of the present disclosure.
  • FIG. 7 is a diagram for explaining discharge fusion according to the second embodiment.
  • FIG. 3 is a diagram for explaining a method for manufacturing an optical waveguide substrate according to the first and second embodiments of the present disclosure.
  • connection structure between any optical fiber and an optical waveguide includes an optical waveguide formed on an optical waveguide substrate having a silicon (hereinafter also referred to as Si) substrate.
  • the optical waveguide substrates of the first embodiment and the second embodiment including a Si substrate are silicon photonics optical waveguides in which at least an optical waveguide is formed on a Si substrate using microfabrication technology used in the semiconductor industry.
  • the connection structure refers to a structure in an optical waveguide substrate that is capable of connecting an optical fiber and an optical waveguide, or that includes such a structure and an optical fiber.
  • the method of manufacturing an optical waveguide substrate of the present disclosure is a method of manufacturing an optical waveguide substrate including such a structure.
  • FIG. 1 is a perspective view for explaining a connection structure (hereinafter also simply referred to as "connection structure") 1 between an optical waveguide 14 and an optical fiber 20 according to a first embodiment of the present disclosure.
  • 2 shows a state in which a plurality of optical fibers 20 are being arranged.
  • 2(a) is a top view of the connection structure 1 shown in FIG. 1
  • FIG. 2(b) is a cross-sectional view along arrows IIb and IIb in FIG. 2(a)
  • FIG. 3(b) is a sectional view taken along arrow lines IIIa and IIIa in
  • FIG. 3(b) is a sectional view opposite to the section shown in FIG. 3(a).
  • the upper surface 12a side shown in the figures is referred to as the "upper” and lower surface of the connection structure 1.
  • the side 12f is defined as the "bottom” of the connection structure 1, and the vertical direction and the direction intersecting the optical axis direction of the optical waveguide 14 are defined as "left and right.”
  • the connection structure 1 of the first embodiment has an optical waveguide substrate 12 that includes an optical waveguide 14 and a V-groove 16 that is a groove in which the optical fibers 20 are arranged.
  • the optical waveguide substrate 12 includes a Si substrate, a cladding layer of oxide (hereinafter also referred to as "SiO 2 ") formed on the Si substrate, and a core made of Si.
  • the optical waveguide 14 is a silicon photonics optical waveguide formed using silicon photonics technology.
  • both the cladding layer and the core are included, that is, the core is indicated by the reference numeral 14. Only a cladding layer is formed at a portion of the optical waveguide substrate 12 where a core is not formed, except for a part.
  • the optical waveguide substrate 12 is located between an optical circuit chip 121 on which the optical waveguide 14 is formed, an optical fiber array 122 on which the V-groove 16 is formed, and between the optical circuit chip 121 and the optical fiber array 122.
  • the discharge rod insertion portion 123 includes at least one of a groove or a through hole extending in a direction crossing the extending direction of the discharge rod 14 .
  • the optical fiber array 122 of the optical waveguide substrate 12 has an optical waveguide non-forming area Ans i .
  • the optical waveguide non-forming region Ans i is a region where a portion of the cladding layer on the optical fiber array 122 is removed by etching to expose the Si substrate.
  • the V-groove 16 is formed in the optical waveguide non-forming region Ans i , is formed on an extension line of the optical waveguide 14 in the extending direction, and extends in the extending direction of the optical waveguide 14 .
  • the V-groove 16 has a V-shaped cross section perpendicular to the surface direction of the optical waveguide substrate 12. As shown in FIG. Since the V-groove 16 is formed on the extension line of the optical waveguide 14 in the extending direction and extends in the extending direction of the optical waveguide 14, the V-groove 15 and the core of the optical waveguide 14 are connected to the 2nd line in the optical waveguide substrate 12. The dimensional positions will now correspond. Note that when forming the V groove 16 using SiO 2 as a cladding layer of the optical fiber array 122 as a mask, a striped SiO 2 mask remains on the upper surface 12c in FIG. 3(a). The depth of the V-groove 16 is set so that the core 20aa of the optical fiber 20 arranged in the V-groove matches the core of the optical waveguide 14. The settings will be detailed later.
  • the V-groove 16 of the first embodiment is formed using the crystal plane of the Si substrate of the optical waveguide substrate 12.
  • the opening angle of the V-groove 16 differs depending on the crystal plane of the Si substrate.
  • the opening angle of the V-groove 16 formed by cutting out the Si substrate is 70.6°.
  • the fixing positions of the plurality of optical fibers 20 can be made constant.
  • the first embodiment can establish a low-loss optical connection and omit an optical polishing process and an active alignment process.
  • Such a V-groove 16 is formed by cutting out the Si substrate and the SiO 2 layer on the Si substrate using known photolithography and etching. Note that wet etching using an alkaline aqueous solution is used for etching.
  • the optical waveguide substrate 12 has a rectangular shape when viewed from above.
  • the optical waveguide substrate 12 includes the Si substrate, the SiO 2 layer formed on the surface of the Si substrate, and the Si core layer partially formed in the SiO 2 layer.
  • the optical waveguide substrate 12 is separated into an optical circuit chip 121 and an optical fiber array 122 by a discharge rod insertion portion 123.
  • the discharge rod insertion portion 123 is formed between the optical circuit chip 121 and the optical fiber array 122.
  • the discharge rod insertion portion 123 of the first embodiment is formed on the entire surface between the optical circuit chip 121 and the optical fiber array 122.
  • Two side surfaces of the optical fiber array 122 perpendicular to the extending direction of the optical waveguide 14 are referred to as side surfaces 12ea and 12eb, respectively.
  • the discharge rod insertion portion 123 forms a groove shape by being thinner than the optical circuit chip 121 and the optical fiber array 122.
  • the first embodiment is not limited to making the thickness of the discharge rod insertion part 123 thinner than the optical circuit chip 121 and the optical fiber array 122.
  • the discharge rod insertion portion 123 may be a through hole that penetrates the optical waveguide substrate 12. When the discharge rod insertion portion 123 penetrates the optical waveguide substrate 12, only the connection portion between the optical fiber 20 and the optical waveguide 14 protrudes from the discharge rod insertion portion 123.
  • the distance between the optical circuit chip 121 and the optical fiber array 122 becomes relatively narrow at the location where the optical waveguide 14 and the V-groove 16 face each other. That is, the portion of the optical circuit chip 121 where the optical waveguide 14 is formed protrudes more toward the optical fiber array 122 than the other portions.
  • a plurality of optical waveguides 14 are formed in the optical circuit chip 121, and the core 14a of the optical waveguide 14 is exposed on the end face 12b of the optical circuit chip 121 facing the optical fiber array 122. are doing.
  • the optical waveguide 14 is composed of an under-cladding layer 14c made of SiO 2 , an over-cladding layer 14b, and a core 14a made of Si. Since such a configuration is well known, further explanation will be omitted.
  • the plurality of V-grooves 16 extend from the side surface 12ea to the side surface 12eb, and are formed such that their intervals and positions correspond to the position of the core 14a exposed on the end surface 12b of the optical waveguide 14.
  • "Corresponding to the position of the core of the optical waveguide” refers to aligning the core 20aa of the optical fiber 20 set in the V-groove 16 with the position of the core 14a of the optical waveguide 14.
  • the position of the optical waveguide 14 refers to a position determined by plane coordinates in the surface direction (upper surface 12a, lower surface 12f) of the optical waveguide substrate 12.
  • V-shaped depth refers to the depth of the deepest part of the V-groove 16.
  • an optical fiber 20a that has been cleaved with the coating 20b removed (hereinafter referred to as "cleave-cut fiber") is dropped into the V-groove 16, and the slope of the V-groove 16 is cut. 16a and 16b so as to be in contact with each other for optical alignment.
  • the slopes 16a and 16b are surfaces that intersect at the deepest portion 16c of the V-groove 16.
  • the height of the cleave cut fibers 20a arranged in the V-groove 16 is set by the depth of the deepest part 16c of the V-groove 16 and the angle (opening angle) of the slopes 16a, 16b.
  • the deepest part 16c of the V-groove 16 and the slopes 16a, 16b are arranged as follows. Set it as follows.
  • the cleave cut fiber 20 is fixed in contact with the slopes 16a and 16b.
  • the depth of the deepest part 16c (the opening angle is uniquely determined) is set so that the height h from the deepest part 16c to the core 20aa matches the height of the core 14a on the optical waveguide 14 side.
  • the "height" from the deepest part 16c to the core 20aa refers to the length of the optical waveguide substrate 12 in the vertical direction, and the height reference must be the same on the optical fiber 20 side and the optical waveguide 14 side.
  • the optical fibers 20 may be tape fibers arranged in advance at equal intervals.
  • the opening angle of the slopes 16a and 16b depends on the crystal plane of the Si substrate in which the V-groove 16 is formed.
  • the Si substrate is etched to form a plurality of V-grooves 16, so that the opening angles are uniform and the positions of the cores 20aa of the optical fibers 20 arranged in the V-grooves 16 can be aligned.
  • optical alignment is performed by arranging the optical fibers 20 in the V-groove 16.
  • FIG. 4 is a diagram for explaining discharge fusion performed after alignment of the optical fibers 20 of all ports.
  • the discharge rods 3a and 3b are inserted into the discharge rod insertion portion 123 from the left and right sides (both sides) of the portion where the core 20aa of the optical fiber 20 and the core of the optical waveguide 14 contact. It is inserted and electrical discharge machining is performed by applying electrical discharge A to the contacting part. By performing electric discharge machining, the SiO 2 layer around the optical waveguide 14 and the glass of the optical fiber 20 are melted. The optical waveguide 14 and the optical fiber 20 are connected and fixed by melting, thereby realizing a connection structure between the optical waveguide substrate 12 and the optical fiber 20 with low coupling loss.
  • FIG. 5 is a perspective view for explaining the connection structure 4 of the second embodiment, and shows a state in which a plurality of optical fibers 20 are arranged in the connection structure 4.
  • FIG. 6 is an enlarged view of the discharge rod insertion portion 423 shown in FIG. 5.
  • FIG. 7(a) is a top view of the connection structure 4 shown in FIG. 5, and
  • FIG. 7(b) is a sectional view taken along the arrows VIb and VIb in FIG. 7(a).
  • the connection structure 4 includes an optical waveguide substrate 42 .
  • the upper surface of the optical waveguide substrate 42 is referred to as an upper surface 42a, and the lower surface is referred to as a lower surface 42f.
  • the upper surface 42a side will be described as the "upper" side of the connection structure 4, and the lower surface 42f side will be described as the "lower" side of the connection structure 4.
  • the optical waveguide substrate 42 includes a Si substrate and an optical waveguide 14 formed on the Si substrate, as in the first embodiment.
  • the optical waveguide substrate 42 has an optical circuit chip 421, a discharge rod insertion portion 423, and an optical fiber array 422.
  • the discharge rod insertion portion 423 is configured to insert the discharge rods 3a and 3b from above and below the optical waveguide substrate 42 when connecting the optical fiber 20 and the optical waveguide 14 by discharge fusion.
  • the discharge rod insertion portion 423 includes an optical waveguide portion 423a that leaves at least the optical waveguide 14 of the optical circuit chip 421, and a through hole portion 423b that penetrates the optical waveguide substrate 42. Further, the optical circuit chip 421 and the optical fiber array 422 are connected, and the discharge rod insertion portion 423 is included in the optical waveguide substrate 42.
  • a V-groove 16 extending in the extending direction of the optical waveguide 14 is formed in the optical fiber array 422.
  • the V-groove 16 is formed, as in the first embodiment, by removing the cladding layer in the region of the optical fiber array 422 where the V-groove 16 is to be formed, and etching the Si substrate.
  • the V-groove 16 is formed by etching the ⁇ 100> plane of Si, and the opening angle thereof is set to 70.6°.
  • the cleave cut fiber 20a is fixed so as to be in contact with the slopes 16a, 16b of the V-groove 16, and optically aligned.
  • the optical fibers 20 may be tape fibers.
  • the discharge rod insertion portion 423 of the second embodiment includes an optical waveguide portion 423a in which the SiO 2 layer including the optical waveguide 14 remains, and a through hole portion 423b.
  • the cleave cut fiber 20a protrudes toward the through hole portion 423b and comes into contact with the end surface of the optical waveguide 14 exposed from the optical waveguide portion 423a.
  • FIG. 8 is a perspective view for explaining a state in which discharge fusion is performed in the second embodiment.
  • the discharge rods 3a and 3b are sandwiched in the thickness direction of the optical waveguide substrate 42. Place it like this. That is, the discharge rods 3a and 3b are arranged in the vertical direction of the optical waveguide substrate 42a, and the discharge A is applied to the abutting portion of the cleave cut fiber 20a and the optical waveguide 14 to melt it.
  • the area of the discharge rod insertion portion 423 may be smaller than the discharge rod insertion portion 123 of the first embodiment, and the chip area can be reduced. It is advantageous to make it small.
  • the second embodiment is also advantageous in reducing the area in the planar direction occupied by the discharge welding mechanism during discharge welding.
  • FIG. 9 is a flowchart for explaining the process of manufacturing an optical waveguide substrate, which is common to the first embodiment and the second embodiment.
  • the cladding layer in the region where the V groove is to be formed is removed (step S901).
  • a V-groove is formed (step S902).
  • Removal of the cladding layer is performed by masking the entire surface other than the region where the V-groove is to be formed with a resist layer, and forming a stripe pattern of the resist layer on the cladding layer in the region where the V-groove is to be formed.
  • the stripe pattern is transferred to the cladding layer in the area where the V groove is to be formed.
  • a discharge rod insertion portion including a groove for electrostatic fusion or a through hole is formed in the optical waveguide substrate (step S903).
  • the discharge rod insertion portion can be formed by, for example, known deep etching.
  • the cleave cut fibers 20a are arranged in the V groove (step S904). Then, the portions where the cores 20aa of the arranged cleave cut fibers 20a and the core 14a of the optical waveguide core 14 come into contact are electrostatically fused, and the optical fibers and the optical waveguide are connected (step S905).
  • the method for manufacturing an optical waveguide substrate described above can connect an optical waveguide and an optical fiber in a shorter time than bonding an optical waveguide and an optical fiber using a photocuring adhesive. This point is advantageous in shortening the time from alignment to connection between the optical waveguide and the optical fiber.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

Formée est une structure de connexion (1) entre une fibre optique et un guide d'ondes optique, la structure de connexion comprenant : un guide d'ondes optique (14) qui est formé sur un substrat de guide d'ondes optique (12) ayant un substrat de silicium ; et une rainure en V (16) qui est formée par découpe d'une région de non-formation de guide d'ondes optique, qui est une région du substrat de silicium du substrat de guide d'ondes optique (12) et qui n'est pas formée avec le guide d'ondes optique (14). Une partie de rainure est formée sur une ligne d'extension du guide d'ondes optique dans une direction d'extension et s'étend dans la direction d'extension du guide d'ondes optique, la rainure en V (16) a une section en forme de V orthogonale à la direction de plan du substrat de guide d'ondes optique (12), et la profondeur de la forme en V de la rainure en V (16) est réglée de telle sorte que le noyau d'une fibre optique (20) disposée dans la rainure en V (16) coïncide avec le noyau du guide d'ondes optique.
PCT/JP2022/030328 2022-08-08 2022-08-08 Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique WO2024033988A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/030328 WO2024033988A1 (fr) 2022-08-08 2022-08-08 Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/030328 WO2024033988A1 (fr) 2022-08-08 2022-08-08 Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique

Publications (1)

Publication Number Publication Date
WO2024033988A1 true WO2024033988A1 (fr) 2024-02-15

Family

ID=89851247

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/030328 WO2024033988A1 (fr) 2022-08-08 2022-08-08 Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique

Country Status (1)

Country Link
WO (1) WO2024033988A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2846777A1 (de) * 1978-10-27 1980-05-08 Licentia Gmbh Verfahren und anordnung zur herstellung eines spleisses
JPS61106904U (fr) * 1984-12-19 1986-07-07
JPH0194305A (ja) * 1987-10-07 1989-04-13 Hitachi Ltd 光回路装置
JPH01126608A (ja) * 1987-11-11 1989-05-18 Hitachi Ltd 光入出力装置
JPH02146507A (ja) * 1988-11-28 1990-06-05 Sumitomo Electric Ind Ltd 光ファイバｖ溝台
JPH04336508A (ja) * 1991-03-08 1992-11-24 Bicc Plc 光ファイバの融接接続方法とその装置
JPH095569A (ja) * 1995-06-23 1997-01-10 Hitachi Cable Ltd 導波路型光部品及びその製造方法並びに導波路

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2846777A1 (de) * 1978-10-27 1980-05-08 Licentia Gmbh Verfahren und anordnung zur herstellung eines spleisses
JPS61106904U (fr) * 1984-12-19 1986-07-07
JPH0194305A (ja) * 1987-10-07 1989-04-13 Hitachi Ltd 光回路装置
JPH01126608A (ja) * 1987-11-11 1989-05-18 Hitachi Ltd 光入出力装置
JPH02146507A (ja) * 1988-11-28 1990-06-05 Sumitomo Electric Ind Ltd 光ファイバｖ溝台
JPH04336508A (ja) * 1991-03-08 1992-11-24 Bicc Plc 光ファイバの融接接続方法とその装置
JPH095569A (ja) * 1995-06-23 1997-01-10 Hitachi Cable Ltd 導波路型光部品及びその製造方法並びに導波路

Similar Documents

Publication Publication Date Title
KR960014123B1 (ko) 광도파로와 광파이버의 접속방법
JPH0829638A (ja) 光導波路・光ファイバ接続構造及び光導波路・光ファイバ接続方法並びに光導波路・光ファイバ接続に使用される光導波路基板及び同基板の製造方法並びに光導波路・光ファイバ接続に使用されるファイバ基板付き光ファイバ
JPH05333231A (ja) 光導波路と光ファイバの接続方法
US6728450B2 (en) Alignment of optical fibers with an optical device
US11415754B2 (en) Fiber array spacers, optical assemblies incorporating fiber array spacers, and methods of fabricating the same
US11460637B2 (en) Optical connection substrates for passive fiber to waveguide coupling
JP4752092B2 (ja) 光導波路接続構造及び光素子実装構造
JPH03265802A (ja) 埋め込み型石英系光導波路およびその製造方法
WO2024033988A1 (fr) Structure de connexion entre une fibre optique et un guide d'ondes optique, et procédé de fabrication d'un substrat de guide d'ondes optique
JPH08313756A (ja) 光ファイバ固定溝付き平面光回路部品およびその作製方法
JP2771167B2 (ja) 光集積回路の実装方法
JP2001324647A (ja) 光ファイバアレイ、光導波路チップ及びこれらを接続した光モジュール
JPH0234806A (ja) 分波合波器及びその製造方法
JP2943530B2 (ja) 光接続部品及びその製造方法
WO2019176561A1 (fr) Module de fibre
JPS61260208A (ja) フアイバ・ガイド付光導波路
JP6345153B2 (ja) Ｓｉフォトニクス光波回路及びその製造方法
JPH0627334A (ja) 光導波路
WO2023105717A1 (fr) Substrat de guide d'ondes optique, dispositif optique et procédé de fabrication pour dispositif optique
JP3950792B2 (ja) 平面光回路部品及びその製造方法
KR100303314B1 (ko) 평면광파회로 소자 제조 방법
JPH11183750A (ja) 光デバイス用光導波路モジュールおよび光デバイスの製造方法
JP2009098432A (ja) 貼り合わせ多チャンネル光路変換素子とその作製方法
JP3194311B2 (ja) ハイブリッド光導波回路
JPH04204510A (ja) 導波路型光部品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22954910

Country of ref document: EP

Kind code of ref document: A1