WO2023246418A1 - 电路板组件、电子设备及电路板组件的制作方法 - Google Patents

电路板组件、电子设备及电路板组件的制作方法 Download PDF

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Publication number
WO2023246418A1
WO2023246418A1 PCT/CN2023/096208 CN2023096208W WO2023246418A1 WO 2023246418 A1 WO2023246418 A1 WO 2023246418A1 CN 2023096208 W CN2023096208 W CN 2023096208W WO 2023246418 A1 WO2023246418 A1 WO 2023246418A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
substrate
chip
solder
area
Prior art date
Application number
PCT/CN2023/096208
Other languages
English (en)
French (fr)
Inventor
梁英
何大鹏
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023246418A1 publication Critical patent/WO2023246418A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Definitions

  • the present application relates to the technical field of circuit board manufacturing, and in particular to a circuit board component, electronic equipment and a manufacturing method of a circuit board component.
  • chips are first prepared using wafers and substrates, and then the chips are welded to the Printed Circuit Board (PCB).
  • PCB Printed Circuit Board
  • the substrate inevitably warps.
  • the warpage of the substrate is large, and the chip is not feasible to be welded to the PCB. Therefore, the warpage of the substrate needs to be reduced.
  • the substrate 11 is usually shaped to reduce the warpage of the substrate 11 so that the chip can be welded to the PCB 21 .
  • the present application provides a circuit board component, an electronic device and a manufacturing method of a circuit board component to reduce defects such as tin connection and open soldering during the welding process of the circuit board and the substrate.
  • the present application provides a circuit board assembly, including: a stacked circuit board and a chip, and a support member located between the circuit board and the chip, wherein: the chip includes a stacked substrate and a wafer, and is fixed between the substrate and the wafer
  • the chip includes a stacked substrate and a wafer, and is fixed between the substrate and the wafer
  • the first solder the substrate is closer to the circuit board than the wafer
  • the substrate includes a first surface away from the circuit board and a second surface facing the circuit board, the area of the first surface is greater than the projected area of the wafer on the first surface, the first surface It includes a first area and a second area, the first area is not provided with a carrying structure, and the chip is fixed to the second area through a first solder.
  • the first surface of the substrate facing away from the circuit board includes a first area and a second area, and no load-bearing structure is provided on the first area, after the chip is fixed on the circuit board, A pressure component can be placed on the first area, followed by reflow soldering.
  • the substrate and the first solder and filler glue located between the chip and the substrate are softened at high temperature, and the pressure component can provide the substrate with a force to move the substrate toward the circuit board under the action of its own gravity. .
  • the support member Since there is a support member between the circuit board and the chip, and the substrate in the chip is closer to the circuit board than the chip, the support member is located between the substrate and the circuit board, and the support member can provide the substrate with a force in the direction away from the circuit board. .
  • the base plate is shaped under the action of the pressure component and the support member, so that it has better flatness.
  • the support member can also limit the displacement of the substrate toward the circuit board, thereby reducing tin connection defects between the circuit board and the substrate. Since the substrate has good flatness, it can also reduce the occurrence of tin connection defects between the circuit board and the substrate. Open welding defects.
  • the cost of the circuit board assembly can be reduced.
  • the chip of the present application has smaller stiffness and greater flexibility, thus making it easier for the substrate to be deformed.
  • the number of support members is multiple, and at least two of the multiple support members have the same size along a first direction, and the first direction is the stacking direction of the circuit board and the chip. Since the support member is located between the substrate and the circuit board, when the dimensions of two support members along the first direction are the same, the heights between the substrate and the circuit board at the two support members are the same, which can cause the substrate to warp. The degree is smaller. Therefore, this solution can reduce the warpage of the substrate.
  • the size of each support member along the first direction is the same. Since the support member is located between the substrate and the circuit board, when the size of each support member along the first direction is the same, the height between the substrate and the circuit board at each support member is the same, so that the first height of the substrate can be Both the surface and the second surface are nearly flat, that is, less warped. Therefore, this solution can further reduce the warpage of the substrate.
  • the support member includes a support core and a second solder wrapping an outer surface of the support core.
  • the support member can be fixed on the second surface of the substrate through ball planting.
  • the second solder of the support and the third solder on the circuit board are melted into one body at high temperature and synthesized into a solder joint, thereby soldering the substrate to the circuit board.
  • the support core can provide support for the substrate and limit the displacement of the substrate. In this way, the support member can not only play a supporting role, but also play a role in welding the substrate and the circuit.
  • each support member includes a support core and a second solder; multiple pads are provided on the second surface, the number of pads is the same as the number of supports, and each support member corresponds one to one Ground is firmly connected to each pad.
  • each support member can be fixed on the second surface of the substrate through ball planting. That is to say, the support members cover the pads on the second surface of the substrate, which can make the connection structure between the substrate and the circuit more consistent.
  • each support member since the two ends of each support member are respectively connected with the circuit board and the circuit board, The substrate is in contact, which can further reduce the warpage of the substrate, thereby making the welding consistency between the substrate and the circuit board better, thereby further reducing the defects of tin connection and open soldering between the circuit board and the substrate.
  • the wafer is a complete wafer.
  • the wafer of the present application is processed from a complete wafer, and the size of the wafer is relatively large. Therefore, the present application can be applied to the solution of large-size chips.
  • This application also provides an electronic device, including a housing and any of the above circuit board components, and the circuit board component is fixed on the housing. Electronics are capable of all the effects of circuit board assemblies.
  • the application also provides a method for manufacturing a circuit board assembly, including: providing a chip, the chip includes a substrate, a wafer and a first solder, the substrate includes an opposing first surface and a second surface, the first surface includes a first region and a second area, the chip is fixed to the second area through the first solder; a circuit board is provided; a third solder is arranged on the circuit board; the chip is arranged on the circuit board so that the second surface of the substrate is in contact with the third solder, and the circuit board A support member is provided between the circuit board and the substrate; a pressure applying component is provided on the first area; reflow soldering is performed to melt the third solder and allow the circuit board and the substrate to pass through at least Third solder secures connection; remove pressure-exerting components.
  • the first surface of the substrate facing away from the circuit board includes a first area and a second area, and no load-bearing structure is provided on the first area, after placing the chip on the circuit board, A pressure component can be placed on the first area, followed by reflow soldering.
  • the substrate and the first solder and filler glue located between the chip and the substrate are softened at high temperature, and the pressure component can provide the substrate with a force to move the substrate toward the circuit board under the action of its own gravity. .
  • the support member Since there is a support member between the circuit board and the chip, and the substrate in the chip is closer to the circuit board than the chip, the support member is located between the substrate and the circuit board, and the support member can provide the substrate with a force in the direction away from the circuit board. .
  • the base plate is shaped under the action of the pressure component and the support member, so that it has better flatness.
  • the support member can also limit the displacement of the substrate toward the circuit board, thereby reducing tin connection defects between the circuit board and the substrate. Since the substrate has good flatness, it can also reduce the occurrence of tin connection defects between the circuit board and the substrate. Open welding defects.
  • the pressing component is removed during the manufacturing process of the circuit board assembly, a metal frame is not provided in the circuit board assembly of the present application, thereby reducing the cost of the circuit board assembly.
  • the chip of the present application has less rigidity and greater flexibility. Therefore, the substrate can be more easily deformed.
  • the pressure-applying component includes a connecting part and a crimping part located on the connecting part, and the connecting part and the crimping part are an integral structure;
  • the step of arranging the pressure-applying component on the first area includes: The pressing component is placed in the first area so that one end of the crimping portion away from the connecting portion is in contact with the first area.
  • the pressure applying component can provide the substrate with a force to move toward the circuit board; since the pressure applying component is placed on the second area, after the reflow soldering is completed, when the pressure applying component is removed, the pressure applying component can be removed.
  • the pressure-applying component can be directly removed from the first area, which makes the process of removing the pressure-applying component more convenient and does not cause damage to the substrate.
  • the pressure-applying component includes a connecting part and a crimping part located on the connecting part, and the connecting part and the crimping part are separate structures; the step of arranging the pressure-applying component on the first area includes: The crimping part is placed on the first area so that one end of the crimping part away from the connection part is in contact with the first area; the connection part is placed on the surface of the crimping part away from the substrate.
  • the crimping part and the connecting part can provide the substrate with a force to move toward the circuit board; since the crimping part is placed on the first area and the connecting part is placed on the crimping part, therefore, After the reflow soldering is completed, when removing the pressure component, the crimping part and the connecting part can be directly removed from the first area, which makes the process of removing the crimping part and the connecting part more convenient and does not damage the substrate. cause damage.
  • the manufacturing method before the step of arranging the chip on the circuit board, the manufacturing method further includes: providing a support member; and arranging the support member on the circuit board.
  • the manufacturing method further includes: providing a support member; and arranging the support member on the circuit board.
  • the step of providing the chip includes: fixing the chip to the first surface of the substrate through a first solder; providing a support; and fixing the support to the second surface of the substrate.
  • the support member can be fixed on the second surface of the substrate by ball planting.
  • the support member is soldered to the circuit board after the third solder is melted at high temperature. That is to say, one end of the support member is soldered to the second surface of the substrate, and the other end is soldered to the circuit board.
  • the support member can be fixed more firmly between the substrate and the circuit board.
  • the size of each support member along the first direction is the same. Since the support member is located between the substrate and the circuit board, when the size of each support member along the first direction is the same, the height between the substrate and the circuit board at each support member is the same, so that the first height of the substrate can be Both the surface and the second surface are nearly flat, that is, less warped. Therefore, this solution can further reduce the warpage of the substrate.
  • Figure 1 is a schematic structural diagram of a circuit board assembly in the related art
  • FIG 2 is a schematic diagram of part of the manufacturing process of the circuit board assembly in the embodiment shown in Figure 1;
  • Figure 3 is a schematic structural diagram of a circuit board assembly in another related technology
  • Figure 4 is a schematic structural diagram of a circuit board assembly in another related technology
  • Figure 5a is a schematic structural diagram of a circuit board assembly in an embodiment of the present application.
  • Figure 5b is a plan view of the substrate in the example shown in Figure 5a;
  • Figure 6 is a schematic structural diagram of the chip in the circuit board assembly when warping occurs in the embodiment shown in Figure 5a;
  • Figure 7 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 8 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 9 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 10 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 11 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 12 is a schematic structural diagram of a support member in an embodiment of the present application.
  • Figure 13 is a schematic structural diagram of a support member in another embodiment of the present application.
  • Figure 14 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 15 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 16 is a schematic structural diagram of a circuit board assembly in another embodiment of the present application.
  • Figure 17 is a schematic diagram of a manufacturing process of a circuit board assembly in an embodiment of the present application.
  • Figure 18 is a schematic diagram of part of the production process of the circuit board assembly in the production process shown in Figure 17;
  • Figure 19 is a schematic diagram of another part of the production process of the circuit board assembly in the production process shown in Figure 17;
  • Figure 20 is a schematic structural diagram of a chip in a circuit board assembly when warping occurs in another embodiment of the present application.
  • Figure 21 is a schematic diagram of another manufacturing process of a circuit board assembly in an embodiment of the present application.
  • Figure 22 is a schematic diagram of part of the production process of the circuit board assembly in the production process shown in Figure 21;
  • FIG. 23 is a schematic diagram of another part of the manufacturing process of the circuit board assembly in the manufacturing process shown in FIG. 21 .
  • Icon 10-chip; 11-substrate; 111-first surface; 112-second surface; 113-second pad; 114-BGA solder ball; 115-LGA pad; 116-first area; 117-th Second area; 118-third area; 12-wafer; 13-first solder; 14-filler glue; 20-circuit board; 21-PCB; 22-third surface; 23-first pad; 24-third Solder; 31-metal frame; 311-interface; 32-metal cover; 40-support; 41-support core; 42-second solder; 50-pressure component; 51-connection part; 52-crimping part; 60-radiator; 70-thermal conductive layer; 61-heat sink plate; 62-support component.
  • a and/or B can mean: A exists alone, A and B exist simultaneously, and they exist alone. B these three situations.
  • first and second in the description and claims of the embodiments of this application are used to distinguish different objects, rather than to describe a specific order of objects.
  • first target object, the second target object, etc. are used to distinguish different target objects, rather than to describe a specific order of the target objects.
  • multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.
  • the chip 12 is first bonded to the substrate 11 by flip-chip method to prepare the chip 10 .
  • the chip 10 is then welded to the PCB 21 .
  • the substrate 11 During the process of preparing the chip 10, due to the large difference in thermal expansion coefficients between the substrate 11 and the wafer 12, the substrate 11 inevitably warps, and the larger the size of the substrate 11, the greater the warpage.
  • the chip 10 can be placed on the PCB 21, and then a reflow soldering method is used to melt the pre-printed solder paste on the PCB 21 to solder the substrate 11 to the PCB 21, thereby soldering the chip 10 to the PCB 21.
  • the solder balls on the surface of the substrate 11 facing the PCB 21 will also melt at high temperatures and collapse or stretch. When the warpage of the substrate 11 meets the requirements of the JEDEC standard, a certain amount of deformation can be provided through the collapse or stretching of the solder balls to achieve good welding of the chip 10 and the PCB 21 .
  • the chip 10 and the PCB 21 can still be well welded through the stretching of the solder balls.
  • the warpage of the substrate 11 does not meet the requirements of the JEDEC standard, good welding of the chip 10 and the PCB 21 cannot be achieved through the collapse or stretching of the solder balls, that is, the substrate 11 does not have the feasibility of welding to the PCB 21 . Therefore, it is necessary to reduce the warpage of the substrate 11 .
  • a metal cover 32 is provided in the circuit board assembly.
  • the substrate 11 has warped.
  • the metal cover 32 is fixed on the substrate 11 to correct the substrate 11. , thereby reducing the warpage of the substrate 11 so that it is feasible to be welded to the PCB 21 .
  • the corrected chip 10 is soldered to the PCB 21 .
  • a metal frame 31 is provided in the circuit board assembly.
  • the substrate 11 has warped.
  • the metal frame 31 is fixed on the substrate 11, and the substrate 11 is corrected to reduce the size of the substrate 11. The degree of warpage allows it to be soldered to PCB21.
  • a metal frame 31 and a metal cover 32 are provided in the circuit board assembly.
  • the metal frame 31 is fixed on the substrate 11, and an interface 311 is provided on the metal frame 31.
  • the metal cover 32 It is fixed on the interface 311 of the metal frame 31 .
  • the substrate 11 is corrected to reduce the warpage of the substrate 11 so that it can be soldered to the PCB 21 .
  • solder joints located between the substrate 11 and the circuit board 20 and at the periphery of the substrate 11 will cause open soldering defects due to the excessive distance between the two, resulting in partial open circuits and partial open circuits between the substrate 11 and the circuit board 20 short circuit.
  • circuit board assembly since the circuit board assembly is provided with a metal frame 31 and/or a metal cover 32 , the circuit board assembly will be heavier and more costly.
  • circuit board assembly in the related art as shown in Figures 1 to 4 is provided with a metal frame 31 and/or a metal cover 32, and after the chip 12 is welded to the substrate 11, the metal frame 31 and/or Or the metal cover 32 is fixed on the base plate 11. After the correction of the base plate 11 is completed, the chip 10 including the metal frame 31 and/or the metal cover 32 is fixed on the circuit board 20. This will result in a greater overall stiffness of the chip 10. And the flexibility is small, which is not conducive to the orthopedic treatment of the base plate 11 . Moreover, during the reflow soldering process, the substrate 11 will also undergo certain deformation. Since the overall stiffness of the chip 10 is relatively large, the stress on the substrate 11 during the reflow soldering process is increased.
  • circuit board assembly that can be used in routers, switches, servers, high-performance computer clusters (High Performance Computing, HPC) and other applications that require high-power consumption chips for data processing and calculations.
  • the electronic device also includes a casing, and the circuit board assembly can be fixed on the casing.
  • the circuit board assembly includes a circuit board 20, a chip 10 and a support 40.
  • the chip 10 includes a stacked substrate 11 and a wafer 12, and a first solder 13 fixed between the substrate 11 and the wafer 12.
  • the substrate 11 is closer to the circuit board 20 than the wafer 12.
  • the substrate 11 includes a first solder 13 that is away from the circuit board 20.
  • the surface 111 and the second surface 112 facing the circuit board 20, as shown in FIG. 5b the area of the first surface 111 is larger than the projected area of the wafer 12 on the first surface 111, and the first surface 111 includes a first area 116 and a second area. 117. There is no carrying structure on the first area 116, and the chip 12 is fixed to the second area 117 through the first solder 13.
  • the pressure component 50 can be placed on the first area 116, and then reflow soldering is performed. During the reflow soldering process, the substrate 11 and the first solder 13 and filler glue 14 located between the wafer 12 and the substrate 11 are softened at high temperature, and the pressure component 50 can provide pressure for the substrate 11 under the action of its own gravity. 11 towards the circuit board 20 movement force.
  • the support member 40 is provided between the circuit board 20 and the chip 10, and the substrate 11 in the chip 10 is closer to the circuit board 20 than the wafer 12, the support member 40 is located between the substrate 11 and the chip 10. Between the circuit boards 20 , the support member 40 can provide the substrate 11 with a force in a direction away from the circuit board 20 .
  • the base plate 11 is deformed under the action of the pressing member 50 and the supporting member 40 so as to have better flatness.
  • the support member 40 can also limit the displacement of the substrate 11 toward the circuit board 20, thereby reducing tin connection defects between the circuit board 20 and the substrate 11. Since the substrate 11 has good flatness, it can also reduce An open soldering defect occurs between the circuit board 20 and the substrate 11 .
  • the metal frame 31 and/or the metal cover 32 are not provided in the circuit board assembly in the embodiment of the present application, thereby reducing the cost of the circuit board assembly. the cost of.
  • the metal frame 31 and/or the metal cover 32 are not provided in the circuit board assembly, the chip 10 is less rigid and more flexible, thereby making it easier for the substrate 11 to be deformed. During the reflow soldering process, the substrate 11 will also undergo certain deformation. Since the stiffness of the chip 10 is small, the stress on the substrate 11 during the reflow soldering process can be reduced.
  • the circuit board 20 may be PCB21. As shown in Figure 5a, the circuit board 20 has a third surface 22.
  • the third surface 22 is provided with a plurality of first soldering pads 23, and a third solder 24 is provided on each first soldering pad 23.
  • the third solder 24 It can be solder such as solder paste, solder or flux.
  • the chip 10 includes a substrate 11 , a wafer 12 and a first solder 13 .
  • the package size of the chip 10 can be greater than or equal to 20mm, and the power consumption can be greater than or equal to 100W.
  • the projection of the chip 10 on the circuit board 20 may be a square, and the package size of the chip 10 may refer to the side length of the projection of the chip 10 on the circuit board 20 .
  • the substrate 11 may be a coreless substrate, a substrate 11 with a thinner core, or a substrate 11 with a thicker core.
  • the material of the substrate 11 may be ceramic, glass, etc.
  • the substrate 11 may be a single-layer structure.
  • the substrate 11 includes a first surface 111 and a second surface 112 , wherein the first surface 111 is away from the circuit board 20 and the second surface 112 faces the circuit board 20 .
  • the first surface 111 includes a first area 116 and a second area 117, and no bearing structure is provided on the first area 116.
  • the second area 117 is used to fix the first solder 13 and the wafer 12 . Therefore, the number of the second areas 117 can be multiple, and each second area 117 can fix one first solder 13 .
  • the first surface 111 also includes a third area 118 .
  • the third area 118 is covered with filler glue 14.
  • the projected area of the filler glue 14 on the first surface 111 is the same as the projected area of the wafer 12 on the first surface 111, or the filler glue 14 is on the first surface 111.
  • the projected area is slightly larger than the projected area of the wafer 12 on the first surface 111 . That is to say, the first surface 111 includes the first area 116 , the second area 117 and the third area 118 , and the overall area of the first surface 111 is larger than the projected area of the wafer 12 on the first surface 111 .
  • the first area 116 is all areas on the first surface 111 except for the plurality of second areas 117 and third areas 118 .
  • the absence of a load-bearing structure on the first area 116 means that the first area 116 is not directly covered with any load-bearing structure and is exposed to the air.
  • the load-bearing structure here may refer to the metal frame 31 shown in FIG. 1 , or the metal frame 31 shown in FIG. 3 , or the metal frame 31 and metal cover 32 shown in FIG. 4 , or other structures that can provide force for the substrate 11 . structure.
  • the substrate 11 may also have a multi-layer structure.
  • the multilayer substrate 11 includes a first surface 111 and a second surface 112 , where the first surface 111 is the substrate farthest from the circuit board 20 in the multilayer substrate 11 11 is the surface facing away from the circuit board 20 , and the second surface 112 is the surface of the multi-layer substrate 11 that is closest to the circuit board 20 and faces the circuit board 20 .
  • the pinout method of the chip 10 can be a Ball Grid Array (BGA).
  • BGA Ball Grid Array
  • a plurality of second soldering pads 113 are provided on the second surface 112 of the substrate 11 , and some of the second soldering pads 113 are provided with BGA solder balls 114 , and the other part of the second soldering pads 113 are not provided with BGA solder balls 114 .
  • Set BGA solder balls 114 can be a Ball Grid Array
  • the pinout method of the chip 10 can be a Land Grid Array (LGA).
  • LGA Land Grid Array
  • a plurality of LGA pads 115 are provided on the first surface 111 of the substrate 11 .
  • the wafer 12 is a complete wafer, that is, the wafer 12 is processed by polishing and other processes.
  • the complete wafer is only processed into one wafer 12. Therefore, the size of the wafer 12 is relatively different from the size of the wafer. Small.
  • the wafer 12 is an independent component relative to the substrate 11 .
  • the wafer 12 can be fixed to the second area 117 of the first surface 111 of the substrate 11 by flip-chip 10 . In this way, between the wafer 12 and the second area of the first surface 111 The first solder 13 can be formed between 117 .
  • the number of wafers 12 may be one.
  • the number of wafers 12 may also be multiple. When the number of wafers 12 is multiple, as shown in FIG. 7 , multiple wafers 12 can be arranged in a stack; as shown in FIG.
  • multiple wafers 12 can also be arranged on the first surface 111 and along the first surface 111 Arrange settings.
  • the substrate 11 has a multi-layer structure, one chip 12 or multiple chips 12 are disposed on the first surface 111 of the substrate 11 that is farthest from the circuit board 20 .
  • the support member 40 can have the following two structural forms:
  • the support member 40 may be a columnar structure, and its material may include metal.
  • the support member 40 may be a precision structural member with high processing accuracy.
  • the support member 40 can be obtained by cutting, grinding, and other processing on the metal raw material.
  • the support member 40 may also have a spherical structure.
  • One end of the support member 40 can be fixed to the first pad 23 on the circuit board 20, and the other end can be in contact with the second pad 113 or the LGA pad 115 on the substrate 11; one end of the support member 40 can be fixed to the first pad 23 on the circuit board 20.
  • the other end of the first pad 23 is fixed to the second pad 113 or the LGA pad 115 on the substrate 11; or, one end of the support 40 is fixed to the second pad 113 or the LGA pad 115 on the substrate 11, and the other end is fixed to the second pad 113 or the LGA pad 115 on the substrate 11.
  • One end is in contact with the first pad 23 on the circuit board 20 .
  • the support member 40 When the support member 40 is fixed to the first pad 23 on the circuit board 20, welding or bonding may be used to fix the support member 40 to the first pad 23 on the circuit board 20; when the support member 40 is fixed to the substrate When the second bonding pad 113 or the LGA bonding pad 115 on the substrate 11 is used, the support member 40 can be fixed to the second bonding pad 113 or the LGA bonding pad 115 on the substrate 11 by welding or bonding.
  • the third solder 24 on the circuit board 20 and the BGA can be soldered at high temperature.
  • the solder ball 114 melts, so that the third solder 24 and the BGA solder ball 114 melt into one body, forming a solder joint, and the substrate 11 and the circuit board 20 are soldered. Therefore, the substrate 11 and the circuit board 20 are welded mainly through the third solder 24 and the BGA solder ball 114 .
  • each second pad 113 is fixed or in contact with a support member 40 , or fixed with a BGA solder ball 114 .
  • each LGA pad 115 may be fixedly connected or in contact with a support member 40 , or may be soldered to a third solder 24 .
  • the support member 40 may include a support core 41 and a second solder 42 , where the support core 41 may be a precision structural part with high processing accuracy, and its material may include metal, and its shape may be Is spherical.
  • the second solder 42 wraps the outer surface of the supporting core 41 , and the second solder 42 may be solder.
  • the support member 40 may have a spherical structure as a whole. In this way, during the process of manufacturing the circuit board assembly, the support member 40 can be fixed to the second surface 112 of the substrate 11 by ball planting.
  • the second solder 42 of the support 40 melts at high temperature, thereby welding the substrate 11 to the circuit board 20.
  • the two ends of the support member 40 are fixed to the circuit board 20 and the substrate 11 respectively.
  • the support core 41 can provide support for the substrate 11 and limit the displacement of the substrate 11 , so that the support member 40 not only plays a supporting role, but also serves to connect the substrate 11 and the circuit board 20 The role of welding.
  • the pinout mode of the chip 10 is BGA
  • Some of the supporting members 40 are located near the edge of the base plate 11 , and the other part of the supporting members 40 are located near the middle of the base plate 11 .
  • the supports 40 located close to the edge of the substrate 11 may be evenly arranged in an array.
  • the pinout mode of the chip 10 is LGA
  • the solder and support 40 are in different locations.
  • each support member 40 can be fixed to the second surface 112 of the substrate 11 through ball planting. That is to say, the support member 40 covers the second pads 113 on the second surface 112 of the substrate 11 , thereby making the connection structure between the substrate 11 and the circuit board 20 more consistent.
  • At least two of the plurality of support members 40 have the same size along the first direction E, and the first direction is the stacking direction of the circuit board 20 and the chip 10 . Since the support member 40 is located between the substrate 11 and the circuit board 20, when the dimensions of two support members 40 along the first direction E are the same, the heights between the substrate 11 and the circuit board 20 at the two support members 40 are the same. This can make the warpage of the substrate 11 smaller. Therefore, this solution can reduce the warpage of the substrate 11 .
  • each support member 40 along the first direction E is the same. Since the support member 40 is located between the substrate 11 and the circuit board 20, when the size of each support member 40 along the first direction E is the same, the height between the substrate 11 and the circuit board 20 at each support member 40 is the same, As a result, both the first surface 111 and the second surface 112 of the substrate 11 can be made close to a plane, that is, the degree of warpage is smaller. Therefore, this solution can further reduce the warpage of the substrate 11 .
  • the circuit board assembly also includes a heat sink 60 and a heat conductive layer 70.
  • the heat sink 60 includes a heat sink 61 and a support member 62.
  • the heat sink 61 is fixed on the circuit board 20 through the support member 62.
  • the heat sink 61 passes through the heat conductor.
  • layer 70 is in contact with wafer 12. Therefore, the heat generated by the wafer 12 can be transferred to the heat dissipation plate 61 through the thermal conductive layer 70 to dissipate the heat of the wafer 12 .
  • An embodiment of the present application also provides a method for manufacturing a circuit board assembly, including:
  • a substrate 11 and a wafer 12 may be provided first.
  • the substrate 11 includes an opposing first surface 111 and a second surface 112 .
  • the first surface 111 includes a first region 116 and a second region 117 .
  • the chip 12 is soldered to the second area 117 of the substrate 11 by flip chip 10 .
  • BGA or LGA is used for packaging to obtain the chip 10.
  • the chip 10 also includes a plurality of second pads 113 and a plurality of BGA solder balls 114 .
  • the pinout mode of the chip 10 is LGA
  • the chip 10 also includes a plurality of LGA pads 115 .
  • the circuit board 20 has a third surface 22 , and a first pad 23 is provided on the third surface 22 .
  • a third solder 24 can be printed on the first pad 23 of the circuit board 20 , and the third solder 24 can be solder such as solder paste, solder, or flux.
  • the support member 40 may be a precision structural member with high processing accuracy. It may have a columnar structure, and the material may be a denser material such as metal. The number of supporting members 40 may be multiple.
  • the support 40 can be placed on the third solder 24 printed on the circuit board 20 .
  • the support member 40 can be placed on the solder paste. Since the base plate 11 is warped in such a shape that the periphery is curved upward and the middle portion is convex downward, when correcting the base plate 11 , it is necessary to exert a force on the peripheral portion toward the circuit board 20 to flatten it.
  • a plurality of supports 40 can be provided around the periphery of the substrate 11 at the projection position of the circuit board 20.
  • the supports 40 can be arranged in a circular array or a rectangular array, and the specific shape of the array can be consistent with the projection shape of the substrate 11 on the circuit board 20. same.
  • the plurality of supports 40 located around the periphery of the substrate 11 can be arranged in a circular array; when the projected shape of the substrate 11 on the circuit board 20 is rectangular, Then, the plurality of supporting members 40 located at the periphery of the substrate 11 may be arranged in a rectangular array.
  • the chip 10 can be placed on the third surface 22 of the circuit board 20 .
  • the BGA solder balls 114 correspond to the positions of part of the third solder 24 .
  • the rest of the BGA solder balls are not provided on the second surface 112 of the substrate 11 .
  • the positions of the second solder pad 113 of the ball 114 and the remaining third solder 24 correspond one to one.
  • part of the LGA pads 115 corresponds to the positions of each third solder 24 one-to-one
  • the remaining part of the LGA pads 115 corresponds to the positions of each support member 40 one-to-one.
  • the pressure member 50 may be placed on the first area 116 .
  • the material of the pressing component 50 may include relatively dense materials such as metal.
  • the pressing component 50 may include a connecting part 51 and a crimping part 52 located on the connecting part 51 .
  • the connecting part 51 may have a plate-like structure.
  • the projected shape of the crimping portion 52 on the third surface 22 may be an annular rectangle or an annular shape, and the projected shape of the crimping portion 52 on the third surface 22 corresponds to the projected shape of the substrate 11 on the third surface 22 , for example Specifically, when the projected shape of the substrate 11 on the third surface 22 is a circle, the projected shape of the crimping portion 52 on the third surface 22 is a circular ring; when the projected shape of the substrate 11 on the third surface 22 is a rectangle, Then, the projection shape of the crimping portion 52 on the third surface 22 is an annular rectangle.
  • the above structure can avoid the contact between the pressure-applying member 50 and the substrate 11 .
  • the pressing member 50 interferes with the wafer 12 and causes damage to the wafer 12 .
  • the pressing component 50 may also be a spring pressure head or a magnetic pressure head or other components capable of exerting a force on the substrate 11 toward the circuit board 20 .
  • the number of crimping parts 52 corresponds to the number of layers of the substrate 11. For example, as shown in Figure 19, when the chip 10 contains a layer of substrate 11, there may be one crimping part 52; as shown in Figure 20, When the chip 10 includes two layers of substrates 11, the number of crimping portions 52 may be two, and so on.
  • the connecting part 51 and the crimping part 52 may be an integral structure.
  • the pressure applying component 50 can be made by one-piece molding.
  • the pressure applying component 50 can be made by casting.
  • the pressure applying component 50 can also be made by welding: the connecting portion 51 and the connecting portion 51 can be made respectively.
  • the crimping part 52 is then welded to the connection part 51 to obtain the pressing member 50 .
  • the prepared pressure applying component 50 can be placed on the first area 116 .
  • the connecting part 51 and the crimping part 52 may have a separate structure. That is, the connection part 51 and the crimping part 52 are not fixedly connected.
  • the crimping part 52 may be placed on the first area 116 first, and then the connecting part 51 may be placed on the end of the pressure part away from the first area 116 .
  • the pressure component 50 After the pressure component 50 is placed in the second area 117, reflow soldering can be performed. During the reflow soldering process, the entire chip 10 and the circuit board 20 are at a high temperature. At this time, the substrate 11 , the first solder 13 and the filler glue 14 are all softened to a certain extent.
  • the material of the pressing member 50 may include relatively dense materials such as metal. Therefore, as shown in FIG. 19 , the pressing member 50 provides the substrate 11 with a force to move the substrate 11 toward the circuit board 20 under the action of its own gravity.
  • the support 40 can provide the substrate 11 with a force away from the circuit board 20, In this way, the base plate 11 is deformed under the action of two forces, thereby having better flatness.
  • the soldering stress between the BGA solder ball 114 or the LGA pad 115 and the substrate 11 during the reflow soldering process can also be reduced.
  • the support member 40 can also limit the displacement of the substrate 11 toward the circuit board 20 , thereby reducing solder connection defects between the circuit board 20 and the substrate 11 . Since the substrate 11 has good flatness, it can also reduce the number of solder connections between the circuit board 11 and the circuit board 11 . There is an open soldering defect between 20 and the substrate 11.
  • the pressing component 50 can be removed, so that no components are provided on the first area 116 of the substrate 11 .
  • This can reduce the weight of the circuit board assembly and reduce the cost of the circuit board assembly.
  • the chip 10 of the embodiment of the present application has smaller stiffness and greater flexibility. Therefore, the substrate 11 can be more easily deformed.
  • the pressure applying member 50 is placed on the first area 116 , it is more convenient to remove the pressure applying member 50 .
  • the pressure applying member 50 can be directly removed from the first area 116 , and the substrate 11 will not be damaged. cause damage.
  • the thermal conductive layer 70 can be fixed on the wafer 12 , and then the supporting member 62 and the heat dissipation plate 61 are installed on the circuit board 20 .
  • the difference from the embodiment shown in FIG. 17 lies in the structure of the support member 40 and the sequence of fixing the support member 40.
  • the support member 40 is first welded to the circuit board 20, In this embodiment, The support member 40 may be welded to the base plate 11 first.
  • the manufacturing method of the circuit board assembly of this embodiment includes:
  • the first surface 111 includes a first area 116 and a second area 117 .
  • the chip 12 can be soldered to the second area 117 of the substrate 11 by flip chip 10 .
  • the support member 40 includes a support core 41 and a second solder 42 , where the support core 41 can be a structure with high processing precision and made of a denser material such as metal.
  • the second solder 42 wraps the outer surface of the support core 41 .
  • the second solder 42 may be solder, and the support member 40 may be a spherical structure.
  • the second bonding pad 113 can be provided on the second surface 112 of the substrate 11 in advance. Then, the support member 40 can be fixed to the second pad 113 on the second surface 112 of the substrate 11 by ball planting.
  • the number of supporting members 40 is the same as the number of second pads 113, and their positions correspond one to one. In other embodiments, the number of support members 40 is less than the number of second pads 113 . That is to say, in a row of second pads 113 , only some of the second pads 113 are provided with support members 40 , and others are provided with support members 40 .
  • the second pad 113 is not provided with a support 40 but a BGA solder ball 114 .
  • the chip 10 When the pinout mode of the chip 10 is LGA, the chip 10 includes a plurality of LGA pads 115 . As shown in FIG. 15 , the number of supporting members 40 is the same as the number of LGA pads 115 , and their positions correspond one to one. In other embodiments, the number of support members 40 is less than the number of LGA pads 115 . That is to say, in a row of LGA pads 115 , only some of the LGA pads 115 are provided with support members 40 , and other parts of the LGA pads 115 are provided with support members 40 . No supports 40 are provided on the disk 115 .
  • the support member 40 includes a support core 41 and a second solder 42 wrapping the support core 41 , and the support core 41 is fixed to the second surface 112 of the substrate 11 .
  • both the third solder 24 and the second solder 42 will melt under high temperature, and the support member 40 will be soldered to the circuit board 20 , that is, one end of the support member 40 will be soldered to the substrate 11
  • the other end of the second surface 112 is welded to the circuit board 20 , thereby making the support member 40 more firmly fixed between the substrate 11 and the circuit board 20 .

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Abstract

本申请提供了一种电路板组件、电子设备及电路板组件的制作方法。其中，电路板组件包括：层叠设置的电路板和芯片，以及位于电路板和芯片之间的支撑件，其中：芯片包括层叠设置的基板和晶片，以及固定于基板和晶片之间的第一焊料，基板相比晶片更加靠近电路板，基板包括背离电路板的第一表面以及朝向电路板的第二表面，第一表面的面积大于晶片在第一表面的投影面积，第一表面包括第一区域和第二区域，第一区域上未设置承载结构，晶片通过第一焊料固定于第二区域。本申请能够减少在电路板与基板焊接的过程中出现连锡及开焊等缺陷。

Description

电路板组件、电子设备及电路板组件的制作方法
本申请要求在2022年06月20日提交中国专利局、申请号为202210695632.9、发明名称为“电路板组件、电子设备及电路板组件的制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电路板制作技术领域，尤其涉及一种电路板组件、电子设备及电路板组件的制作方法。
背景技术
在电路板组件的生产过程中，先利用晶片和基板制备芯片，接着将芯片焊接至印制电路板(Printed Circuit Board，PCB)上。在制备芯片的过程中，由于基板和晶片的热膨胀系数相差较大，基板不可避免地产生翘曲。针对大尺寸大功耗的芯片，基板的翘曲度较大，芯片不具备与PCB的焊接可行性，因此，需要减小基板的翘曲度。
相关技术中，通常在制备好芯片10后，对基板11进行矫形，从而减小基板11的翘曲度，以使芯片具备与PCB21的焊接可行性。
但是，该种方案不足以控制翘曲度，即，芯片10仍然具有较大的翘曲度，这将导致基板11与电路板20之间出现开焊及连锡等缺陷，从而导致系统开路和短路的电气功能失效。
发明内容
为了解决上述技术问题，本申请提供一种电路板组件、电子设备及电路板组件的制作方法，以减少在电路板与基板焊接的过程中出现连锡及开焊等缺陷。
本申请提供一种电路板组件，包括：层叠设置的电路板和芯片，以及位于电路板和芯片之间的支撑件，其中：芯片包括层叠设置的基板和晶片，以及固定于基板和晶片之间的第一焊料，基板相比晶片更加靠近电路板，基板包括背离电路板的第一表面以及朝向电路板的第二表面，第一表面的面积大于晶片在第一表面的投影面积，第一表面包括第一区域和第二区域，第一区域上未设置承载结构，晶片通过第一焊料固定于第二区域。
在制备本申请的电路板组件时，由于基板背离电路板的第一表面包括第一区域和第二区域，且第一区域上未设置承载结构，因此，在将芯片固定于电路板上后，可以在第一区域上放置施压部件，接着进行回流焊接。在回流焊接的过程中，基板以及位于晶片和基板之间的第一焊料和填充胶在高温下软化，施压部件能够在自身重力的作用下，为基板提供使基板朝向电路板运动的作用力。由于电路板与芯片之间设置有支撑件，而芯片中的基板相比晶片更加靠近电路板，因此，支撑件位于基板和电路板之间，支撑件能够为基板提供远离电路板方向的作用力。基板在施压部件和支撑件的作用下被矫形，从而具有较好的平面度。此外，支撑件还能够限制基板朝向电路板运动的位移量，从而减少电路板与基板之间出现连锡的缺陷，由于基板具有较好的平面度，因此也能够减少电路板与基板之间出现 开焊的缺陷。
另外，由于本申请中的第一区域上未设置承载结构，由此能够降低电路板组件的成本。此外，本申请的芯片的刚度更小，柔性更大，因此，能够使得基板更容易被矫形。
在一些可能实现的方式中，支撑件的数量为多个，多个支撑件中至少两个支撑件沿第一方向的尺寸相同，第一方向为电路板和芯片的层叠方向。由于支撑件位于基板和电路板之间，当某两个支撑件沿第一方向的尺寸相同时，这两个支撑件处基板和电路板之间的高度相同，由此可使得基板的翘曲度较小。因此，该方案能够减小基板的翘曲度。
在一些可能实现的方式中，每个支撑件沿第一方向的尺寸均相同。由于支撑件位于基板和电路板之间，当每个支撑件沿第一方向的尺寸均相同时，每个支撑件处基板和电路板之间的高度均相同，由此可使得基板的第一表面和第二表面均接近平面，即，翘曲度更小。因此，该方案能够进一步减小基板的翘曲度。
在一些可能实现的方式中，至少部分支撑件包括支撑芯体以及包裹支撑芯体的外表面的第二焊料。这样，在制作电路板组件的过程中，可以将支撑件通过植球的方式固定于基板的第二表面。在将芯片放置于电路板上后，进行回流焊接的过程中，高温下支撑件的第二焊料和电路板上的第三焊料熔化为一体，合成为一个焊点，从而将基板与电路板焊接。在第二焊料熔化后，支撑芯体能够为基板提供支撑，限制基板的位移量。由此能够使得支撑件既起到支撑的作用，还起到将基板与电路焊接的作用。
在一些可能实现的方式中，每个支撑件包括支撑芯体和第二焊料；第二表面上设置有多个焊盘，焊盘的数量与支撑件的数量相同，每个支撑件一一对应地与每个焊盘固定连接。这样，制作电路板组件的过程中，可以将每个支撑件通过植球的方式固定于基板的第二表面。也就是说，支撑件布满基板的第二表面上的焊盘，由此能够使得基板与电路之间连接结构的一致性较好，此外，由于每个支撑件的两端分别与电路板和基板接触，由此能够进一步减小基板的翘曲度，从而使得基板和电路板之间的焊接一致性较好，从而进一步减少电路板与基板之间出现连锡及开焊的缺陷。
在一些可能实现的方式中，晶片为完整的晶圆。这样，本申请的晶片为完整的晶圆加工而成的，该晶片的尺寸较大，因此，本申请能够应用于大尺寸芯片的方案。
本申请还提供一种电子设备，包括壳体以及上述任一项的电路板组件，电路板组件固定于壳体上。电子设备能够实现电路板组件的所有效果。
本申请还提供一种电路板组件的制作方法，包括：提供芯片，芯片包括基板、晶片和第一焊料，基板包括相对的第一表面和第二表面，第一表面包括第一区域和第二区域，晶片通过第一焊料固定于第二区域；提供电路板；在电路板上设置第三焊料；将芯片设置于电路板上，以使基板的第二表面与第三焊料相接触，电路板与基板之间设置有支撑件；在第一区域上设置施压部件；进行回流焊接，以熔化第三焊料，并使电路板与基板至少通过 第三焊料固定连接；去除施压部件。
在制备本申请的电路板组件时，由于基板背离电路板的第一表面包括第一区域和第二区域，且第一区域上未设置承载结构，因此，在将芯片放置于电路板上后，可以在第一区域上放置施压部件，接着进行回流焊接。在回流焊接的过程中，基板以及位于晶片和基板之间的第一焊料和填充胶在高温下软化，施压部件能够在自身重力的作用下，为基板提供使基板朝向电路板运动的作用力。由于电路板与芯片之间设置有支撑件，而芯片中的基板相比晶片更加靠近电路板，因此，支撑件位于基板和电路板之间，支撑件能够为基板提供远离电路板方向的作用力。基板在施压部件和支撑件的作用下被矫形，从而具有较好的平面度。此外，支撑件还能够限制基板朝向电路板运动的位移量，从而减少电路板与基板之间出现连锡的缺陷，由于基板具有较好的平面度，因此也能够减少电路板与基板之间出现开焊的缺陷。
另外，由于在制作电路板组件的过程中，将施压部件去除，因此，本申请的电路板组件中并未设置金属框，由此能够降低电路板组件的成本。此外，相比设置金属框的芯片，本申请的芯片的刚度更小，柔性更大，因此，能够使得基板更容易被矫形。
在一些可能实现的方式中，施压部件包括连接部以及位于连接部上的压接部，连接部和压接部为一体式结构；在第一区域上设置施压部件的步骤，包括：将施压部件放置于第一区域，以使压接部背离连接部的一端与第一区域相接触。这样，在回流焊接的过程中，施压部件能够为基板提供朝向电路板运动的作用力；由于施压部件放置于第二区域上，因此，在回流焊接完成后，去除施压部件时，可直接将施压部件从第一区域上取下即可，由此能够使得去除施压部件的过程更为方便，而且不会对基板造成损伤。
在一些可能实现的方式中，施压部件包括连接部以及位于连接部上的压接部，连接部和压接部为分体式结构；在第一区域上设置施压部件的步骤，包括：将压接部放置于第一区域，以使压接部背离连接部的一端与第一区域相接触；将连接部放置于压接部背离基板的表面。这样，在回流焊接的过程中，压接部和连接部能够为基板提供朝向电路板运动的作用力；由于压接部放置于第一区域上，连接部放置于压接部上，因此，在回流焊接完成后，去除施压部件时，可直接将压接部和连接部从第一区域上取下即可，能够使得去除压接部和连接部的过程更为方便，而且不会对基板造成损伤。
在一些可能实现的方式中，在将芯片设置于电路板上的步骤之前，制作方法还包括：提供支撑件；将支撑件设置于电路板上。这样，在回流焊接的过程中，高温下第三焊料熔化后会将支撑件的一端焊接至电路板上，施压部件在与基板朝向电路板的方向运动的过程中，当基板的第二表面抵接至支撑件的另一端后停止运动，完成对基板的矫形。该种方法较为容易实现。
在一些可能实现的方式中，提供芯片的步骤，包括：将晶片通过第一焊料固定于基板的第一表面；提供支撑件；将支撑件固定于基板的第二表面。这样，可采用植球的方式将支撑件固定于基板的第二表面。在进行回流焊接时，高温下第三焊料熔化后会将支撑件焊接至电路板上，也就是说，支撑件的一端焊接至基板的第二表面，另一端焊接至电路板上， 由此能够使得支撑件在基板和电路板之间的固定更为牢固。
在一些可能实现的方式中，支撑件的数量为多个，多个支撑件中至少存在两个支撑件沿第一方向的尺寸相同，第一方向为电路板和芯片的层叠方向。由于支撑件位于基板和电路板之间，当某两个支撑件沿第一方向的尺寸相同时，这两个支撑件处基板和电路板之间的高度相同，由此可使得基板的翘曲度较小。因此，该方案能够减小基板的翘曲度。
在一些可能实现的方式中，每个支撑件沿第一方向的尺寸均相同。由于支撑件位于基板和电路板之间，当每个支撑件沿第一方向的尺寸均相同时，每个支撑件处基板和电路板之间的高度均相同，由此可使得基板的第一表面和第二表面均接近平面，即，翘曲度更小。因此，该方案能够进一步减小基板的翘曲度。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术中电路板组件的结构示意图；
图2为图1所示实施例中电路板组件的部分制作过程示意图；
图3为另一种相关技术中电路板组件的结构示意图；
图4为另一种相关技术中电路板组件的结构示意图；
图5a为本申请实施例中，电路板组件的结构示意图；
图5b为图5a所示示例中，基板的平面视图；
图6为图5a所示实施例中，电路板组件中的芯片在发生翘曲时的结构示意图；
图7为本申请另一种实施例中，电路板组件的结构示意图；
图8为本申请另一种实施例中，电路板组件的结构示意图；
图9为本申请另一种实施例中，电路板组件的结构示意图；
图10为本申请另一种实施例中，电路板组件的结构示意图；
图11为本申请另一种实施例中，电路板组件的结构示意图；
图12为本申请一种实施例中，支撑件的结构示意图；
图13为本申请另一种实施例中，支撑件的结构示意图；
图14为本申请另一种实施例中，电路板组件的结构示意图；
图15为本申请另一种实施例中，电路板组件的结构示意图；
图16为本申请另一种实施例中，电路板组件的结构示意图；
图17为本申请实施例中，电路板组件的一种制作流程示意图；
图18为图17所示的制作流程中，电路板组件的部分制作过程示意图；
图19为图17所示的制作流程中，电路板组件的另一部分制作过程示意图；
图20为本申请另一种实施例中，电路板组件中的芯片在发生翘曲时的结构示意图；
图21为本申请实施例中，电路板组件的另一种制作流程示意图；
图22为图21所示的制作流程中，电路板组件的部分制作过程示意图；
图23为图21所示的制作流程中，电路板组件的另一部分制作过程示意图。
图标：10-芯片；11-基板；111-第一表面；112-第二表面；113-第二焊盘；114-BGA焊球；115-LGA焊盘；116-第一区域；117-第二区域；118-第三区域；12-晶片；13-第一焊料；14-填充胶；20-电路板；21-PCB；22-第三表面；23-第一焊盘；24-第三焊料；31-金属框；311-接口；32-金属盖；40-支撑件；41-支撑芯体；42-第二焊料；50-施压部件；51-连接部；52-压接部；60-散热器；70-导热层；61-散热板；62-支撑部件。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
本申请实施例的说明书和权利要求书中的术语“第一”和“第二”等是用于区别不同的对象，而不是用于描述对象的特定顺序。例如，第一目标对象和第二目标对象等是用于区别不同的目标对象，而不是用于描述目标对象的特定顺序。
在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
在本申请实施例的描述中，除非另有说明，“多个”的含义是指两个或两个以上。例如，多个处理单元是指两个或两个以上的处理单元；多个系统是指两个或两个以上的系统。
如图2所示，在电路板组件的生产过程中，先通过倒装芯片的方式将晶片12键合于基板11以制备芯片10，如图1所示，接着将芯片10焊接至PCB21上。在制备芯片10的过程中，由于基板11和晶片12的热膨胀系数相差较大，基板11不可避免地产生翘曲，且基板11的尺寸越大，翘曲度也越大。
在芯片10制备好后，可将芯片10放置于PCB21上，接着采用回流焊接的方法将PCB21上预先印刷的锡膏熔化，以将基板11和PCB21焊接，从而将芯片10焊接至PCB21上。此外，基板11朝向PCB21表面的焊球也会在高温下熔化而产生坍塌或拉伸。当基板11的翘曲度满足JEDEC标准的规定时，通过焊球的坍塌或拉伸能够提供一定的变形量，实现芯片10与PCB21的良好焊接。也就是说，即使由于芯片10的翘曲导致基板11与PCB21之间的距离过大，通过焊球的拉伸仍然能够使得芯片10与PCB21良好焊接。当基板11的翘曲度不满足JEDEC标准的规定时，通过焊球的坍塌或拉伸也无法实现芯片10与PCB21的良好焊接，即，基板11不具备与PCB21的焊接可行性。因此，需要减小基板11的翘曲度。
在一种相关技术中，如图1所示，电路板组件中设置有金属盖32。在制备芯片10的过程中，如图2所示，将晶片12键合于基板11后，此时基板11已产生翘曲，接着，将金属盖32固定于基板11上，对基板11进行矫形，从而减小基板11的翘曲度，以使其具备与PCB21的焊接可行性。接着，将矫形后的芯片10焊接至PCB21上。
在另一种相关技术中，如图3所示，电路板组件中设置有金属框31。在制备芯片10的过程中，将晶片12键合于基板11后，此时基板11已产生翘曲，接着，将金属框31固定于基板11上，对基板11进行矫形，从而减小基板11的翘曲度，以使其具备与PCB21的焊接可行性。
在另一种相关技术中，如图4所示，电路板组件中设置有金属框31和金属盖32，金属框31固定于基板11上，且金属框31上设置有接口311，金属盖32固定于金属框31的接口311上。在制备芯片10的过程中，将晶片12键合于基板11后，此时基板11已产生翘曲，接着，将金属框31固定于基板11上，将金属盖32固定于金属框31上，对基板11进行矫形，从而减小基板11的翘曲度，以使其具备与PCB21的焊接可行性。
针对图1-图4所示的相关技术，随着芯片10的功耗和尺寸的增加，在基板11上安装金属框31和/或金属盖32等加强件已不足以控制基板11的翘曲度，即使采用层叠结构且芯层较厚的基板11，芯片10的翘曲度仍然无法满足JEDEC标准的规定。由于基板11的周边朝向远离电路板20的方向弯曲，因此，当基板11的翘曲度较大时，位于基板11与电路板20之间且位于基板11中部的焊点将出现连锡的缺陷，位于基板11与电路板20之间且位于基板11的周边的焊点将因为两者之间的距离过大而造成开焊的缺陷，从而导致基板11与电路板20之间局部开路及局部短路。
此外，针对图1-图4所示的相关技术，由于电路板组件中设置有金属框31和/或金属盖32，因此，将导致电路板组件的重量较大，且成本较高。
另外，由于如图1-图4所示的相关技术中的电路板组件中设置有金属框31和/或金属盖32，且在将晶片12焊接于基板11上后，将金属框31和/或金属盖32固定在基板11上，待对基板11的矫形完成后，将包括金属框31和/或金属盖32的芯片10固定于电路板20上，这样将导致芯片10的整体刚度较大以及柔性较小，不利于基板11的矫形。而且在回流焊接的过程中，基板11也会产生一定的变形，由于芯片10的整体刚度较大，因此，增加了在回流焊接过程中基板11的应力。
基于此，本申请实施例提供一种电路板组件，该电路板组件可应用于路由器、交换机、服务器、高性能计算机群(High Performance Computing，HPC)等需要大功耗芯片进行数据处理和运算的电子设备。电子设备还包括壳体，电路板组件可固定于壳体上。
在本实施例中，如图5a所示，电路板组件包括电路板20、芯片10和支撑件40。芯片10包括层叠设置的基板11和晶片12，以及固定于基板11和晶片12之间的第一焊料13，基板11相比晶片12更加靠近电路板20，基板11包括背离电路板20的第一表面111以及朝向电路板20的第二表面112，如图5b所示，第一表面111的面积大于晶片12在第一表面111的投影面积，第一表面111包括第一区域116和第二区域117，第一区域116上未设置承载结构，晶片12通过第一焊料13固定于第二区域117。
在制备本申请实施例的电路板组件时，由于基板11背离电路板20的第一表面111包括第一区域116和第二区域117，且第一区域116上未设置承载结构，因此，在将芯片10固定于电路板20上后，如图6所示，可以在第一区域116上放置施压部件50，接着进行回流焊接。在回流焊接的过程中，基板11以及位于晶片12和基板11之间的第一焊料13和填充胶14在高温下软化，施压部件50能够在自身重力的作用下，为基板11提供使基板11朝向电路板20运动的作用力。由于电路板20与芯片10之间设置有支撑件40，而芯片10中的基板11相比晶片12更加靠近电路板20，因此，支撑件40位于基板11和电 路板20之间，支撑件40能够为基板11提供远离电路板20方向的作用力。基板11在施压部件50和支撑件40的作用下被矫形，从而具有较好的平面度。此外，支撑件40还能够对限制基板11朝向电路板20运动的位移量，从而减少电路板20与基板11之间出现连锡的缺陷，由于基板11具有较好的平面度，因此也能够减少电路板20与基板11之间出现开焊的缺陷。
此外，本申请实施例中，由于第一区域116上未设置承载结构，因此本申请实施例中的电路板组件中并未设置金属框31和/或金属盖32，由此能够降低电路板组件的成本。此外，由于电路板组件中未设置金属框31和/或金属盖32，因此，芯片10的刚度更小，柔性更大，由此能够使得基板11更容易被矫形。在回流焊接的过程中，基板11也会产生一定的变形，由于芯片10的刚度较小，因此能够减小回流焊接过程中基板11的应力。
下面，对本申请实施例的电路板组件中的各部件进行说明。
电路板20可以为PCB21。如图5a所示，电路板20具有第三表面22，第三表面22设置有多个第一焊盘23，在每个第一焊盘23上均设置有第三焊料24，第三焊料24可以为锡膏、焊锡或助焊剂等焊料。
如图5a所示，芯片10包括基板11、晶片12和第一焊料13。芯片10的封装尺寸可以大于或等于20mm，功耗可以大于或等于100W。需要说明的是，芯片10在电路板20上的投影可以为正方形，芯片10的封装尺寸可以指芯片10在电路板20上的投影的边长尺寸。
基板11可以为无芯基板、具有厚度较薄的芯体的基板11、具有厚度较厚的芯体的基板11。基板11的材料可以为陶瓷、玻璃等。
如图7和图8所示，基板11可以为单层结构，基板11包括第一表面111和第二表面112，其中，第一表面111背离电路板20，第二表面112朝向电路板20。如图5b所示，第一表面111包括第一区域116和第二区域117，第一区域116上未设置承载结构。第二区域117用于固定第一焊料13和晶片12，因此，第二区域117的数量可以为多个，每个第二区域117均可固定一个第一焊料13。
需要说明的是，由于在制作芯片10的过程中，在基板11和晶片12焊接完成后，还需要在基板11和晶片12之间设置填充胶14，因此，如图5b所示，第一表面111还包括第三区域118。如图5a所示，第三区域118上覆盖有填充胶14，填充胶14在第一表面111的投影面积与晶片12在第一表面111的投影面积相同，或者填充胶14在第一表面111的投影面积略大于晶片12在第一表面111的投影面积。也就是说，第一表面111包括第一区域116、第二区域117和第三区域118，且第一表面111的整体面积大于晶片12在第一表面111的投影面积。
第一区域116为第一表面111上除多个第二区域117和第三区域118以外的所有区域。第一区域116上未设置承载结构指的是，第一区域116上未直接覆盖任何承载结构，裸露在空气中。示例性的，如图5a所示，散热器60的散热板61与第一区域116之间存在一定空间，该空间内未设置任何承载结构。此处的承载结构可以指图1所示的金属框31，或者图3所示的金属框31，或者图4所示的金属框31和金属盖32，或者其他能够为基板11提供作用力的结构。
如图9和图10所示，基板11也可以为多层结构。该种情况下，多层基板11包括第一表面111和第二表面112，其中第一表面111为多层基板11中最远离电路板20的基板 11背离电路板20的表面，第二表面112为多层基板11中最靠近电路板20的基板11朝向电路板20的表面。
如图7所示，芯片10的出脚方式可以为球珊阵列(Ball Grid Array，BGA)。采用该种出脚方式时，基板11的第二表面112设置有多个第二焊盘113，且一部分第二焊盘113上设置有BGA焊球114，另一部分第二焊盘113上并未设置BGA焊球114。
如图11所示，芯片10的出脚方式可以为平面网格阵列(Land Grid Array，LGA)，采用该种出脚方式时，基板11的第一表面111设置有多个LGA焊盘115。
晶片12为完整的晶圆，即，晶片12为由完整的晶圆经过打磨等工艺加工而成，完整的晶圆只加工为一个晶片12，因此，晶片12的尺寸与晶圆的尺寸相差较小。
晶片12为相对于基板11独立的部件，晶片12可以通过倒装芯片10的方式固定至基板11的第一表面111的第二区域117，这样，在晶片12和第一表面111的第二区域117之间可形成第一焊料13。如图5a和图9所示，晶片12的数量可以为一个，如图7、图8和图10所示，晶片12的数量也可以为多个。当晶片12的数量为多个时，如图7所示，多个晶片12可以层叠设置；如图8所示，多个晶片12也可以均设置在第一表面111，且沿第一表面111排列设置。当基板11为多层结构时，一个晶片12或多个晶片12均设置于最远离电路板20的基板11的第一表面111上。
支撑件40可以有如下两种结构形式：
第一种，如图12所示，支撑件40可以为柱状结构，其材料可以包括金属。支撑件40可以为加工精度较高的精密结构件。示例性的，可以对金属原材料进行切割、打磨等加工获得支撑件40。在其他实施例中，支撑件40也可以为球状结构。
支撑件40可以一端固定于电路板20上的第一焊盘23，另一端与基板11上的第二焊盘113或LGA焊盘115相接触；支撑件40的一端固定于电路板20上的第一焊盘23，另一端固定于基板11上的第二焊盘113或LGA焊盘115；或者，支撑件40的一端固定于基板11上的第二焊盘113或LGA焊盘115，另一端与电路板20上的第一焊盘23相接触。当支撑件40固定于电路板20上的第一焊盘23时，可以采用焊接或者粘接的方式将支撑件40固定于电路板20上的第一焊盘23；当支撑件40固定于基板11上的第二焊盘113或LGA焊盘115时，可以采用焊接或粘接的方式将支撑件40固定于基板11上的第二焊盘113或LGA焊盘115。
如图5a所示，当芯片10的出脚方式为BGA时，在将芯片10设置于电路板20上时，回流焊接的过程中，高温下可将电路板20上的第三焊料24和BGA焊球114熔化，从而使得第三焊料24和BGA焊球114熔化为一体，合成为一个焊点，将基板11和电路板20焊接。因此，基板11和电路板20主要通过第三焊料24和BGA焊球114实现焊接。如图5a所示，在基板11和电路板20之间，存在多个支撑件40和多个BGA焊球114，且支撑件40的数量和BGA焊球114的数量之和与第二焊盘113的数量相同，即，一部分第二焊盘113与多个支撑件40一一对应固定或接触，另一部分第二焊盘113与多个BGA焊球114一一对应固定连接。且每个第二焊盘113与一个支撑件40固定或接触，或者与一个BGA焊球114固定。
如图11所示，当芯片10的出脚方式为LGA时，在将芯片10设置于电路板20上时，回流焊接的过程中，高温下可将电路板20上的第三焊料24熔化，从而将第三焊料24与LGA焊盘115焊接，以将基板11和电路板20焊接。因此，基板11和电路板20主要通 过第三焊料24和LGA焊盘115实现焊接。如图11所示，每一个LGA焊盘115，可与一个支撑件40固定连接或接触，或者与一个第三焊料24焊接。
第二种，如图13所示，支撑件40可以包括支撑芯体41和第二焊料42，其中支撑芯体41可以为加工精度较高的精密结构件，其材料可以包括金属，其形状可以为球状。第二焊料42包裹支撑芯体41的外表面，第二焊料42可以为焊锡。支撑件40整体可以为球状结构。这样，在制作电路板组件的过程中，可以采用植球的方式将支撑件40固定于基板11的第二表面112。如图14所示，在将芯片10固定于电路板20上后，进行回流焊接的过程中，高温下支撑件40的第二焊料42熔化，从而将基板11与电路板20焊接，在该种结构下，支撑件40的两端分别固定于电路板20和基板11。在第二焊料42熔化后，支撑芯体41能够为基板11提供支撑，限制基板11的位移量，由此能够使得支撑件40既起到支撑的作用，还起到将基板11与电路板20焊接的作用。
在一种可能实现的方式中，如图14所示，当芯片10的出脚方式为BGA时，基板11和电路板20之间，存在多个支撑件40，也存在多个BGA焊球114。其中部分支撑件40位于靠近基板11边缘的位置，另一部分支撑件40位于靠近基板11中部的位置。靠近基板11边缘的位置的支撑件40可以按照阵列均匀布置。
如图16所示，当芯片10的出脚方式为LGA时，基板11和电路板20之间，存在多个支撑件40，也存在多个第三焊料24。焊锡和支撑件40位于不同的位置。
在另一种可能实现的方式中，如图15所示，基板11和电路板20之间，仅存在多个支撑件40，无BGA焊球114。多个支撑件40均布于基板11和电路板20之间。示例性的，支撑件40的数量与第二表面112上的第二焊盘113的数量相同，且每个支撑件40一一对应地与每个第二焊盘113固定连接。这样，制作电路板组件的过程中，可以将每个支撑件40通过植球的方式固定于基板11的第二表面112。也就是说，支撑件40布满基板11的第二表面112上的第二焊盘113，由此能够使得基板11与电路板20之间连接结构的一致性较好。
如图15所示，在将芯片10固定于电路板20上后，进行回流焊接的过程中，高温下支撑件40的第二焊料42和电路板20上的第三焊料24熔化为一体，合成为一个焊点，从而将基板11与电路板20焊接，在该种结构下，每个支撑件40的两端分别固定于电路板20和基板11。由此能够提高基板11的平面度，减小基板11的翘曲度，从而使得基板11和电路板20之间的焊接一致性较好，即，能够减少开焊及连锡等缺陷。
如图5a所示，多个支撑件40中至少存在两个支撑件40沿第一方向E的尺寸相同，第一方向为电路板20和芯片10的层叠方向。由于支撑件40位于基板11和电路板20之间，当某两个支撑件40沿第一方向E的尺寸相同时，这两个支撑件40处基板11和电路板20之间的高度相同，由此可使得基板11的翘曲度较小。因此，该方案能够减小基板11的翘曲度。
如图5a所示，每个支撑件40沿第一方向E的尺寸均相同。由于支撑件40位于基板11和电路板20之间，当每个支撑件40沿第一方向E的尺寸均相同时，每个支撑件40处基板11和电路板20之间的高度均相同，由此可使得基板11的第一表面111和第二表面112均接近平面，即，翘曲度更小。因此，该方案能够进一步减小基板11的翘曲度。
如图5a所示，电路板组件还包括散热器60和导热层70，散热器60包括散热板61和支撑部件62，散热板61通过支撑部件62固定于电路板20上，散热板61通过导热层 70与晶片12接触。由此，晶片12产生的热量可以通过导热层70传递至散热板61以对晶片12进行散热。
本申请实施例还提供一种电路板组件的制作方法，包括：
S101，提供芯片10。
如图18所示，可先提供基板11和晶片12，基板11包括相对的第一表面111和第二表面112，第一表面111包括第一区域116和第二区域117。接着，采用倒装芯片10的方式将晶片12焊接至基板11的第二区域117上。最后，采用BGA或LGA进行封装，以获得芯片10。当芯片10的出脚方式为BGA时，芯片10中也包含多个第二焊盘113和多个BGA焊球114。当芯片10的出脚方式为LGA时，芯片10中也包含多个LGA焊盘115。
S102，提供电路板20。
如图18所示，电路板20具有第三表面22，第三表面22上设置有第一焊盘23。
S103，在电路板20上设置第三焊料24。
如图18所示，在本实施例中，可以在电路板20的第一焊盘23上印刷第三焊料24，第三焊料24可以为锡膏、焊锡或助焊剂等焊料。
S104，提供支撑件40。
如图18所示，支撑件40可以为加工精度较高的精密结构件，其可以为柱状结构，材料可以为金属等密度较大的材料。支撑件40的数量可以为多个。
S105，将支撑件40设置于电路板20上。
如图18所示，可以将支撑件40放置于电路板20上所印刷的第三焊料24上。示例性的，可将支撑件40放置于锡膏上。由于基板11的翘曲呈周边向上弯曲，中部朝下凸出的形状，因此，在对基板11进行矫形时，需要对周边的部分施加朝向电路板20方向的作用力，以将其压平。可以在基板11的周边在电路板20的投影位置处设置多个支撑件40，支撑件40可以呈圆形阵列或矩形阵列排列，其具体阵列的形状可以与基板11在电路板20的投影形状相同。示例性的，当基板11在电路板20的投影形状为圆形，则位于基板11的周边的多个支撑件40可以呈圆形阵列排列；当基板11在电路板20的投影形状为矩形，则位于基板11的周边的多个支撑件40可以呈矩形阵列排列。
S106，将芯片10设置于电路板20上。
如图18所示，可以将芯片10放置于电路板20的第三表面22上，BGA焊球114与部分第三焊料24位置一一对应，基板11的第二表面112上其余未设置BGA焊球114的第二焊盘113与剩余部分第三焊料24位置一一对应。或者，如图16所示，部分LGA焊盘115与各第三焊料24位置一一对应，剩余部分LGA焊盘115与各支撑件40位置一一对应。
S107，在第一区域116上设置施压部件50。
如图19所示，可以将施压部件50放置于第一区域116上。施压部件50的材料可以包括金属等密度较大的材料，在本实施例中，施压部件50可以包括连接部51以及位于连接部51上的压接部52。连接部51可以为板状结构。压接部52在第三表面22的投影形状可以为环状矩形或圆环形，且压接部52在第三表面22的投影形状与基板11在第三表面22的投影形状相对应，示例性的，当基板11在第三表面22的投影形状为圆形，则压接部52在第三表面22的投影形状为圆环形；当基板11在第三表面22的投影形状为矩形， 则压接部52在第三表面22的投影形状为环状矩形。由于施压部件50的压接部52要与基板11的第一表面111接触，而晶片12高于基板11的第一表面111，采用上述的结构，能够避免在施压部件50与基板11相作用的过程中，施压部件50与晶片12产生干涉并对晶片12造成损伤的情况。在其他实施例中，施压部件50也可以为弹簧压头或磁性压头等能够为基板11施加朝向电路板20方向的作用力的部件。
压接部52的数量与基板11的层数相对应，示例性的，如图19所示，当芯片10中包含一层基板11时，压接部52可以为一个；如图20所示，当芯片10中包含两层基板11时，压接部52的数量可以为两个，以此类推。
在一种可能实现的方式中，连接部51和压接部52可以为一体式结构。具体地，施压部件50可以采用一体成型的方式制作，示例性的，可以采用铸造的方式制作施压部件50；或者，还可以采用焊接的方式制作施压部件50：分别制作连接部51和压接部52，接着，将压接部52焊接至连接部51获得施压部件50。在第一区域116上设置施压部件50的过程中，可以将制作好的施压部件50放置于第一区域116上。
在另一种可能实现的方式中，连接部51和压接部52可以为分体式结构。即，连接部51和压接部52无固定连接。在第一区域116上设置施压部件50的过程中，可以先将压接部52放置于第一区域116，接着将连接部51放置于施压部远离第一区域116的一端。
S108，进行回流焊接。
在将施压部件50放置于第二区域117后，即可进行回流焊接。回流焊接的过程中，整个芯片10和电路板20均处于高温下，此时基板11、第一焊料13和填充胶14均存在一定程度的软化。施压部件50的材料可以包括金属等密度较大的材料，因此，如图19所示，施压部件50在自身重力的作用下，为基板11提供使基板11朝向电路板20运动的作用力，当基板11在该作用力朝向电路板20运动，直到基板11的第二表面112与电路板20上的支撑件40相接触，支撑件40能够为基板11提供远离电路板20的作用力，这样，基板11在两个作用力的作用下被矫形，从而具有较好的平面度。此外，还能够减小在回流焊接过程中，BGA焊球114或LGA焊盘115与基板11之间的焊接应力。支撑件40还能够对限制基板11朝向电路板20运动的位移量，从而减少电路板20与基板11之间出现连锡的缺陷，由于基板11具有较好的平面度，因此也能够减少电路板20与基板11之间出现开焊的缺陷。
S109，去除施压部件50。
如图19所示，在回流焊接完成后，可去除施压部件50，这样，基板11的第一区域116上未设置任何零部件。由此可减少电路板组件的自身重量，而且能够降低电路板组件的成本。此外，相比设置金属框31的芯片10，本申请实施例的芯片10的刚度更小，柔性更大，因此，能够使得基板11更容易被矫形。
此外，由于施压部件50放置于第一区域116上，因此，在去除施压部件50时较为方便，直接将施压部件50从第一区域116上取下即可，而且不会对基板11造成损伤。
在去除施压部件50后，可在晶片12上固定导热层70，接着，在电路板20上安装支撑部件62和散热板61。
在其他实施例中，与图17所示实施例的区别在于支撑件40的结构以及固定支撑件40的顺序，在图17所示实施例中，先将支撑件40焊接至电路板20上，在本实施例中， 可以先将支撑件40焊接至基板11上。
具体地，如图21所示，本实施例的电路板组件的制作方法，包括：
S201，将晶片12通过第一焊料13固定于基板11的第一表面111。
如图22所示，第一表面111包括第一区域116和第二区域117。可以采用倒装芯片10的方式将晶片12焊接至基板11的第二区域117上。
S202，提供支撑件40。
如图22所示，支撑件40包括支撑芯体41和第二焊料42，其中支撑芯体41可以为加工精度较高、且采用金属等密度较大的材料制成的结构。第二焊料42包裹支撑芯体41的外表面，第二焊料42可以为焊锡，支撑件40可以为球状结构。
S203，将支撑件40固定于基板11的第二表面112。
如图22所示，当芯片10的出脚方式为BGA时，可预先在基板11的第二表面112上设置第二焊盘113。接着，可以采用植球的方式将支撑件40固定于基板11的第二表面112的第二焊盘113。在本实施例中，支撑件40的数量与第二焊盘113的数量相同，且位置一一对应。在其他实施例中，支撑件40的数量少于第二焊盘113的数量，也就是说，在一行第二焊盘113中，仅有部分第二焊盘113上设置有支撑件40，其他第二焊盘113未设置支撑件40，而是BGA焊球114。
当芯片10的出脚方式为LGA时，芯片10中包含多个LGA焊盘115。如图15所示，支撑件40的数量与LGA焊盘115的数量相同，且位置一一对应。在其他实施例中，支撑件40的数量少于LGA焊盘115的数量，也就是说，在一行LGA焊盘115中，仅有部分LGA焊盘115上设置有支撑件40，其他部分LGA焊盘115上未设置支撑件40。
S204，提供电路板20。
S205，在电路板20上设置第三焊料24。
S206，将芯片10设置于电路板20上。
S207，在第一区域116上设置施压部件50。
S208，进行回流焊接。
S209，去除施压部件50。
在本实施例中，如图22和图23所示，由于支撑件40包括支撑芯体41以及包裹支撑芯体41的第二焊料42，且支撑芯体41固定于基板11的第二表面112。这样，在回流焊接的过程中，高温下第三焊料24和第二焊料42均会熔化，并将支撑件40焊接至电路板20上，也就是说，支撑件40的一端焊接至基板11的第二表面112，另一端焊接至电路板20上，由此能够使得支撑件40在基板11和电路板20之间的固定更为牢固。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (14)

  1. 一种电路板组件，其特征在于，包括：层叠设置的电路板和芯片，以及位于所述电路板和所述芯片之间的支撑件，其中：
    所述芯片包括层叠设置的基板和晶片，以及固定于所述基板和所述晶片之间的第一焊料，所述基板相比所述晶片更加靠近所述电路板，所述基板包括背离所述电路板的第一表面以及朝向所述电路板的第二表面，所述第一表面的面积大于所述晶片在所述第一表面的投影面积，所述第一表面包括第一区域和第二区域，所述第一区域上未设置承载结构，所述晶片通过所述第一焊料固定于所述第二区域。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述支撑件的数量为多个，多个所述支撑件中至少两个所述支撑件沿第一方向的尺寸相同，所述第一方向为所述电路板和所述芯片的层叠方向。
  3. 根据权利要求2所述的电路板组件，其特征在于，每个所述支撑件沿所述第一方向的尺寸均相同。
  4. 根据权利要求2或3所述的电路板组件，其特征在于，至少部分所述支撑件包括支撑芯体以及包裹所述支撑芯体的外表面的第二焊料。
  5. 根据权利要求2-4任一项所述的电路板组件，其特征在于，每个所述支撑件包括所述支撑芯体和第二焊料；
    所述第二表面上设置有多个焊盘，所述焊盘的数量与所述支撑件的数量相同，每个所述支撑件一一对应地与每个所述所述焊盘固定连接。
  6. 根据权利要求1-5任一项所述的电路板组件，其特征在于，所述晶片为完整的晶圆。
  7. 一种电子设备，其特征在于，包括壳体以及权利要求1-6任一项所述的电路板组件，所述电路板组件固定于所述壳体上。
  8. 一种电路板组件的制作方法，其特征在于，包括：
    提供芯片，所述芯片包括基板、晶片和第一焊料，所述基板包括相对的第一表面和第二表面，所述第一表面包括第一区域和第二区域，所述晶片通过所述第一焊料固定于所述第二区域；
    提供电路板；
    在所述电路板上设置第三焊料；
    将所述芯片设置于所述电路板上，以使所述基板的所述第二表面与所述第三焊料相接触，所述电路板与所述基板之间设置有支撑件；
    在所述第一区域上设置施压部件；
    进行回流焊接，以熔化所述第三焊料，并使所述电路板与所述基板至少通过所述第三 焊料固定连接；
    去除所述施压部件。
  9. 根据权利要求8所述的制作方法，其特征在于，所述施压部件包括连接部以及位于所述连接部上的压接部，所述连接部和所述压接部为一体式结构；
    所述在所述第一区域上设置施压部件的步骤，包括：
    将所述施压部件放置于所述第一区域，以使所述压接部背离所述连接部的一端与所述第二区域相接触。
  10. 根据权利要求8所述的制作方法，其特征在于，所述施压部件包括连接部以及位于所述连接部上的压接部，所述连接部和所述压接部为分体式结构；
    所述在所述第一区域上设置施压部件的步骤，包括：
    将所述压接部放置于所述第一区域，以使所述压接部背离所述连接部的一端与所述第二区域相接触；
    将所述连接部放置于所述压接部背离所述基板的表面。
  11. 根据权利要求8-10任一项所述的制作方法，其特征在于，在所述将所述芯片设置于所述电路板上的步骤之前，所述制作方法还包括：
    提供所述支撑件；
    将所述支撑件设置于所述电路板上。
  12. 根据权利要求8-10任一项所述的制作方法，其特征在于，所述提供芯片的步骤，包括：
    将所述晶片通过所述第一焊料固定于所述基板的所述第一表面；
    提供所述支撑件；
    将所述支撑件固定于所述基板的所述第二表面。
  13. 根据权利要求8-12任一项所述的制作方法，其特征在于，所述支撑件的数量为多个，多个所述支撑件中至少存在两个所述支撑件沿第一方向的尺寸相同，所述第一方向为所述电路板和所述芯片的层叠方向。
  14. 根据权利要求13所述的制作方法，其特征在于，每个所述支撑件沿所述第一方向的尺寸均相同。
PCT/CN2023/096208 2022-06-20 2023-05-25 电路板组件、电子设备及电路板组件的制作方法 WO2023246418A1 (zh)

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CN103857174A (zh) * 2012-12-06 2014-06-11 三星电机株式会社 印刷电路板及其制造方法
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JP2016127219A (ja) * 2015-01-08 2016-07-11 三菱電機株式会社 半導体デバイスの製造方法および半導体デバイス
JP2019080040A (ja) * 2017-10-19 2019-05-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． スティフナ及びこれを含むパッケージ基板
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Publication number Priority date Publication date Assignee Title
US20050077080A1 (en) * 2003-10-14 2005-04-14 Adesoji Dairo Ball grid array (BGA) package having corner or edge tab supports
CN103857174A (zh) * 2012-12-06 2014-06-11 三星电机株式会社 印刷电路板及其制造方法
US20150146399A1 (en) * 2013-11-25 2015-05-28 Lakshminarayan Viswanathan Packaged semiconductor devices and methods of their fabrication
JP2016127219A (ja) * 2015-01-08 2016-07-11 三菱電機株式会社 半導体デバイスの製造方法および半導体デバイス
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