WO2023187876A1 - 荷電粒子線装置の調整方法及び荷電粒子線装置 - Google Patents

荷電粒子線装置の調整方法及び荷電粒子線装置 Download PDF

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Publication number
WO2023187876A1
WO2023187876A1 PCT/JP2022/014901 JP2022014901W WO2023187876A1 WO 2023187876 A1 WO2023187876 A1 WO 2023187876A1 JP 2022014901 W JP2022014901 W JP 2022014901W WO 2023187876 A1 WO2023187876 A1 WO 2023187876A1
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Prior art keywords
light
sample
particle beam
adjustment
irradiation position
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PCT/JP2022/014901
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English (en)
French (fr)
Japanese (ja)
Inventor
秀憲 町屋
好文 關口
直也 中井
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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Priority to PCT/JP2022/014901 priority Critical patent/WO2023187876A1/ja
Priority to US18/839,987 priority patent/US20250157785A1/en
Priority to KR1020247028173A priority patent/KR20240134220A/ko
Priority to JP2024511344A priority patent/JP7760044B2/ja
Priority to PCT/JP2023/003515 priority patent/WO2023188810A1/ja
Priority to TW112109713A priority patent/TWI856565B/zh
Publication of WO2023187876A1 publication Critical patent/WO2023187876A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H01J37/228—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination or light collection take place in the same area of the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/261—Details
    • H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/1501—Beam alignment means or procedures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20292—Means for position and/or orientation registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24571—Measurements of non-electric or non-magnetic variables
    • H01J2237/24578—Spatial variables, e.g. position, distance

Definitions

  • the present disclosure relates to a method for adjusting a charged particle beam device and a charged particle beam device.
  • Patent Document 1 discloses a technique for preventing charging by irradiating a charged particle beam at the same time as irradiating a light beam.
  • Patent Document 2 describes the difference between a first observed image obtained when only a primary charged particle beam is irradiated and a second observed image obtained when light is irradiated in addition to the primary charged particle beam. Based on this, a charged particle beam device is disclosed that determines whether or not the irradiation position of a primary charged particle beam matches the irradiation position of light. Further, Patent Document 2 states that the adjustment sample used for specifying the light irradiation position has patterns repeatedly arranged in a grid pattern when viewed from the top, and that the pattern position coordinates can be recognized by the marks, as described above. It is disclosed that the irradiation position of the primary charged particle beam and the irradiation position of the light are matched by adjusting so that the difference is small.
  • Patent Document 3 discloses a method for adjusting the irradiation position of a charged particle beam and a light beam.
  • Patent Document 4 discloses a method in which an area irradiated with ultraviolet rays is displayed as a photoelectron image, and the photoelectron image and the backscattered electron image are displayed in a superimposed manner on a monitor.
  • Patent Document 5 discloses an optical height detection method in which a two-dimensional slit light is projected onto an object from diagonally above, the reflected light is detected, and the height of the object is detected by excluding the slit portion where the detection error is large. A method is disclosed.
  • the present disclosure aims to accurately match the irradiation position of a charged particle beam and the irradiation position of light using a simple method.
  • a method for adjusting a light irradiation position includes: a particle beam source that irradiates a sample with a charged particle beam; a particle beam detector that detects the particle beam from the sample and generates a particle beam electric signal; A light source that generates the first light to be irradiated, a movable mechanism that can move the irradiation position of the first light, and a photoelectric generator that detects the second light emitted from the sample by the irradiation of the first light.
  • a method for adjusting the irradiation position of first light in a charged particle beam device comprising a photodetector that generates a signal, a sample stage having a configuration in which a sample can be placed and moved, and a control device.
  • the light source irradiates the first light onto the adjustment sample that is set on the sample stage and includes the reference structure
  • the photodetector detects that the first light is modulated by the reference structure.
  • the generated second light is detected and a photoelectric signal is sent to the control device, and the control device issues a command to change the irradiation position of the first light so that it passes through the reference structure, and responds to the change in the photoelectric signal.
  • the movable mechanism is adjusted so that the irradiation position of the charged particle beam and the irradiation position of the first light coincide.
  • a charged particle beam device includes a particle beam source that irradiates a sample with a charged particle beam, a particle beam detector that detects a particle beam from the sample and generates a particle beam electric signal, and a particle beam detector that irradiates the sample with a particle beam.
  • a light source that generates the first light
  • a movable mechanism that can move the irradiation position of the first light
  • a photoelectric signal that detects the second light emitted from the sample by the irradiation of the first light.
  • a charged particle beam device comprising: a photodetector that generates a sample; a sample stage configured to allow a sample to be placed and moved; and a control device; , which includes a reference structure, is irradiated with the first light, and the photodetector detects the second light generated by the modulation of the first light by the reference structure, and generates a photoelectric signal.
  • the control device issues a command to change the irradiation position of the first light so that it passes through the reference structure, and changes the irradiation position of the charged particle beam and the first light based on the change in the photoelectric signal. Adjust the movable mechanism so that the irradiation position matches the light irradiation position.
  • the irradiation position of a charged particle beam and the irradiation position of light can be accurately matched with each other using a simple method.
  • FIG. 1 is a schematic configuration diagram showing a charged particle beam device of Example 1.
  • FIG. It is a figure showing the light irradiation area in a sample.
  • FIG. 2 is a cross-sectional view showing an example of the adjustment sample 6 of FIG. 1.
  • FIG. It is a top view which shows the adjustment sample 6 of FIG. 3A.
  • FIG. 3B is an enlarged view of a region 6p indicated by a dotted square in FIG. 3B.
  • 3A is a sectional view showing a modification of the adjustment sample 6 of FIG. 3A.
  • FIG. FIG. 2 is a top view showing the overall structure of a preparation sample used in Example 1.
  • 2 is a configuration diagram showing an example of a control system 5 in FIG. 1.
  • FIG. 1 is a schematic configuration diagram showing a charged particle beam device of Example 1.
  • FIG. It is a figure showing the light irradiation area in a sample.
  • FIG. 2 is a cross-sectional view showing an example of the adjustment sample
  • FIG. 3 is a flowchart showing a method for adjusting a light irradiation position in Example 1.
  • FIG. FIG. 3 is a diagram showing an adjustment GUI in the first embodiment.
  • FIG. 3 is a diagram showing an adjustment GUI in the first embodiment.
  • 5 is a graph showing an example of mirror angle dependence of secondary light intensity in Example 1.
  • FIG. 7 is a graph showing another example of the mirror angle dependence of the secondary light intensity in Example 1.
  • FIG. 7 is a cross-sectional view showing an example of a reference structure used in Modification 1.
  • FIG. 7 is a cross-sectional view showing another example of the reference structure used in Modification 1.
  • FIG. 7 is a cross-sectional view showing another example of the reference structure used in Modification 1.
  • FIG. 7 is a cross-sectional view showing another example of the reference structure used in Modification 1.
  • FIG. 7 is a cross-sectional view showing an example of a reference structure used in Modification 2.
  • FIG. 7 is a cross-sectional view showing an example of a reference structure used in Modification 3.
  • FIG. 7 is a cross-sectional view showing another example of the reference structure used in Modification 3.
  • FIG. 7 is a schematic diagram showing the influence when the height of the sample changes in Example 2.
  • FIG. 2 is a schematic configuration diagram showing a charged particle beam device of Example 2.
  • 3 is a cross-sectional view showing an example of a preparation sample used in Example 2.
  • FIG. 3 is a cross-sectional view showing another example of the adjustment sample used in Example 2.
  • FIG. 7 is a flowchart showing a method for calibrating a mirror angle according to a second embodiment.
  • FIG. 7 is a diagram illustrating an example of a setting screen, which is a calibration GUI according to the second embodiment.
  • FIG. FIG. 7 is a diagram showing an example of a measurement value and an adjustment result of a sample height, which is a calibration GUI of Example 2;
  • 7 is a flowchart showing a method for adjusting an irradiation position in Example 2.
  • FIG. 7 is a graph for explaining a method for determining a mirror angle in Example 2.
  • FIG. FIG. 3 is a configuration diagram showing a light irradiation system and a light detection system of Example 3.
  • FIG. 7 is a configuration diagram showing a light irradiation system and a light detection system of Example 4. It is a block diagram which shows the modification of an optical system.
  • FIG. 7 is a top view showing an example of a preparation sample of Example 5.
  • 13 is a flowchart showing an adjustment procedure for obtaining a coordinate transformation formula in Example 5.
  • 12 is a diagram illustrating an example of a GUI for displaying adjustment results in Example 5.
  • a method for adjusting a light irradiation position in a charged particle beam device includes: an adjustment sample including a reference structure that generates new light in response to light irradiation; a control device that controls the light irradiation position; Using a photodetector that detects and generates an electrical signal, the control device moves the irradiation position of the light so that it passes through the reference structure, and calculates the relative position of the charged particle beam to the irradiation position based on the change in the electrical signal. Adjust the light irradiation position.
  • FIG. 1 is a schematic configuration diagram showing the charged particle beam device of this example.
  • the charged particle beam device includes a light irradiation system 1, a photodetection system 2, an electron optical system 3, a sample stage system 4 (sample stage), and a control system 5 (control device).
  • a light irradiation system 1 a photodetection system 2
  • an electron optical system 3 a sample stage system 4 (sample stage)
  • a control system 5 control device
  • the electron optical system 3 is configured to generate a SEM image, and includes an electron beam source 3a (particle beam source), an electron beam focusing section 3b, an electron beam detection section 3c (particle beam detector), and a SEM image generation system. It is composed of a section 3d.
  • the electron beam emitted from the electron beam source 3a passes through the electron beam condenser 3b and is irradiated onto one point of the sample placed on the sample stage. Signal electrons emitted from the sample are converted into electrical signals (particle beam electrical signals) by the electron beam detection section 3c.
  • the SEM image generation unit 3d generates an image by recording the generated electrical signals.
  • SEM is an abbreviation for Scanning Electron Microscope.
  • the sample stage system 4 includes a sample stage 4a on which a sample is placed, and a movable stage 4b that moves the sample stage 4a.
  • a sample is placed on the sample stage 4a, and its position can be changed by a movable stage 4b.
  • an adjustment sample 6 is placed on the sample stage 4a.
  • the adjustment sample 6 has a reference structure 6a.
  • the light irradiation system 1 includes a light source 1a and a light irradiation position adjustment section 1b.
  • the light irradiation position adjustment section 1b includes an optical element 1c and a movable stage 1d.
  • the light source 1a is any light source having wavelengths from X-rays to infrared rays, and may be a laser light source, an LED, a lamp, or the like. The wavelength may be fixed or a variable wavelength light source may be used. Further, the light source 1a may be a multicolored light source that is a combination of a plurality of light sources. Furthermore, the light source 1a may be a pulsed light source or a continuous wave light source.
  • the light source 1a when used for the purpose of removing electrical charges on a sample with light, it is necessary to excite charges in the sample, so it emits high-energy light, particularly continuous light with a wavelength of 450 nm or less. Something is desirable.
  • the light source 1a emits a light beam Ray1 toward the light irradiation position adjustment section 1b.
  • the optical element 1c of the light irradiation position adjustment section 1b is a mirror.
  • the movable stage 1d adjusts the angle of the optical element 1c so that the light beam Ray1 is irradiated to an appropriate position on the sample.
  • the light irradiation position adjustment section 1b is a movable mechanism that can move the irradiation position of the light beam Ray1.
  • the position where the light beam Ray1 is irradiated will also be referred to as the "light irradiation position.”
  • a lens or a prism can also be used as the optical element 1c.
  • the light irradiation position may be changed by moving the position of the optical element 1c using the movable stage 1d.
  • the light beam Ray1 enters obliquely through the light irradiation position adjustment section 1b so as not to affect the trajectory of the electron beam, and is irradiated onto the sample.
  • the light Ray1 may be emitted as parallel light, or may be focused using a lens or a curved mirror and emitted.
  • the method of incidence is not limited to this method; for example, a mirror with a hole through which the electron beam passes is installed in the electron optical system 3, and the light beam Ray1 is incident parallel to the electron beam and perpendicular to the sample. You may irradiate with light Ray1. Alternatively, the light may be guided to the charged particle beam device through an optical fiber or the like. In either method, it is sufficient that the sample can be irradiated with the light beam Ray1.
  • a secondary light Ray2 which is light obtained by modulating the light ray Ray1
  • the modulated light is, for example, new light generated in response to the light ray Ray1.
  • the secondary light Ray2 include diffracted light, fluorescence, scattered light, and the like.
  • the reflected light is transferred to the reference structure 6a. It can also be thought of as newly generated light. Therefore, in this case, reflected light (reflected light) may be considered to be included in the secondary light.
  • the modulated light is not limited to the secondary light shown in the above example.
  • the light that is attenuated by the reference structure 6a absorbing light is not new light emitted by the reference structure 6a, and therefore is not secondary light, but is a type of light modulated by the reference structure 6a. It can be considered that Therefore, such dimmed light can also be used to adjust the light irradiation position.
  • first light the light irradiated onto the sample from the light source 1a
  • second light the light irradiated onto the sample from the light source 1a
  • first light the light irradiated onto the sample from the light source 1a
  • second light the light such as secondary light and attenuated light that travels from the sample to the photodetector
  • the photodetection system 2 detects the secondary light Ray2.
  • the photodetection system 2 includes a light receiving element that converts the energy of the secondary light Ray2 into an electrical signal (photoelectric signal).
  • an optical filter or lens may be additionally used to clearly detect the secondary light Ray2.
  • the light receiving element is an element that converts light into an electrical signal, and can be a CMOS, a CCD camera, a photomultiplier tube, a silicon photomultiplier, a photodiode, or the like.
  • the electron beam detection unit 3c of the electron optical system 3 may be used for detection.
  • an Everhart-Thornley detector (hereinafter referred to as "ET detector") is typical as the electron beam detector 3c.
  • the ET detector includes a scintillator and a light guide.
  • the secondary light Ray2 is converted into an electrical signal by a configuration in which it is directly incident on the light receiving element, or a configuration in which a scintillator emits fluorescence and the fluorescence is detected by the light receiving element.
  • the secondary light Ray2 may be incident on an intermediate light guide, guided, and incident on the light receiving element.
  • detectors include Si photodiodes, which are semiconductor detectors.
  • the Si photodiode can be used for the photodetection system 2 because it can detect both light and electrons.
  • the electron beam detection section 3c is used as in this embodiment, the circuit and software for processing the electric signals of the detector can be shared, so it is suitable for an SEM or an electron beam lithography apparatus having an SEM function.
  • the irradiation position can be adjusted without adding any mechanism or software to the existing charged particle beam device.
  • a method may be used in which the light source 1a modulates the output at the frequency f and the photodetection system 2 extracts and detects only the frequency f component, that is, lock-in detection.
  • lock-in detection it is possible to provide an adjustment method that is robust against disturbances such as light incident from outside the charged particle beam device.
  • FIG. 2 is a diagram showing the light irradiation area on the sample.
  • the elliptical area 7a is irradiated.
  • the minor axis diameter of the elliptical region 7a is d
  • the major axis diameter is D
  • the center position is (x, y).
  • the reference structure 6a is adjusted by the sample stage system 4 so that its center is the irradiation position of the electron beam.
  • the portion where the elliptical region 7a and the reference structure 6a overlap is a region 6aL, and the secondary light is emitted from the region 6aL.
  • the elliptical region 7a has a spatial distribution in which the power density is high at the center and decreases as the distance from the center increases. For example, consider the Gaussian spatial distribution that occurs when a laser is used as a light source.
  • the amount of secondary light is determined by the area of the region 6aL and the distance from the center of the elliptical region 7a.
  • the amount of secondary light becomes maximum when the center of the reference structure 6a and the center of the ellipse region 7a coincide. Therefore, by adjusting the light irradiation position (x, y) so that the amount of secondary light becomes maximum, the center of the reference structure 6a and the light irradiation position can be made to coincide.
  • the center of the reference structure 6a is adjusted in advance by the electron optical system 3 and sample stage system 4 so that it coincides with the irradiation position of the electron beam. Therefore, by using the reference structure 6a according to the above principle, the light irradiation position and the electron beam irradiation position can be accurately matched.
  • the center position (x, y) of the light can be adjusted by a movable part that moves the angle of the mirror.
  • the movable axis of the movable part may be in only one direction, it is more preferable to have a movable axis in two directions (H, V) because the irradiation position can be set at arbitrary coordinates within the XY plane, that is, within the sample plane. For example, when the movable axis H is moved, the irradiation position moves to (x', y'). Similarly, when the movable axis V is moved, the irradiation position moves to (x'', y'').
  • the range that the irradiation position can take when these movable axes (H, V) are moved to the maximum is hereinafter referred to as the irradiation position movable range 7b.
  • the size in the H direction be R H and the size in the V direction be R V .
  • FIG. 3A is a cross-sectional view showing an example of the adjustment sample 6 of FIG. 1.
  • the adjustment sample 6 has a flat substrate 6S and a reference structure 6a that is an aggregate of a plurality of fine protrusions provided at the center of the substrate 6S.
  • the substrate 6S is formed of, for example, a Si substrate.
  • the reference structure 6a is formed of a plurality of protrusions having a height of, for example, about 100 nm, and is made of, for example, Si.
  • the reference structure 6a emits secondary light Ray2 in response to irradiation with the light Ray1.
  • FIG. 3B is a top view showing the adjustment sample 6 of FIG. 3A.
  • the reference structure 6a has a circular shape.
  • a cross-shaped center mark 6c is provided at the center of the reference structure 6a.
  • FIG. 3C is an enlarged view of the region 6p indicated by a dotted square in FIG. 3B.
  • the region 6p of the reference structure 6a has a structure in which a plurality of protrusions 6b are arranged at equal intervals in the vertical and horizontal directions.
  • Each protrusion 6b has a cylindrical shape.
  • the diameter of each protrusion 6b is, for example, about 100 nm.
  • the distance between adjacent protrusions 6b, that is, the period A, is calculated as follows, where ⁇ is the wavelength of light, n is the refractive index of the medium through which the light enters the periodic structure, and d is the minor axis diameter of the elliptical region 7a (FIG. 2). Satisfies the relational expression.
  • the periodic structure there is a periodic structure with at least one period in the light irradiation region (elliptical region 7a), and since the period A is larger than the wavelength ⁇ , the periodic structure functions as a diffraction grating. If the periodic structure is designed appropriately, the diffracted light can be generated in the direction of the detector, so the diffracted light can be used as the secondary light Ray2. Since the diffracted light can be diffracted to a specific diffraction angle, the secondary light Ray2 can be selectively emitted toward the detector. Therefore, it is possible to reliably detect the secondary light Ray2.
  • the periodic structure is desirably made of Si, SiO 2 or the like, which is not easily deteriorated by exposure to ultraviolet light or electron beams or exposure to the atmosphere. This is because it has the effect of being able to be used stably over a long period of time.
  • FIG. 3D is a cross-sectional view showing a modification of the adjustment sample 6 of FIG. 3A.
  • the reference structure 6a of the adjustment sample 6 is covered with a protective layer 6S'.
  • the material of the protective layer 6S' may be any material that allows the light beam Ray1 to pass through, and for example, SiO 2 or the like may be used.
  • the refractive index n of the medium is the refractive index of the protective layer 6S'.
  • the adjustment sample 6 since the adjustment sample 6 has the protective layer 6S', the reference structure 6a can be protected from foreign substances. Further, even if the adjustment sample 6 is cleaned by ultrasonic cleaning or the like, the reference structure 6a is not damaged, so the adjustment sample 6 can be used repeatedly.
  • the outer shape of the reference structure 6a may be any shape, it is more preferable to have a shape having rotational symmetry about the center of the reference structure 6a.
  • the amount of secondary light Ray2 emitted from the portion overlapping with the light irradiation area (elliptical area 7a) is monotonous depending on the distance from the center, regardless of the orientation of the reference structure 6a. This is because the positional adjustment becomes easier because the number increases.
  • the outer shape of the reference structure 6a may be a perfect circle as shown in this embodiment.
  • the shape may be a polygon that approximates a perfect circle.
  • the center mark 6c is formed by removing a part of the protrusion 6b forming the reference structure 6a to expose the underlying Si substrate. Further, the reference structure 6a may be formed without forming the protrusion 6b in the portion to be the center mark 6c.
  • a protrusion having a shape different from that of the protrusion 6b may be arranged at the position of the center mark 6c.
  • the material of the protrusion forming the center mark 6c may be the same as that of the reference structure 6a, or may be a different material such as metal.
  • the center mark 6c is used to confirm the center of the reference structure 6a using the SEM image and to move the sample stage system 4. Therefore, the shape of the center mark 6c may be any shape as long as it can be confirmed in the SEM image, and may be a circular shape, an elliptical shape, an L-shape, a square shape, or the like.
  • the outer dimension of the center mark 6c needs to be within the range of 10 nm or more and 1 mm or less, and should be within the field of view of the SEM. It is further desirable that the outer dimension of the center mark 6c be smaller than the light irradiation diameter d. This is because it is possible to suppress a decrease in the intensity of the secondary light due to the center mark 6c.
  • the center mark can be omitted because the center can be confirmed using the reference structure 6a itself as a marker. You can also do it.
  • FIG. 4 is a top view showing the overall structure of the adjustment sample used in this example.
  • the adjustment sample 6 shown in this figure has two reference structures: a coarse adjustment reference structure 6a' and a fine adjustment reference structure 6a''.
  • the outer shape of the rough adjustment reference structure 6a' is larger than the outer shape of the fine adjustment reference structure 6a'', it is suitable for roughly adjusting the light irradiation position.
  • the outer dimensions of the fine adjustment reference structure 6a'' smaller than the light irradiation diameter d (Fig. 2), the amount of change in the amount of secondary light increases with respect to the deviation of the light irradiation position, making it more accurate.
  • the light irradiation position can be adjusted. Note that when the sample is used for periodic fine adjustment of the light irradiation position, the deviation of the light irradiation position is considered to be small, so an adjustment sample without the coarse adjustment reference structure 6a' may be used.
  • both the rough adjustment reference structure 6a' and the fine adjustment reference structure 6a'' have a similar periodic structure. That is, both have a structure in which a plurality of protrusions 6b are arranged at similar intervals.
  • the photodetection system 2 only needs to respond to a single type of secondary light Ray2, which simplifies the configuration of the optical system and facilitates the preparation of the adjustment sample 6. This effect is achieved.
  • the coarse adjustment reference structure 6a' and the fine adjustment reference structure 6a'' may be of different types.
  • a periodic structure although its dimensions cannot be made smaller than the period A, it is possible to make a smaller reference structure by using, for example, a phosphor, which is suitable for highly accurate adjustment.
  • the coarse adjustment reference structure 6a' and the fine adjustment reference structure 6a'' need to have a large distance L from the adjacent reference structure so that they can be distinguished from the secondary light Ray2 emitted from the adjacent reference structure. .
  • R is the larger value of the movable ranges R H and R V. More preferably, L>R+D/2, taking into account the major axis diameter D of the elliptical region 7a (FIG. 2) that is the light irradiation region.
  • the reference structures that emit different types of secondary light Ray2 are arranged next to each other, the reference structures can also be arranged closer than the above-mentioned distance L.
  • different types of secondary light mean, for example, secondary light of different wavelengths. Fluorescence is light with a wavelength different from that of incident light, so it can be realized by combining a periodic structure that generates diffracted light with a phosphor, or by combining phosphors that emit light at different wavelengths. By changing the wavelength of the secondary light emitted from the adjacent structures in this way, the secondary light from the adjacent reference structures can be removed by a color filter or the like.
  • a polarizer is used.
  • secondary optical signals from adjacent structures can be separated.
  • the size of the center mark 6c' of the coarse adjustment reference structure 6a' and the center mark 6c'' of the fine adjustment reference structure 6a'' may be enlarged or reduced according to the outer shape of each reference structure. .
  • FIG. 5 is a configuration diagram showing an example of the control system 5 in FIG. 1.
  • the control system 5 includes a SEM image processing section 5a, a sample stage control section 5b, a light control section 5c, a display section 5d, and a storage section 5e.
  • the SEM image processing section 5a detects the center mark 6c of the reference structure 6a of the adjustment sample 6 shown in FIG. 3 based on the SEM image generated by the SEM image generation section 3d.
  • the sample stage control unit 5b moves the movable stage 4b (FIG. 1) so that the center mark 6c of the reference structure 6a is located at the center of the SEM image.
  • the light control unit 5c controls the mirror angle (H, V) based on the signal intensity of the secondary light Ray2, and adjusts the light irradiation position.
  • the display section 5d displays SEM images and adjustment results.
  • the storage unit 5e records the adjusted mirror angle.
  • FIGS. 6, 7A, 7B, 8A, and 8B The basic operation of the method for adjusting the light irradiation position will be explained using FIGS. 6, 7A, 7B, 8A, and 8B.
  • the user selects the adjustment sample 6 and reference structure 6a to be used (step S1). For example, as shown in Figure 7A, the user can select from a list using the GUI (8a).
  • the control device places the adjustment sample on the sample stage using a transport arm or the like according to the user's selection. Further, the control device moves the sample stage to a position where the selected reference structure is captured in the SEM image.
  • step S2 to S3 the stage is moved to the center of the mark while checking the SEM image.
  • the user selects the magnification at which the center mark can be confirmed using the GUI (8b).
  • the control device automatically moves the sample stage using algorithms such as pattern matching.
  • the user sets the XY coordinates 8d of the sample stage so that the center mark of the reference structure is at the center of the image.
  • the user sets conditions for adjusting the light irradiation position (step S4).
  • the user sets the output power 8e of the irradiating laser in order to prevent the detector signal from being saturated.
  • the detector 8f that detects the secondary light Ray2 is selected from the list. For example, in this embodiment, it is desirable to select the electron beam detection section 3c at a position where the secondary light Ray2 is most likely to enter.
  • mirror angle scan ranges 8g are set for the two axes H and V, respectively.
  • the scan range is the range in which the mirror angle is changed in order to search for the optimal mirror angle, and for example, the start and end points of the scan can be set on the GUI.
  • a GUI configuration may be used in which the center and width of the range can be specified.
  • the user also selects which of the two axes H and V to adjust first on the GUI (8h).
  • the axis H is selected to be adjusted first, but even if the axis V is set to be adjusted first, the adjustment can be performed using the same procedure.
  • the user can select to what value the angle of the unselected one, that is, the axis V, should be set using the GUI (8i). For example, it is possible to specify that the central value of the scan range set by the user is to be used, or it may be possible to manually set an arbitrary value.
  • the user can set how to set the angle of the other axis, that is, the axis H, using the GUI (8j) during the second stage adjustment, that is, the adjustment of the axis V.
  • the optimum value obtained as a result of adjusting the axis H in the first stage adjustment is set to be used.
  • the control device starts light irradiation (step S5) and moves the angle of the axis V (step S6). Thereafter, while changing the value of the axis H, the angle of the axis H at which the magnitude of the electrical signal of the detector selected by the user is maximized is extracted (step S7). For example, the secondary optical signal is recorded while changing the angle of the axis H at regular intervals.
  • the amount of secondary light increases when the light irradiation position passes through the reference structure, when the secondary light intensity is plotted as a function of the mirror angle, it becomes a mountain-like function as shown in FIG. 8A. In other words, in FIG. 8A, when the amount of secondary light is measured in the direction of the axis H as shown in FIG. 2, the amount of secondary light becomes a curve with a prominent maximum value.
  • the result is displayed as the first scan result (graph 8k) in the adjustment result window as shown in FIG. 7B.
  • the mirror angle that takes the maximum value is the adjusted mirror angle.
  • a gradient method can also be used to find the mirror angle at which the secondary light intensity is maximum.
  • the gradient method is an algorithm also called the steepest descent method, and because it can find local maximum values and local minimum values with a small number of trials, it has the advantage that adjustment can be completed quickly.
  • a step function type curve (on the axis H) as shown in FIG. 8B is formed instead of a mountain curve as shown in FIG. 8A.
  • a curve having a range in which the amount of secondary light has a substantially constant maximum value with respect to changes) is obtained.
  • the power density within the light irradiation area (elliptical area 7a) has a spatially uniform distribution, that is, a flat-top spatial distribution
  • a step function type curve as shown in FIG. 8B is also applied. becomes.
  • the optimal value of the mirror angle is (H0 + H1)/2, and the center of the peak is You can ask for it.
  • the algorithm for extracting the optimal mirror angle from the data shown in FIGS. 8A and 8B is not limited to the method using the maximum value or the method using the peak center as described above. Any algorithm may be used as long as it provides an optimal value based on the mirror angle dependence of the signal amount output by the photodetection system. For example, a method of fitting a Gaussian function may be used, or a machine learning model may be used. A plurality of algorithms may be implemented in the control device. The control device may automatically determine and select which algorithm to use, or the user may be able to select it on the GUI.
  • control device adjusts the other adjustment axis, that is, axis V, in the same procedure (steps S8 to S9), and the second scan result (graph 8l) is displayed.
  • the conditions at the time of adjustment such as the laser power and the detector used, are also displayed in column 8m.
  • the user can perform the adjustment procedures of steps S1 to S9 by sequentially performing the coarse adjustment reference structure and the fine adjustment reference structure.
  • the adjustment procedures of steps S1 to S9 by sequentially performing the coarse adjustment reference structure and the fine adjustment reference structure.
  • the scanning position of the mirror is greatly deviated, the light will not hit the reference structure and it will not be possible to extract the mirror angle that maximizes the secondary light intensity.
  • By performing the adjustment using the adjustment reference structure it is possible to roughly adjust the irradiation position.
  • the set values of the movable axes H and V are stored in the storage unit 5e (FIG. 5).
  • all information used for configuration is saved.
  • the detector used for setting, H, V range, etc. The results may be saved automatically or the user may review the results and then save them manually.
  • the set value of the mirror angle that accurately matches the electron beam irradiation position and the light irradiation position can be recorded and recalled later. Note that if the deviation between the irradiation positions of the electron beam and the light is small, the coarse adjustment procedure may be omitted and the fine adjustment may be performed from the beginning.
  • the adjustment method includes an adjustment sample including a reference structure that generates secondary light in response to light irradiation, a control device that controls the light irradiation position, and a control device that detects the secondary light and generates an electrical signal.
  • the control device sequentially moves the light irradiation position in two directions so as to pass through the reference structure, and maximizes the amount of secondary light generated, thereby changing the light irradiation position to the electron beam. This has the effect that the irradiation position can be accurately adjusted.
  • the adjustment method according to this embodiment can also be applied to the removal of charge on a sample caused by irradiation with a charged particle beam.
  • the charge generated by the light irradiation can be efficiently injected into the charged region, thereby improving the charge removal effect.
  • Modification example 1 of reference structure In Modification 1, an example in which a phosphor is used as the reference structure will be described.
  • the phosphor may be any material as long as it emits light of different wavelengths depending on the light, for example, it may be a material such as YAG having a luminescent center, or it may be a semiconductor such as GaN. Alternatively, a material having a fine structure such as quantum dots, nanowires, quantum wells, etc. may be used.
  • the emission wavelength may be any wavelength from ultraviolet to infrared, for example, but when using an ET detector as a secondary photodetector, if the emission wavelength is the same as that of the scintillator, a wavelength range with high detection sensitivity can be used. Better for.
  • a wavelength range in which the sensitivity of the light-receiving element constituting the ET detector is high it is preferable to use a wavelength range in which the sensitivity of the light-receiving element constituting the ET detector is high.
  • a phosphor is used as a reference structure, it is possible to use light with a wavelength different from the incident light as secondary light, so by using a color filter or dichroic mirror, it is not affected by the incident light or reflected light. This has the effect that secondary light can be clearly detected.
  • FIG. 9A is a cross-sectional view showing an example of a reference structure used in Modification 1.
  • the adjustment sample 6 has a phosphor reference structure 6a.
  • the reference structure 6a may have a flat structure, the amount of secondary optical signals can be increased by changing the structure.
  • FIG. 9B is a sectional view showing another example of the reference structure used in Modification 1.
  • a fine structure such as an uneven structure 6d of SiO 2 is formed on the surface of a substrate (made of Si) of the adjustment sample 6, and the surface of the uneven structure 6d is covered with a phosphor.
  • FIG. 9C is a top view showing another example of the reference structure used in Modification 1.
  • the phosphor is provided to form an optical resonator structure.
  • an optical resonator used as the reference structure 6a shown in this figure there is, for example, an H1 type photonic crystal resonator 6e.
  • the optical resonator structure is not limited to these, and may be a Fabry-Perot resonator or a microdisk resonator. These optical resonators can increase the amount of light emitted, so the amount of secondary light can be increased.
  • adding an optical structure to the phosphor makes it possible to increase the amount of secondary light that can be detected, resulting in the effect that the secondary light can be clearly detected.
  • Modification example 2 of reference structure In Modification 2, a case will be described in which a scatterer is used as the reference structure.
  • FIG. 10 is a cross-sectional view showing an example of the reference structure used in this modification.
  • the scatterer 6f is a structure that emits light of the same wavelength in an angular range depending on the incident light.
  • the angular range of scattering is determined by the surface roughness Rz of the scatterer 6f, and it is preferable to use a structure in which the photodetector is included in the angular range because the secondary light can be clearly detected.
  • the secondary light emitted from the scatterer 6f is emitted in various directions, so if the scatterer 6f is used as a reference structure, it can be used with many types of charged particle beam devices with different detector positions. be effective.
  • the scatterer 6f is not limited to this.
  • examples include a scatterer in which titanium oxide is dispersed in a resin, a scatterer in which a polyester film having a large number of flat voids is used, and a scatterer in which a diffusion material such as barium sulfate is used.
  • FIG. 11A is a cross-sectional view showing an example of a reference structure used in this modification.
  • the adjustment sample 6 has a reference structure 6g of a micromirror.
  • the surface of the micromirror is a mirror surface, and the light reflected by the micromirror becomes secondary light.
  • the light specularly reflected on the outside of the reference structure 6g (the substrate surface of the adjustment sample 6) is directed in the opposite direction to the incident light with the normal to the substrate surface of the adjustment sample 6 as the axis of symmetry, that is, at an angle of ⁇ Head in the direction of. Therefore, the detector can detect only the light reflected by the micromirror.
  • the micromirror may be made of a metal that has a high reflectance in the wavelength range of incident light, or may be a dielectric multilayer mirror.
  • the surface of the micromirror may be a curved surface; for example, in the case of a paraboloid, light can be detected more efficiently by arranging the detector at the focal point of the paraboloid.
  • FIG. 11B is a cross-sectional view showing another example of the reference structure used in this modification.
  • the adjustment sample 6 has a reference structure 6h in which a plurality of mirrors are arranged in an array.
  • the angle ⁇ of the reference structure 6h can be increased without changing the thickness, making it easy to separate the specularly reflected light toward the angle ⁇ direction. Therefore, changes in the amount of secondary light can be clearly detected.
  • the reference structure 6g may be a MEMS mirror, and the angle ⁇ may be controlled by an external control signal.
  • Such a movable mechanism allows the angle of the generated secondary light to be varied, so that detectors at different positions can be made compatible with many different types of charged particle beam devices.
  • This example differs from Example 1 mainly in that the sample stage system of the charged particle beam device includes a sample height sensor.
  • FIG. 12 is a schematic diagram showing the effect when the height of the sample changes in this example.
  • FIG. 13 is a schematic configuration diagram showing the charged particle beam device of this example.
  • the charged particle beam device shown in this figure differs from Example 1 (FIG. 1) in that it includes a height sensor 4c.
  • the height sensor 4c measures the height of the sample. By calibrating the mirror angle to the optimum mirror angle according to the output value of the height sensor 4c, it is possible to adjust the light irradiation position for a sample of any height.
  • FIG. 14A is a cross-sectional view showing an example of the adjustment sample used in this example.
  • the adjustment samples 6i, 6i', 6i'' shown in this figure are used for calibration.
  • the adjustment samples 6i, 6i', and 6i'' have substrates with different thicknesses, and can be adjusted at different heights.
  • FIG. 14B is a cross-sectional view showing another example of the adjustment sample used in this example.
  • the adjustment sample 6j shown in this figure has portions with different thicknesses, and a reference structure 6a is provided in each portion.
  • FIG. 14A will be used as an example, but the same procedure can be used when using a sample as shown in FIG. 14B.
  • FIGS. 14A and 14B only illustrate samples with three types of heights, it goes without saying that samples with more types of heights may be used.
  • Optical lever type height sensors and laser interferometers are suitable as height sensors because they can measure heights with high precision, but measurement methods are not limited to these.
  • a height sensor may be used, or the height may be measured mechanically. Examples of the configuration of the height sensor include the one described in Patent Document 5.
  • FIG. 15 is a flowchart showing a method for calibrating the mirror angle.
  • FIG. 16A is a diagram showing an example of a setting screen that is an operation GUI.
  • FIG. 16B is an operation GUI and is a diagram showing an example of the measured value and adjustment result of the sample height.
  • the user inputs the light irradiation position adjustment settings (8b, 8e, 8f, 8g, 8h, 8i, 8j) (step S10). Since the setting items are the same as those in the first embodiment, their explanation will be omitted.
  • control device automatically uses a transport arm or the like to place the adjustment sample on the sample stage (step S11).
  • control device performs SEM photography without irradiating light (step S12). Then, the stage is moved so that the center mark appears at the center of the SEM image (step S13).
  • the movement to the center can be automatically performed using an algorithm such as pattern matching.
  • a configuration may be adopted in which manual adjustment can be performed by user input.
  • control device adjusts the mirror angles H and V as described in Example 1 (step S14).
  • control device moves the sample stage to a flat area where there is no reference structure (step S15). Then, the height of the sample is measured by the height sensor (step S16). By performing height measurement on a flat portion, the height can be accurately measured without being influenced by the reference structure.
  • the measuring device associates the measured value of the sample height with the adjustment results (H, V) and stores them in the storage unit 5e (step S17). More preferably, conditions such as the laser output and the detector used during adjustment are also saved at the same time.
  • control device takes out the adjustment sample from the sample stage using a transport arm or the like (step S18).
  • control device returns to step S12 and performs adjustment using another height adjustment sample. After completing the adjustment for all the adjustment samples, the adjustment process is completed.
  • the value of the height sensor can be adjusted by changing the height of the movable stage 4b instead of using samples of different heights.
  • a table may be created that associates the values of the mirror angles with the values of the mirror angles.
  • FIG. 17 is a flowchart showing a method for adjusting the irradiation position in Example 2.
  • the user places the sample to be irradiated with the charged particle beam and light on the sample stage (step S20).
  • the sample means a sample to be observed, for example, when the charged particle beam device is an SEM. At this time, the height of the sample may be unknown.
  • control device measures the height of the sample using the height sensor (step S21).
  • control device interpolates or extrapolates the values of the movable axes H and V based on the table 8n (FIG. 16B) and sets them (step S22).
  • FIG. 18 is a graph of table 8n in FIG. 16B.
  • the horizontal axis is the sample height, and the vertical axis is the optimal value of the mirror angle.
  • the movable axis H is shown as an example, but the movable axis V can also be adjusted in the same way.
  • the points shown in the graph of this figure are the values obtained in steps S10 to S17, and the curve is a line connecting these points.
  • the optimal mirror angle h1 is found as the value of the curve L1 with respect to the sample height z1. In other words, by using the curve L1 obtained by interpolation, the optimal mirror angle can be calculated.
  • the sample height is outside the range of the table 8n, it can be determined by extrapolating based on data points within the range.
  • the adjustment method according to this embodiment can automatically adjust the light irradiation position in conjunction with the height sensor. Thereby, even when the light is incident on the sample obliquely, the electron beam irradiation position and the light irradiation position can be accurately matched regardless of the sample height.
  • This example differs from Example 1 mainly in that a photodetector is installed on the path of the incident light.
  • FIG. 19 is a configuration diagram showing only the light irradiation system and the light detection system. The rest of the device configuration is the same as that of Example 1, so the explanation will be omitted.
  • the light irradiation system 1 has a branch part 1e on the path of the incident light.
  • a beam splitter can be used as the branching part 1e.
  • the light Ray1 (incident light) is irradiated onto the reference structure 6a of the adjustment sample 6, secondary light Ray2 is generated.
  • the secondary light Ray2 also goes in the direction exactly opposite to the light beam Ray1 (180 degree direction), so it reaches the branching part 1e. Then, the secondary light Ray2 is divided into a light ray that passes through the branching part 1e and going straight, and a light ray Ray3 that is reflected at the branching part 1e.
  • the light detection system 2 detects the light Ray3 (secondary light).
  • the light irradiation system 1 and the light detection system 2 can be integrated, making it possible to make the charged particle beam device more compact. This has the effect of making installation easier.
  • a dichroic mirror can be used for the branch portion 1e.
  • dichroic mirrors There are two types of dichroic mirrors: short-pass type and long-pass type.
  • the short-pass type has the characteristic that light with wavelengths shorter than a certain wavelength travels straight, and light with longer wavelengths is reflected.
  • a long-pass dichroic mirror has the characteristic that light with wavelengths longer than a certain wavelength travels straight, and light with shorter wavelengths is reflected.
  • the fluorescent light returned from the sample is reflected at the branch part. Since a phosphor is a material that receives energy from incident light and produces light with lower energy than the incident light, that is, with a longer wavelength, a short-pass type dichroic mirror that reflects light with a longer wavelength is suitable as the dichroic mirror. However, if the positions of the light source and the photodetection system are reversed, a long-pass type, in which fluorescent light with a long wavelength travels straight, is suitable. By using a dichroic mirror, the optical path can be switched depending on the wavelength, and more secondary light can enter the detector than when using a beam splitter, resulting in clearer images. This has the effect that secondary light can be detected.
  • a polarizing beam splitter can also be used for the branching part 1e.
  • the polarization of the secondary light needs to be different from the polarization of the incident light, and can be applied, for example, when a scatterer or a fluorescent material is used in the reference structure.
  • the optical path can be switched depending on the polarization.
  • a non-polarizing beam splitter is used, a portion of the secondary optical signal passes straight through the beam splitter. Therefore, using a polarizing beam splitter allows more secondary light to be reflected and incident on the detector. Therefore, there is an effect that the secondary light can be detected more clearly.
  • This example differs from Example 1 mainly in that a photodetector is installed on the path of specularly reflected light.
  • FIG. 20A is a configuration diagram showing only the light irradiation system and the light detection system. The rest of the device configuration is the same as in Example 1, so the explanation will be omitted.
  • the photodetection system 2 includes a branching section 2a, two light receiving elements 2b and 2c, and a signal processing section 2d.
  • the branching section 2a separates the specularly reflected light into reflected light Ray1' and secondary light Ray3'. Secondary light Ray3' is detected by the light receiving element 2b. The branched reflected light Ray1' is detected by the light receiving element 2c.
  • a phosphor is used as the reference structure 6a
  • a dichroic mirror or a polarizing beam splitter can be used as described in the third embodiment.
  • a scatterer is used as the reference structure 6a
  • a polarizing beam splitter can be used as described in the third embodiment.
  • FIG. 21A is a graph showing the signal strength X1 detected by the light receiving element 2b of FIG. 20A.
  • FIG. 21B is a graph showing the signal strength X2 detected by the light receiving element 2c of FIG. 20A.
  • FIG. 21C is a graph showing the electrical signal X3 calculated by the signal processing unit 2d of FIG. 20A.
  • the curve F3 obtained thereby is steeper than the curves F1 and F2 (FIG. 21C). Therefore, when the adjustment described in Example 1 is performed using the curve F3 as an input signal, the change in the signal is large, so the effect is that the irradiation position can be adjusted robustly without being affected by noise etc. play.
  • the arithmetic processing performed by the signal processing unit 2d is not limited to division.
  • subtraction may be performed instead of division, or an exponential function or a logarithmic function may be used.
  • the optical path should be changed to prevent specularly reflected light from going outside the device, or to prevent it from being diffusely reflected inside the device and damaging internal components. It is desirable to provide a terminating beam damper.
  • a beam damper is not required, simplifying the configuration, and the secondary light can be detected more clearly. play.
  • FIG. 20B is a configuration diagram showing a modification of the optical system.
  • the light irradiation system is the same as that in FIG. 20A, so its description will be omitted.
  • the light receiving element 2b uses the electron beam detection section 3c as described in the first embodiment.
  • the branch part 2a of the photodetection system 2 can be omitted, and the light receiving element 2c can be placed directly on the reflected light path.
  • fluorescent light or scattered light may also enter the light receiving element 2c, so the optical element 2a' that removes the secondary light may be used.
  • the light ray Ray1' is detected through. This is desirable because it becomes possible to selectively detect only the reflected light.
  • a color filter or a polarizer can be used as the optical element 2a'.
  • FIG. 20C is a configuration diagram showing a modification of the optical system.
  • the reference structure 6a shown in this figure is made of a light absorber.
  • the light Ray1 is absorbed and a reduced light is generated as reflected light Ray1'.
  • the reference structure 6a is made of a material or structure that absorbs the light Ray1.
  • amorphous carbon or graphite can be used as the material that absorbs the light Ray1, but the material is not limited to these materials.
  • a fine structure that does not reflect light may be used.
  • a needle-like structure (black silicon) produced when Si is plasma etched can be used.
  • the irradiation position can be adjusted using only the reflected light Ray1' that has been attenuated by the reference structure 6a.
  • the photodetection system 2 is composed of a single detector. The types of detectors that can be used are as explained in the first embodiment.
  • the control device can adjust the light irradiation position by finding the mirror angle that gives the minimum value of the curve F2. Since a light absorber can absorb light of a wide range of wavelengths, by using a light absorber for the reference structure 6a, adjustment can be made even when the light source emits light of multiple wavelengths. play.
  • This example differs from Example 1 mainly in that an adjustment sample is used in which the position of the center mark of the reference structure is shifted from the original center coordinates of the reference structure.
  • the SEM has an image shift function that allows the SEM observation range to be moved over a range of several tens of ⁇ m or more by using an electron beam deflector without moving the sample stage. That is, there are cases where a position away from the light irradiation position adjusted using the adjustment sample is observed. Therefore, it is necessary to set the light irradiation position to an arbitrary coordinate within the XY plane in accordance with the movement of the electron beam irradiation position.
  • the coordinate transformation formula is expressed by the following formulas (1) and (2).
  • H AHX ⁇ X+AHY ⁇ Y+H0...(1)
  • V AVX ⁇ X+AVY ⁇ Y+V0...(2) It is determined by six coefficients (AHX, AHY, AVX, AVY, H0, V0).
  • the conversion equation is expressed as a linear equation like the above equations (1) and (2), but the conversion equation is not limited to this.
  • the conversion equation is not limited to this.
  • the amount of change in the irradiation position is curved with respect to the mirror angle, such as when light is focused through a lens
  • higher-order terms such as second-order and third-order terms.
  • curvature due to lenses can also be taken into account, so even if you want to adjust the irradiation range over a wide range that would cause curvature if the optical system includes a lens, it is possible to accurately adjust the irradiation range. This has the effect that the irradiation position can be adjusted.
  • FIG. 22 is a top view showing an example of an adjustment sample used to obtain a coordinate transformation formula.
  • the rest of the device configuration is the same as that of Example 1, so the explanation will be omitted.
  • an adjustment sample 6 having three reference structures 6k1, 6k2, and 6k3 is used. This is because there are six coefficients to be determined.
  • Each of the reference structures 6k1, 6k2, and 6k3 has a center mark 6c for detecting the center by SEM observation.
  • the structures, dimensions, etc. of the adjustment sample 6 and the reference structures 6k1, 6k2, and 6k3 are the same as described in Example 1, and therefore their explanations will be omitted.
  • the respective reference structures 6k1, 6k2, and 6k3 are arranged at positions where the center mark 6c is shifted from the reference.
  • the reference structure 6k1 is located at a position shifted by Q1 (dx1, dy1) from the position of the center mark 6c.
  • the reference structures 6k2 and 6k3 are located at positions Q2 (dx2, dy2) and Q3 (dx3, dy3), respectively, with the center mark 6c as the origin.
  • the coordinates of Q1 to Q3 may be arbitrarily selected, but since six coefficients need to be determined, vectors Q1Q2 and Q1Q3 must be linearly independent. In other words, when Q1 to Q3 are plotted in the XY plane, Q3 must not lie on the straight line Q1-Q2.
  • FIG. 23 is a flowchart showing the adjustment procedure for obtaining the coordinate transformation formula.
  • the user sets conditions for adjusting the light irradiation position (step S30).
  • the GUI example of the setting screen may be the same as that shown in FIG. 16A, so the description thereof will be omitted.
  • control device transports the adjustment sample to the sample stage using a transport arm or the like (step S31).
  • control device performs SEM photography without irradiating light (step S32). Then, the sample stage is moved to the center mark position of the reference structure 6k1 (step S33). The control device acquires the SEM image and uses an algorithm such as pattern matching to move the sample stage so that the center mark is located at the center of the SEM image. Note that in the case of a SEM having an image shift function, imaging is performed after the image shift is moved to the origin.
  • control device adjusts the irradiation position in the same manner as in Example 1 (step S34).
  • control device records the adjustment result (H1, V1) in association with the deviation Q1 from the center mark (step S35).
  • control device moves the sample stage to the positions of the reference structures 6k2 and 6k3, and sequentially performs steps S32 to S35.
  • the adjustment results (H2, V2) and (H3, V3) are recorded in association with Q2 and Q3, respectively.
  • control device calculates a conversion coefficient (step S36).
  • the control device obtains simultaneous equations by substituting the adjustment results into the above equations (1) and (2).
  • the simultaneous equations obtained by substituting the above equation (1) are expressed by the following equations (3), (4), and (5).
  • H1 AHX ⁇ X1+AHY ⁇ Y1+H0...(3)
  • H2 AHX ⁇ X2+AHY ⁇ Y2+H0...(4)
  • H3 AHX ⁇ X3+AHY ⁇ Y3+H0...(5) Since there are three degrees of freedom, the simultaneous equations (3), (4), and (5) can be solved, and the control device can obtain the coefficients AHX, AHY, and H0.
  • control device can obtain the coefficients AVX, AVY, and V0 by solving the simultaneous equations obtained by substituting them into the above equation (2).
  • the optimum coefficient may be calculated numerically using four or more reference structures. By using more reference structures, it is possible to determine coefficients with higher precision.
  • control device stores the conversion coefficients, that is, the coefficients AHX, AHY, H0, AVX, AVY, and V0 in the storage unit 5e (FIG. 5). More preferably, the sample height is also measured as in Example 2, and the conversion coefficient is stored in association with the sample height.
  • FIG. 24 is a diagram showing an example of a GUI for displaying adjustment results.
  • the adjustment conditions are displayed in column 8m.
  • the adjustment conditions include, for example, the laser output and the selected detector.
  • the measurement results for each reference structure 6k1, 6k2, and 6k3 are displayed in column 8n'.
  • the conversion coefficient is displayed in column 8p.
  • Hxy AHX ⁇ x+AHY ⁇ y+H0...(6)
  • Vxy AVX ⁇ x+AVY ⁇ y+V0...(7)
  • the reference structure has a periodic structure, and the period of the periodic structure is ⁇ /n or more, where ⁇ is the wavelength of the first light and n is the refractive index of the medium into which the first light is incident, It is smaller than the irradiation diameter of the first light.
  • the reference structure is made of a material that emits fluorescence in response to the first light.
  • the reference structure is made of a material or structure that generates scattered light in response to the first light.
  • the reference structure is constituted by a mirror surface whose inclination is adjusted so that the reflected light is emitted in the direction of the photodetector.
  • the irradiation position of the first light can be adjusted two-dimensionally.
  • a particle beam detector has the function of detecting light.
  • the adjustment sample has a plurality of structures, and the distance between the adjacent structures is larger than the movable range of the irradiation position.
  • the adjustment samples have structures of different sizes, and the movable mechanism is adjusted in descending order of the structure size.
  • the charged particle beam device further includes a height sensor that measures the height of the sample, and the adjustment sample has parts with different heights, and the adjustment of the movable mechanism allows the first light to be emitted at the height of the sample. Calibrate the irradiation position.
  • the periodic structure is two-dimensional.
  • the second light includes reflected light and secondary light, and uses electrical signals derived from the reflected light and secondary light to adjust the movable mechanism.
  • the adjustment sample has a marker for detecting the center using an image obtained by irradiating the charged particle beam, and the center of the reference structure of the adjustment sample is placed at a position shifted from the center of the marker, and the reference structure Adjust the movable mechanism using the structure.
  • the first light is irradiated onto the sample from a direction different from that of the charged particle beam. This makes it possible to irradiate the sample with light without interfering with the irradiation path of the charged particle beam, and eliminates the need for components such as lenses and prisms for making the light parallel to the charged particle beam.
  • the present disclosure is not limited to the embodiments described above, and includes various modifications.
  • the embodiments described above are described in detail to explain the present disclosure in an easy-to-understand manner, and are not necessarily limited to having all the configurations described.
  • 1 Light irradiation system
  • 1a Light source
  • 1b Light irradiation position adjustment section
  • 1c Optical element
  • 1d Movable stage
  • 2 Photo detection system
  • 3 Electron optical system
  • 4 Sample stage system
  • 6 sample for adjustment
  • 6a reference structure
  • 7a elliptical area
  • 7b movable range of irradiation position
  • 9 sample.

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electron Sources, Ion Sources (AREA)
PCT/JP2022/014901 2022-03-28 2022-03-28 荷電粒子線装置の調整方法及び荷電粒子線装置 Ceased WO2023187876A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/JP2022/014901 WO2023187876A1 (ja) 2022-03-28 2022-03-28 荷電粒子線装置の調整方法及び荷電粒子線装置
US18/839,987 US20250157785A1 (en) 2022-03-28 2023-02-03 Charged particle beam device adjustment method and charged particle beam device
KR1020247028173A KR20240134220A (ko) 2022-03-28 2023-02-03 하전 입자선 장치의 조정 방법 및 하전 입자선 장치
JP2024511344A JP7760044B2 (ja) 2022-03-28 2023-02-03 荷電粒子線装置の調整方法及び荷電粒子線装置
PCT/JP2023/003515 WO2023188810A1 (ja) 2022-03-28 2023-02-03 荷電粒子線装置の調整方法及び荷電粒子線装置
TW112109713A TWI856565B (zh) 2022-03-28 2023-03-16 光照射位置之調整方法及荷電粒子束裝置

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WO2023188810A1 (ja) 2023-10-05
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US20250157785A1 (en) 2025-05-15

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