Classifications

• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D3/00—Electroplating: Baths therefor
  • C25D3/02—Electroplating: Baths therefor from solutions
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/10—Electroplating with more than one layer of the same or of different metals
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/16—Electroplating with layers of varying thickness
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/48—After-treatment of electroplated surfaces

Definitions

• the present invention relates to a structure, a method for manufacturing the structure, and a joined body.
• the surface of the metal component is etched to form a micrometer-order uneven structure (base rough surface), and the surface of the base rough surface is further etched to form a dendritic layer (fine rough surface).
• a method for forming a surface (see, for example, Patent Document 1) has been proposed.
• the metal member whose surface has been roughened by the method described in Patent Document 1 has a base rough surface on the order of micrometers and a fine rough surface formed on the surface, so that it can be bonded to, for example, an excellent bond to a resin member. Demonstrate strength.
• the method described in Patent Document 1 may not be able to form a good uneven structure.
• aluminum alloys used for manufacturing die castings contain a large amount of silicon to improve fluidity during molding. If such an aluminum alloy is roughened by the method described in Patent Document 1, silicon, which has poor solubility in the etching solution, will precipitate on the roughened surface, resulting in sufficient bonding strength. may not be possible.
• Means for solving the above problems include the following embodiments. ⁇ 1> Comprising a base material and a plating layer disposed on the base material, The plated layer has a porous structure on the surface opposite to the base material, and the structure satisfies at least one of the following (1) to (3).
• the porous structure has first pores and second pores formed on the surface of the first pores.
• the protruding valley depth (Rvk) of the surface having a porous structure of the plating layer is 0.3 ⁇ m or more.
• the roughness index obtained by dividing the true surface area (m 2 ) measured by the krypton adsorption method by the geometric surface area (m 2 ) of the surface having a porous structure of the plating layer is 12 or more.
• ⁇ 2> The structure according to ⁇ 1>, which satisfies (1) above.
• ⁇ 3> The structure according to ⁇ 1>, which satisfies (2) above.
• ⁇ 4> The structure according to ⁇ 1>, which satisfies (3) above.
• ⁇ 5> The structure according to any one of ⁇ 1> to ⁇ 4>, wherein the plating layer includes two or more plating layers.
• ⁇ 6> The structure according to any one of ⁇ 1> to ⁇ 4>, for use as an antibacterial member.
• ⁇ 7> A joined body comprising the structure according to any one of ⁇ 1> to ⁇ 4> and a resin member joined to the surface of the structure on which the plating layer is formed.
• ⁇ 8> Forming a plating layer having a porous structure on the base material, A method for manufacturing a structure, the method comprising: bringing the surface of the plating layer into contact with an etching solution.
• the etching solution contains an oxidizing agent and an inorganic acid.
• a structure having a fine uneven structure on its surface regardless of the material of the base material, a method for manufacturing the same, and a bonded body including this structure are provided.
• Example 1 is an electron microscope image of a cross section of a joined body obtained in Example 1.
• 2 is a partially enlarged image of the electron microscope image shown in FIG. 1.
• 2 is an electron microscope image of a cross section of a joined body obtained in Comparative Example 1.
• 4 is a partially enlarged image of the electron microscope image shown in FIG. 3.
• a numerical range indicated using " ⁇ " indicates a range that includes the numerical values written before and after " ⁇ " as the minimum value and maximum value, respectively.
• the upper or lower limit stated in one numerical range may be replaced by the upper or lower limit of another numerical range described step by step, and , may be replaced with the values shown in the examples.
• the amount of each component in the material means the total amount of the multiple substances present in the material, unless otherwise specified.
• the structure of the present disclosure includes a base material and a plating layer disposed on the base material,
• the plating layer has a porous structure on the surface opposite to the base material, and is a structure that satisfies at least one of the following (1) to (3).
• the porous structure has first pores and second pores formed on the surface of the first pores.
• the protruding valley depth (Rvk) of the surface having a porous structure of the plating layer is 0.3 ⁇ m or more.
• the roughness index obtained by dividing the true surface area (m 2 ) measured by the krypton adsorption method by the geometric surface area (m 2 ) of the surface having a porous structure of the plating layer is 12 or more.
• the plating layer disposed on the base material has a porous structure on the surface opposite to the base material, and satisfies at least one of (1) to (3). That is, a fine uneven structure is formed on the surface of the structure. Therefore, for example, when the structure is joined to another member, a sufficient microscopic area of the contact portion between the structure and the other member is ensured, and excellent joint strength is achieved. Furthermore, in the structure of the present disclosure, the plating layer disposed on the base material instead of the base material has a porous structure. Therefore, the material of the base material is not limited to those capable of forming a porous structure.
• the material of the base material in the structure is not particularly limited, and can be selected from metals, resins, ceramics, glass, wood, and the like.
• the base material may or may not have conductivity.
• a layer that imparts conductivity to the surface of the base material may be disposed between the base material and the plating layer.
• the base material contains a metal, specifically, a metal selected from iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, and manganese. and an alloy containing at least one selected from the above metals.
• a metal specifically, a metal selected from iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, and manganese. and an alloy containing at least one selected from the above metals.
• the resin may be selected from resins that may be included in the resin member described below.
• the plating layer disposed on the base material has a porous structure on the surface opposite to the base material.
• a "porous structure” refers to the presence of pores when observing a cross section obtained by cutting a plated layer along the thickness direction, and the number of pores observed per 10 ⁇ m of the cross section. means a structure in which the average value of is 5 or more. The above average value is the arithmetic mean value of the number of pores per 10 ⁇ m measured at five or more locations.
• "pore” means an open pore (pore connected to the outside air) with a pore diameter of 5 ⁇ m or less. The pore diameter of a pore is the value measured at the entrance of the pore.
• the plating layer may consist of one plating layer or may include two or more plating layers.
• Examples of the plating layer including two or more plating layers include a plating layer including one or more base plating layers and a plating layer having a porous structure on the surface disposed on the base plating layer.
• the material of the plating layer is not particularly limited and can be selected in consideration of the purpose of the structure, the material of the base material, etc. Specific examples of the material of the plating layer include nickel, copper, tin, zinc, and chromium. When the plating layer consists of two or more plating layers, the materials of the two or more plating layers may be the same or different.
• the porous structure of the plating layer preferably has first pores and second pores formed on the surface of the first pores.
• the pore diameter of the first pores is not particularly limited.
• the average pore size of the first pores may range from 0.1 ⁇ m to 5 ⁇ m.
• the depth of the first pores is not particularly limited.
• the average depth of the first pores may range from 0.1 ⁇ m to 5 ⁇ m.
• the pore diameter of the second pores is not particularly limited.
• the average pore size of the second pores may range from 5 nm to 500 nm.
• the depth of the second pores is not particularly limited.
• the average depth of the second pores may range from 5 nm to 300 nm.
• the pore size and depth of pores are measured by image analysis. For example, it is measured by cutting the plated layer along the thickness direction and observing the obtained cross section using an electron microscope or the like.
• the average pore diameter and average depth of pores are the arithmetic mean values of values measured for 80 pores.
• a plating layer having a porous structure having first pores and second pores formed on the surface of the first pores forms a plating layer having first pores. , and then by forming second pores on the surface of the first pores.
• the plating layer having the first pores may be formed by, for example, forming a plating layer using a plating solution containing a substance that inhibits the growth of the plating layer, and then removing the substance that inhibits the growth of the plating layer. I can do it.
• a method includes the method described in Japanese Patent No. 5366076.
• substances that inhibit the growth of the plating layer include substances that dissolve in the plating solution, exhibit cationic properties, and produce water-insoluble decomposition products upon reductive decomposition.
• Substances that exhibit cationic properties when dissolved in the plating solution and produce water-insoluble decomposition products through reductive decomposition are attracted to the object to be plated, which serves as a cathode during electroplating, and are reductively decomposed on the surface of the object to be plated. and produce water-insoluble decomposition products. This water-insoluble decomposition product remains on the object to be plated and hinders the growth of the plating layer.
• Substances that exhibit cationic properties in the plating solution and produce water-insoluble decomposition products through reductive decomposition include water-soluble quaternary ammonium compounds with hydrophobic groups such as alkyl groups, aryl groups, and aralkyl groups. can be mentioned.
• water-soluble quaternary ammonium compounds having a hydrophobic group include dodecyltrimethylammonium, tetradecyltrimethylammonium, hexadecyltrimethylammonium, octadecyltrimethylammonium, phenyltrimethylammonium, benzyltrimethylammonium, benzyltriethylammonium, and benzyl.
• Examples include chlorides, bromides, hydroxides, sulfates and nitrates of tributylammonium, didecyldimethylammonium, dodecyldimethylbenzylammonium, tetradecyldimethylbenzylammonium, octadecyldimethylbenzylammonium, trioctylmethylammonium, dodecylpyridinium or benzylpyridinium. It will be done.
• the number of water-soluble quaternary ammonium compounds having a hydrophobic group contained in the plating solution may be one or two or more.
• the content of the water-soluble quaternary ammonium compound having a hydrophobic group contained in the plating solution is preferably 0.001 mol/L or more. From the viewpoint of forming a uniform plating layer, the content of the water-soluble quaternary ammonium compound having a hydrophobic group contained in the plating solution is preferably 0.1 mol/L or less.
• the type of plating solution used to form the plating layer is not particularly limited, and can be selected from known plating solutions.
• Specific plating solutions include electrolytic nickel plating baths such as Watt bath, Wood bath, nickel sulfamate bath, organic acid nickel bath, copper sulfate bath, copper pyrophosphate bath, tin sulfate bath, tin methanesulfonate bath, and chloride bath.
• Examples include zinc baths, zinc sulfate baths, and various alloy plating baths.
• the formation of the second pores on the surface of the first pores can be performed, for example, by bringing the surface of the plating layer having the first pores into contact with an etching solution.
• the type of etching solution is not particularly limited.
• it may contain an oxidizing agent and an inorganic acid.
• the etching solution may be an aqueous solution of an oxidizing agent and an inorganic acid.
• the oxidizing agent examples include nitric acid, permanganic acid, and hydrogen peroxide.
• the concentration of the oxidizing agent in the etching solution is not particularly limited.
• the concentration of the oxidizing agent in the etching solution can be selected from 0.1% by mass to 20% by mass, preferably 0.5% by mass to 5% by mass.
• inorganic acids include phosphoric acid, sulfuric acid, and hydrochloric acid.
• the concentration of the inorganic acid in the etching solution is not particularly limited.
• the concentration of the inorganic acid in the etching solution can be selected from 0.1% by mass to 20% by mass, preferably 5% by mass to 10% by mass.
• the temperature of the etching solution when it comes into contact with the surface of the plating layer is not particularly limited.
• the temperature of the etching solution can be selected from the range of 20°C to 60°C, preferably 30°C to 50°C.
• time period for which the etching solution is brought into contact with the surface of the plating layer can be selected from the range of 30 seconds to 10 minutes, preferably 1 minute to 5 minutes.
• the protruding valley depth (Rvk) of the surface having a porous structure of the plating layer is preferably 0.3 ⁇ m or more, more preferably 0.4 ⁇ m or more, and still more preferably 0.5 ⁇ m or more. preferable. From the viewpoint of how easily the resin can enter the pores when the porous surface of the plating layer is bonded to a resin member, the protruding valley depth (Rvk) of the porous surface of the plating layer is It is preferable that it is 1.5 ⁇ m or less.
• the protruding valley depth (Rvk) of the surface having a porous structure of the plating layer is a value measured in accordance with JIS B 0671-2:2002 (ISO 13565-2:1996).
• the maximum height (Rz) of the surface of the plating layer having a porous structure is preferably 1.5 ⁇ m or more, more preferably 2 ⁇ m or more. From the viewpoint of how easily the resin can enter the pores when the surface of the plated layer has a porous structure and is bonded to a resin member, the maximum height (Rz) of the surface of the plated layer that has a porous structure is For example, the thickness is preferably 10 ⁇ m or less, or more preferably 5 ⁇ m or less.
• the arithmetic mean roughness (Ra) of the surface of the plating layer having a porous structure is preferably 0.2 ⁇ m or more, more preferably 0.3 ⁇ m or more. From the viewpoint of ease of resin penetration into the pores when joining the porous surface of the plating layer with a resin member, the arithmetic mean roughness (Ra) of the porous surface of the plating layer is 5 ⁇ m. It is preferably at most 3 ⁇ m, more preferably at most 1 ⁇ m, or more preferably at most 0.7 ⁇ m.
• the roughness index obtained by dividing the true surface area (m 2 ) measured by the krypton adsorption method of the surface having a porous structure of the plating layer by the geometric surface area (m 2 ) is preferably 12 or more. , more preferably 13 or more, and even more preferably 14 or more.
• the true surface area of the porous surface of the plating layer is determined by the BET method using krypton gas as an adsorbent. That is, the value obtained by multiplying the BET specific surface area (m 2 /g) of the measurement object by the mass (g) of the measurement object is the true surface area (m 2 ) of the measurement object.
• the true surface area of the surface of the plated layer having a porous structure is determined, for example, by the method described in Examples.
• antibacterial member means a member that exhibits antibacterial performance.
• antibacterial performance includes the performance of killing bacteria or suppressing their proliferation (antibacterial performance) and the performance of inactivating viruses (antiviral performance). That is, the targets of antibacterial performance include bacteria and viruses.
• the mechanism by which the structure of the present disclosure exhibits antibacterial performance is presumed to be, for example, as follows.
• the scope of the present disclosure is not limited in any way by such speculation.
• the plating layer disposed on the base material has a porous structure. Therefore, when bacteria adhere to the plating layer, the porous structure of the plating layer damages the cell walls of the bacteria, and in a preferred embodiment, it is thought that the bacteria will die.
• the activity of the virus captured by the porous structure of the plating layer is weakened, and in a preferred embodiment, the virus is considered to be inactivated.
• the plating layer has a porous structure, the microscopic surface area of the plating layer is large. Therefore, a large amount of bacteria or viruses can be attached to a limited area and an antibacterial effect can be effectively exerted.
• Antibacterial materials can be used, for example, in medical and pharmaceutical supplies (medical pads, surgical instruments, drug bottle caps, dental materials, etc.); housing-related supplies (doorknobs, handrails, etc.); food and cooking-related supplies (tableware, cooking utensils, etc.); (sinks, faucets, serving trays, etc.); infrastructure-related supplies (pipes used for water treatment or factory facilities, etc.); automobile-related supplies (doorknobs, etc.); miscellaneous goods (pencil cases, rulers, mechanical pencils, calculators, etc.); electronic equipment (personal computers, smartphones, etc.); and entertainment-related goods (medals used in gaming machines, etc.).
• the method for manufacturing the structure of the present disclosure includes: forming a plating layer having a porous structure on the base material; A method for manufacturing a structure, including a step of bringing the surface of the plating layer into contact with an etching solution.
• a structure having a fine uneven structure on the surface can be manufactured regardless of the material of the base material.
• the step of forming a plating layer having a porous structure on the base material can be carried out using, for example, a plating solution containing a substance that inhibits the growth of the plating layer as described above.
• the step of bringing the surface of the plating layer having a porous structure into contact with an etching solution can be carried out using, for example, an etching solution containing an oxidizing agent and an inorganic acid.
• the details and preferred embodiments of the base material, plating layer, and etching solution in the above method are the same as the details and preferred embodiments of the plating layer and etching solution described for the structure of the present disclosure. That is, the method of the present disclosure may be the method of manufacturing the structure of the present disclosure described above.
• the joined body of the present disclosure is a joined body that includes the above-described structure of the present disclosure and a resin member joined to the surface of the structure on which the plating layer is formed.
• a state in which the structure and the resin member are "joined” means a state in which the structure is fixed to the resin member without using an adhesive, screws, or the like.
• the state in which the structure is joined to the resin member can be formed, for example, by applying the material of the resin member, which has fluidity due to melting or softening, to the roughened surface of the structure.
• the material of the resin member has fluidity
• the material of the resin member enters the porous structure on the surface of the structure, an anchor effect is produced, and the resin member is firmly bonded to the surface of the structure.
• the type of resin contained in the resin member is not particularly limited, and may be a thermoplastic resin, a thermosetting resin, a thermoplastic elastomer, a thermosetting elastomer, or the like.
• Thermoplastic resins include polyethylene (PE), polypropylene (PP), polystyrene (PS), acrylonitrile/styrene resin (AS), acrylonitrile/butadiene/styrene resin (ABS), methacrylic resin (PMMA), and polyvinyl chloride (PVC).
• PA polyamide
• POM polyacetal
• UHPE ultra-high molecular weight polyethylene
• PBT polybutylene terephthalate
• PET polyethylene terephthalate
• TPX polymethylpentene
• PC polycarbonate
• PPE polyphenylene ether
• PES polyetheretherketone
• LCP liquid crystalline resin
• PTFE polytetrafluoroethylene
• PEI polyetherimide
• PAR polyarylate
• PSF polysulfone
• PES polyamideimide
• PAI polyamideimide
• thermosetting resin examples include phenol resin, urea resin, melamine resin, unsaturated polyester, alkyd resin, epoxy resin, diallyl phthalate, and the like.
• thermoplastic elastomer examples include styrene thermoplastic elastomer, polyester thermoplastic elastomer, urethane thermoplastic elastomer, and amide thermoplastic elastomer.
• thermosetting elastomers examples include natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene-butadiene copolymer rubber (SBR), chloroprene rubber (CR), and acrylonitrile-butadiene copolymer rubber ( Examples include diene rubbers such as NBR), non-diene rubbers such as butyl rubber (IIR), ethylene propylene rubber (EPM), urethane rubber, silicone rubber, and acrylic rubber.
• the resin contained in the resin member may be in the form of an ionomer or a polymer alloy.
• the resin member may contain only one type of resin or two or more types of resin.
• the resin member may contain various compounding agents in addition to the resin.
• Compounding agents include glass fibers, carbon fibers, fillers such as inorganic powders, heat stabilizers, antioxidants, pigments, weathering agents, flame retardants, plasticizers, dispersants, lubricants, mold release agents, antistatic agents, etc. can be mentioned.
• the proportion of the resin in the entire resin member is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more. preferable.
• the step of joining the resin member to the surface of the structure having a porous structure can be carried out by a known method such as injection molding, for example.
• Example 1 Preparation of a bonded body A base nickel plating layer with a thickness of about 3 to 4 ⁇ m was formed on the surface of an aluminum plate as a base material.
• the base nickel plating layer was formed using an aqueous solution containing nickel sulfate (280 g/L), nickel chloride (45 g/L), and boric acid (40 g/L) as a plating solution, at a temperature of 50°C and a pH of 4.3. The test was carried out at a cathode current density of 3 A/dm 2 .
• a nickel plating layer having a porous structure with a thickness of about 1 to 5 ⁇ m was formed on the base nickel plating layer.
• the nickel plating layer with a porous structure was prepared by adding dodecyltrimethylammonium as a substance that inhibits the growth of the plating layer to an aqueous solution containing nickel sulfate (280 g/L), nickel chloride (45 g/L), and boric acid (40 g/L).
• the plating was carried out using a plating solution containing chloride (10 ml/L) under the conditions of a solution temperature of 50° C., pH of 4.3, and cathode current density of 3 A/dm 2 .
• An etching treatment was performed on an aluminum plate on which a nickel plating layer having a porous structure was formed by immersing it in an aqueous solution (40° C.) containing 0.6% by mass of nitric acid and 7.5% by mass of phosphoric acid for 3 minutes.
• the aluminum plate after etching the nickel plating layer was placed in a small dumbbell metal insert mold attached to an injection molding machine (J55-AD) manufactured by Japan Steel Works.
• polyphenylene sulfide PPS, Tosoh Corporation, Susteel SGX120
• PPS polyphenylene sulfide
• FIG. 1 An electron microscope image of a cross section obtained by cutting the joined body A in the thickness direction is shown in FIG. 1, and a partially enlarged image of FIG. 1 is shown in FIG. The relatively bright parts in the figure correspond to the nickel plating layer.
• the nickel plating layer has a porous structure on the surface opposite to the aluminum plate, and the porous structure is formed on the first pore and the surface of the first pore. It was observed that the pores had a second pore.
• the average number of first pores per 10 ⁇ m measured from the images shown in FIGS. 1 and 2 is 6, the average pore diameter of the first pores is 0.97 ⁇ m, and the average number of first pores per 10 ⁇ m is 6.
• the depth was 1.5 ⁇ m.
• the shear bonding strength between the nickel plating layer and the PPS layer of the bonded body A was measured by a method based on ISO19095. Specifically, a special jig was attached to a tensile testing machine (Model 1323, manufactured by ICo Engineering), and the fracture was measured at room temperature (23°C), with a distance between chucks of 60 mm, and a tensile speed of 10 mm/min. The load (N) was measured. The shear bonding strength (MPa) was obtained by dividing the measured breaking load (N) by the area (50 mm 2 ) of the bonded portion between the nickel plating layer and the PPS layer. The results are shown in Table 1.
• Example 2 Evaluation was performed in the same manner as in Example 1, except that the aqueous solution used for etching the nickel plating layer was changed to an aqueous solution containing 0.1% by mass of nitric acid and 0.1% by mass of phosphoric acid. The results are shown in Table 1. When observing the cross section of the bonded body A obtained in Example 2, it was found that the nickel plating layer had a porous structure on the surface opposite to the aluminum plate, and the porous structure had first pores and first pores. and second pores formed on the surface of the pores.
• Example 3 Evaluation was performed in the same manner as in Example 1, except that the aqueous solution used for etching the nickel plating layer was changed to an aqueous solution containing 1% by mass of nitric acid and 20% by mass of phosphoric acid. The results are shown in Table 1. When observing the cross section of the bonded body A obtained in Example 3, it was found that the nickel plating layer had a porous structure on the surface opposite to the aluminum plate, and the porous structure had first pores and first pores. and second pores formed on the surface of the pores.
• Example 4 Evaluation was performed in the same manner as in Example 1, except that the resin used for producing the joined body was changed from PPS to polypropylene (PP, Prime Polypro V7100, Prime Polymer Co., Ltd.). The results are shown in Table 1. When the cross section of the bonded body A obtained in Example 4 was observed, it was found that the nickel plating layer had a porous structure on the surface opposite to the aluminum plate, and the porous structure had first pores and first pores. and second pores formed on the surface of the pores.
• Example 5 Evaluation was carried out in the same manner as in Example 1, except that the resin used for producing the joined body was changed from PPS to polyphthalamide (PPA, Mitsui Chemicals, Inc., Arlen A350). The results are shown in Table 1. When the cross section of the bonded body A obtained in Example 5 was observed, it was found that the nickel plating layer had a porous structure on the surface opposite to the aluminum plate, and the porous structure had first pores and first pores. and second pores formed on the surface of the pores.
• FIG. 3 shows an electron microscope image of a cross section obtained by cutting the joined body A produced in Comparative Example 1 in the thickness direction
• FIG. 4 shows a partially enlarged image of FIG. 3.
• the relatively bright parts in the figure correspond to the nickel plating layer.
• the nickel plating layer had a porous structure on the surface opposite to the aluminum plate, but the second pores were not formed on the surface of the first pores. Ta.
• the percentage of viable bacteria after 30 minutes indicates the ratio of the number of viable bacteria 30 minutes after inoculating the test piece with the bacteria to the number of viable bacteria at the time when the test piece was inoculated with the bacteria.
• the percentage of viable bacteria after 24 hours indicates the ratio of the number of viable bacteria 24 hours after inoculating the test piece with the bacteria to the number of viable bacteria at the time when the test piece was inoculated with the bacteria.
• test piece A and test piece B used in the antibacterial performance test were used in accordance with ISO 21702:2019. Specifically, the virus inactivation rate and infectious titer were measured 30 minutes and 24 hours after inoculating the test piece with the virus. As viruses, Influenza A H3N2 (size: 80 nm to 120 nm, with envelope) and Feline Calicivirus (size: 27 nm to 32 nm, without envelope) were used.
• the virus inactivation rate after 30 minutes indicates the ratio of the infectious titer 30 minutes after inoculating the test piece with the virus to the infectious titer at the time when the test piece was inoculated with the virus.
• the virus inactivation rate after 24 hours indicates the ratio of the infectious titer 24 hours after inoculating the test piece with the virus to the infectious titer at the time when the test piece was inoculated with the virus.
• the infectious titer is an index representing the degree of virus inactivation, and is a value measured by TCID50 (50% tissue culture infectious dose).
• test piece A was obtained by forming a nickel plating layer with a porous structure on the surface of an aluminum plate and etching the nickel plating layer. It showed superior antibacterial and antiviral performance compared to test piece B, which did not have a nickel plating layer with a textured structure.

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• 2023
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