JPWO2023181627A1 - - Google Patents
Info
- Publication number
- JPWO2023181627A1 JPWO2023181627A1 JP2024509798A JP2024509798A JPWO2023181627A1 JP WO2023181627 A1 JPWO2023181627 A1 JP WO2023181627A1 JP 2024509798 A JP2024509798 A JP 2024509798A JP 2024509798 A JP2024509798 A JP 2024509798A JP WO2023181627 A1 JPWO2023181627 A1 JP WO2023181627A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022045974 | 2022-03-22 | ||
| PCT/JP2023/002526 WO2023181627A1 (ja) | 2022-03-22 | 2023-01-26 | 構造体、構造体の製造方法及び接合体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181627A1 true JPWO2023181627A1 (https=) | 2023-09-28 |
Family
ID=88101042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509798A Pending JPWO2023181627A1 (https=) | 2022-03-22 | 2023-01-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023181627A1 (https=) |
| CN (1) | CN118475729A (https=) |
| TW (1) | TW202341827A (https=) |
| WO (1) | WO2023181627A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01312893A (ja) * | 1988-06-09 | 1989-12-18 | Fujitsu Ltd | プリント基板の製造方法 |
| JP2012219333A (ja) * | 2011-04-08 | 2012-11-12 | Mitsui Mining & Smelting Co Ltd | 複合金属箔およびその製造方法 |
| JP2016065267A (ja) * | 2014-09-22 | 2016-04-28 | 株式会社Ｓｈカッパープロダクツ | 表面処理銅箔、該表面処理銅箔の製造方法、および該表面処理銅箔を用いた銅張積層板 |
| JP2019518869A (ja) * | 2016-04-27 | 2019-07-04 | パリ・シアンス・エ・レットゥル−カルチエ・ラタン | 高い比表面積を有する金属／金属カルコゲナイド電極 |
| WO2019208520A1 (ja) * | 2018-04-27 | 2019-10-31 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
| WO2021132191A1 (ja) * | 2019-12-26 | 2021-07-01 | ナミックス株式会社 | シランカップリング剤で処理された複合銅部材 |
| WO2021193863A1 (ja) * | 2020-03-27 | 2021-09-30 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、並びにこれを用いたプリント配線板用銅張積層板及びプリント配線板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7051988B1 (ja) * | 2020-11-27 | 2022-04-11 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板、及びプリント配線板 |
-
2023
- 2023-01-26 JP JP2024509798A patent/JPWO2023181627A1/ja active Pending
- 2023-01-26 WO PCT/JP2023/002526 patent/WO2023181627A1/ja not_active Ceased
- 2023-01-26 CN CN202380015767.9A patent/CN118475729A/zh active Pending
- 2023-01-30 TW TW112102958A patent/TW202341827A/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01312893A (ja) * | 1988-06-09 | 1989-12-18 | Fujitsu Ltd | プリント基板の製造方法 |
| JP2012219333A (ja) * | 2011-04-08 | 2012-11-12 | Mitsui Mining & Smelting Co Ltd | 複合金属箔およびその製造方法 |
| JP2016065267A (ja) * | 2014-09-22 | 2016-04-28 | 株式会社Ｓｈカッパープロダクツ | 表面処理銅箔、該表面処理銅箔の製造方法、および該表面処理銅箔を用いた銅張積層板 |
| JP2019518869A (ja) * | 2016-04-27 | 2019-07-04 | パリ・シアンス・エ・レットゥル−カルチエ・ラタン | 高い比表面積を有する金属／金属カルコゲナイド電極 |
| WO2019208520A1 (ja) * | 2018-04-27 | 2019-10-31 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
| WO2021132191A1 (ja) * | 2019-12-26 | 2021-07-01 | ナミックス株式会社 | シランカップリング剤で処理された複合銅部材 |
| WO2021193863A1 (ja) * | 2020-03-27 | 2021-09-30 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、並びにこれを用いたプリント配線板用銅張積層板及びプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202341827A (zh) | 2023-10-16 |
| WO2023181627A1 (ja) | 2023-09-28 |
| CN118475729A (zh) | 2024-08-09 |
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