CN118475729A - 结构体、结构体的制造方法及接合体 - Google Patents

结构体、结构体的制造方法及接合体 Download PDF

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Publication number
CN118475729A
CN118475729A CN202380015767.9A CN202380015767A CN118475729A CN 118475729 A CN118475729 A CN 118475729A CN 202380015767 A CN202380015767 A CN 202380015767A CN 118475729 A CN118475729 A CN 118475729A
Authority
CN
China
Prior art keywords
plating layer
porous structure
pore
joined body
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380015767.9A
Other languages
English (en)
Chinese (zh)
Inventor
住田大树
小寺雄太
岛崎绚也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN118475729A publication Critical patent/CN118475729A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202380015767.9A 2022-03-22 2023-01-26 结构体、结构体的制造方法及接合体 Pending CN118475729A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022045974 2022-03-22
JP2022-045974 2022-03-22
PCT/JP2023/002526 WO2023181627A1 (ja) 2022-03-22 2023-01-26 構造体、構造体の製造方法及び接合体

Publications (1)

Publication Number Publication Date
CN118475729A true CN118475729A (zh) 2024-08-09

Family

ID=88101042

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380015767.9A Pending CN118475729A (zh) 2022-03-22 2023-01-26 结构体、结构体的制造方法及接合体

Country Status (4)

Country Link
JP (1) JPWO2023181627A1 (https=)
CN (1) CN118475729A (https=)
TW (1) TW202341827A (https=)
WO (1) WO2023181627A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01312893A (ja) * 1988-06-09 1989-12-18 Fujitsu Ltd プリント基板の製造方法
JP5400826B2 (ja) * 2011-04-08 2014-01-29 三井金属鉱業株式会社 複合金属箔およびその製造方法
JP5728118B1 (ja) * 2014-09-22 2015-06-03 株式会社Ｓｈカッパープロダクツ 表面処理銅箔、該表面処理銅箔の製造方法、および該表面処理銅箔を用いた銅張積層板
FR3050740B1 (fr) * 2016-04-27 2021-01-29 Paris Sciences Lettres Quartier Latin Electrode metal / chalcogenure metallique a haute surface specifique
EP3786315A4 (en) * 2018-04-27 2022-04-20 JX Nippon Mining & Metals Corporation SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD
CN114846175A (zh) * 2019-12-26 2022-08-02 纳美仕有限公司 经过硅烷偶联剂处理的复合铜部件
CN115279951B (zh) * 2020-03-27 2025-04-08 古河电气工业株式会社 印刷配线板用表面处理铜箔、以及使用其的印刷配线板用覆铜层叠板和印刷配线板
JP7051988B1 (ja) * 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板

Also Published As

Publication number Publication date
TW202341827A (zh) 2023-10-16
WO2023181627A1 (ja) 2023-09-28
JPWO2023181627A1 (https=) 2023-09-28

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