TW202341827A - 構造體、構造體之製造方法及接合體 - Google Patents
構造體、構造體之製造方法及接合體 Download PDFInfo
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- TW202341827A TW202341827A TW112102958A TW112102958A TW202341827A TW 202341827 A TW202341827 A TW 202341827A TW 112102958 A TW112102958 A TW 112102958A TW 112102958 A TW112102958 A TW 112102958A TW 202341827 A TW202341827 A TW 202341827A
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- Prior art keywords
- plating layer
- porous structure
- pores
- layer
- base material
- Prior art date
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- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
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- PDSVZUAJOIQXRK-UHFFFAOYSA-N trimethyl(octadecyl)azanium Chemical compound CCCCCCCCCCCCCCCCCC[N+](C)(C)C PDSVZUAJOIQXRK-UHFFFAOYSA-N 0.000 description 1
- GLFDLEXFOHUASB-UHFFFAOYSA-N trimethyl(tetradecyl)azanium Chemical compound CCCCCCCCCCCCCC[N+](C)(C)C GLFDLEXFOHUASB-UHFFFAOYSA-N 0.000 description 1
- ZNEOHLHCKGUAEB-UHFFFAOYSA-N trimethylphenylammonium Chemical compound C[N+](C)(C)C1=CC=CC=C1 ZNEOHLHCKGUAEB-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH01312893A (ja) * | 1988-06-09 | 1989-12-18 | Fujitsu Ltd | プリント基板の製造方法 |
| JP5400826B2 (ja) * | 2011-04-08 | 2014-01-29 | 三井金属鉱業株式会社 | 複合金属箔およびその製造方法 |
| JP5728118B1 (ja) * | 2014-09-22 | 2015-06-03 | 株式会社Shカッパープロダクツ | 表面処理銅箔、該表面処理銅箔の製造方法、および該表面処理銅箔を用いた銅張積層板 |
| FR3050740B1 (fr) * | 2016-04-27 | 2021-01-29 | Paris Sciences Lettres Quartier Latin | Electrode metal / chalcogenure metallique a haute surface specifique |
| EP3786315A4 (en) * | 2018-04-27 | 2022-04-20 | JX Nippon Mining & Metals Corporation | SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD |
| CN114846175A (zh) * | 2019-12-26 | 2022-08-02 | 纳美仕有限公司 | 经过硅烷偶联剂处理的复合铜部件 |
| CN115279951B (zh) * | 2020-03-27 | 2025-04-08 | 古河电气工业株式会社 | 印刷配线板用表面处理铜箔、以及使用其的印刷配线板用覆铜层叠板和印刷配线板 |
| JP7051988B1 (ja) * | 2020-11-27 | 2022-04-11 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板、及びプリント配線板 |
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| CN118475729A (zh) | 2024-08-09 |
| JPWO2023181627A1 (https=) | 2023-09-28 |
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