TW202341827A - 構造體、構造體之製造方法及接合體 - Google Patents

構造體、構造體之製造方法及接合體 Download PDF

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Publication number
TW202341827A
TW202341827A TW112102958A TW112102958A TW202341827A TW 202341827 A TW202341827 A TW 202341827A TW 112102958 A TW112102958 A TW 112102958A TW 112102958 A TW112102958 A TW 112102958A TW 202341827 A TW202341827 A TW 202341827A
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TW
Taiwan
Prior art keywords
plating layer
porous structure
pores
layer
base material
Prior art date
Application number
TW112102958A
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English (en)
Chinese (zh)
Inventor
住田大樹
小寺雄太
島崎絢也
Original Assignee
日商三井化學股份有限公司
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Filing date
Publication date
Application filed by 日商三井化學股份有限公司 filed Critical 日商三井化學股份有限公司
Publication of TW202341827A publication Critical patent/TW202341827A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16Electroplating with layers of varying thickness
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
TW112102958A 2022-03-22 2023-01-30 構造體、構造體之製造方法及接合體 TW202341827A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022045974 2022-03-22
JP2022-045974 2022-03-22

Publications (1)

Publication Number Publication Date
TW202341827A true TW202341827A (zh) 2023-10-16

Family

ID=88101042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112102958A TW202341827A (zh) 2022-03-22 2023-01-30 構造體、構造體之製造方法及接合體

Country Status (4)

Country Link
JP (1) JPWO2023181627A1 (https=)
CN (1) CN118475729A (https=)
TW (1) TW202341827A (https=)
WO (1) WO2023181627A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01312893A (ja) * 1988-06-09 1989-12-18 Fujitsu Ltd プリント基板の製造方法
JP5400826B2 (ja) * 2011-04-08 2014-01-29 三井金属鉱業株式会社 複合金属箔およびその製造方法
JP5728118B1 (ja) * 2014-09-22 2015-06-03 株式会社Shカッパープロダクツ 表面処理銅箔、該表面処理銅箔の製造方法、および該表面処理銅箔を用いた銅張積層板
FR3050740B1 (fr) * 2016-04-27 2021-01-29 Paris Sciences Lettres Quartier Latin Electrode metal / chalcogenure metallique a haute surface specifique
EP3786315A4 (en) * 2018-04-27 2022-04-20 JX Nippon Mining & Metals Corporation SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD
CN114846175A (zh) * 2019-12-26 2022-08-02 纳美仕有限公司 经过硅烷偶联剂处理的复合铜部件
CN115279951B (zh) * 2020-03-27 2025-04-08 古河电气工业株式会社 印刷配线板用表面处理铜箔、以及使用其的印刷配线板用覆铜层叠板和印刷配线板
JP7051988B1 (ja) * 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板

Also Published As

Publication number Publication date
WO2023181627A1 (ja) 2023-09-28
CN118475729A (zh) 2024-08-09
JPWO2023181627A1 (https=) 2023-09-28

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