Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
  • C08K5/3445—Five-membered rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/49—Phosphorus-containing compounds
  • C08K5/50—Phosphorus bound to carbon only
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K9/00—Use of pretreated ingredients
  • C08K9/04—Ingredients treated with organic substances
  • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/62—Alcohols or phenols
  • C08G59/621—Phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
  • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Definitions

• the present invention relates to adhesive compositions. More particularly, the present invention relates to an epoxy-based adhesive composition excellent in properties such as shear property, curability and heat resistance, and a laminate using the same.
• epoxy adhesives have excellent properties such as mechanical properties, water resistance, chemical resistance, and heat resistance, and are used in a wide range of fields such as paints, molding materials, heat dissipation materials, and adhesives. It is an indispensable material.
• Reactive diluents are widely used in epoxy adhesives to reduce viscosity, improve workability, and provide flexibility.
• Examples of reactive diluents include epoxies with low viscosity such as monofunctional and aliphatic. It is Further, Patent Document 2 reports that adding an epoxy resin having an aliphatic hydrocarbon structure with 6 or more carbon atoms improves flexibility.
• an object of the present invention is to provide an epoxy-based adhesive excellent in tensile shear and curability with a substrate.
• the present invention consists of the following configurations.
• [1] Contains a bifunctional or higher aromatic epoxy resin (A), a bifunctional or higher aliphatic epoxy resin (B), an epoxy resin curing agent (C), a curing catalyst (D) and a thixotropic agent (E) ,
• the adhesive composition wherein the total chlorine content of the bifunctional or higher aliphatic epoxy resin (B) is 1.0% by mass or less.
• the aliphatic epoxy resin (B) with a functionality of 1 or more is 1 to The adhesive composition according to [1] above, which is 30 parts by mass.
• the adhesive composition of the present invention is excellent in tensile shear and curability with substrates. Therefore, the adhesive composition of the present invention can be suitably used as a structural adhesive.
• the adhesive composition of the present invention comprises an aromatic epoxy resin (A) having a functionality of 2 or more, an aliphatic epoxy resin having a functionality of 2 or more (B), an epoxy resin curing agent (C), a curing catalyst (D), and It contains a thixotropic agent (E) as an essential ingredient.
• A aromatic epoxy resin
• B aliphatic epoxy resin having a functionality of 2 or more
• C epoxy resin curing agent
• D curing catalyst
• E thixotropic agent
• the bifunctional or higher aromatic epoxy resin (A) (hereinafter also referred to as aromatic epoxy resin (A) or simply component (A)) contains one or more aromatic rings and two or more oxiranes in one molecule. It is not particularly limited as long as it contains a ring.
• Examples of the bifunctional or higher aromatic epoxy resin (A) used in the present invention include monocyclic aromatic glycidyl ether compounds obtained by glycidyl-etherifying polyhydric aromatic alcohols such as catechol, resorcinol, hydroquinone, and phthalic acid; Bisphenol-type epoxy obtained by glycidyl-etherifying bisphenol compounds such as bisphenol A, bisphenol F, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bisphenol C, bisphenol E, bisphenol M, bisphenol S, bisphenol P, bisphenol PH and bisphenol Z.
• monocyclic aromatic glycidyl ether compounds obtained by glycidyl-etherifying polyhydric aromatic alcohols such as catechol, resorcinol, hydroquinone, and phthalic acid
• Bisphenol-type epoxy obtained by glycidyl-etherifying bisphenol compounds such as bisphenol A, bisphenol F, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bis
• Polycyclic aromatic epoxy resin obtained by glycidyl-etherifying a polycyclic aromatic compound such as naphthalene, biphenyl, tetramethylbiphenyl, bisphenolfluorene, biscresolfluorene, tetraphenylolethane; phenol novolak, cresol novolak, bisphenol A Novolac-type epoxy resins obtained by epoxidizing novolak-type compounds such as novolacs, glycidylamine-type epoxy resins obtained by glycidyl-etherifying aromatic amino compounds such as aniline, o-methylaniline, p-aminophenol, and m-phenylenediamine; triglycidyl Polyfunctional epoxy resins such as isocyanurate, triphenylglycidyl ether methane type epoxy resin, xylylene type epoxy resin, tetrakisphenolethane type epoxy resin, naphthalene type epoxy resin; ethylene oxide a polycycl
• bisphenol-type epoxy resins are preferable from the viewpoint of mechanical properties such as adhesiveness and heat resistance, and among them, bisphenol-A-type epoxy resins and bisphenol-F-type epoxy resins are preferable because the viscosity of the composition can be easily adjusted.
• the bisphenol A type epoxy resin changes its state depending on its molecular weight, but it is preferably liquid to semi-solid at room temperature, and particularly preferably liquid.
• a bifunctional or higher aliphatic epoxy resin (B) (hereinafter also referred to as an aliphatic epoxy resin (B) or simply (B) component) contains an aliphatic hydrocarbon group and two or more oxirane rings in one molecule. is not particularly limited as long as it contains an alicyclic skeleton as the aliphatic hydrocarbon group. However, aromatic groups are not included.
• Aliphatic epoxy resins (B) used in the present invention include, for example, diepoxy compounds of cycloaliphatic alcohols such as dimethylol dicyclopentadiene diglycidyl ether; diglycidyl hexahydrophthalate, diglycidyl hexahydroterephthalate diepoxy compounds of cycloaliphatic dicarboxylic acids such as; diepoxy compounds of aliphatic alcohols such as 1,4-butanediol diglycidyl ether and 1,6-hexanediol diglycidyl ether; ), jER872 (trade name, manufactured by Mitsubishi Chemical Corporation) and other difunctional epoxy resins having a dimer acid skeleton.
• diepoxy compounds of cycloaliphatic alcohols such as dimethylol dicyclopentadiene diglycidyl ether
• diglycidyl hexahydrophthalate diglycidyl hexahydroterephthalate diepoxy
• the aliphatic epoxy resin (B) used in the present invention preferably has a total chlorine content of 1.0% by mass or less from the viewpoint of curability of the adhesive composition. It is more preferably 0.8% by mass or less, and particularly preferably 0.7% by mass or less.
• the total amount of chlorine means the amount (% by mass) of chlorine atoms contained in the aliphatic epoxy resin (B), and can be measured by the method described in JIS K 7243-3:2005.
• Such an aliphatic epoxy resin (B) include EX212L (1,6-hexanediol type, total chlorine content of 0.4% by mass), EX214L (1,4-butanediol type, total chlorine content of 0 .4% by mass), EX216L (cyclohexanedimethanol type, total chlorine content 0.4% by mass), EX211L (2,2-dimethylpropanediol type, total chlorine content 0.7% by mass), EX321L (trimethylolpropane type , total chlorine content 0.4% by mass) (manufactured by Nagase ChemteX); YX-8000 (hydrogenated bisphenol A type, total chlorine content 0.011% by mass), YX-8034 (hydrogenated bisphenol A type, total chlorine content 0.006% by mass), (manufactured by Mitsubishi Chemical), EP-4088S (dicyclopentadiene dimethanol type, total chlorine content 0.3% by mass), EP-4088L (dicyclopent
• bifunctional or higher aliphatic epoxy resins with a high total chlorine content It is presumed that this is because the resin (B) contains an impurity in which a part of the epoxy group is substituted with another group, which inhibits the cross-linking reaction.
• an intermediate product of the reaction to obtain an epoxy resin for example, a compound having a 3-chloro-2-hydroxypropyl group instead of a glycidyl group is known.
• one of the bifunctional aliphatic epoxy resins A compound in which the glycidyl group of is a 3-chloro-2-hydroxypropyl group is included as an impurity.
• the impurities listed on the left although the glycidyl group at one end of the molecule consumes the reaction point where the cross-linking reaction should have originally occurred, there is no glycidyl group at the other end of the molecule, so no cross-linking structure is formed, and the cross-linking density of the cured product is decreases. It is believed that the same is true in the case of using a tri- or higher functional aliphatic epoxy resin (B) in that it inhibits the cross-linking reaction.
• the content of the aliphatic epoxy resin (B) in the adhesive composition of the present invention is 1- It is preferably 30 parts by mass, more preferably 5 to 30 parts by mass.
• the content of the aliphatic epoxy resin (B) is at least the lower limit, workability is improved due to the dilution effect.
• cured material becomes it favorable that it is below the said upper limit.
• epoxy resin curing agent (C) used in the present invention, known compounds capable of curing epoxy resins can be used, such as dicyandiamide; bisphenol compounds such as bisphenol A, bisphenol F and bisphenol E; catechol compounds such as catechol, resorcinol and methylcatechol; biphenol compounds such as biphenol and tetramethylbiphenol; biscresol compounds such as biscresol fluorene; hydroquinone compounds; liquid phenol compounds such as trisdimethylaminomethylphenol; Novolac compounds; aliphatic amines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, diethylaminopropylamine; isophoronediamine, 1,3-bis Alicyclic polyamines such as aminomethylcyclohexane, bis(4-aminocyclohe
• the content of the epoxy resin curing agent (C) in the adhesive composition of the present invention is the epoxy resin curing agent (
• the ratio of the number of active hydrogen groups in C) is preferably from 1.00 to 1.10:1.00, more preferably from 1.05 to 1.10:1.00. This is because when the epoxy groups are in excess of the active hydrogen groups, a branching reaction occurs and the heat resistance of the cured product is improved.
• curing catalyst (D) used in the present invention, known compounds known as curing catalysts for epoxy resins can be used, for example, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, N,N'-(4-methyl-1,3-phenylene)bis[N,N'-dimethylurea], N'-[3- Ureas such as [[[(dimethylamino)carbonyl]amino]methyl]-3,5,5-trimethylcyclohexyl]-N,N-dimethylurea; DBU (1,8-diazabicyclo[5.4.0]undecene -7), DBU-type amines such as DBU-phenol salt, DBU-octylate, DBU-formate, DBU-p-toluenesulfonate; DBN (1,5-diazabicyclo
• the content of the curing catalyst (D) in the adhesive composition of the present invention is preferably 0.1 to 20 parts by mass with respect to a total of 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B). It is more preferably 0.5 to 10 parts by mass, still more preferably 1 to 5 parts by mass. Within the above range, good curability and stability are obtained from the viewpoint of catalytic activity and reaction rate.
• thixotropic agent (E) As the thixotropic agent (E) used in the present invention, known compounds known as thixotropic agents for epoxy resins can be used, for example, hydrophilic fumed silica and surface-treated hydrophobic fumed silicas such as fumed silica; carbon blacks such as ketjen black; fine particles such as fine calcium carbonate, sepiolite, various metal powders; wollastonite, mica, talc, kaolin, barium sulfate, calcium carbonate , magnesium hydroxide, inorganic fillers having a high aspect ratio such as clay, and the like.
• fumed silicas are preferred because of their small particle size and large effect of imparting thixotropic properties, and hydrophobic fumed silicas are particularly preferred.
• the content of the thixotropic agent (E) in the adhesive composition of the present invention is preferably 1 to 20 parts by mass with respect to a total of 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B), and more It is preferably 0.5 to 10 parts by mass, more preferably 1 to 5 parts by mass. Within the above range, the thixotropic property is good and the workability is good.
• the adhesive composition of the present invention preferably further contains a hygroscopic inorganic filler (F) (hereinafter also referred to as inorganic filler (F) or simply component (F)).
• a hygroscopic inorganic filler (F) hereinafter also referred to as inorganic filler (F) or simply component (F)
• foaming during curing can be suppressed.
• the hygroscopic inorganic filler (F) include an inorganic filler that chemically reacts with water, an inorganic filler that absorbs moisture due to its porosity, and the like.
• Examples of the inorganic filler (F) used in the present invention include metal oxides and metal hydroxides such as magnesium oxide, calcium oxide, and silicon dioxide. Of these, calcium oxide is preferred because it can effectively reduce the curing time and can chemically react with water, although the reason is not clear.
• the content of the inorganic filler (F) in the adhesive composition of the present invention is 1 to 20 parts by mass with respect to a total of 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B). is preferred, more preferably 0.5 to 10 parts by mass, still more preferably 1 to 5 parts by mass. Within the above range, suppression of foaming during curing can be expected, and the toughness of the cured product is improved.
• the adhesive composition of the present invention may further contain elastomers, core-shell rubbers, coupling agents, inorganic fillers, spacers, various additives, etc., in addition to the components described above.
• Elastomers are used to modify adhesives.
• NBR acrylonitrile-butadiene rubber
• SBR styrene-butadiene rubber
• polybutadiene rubber-modified epoxy resins such as terminal carboxylic acid-modified acrylonitrile-butadiene
• Hypox RA series manufactured by CVC
• ADEKA RESIN EPU series such as ADEKA RESIN EPU73B
• Hypox UA series manufactured by CVC
• Liquid rubbers such as NBR, SBR, polybutadiene
• Silicone resins Carboxylic acid or amino terminal acrylonitrile-butadiene rubber (CTBN, ATBN); NBR rubber having carboxylic acid in the main chain; carboxylic acid terminal polybutadiene; liquid polysulfide; various
• Core-shell rubber is used to temporarily fix parts using modified adhesives and physical cross-linking.
• Kaneace MX153, MX154, MX-257, MX-960, MX-136, MX-217 (all manufactured by Kaneka), Ganz Pearl (manufactured by Aica Kogyo) and the like can be mentioned.
• the core-shell rubber is a particle having at least a two-layer structure of a core layer made of a rubber component and a hard shell layer.
• a rubber-like substance is used, for example, a polymer obtained by polymerizing a conjugated diene such as polybutadiene and/or a lower alkyl acrylate, a polymer obtained by copolymerizing a monomer that can be copolymerized with these polymers, or polysiloxane. Consists of rubber or the like.
• the core layer preferably has a glass transition temperature of ⁇ 20° C. or less from the viewpoint of improving impact resistance at low temperatures and peeling strength.
• the shell layer it is preferable to use a component that has a high affinity with the epoxy resin and does not exhibit rubber elasticity.
• graft polymerization is a polymer obtained by polymerizing methyl methacrylate and / or a styrene monomer, or a polymer obtained by copolymerizing a monomer copolymerizable with these. It is preferable from the viewpoint of the properties and the affinity with the epoxy resin. From the viewpoint of adhesiveness, the shell layer is preferably made of a material having a glass transition point of 50° C. or higher.
• Coupling agents are used to improve adhesion to substrates, fillers, resins, etc.
• Inorganic fillers are used for purposes such as filling and improving mechanical properties.
• a spacer is used to adjust the thickness of the adhesive.
• examples include glass beads, fibers, resin beads, and inorganic fillers having hardness and particle size above a certain level. These may be used alone or in combination of two or more.
• the particle size of the spacer is preferably 1-200 ⁇ m, more preferably 10-150 ⁇ m. If the particle size of the spacer is less than 1 ⁇ m, it may be difficult to control the thickness of the adhesive, and if it exceeds 200 ⁇ m, the stress of the adhesive may become too large.
• the shape of the spacer includes, for example, spherical particles and fibrous particles. Among these, spherical particles are preferable because the particle size can be easily controlled.
• the amount used is preferably 0.2 to 1.5 parts by mass, preferably 0.5 to 1 part by mass, per 100 parts by mass of the aromatic epoxy resin (A) and the aliphatic epoxy resin (B). is more preferred.
• additives include, for example, plasticizers, reactive diluents, storage stabilizers, anti-aging agents, antioxidants, pigments, dyes, colorants, coupling agents, leveling agents, tackifiers, flame retardants. , antistatic agents, conductivity imparting agents, lubricants, slidability imparting agents, ultraviolet absorbers, surfactants, dispersants, dispersion stabilizers, antifoaming agents, dehydrating agents, cross-linking agents, rust inhibitors, solvents, etc. can be blended.
• the adhesive composition of the present invention can be produced by mixing each component described above.
• Mixing methods include a disper, a double planetary mixer, a rotation/revolution mixer, a homogenizer, a three-roll mixer, a kneader, and a kneader.
• Examples of the method of applying the adhesive composition of the present invention include a method of applying the adhesive composition filled in a syringe or the like with a dispenser, a method of spraying, a gun, a brush, and the like.
• the application temperature of the adhesive composition is preferably 30 to 60°C.
• the curing temperature of the adhesive composition is preferably 120-220°C, more preferably 140-200°C.
• the curing time is preferably 20 to 120 minutes, more preferably 30 to 90 minutes, still more preferably 30 to 60 minutes.
• the laminate of the present invention comprises an adhesive layer obtained by placing the adhesive composition of the present invention between substrates 1 and 2 and curing the adhesive composition.
• the base material 1 and the base material 2 are metals such as iron, aluminum, steel, etc.; fiber reinforced plastics such as CFRP (carbon fiber reinforced plastic) and GFRP (glass fiber reinforced plastic); PET (polyethylene terephthalate); engineering plastic resins such as PBT (polybutylene terephthalate), PC (polycarbonate), PI (polyimide), PA (polyamide); and glass.
• ⁇ Tensile shear strength> A test piece was prepared and measured in accordance with JIS K6850:1999 by using an adherend obtained by degreasing the following base material with acetone. The tensile speed was set to 10 mm/min. The tensile shear strength of the test piece prepared by coating the adhesive composition so that the thickness of the adhesive layer is 0.1 mm and curing at 170 ° C. for 30 minutes is ⁇ , and the level of less than 20 MPa. x.
• Base material SPCC-SD (cold-rolled steel plate) (1.6 mm ⁇ 25 mm ⁇ 100 mm, manufactured by Engineering Test Piece)
• ⁇ tan ⁇ peak> It was measured with a dynamic viscoelasticity measuring device (DVA-220, manufactured by IT Keisoku Co., Ltd.). The dynamic viscoelasticity of the adhesive composition was cured at 170° C. for 30 minutes and cut into strips under conditions of a frequency of 10 Hz and a heating rate of 4° C./min. The tan ⁇ peak obtained by the measurement was used as an index of heat resistance, and the level of tan ⁇ peak of 80°C or higher was indicated by ⁇ , and the level of lower than 80°C was indicated by x.
• DVA-220 dynamic viscoelasticity measuring device
• ⁇ Measurement of curing time> The viscoelasticity during the curing process was measured using a rigid pendulum physical property tester (RPT-3000W, A&D Co., Ltd.), and the curing time was measured.
• the prepared adhesive composition was applied to a 60 mm long ⁇ 20 mm wide aluminum plate to a thickness of 100 ⁇ m using an applicator. Then, a pendulum and a flat knife edge were selected so that the inertia ratio was 4000, the temperature was raised from room temperature to 170°C at a heating rate of 10°C/min, and the measurement was performed by heating at 170°C for 60 minutes.
• the curing time was measured from the time obtained in the process until the cycle stabilized. A level at which the cycle was stabilized within 60 minutes was judged to be ⁇ , and a level at which the cycle was not stabilized within the time or a decrease in the cycle before and after curing was less than 0.3 s was judged to be x.
• Total chlorine content The total chlorine content (mass%) of the aliphatic epoxy resin (B) was measured by the method described in JIS K 7243-3:2005.
• Epoxy resin composition (A-1) 80.4 parts by mass, aliphatic epoxy resin (B-3) 19.6 parts by mass, epoxy resin curing agent (C-1) 60.7 parts by mass, curing catalyst (D- 1) 2.8 parts by mass of the thixotropic agent (E-1) and 2.8 parts by mass of the thixotropic agent (E-1) were mixed by a rotation-revolution mixer to obtain an adhesive composition 1.
• the adhesive composition 1 thus obtained was evaluated for tensile shear strength, tan ⁇ peak, curing time and gel fraction. Table 1 shows the results.
• Adhesive compositions 2 to 11 were prepared in the same manner as in Example 1, except that the content shown in Table 1 was changed as the composition of the adhesive composition. The tensile shear strength, tan ⁇ peak, curing time and gel fraction of each obtained adhesive composition were evaluated. Table 1 shows the results.
• Aromatic epoxy resin A-1 jER-828 (bisphenol A type epoxy resin, epoxy equivalent 185 g / eq, manufactured by Mitsubishi Chemical)
• Aliphatic epoxy resin B-1 EX-211 (neopentyl glycol diglycidyl ether, total chlorine content 5.7%, epoxy equivalent 138 g / eq, manufactured by Nagase ChemteX)
• Aliphatic epoxy resin B-2 ED-505: Trimethylolpropane polyglycidyl ether, total chlorine content 8.0%, epoxy equivalent 150 g / eq, manufactured by ADEKA
• Aliphatic epoxy resin B-3 EX-211L: neopentyl glycol Diglycidyl ether, total chlorine content 0.7%, epoxy equivalent 130 g/eq, Nagase ChemteX aliphatic epoxy resin B-4: EX-321L: trimethylolpropane polyglycidyl ether, total chlorine content 0.3%
• the adhesive composition of the present invention can be suitably used as an adhesive with excellent adhesion and curability, it is expected to greatly contribute to the industrial world, especially as a structural adhesive.

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• 2022
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