KR20240124938A - 접착제 조성물 및 적층체 - Google Patents

접착제 조성물 및 적층체 Download PDF

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Publication number
KR20240124938A
KR20240124938A KR1020247022286A KR20247022286A KR20240124938A KR 20240124938 A KR20240124938 A KR 20240124938A KR 1020247022286 A KR1020247022286 A KR 1020247022286A KR 20247022286 A KR20247022286 A KR 20247022286A KR 20240124938 A KR20240124938 A KR 20240124938A
Authority
KR
South Korea
Prior art keywords
epoxy resin
adhesive composition
mass
bifunctional
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247022286A
Other languages
English (en)
Korean (ko)
Inventor
다쿠야 시바
Original Assignee
도요보 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요보 가부시키가이샤 filed Critical 도요보 가부시키가이샤
Publication of KR20240124938A publication Critical patent/KR20240124938A/ko
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/50Phosphorus bound to carbon only
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2206Oxides; Hydroxides of metals of calcium, strontium or barium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
KR1020247022286A 2021-12-20 2022-12-20 접착제 조성물 및 적층체 Pending KR20240124938A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021205733 2021-12-20
JPJP-P-2021-205733 2021-12-20
PCT/JP2022/046837 WO2023120511A1 (ja) 2021-12-20 2022-12-20 接着剤組成物および積層体

Publications (1)

Publication Number Publication Date
KR20240124938A true KR20240124938A (ko) 2024-08-19

Family

ID=86902437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247022286A Pending KR20240124938A (ko) 2021-12-20 2022-12-20 접착제 조성물 및 적층체

Country Status (6)

Country Link
US (1) US20250101280A1 (https=)
EP (1) EP4455242A1 (https=)
JP (1) JPWO2023120511A1 (https=)
KR (1) KR20240124938A (https=)
CN (1) CN118414395A (https=)
WO (1) WO2023120511A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119351025B (zh) * 2024-12-25 2025-08-22 清华大学 双组分承重型胶粘剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017191801A (ja) 2016-04-11 2017-10-19 株式会社小森コーポレーション 電子デバイス製造装置
JP6632401B2 (ja) 2016-01-29 2020-01-22 アイシン化工株式会社 構造用接着剤組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4735297B2 (ja) * 2006-02-03 2011-07-27 三菱化学株式会社 エポキシ樹脂硬化層と構造体構成材料が一体化した複合体
JP2008174577A (ja) * 2007-01-16 2008-07-31 Kyocera Chemical Corp ダイボンディングペーストおよびそれを用いた半導体装置
CN103930501B (zh) * 2011-11-14 2017-09-12 Lg化学株式会社 粘合膜
ES2748241T3 (es) * 2013-10-29 2020-03-16 Kaneka Corp Composición de resina curable que contiene partículas finas de polímero que tiene estabilidad en almacenamiento mejorada
JP2017186483A (ja) * 2016-04-08 2017-10-12 積水化学工業株式会社 積層シート、接着層及び金属材付き半導体チップの製造方法、及び半導体装置の製造方法
JP7167441B2 (ja) 2016-05-06 2022-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤
JP7024174B2 (ja) * 2016-08-26 2022-02-24 味の素株式会社 樹脂組成物
EP3529328B1 (en) * 2016-10-24 2020-06-24 Dow Global Technologies LLC Epoxy adhesive resistant to open bead humidity exposure
JP2019083225A (ja) * 2017-10-27 2019-05-30 日立化成株式会社 アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法
US11932785B2 (en) * 2018-03-28 2024-03-19 Sekisui Chemical Co., Ltd. Epoxy adhesive composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6632401B2 (ja) 2016-01-29 2020-01-22 アイシン化工株式会社 構造用接着剤組成物
JP2017191801A (ja) 2016-04-11 2017-10-19 株式会社小森コーポレーション 電子デバイス製造装置

Also Published As

Publication number Publication date
US20250101280A1 (en) 2025-03-27
EP4455242A1 (en) 2024-10-30
JPWO2023120511A1 (https=) 2023-06-29
CN118414395A (zh) 2024-07-30
WO2023120511A1 (ja) 2023-06-29

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PA0105 International application

Patent event date: 20240703

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application