WO2023071486A1 - 一种电路板及其制作方法、终端设备 - Google Patents

一种电路板及其制作方法、终端设备 Download PDF

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Publication number
WO2023071486A1
WO2023071486A1 PCT/CN2022/115228 CN2022115228W WO2023071486A1 WO 2023071486 A1 WO2023071486 A1 WO 2023071486A1 CN 2022115228 W CN2022115228 W CN 2022115228W WO 2023071486 A1 WO2023071486 A1 WO 2023071486A1
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WIPO (PCT)
Prior art keywords
pad
liquid metal
metal body
circuit board
radio frequency
Prior art date
Application number
PCT/CN2022/115228
Other languages
English (en)
French (fr)
Inventor
杨俊杰
李二亮
白剑
李晓航
Original Assignee
荣耀终端有限公司
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Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/041,767 priority Critical patent/US20240237194A9/en
Priority to EP22857003.2A priority patent/EP4199662A4/en
Publication of WO2023071486A1 publication Critical patent/WO2023071486A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Definitions

  • the present application relates to the technical field of terminals, in particular to a circuit board, a manufacturing method thereof, and a terminal device.
  • the radio frequency circuit In the circuit board of terminal equipment such as mobile phones, the radio frequency circuit is an important part. It is generally composed of a radio frequency front-end circuit and a radio frequency back-end circuit. Due to the large number of components involved in the radio frequency front-end circuit, the composition is relatively complicated. Therefore, in In the actual production process of the circuit board, it is necessary to test the RF front-end circuit to detect the quality of components and welding problems in the RF circuit.
  • the radio frequency switch test socket is usually used to test the radio frequency front-end circuit, as shown in FIG. 1 , which is a schematic diagram of testing the circuit board of the current terminal equipment.
  • the circuit board of the terminal device includes a radio frequency front-end circuit 11 , a radio frequency back-end circuit 12 , and a switch test socket 17 connected between the radio frequency front-end circuit 11 and the radio frequency back-end circuit 12 .
  • the test terminal 410 of the radio frequency test instrument 400 is inserted in the switch test socket 17, to disconnect the connection between the radio frequency front-end circuit 11 and the radio frequency back-end circuit 12, and the test terminal 410 and the radio frequency front-end circuit 11, so as to introduce the signal from the RF front-end circuit 11 into the RF testing instrument 400 for testing.
  • the test terminal 410 is pulled out from the switch test socket 17 to reconnect the RF front-end circuit 11 and the RF back-end circuit 12 to ensure that the function of the circuit board is normal.
  • the RF switch test socket 17 on the above-mentioned circuit board generally has no other functions after the test is completed, which not only occupies the layout area on the circuit board, but also increases the device cost of the terminal equipment.
  • the related art discloses a circuit board in which two pads are used to replace the switch test socket, one of which is connected to the RF switch test socket.
  • the front-end circuit is connected, and the other pad is connected to the RF back-end circuit.
  • the test terminal of the RF test instrument When testing the RF front-end circuit, the test terminal of the RF test instrument is connected to one of the pads, so as to introduce the signal from the RF front-end circuit into the RF test instrument for testing. After the test is completed, the series device is soldered between the two pads through a low-temperature reflow process, so as to conduct the RF front-end circuit and the RF back-end circuit.
  • the serial device is soldered between two pads through a low-temperature reflow soldering process, and low-temperature solder paste is required for soldering during soldering, while other devices on the circuit board of the terminal equipment are usually soldered with high-temperature tin
  • This increases the risk of solder paste mixing.
  • soldering series devices it is easy to mix high-temperature solder paste for soldering, which easily increases the probability of soldering defects, thereby reducing the connection between the RF front-end circuit and the RF back-end circuit. reliability.
  • Embodiments of the present application provide a circuit board, a manufacturing method thereof, and a terminal device, which are used to solve the problem of low connection reliability between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in the related art.
  • the embodiment of the present application provides a circuit board, including a substrate and a liquid metal body, the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit and a pad group, and the pad group includes the The first pad electrically connected to the radio frequency front-end circuit and the second pad electrically connected to the radio frequency back-end circuit, the second pad is set apart from the first pad; the liquid metal body is set on the The first pad is connected to the second pad, so that the radio frequency front-end circuit is electrically connected to the radio frequency back-end circuit.
  • connection process between the first pad and the second pad is simpler, and there is no need to add low-temperature solder paste for soldering, thus avoiding soldering defects caused by solder paste mixing, thereby improving the first soldering process.
  • the reliability of the connection between the pad and the second pad thereby improving the reliability of the connection between the radio frequency front-end circuit and the radio frequency back-end circuit.
  • the liquid metal body is disposed on a side of the pad group away from the substrate, and is in contact with the first pad and the second pad.
  • the first pad includes a first pad surface on a side away from the substrate, and the second pad includes a second pad surface on a side away from the substrate;
  • the liquid metal body is A layered structure, which is stacked with the first pad surface and the first pad surface.
  • the contact area between the liquid metal body and the first pad surface and the second pad surface can be increased, thereby reducing the impedance of the liquid metal body.
  • the first pad surface is flush with the second pad surface.
  • the liquid metal body is flush with an edge of the first pad surface away from the second pad.
  • the contact area between the liquid metal body and the second pad surface can be maximized, which is more conducive to reducing the impedance of the liquid metal body.
  • the liquid metal body is flush with an edge of the second pad surface away from the first pad.
  • the contact area between the liquid metal body and the second pad surface can be maximized, which is more conducive to reducing the impedance of the liquid metal body.
  • the circuit board further includes a first insulating layer, and the first insulating layer is filled in a gap between the first pad and the second pad.
  • the first insulating layer can support the part of the liquid metal body opposite to the gap between the first pad and the second pad, so that the liquid metal body can be better prevented from contacting the substrate .
  • the liquid metal body is filled in a gap between the first pad and the second pad.
  • the circuit board further includes a second insulating layer, and the second insulating layer is disposed at the position of the liquid metal body to cover the liquid metal body.
  • the liquid metal body has a layered structure, and the second insulating layer is stacked on a side of the liquid metal body away from the substrate.
  • the second insulating layer can be conveniently arranged on the liquid metal body, so that the contact area between the second insulating layer and the liquid metal body is large, and it is not easy to separate from the liquid metal body.
  • the second insulating layer is a heat-curable adhesive layer or an ultraviolet-curable adhesive layer.
  • the second insulating layer has a certain mechanical strength, so that the position of the liquid metal body can be well restricted to the pad group.
  • the circuit board further includes a first shielding cover, and the first shielding cover is disposed on a region where the radio frequency front-end circuit is disposed on the substrate.
  • the circuit board further includes a second shielding cover, and the second shielding cover is provided on the substrate where the radio frequency back-end circuit is disposed.
  • the embodiment of the present application provides a terminal device, including a casing, an antenna, and the circuit board described in the first aspect, the circuit board is arranged in the casing, and the radio frequency backend between the antenna and the circuit board electrical connection to the terminal circuit.
  • the technical effect of the terminal device is the same as that of the circuit board in the first aspect, and will not be repeated here.
  • the embodiment of the present application provides a method for manufacturing a circuit board, including: providing a substrate; wherein, the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, and the pad group It includes a first pad electrically connected to the radio frequency front-end circuit, and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is set apart from the first pad. Electrically connect a test terminal of a radio frequency testing instrument to the first pad, so as to test the radio frequency front-end circuit. After the RF front-end circuit is tested, a liquid metal body is arranged at the position of the pad group, and the first pad is connected to the second pad, so that the RF front-end circuit and the The radio frequency back-end circuit is electrically connected.
  • setting a liquid metal body at the position of the pad group, and connecting the first pad to the second pad includes: The liquid metal body is arranged on the side, so that the liquid metal body is in contact with the first welding pad and the second welding pad.
  • the liquid metal body on the side of the pad group away from the substrate before disposing the liquid metal body on the side of the pad group away from the substrate, it further includes: filling the gap between the first pad and the second pad with an insulating material In order to form the first insulating layer.
  • the first insulating layer can support the part of the liquid metal body opposite to the space between the first pad and the second pad, so as to better avoid the contact between the liquid metal body and the substrate .
  • the liquid metal body is arranged on the side of the pad group away from the substrate, so that the liquid metal body is in contact with the first pad and the second pad, including A method for stacking a mask plate with a mask hole on the substrate, so that the pad group is located in the mask hole. Coating a liquid metal material into the mask hole to form the liquid metal body on the side of the pad group away from the substrate.
  • the coating position and coating amount of the liquid metal material can be precisely controlled.
  • setting a liquid metal body at the position of the pad group, and connecting the first pad to the second pad includes: filling the first pad with a liquid metal material and the second pad to form the liquid metal body.
  • filling the liquid metal material in the gap between the first pad and the second pad to form the liquid metal body includes: stacking a mask hole on the substrate mask plate, so that the pad group is located in the mask hole. Coating a liquid metal material into the mask hole to form the liquid metal body in the gap between the first pad and the second pad.
  • the coating position and coating amount of the liquid metal material can be precisely controlled.
  • the liquid metal body after arranging the liquid metal body at the position of the pad group, it further includes: coating an insulating material on the position of the liquid metal body to form a first layer covering the liquid metal body. Two insulating layers.
  • coating an insulating material at the position of the liquid metal body to form a second insulating layer covering the liquid metal body includes: coating an insulating glue on the liquid metal body position, and then after curing, the second insulating layer is formed.
  • the second insulating layer formed after the insulating glue is cured has a certain mechanical strength, and can well limit the position of the liquid metal body to the pad group.
  • FIG. 1 is a schematic diagram of testing a circuit board of a current terminal device
  • FIG. 2 is an exploded view of a mobile phone in some embodiments of the present application.
  • Fig. 3 is a schematic structural diagram of the circuit board in Fig. 2;
  • Fig. 4 is a partial schematic diagram of Fig. 3;
  • FIG. 5 is a schematic structural view of the circuit board in FIG. 3 after removing the second insulating layer
  • FIG. 6 is a cross-sectional view of the circuit board in FIG. 4 at the pad group;
  • FIG. 7 is a structural diagram of the circuit board at the pad group in other embodiments of the present application.
  • Fig. 9a is a process diagram of the manufacturing method of the circuit board shown in Fig. 6;
  • Fig. 9b is a flowchart of the manufacturing method of the circuit board shown in Fig. 6;
  • Fig. 10 is a process diagram of the manufacturing method of the circuit board shown in Fig. 7;
  • Fig. 11a is a process diagram of the manufacturing method of the circuit board shown in Fig. 8;
  • FIG. 11 b is a flow chart of the manufacturing method of the circuit board shown in FIG. 8 .
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
  • a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • electrical connection should be understood in a broad sense, for example, it may be to realize current conduction through direct connection, or to realize electric energy conduction through capacitive coupling.
  • the circuit board, its manufacturing method, and terminal equipment provided by the embodiments of the present application replace the serial devices welded on the pads in the related art with a liquid metal body, thereby improving the communication between the radio frequency front-end circuit and the radio frequency back-end circuit. Connection reliability.
  • the terminal device in the embodiment of the present application may be a mobile phone, a tablet computer, an e-reader, a wearable device (such as a smart watch), a POS (point of sales terminal; point of sale information management system) machine, a personal digital assistant (personal digital assistant) , PDA), vehicle-mounted equipment, network TV and other terminal equipment with antenna structure.
  • a wearable device such as a smart watch
  • POS point of sales terminal; point of sale information management system
  • PDA personal digital assistant
  • vehicle-mounted equipment network TV and other terminal equipment with antenna structure.
  • the following takes a mobile phone as an example to specifically describe the circuit board of the terminal device in the embodiment of the present application.
  • Other types of terminal devices can be set with reference to the design concept of the circuit board in the mobile phone embodiment, and will not be repeated here.
  • FIG. 2 is an exploded view of a mobile phone in some embodiments of the present application.
  • the mobile phone includes a casing 100 , a circuit board 200 and a battery 300 .
  • the casing 100 includes a front case 110 (also called a middle frame) and a rear cover 120 (also called a battery cover).
  • the front case 110 includes a bottom wall 111 and a side wall 112 disposed at an edge of the bottom wall 111 .
  • the rear cover 120 is buckled on the front case 110, and the rear cover 120 forms an accommodating space 130 with the bottom wall 111 and the side wall 112 of the front case 110.
  • the accommodating space 130 includes a circuit board accommodating space 131 separated by a partition wall 140 and a battery accommodating space. Space 132 , the circuit board 200 is disposed in the circuit board accommodating space 131 , the battery 300 is disposed in the battery accommodating space 132 , and is electrically connected to the circuit board 200 through an electrical connector (not shown in the figure).
  • Figure 3 is a schematic structural view of the circuit board 200 in Figure 2
  • Figure 4 is a partial schematic view of Figure 3
  • Figure 5 is a schematic view of the circuit board 200 in Figure 3 after removing the second insulating layer 4 Schematic.
  • the circuit board 200 includes a substrate 1 and a liquid metal body 2 .
  • the substrate 1 is provided with a radio frequency front-end circuit 11, a radio frequency back-end circuit 12, an antenna shrapnel 13 and a pad group 14, and the pad group 14 includes a first pad 15 electrically connected to the radio frequency front-end circuit 11, and a first pad 15 connected to the radio frequency back-end circuit. 12 is electrically connected to the second pad 16, and the second pad 16 is set apart from the first pad 15.
  • the contour shapes of the first pad 15 and the second pad 16 are rectangular (as shown in FIG. 5 ), but they are not limited thereto.
  • the contour shapes of the first pad 15 and the second pad 16 can also be circular, oval etc.
  • the terminal device further includes an antenna, and the antenna includes an antenna radiator disposed in the circuit board accommodation space 131 , and the antenna radiator is electrically connected to the radio frequency back-end circuit 12 through the antenna shrapnel 13 .
  • the number of antenna shrapnel 13 can be one or more, which can be determined according to the number of antenna radiators.
  • the above-mentioned substrate 1 is a circuit board 200 without soldering any circuit devices and chips.
  • the RF front-end circuit 11 refers to a part of the circuit between the antenna and the intermediate frequency (or baseband) circuit. In this section of the circuit, the signal is transmitted in the form of radio frequency.
  • the RF front-end circuit 11 usually includes: amplifiers, filters, and frequency converters; Circuitry 12 includes, but is not limited to, antenna matching circuits.
  • the liquid metal body 2 is disposed at the pad group 14 and connects the first pad 15 and the second pad 16 to electrically connect the RF front-end circuit 11 and the RF back-end circuit 12 .
  • the material of the liquid metal body 2 is a liquid metal material, which is a general term for a class of metal materials that are in a liquid state at a relatively low temperature. It has a certain fluidity, for example, liquid metal material can be made into a paste, with a viscous texture and strong adsorption.
  • the material of the liquid metal body can be low-melting point metals, such as gallium (Ga) and sodium (Na), potassium (K), lithium (Li) in alkali metals, or low-melting point alloys, such as gallium metal alloys. This is not specifically limited.
  • Table 1 below describes the electrical parameters when the liquid metal body is a gallium metal alloy. From the data in Table 1, it can be seen that the conductivity and impedance of the liquid metal body 2 can fully meet the requirements of radio frequency circuits.
  • the liquid metal body 2 is disposed on the first pad 15
  • the connection can be completed at the second pad 16, which makes the connection process between the first pad 15 and the second pad 16 simpler, and does not need to add low-temperature solder paste for soldering, thus avoiding the soldering caused by the mixing of solder paste defects, thereby improving the reliability of the connection between the first pad 15 and the second pad 16 , thereby improving the reliability of the connection between the radio frequency front-end circuit 11 and the radio frequency back-end circuit 12 .
  • the existing dispensing equipment is needed to coat the liquid metal material on the pad group 14 to form the liquid metal body 2, without additional additional equipment, so that the circuit board 200
  • the process route is relatively simple, which is beneficial to reduce the manufacturing cost of the circuit board 200 .
  • the setting position of the liquid metal body 2 at the pad group 14 is not unique, and Fig. 5 and Fig. 6 show the first embodiment of the liquid metal body 2 at the pad group 14, and Fig. 6 shows the position in Fig. 4 A cross-sectional view of the circuit board 200 at the pad group 14 .
  • the liquid metal body 2 is disposed on the side of the pad group 14 away from the substrate 1 , and is in contact with the first pad 15 and the second pad 16 .
  • the liquid metal body 2 By arranging the liquid metal body 2 on the side of the pad group 14 away from the substrate 1, the liquid metal body 2 can be separated from the substrate 1 by a certain distance, thereby avoiding the contact between the liquid metal body 2 and the substrate 1, thereby reducing the substrate 1. The risk of the circuit above being short-circuited by the liquid metal body 2.
  • the surface of the liquid metal body 2 has a certain tension and can span the gap between the first pad 15 and the second pad 16 .
  • the first pad 15 includes a first pad surface 151 away from the substrate 1 side
  • the second pad 16 includes a second pad surface 161 away from the substrate 1 side.
  • the liquid metal body 2 has a layered structure and is stacked with the first pad surface 151 and the first pad surface 151 .
  • the contact area between the liquid metal body 2 and the first pad surface 151 and the second pad surface 161 can be increased, thereby helping to reduce the liquid metal body 2.
  • the impedance of the metal body 2 facilitates the transmission of radio frequency signals on the liquid metal body 2.
  • liquid metal body 2 can also be arranged in other shapes according to the actual situation, such as a drop shape, a cone shape, and the like.
  • the liquid metal body 2 and the first pad surface 151 are away from the side edge of the second pad 16 (the side edge of the first pad surface 151 shown in FIG. 6 a) Phase flush. In this way, the contact area between the liquid metal body 2 and the first pad surface 151 can be maximized, which is more conducive to reducing the impedance of the liquid metal body 2 to facilitate the transmission of radio frequency signals on the liquid metal body 2 .
  • the liquid metal body 2 and the second pad surface 161 are away from the side edge of the first pad 15 (the side edge of the second pad surface 161 shown in FIG. 6 b) flush with each other. In this way, the contact area between the liquid metal body 2 and the second pad surface 161 can be maximized, which is more conducive to reducing the impedance of the liquid metal body 2 so as to facilitate the transmission of radio frequency signals on the liquid metal body 2 .
  • the liquid metal body 2 can be flush with the side edge a of the first pad surface 151 and the side edge b of the second pad surface 161; it can also be only with the side edge a of the first pad surface 151 or the second pad surface
  • the side edge b of 161 is flush with each other, which may be determined according to actual conditions.
  • the first pad surface 151 is flush with the second pad surface 161 . In this way, the formation of steps between the first pad 15 and the second pad 16 can be avoided, so that the liquid metal body 2 can be conveniently disposed on the first pad surface 151 and the second pad surface 161 .
  • FIG. 7 is a structural diagram of the circuit board 200 at the pad group 14 in other embodiments of the present application.
  • the circuit board 200 also includes a first insulating layer 3 filled in the gap between the first pad 15 and the second pad 16 .
  • the first insulating layer 3 can support the part of the gap between the liquid metal body 2 and the first pad 15 and the second pad 16, thereby better avoiding the contact between the liquid metal body 2 and the substrate 1. contact, thereby greatly reducing the risk of the circuit on the substrate 1 being short-circuited by the liquid metal body 2 .
  • the first insulating layer 3 may be an insulating adhesive layer, and the insulating adhesive layer may be an insulating adhesive layer formed after curing a heat-curing adhesive or an ultraviolet-curing adhesive.
  • the circuit board 200 further includes a second insulating layer 4 disposed at the position of the liquid metal body 2 to cover the liquid metal body 2 .
  • the second insulating layer 4 can isolate the liquid metal body 2 , so as to avoid short circuit between the liquid metal body 2 and the electronic devices around the pad group 14 .
  • the second insulating layer 4 is a thermosetting adhesive layer.
  • the thermosetting adhesive layer is an adhesive layer formed after the thermosetting adhesive is heated and cured. It has a certain mechanical strength. By covering the liquid metal body 2 with heat The cured adhesive layer can not only play the role of insulation, but also can well limit the position of the liquid metal body 2 to the pad group 14, so as to prevent the liquid metal body 2 from the pad group 14 when the terminal equipment is shaking. Detach and move to another location.
  • the heat-curing adhesive layer is a UF adhesive layer
  • the main component of the UF (Underfill; bottom filling) adhesive is epoxy resin
  • the second insulating layer 4 is an ultraviolet curing adhesive layer, which is an adhesive layer formed after ultraviolet curing adhesive (alias: photosensitive adhesive, shadowless adhesive) is cured by ultraviolet radiation, and it also has a certain The mechanical strength can not only play the role of insulation, but also can well limit the position of the liquid metal body 2 to the pad group 14 .
  • ultraviolet curing adhesive alias: photosensitive adhesive, shadowless adhesive
  • the liquid metal body 2 has a layered structure, and the second insulating layer 4 is stacked on the side of the liquid metal body 2 away from the substrate 1 .
  • the liquid metal body 2 is arranged in a layered structure, and the second insulating layer 4 is stacked on the side of the liquid metal body 2 away from the substrate 1, so that it is convenient to arrange the second insulating layer 4 on the liquid metal body 2, so that the second insulating layer 4
  • the contact area between the second insulating layer 4 and the liquid metal body 2 is large, and it is not easy to separate from the liquid metal body 2 .
  • FIG. 8 shows a second embodiment of the location of the liquid metal body 2 at the pad group 14 .
  • the liquid metal body 2 fills the gap between the first pad 15 and the second pad 16 .
  • the first pad 15 and the second pad 16 can limit the position of the liquid metal body 2, which can better Prevent the liquid metal body 2 from detaching from the pad group 14 and moving to other positions when the terminal device is shaken.
  • the second insulating layer 4 covers the first pad surface 151 and the second pad surface 161 .
  • the second insulating layer 4 can be protected by the first pad 15 and the second pad 16 like this, and prevents other conductive devices from affecting the radio frequency signal when they are in contact with the first pad surface 151 and the second pad surface 161. transmission between two pads 16.
  • the type of the second insulating layer 4 in this embodiment can be specifically set with reference to the type of the second insulating layer 4 in the embodiment shown in FIG. 4 and FIG. 6 , and will not be repeated here.
  • each pad group 14 there are multiple pad groups 14 , and multiple pad groups 14 are arranged side by side.
  • the first pads 15 in each pad group 14 are electrically connected to the RF front-end circuit 11
  • the second pads 16 in each pad group 14 are electrically connected to the RF back-end circuit 12
  • the first pad 15 in each pad group 14 is connected to the second pad 16 through the liquid metal body 2 .
  • the test terminal 410 of the radio frequency testing instrument 400 By arranging a plurality of pad groups 14 arranged side by side, when the radio frequency front-end circuit 11 is tested like this, the test terminal 410 of the radio frequency testing instrument 400 just can be connected with the first pad 15 of a plurality of pad groups 14, increased The connection reliability between the test terminal 410 and the pad group 14 is tested. Arranging multiple pad groups 14 side by side can facilitate the test terminal 410 of the radio frequency testing instrument 400 to be connected to the first pads 15 of multiple pad groups 14 at the same time.
  • the circuit board 200 further includes a first shielding case 5 , and the first shielding case 5 is disposed on the area where the radio frequency front-end circuit 11 is disposed on the substrate 1 .
  • the first shielding cover 5 can not only shield the electromagnetic interference to the radio frequency front-end circuit 11 when other devices on the substrate 1 are working, but also can shield the electromagnetic interference to other surrounding devices when the radio frequency front-end circuit 11 is working.
  • the circuit board 200 further includes a second shielding cover, and the second shielding cover is disposed on the area where the radio frequency back-end circuit 12 is disposed on the substrate 1 .
  • the second shielding cover can not only shield the electromagnetic interference to the radio frequency back-end circuit 12 when other devices on the substrate 1 are working, but also can shield the electromagnetic interference to other surrounding devices when the radio frequency back-end circuit 12 is working.
  • Figure 9a is a process diagram of the manufacturing method of the circuit board 200 shown in Figure 6, the figure on the right side in Figure 9a is a top view on the left side, and Figure 9b is the top view of the figure on the left side
  • the flow chart of the manufacturing method of the circuit board 200 includes:
  • the substrate 1 is provided with a radio frequency front-end circuit 11, a radio frequency back-end circuit 12, and a pad group 14, and the pad group 14 includes a first pad 15 electrically connected to the radio frequency front-end circuit 11, and a first pad 15 connected to the radio frequency back-end circuit 12.
  • the second pad 16 is electrically connected, and the second pad 16 is set apart from the first pad 15 .
  • the test terminal 410 of the radio frequency testing instrument 400 may be a test probe, and the test probe may be inserted into the first pad 15 to realize electrical connection with the first pad 15 .
  • the radio frequency testing instrument 400 sends a test signal to the first pad 15 through the test terminal 410 to test the radio frequency front-end circuit 11; after the test, the test terminal 410 needs to be removed from the first pad 15 to The connection to the first pad 15 is disconnected.
  • S300 as shown in (3)-(5) in FIG. 11 is electrically connected to the radio frequency back-end circuit 12.
  • the dispensing equipment can extrude and coat the liquid metal material on the pad group 14 through a needle tube, so as to form the liquid metal body 2 .
  • the liquid metal body 2 can be isolated by setting the second insulating layer 4, thereby avoiding the short circuit between the liquid metal body 2 and the electronic devices around the pad group 14.
  • the electronic devices around the pad group 14 can avoid contact with the liquid metal
  • the body 2 is in contact, and the second insulating layer 4 may not be provided.
  • S300 includes:
  • the liquid metal body 2 can be separated from the substrate 1 by a certain distance, thereby avoiding the contact between the liquid metal body 2 and the substrate 1 , thereby reducing the risk of the circuit on the substrate 1 being short-circuited by the liquid metal body 2 .
  • S310 includes:
  • the mask plate 500 can be made of insulating material, such as plastic.
  • the mask hole 510 when the liquid metal body 2 covers a part of the first pad surface 151 and the second pad surface 161, for example, the width d1 of the liquid metal body 2 is smaller than the size d2 of the first pad 15, as shown in (3) and As shown in (4), the mask hole 510 needs to be made into a stepped shape.
  • the mask hole 510 includes a large hole section 511 and a small hole section 512.
  • the size of the large hole section 511 matches the size of the area where the pad group 14 is located.
  • the first The pad 15 and the second pad 16 are located in the large hole section 511; the hole wall of the small hole section 512 forms a "container" with the first pad surface 151 and the second pad surface 161, and the liquid state is applied to the "container".
  • Metal material the formed liquid metal body 2 can cover a part of the first pad surface 151 and the second pad surface 161 .
  • the width d1 of the liquid metal body 2 is equal to the size d2 of the first pad 15, then the mask hole 510 needs to be made into a straight hole After coating the liquid metal material into the mask hole 510 , the formed liquid metal body 2 can completely cover the first pad surface 151 and the second pad surface 161 .
  • the liquid metal body 2 is made by setting the mask plate 500, which can accurately control the coating position and coating amount of the liquid metal material, thereby ensuring that the liquid metal body 2 can accurately connect the first pad 15 and the second pad 16 are connected.
  • S400 includes:
  • the insulating glue material is coated on the position of the liquid metal body 2 and cured to form the second insulating layer 4 .
  • insulating glue can be coated on the side of the liquid metal body 2 away from the substrate 1 to form the second insulating layer 4 .
  • the second insulating layer 4 formed after the insulating glue is cured has a certain mechanical strength, and can well limit the position of the liquid metal body 2 to the pad group 14, so as to prevent the liquid metal The body 2 is detached from the pad group 14 and moved to other positions.
  • the above-mentioned insulating glue material may be heat curing glue or ultraviolet curing glue.
  • FIG. 10 is a process diagram of the manufacturing method of the circuit board 200 shown in FIG. 7 .
  • the difference between the manufacturing method of the circuit board 200 shown in FIG. 10 and the manufacturing method of the circuit board 200 shown in FIG. 9a is that: the manufacturing method of the circuit board 200 shown in FIG.
  • the first insulating layer 3 is formed in the gap between the pad 15 and the second pad 16 .
  • the manufacturing method of the circuit board 200 includes:
  • the first insulating layer 3 can support the part of the space between the liquid metal body 2 and the first pad 15 and the second pad 16, thereby better avoiding the contact between the liquid metal body 2 and the substrate 1. contact, thereby greatly reducing the risk of the circuit on the substrate 1 being short-circuited by the liquid metal body 2 .
  • S300 as shown in (4)-(6) in FIG. 11 is electrically connected to the radio frequency back-end circuit 12.
  • the liquid metal body 2 can be isolated by setting the second insulating layer 4, thereby avoiding the short circuit between the liquid metal body 2 and the electronic devices around the pad group 14.
  • the electronic devices around the pad group 14 can avoid contact with the liquid metal
  • the body 2 is in contact, and the second insulating layer 4 may not be provided.
  • Figure 11a is a process diagram of the manufacturing method of the circuit board 200 shown in Figure 8, the figure on the right side in Figure 11a is a top view on the left side, and Figure 11b is a top view of the figure on the left side
  • the flow chart of the manufacturing method of the circuit board 200 includes:
  • N100 as shown in (1) in FIG. 11a , provide a substrate 1 .
  • the substrate 1 is provided with a radio frequency front-end circuit 11, a radio frequency back-end circuit 12, and a pad group 14, and the pad group 14 includes a first pad 15 electrically connected to the radio frequency front-end circuit 11, and a first pad 15 connected to the radio frequency back-end circuit 12.
  • the second pad 16 is electrically connected, and the second pad 16 is set apart from the first pad 15 .
  • the test terminal 410 of the radio frequency testing instrument 400 may be a test probe, and the test probe may be inserted into the first pad 15 to realize electrical connection with the first pad 15 .
  • the radio frequency testing instrument 400 sends a test signal to the first pad 15 through the test terminal 410 to test the radio frequency front-end circuit 11; after the test, the test terminal 410 needs to be removed from the first pad 15 to The connection to the first pad 15 is disconnected.
  • the liquid metal material can be extruded and coated in the gap between the first pad 15 and the second pad 16 through the needle tube of the dispensing device, so as to form the liquid metal body 2 .
  • an insulating material is coated on the side of the liquid metal body 2 away from the substrate 1 to form the second insulating layer 4 .
  • the liquid metal body 2 can be isolated by setting the second insulating layer 4, thereby avoiding the short circuit between the liquid metal body 2 and the electronic devices around the pad group 14.
  • the electronic devices around the pad group 14 can avoid contact with the liquid metal
  • the body 2 is in contact, and the second insulating layer 4 may not be provided.
  • the N300 includes:
  • a mask plate 500 with a mask hole 510 is stacked on the substrate 1 , so that the pad group 14 is located in the mask hole 510 .
  • the mask plate 500 can be made of insulating material, such as plastic.
  • the size of the mask hole 510 can match the size of the area where the pad group 14 is located, so that the hole wall of the mask hole 510 can play a blocking role to prevent the liquid metal material from flowing from the first pad 15 and the second pad. Both ends of the gap of the disc 16 overflow.
  • this part of the liquid metal material can be scraped off.
  • the liquid metal body 2 is made by setting the mask plate 500, so that the coating position and coating amount of the liquid metal material can be precisely controlled, thereby ensuring that the liquid metal body 2 is located between the first pad 15 and the second pad.
  • the gap between the two pads 16 is used to connect the first pad 15 and the second pad 16 .
  • N400 includes: coating an insulating glue on the position of the liquid metal body 2 , and then curing to form the second insulating layer 4 .
  • an insulating glue is coated on the side of the liquid metal body 2 away from the substrate 1 to form the second insulating layer 4 .
  • the second insulating layer 4 formed after the insulating glue is cured has a certain mechanical strength, and can well limit the position of the liquid metal body 2 to the pad group 14, so as to prevent the liquid metal The body 2 is detached from the pad group 14 and moved to other positions.
  • the above-mentioned insulating glue material may be heat curing glue or ultraviolet curing glue.

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Abstract

本申请公开了一种电路板及其制作方法、终端设备，涉及终端技术领域，为解决相关技术中的终端设备的电路板中射频前端电路和射频后端电路之间的连接可靠性较低的问题而发明。该电路板，包括基板及液态金属体，所述基板上设有射频前端电路、射频后端电路以及焊盘组，所述焊盘组包括与所述射频前端电路电连接的第一焊盘、以及与所述射频后端电路电连接的第二焊盘，所述第二焊盘与所述第一焊盘相隔设置；液态金属体设置于所述焊盘组的位置处，且将所述第一焊盘与所述第二焊盘连接，以使所述射频前端电路与所述射频后端电路电连接。本申请可用于手机等终端设备中。

Description

一种电路板及其制作方法、终端设备
本申请要求于2021年10月27日提交国家知识产权局、申请号为202111258940.7、申请名称为“一种电路板及其制作方法、终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端技术领域，尤其涉及一种电路板及其制作方法、终端设备。
背景技术
在手机等终端设备的电路板中，射频电路是其重要的组成部分，一般由射频前端电路和射频后端电路组成，由于射频前端电路涉及的元器件数量较多，构成较为复杂，因此，在电路板的实际生产过程中，需要对射频前端电路进行测试，以检测射频电路中的元器件质量和焊接问题。
目前通常利用射频开关测试座来进行对射频前端电路进行测试，如图1所示，图1为目前终端设备的电路板的测试示意图。该终端设备的电路板包括射频前端电路11、射频后端电路12、以及连接于射频前端电路11和射频后端电路12之间的开关测试座17。
在对射频前端电路11测试时，射频测试仪器400的测试端410插入开关测试座17中，以断开射频前端电路11和射频后端电路12之间的连接，并且测试端410与射频前端电路11电连接，以将信号由射频前端电路11引入射频测试仪器400中进行测试。测试完成之后，将测试端410从开关测试座17中拔出，以将射频前端电路11和射频后端电路12重新连接起来，以保证该电路板的功能正常。
然而，上述电路板上的射频开关测试座17在完成测试后一般就没有其它作用了，这样既占据了电路板上的布局面积，又增加了终端设备的器件成本。
为了解决射频开关测试座占用电路板上的布局面积、成本较高的问题，相关技术公开了一种电路板，该电路板中采用两个焊盘来代替开关测试座，其中一个焊盘与射频前端电路连接，另外一个焊盘与射频后端电路连接。
在对射频前端电路测试时，射频测试仪器的测试端与其中一个焊盘连接，以将信号由射频前端电路引入射频测试仪器中进行测试。测试完成之后，将串联器件通过低温回流焊工艺焊接在两个焊盘之间，以使射频前端电路和射频后端电路导通。
相关技术中的电路板，串联器件通过低温回流焊工艺焊接在两个焊盘之间，在焊接时需要使用低温锡膏进行焊接，而终端设备的电路板上的其它器件的焊接通常采用高温锡膏，这样增加了锡膏错混的风险，比如在焊接串联器件时容易混用高温锡膏来焊接，从而容易增大了焊接缺陷的发生概率，进而降低了射频前端电路和射频后端电路的连接可靠性。
发明内容
本申请的实施例提供一种电路板及其制作方法、终端设备，用于解决相关技术中的终端设备的电路板中射频前端电路和射频后端电路之间的连接可靠性较低的问题。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，本申请实施例提供了一种电路板，包括基板和液态金属体，所述基板上设有射频前端电路、射频后端电路以及焊盘组，所述焊盘组包括与所述射频前端电路电连接的第一焊盘、以及与所述射频后端电路电连接的第二焊盘，所述第二焊盘与所述第一焊盘相隔设置；液态金属体设置于所述焊盘组的位置处，且将所述第一焊盘与所述第二焊盘连接，以使所述射频前端电路与所述射频后端电路电连接。
通过采用上述技术方案，使得第一焊盘和第二焊盘的连接工艺更加简单，无需添加低温锡膏进行焊接，那么就避免了锡膏错混所引起的焊接缺陷，从而提高了第一焊盘和第二焊盘之间连接的可靠性，进而提高了射频前端电路和射频后端电路连接的可靠性。
在一些实施例中，所述液态金属体设置于所述焊盘组远离所述基板的一侧，且与所述第一焊盘、所述第二焊盘相接触。
通过采用上述技术方案，避免了液态金属体与基板相接触，进而降低了基板上的线路被液态金属体短路的风险。
在一些实施例中，所述第一焊盘包括远离所述基板一侧的第一焊盘面，所述第二焊盘包括远离所述基板一侧的第二焊盘面；所述液态金属体为层状结构，且与所述第一焊盘面、所述第一焊盘面层叠设置。
通过采用上述技术方案，在液态金属体的体积一定时，可以增大液态金属体与第一焊盘面、第二焊盘面的接触面积，从而有利于降低液态金属体的阻抗。
在一些实施例中，所述第一焊盘面与所述第二焊盘面相齐平。
通过采用上述技术方案，可以避免第一焊盘和第二焊盘形成台阶，从而可以方便液态金属体设置在第一焊盘面以及第二焊盘面上。
在一些实施例中，所述液态金属体与所述第一焊盘面远离所述第二焊盘的一侧边缘相齐平。
通过采用上述技术方案，可以最大限度地增大液态金属体与第二焊盘面的接触面积，从而可以更有利于降低液态金属体的阻抗。
在一些实施例中，所述液态金属体与所述第二焊盘面远离所述第一焊盘的一侧边缘相齐平。
通过采用上述技术方案，可以最大限度地增大液态金属体与第二焊盘面的接触面积，从而可以更有利于降低液态金属体的阻抗。
在一些实施例中，所述电路板还包括第一绝缘层，所述第一绝缘层填充于所述第一焊盘与所述第二焊盘之间的间隙中。
通过采用上述技术方案，第一绝缘层可以对液态金属体与第一焊盘、第二焊盘之间间隙相对的部分起到支撑的作用，从而可以更好的避免液态金属体与基板相接触。
在一些实施例中，所述液态金属体填充于所述第一焊盘与所述第二焊盘的间隙中。
通过采用上述技术方案，可以较好地防止终端设备在晃动时液态金属体从焊盘组处脱离移动至其它位置。
在一些实施例中，所述电路板还包括第二绝缘层，所述第二绝缘层设置于所述液态金属体的位置处，以将所述液态金属体覆盖。
通过采用上述技术方案，可以避免液态金属体与焊盘组周围的电子器件接触短路。
在一些实施例中，所述液态金属体为层状结构，所述第二绝缘层叠置于所述液态金属体远离基板的一侧。
通过采用上述技术方案，可以方便将第二绝缘层设置在液态金属体上，使得第二绝缘层与液态金属体之间的接触面积大，不容易从液态金属体上脱离。
在一些实施例中，所述第二绝缘层为热固化胶层或紫外固化胶层。
通过采用上述技术方案，使第二绝缘层具有一定的机械强度，从而可以将液态金属体的位置很好地限制在焊盘组处。
在一些实施例中，所述焊盘组的数目为多个，多个所述焊盘组并排设置。
通过采用上述技术方案，方便射频测试仪器的测试端同时与多个焊盘组的第一焊盘连接，增加了测试端与焊盘组的连接可靠性。
在一些实施例中，所述电路板还包括第一屏蔽罩，所述第一屏蔽罩罩设于所述基板上设置所述射频前端电路的区域。
通过采用上述技术方案，不但可以屏蔽基板上其它器件工作时对射频前端电路的电磁干扰，同时也可以屏蔽射频前端电路在工作时对周围其它器件的电磁干扰。
在一些实施例中，所述电路板还包括第二屏蔽罩，所述第二屏蔽罩罩设于所述基板上设置所述射频后端电路的区域。
通过采用上述技术方案，不但可以屏蔽基板上其它器件工作时对射频后端电路的电磁干扰，同时也可以屏蔽射频后端电路在工作时对周围其它器件的电磁干扰。
第二方面，本申请实施例提供了一种终端设备，包括壳体、天线和第一方面中所述的电路板，电路板设置于所述壳体中，天线与所述电路板的射频后端电路电连接。
该终端设备所具有的技术效果与第一方面中的电路板所具有的技术效果相同，在此不再赘述。
第三方面，本申请实施例提供了一种电路板的制作方法，包括：提供基板；其中，所述基板上设有射频前端电路、射频后端电路、以及焊盘组，所述焊盘组包括与所述射频前端电路电连接的第一焊盘、以及与所述射频后端电路电连接的第二焊盘，所述第二焊盘与所述第一焊盘相隔设置。将射频测试仪器的测试端与所述第一焊盘电连接，以对所述射频前端电路测试。在所述射频前端电路测试完之后，在所述焊盘组的位置处设置液态金属体，将所述第一焊盘与所述第二焊盘连接，以使所述射频前端电路与所述射频后端电路电连接。
该电路板的制作方法所具有的技术效果与第一方面中的电路板所具有的技术效果相同，在此不再赘述。
在一些实施例中，在所述焊盘组的位置处设置液态金属体，将所述第一焊盘与所述第二焊盘连接，包括：在所述焊盘组远离所述基板的一侧设置所述液态金属体，使所述液态金属体与所述第一焊盘、所述第二焊盘相接触。
通过采用上述技术方案，避免了液态金属体与基板相接触，进而降低了基板上的线路被液态金属体短路的风险。
在一些实施例中，在所述焊盘组远离所述基板的一侧设置所述液态金属体之前，还包括：将绝缘材料填充于所述第一焊盘和所述第二焊盘的间隙中，以形成第一绝缘层。
通过采用上述技术方案，第一绝缘层可以对液态金属体与第一焊盘、第二焊盘之间空间相对的部分起到支撑的作用，从而可以更好的避免液态金属体与基板相接触。
在一些实施例中，在所述焊盘组远离所述基板的一侧设置所述液态金属体，使所述液态金属体与所述第一焊盘、所述第二焊盘相接触，包括：在所述基板上层叠设置具有掩膜孔的掩膜板，以使所述焊盘组位于所述掩膜孔中。向所述掩膜孔中涂覆液态金属材料，以在所述焊盘组远离所述基板的一侧形成所述液态金属体。
通过采用上述技术方案，能够精确地控制液态金属材料的涂覆位置和涂覆量。
在一些实施例中，在所述焊盘组的位置处设置液态金属体，将所述第一焊盘与所述第二焊盘连接，包括：将液态金属材料填充于所述第一焊盘和所述第二焊盘的间隙中，以形成所述液态金属体。
通过采用上述技术方案，可以较好地防止终端设备在晃动时液态金属体从焊盘组处脱离移动至其它位置。
在一些实施例中，将液态金属材料填充于所述第一焊盘和所述第二焊盘的间隙中，以形成所述液态金属体，包括：在所述基板上层叠设置具有掩膜孔的掩膜板，以使所述焊盘组位于所述掩膜孔中。向所述掩膜孔中涂覆液态金属材料，以在所述第一焊盘和所述第二焊盘的间隙中形成所述液态金属体。
通过采用上述技术方案，能够精确地控制液态金属材料的涂覆位置和涂覆量。
在一些实施例中，在所述焊盘组的位置处设置液态金属体之后，还包括：将绝缘材料涂覆于所述液态金属体的位置处，以形成将所述液态金属体覆盖的第二绝缘层。
通过采用上述技术方案，可以避免液态金属体与焊盘组周围的电子器件接触短路。
在一些实施例中，将绝缘材料涂覆于所述液态金属体的位置处，以形成将所述液态金属体覆盖的第二绝缘层，包括：将绝缘胶材涂覆于所述液态金属体的位置处，然后经过固化后，形成所述第二绝缘层。
通过采用上述技术方案，绝缘胶材经过加固化后形成的第二绝缘层，其具有一定的机械强度，可以将液态金属体的位置很好地限制在焊盘组处。
附图说明
图1为目前的终端设备的电路板的测试示意图；
图2为本申请一些实施例中的手机的爆炸图；
图3为图2中的电路板的结构示意图；
图4为图3的局部示意图；
图5为图3中的电路板去除第二绝缘层后的结构示意图；
图6所示为图4中电路板在焊盘组处的截面图；
图7为本申请另一些实施例中电路板在焊盘组处的结构图；
图8为本申请另一些实施例中电路板在焊盘组处的结构图；
图9a为图6所示的电路板的制作方法过程图；
图9b为图6中所示的电路板的制作方法的流程图；
图10为图7所示的电路板的制作方法过程图；
图11a为图8所示的电路板的制作方法过程图；
图11b为图8中所示的电路板的制作方法的流程图。
具体实施方式
在本申请实施例中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
在本申请实施例中，需要说明的是，术语“电连接”应做广义理解，例如，可以是通过直接连接的方式实现电流导通，也可以是通过电容耦合的方式实现电能量传导。
本申请实施例提供的电路板及其制作方法、终端设备，通过将液态金属体来代替相关技术中的焊接在焊盘上的串联器件，从而提高了射频前端电路和射频后端电路之间的连接可靠性。
本申请实施例中的终端设备可以是手机、平板电脑、电子阅读器、可穿戴设备(比如智能手表)、POS(point of sales terminal；销售点情报管理系统)机、个人数字助理(personal digital assistant，PDA)、车载设备、网络电视机等具有天线结构的终端设备。
下面以手机为例为具体描述本申请实施例中的终端设备的电路板，其它类型的终端设备具体可参照手机实施例中电路板的设计构思来设置，在此不再一一赘述。
如图2所示，图2为本申请一些实施例中的手机的爆炸图。该手机包括壳体100、电路板200以及电池300。壳体100包括前壳110(也称中框)和后盖120(也称电池盖)，前壳110包括底壁111、以及设置于底壁111边沿处的侧壁112。后盖120扣在前壳110上，后盖120与前壳110的底壁111、侧壁112形成容纳空间130，该容纳空间130包括通过分隔壁140隔开的电路板容纳空间131和电池容纳空间132，电路板200设置于电路板容纳空间131中，电池300设置于电池容纳空间132中，且通过电连接件(图中未示出)与电路板200电连接。
如图3～图5所示，图3为图2中的电路板200的结构示意图，图4为图3的局部示意图，图5为图3中的电路板200去除第二绝缘层4后的结构示意图。该电路板200包括基板1、以及液态金属体2。
基板1上设有射频前端电路11、射频后端电路12、天线弹片13以及焊盘组14，焊盘组14包括与射频前端电路11电连接的第一焊盘15、以及与射频后端电路12电连接的第二焊盘16，第二焊盘16与第一焊盘15相隔设置。
第一焊盘15、第二焊盘16的轮廓形状为长方形(如图5所示)，但也不限于此，第一焊盘15、第二焊盘16的轮廓形状也可以是圆形、椭圆形等。
该终端设备还包括天线，天线包括设置于电路板容纳空间131中的天线辐射体，天线辐射体通过天线弹片13与射频后端电路12电连接。天线弹片13的数目可以设置一个，也可以设置多个，具体可根据天线辐射体的数目而定。
其中，上述基板1为未焊接任何电路器件和芯片的电路板200。射频前端电路11 是指天线和中频(或基带)电路之间的部分电路，在这一段电路中信号以射频形式传输，射频前端电路11通常包括：放大器，滤波器以及变频器等；射频后端电路12包括但不限于天线匹配电路。
液态金属体2设置于焊盘组14的位置处，且将第一焊盘15与第二焊盘16连接，以使射频前端电路11与射频后端电路12电连接。
其中，液态金属体2的材料为液态金属材料，液态金属材料是在较低温度下处于液态的一类金属材料的统称，不但具有金属物质所具有的极强的导热性和导电性，而且还具有一定的流动性，比如液态金属材料可以做成膏状，质地粘稠、吸附性强。
该液态金属体的材料可以为低熔点金属，比如镓(Ga)以及碱金属中的钠(Na)、钾(K)、锂(Li)，也可以为低熔点合金，比如镓金属合金，在此不做具体限定。
下面表1中所述为液态金属体为镓金属合金时的电学参数，由表1中的数据可以看出液态金属体2的导电性和阻抗完全能够满足射频电路的使用要求。
表1液态金属体2为镓金属合金时的电学参数
Figure PCTCN2022115228-appb-000001
表1中：R＝ρI/S，其中ρ为液态金属体2的电阻率；I为液态金属体2的长度；S为液态金属体2的横截面积；R为液态金属体2的阻抗。
上述电路板200中，通过将液态金属体2设置于焊盘组14的位置处，且将第一焊盘15与第二焊盘16连接，这样将液态金属体2设置在第一焊盘15和第二焊盘16处即可完成连接，使得第一焊盘15和第二焊盘16的连接工艺更加简单，无需添加低温锡膏进行焊接，那么就避免了锡膏错混所引起的焊接缺陷，从而提高了第一焊盘15和第二焊盘16之间连接的可靠性，进而提高了射频前端电路11和射频后端电路12连接的可靠性。
另外，在电路板200的制作过程中，需要现有的点涂设备即可将液态金属材料涂覆在焊盘组14处以形成液态金属体2，无需额外增加其它设备，这样使得该电路板200的工艺路线较为简洁，有利于降低电路板200的制成成本。
液态金属体2在焊盘组14处的设置位置不唯一，图5和图6所示为液态金属体2在焊盘组14处设置位置的第一实施例，图6所示为图4中电路板200在焊盘组14处的截面图。在该实施例中，液态金属体2设置于焊盘组14远离基板1的一侧，且与第一焊盘15、第二焊盘16相接触。
通过将液态金属体2设置于焊盘组14远离基板1的一侧，可以使液态金属体2与基板1相隔一段距离，从而避免了液态金属体2与基板1相接触，进而降低了基板1上的线路被液态金属体2短路的风险。
需要说明的是：液态金属体2的表面具有一定的张力，能够横跨第一焊盘15和第二焊盘16之间的间隙。
在一些实施例中，如图5和图6所示，第一焊盘15包括远离基板1一侧的第一焊 盘面151，第二焊盘16包括远离基板1一侧的第二焊盘面161。液态金属体2为层状结构，且与第一焊盘面151、第一焊盘面151层叠设置。通过将液态金属体2设置成层状结构，在液态金属体2的体积一定时，可以增大液态金属体2与第一焊盘面151、第二焊盘面161的接触面积，从而有利于降低液态金属体2的阻抗，以便于射频信号在液态金属体2上的传输。
当然，也可以根据实际情况，将液态金属体2设置成其它形状，比如水滴状、圆锥状等。
在一些实施例中，如图5和图6所示，液态金属体2与第一焊盘面151远离第二焊盘16的一侧边缘(图6中所示的第一焊盘面151的侧边缘a)相齐平。这样可以最大限度地增大液态金属体2与第一焊盘面151的接触面积，从而可以更有利于降低液态金属体2的阻抗，以便于射频信号在液态金属体2上的传输。
在一些实施例中，如图5和图6所示，液态金属体2与第二焊盘面161远离第一焊盘15的一侧边缘(图6中所示的第二焊盘面161的侧边缘b)相齐平。这样可以最大限度地增大液态金属体2与第二焊盘面161的接触面积，从而可以更有利于降低液态金属体2的阻抗，以便于射频信号在液态金属体2上的传输。
其中，液态金属体2可以均与第一焊盘面151的侧边缘a、第二焊盘面161的侧边缘b相齐平；也可以仅与第一焊盘面151的侧边缘a或者第二焊盘面161的侧边缘b相齐平，具体可根据实际情况而定。
在一些实施例中，如图5和图6所示，第一焊盘面151与第二焊盘面161相齐平。这样可以避免第一焊盘15和第二焊盘16形成台阶，从而可以方便液态金属体2设置在第一焊盘面151以及第二焊盘面161上。
在一些实施例中，如图7所示，图7为本申请另一些实施例中电路板200在焊盘组14处的结构图。电路板200还包括第一绝缘层3，第一绝缘层3填充于第一焊盘15与第二焊盘16之间的间隙中。这样第一绝缘层3可以对液态金属体2与第一焊盘15、第二焊盘16之间间隙相对的部分起到支撑的作用，从而可以更好的避免液态金属体2与基板1相接触，进而大大降低了基板1上的线路被液态金属体2短路的风险。
示例的，第一绝缘层3可以是绝缘胶层，该绝缘胶层可以是热固化胶或者紫外固化胶经过固化后形成的绝缘胶层。
在一些实施例中，如图4和图6所示，电路板200还包括第二绝缘层4，第二绝缘层4设置于液态金属体2的位置处，以将液态金属体2覆盖。
通过设置第二绝缘层4将液态金属体2覆盖，这样第二绝缘层4可以将液态金属体2隔离，从而避免液态金属体2与焊盘组14周围的电子器件接触短路。
在一些实施例中，第二绝缘层4为热固化胶层，热固化胶层是热固化胶经过加热固化后形成的胶层，其具有一定的机械强度，通过在液态金属体2上覆盖热固化胶层，不但可以起到绝缘的作用，而且还可以将液态金属体2的位置很好地限制在焊盘组14处，以防止终端设备在晃动时液态金属体2从焊盘组14处脱离移动至其它位置。
示例的，热固化胶层为UF胶层，UF(Underfill；底部填充)胶主要成分是环氧树脂。
在一些实施例中，第二绝缘层4为紫外固化胶层，紫外固化胶层是紫外固化胶(别 名：光敏胶、无影胶)经过紫外照射固化后形成的胶层，其也具有一定的机械强度，不但可以起到绝缘的作用，而且也可以将液态金属体2的位置很好地限制在焊盘组14处。
在一些实施例中，如图6所示，液态金属体2为层状结构，第二绝缘层4叠置于液态金属体2远离基板1的一侧。
将液态金属体2设置成层状结构，并且第二绝缘层4叠置于液态金属体2远离基板1的一侧，这样可以方便将第二绝缘层4设置在液态金属体2上，使得第二绝缘层4与液态金属体2之间的接触面积大，不容易从液态金属体2上脱离。
图8所示为液态金属体2在焊盘组14处设置位置的第二实施例，在该实施例中，液态金属体2填充于第一焊盘15与第二焊盘16的间隙中。
通过将液态金属体2填充于第一焊盘15与第二焊盘16的间隙中，这样第一焊盘15和第二焊盘16可以对液态金属体2的位置进行限制，可以较好地防止终端设备在晃动时液态金属体2从焊盘组14处脱离移动至其它位置。
在一些实施例中，如图8所示，第二绝缘层4叠置于液态金属体2远离基板1的一侧。这样第二绝缘层4、第一焊盘15、第二焊盘16对液态金属体2进行包裹，可以更好地对液态金属体2的位置进行限制，从而可以更好地防止终端设备在晃动时液态金属体2从焊盘组14处脱离移动至其它位置。
在一些实施例中，如图8所示，第二绝缘层4将第一焊盘面151和第二焊盘面161覆盖。这样第二绝缘层4可以第一焊盘15、第二焊盘16进行保护，防止其它导电器件与第一焊盘面151、第二焊盘面161接触时影响射频信号在第一焊盘15、第二焊盘16之间的传输。
该实施例中的第二绝缘层4的类型，具体可参照图4和图6所示实施例中第二绝缘层4的类型设置，在此不再赘述。
在一些实施例中，如图5所示，焊盘组14的数目为多个，多个焊盘组14并排设置。每个焊盘组14中的第一焊盘15均与射频前端电路11电连接，每个焊盘组14中的第二焊盘16均与射频后端电路12电连接。每个焊盘组14中的第一焊盘15通过液态金属体2与第二焊盘16连接。
通过设置多个并排设置的焊盘组14，这样在对射频前端电路11进行测试时，射频测试仪器400的测试端410就可以与多个焊盘组14的第一焊盘15连接，增加了测试端410与焊盘组14的连接可靠性。将多个焊盘组14并排设置，可以方便射频测试仪器400的测试端410同时与多个焊盘组14的第一焊盘15连接。
在一些实施例中，如图3所示，电路板200还包括第一屏蔽罩5，第一屏蔽罩5罩设于基板1上设置射频前端电路11的区域。这样第一屏蔽罩5不但可以屏蔽基板1上其它器件工作时对射频前端电路11的电磁干扰，同时也可以屏蔽射频前端电路11在工作时对周围其它器件的电磁干扰。
在一些实施例中，电路板200还包括第二屏蔽罩，第二屏蔽罩罩设于基板1上设置射频后端电路12的区域。这样第二屏蔽罩不但可以屏蔽基板1上其它器件工作时对射频后端电路12的电磁干扰，同时也可以屏蔽射频后端电路12在工作时对周围其它器件的电磁干扰。
如图9a和图9b所示，图9a为图6所示的电路板200的制作方法过程图，图9a中位于右侧的图是位于左侧图的俯视图，图9b为图6中所示的电路板200的制作方法的流程图。该电路板200的制作方法，包括：
S100、如图9a中的(1)所示，提供基板1。
其中，基板1上设有射频前端电路11、射频后端电路12、以及焊盘组14，焊盘组14包括与射频前端电路11电连接的第一焊盘15、以及与射频后端电路12电连接的第二焊盘16，第二焊盘16与第一焊盘15相隔设置。
S200、如图9a中的(2)所示，将射频测试仪器400的测试端410与第一焊盘15电连接，以对射频前端电路11测试。
其中，射频测试仪器400的测试端410可以是测试探针，测试探针可以插至第一焊盘15上，以实现与第一焊盘15的电连接。在测试时，射频测试仪器400通过测试端410向第一焊盘15发送测试信号，以对射频前端电路11进行测试；测试完之后，需要将测试端410从第一焊盘15上移出，以断开与第一焊盘15的连接。
S300、如图9a中的(3)～(5)所示，在焊盘组14的位置处设置液态金属体2，将第一焊盘15与第二焊盘16连接，以使射频前端电路11与射频后端电路12电连接。其中，点涂设备可以通过针管将液态金属材料挤出涂覆于焊盘组14处，以形成液态金属体2。
S400、如图9a中的(6)所示，将绝缘材料涂覆于液态金属体2的位置处，以形成将液态金属体2覆盖的第二绝缘层4。
通过设置第二绝缘层4可以将液态金属体2隔离，从而避免液态金属体2与焊盘组14周围的电子器件接触短路，当然，如果焊盘组14周围的电子器件能够避开与液态金属体2接触，第二绝缘层4也可以不设置。
在一些实施例中，如图9a中的(5)所示，S300包括：
S310、在焊盘组14远离基板1的一侧设置液态金属体2，使液态金属体2与第一焊盘15、第二焊盘16相接触。
这样可以使液态金属体2与基板1相隔一段距离，从而避免了液态金属体2与基板1相接触，进而降低了基板1上的线路被液态金属体2短路的风险。
在一些实施例中，在S310包括：
S311、如图9a中的(3)所示，在基板1上层叠设置具有掩膜孔510的掩膜板500，以使焊盘组14位于掩膜孔510中。其中，该掩膜板500可以由绝缘材料制作而成，比如塑胶。
S312、如图9a中的(4)所示，向掩膜孔510中涂覆液态金属材料，以在焊盘组14远离基板1的一侧形成液态金属体2。
其中，当液态金属体2覆盖第一焊盘面151、第二焊盘面161的一部分时，比如液态金属体2的宽度d1小于第一焊盘15的尺寸d2，如图9a中的(3)和(4)所示，掩膜孔510需要做成阶梯状，掩膜孔510包括大孔段511和小孔段512，大孔段511的大小与焊盘组14所在区域大小相匹配，第一焊盘15、第二焊盘16位于大孔段511中；小孔段512的孔壁、与第一焊盘面151、第二焊盘面161形成“容器”，向该“容器”中涂覆液态金属材料，所形成的液态金属体2就可以覆盖第一焊盘面151、第二 焊盘面161中的一部分。
当液态金属体2完全覆盖第一焊盘面151、第二焊盘面161时，比如液态金属体2的宽度d1等于第一焊盘15的尺寸d2，此时需要将掩膜孔510做成直孔状，在向掩膜孔510中涂覆液态金属材料之后，所形成的液态金属体2就可以完全覆盖第一焊盘面151和第二焊盘面161。
在向掩膜孔510中涂覆液态金属材料时，如果一部分液态金属材料溢出掩膜孔510外，可以将该部分的液态金属材料刮除掉。
在该实施例中，通过设置掩膜板500来制作液态金属体2，这样能够精确地控制液态金属材料的涂覆位置和涂覆量，从而保证液态金属体2能够准确地将第一焊盘15和第二焊盘16连接。
在一些实施例中，S400包括：
将绝缘胶材涂覆于液态金属体2的位置处，然后经过固化后，形成第二绝缘层4。其中，在液态金属体2为层状结构时，可以将绝缘胶材涂覆于液态金属体2远离基板1的一侧，以形成第二绝缘层4。
绝缘胶材经过加固化后形成的第二绝缘层4，其具有一定的机械强度，可以将液态金属体2的位置很好地限制在焊盘组14处，以防止终端设备在晃动时液态金属体2从焊盘组14处脱离移动至其它位置。
其中，上述绝缘胶材可以是热固化胶或者紫外固化胶。
如图10所示，图10为图7所示的电路板200的制作方法过程图。图10中所示电路板200的制作方法与图9a所示的电路板200的制作方法的区别在于：图10中所示电路板200的制作方法在S300之前，将绝缘材料填充于第一焊盘15和第二焊盘16的间隙中，以形成第一绝缘层3。
该电路板200的制作方法，包括：
S100、如图10中的(1)所示，提供基板1。
S200、如图10中的(2)所示，将射频测试仪器400的测试端410与第一焊盘15电连接，以对射频前端电路11测试。
S250、如图10中的(3)所示，将绝缘材料填充于第一焊盘15和第二焊盘16的间隙中，以形成第一绝缘层3。
这样第一绝缘层3可以对液态金属体2与第一焊盘15、第二焊盘16之间空间相对的部分起到支撑的作用，从而可以更好的避免液态金属体2与基板1相接触，进而大大降低了基板1上的线路被液态金属体2短路的风险。
S300、如图10中的(4)～(6)所示，在焊盘组14的位置处设置液态金属体2，将第一焊盘15与第二焊盘16连接，以使射频前端电路11与射频后端电路12电连接。
S400、如图10中的(7)所示，将绝缘材料涂覆于液态金属体2的位置处，以形成将液态金属体2覆盖的第二绝缘层4。
通过设置第二绝缘层4可以将液态金属体2隔离，从而避免液态金属体2与焊盘组14周围的电子器件接触短路，当然，如果焊盘组14周围的电子器件能够避开与液态金属体2接触，第二绝缘层4也可以不设置。
该实施例中，S300和S400具体执行的步骤可参照图9a中的描述来设置，在此不 再赘述。
如图11a和图11b所示，图11a为图8所示的电路板200的制作方法过程图，图11a中位于右侧的图是位于左侧图的俯视图，图11b为图8中所示的电路板200的制作方法的流程图。该电路板200的制作方法，包括：
N100、如图11a中的(1)所示，提供基板1。
其中，基板1上设有射频前端电路11、射频后端电路12、以及焊盘组14，焊盘组14包括与射频前端电路11电连接的第一焊盘15、以及与射频后端电路12电连接的第二焊盘16，第二焊盘16与第一焊盘15相隔设置。
N200、如图11a中的(2)所示，将射频测试仪器400的测试端410与第一焊盘15电连接，以对射频前端电路11测试。
其中，射频测试仪器400的测试端410可以是测试探针，测试探针可以插至第一焊盘15上，以实现与第一焊盘15的电连接。在测试时，射频测试仪器400通过测试端410向第一焊盘15发送测试信号，以对射频前端电路11进行测试；测试完之后，需要将测试端410从第一焊盘15上移出，以断开与第一焊盘15的连接。
N300、如图11a中的(3)～(5)所示，将液态金属材料填充于第一焊盘15和第二焊盘16的间隙中，以形成液态金属体2。其中，液态金属材料可以通过点涂设备的针管挤出涂覆于第一焊盘15和第二焊盘16的间隙中，以形成液态金属体2。
N400、如图11a中的(4)所示，将绝缘材料涂覆于液态金属体2的位置处，以形成将液态金属体2覆盖的第二绝缘层4。
具体地，将绝缘材料涂覆于液态金属体2远离基板1的一侧，以形成第二绝缘层4。
通过设置第二绝缘层4可以将液态金属体2隔离，从而避免液态金属体2与焊盘组14周围的电子器件接触短路，当然，如果焊盘组14周围的电子器件能够避开与液态金属体2接触，第二绝缘层4也可以不设置。
在一些实施例中，在N300包括：
N310、如图11a中的(3)所示，在基板1上层叠设置具有掩膜孔510的掩膜板500，以使焊盘组14位于掩膜孔510中。其中，该掩膜板500可以由绝缘材料制作而成，比如塑胶。
N320、如图11a中的(4)和(5)所示，向掩膜孔510中涂覆液态金属材料，以在第一焊盘15和第二焊盘16的间隙中形成液态金属体2。
其中，掩膜孔510的大小可以与焊盘组14所在区域的大小相匹配，这样掩膜孔510的孔壁可以起到阻挡的作用，防止液态金属材料从第一焊盘15和第二焊盘16的间隙的两端溢出。在向掩膜孔510中涂覆液态金属材料时，如果一部分液态金属材料溢出掩膜孔510外，可以将该部分的液态金属材料刮除掉。
在该实施例中，通过设置掩膜板500来制作液态金属体2，这样能够精确地控制液态金属材料的涂覆位置和涂覆量，从而保证液态金属体2位于第一焊盘15和第二焊盘16的间隙中以将第一焊盘15和第二焊盘16连接。
在一些实施例中，N400包括：将绝缘胶材涂覆于液态金属体2的位置处，然后经过固化后，形成第二绝缘层4。具体地，将绝缘胶材涂覆于液态金属体2远离基板1 的一侧，以形成第二绝缘层4。
绝缘胶材经过加固化后形成的第二绝缘层4，其具有一定的机械强度，可以将液态金属体2的位置很好地限制在焊盘组14处，以防止终端设备在晃动时液态金属体2从焊盘组14处脱离移动至其它位置。
其中，上述绝缘胶材可以是热固化胶或者紫外固化胶。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (21)

  1. 一种电路板，其特征在于，包括：
    基板，所述基板上设有射频前端电路、射频后端电路以及焊盘组，所述焊盘组包括与所述射频前端电路电连接的第一焊盘、以及与所述射频后端电路电连接的第二焊盘，所述第二焊盘与所述第一焊盘相隔设置；
    液态金属体，设置于所述焊盘组的位置处，且将所述第一焊盘与所述第二焊盘连接，以使所述射频前端电路与所述射频后端电路电连接。
  2. 根据权利要求1所述的电路板，其特征在于，
    所述液态金属体设置于所述焊盘组远离所述基板的一侧，且与所述第一焊盘、所述第二焊盘相接触。
  3. 根据权利要求2所述的电路板，其特征在于，
    所述第一焊盘包括远离所述基板一侧的第一焊盘面，所述第二焊盘包括远离所述基板一侧的第二焊盘面；
    所述液态金属体为层状结构，且与所述第一焊盘面、所述第一焊盘面层叠设置。
  4. 根据权利要求3所述的电路板，其特征在于，
    所述第一焊盘面与所述第二焊盘面相齐平。
  5. 根据权利要求3或4所述的电路板，其特征在于，
    所述液态金属体与所述第一焊盘面远离所述第二焊盘的一侧边缘相齐平，和/或，所述液态金属体与所述第二焊盘面远离所述第一焊盘的一侧边缘相齐平。
  6. 根据权利要求2～5中任一项所述的电路板，其特征在于，
    所述电路板还包括第一绝缘层，所述第一绝缘层填充于所述第一焊盘与所述第二焊盘之间的间隙中。
  7. 根据权利要求1所述的电路板，其特征在于，
    所述液态金属体填充于所述第一焊盘与所述第二焊盘的间隙中。
  8. 根据权利要求1～7中任一项所述的电路板，其特征在于，
    所述电路板还包括第二绝缘层，所述第二绝缘层设置于所述液态金属体的位置处，以将所述液态金属体覆盖。
  9. 根据权利要求8所述的电路板，其特征在于，
    所述液态金属体为层状结构，所述第二绝缘层叠置于所述液态金属体远离基板的一侧。
  10. 根据权利要求8或9所述的电路板，其特征在于，
    所述第二绝缘层为热固化胶层或紫外固化胶层。
  11. 根据权利要求1～10中任一项所述的电路板，其特征在于，
    所述焊盘组的数目为多个，多个所述焊盘组并排设置。
  12. 根据权利要求1～11中任一项所述的电路板，其特征在于，
    所述电路板还包括第一屏蔽罩和/或第二屏蔽罩；
    所述第一屏蔽罩罩设于所述基板上设置所述射频前端电路的区域；所述第二屏蔽罩罩设于所述基板上设置所述射频后端电路的区域。
  13. 一种终端设备，其特征在于，包括：
    壳体；
    权利要求1～12中任一项所述的电路板，设置于所述壳体中；
    天线，与所述电路板的射频后端电路电连接。
  14. 一种电路板的制作方法，其特征在于，包括：
    提供基板；其中，所述基板上设有射频前端电路、射频后端电路、以及焊盘组，所述焊盘组包括与所述射频前端电路电连接的第一焊盘、以及与所述射频后端电路电连接的第二焊盘，所述第二焊盘与所述第一焊盘相隔设置；
    将射频测试仪器的测试端与所述第一焊盘电连接，以对所述射频前端电路测试；
    在所述射频前端电路测试完之后，在所述焊盘组的位置处设置液态金属体，将所述第一焊盘与所述第二焊盘连接，以使所述射频前端电路与所述射频后端电路电连接。
  15. 根据权利要求14所述的电路板的制作方法，其特征在于，
    在所述焊盘组的位置处设置液态金属体，将所述第一焊盘与所述第二焊盘连接，包括：
    在所述焊盘组远离所述基板的一侧设置所述液态金属体，使所述液态金属体与所述第一焊盘、所述第二焊盘相接触。
  16. 根据权利要求15所述的电路板的制作方法，其特征在于，
    在所述焊盘组远离所述基板的一侧设置所述液态金属体之前，还包括：
    将绝缘材料填充于所述第一焊盘和所述第二焊盘的间隙中，以形成第一绝缘层。
  17. 根据权利要求15或16所述的电路板的制作方法，其特征在于，
    在所述焊盘组远离所述基板的一侧设置所述液态金属体，使所述液态金属体与所述第一焊盘、所述第二焊盘相接触，包括：
    在所述基板上层叠设置具有掩膜孔的掩膜板，以使所述焊盘组位于所述掩膜孔中；
    向所述掩膜孔中涂覆液态金属材料，以在所述焊盘组远离所述基板的一侧形成所述液态金属体。
  18. 根据权利要求14所述的电路板的制作方法，其特征在于，
    在所述焊盘组的位置处设置液态金属体，将所述第一焊盘与所述第二焊盘连接，包括：
    将液态金属材料填充于所述第一焊盘和所述第二焊盘的间隙中，以形成所述液态金属体。
  19. 根据权利要求18所述的电路板的制作方法，其特征在于，
    将液态金属材料填充于所述第一焊盘和所述第二焊盘的间隙中，以形成所述液态金属体，包括：
    在所述基板上层叠设置具有掩膜孔的掩膜板，以使所述焊盘组位于所述掩膜孔中；
    向所述掩膜孔中涂覆液态金属材料，以在所述第一焊盘和所述第二焊盘的间隙中形成所述液态金属体。
  20. 根据权利要求14～19中任一项所述的电路板的制作方法，其特征在于，
    在所述焊盘组的位置处设置液态金属体之后，还包括：
    将绝缘材料涂覆于所述液态金属体的位置处，以形成将所述液态金属体覆盖的第二绝缘层。
  21. 根据权利要求20所述的电路板的制作方法，其特征在于，
    将绝缘材料涂覆于所述液态金属体的位置处，以形成将所述液态金属体覆盖的第二绝缘层，包括：
    将绝缘胶材涂覆于所述液态金属体的位置处，然后经过固化后，形成所述第二绝缘层。
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