WO2022203327A1 - 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 - Google Patents
그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 Download PDFInfo
- Publication number
- WO2022203327A1 WO2022203327A1 PCT/KR2022/003935 KR2022003935W WO2022203327A1 WO 2022203327 A1 WO2022203327 A1 WO 2022203327A1 KR 2022003935 W KR2022003935 W KR 2022003935W WO 2022203327 A1 WO2022203327 A1 WO 2022203327A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasticizer
- polyimide film
- graphite sheet
- bis
- dianhydride
- Prior art date
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 98
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 69
- 239000010439 graphite Substances 0.000 title claims abstract description 69
- 239000004014 plasticizer Substances 0.000 claims abstract description 136
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims description 23
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 20
- 238000009792 diffusion process Methods 0.000 claims description 19
- 239000003054 catalyst Substances 0.000 claims description 14
- 150000004985 diamines Chemical class 0.000 claims description 12
- -1 dicarboxyphenyl Chemical group 0.000 claims description 8
- 238000010000 carbonizing Methods 0.000 claims description 7
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 7
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 5
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 5
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims description 5
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 4
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 3
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 claims description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical group C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 3
- XDYLWBWPEDSSLU-UHFFFAOYSA-N 4-(3-carboxyphenyl)benzene-1,2,3-tricarboxylic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C(C(O)=O)=CC=2)C(O)=O)=C1 XDYLWBWPEDSSLU-UHFFFAOYSA-N 0.000 claims description 2
- BCJIMAHNJOIWKQ-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-4-yl)oxy]-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2OC1=CC=CC2=C1C(=O)OC2=O BCJIMAHNJOIWKQ-UHFFFAOYSA-N 0.000 claims description 2
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 claims description 2
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 2
- OWICEWMBIBPFAH-UHFFFAOYSA-N (3-diphenoxyphosphoryloxyphenyl) diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1)(=O)OC1=CC=CC=C1 OWICEWMBIBPFAH-UHFFFAOYSA-N 0.000 claims 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 22
- 239000011256 inorganic filler Substances 0.000 description 21
- 229910003475 inorganic filler Inorganic materials 0.000 description 21
- 229920005575 poly(amic acid) Polymers 0.000 description 20
- 238000005187 foaming Methods 0.000 description 15
- 238000005087 graphitization Methods 0.000 description 14
- 238000003763 carbonization Methods 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- 230000007423 decrease Effects 0.000 description 11
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 229910003481 amorphous carbon Inorganic materials 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 230000005484 gravity Effects 0.000 description 5
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 4
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 108010025899 gelatin film Proteins 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 235000019739 Dicalciumphosphate Nutrition 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- NEFBYIFKOOEVPA-UHFFFAOYSA-K dicalcium phosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])([O-])=O NEFBYIFKOOEVPA-UHFFFAOYSA-K 0.000 description 2
- 229940038472 dicalcium phosphate Drugs 0.000 description 2
- 229910000390 dicalcium phosphate Inorganic materials 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-methyl-PhOH Natural products CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-methyl phenol Natural products CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- LERREUOVCXYKGR-UHFFFAOYSA-N (2-phenoxyphenyl)-phenylmethanone Chemical compound C=1C=CC=C(OC=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 LERREUOVCXYKGR-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- JFEXPVDGVLNUSC-UHFFFAOYSA-N 3-(3-aminophenyl)sulfanylaniline Chemical compound NC1=CC=CC(SC=2C=C(N)C=CC=2)=C1 JFEXPVDGVLNUSC-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- UVUCUHVQYAPMEU-UHFFFAOYSA-N 3-[2-(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC(C(C=2C=C(N)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 UVUCUHVQYAPMEU-UHFFFAOYSA-N 0.000 description 1
- DVXYMCJCMDTSQA-UHFFFAOYSA-N 3-[2-(3-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=CC(N)=CC=1C(C)(C)C1=CC=CC(N)=C1 DVXYMCJCMDTSQA-UHFFFAOYSA-N 0.000 description 1
- WWNABCFITWBKEM-UHFFFAOYSA-N 3-[3-(3-aminophenyl)phenyl]aniline Chemical compound NC1=CC=CC(C=2C=C(C=CC=2)C=2C=C(N)C=CC=2)=C1 WWNABCFITWBKEM-UHFFFAOYSA-N 0.000 description 1
- GBUNNYTXPDCASY-UHFFFAOYSA-N 3-[3-[2-[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(C=CC=2)C(C=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 GBUNNYTXPDCASY-UHFFFAOYSA-N 0.000 description 1
- FJWUJUIPIZSDTR-UHFFFAOYSA-N 3-[3-[2-[3-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=CC(OC=2C=C(N)C=CC=2)=CC=1C(C)(C)C(C=1)=CC=CC=1OC1=CC=CC(N)=C1 FJWUJUIPIZSDTR-UHFFFAOYSA-N 0.000 description 1
- GZBHMJRTCUJCBO-UHFFFAOYSA-N 3-[3-[3-(3-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(OC=4C=C(N)C=CC=4)C=CC=3)C=CC=2)=C1 GZBHMJRTCUJCBO-UHFFFAOYSA-N 0.000 description 1
- MFIONUVRAOILLH-UHFFFAOYSA-N 3-[3-[3-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=C(C=CC=2)C=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 MFIONUVRAOILLH-UHFFFAOYSA-N 0.000 description 1
- SABXTRNPHKCTFO-UHFFFAOYSA-N 3-[3-[3-(3-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(SC=3C=C(OC=4C=C(N)C=CC=4)C=CC=3)C=CC=2)=C1 SABXTRNPHKCTFO-UHFFFAOYSA-N 0.000 description 1
- YLTIRYJAWQHSQS-UHFFFAOYSA-N 3-[3-[3-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(C=CC=2)S(=O)(=O)C=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 YLTIRYJAWQHSQS-UHFFFAOYSA-N 0.000 description 1
- OLFCXXUMDWEXKG-UHFFFAOYSA-N 3-[3-[[3-(3-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(CC=3C=C(OC=4C=C(N)C=CC=4)C=CC=3)C=CC=2)=C1 OLFCXXUMDWEXKG-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- POXPSTWTPRGRDO-UHFFFAOYSA-N 3-[4-(3-aminophenyl)phenyl]aniline Chemical compound NC1=CC=CC(C=2C=CC(=CC=2)C=2C=C(N)C=CC=2)=C1 POXPSTWTPRGRDO-UHFFFAOYSA-N 0.000 description 1
- MFTFTIALAXXIMU-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MFTFTIALAXXIMU-UHFFFAOYSA-N 0.000 description 1
- NQZOFDAHZVLQJO-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 NQZOFDAHZVLQJO-UHFFFAOYSA-N 0.000 description 1
- JERFEOKUSPGKGV-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(SC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 JERFEOKUSPGKGV-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- YSMXOEWEUZTWAK-UHFFFAOYSA-N 3-[4-[[4-(3-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 YSMXOEWEUZTWAK-UHFFFAOYSA-N 0.000 description 1
- RXXCIBALSKQCAE-UHFFFAOYSA-N 3-methylbutoxymethylbenzene Chemical compound CC(C)CCOCC1=CC=CC=C1 RXXCIBALSKQCAE-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 1
- YARZEPAVWOMMHZ-UHFFFAOYSA-N 4-(3,4-dicarboxy-4-phenylcyclohexa-1,5-dien-1-yl)phthalic acid Chemical compound OC(=O)C1C=C(C=2C=C(C(C(O)=O)=CC=2)C(O)=O)C=CC1(C(O)=O)C1=CC=CC=C1 YARZEPAVWOMMHZ-UHFFFAOYSA-N 0.000 description 1
- VILWHDNLOJCHNJ-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfanylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1SC1=CC=C(C(O)=O)C(C(O)=O)=C1 VILWHDNLOJCHNJ-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- QNLCDRXVEPWSBQ-UHFFFAOYSA-N 4-(4,5-dicarboxy-5-phenylcyclohexa-1,3-dien-1-yl)phthalic acid Chemical compound OC(=O)C1=CC=C(C=2C=C(C(C(O)=O)=CC=2)C(O)=O)CC1(C(O)=O)C1=CC=CC=C1 QNLCDRXVEPWSBQ-UHFFFAOYSA-N 0.000 description 1
- YJOAIOIVLVUPST-UHFFFAOYSA-N 4-(4-amino-2-methoxyphenyl)-3-methoxyaniline Chemical compound COC1=CC(N)=CC=C1C1=CC=C(N)C=C1OC YJOAIOIVLVUPST-UHFFFAOYSA-N 0.000 description 1
- MITHMOYLTXMLRB-UHFFFAOYSA-N 4-(4-aminophenyl)sulfinylaniline Chemical compound C1=CC(N)=CC=C1S(=O)C1=CC=C(N)C=C1 MITHMOYLTXMLRB-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- JYZPDAUOQGFBKT-UHFFFAOYSA-N 4-[2-[2-[2-(3,4-dicarboxyphenoxy)phenyl]propan-2-yl]phenoxy]phthalic acid Chemical compound C=1C=CC=C(OC=2C=C(C(C(O)=O)=CC=2)C(O)=O)C=1C(C)(C)C1=CC=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 JYZPDAUOQGFBKT-UHFFFAOYSA-N 0.000 description 1
- GQUSLIBGUTZKJZ-UHFFFAOYSA-N 4-[3-(3,4-dicarboxyphenoxy)phenoxy]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=CC(OC=2C=C(C(C(O)=O)=CC=2)C(O)=O)=C1 GQUSLIBGUTZKJZ-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- BOVVHULZWVFIOX-UHFFFAOYSA-N 4-[3-(4-aminophenyl)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=CC(C=2C=CC(N)=CC=2)=C1 BOVVHULZWVFIOX-UHFFFAOYSA-N 0.000 description 1
- WJMZKMOQJDOAIE-UHFFFAOYSA-N 4-[3-[2-[3-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(C(C=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 WJMZKMOQJDOAIE-UHFFFAOYSA-N 0.000 description 1
- HCJSCAOEKCHDQO-UHFFFAOYSA-N 4-[3-[3-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)=C1 HCJSCAOEKCHDQO-UHFFFAOYSA-N 0.000 description 1
- WVIGQQBEFCXWRW-UHFFFAOYSA-N 4-[3-[3-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=CC(C=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)=C1 WVIGQQBEFCXWRW-UHFFFAOYSA-N 0.000 description 1
- LEUQLXVKRVZUEX-UHFFFAOYSA-N 4-[3-[3-(4-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(SC=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)=C1 LEUQLXVKRVZUEX-UHFFFAOYSA-N 0.000 description 1
- VZZOONBAZHZSEB-UHFFFAOYSA-N 4-[3-[3-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(S(=O)(=O)C=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)=C1 VZZOONBAZHZSEB-UHFFFAOYSA-N 0.000 description 1
- IXZCKKLBICAHRA-UHFFFAOYSA-N 4-[3-[[3-(4-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(CC=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)=C1 IXZCKKLBICAHRA-UHFFFAOYSA-N 0.000 description 1
- QBSMHWVGUPQNJJ-UHFFFAOYSA-N 4-[4-(4-aminophenyl)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(C=2C=CC(N)=CC=2)C=C1 QBSMHWVGUPQNJJ-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- SXTPNMJRVQKNRN-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1SC(C=C1)=CC=C1OC1=CC=C(N)C=C1 SXTPNMJRVQKNRN-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- PJCCVNKHRXIAHZ-UHFFFAOYSA-N 4-[4-[[4-(4-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CC(C=C1)=CC=C1OC1=CC=C(N)C=C1 PJCCVNKHRXIAHZ-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- BBTGUNMUUYNPLH-UHFFFAOYSA-N 5-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 BBTGUNMUUYNPLH-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- ASDFHLVGJMRDTI-UHFFFAOYSA-N benzene-1,3-diol;phosphoric acid Chemical compound OP(O)(O)=O.OC1=CC=CC(O)=C1 ASDFHLVGJMRDTI-UHFFFAOYSA-N 0.000 description 1
- KYJFTSJZXHMIEL-UHFFFAOYSA-N bis(3-amino-4-chlorophenyl)methanone Chemical compound C1=C(Cl)C(N)=CC(C(=O)C=2C=C(N)C(Cl)=CC=2)=C1 KYJFTSJZXHMIEL-UHFFFAOYSA-N 0.000 description 1
- BQHONQTZEHHWKX-UHFFFAOYSA-N bis(3-amino-4-methoxyphenyl)methanone Chemical compound C1=C(N)C(OC)=CC=C1C(=O)C1=CC=C(OC)C(N)=C1 BQHONQTZEHHWKX-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- CCTYCLLYQJOQSB-UHFFFAOYSA-N bis[3-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=C(C=CC=2)C(=O)C=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 CCTYCLLYQJOQSB-UHFFFAOYSA-N 0.000 description 1
- QELIUXRUDBKNAP-UHFFFAOYSA-N bis[3-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(C(=O)C=2C=C(OC=3C=CC(N)=CC=3)C=CC=2)=C1 QELIUXRUDBKNAP-UHFFFAOYSA-N 0.000 description 1
- VPCCFJZBAILZNL-UHFFFAOYSA-N bis[3-amino-4-(4-phenylphenoxy)phenyl]methanone Chemical compound NC1=CC(C(=O)C=2C=C(N)C(OC=3C=CC(=CC=3)C=3C=CC=CC=3)=CC=2)=CC=C1OC(C=C1)=CC=C1C1=CC=CC=C1 VPCCFJZBAILZNL-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- LSDYQEILXDCDTR-UHFFFAOYSA-N bis[4-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 LSDYQEILXDCDTR-UHFFFAOYSA-N 0.000 description 1
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
- C01B32/205—Preparation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
Definitions
- the present invention relates to a polyimide film for a graphite sheet and a graphite sheet prepared therefrom.
- the graphite sheet has a higher thermal conductivity than a metal sheet such as copper or aluminum, and is attracting attention as a heat dissipation member for electronic devices.
- the graphite sheet may be manufactured by various methods, for example, it may be prepared by carbonizing and graphitizing a polymer film.
- the polyimide film has been in the spotlight as a polymer film for manufacturing a graphite sheet due to its excellent mechanical, thermal dimensional stability, chemical stability, and the like.
- a variety of additives may be used in the polyimide film used for manufacturing the graphite sheet, and a double plasticizer is widely used to improve the physical properties of the polyimide film. Problems such as deterioration in appearance quality occur, and a solution is required.
- Patent Document 1 Republic of Korea Patent Publication No. 2017-0049912
- An object of the present invention is to provide a polyimide film including a first plasticizer and a second plasticizer, which does not deteriorate a thermal diffusion coefficient and appearance quality even when converted to a graphite sheet, and has a low mass reduction rate during carbonization and graphitization.
- Another object of the present invention is to provide a method for manufacturing a graphite sheet from the polyimide film and a graphite sheet of excellent quality prepared therefrom.
- One embodiment of the present invention for achieving the above object includes a first plasticizer and a second plasticizer,
- a polyimide film is provided.
- Another embodiment of the present invention comprises the step of carbonizing, graphitizing or carbonizing and graphitizing the polyimide film
- a method for manufacturing a graphite sheet is provided.
- Another embodiment of the present invention provides a graphite sheet manufactured by the method for manufacturing the graphite sheet.
- the present invention has the effect of providing a polyimide film having a low mass reduction rate during carbonization and graphitization, a method for producing a graphite sheet from the polyimide film, and a graphite sheet having an excellent appearance prepared therefrom without a decrease in the thermal diffusion coefficient.
- Figure 4 is a graph of the measurement of the thermal diffusion coefficient and foam thickness of the graphite sheet according to Examples and Comparative Examples of the present invention.
- the polyimide film according to an aspect of the present invention may include a first plasticizer and a second plasticizer, and the molecular weight of the first plasticizer and the second plasticizer may be 700 g/mol or less.
- the molecular weight of the first plasticizer and the second plasticizer is 700 g/mol or less, 600 g/mol or less, 500 g/mol or less, 450 g/mol or less, 400 g/mol or less, 370 g/mol or less. It may be the following, but is not limited thereto.
- the plasticizer increases the distance between the polyimide polymers, weakens the attractive force between the polymer chains, and has the effect of moving the glass transition temperature (Tg) to a low temperature region.
- the decrease in the thermal diffusion coefficient is presumed to be a phenomenon that occurs because, as the molecular weight of the plasticizer increases, the plasticizer molecules increase the distance between the polyimide molecular chains of the polyimide film, thereby affecting the graphite sheet prepared from the polyimide film.
- the molecular weight of the plasticizer of the polyimide film is less than 250 g/mol, the mass reduction rate during carbonization and graphitization of the polyimide film for producing a graphite sheet increases.
- the change in the mass reduction rate shows that as the molecular weight of the plasticizer is lowered, the attraction between the plasticizer molecules or the attraction between the plasticizer and the polyimide molecules is lowered and the volatility is increased. It is presumed to be a phenomenon that occurs because it does not properly perform its role as a plasticizer in
- the plasticizer is By appropriately controlling the type and ratio, both a high thermal diffusion coefficient during graphite conversion and a low mass reduction rate during carbonization and graphitization of the polyimide film can be secured.
- the difference between the molecular weight of the first plasticizer and the second plasticizer may be 150 g/mol or less.
- the difference between the molecular weights of the first plasticizer and the second plasticizer may be 150 g/mol or less, 120 g/mol or less, 100 g/mol or less, or 50 g/mol or less, but is not limited thereto.
- the first plasticizer and the second plasticizer may be included.
- the total content of the imidization catalyst included in the polyimide film is 100% by weight
- the total content of the first plasticizer and the second plasticizer included in the polyimide film may be 1.65% by weight or less.
- the total content of the first plasticizer and the second plasticizer included in the polyimide film may be 1.65 wt% or less, 1.1 wt% or less, or 0.7 wt% or less.
- the imidization catalyst promotes the ring closure reaction of the polyamic acid, and for example, an aliphatic tertiary amine, an aromatic tertiary amine, and a heterocyclic tertiary amine may be used. Among them, a heterocyclic tertiary amine can be used from the viewpoint of reactivity as a catalyst.
- heterocyclic tertiary amine examples include quinoline, isoquinoline, ⁇ -picoline, pyridine, and the like, and these may be used alone or in combination of two or more.
- the imidization catalyst may be added in an amount of 0.05 moles to 3 moles (eg, 0.2 moles to 2 moles) based on 1 mole of the amic acid group in the polyamic acid.
- the present invention is not limited thereto.
- the thermal diffusion coefficient decreases and the foaming rate increases when converted to the graphite sheet.
- the density decreases when converted to a polyimide film and a graphite sheet.
- the weight ratio of the first plasticizer to the second plasticizer may be 1:9 to 9:1.
- the thermal diffusion coefficient of the graphite sheet decreases and the foaming rate (foaming thickness) tends to increase appears.
- the densities of the polyimide film and the graphite sheet tend to increase and then decrease.
- the thermal diffusion coefficient, foaming rate, and true density of the graphite sheet can be appropriately adjusted.
- the first plasticizer and the second plasticizer may be a phosphorus (P)-based plasticizer.
- the phosphorus (P)-based plasticizer may exhibit the properties of the flame retardant together.
- the first plasticizer or the second plasticizer is triphenyl phosphate (treiphenyl phosphate), tricresyl phosphate (tricresyl phosphate) and triphenylphosphine (triphenylphosphine), resorcinol bisdiphenyl phosphate (resorcinol) It may be any one selected from the group consisting of bis (diphenyl phosphate)) and bisphenol A bisdiphenyl phosphate (bisphenol A bis (diphenyl phosphate)).
- the polyimide film is prepared by imidizing a polyamic acid formed by the reaction of a dianhydride monomer and a diamine monomer, and the polyamic acid may have a weight average molecular weight of 100,000 to 500,000.
- the polyamic acid may have a weight average molecular weight of 100,000 to 500,000.
- graphitization may be facilitated during the manufacture of the graphite sheet.
- the 'weight average molecular weight' may be measured using gel chromatography (GPC) and using polystyrene as a standard sample.
- the weight average molecular weight of the polyamic acid may be, for example, 150,000 to 500,000, another example, 100,000 to 400,000, and another example, 250,000 to 400,000, but is not limited thereto.
- the dianhydride monomer and the diamine monomer various monomers commonly used in the field of polyimide film production may be used.
- the dianhydride monomer may be an aromatic dianhydride monomer and the diamine monomer may be an aromatic diamine monomer.
- the dianhydride monomer include pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, and oxydiphthalic dianhydride.
- diphenylsulfone-3,4,3',4'-tetracarboxylic dianhydride bis(3,4-dicarboxyphenyl)sulfide dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1 ,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride
- Water bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, p-phenylenebis(trimellitic acid monoester anhydride), p- Biphenylenebis(trimellitic acid monoester anhydride), m-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, p
- diamine monomer a diamine monomer including one benzene ring (eg, 1,4-diaminobenzene, 1,3-diaminobenzene, 2,4-diaminotoluene, 2,6-diaminotoluene, 3 ,5-diaminobenzoic acid, etc.), diamine monomers containing two benzene rings (for example, diaminodiphenyl ethers such as 4,4'-diaminodiphenyl ether and 3,4'-diaminodiphenyl ether) , 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2' -bis(trifluoromethyl)-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-ddi
- dianhydride monomer pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4-biphenyltetracarboxylic dianhydride, oxydiphthalic anhydride , bis(3,4-dicarboxyphenyl)sulfone dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, or a combination thereof is used, and the diamine monomer is 4,4'-oxydianiline , 3,4'-oxydianiline, p-phenylenediamine, m-phenylenediamine, 4,4'-methylenedianiline, 3,3'-methylenedianiline, or a combination thereof may be used.
- the thickness of the polyimide film may be 25 to 500 ⁇ m.
- the thickness of the polyimide film may be, for example, 25 to 125 ⁇ m, for example, 40 to 500 ⁇ m, but is not limited thereto.
- the polyimide film may be prepared by various methods commonly used in the field of polyimide film production.
- the polyimide film is prepared by polymerizing one or more dianhydride monomers and one or more diamine monomers in a solvent to prepare a polyamic acid solution, and then adding an imidization catalyst, a dehydrating agent, and optionally a sublimable inorganic to the polyamic acid solution.
- It may be prepared by adding a filler, a solvent, etc. to form a composition for a polyimide film, and forming the composition into a film, but is not limited thereto.
- the imidization of the polyamic acid solution may be performed through a known imidization method, such as a thermal imidization method, a chemical imidization method, or a complex imidization method using a combination of the thermal imidization method and a chemical imidization method.
- a known imidization method such as a thermal imidization method, a chemical imidization method, or a complex imidization method using a combination of the thermal imidization method and a chemical imidization method.
- the average particle diameter (D 50 ) of the entire sublimable inorganic filler included in the polyimide film is 0.1 to 5.0 ⁇ m, and the total content of the sublimable inorganic filler is 0.07 to 0.4 wt% based on the total weight of the polyimide film. have.
- the sublimable inorganic filler may sublimate during carbonization and/or graphitization of the polyimide film to induce a predetermined foaming phenomenon.
- This foaming phenomenon can facilitate the exhaustion of sublimation gas generated during carbonization and/or graphitization, thereby making it possible to obtain a graphite sheet of good quality, and predetermined voids formed according to foaming can provide the graphite sheet with its bending resistance ( 'flexibility') can also be improved.
- the type, content and particle size of the sublimable inorganic filler are should be chosen carefully.
- the 'average particle size (D 50 )' is to be measured using a laser diffraction particle size analyzer (SALD-2201, Shimadzu) after ultrasonically dispersing the sublimable inorganic filler in dimethylformamide solvent at 25° C. for 5 minutes.
- SALD-2201 laser diffraction particle size analyzer
- the average particle diameter (D 50 ) of the entire sublimable inorganic filler in the polyimide film is, for example, 0.5 to 4.0 ⁇ m, for example 0.1 to 2.5 ⁇ m, for another example, 1.5 to 5.0 ⁇ m, for another example It may be less than 1.5 to 2.5 ⁇ m, but is not limited thereto.
- the total content of the sublimable inorganic filler in the polyimide film is, based on the total weight of the polyimide film, for example, 0.07 to 0.35% by weight, for example, 0.1 to 0.3% by weight, for another example, 0.15 to 0.3% by weight. %, but is not limited thereto.
- the sublimable inorganic filler may include a first sublimable inorganic filler having an average particle diameter (D 50 ) of 0.1 to 2.0 ⁇ m and a second sublimable inorganic filler having an average particle diameter (D 50 ) of greater than 2.0 to 5.0 ⁇ m.
- the content of the first sublimable inorganic filler and the second sublimable inorganic filler in the sublimable inorganic filler is not particularly limited, but for example, the first sublimable inorganic filler is 90 to 10 based on the total weight of the sublimable inorganic filler. It may be included in an amount of 10 wt% to 90 wt% of the second sublimable inorganic filler.
- the content of the first sublimable inorganic filler based on the total weight of the sublimable inorganic filler is, for example, 15 to 85% by weight, for example 20 to 80% by weight, for another example from 30 to 80% by weight.
- the content of the second sublimable inorganic filler is, for example, 85 to 15% by weight, for example 80 to 20% by weight, another example For example, 70 to 20% by weight, another example may be 50 to 20% by weight, but is not limited thereto.
- sublimable inorganic filler examples include, but are not limited to, calcium carbonate, dicalcium phosphate, and barium sulfate.
- the solvent is not particularly limited as long as it can dissolve the polyamic acid.
- the solvent may include an aprotic polar solvent.
- sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide; formamide solvents such as N,N-dimethylformamide and N,N-diethylformamide; acetamide-based solvents such as N,N-dimethylacetamide and N,N-diethylacetamide; pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone; phenolic solvents such as phenol, o-, m-, or p-cresol, xylenol, halogenated phenol, and catechol; aprotic polar solvents such as hexamethylphosphoramide and ⁇ -butylolactone; and the like may be used alone or in combination of two or more, but is not limited thereto.
- formamide solvents such as N,N-dimethylformamide and N,N-diethylformamide
- acetamide-based solvents such
- acetic anhydride propionic anhydride, butyric anhydride, benzoic anhydride, etc. may be used alone or in combination of two or more, but is not limited thereto.
- the film forming is performed by applying a polyamic acid solution in the form of a film on a substrate, drying by heating at a temperature of 30 to 200 ° C. for 15 seconds to 30 minutes to prepare a gel film, and then removing the substrate from the gel film at 250 to 600 ° C. It may be carried out by heat treatment at a temperature for 15 seconds to 30 minutes, but is not limited thereto.
- the elongation of the polyimide film is 120% or more, the strength is 210 MPa or more, the residual amount upon thermal decomposition at 1000°C is 56 wt% or more, and the true density is 1.35 g/cm 3 or more. .
- the elongation of the polyimide film may be 135% or less, the strength may be 230 MPa or less, and the true density may be 1.55 g/cm 3 or less.
- the proportion of a plasticizer having a relatively high molecular weight in the total plasticizer content (content of the first plasticizer + content of the second plasticizer) increases, the residual amount during thermal decomposition at 1000° C. tends to increase.
- the 'true density' is a density in which both closed pores and open pores are removed, and is different from the apparent density in which open pores are removed but closed pores are included.
- the true density of the polyimide film can be controlled in various ways. For example, by controlling the molecular weight of the polyamic acid, which is a precursor of the polyimide film, controlling the viscosity by adding a solvent to the polyamic acid, or controlling the type, particle size, content, etc. of the filler included in the polyimide film, etc. can be controlled, but is not limited thereto.
- the polyimide film may be used for manufacturing a graphite sheet.
- a method of manufacturing a graphite sheet according to another aspect of the present invention includes carbonizing, graphitizing, or carbonizing and graphitizing the polyimide film.
- the carbonization is a process of thermally decomposing the polymer chain of the polyimide film to form a preliminary graphite sheet including an amorphous carbon body, an amorphous carbon body and/or an amorphous carbon body.
- the polyimide film is heated under reduced pressure or under an inert gas atmosphere. It may include, but is not limited to, raising and maintaining the temperature from room temperature to a temperature ranging from 1,000° C. to 1,500° C., which is the highest temperature, over 10 hours to 30 hours.
- pressure may be applied to the polyimide film using a hot press or the like during carbonization for high carbon orientation, and the pressure at this time is, for example, 5 kg/cm 2 or more, for example, 15 kg/cm 2 or more, for example, 25 kg/cm 2 or more may be, but is not limited thereto.
- the graphitization is a process of forming a graphite sheet by rearranging the carbon of an amorphous carbon body, an amorphous carbon body and / or an amorphous carbon body, for example, a preliminary graphite sheet, optionally from room temperature to the highest temperature under an inert gas atmosphere It may include, but is not limited to, raising and maintaining the temperature over 2 to 30 hours to a temperature in the range of 2,500°C to 3,000°C.
- pressure may be applied to the preliminary graphite sheet using a hot press during graphitization for high orientation of carbon, and the pressure at this time is, for example, 100 kg/cm 2 or more, for example, 200 kg/ cm 2 or more, for example, 300 kg/cm 2 or more, but is not limited thereto.
- the graphite sheet according to another aspect of the present invention is manufactured by the method for manufacturing the graphite sheet, and the thermal diffusion coefficient is 720 mm 2 /s or more, and the foaming thickness may be 85 ⁇ m or less.
- the thermal diffusion coefficient may be 780 mm 2 /s or less, and the foaming thickness may be 60 ⁇ m or more.
- a first plasticizer triphenyl phosphate, TPP
- a second plasticizer tricresyl phosphate, tricresyl phosphate, TCP
- the prepared polyimide film precursor solution was cast to 500 ⁇ m on a SUS plate (100SA, Sandvik) using a doctor blade and dried in a temperature range of 100° C. to 200° C. to prepare a self-supporting gel film.
- the gel film was peeled off the SUS plate, fixed to a pin frame, and transferred to a high-temperature tenter.
- the film was heated from 200° C. to 700° C. in a high-temperature tenter, cooled at 25° C., and separated from the pin frame to obtain a polyimide film.
- the polyimide film prepared in Preparation Example 1 was heated to 1,210°C at a rate of 3.3°C/min under nitrogen gas using an electric furnace capable of carbonization, and maintained at 1,210°C for about 2 hours (carbonization).
- the temperature was raised from 1,210°C to 2,200°C under argon gas at a temperature increase rate of 2.5°C/min to perform a first firing step.
- the temperature was continuously increased to 2,500 °C by changing the temperature increase rate to a temperature increase rate of 1.25 °C/min to perform a second firing step.
- the temperature increase rate was changed to a temperature increase rate of 10 °C/min, and the temperature was continuously raised to 2,800 °C to perform a third firing step, and after standing at 2,800 °C for several minutes, graphitization was completed to complete the graphite sheet was prepared.
- the first plasticizer and the second plasticizer were mixed with the polyamic acid solution based on the total content of the imidization catalyst (when the total content of the imidization catalyst was 100% by weight) , 0.47 wt% and 0.08 wt% were added, respectively. Thereafter, a graphite sheet was prepared according to Preparation Example 2.
- a graphite sheet was prepared in the same manner as in Example 1, except that 0.39 wt% and 0.17 wt% of the first plasticizer and the second plasticizer were added, respectively, based on the total content of the imidization catalyst mixed in the polyamic acid solution. .
- a graphite sheet was prepared in the same manner except that 0.28 wt% and 0.28 wt% of the first plasticizer and the second plasticizer were added, respectively, based on the total content of the imidization catalyst mixed in the polyamic acid solution.
- a graphite sheet was prepared in the same manner as in Example 1, except that 0.17 wt% and 0.39 wt% of the first plasticizer and the second plasticizer were added, respectively, based on the total content of the imidization catalyst mixed in the polyamic acid solution. .
- a graphite sheet was prepared in the same manner as in Example 1, except that the first and second plasticizers were not added.
- a graphite sheet was prepared in the same manner as in Example 1, except that 0.56% by weight of the imidization catalyst mixed in the polyamic acid solution was added without adding the first plasticizer and only the second plasticizer was added.
- a graphite sheet was prepared in the same manner as in Example 1, except that 0.56% by weight of the imidization catalyst mixed in the polyamic acid solution was added without adding the second plasticizer and only the first plasticizer was added.
- the polyimide films of Examples 1 to 4 in which the first plasticizer and the second plasticizer were mixed had both elongation and strength increased compared to the polyimide film of Comparative Example 2 including only the first plasticizer, but compared with only the second plasticizer Compared to the polyimide film of Example 3, the strength was somewhat lower and the elongation was similar or higher.
- the strength range was 215 to 225 MPa, and the elongation range was measured to be 120 to 135%.
- the specific gravity of the second plasticizer (TCP) in the total plasticizer content (content of the first plasticizer + the content of the second plasticizer) increased, the elongation and strength of the polyimide film did not change much, but showed a tendency to partially decrease.
- True density was measured using a Pycnometer (AccuPyc 1340, Micromeritics) with respect to a specimen cut into a size of 15 mm ⁇ 300 mm (horizontal ⁇ ) of the prepared polyimide film, using helium gas at room temperature conditions.
- the range of true density was measured to be 1.45 to 1.47 g/cm 3 .
- the specific gravity of the second plasticizer (TCP) in the total plasticizer content (content of the first plasticizer + content of the second plasticizer) increased, the true density of the polyimide film gradually increased and then decreased.
- Thermal decomposition properties were measured by increasing the temperature to 1000°C at a rate of 10°C/min using Thermogravimetric Analysis (TA Instruments, TGA5500).
- the polyimide films of Examples 1 to 4 in which the first plasticizer and the second plasticizer were mixed, compared to the polyimide film of Comparative Example 1 not including the first plasticizer and the second plasticizer, were prepared at 1000° C. During pyrolysis, the residual amount all increased.
- the residual amount upon thermal decomposition at 1000° C. was measured to be 56 wt % or more.
- the residual amount showed a tendency to slightly increase.
- the range of the thermal diffusion coefficient of the prepared graphite sheet was 720 to 760 mm 2 /s, and the range of the foaming thickness was measured to be 70 to 85 ⁇ m.
- the thermal diffusion coefficient was measured in the plane direction by the laser flash method using a measuring device (Netsch, LFA 467), and the foaming thickness was measured by a Digital Micrometer (Standard-type, Mitutoyo).
- the thermal diffusion coefficient showed a tendency to decrease.
- the foaming thickness showed a tendency to increase.
- the present invention has the effect of providing a polyimide film with a low thermal diffusion coefficient and a low mass reduction rate during carbonization and graphitization, a method for manufacturing a graphite sheet from the polyimide film, and a graphite sheet with excellent appearance prepared therefrom.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Carbon And Carbon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
가소제 | ||
제 1 가소제(TPP) | 제2 가소제(TCP) | |
실시예 1 | 0.47 | 0.08 |
실시예 2 | 0.39 | 0.17 |
실시예 3 | 0.28 | 0.28 |
실시예 4 | 0.17 | 0.39 |
비교예 1 | 0 | 0 |
비교예 2 | 0 | 0.56 |
비교예 3 | 0.56 | 0 |
Claims (11)
- 제1 가소제 및 제2 가소제를 포함하고,상기 제1 가소제 및 상기 제2 가소제의 분자량이 700 g/mol 이하인,폴리이미드 필름.
- 제1항에 있어서상기 상기 제1 가소제와 상기 제2 가소제의 분자량의 차이는 150 g/mol 이하인,폴리이미드 필름.
- 제1항에 있어서,상기 폴리이미드 필름에 포함된 이미드화 촉매의 총 함량을 기준으로, 1.65 중량% 이하의 상기 제1 가소제 및 상기 제2 가소제를 포함하는,폴리이미드 필름.
- 제1항에 있어서,상기 제1 가소제와 상기 제2 가소제의 중량비가 1:9 내지 9:1인,폴리이미드 필름.
- 제1항에 있어서,상기 제1 가소제 및 상기 제2 가소제는 인계 가소제인,폴리이미드 필름.
- 제5항에 있어서,상기 제1 가소제 또는 상기 제2 가소제는트리페닐 포스페이트(treiphenyl phosphate), 트리크레실 포스페이트(tricresyl phosphate), 트리페닐포스핀(triphenylphosphine), 레조시놀 비스다이페닐 포스페이트(resorcinol bis(diphenyl phosphate)) 및 비스페놀에이 비스다이페닐 포스페이트(bisphenol A bis(diphenyl phosphate))로 이루어진 군에서 선택된 어느 하나인,폴리이미드 필름.
- 제1항에 있어서,피로멜리트산 이무수물, 3,3',4,4'-비페닐테트라카르복시산 이무수물, 2,3,3',4-비페닐테트라카르복시산 이무수물, 옥시디프탈산 무수물, 비스(3,4-디카르복시페닐)설폰 이무수물, 3,3',4,4'-벤조페논테트라카르복시산 이무수물 또는 이들의 조합을 포함한 이무수물 단량체, 및4,4'-옥시디아닐린, 3,4'-옥시디아닐린, p-페닐렌디아민, m-페닐렌디아민, 4,4'-메틸렌디아닐린, 3,3'-메틸렌디아닐린 또는 이들의 조합을 포함한 디아민 단량체로부터 형성된,폴리이미드 필름.
- 제1항에 있어서,신도가 120% 이상이고,강도가 210 MPa 이상이며,1000℃에서의 열분해 시 잔여량이 56 중량% 이상이고,진밀도가 1.35 g/cm3 이상인,폴리이미드 필름.
- 제1항에 있어서,그라파이트 시트 제조용인,폴리이미드 필름.
- 제1항 내지 제9항 중 어느 한 항의 폴리이미드 필름을 탄화, 흑연화 또는 탄화 및 흑연화하는 단계를 포함하는,그라파이트 시트의 제조 방법.
- 제10항의 그라파이트 시트의 제조 방법에 의해서 제조되는,열확산 계수가 720 mm2/s 이상이고,발포 두께가 85 μm 이하인,그라파이트 시트.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280022207.1A CN117120522A (zh) | 2021-03-23 | 2022-03-22 | 石墨片用聚酰亚胺膜和由其制造的石墨片 |
JP2023555800A JP2024512437A (ja) | 2021-03-23 | 2022-03-22 | グラファイトシート用ポリイミドフィルムおよびこれから製造されたグラファイトシート |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2021-0037136 | 2021-03-23 | ||
KR1020210037136A KR102492197B1 (ko) | 2021-03-23 | 2021-03-23 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022203327A1 true WO2022203327A1 (ko) | 2022-09-29 |
Family
ID=83395952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2022/003935 WO2022203327A1 (ko) | 2021-03-23 | 2022-03-22 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2024512437A (ko) |
KR (1) | KR102492197B1 (ko) |
CN (1) | CN117120522A (ko) |
WO (1) | WO2022203327A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240077024A (ko) * | 2022-11-24 | 2024-05-31 | 피아이첨단소재 주식회사 | 첨가제를 포함하는 폴리이미드 필름 및 그로부터 제조된 그라파이트 시트 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109161197A (zh) * | 2018-08-24 | 2019-01-08 | 桂林电器科学研究院有限公司 | 一种高绝缘亚光黑色聚酰亚胺薄膜及其制备方法 |
KR20200065766A (ko) * | 2018-11-30 | 2020-06-09 | 에스케이씨코오롱피아이 주식회사 | 배향성이 우수한 폴리이미드 필름의 제조방법, 이로부터 제조되는 폴리이미드 필름 및 이를 이용하여 제조된 그라파이트 시트 |
WO2020218695A1 (ko) * | 2019-04-26 | 2020-10-29 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
WO2020262295A1 (ja) * | 2019-06-24 | 2020-12-30 | 株式会社カネカ | 透明ポリイミドフィルムおよびその製造方法 |
KR20210001738A (ko) * | 2019-06-28 | 2021-01-06 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이의 제조방법 |
KR102222571B1 (ko) * | 2019-10-28 | 2021-03-05 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
KR20210026053A (ko) * | 2019-08-29 | 2021-03-10 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 그 제조방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102125911B1 (ko) | 2015-10-29 | 2020-06-23 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 이의 제조방법 |
KR102144807B1 (ko) * | 2019-03-20 | 2020-08-18 | 한국화학연구원 | 폴리이미드 전구체의 전처리를 통한 탄소분자체막의 제조방법 및 이에 의해 제조된 탄소분자체막 |
KR20200125394A (ko) * | 2019-11-21 | 2020-11-04 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
-
2021
- 2021-03-23 KR KR1020210037136A patent/KR102492197B1/ko active IP Right Grant
-
2022
- 2022-03-22 CN CN202280022207.1A patent/CN117120522A/zh active Pending
- 2022-03-22 WO PCT/KR2022/003935 patent/WO2022203327A1/ko active Application Filing
- 2022-03-22 JP JP2023555800A patent/JP2024512437A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109161197A (zh) * | 2018-08-24 | 2019-01-08 | 桂林电器科学研究院有限公司 | 一种高绝缘亚光黑色聚酰亚胺薄膜及其制备方法 |
KR20200065766A (ko) * | 2018-11-30 | 2020-06-09 | 에스케이씨코오롱피아이 주식회사 | 배향성이 우수한 폴리이미드 필름의 제조방법, 이로부터 제조되는 폴리이미드 필름 및 이를 이용하여 제조된 그라파이트 시트 |
WO2020218695A1 (ko) * | 2019-04-26 | 2020-10-29 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
WO2020262295A1 (ja) * | 2019-06-24 | 2020-12-30 | 株式会社カネカ | 透明ポリイミドフィルムおよびその製造方法 |
KR20210001738A (ko) * | 2019-06-28 | 2021-01-06 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이의 제조방법 |
KR20210026053A (ko) * | 2019-08-29 | 2021-03-10 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 그 제조방법 |
KR102222571B1 (ko) * | 2019-10-28 | 2021-03-05 | 피아이첨단소재 주식회사 | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 |
Also Published As
Publication number | Publication date |
---|---|
CN117120522A (zh) | 2023-11-24 |
KR102492197B1 (ko) | 2023-01-27 |
JP2024512437A (ja) | 2024-03-19 |
KR20220132176A (ko) | 2022-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2014003451A1 (en) | Polyimide and polyimide film comprising the same | |
WO2019088454A1 (ko) | 초박막 블랙 폴리이미드 필름 및 이의 제조방법 | |
WO2019164068A1 (ko) | 구형의 pi계 필러를 포함하는 그라파이트 시트용 폴리이미드 필름, 이의 제조방법 및 이를 이용하여 제조되는 그라파이트 시트 | |
WO2019168245A1 (ko) | 그래핀 함유의 구형 pi계 필러를 포함하는 그라파이트 시트용 폴리이미드 필름, 이의 제조방법 및 이를 이용하여 제조되는 그라파이트 시트 | |
WO2010036049A2 (en) | Polyimide film | |
WO2020096259A1 (ko) | 치수 안정성이 향상된 초박막 폴리이미드 필름 및 이의 제조방법 | |
WO2020091432A1 (ko) | 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름 | |
WO2020262765A1 (ko) | 그라파이트 시트용 폴리이미드 필름 및 이의 제조방법 | |
WO2019160218A1 (ko) | 저장 안정성이 향상된 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 이로 제조된 폴리이미드 필름 | |
WO2020080598A1 (ko) | 표면 품질이 개선된 고후도 폴리이미드 필름 및 이의 제조방법 | |
WO2022203327A1 (ko) | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 | |
WO2021085851A1 (ko) | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 | |
WO2020101225A1 (ko) | 가교성 디안하이드라이드계 화합물 및 산화방지제를 포함하는 폴리이미드 전구체 조성물, 이로부터 제조된 폴리이미드 필름 | |
WO2022114852A1 (ko) | 그라파이트 시트용 폴리이미드 필름, 이의 제조방법 및 이로부터 제조된 그라파이트 시트 | |
WO2020218695A1 (ko) | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 | |
WO2020040527A1 (ko) | 결정성 폴리이미드 수지 및 열전도성 필러를 포함하는 폴리이미드 필름 및 이의 제조방법 | |
WO2020071588A1 (ko) | 폴리아미드이미드 필름의 제조방법 및 이로부터 제조되는 폴리아미드이미드 필름 | |
WO2020017692A1 (ko) | 점토 입자 및 카본 블랙을 포함하는 폴리이미드 필름 및 이의 제조방법 | |
WO2024010418A1 (ko) | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 | |
WO2020101122A1 (ko) | 고후도 그라파이트 시트의 제조방법 및 이를 이용하여 제조된 고후도 그라파이트 시트 | |
WO2020022564A1 (ko) | 방향족 카르복실산을 포함하는 폴리이미드 전구체 조성물 및 이를 이용하여 제조되는 폴리이미드 필름 | |
WO2021015363A1 (ko) | 그라파이트 시트 및 이를 포함한 전자 장치 | |
WO2019132185A1 (ko) | 불소계 수지를 포함하는 블랙 폴리이미드 필름 및 이의 제조방법 | |
WO2023090838A1 (ko) | 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트 | |
WO2020111529A1 (ko) | 배향성이 우수한 폴리이미드 필름으로부터 제조되는 그라파이트 시트 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22776028 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2023555800 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18282863 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2301005962 Country of ref document: TH |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22776028 Country of ref document: EP Kind code of ref document: A1 |