WO2022188847A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022188847A1
WO2022188847A1 PCT/CN2022/080264 CN2022080264W WO2022188847A1 WO 2022188847 A1 WO2022188847 A1 WO 2022188847A1 CN 2022080264 W CN2022080264 W CN 2022080264W WO 2022188847 A1 WO2022188847 A1 WO 2022188847A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
sub
board
dissipation area
electronic device
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Application number
PCT/CN2022/080264
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English (en)
French (fr)
Inventor
李能智
黄志军
姚彦青
Original Assignee
维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022188847A1 publication Critical patent/WO2022188847A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof

Definitions

  • the present application belongs to the technical field of electronic devices, and specifically relates to an electronic device.
  • the vapor chamber is usually in the middle frame of the electronic device.
  • the vapor chamber and the flexible circuit board are usually arranged side by side in the groove of the middle frame of the mobile phone.
  • this will result in poor heat dissipation capability of the vapor chamber, which in turn results in poor heat dissipation capability of the electronic device.
  • the purpose of the embodiments of the present application is to provide an electronic device, which can solve the problem that the heat dissipation capability of the vapor chamber is poor, which leads to the poor heat dissipation capability of the electronic device.
  • an embodiment of the present application provides an electronic device, the electronic device includes: a middle frame and a vapor chamber;
  • the middle frame is provided with cooling holes
  • the vapor chamber is provided with a first heat dissipation area and a second heat dissipation area, at least part of the first heat dissipation area is arranged around the second heat dissipation area, the first heat dissipation area is connected to the middle frame, and the The second heat dissipation area is disposed in the heat dissipation hole, and the second heat dissipation area is provided with a first groove for accommodating electronic devices;
  • the thickness of the soaking plate corresponding to the first heat dissipation area is smaller than the thickness of the soaking plate corresponding to the second heat dissipation area.
  • the first heat dissipation area and the second heat dissipation area are provided on the heat dissipation plate, and the thickness of the first heat dissipation area is smaller than the thickness of the second heat dissipation area, which is equivalent to setting the heat dissipation plate in an unequal thickness structure.
  • a first groove for accommodating electronic devices is arranged in the second heat dissipation area, thereby reducing the thickness of the electronic device, making the electronic device lighter and thinner, and increasing the heat dissipation area of the heat dissipation plate , thereby improving the heat dissipation capacity of electronic equipment.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Fig. 2 is the sectional structure schematic diagram of A-A direction in Fig. 1;
  • Fig. 3 is the enlarged view of C position in Fig. 2;
  • Fig. 4 is the enlarged view of D position in Fig. 2;
  • FIG. 5 is one of the structural schematic diagrams of the vapor chamber according to the embodiment of the present application.
  • FIG. 6 is the second structural schematic diagram of the vapor chamber according to the embodiment of the present application.
  • Fig. 7 is the sectional structure schematic diagram along the B-B direction in Fig. 6;
  • Fig. 8 is the enlarged view of E position in Fig. 7;
  • FIG. 9 is an enlarged view of the F position in FIG. 7 .
  • the electronic device described in the embodiments of the present application may be a smart phone, a computer, a multimedia player, an electronic reader, a wearable device, a video camera, and the like.
  • FIG. 1 a schematic structural diagram of an electronic device according to an embodiment of the present application is shown.
  • FIG. 2 a schematic diagram of a cross-sectional structure in the direction A-A in FIG. 1 is shown.
  • Figure 3 an enlarged view of position C in Figure 2 is shown.
  • FIG. 4 an enlarged view of position D in FIG. 2 is shown.
  • the electronic device may specifically include: a middle frame 10 and a heat soaking plate 20; the middle frame 10 is provided with heat dissipation holes 101; the heat soaking plate 20 is provided with a first heat dissipation area 21 and a second heat dissipation area 22, At least part of the first heat dissipation area 21 is disposed around the second heat dissipation area 22, and the first heat dissipation area 21 is connected to the middle frame 10.
  • the second heat dissipation area 22 is disposed in the heat dissipation hole 101, and the second heat dissipation area 22 is provided with a space for accommodating electronic The thickness of the first groove 23 of the device 30;
  • the middle frame 10 may be understood as a housing or a part of the housing of the electronic device, which is not limited in this embodiment of the present application.
  • the shape of the soaking plate 20 can be set according to the specific layout in the electronic device. Since the soaking plate 20 is similar to a plate-like structure, the shape of the soaking plate 20 can be easily set by machining It is an unconventional special-shaped structure (ie, non-rectangular, triangular and other conventional shapes), so that the area of the vapor chamber 20 can be effectively increased, thereby improving the heat dissipation capability of the electronic device.
  • the thickness of the vapor chamber 20 corresponding to the first heat dissipation area 21 is smaller than the thickness of the vapor chamber 20 corresponding to the second heat dissipation area 22 , which is equivalent to setting the vapor chamber 20 as an unequal thickness structure with thin edges.
  • the thickness of the first heat dissipation area 21 connected to the middle frame 10 is thin, so that the thickness of the connection between the vapor chamber 20 and the middle frame 10 can be effectively reduced, and the overall thickness of the electronic device can be reduced.
  • heat dissipation holes 101 are provided on the middle frame 10 to separate the second heat dissipation area 22 It is arranged in the heat dissipation hole 101 , so that the thickness of the stacking of the middle frame 10 and the soaking plate 20 can be effectively reduced, thereby reducing the thickness of the electronic device.
  • the heat dissipation holes 101 may be set as stepped holes, and the first heat dissipation area 21 passes through It is fixed on the stepped surface of the stepped hole by bonding or welding.
  • the first heat dissipation area 21 can be overlapped on the middle frame 10 , and the first heat dissipation area 21 and the middle frame 10 are connected by bonding or welding. In this way, since there is a sufficient contact area between the first heat dissipation area 21 and the middle frame 10 , the strength between the first heat dissipation area 21 and the middle frame 10 is strong whether it is bonded or welded.
  • the first heat dissipation area 21 is disposed at least partially around the circumference of the second heat dissipation area 22 , that is, it can be understood that the first heat dissipation area 21 is disposed along the circumferential edge of the second heat dissipation area 22 .
  • the thickness of the first heat dissipation area 21 is thinner than that of the second heat dissipation area 22, it can also effectively dissipate heat.
  • the first heat dissipation area 21 can be arranged as a ring-shaped area around the circumferential edge of the middle frame 10 according to the internal space of the electronic device, or can be formed in an "L" shape, a "U” shape or arranged on opposite sides of the middle frame 10, Those skilled in the art can set according to the actual situation, which is not limited in the embodiments of the present application.
  • the thickness of the first heat dissipation area 21 is smaller than the thickness of the second heat dissipation area 22 , which can effectively reduce the thickness of the connection between the first heat dissipation area 21 and the middle frame 10 , and save the heat soaking plate 20 occupying the middle frame 10 .
  • the space volume is small, and a larger setting space is reserved for other devices in the electronic device.
  • bonding can be understood as bonding by glue or double-sided tape, and those skilled in the art can select and set according to actual conditions, which are not limited in the embodiments of the present application.
  • the soaking plate 20 can be made of high-strength materials, including but not limited to stainless steel plate, zirconium alloy plate, nickel alloy plate, titanium alloy plate, chrome alloy plate, and the like. In practical applications, the soaking plate 20 can be formed by any one or more of the above-mentioned combinations, so as to improve the strength of the soaking plate 20, improve the anti-deformation ability of the soaking plate 20, and improve the heat dissipation caused by the easy deformation of the soaking plate 20. performance failure problem. In the embodiment of the present application, the soaking plate 20 is designed with an unequal thickness structure, and is also made of the above-mentioned high-strength materials.
  • the middle frame 10 does not need to support the soaking plate 20 in a large area, so that the soaking plate 20 can be placed on the soaking plate 20.
  • the thicker and stronger second heat dissipation area 22 is disposed in the heat dissipation hole 101 of the middle frame 10, so that the increase in the thickness of the electronic device can be effectively avoided.
  • the internal structure of the electronic device can be made more compact, thereby effectively reducing the volume of the electronic device and making the electronic device more lightweight .
  • the electronic device 30 may include, but is not limited to, a flexible circuit board, a main board, a sub-board and other devices. In the embodiments of the present application, only a flexible circuit board is used as an example for explanation, and other references may be used for execution.
  • the second heat dissipation area 22 is provided with the first groove 23 for accommodating the electronic device 30, so that the electronic device 30 such as the flexible circuit board can be placed in the first groove 23, which is compared with the traditional uniform.
  • the area of the heat soaking plate 20 can be effectively increased, and the heat dissipation capability of the heat soaking plate 20 can be effectively improved.
  • FIG. 5 it shows one of the structural schematic diagrams of the heat soaking plate according to the embodiment of the present application.
  • FIG. 6 the second schematic diagram of the structure of the heat soaking plate according to the embodiment of the present application is shown.
  • FIG. 7 a schematic cross-sectional structure diagram along the B-B direction in FIG. 6 is shown.
  • Figure 8 an enlarged view of position E in Figure 7 is shown.
  • Figure 9 an enlarged view of the position F in Figure 7 is shown.
  • the vapor chamber 20 may specifically include: a first sub-board 201 and a second sub-board 202; the first sub-board 201 includes a connecting wall 2011 and a sub-board main body 2012, and the connecting wall 2011 at least partially surrounds the sub-board main body 2012 Setting, the thickness of the connecting wall 2011 is smaller than the thickness of the sub-board main body 2012, the connecting wall 2011 forms the first heat dissipation area 21 and is connected with the middle frame 10; the second sub-board 202 is covered on the sub-board main body 2012 to form the second heat dissipation area 22 , and is disposed in the heat dissipation hole 101 ; the first groove 23 is disposed on the side of the second sub-board 202 away from the first sub-board 201 .
  • the first sub-board 201 and the second sub-board 202 of the vapor chamber 20 may be sealed by edge welding, thereby increasing the connection strength between the first sub-board 201 and the second sub-board 202 .
  • the first heat dissipation area 21 is formed by the connecting wall 2011, which means that the connecting wall 2011 is connected to the middle frame 10. Since the thickness of the connecting wall 2011 is relatively small, the connection portion between the connecting wall 2011 and the middle frame 10 is relatively small. The thickness can also be effectively reduced, and the thickness of the electronic device can be made thinner and lighter.
  • the second sub-board 202 by arranging the second sub-board 202 to cover the sub-board main body 2012 of the first sub-board 201, since the thickness of the sub-board main body 2012 is greater than the thickness of the connecting wall 2011, the sub-board main body 2012 corresponds to the thickness of the connecting wall 2011.
  • the area can be the same as that of the second sub-board 202 , and the sub-board main body 2012 can play a guiding and limiting role for the installation of the second sub-board 202 , so that the assembly of the second sub-board 202 and the first sub-board 201 can be fixed. Simpler.
  • the connecting wall 2011 and the sub-board main body 2012 can be integrally formed, so that the strength of the first sub-board 201 is better.
  • the thickness of the connecting wall 2011 is smaller than the thickness of the sub-board main body 2012 , that is, the first sub-board 201 is set to a structure in which the edge is thin and the middle is thick.
  • the area corresponding to the connecting wall 2011 on the first sub-board 201 may be thinned by etching or numerical control machining (CNC machining).
  • CNC machining numerical control machining
  • the shape design of the connecting wall 2011 can be made more flexible and the machining accuracy is higher through CNC machining.
  • the thickness of the connecting wall 2011 corresponding to the first sub-board 201 may be any value between 0.1 mm and 0.2 mm.
  • connection wall 2011 or the first heat dissipation area 21 and the middle frame 10 can be connected by means of glue, double-sided tape or welding, which is simple, convenient and efficient.
  • the first groove 23 is disposed on the side of the second sub-board 202 away from the first sub-board 201 .
  • the sub-board 202 extends to the first sub-board 201 .
  • the area of the second sub-board 202 corresponding to the first groove 23 can be directly cut off. Since the second sub-board 202 and the first sub-board 201 are stacked, it is equivalent to that the first groove 23 is Taking the first sub-board 201 as the groove bottom and the second sub-board 202 as the groove formed by the groove wall, the depth of the first groove 23 is equal to the thickness of the second sub-board 202 . In this way, the processing of the first groove 23 is simpler, the cost is lower, and the precision is higher.
  • a thinning design may also be performed in the area of the first sub-board 201 corresponding to the first groove 23 , that is, the first sub-board 201 may be thinned.
  • the groove 23 extends from the second sub-board 202 to the first sub-board 201 .
  • the region of the first sub-board 201 corresponding to the first groove 23 may be realized by etching or numerical control machining.
  • the thickness of the region corresponding to the first groove 23 of the first sub-board 201 can be set to be 0.15 mm to 0.25 mm. In this way, the volume of the first groove 23 is larger, which is beneficial for the flexible circuit board to be placed in the first groove 23 assembly settings.
  • the area between the first groove 23 and the connecting wall 2011 on the vapor chamber 20 may also be hollowed out to improve the heat dissipation performance of the vapor chamber 20 .
  • a second groove 2013 is also provided on the side of the sub-board main body 2012 close to the second sub-board 202; the second groove 2013 and the second sub-board 202 form an accommodation cavity 203, and the accommodation cavity 203 is used for accommodating capillary heat dissipation structure to improve heat dissipation.
  • capillary heat dissipation structures such as copper meshes and copper wires in the accommodating cavity 203 , the heat dissipation performance of the vapor chamber 20 can be effectively improved. Since the thickness of the sub-board main body 2012 of the first sub-board 201 is relatively thick, the processing of the second groove 2013 may be relatively simple, and may be realized by etching or numerical control machining.
  • a third groove 2021 may be provided on the second sub-board 202 at a position opposite to the second groove 2013 .
  • the grooves 2013 communicate with each other to form the accommodating cavity 203 .
  • the volume of the accommodating cavity 203 is larger and can accommodate more capillary heat dissipation structures such as copper mesh or copper wire, which can improve the thermal conductivity of the vapor chamber 20 and is more conducive to the heat dissipation of electronic equipment.
  • the electronic device described in the embodiments of the present application at least includes the following advantages:
  • the first heat dissipation area and the second heat dissipation area are provided on the heat dissipation plate, and the thickness of the first heat dissipation area is smaller than the thickness of the second heat dissipation area, which is equivalent to setting the heat dissipation plate in an unequal thickness structure.
  • a first groove for accommodating electronic devices is arranged in the second heat dissipation area, thereby reducing the thickness of the electronic device, making the electronic device lighter and thinner, and increasing the heat dissipation area of the heat dissipation plate , thereby improving the heat dissipation capacity of electronic equipment.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开了一种电子设备，涉及电子设备技术领域。所述电子设备具体包括：中框和均热板；所述中框上设有散热孔；所述均热板上设有第一散热区和第二散热区，至少部分所述第一散热区围绕所述第二散热区设置，且所述第一散热区与所述中框相连，所述第二散热区设置于所述散热孔内，所述第二散热区上设有用于容纳电子器件的第一凹槽；所述均热板对应所述第一散热区的厚度小于所述均热板对应所述第二散热区的厚度。本申请实施例中，既减小了电子设备的厚度，使电子设备更加轻薄，又提升了散热板的散热面积，进而提升了电子设备的散热能力。

Description

电子设备
相关申请的交叉引用
本申请要求于2021年3月12日提交的申请号为2021102723429，发明名称为“电子设备”的中国专利申请的优先权，其通过引用方式全部并入本申请。
技术领域
本申请属于电子设备技术领域，具体涉及一种电子设备。
背景技术
随着电子技术的高速发展，电子设备已经成为人们日常生活中不可或缺的工具。在使用电子设备的过程中，电子设备经常会发热，一旦热量不能快速散发，就会影响电子设备的性能，因此，在电子设备中通常设有均热板等装置，以提升电子设备的散热能力。
相关技术中，均热板通常在电子设备的中框内。同时，为了避免均热板与连接主板的柔性电路板叠设导致电子设备的厚度增加，通常将均热板和柔性电路板以并排平铺的方式设置于手机中框的凹槽内。然而，这样就会导致均热板的散热能力较差，进而导致电子设备的散热能力也较差。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决均热板散热能力较差进而导致电子设备散热能力差的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种电子设备，所述电子设备包括：中框和均热板；
所述中框上设有散热孔；
所述均热板上设有第一散热区和第二散热区，至少部分所述第一散热区围绕所述第二散热区设置，所述第一散热区与所述中框相连，所述第二散热区设置于所述散热孔内，所述第二散热区上设有用于容纳电子器件的第一凹槽；
所述均热板对应所述第一散热区的厚度小于所述均热板对应所述第二散热区的厚度。
在本申请实施例中，通过散热板上设有第一散热区和第二散热区，第一散热区的厚度小于第二散热区的厚度，即相当于将散热板设置为不等厚结构，并在第二散热区设置用于容纳电子器件(例如，柔性电路板等)的第一凹槽，从而既减小了电子设备的厚度，使电子设备更加轻薄，又提升了散热板的散热面积，进而提升了电子设备的散热能力。
附图说明
图1是本申请实施例所述电子设备的结构示意图；
图2是图1中A-A方向的剖面结构示意图；
图3是图2中C位置的放大图；
图4是图2中D位置的放大图；
图5是本申请实施例所述均热板的结构示意图之一；
图6是本申请实施例所述均热板的结构示意图之二；
图7是图6中沿B-B方向的剖面结构示意图；
图8是图7中E位置的放大图；
图9是图7中F位置的放大图。
附图标记说明：
10：中框；20：均热板；30：电子器件；101：散热孔；21：第一散热区；22：第二散热区；23：第一凹槽；201：第一子板；202：第二子板；2011：连接壁；2012：子板主体；2013：第二凹槽；2021：第三凹槽；203： 容纳腔。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
本申请实施例所述的电子设备可以为智能手机、电脑、多媒体播放器、电子阅读器、可穿戴式设备、摄像机等。
参照图1，示出了本申请实施例所述电子设备的结构示意图。参照图2，示出了图1中A-A方向剖面结构示意图。参照图3，示出了图2中C位置的放大图。参照图4，示出了图2中D位置的放大图。
本申请实施例中，电子设备具体可以包括：中框10和均热板20；中框10上设有散热孔101；均热板20上设有第一散热区21和第二散热区22，至少部分第一散热区21围绕第二散热区22设置，且第一散热区21与中框10相连，第二散热区22设置于散热孔101内，第二散热区22上设有用于容纳电子器件30的第一凹槽23；均热板20对应第一散热区21的厚度小于均热板20对应第二散热区22的厚度。
需要说明的是，在一部分电子设备中，中框10可以理解为电子设备的壳体或者壳体的一部分，本申请实施例对此不作限定。
本申请实施例中，均热板20的形状可以根据电子设备内的具体布局设置，由于均热板20为类似于板状结构，因此，均热板20的形状可以通过机加工很容易的设置为非常规的异形结构(即非矩形、三角形等常规形状)，这样，就可以使均热板20的面积有效增大，进而提升电子设备的散热能力。
本申请实施例中，均热板20对应第一散热区21的厚度小于均热板20对应第二散热区22的厚度，即相当于将均热板20设置为边缘薄的不等厚结构。在实际应用中，将与中框10相连的第一散热区21的厚度做薄，从而可以有效减小均热板20与中框10连接处的厚度，减薄电子设备的整体厚度。
在实际应用中，为了避免中框10与均热板20直接叠设导致电子设备厚度增加的问题，本申请实施例中，通过在中框10上设置散热孔101，以将第二散热区22设置于散热孔101内，这样可以有效减小中框10与均热板20叠设的厚度，进而减小电子设备厚度。
本申请实施例中，为了简化中框10与均热板20的连接难度，提升中框10与均热板20之间的连接强度，散热孔101可以设置为台阶孔，第一散热区21通过粘接或焊接等方式固定于台阶孔的台阶面上。如图4所示，可以将第一散热区21搭接于中框10上，第一散热区21与中框10之间通过粘接或焊接等方式连接。这样，由于第一散热区21与中框10之间具有足够的接触面积，因此，第一散热区21与中框10之间无论是粘接还是焊接，其强度都较强。
本申请实施例中，第一散热区21至少部分围绕第二散热区22的周向设置，即可以理解为第一散热区21沿第二散热区22的周向边缘设置。在实际应用中，第一散热区21虽然相较于第二散热区22厚度较薄，但是也可以进行有效散热。第一散热区21可以根据电子设备内部空间，围绕中 框10的周向边缘设置为环状区域，也可以形成“L”型、“U”型或者设置于中框10相对的两侧边，本领域技术人员可以根据实际情况设定，本申请实施例不作限定。
本申请实施例中，第一散热区21的厚度小于第二散热区22的厚度，可以有效减小第一散热区21与中框10相连接的厚度，节省均热板20占用中框10内的空间体积，给电子设备内的其他器件预留更大的设置空间。
本申请实施例中，粘接可以理解为通过胶水粘接或者双面胶粘接，本领域技术人员可以根据实际情况选择设定，本申请实施例对此不作限定。
本申请实施例中，均热板20可以采用高强度材料制作，包括但不限于不锈钢板、锆合金板、镍合金板、钛合金板、铬合金板等。在实际应用中，均热板20可以由上述任意一种或多种组合的方式形成，从而在提升均热板20强度，提升均热板20抗变形能力，改善均热板20易变形导致散热性能失效的问题。本申请实施例中，均热板20采用不等厚结构设计，并且还采用上述高强度材料制作，因此，中框10无需对均热板20进行大面积支撑，从而可以将均热板20上厚度较厚、强度较强的第二散热区22设置于中框10的散热孔101中，这样就可以有效避免电子设备厚度的增加。
本申请实施例中，通过在第二散热区22设置用于容纳电子器件30的第一凹槽23，可以使电子设备内部结构更加紧凑，从而有效减小电子设备体积，使电子设备更加轻巧化。具体的，电子器件30可以包括但不限于柔性电路板、主板、副板等器件，本申请实施例中仅以柔性电路板为例进行解释说明，其他参照执行即可。
本申请实施例中，在第二散热区22上设置容纳电子器件30的第一凹槽23，以便于将柔性电路板等电子器件30设置于第一凹槽23中，相较于传统的均热板20与柔性电路板并排平铺的方式，本申请实施例中，均热板20的面积可以有效增大，进而均热板20的散热能力可以有效提升。
参照图5，示出了本申请实施例所述均热板的结构示意图之一。参照 图6，示出了本申请实施例所述均热板的结构示意图之二。参照图7，示出了图6中沿B-B方向的剖面结构示意图。参照图8，示出了图7中E位置的放大图。参照图9，示出了图7中F位置的放大图。
本申请实施例中，均热板20具体可以包括：第一子板201和第二子板202；第一子板201包括连接壁2011和子板主体2012，连接壁2011至少部分围绕子板主体2012设置，连接壁2011的厚度小于子板主体2012的厚度，连接壁2011形成第一散热区21，且与中框10相连；第二子板202盖设于子板主体2012上形成第二散热区22，且设置于散热孔101内；第一凹槽23设置于第二子板202远离第一子板201的侧面上。
本申请实施例中，均热板20的第一子板201和第二子板202可以通过边缘焊接密封，从而使第一子板201和第二子板202之间的连接强度增加。可以理解的是，由连接壁2011形成第一散热区21，也就相当于连接壁2011与中框10相连，由于连接壁2011的厚度较小，因此，连接壁2011与中框10连接部位的厚度也可以有效减小，电子设备的厚度可以更加轻薄化。
本申请实施例中，通过设置第二子板202盖设于第一子板201的子板主体2012上，由于子板主体2012的厚度大于连接壁2011的厚度，因此，子板主体2012对应的面积可以与第二子板202的面积相同，子板主体2012可以对第二子板202的安装起到导向限位的作用，这样可以使第二子板202与第一子板201的组装固定更加简单。
在实际应用中，连接壁2011与子板主体2012可以为一体成型结构，从而使第一子板201的强度更好。连接壁2011的厚度小于子板主体2012的厚度，即相当于第一子板201设置为边缘薄中间厚的结构。第一子板201上对应连接壁2011区域可以通过蚀刻或数控加工(CNC加工)等方式实现减薄加工。在实际应用中，由于数控加工精度更高，且适用于各种形状尺寸，因此，通过数控加工可以使连接壁2011的形状设计更加灵活、加工精度也更高。可选地，第一子板201对应的连接壁2011的厚度可以为 0.1mm～0.2mm中的任意值。
本申请实施例中，连接壁2011或者说是第一散热区21与中框10之间可以通过胶水、双面胶或焊接等方式进行连接，简单方便、效率高。
本申请实施例中，第一凹槽23设置于第二子板202远离第一子板201的侧面上，第一凹槽23可以贯穿第二子板202，或第一凹槽23由第二子板202延伸至第一子板201上。在实际加工过程中，可以直接将第二子板202对应第一凹槽23区域切除，由于第二子板202与第一子板201叠放，因此，也就相当于第一凹槽23是以第一子板201为槽底、第二子板202为槽壁形成的凹槽，第一凹槽23的深度等于第二子板202的厚度。这样，第一凹槽23的加工更加简单，成本更低，精度更高。
本申请实施例中，为了使第一凹槽23可以容纳更多器件包括但不限于柔性电路板，还可以在第一子板201对应第一凹槽23的区域进行减薄设计，即第一凹槽23由第二子板202延伸至第一子板201上。在实际应用中，第一子板201对应第一凹槽23的区域可以通过蚀刻或数控加工等方式实现。具体的，可以设置第一子板201对应第一凹槽23区域的厚度为0.15mm～0.25mm，这样，第一凹槽23的体积更大，有利于柔性电路板在第一凹槽23内的组装设置。
在实际应用中，均热板20上第一凹槽23与连接壁2011之间的区域还可以进行掏空设计，以提升均热板20的散热性能。具体的，子板主体2012上靠近第二子板202的侧面上还设有第二凹槽2013；第二凹槽2013与第二子板202形成容纳腔203，容纳腔203用于容纳毛细散热结构以提升散热能力。本申请实施例中，通过在容纳腔203内设置铜网和铜线等毛细散热结构，从而可以有效提升均热板20的散热性能。由于第一子板201的子板主体2012位置的厚度较厚，因此，第二凹槽2013的加工可以较为简单，可以通过蚀刻或者数控加工等方式实现。
本申请实施例中，为了进一步增大容纳腔203的体积，还可以在第二子板202上与第二凹槽2013相对的位置设有第三凹槽2021，第三凹槽2021 与第二凹槽2013相连通以形成容纳腔203。在实际应用中，容纳腔203的体积更大，可以容纳更多的铜网或铜丝等毛细散热结构，可以使均热板20的导热性能更好，更有利于电子设备的散热。
综上，本申请实施例所述的电子设备至少包括以下优点：
在本申请实施例中，通过散热板上设有第一散热区和第二散热区，第一散热区的厚度小于第二散热区的厚度，即相当于将散热板设置为不等厚结构，并在第二散热区设置用于容纳电子器件(例如，柔性电路板等)的第一凹槽，从而既减小了电子设备的厚度，使电子设备更加轻薄，又提升了散热板的散热面积，进而提升了电子设备的散热能力。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备，包括：中框和均热板；
    所述中框上设有散热孔；
    所述均热板上设有第一散热区和第二散热区，至少部分所述第一散热区围绕所述第二散热区设置，所述第一散热区与所述中框相连，所述第二散热区设置于所述散热孔内，所述第二散热区上设有用于容纳电子器件的第一凹槽；
    所述均热板对应所述第一散热区的厚度小于所述均热板对应所述第二散热区的厚度。
  2. 根据权利要求1所述的电子设备，其中，所述均热板包括：第一子板和第二子板；
    所述第一子板包括连接壁和子板主体，至少部分所述连接壁围绕所述子板主体设置，所述连接壁的厚度小于所述子板主体的厚度，所述连接壁形成所述第一散热区，且与所述中框相连；
    所述第二子板盖设于所述子板主体上，所述第二子板形成所述第二散热区，且设置于所述散热孔内；
    所述第一凹槽设置于所述第二子板远离所述第一子板的侧面上。
  3. 根据权利要求2所述的电子设备，其中，所述第一凹槽贯穿所述第二子板，或所述第一凹槽由所述第二子板延伸至所述第一子板上。
  4. 根据权利要求2所述的电子设备，其中，所述连接壁与所述子板主体为一体成型结构。
  5. 根据权利要求2所述的电子设备，其中，所述子板主体上靠近所述第二子板的侧面上还设有第二凹槽；
    所述第二凹槽与所述第二子板形成容纳腔，所述容纳腔用于容纳散热结构。
  6. 根据权利要求5所述的电子设备，其中，所述第二子板上与所述第二凹槽相对的位置设有第三凹槽，所述第三凹槽与所述第二凹槽相连通 以形成所述容纳腔。
  7. 根据权利要求2所述的电子设备，其中，所述连接壁的厚度为0.1mm～0.2mm。
  8. 根据权利要求2所述的电子设备，其中，所述第一子板对应所述第一凹槽区域的厚度为0.15mm～0.25mm。
  9. 根据权利要求1所述的电子设备，其中，所述散热孔为台阶孔，所述第一散热区粘接或焊接于所述台阶孔的台阶面上。
  10. 根据权利要求1所述的电子设备，其中，所述均热板为不锈钢板、锆合金板、镍合金板、钛合金板、铬合金板中的至少一种。
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