WO2021120948A1 - 扬声器模组和电子设备 - Google Patents

扬声器模组和电子设备 Download PDF

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Publication number
WO2021120948A1
WO2021120948A1 PCT/CN2020/129108 CN2020129108W WO2021120948A1 WO 2021120948 A1 WO2021120948 A1 WO 2021120948A1 CN 2020129108 W CN2020129108 W CN 2020129108W WO 2021120948 A1 WO2021120948 A1 WO 2021120948A1
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WO
WIPO (PCT)
Prior art keywords
heat
plate
heat dissipation
housing
conducting
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PCT/CN2020/129108
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English (en)
French (fr)
Inventor
郭翔
刘磊
王海荣
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歌尔股份有限公司
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021120948A1 publication Critical patent/WO2021120948A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details

Definitions

  • the present invention relates to the technical field of sound energy conversion, in particular to a speaker module and electronic equipment.
  • the speaker module is an important acoustic component of portable electronic equipment. It is used to complete the conversion between electrical and acoustic signals. In order to achieve better sound reproduction in a small cavity space, SmartPA ( Smart power amplifier) and tuning algorithm, but in the process of Smart PA application, the speaker module will work for a long time under high power conditions, which will increase the heat generated by the speaker module.
  • the current speaker module mainly passes through the housing The sound hole on the upper side is used for heat dissipation, and the heat dissipation effect is poor. The high temperature in the speaker module cannot be effectively conducted and emitted, and the risk of the voice coil of the speaker module is relatively high.
  • the main purpose of the present invention is to provide a loudspeaker module, which aims to improve the heat dissipation capacity of the loudspeaker module.
  • the speaker module provided by the present invention includes:
  • the speaker unit is arranged in the receiving cavity, and the receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity.
  • the speaker unit includes a single housing and a magnetic circuit system provided on the single housing.
  • the single housing includes a heat-conducting part connected to the magnetic circuit system; and,
  • the heat dissipating element includes a heat dissipating plate and a heat conducting plate connected to the heat dissipating plate.
  • the heat dissipating plate is arranged on the outer surface of the module housing.
  • the heat conducting plate penetrates the module housing and is connected to the heat conducting part. Thermal connection.
  • the front acoustic cavity has a heat dissipation opening
  • the vibration system of the speaker unit is opposite to the heat dissipation opening
  • the heat dissipation plate covers the heat dissipation opening
  • the heat dissipation plate and the module housing are integrally molded; or, the heat dissipation plate is adhered to the module housing.
  • the module housing has a side wall, and the side wall is formed with a sound outlet communicating with the front acoustic cavity;
  • the heat dissipation plate has a first side edge facing the side wall, and the first side edge Two second side edges connected by one side edge, and a third side edge opposite to the first side edge, at least one of the third side edge and the two second side edges is provided with the heat conducting plate .
  • a heat-conducting medium is filled between the heat-conducting part and the heat-conducting plate.
  • the heat dissipation plate and the heat conduction plate are integrally formed.
  • the magnetic circuit system includes a magnetically conductive yoke, a side magnet provided on the magnetically conductive yoke, and a side magnetic conductive plate provided on the upper end of the side magnet; the heat conducting part is ring-shaped, and the speaker A single vibration system is connected to one end of the heat conduction part, and the side magnetic conductive plate is connected to the other end of the heat conduction part, and is integrally formed with the heat conduction part.
  • the magnetic circuit system includes a magnetic conductive yoke, a side magnet provided on the magnetic conductive yoke, and a side magnetic conductive plate provided on the upper end of the side magnet; the heat conductive plate faces the magnetic conductive yoke Extending in a direction, the heat conducting plate is also thermally conductively connected to the outer peripheral surface of one of the magnetic yoke, the side magnet and the side magnetic conductive plate.
  • a flexible deformable portion is provided on the module housing corresponding to the rear acoustic cavity
  • the speaker module further includes an electronic device housing, and a closed cavity is formed between the electronic device housing and the module housing, The electronic device housing isolates the sound generated by the flexible deformable part from the sound emitted by the speaker unit through the front sound cavity;
  • the module housing is provided with a communication port communicating with the closed cavity, so The communication port is opposite to the flexible deformable portion;
  • the speaker module further includes a heat dissipation cover plate located at the communication port, and the heat dissipation cover plate is provided with a heat dissipation through hole.
  • the present invention also provides an electronic device.
  • the electronic device includes a speaker module.
  • the speaker module includes a module housing, a speaker unit, and a heat sink.
  • the module housing has a receiving cavity.
  • the speaker unit is arranged in the receiving cavity, and the receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity.
  • the speaker unit includes a single housing and a magnetic circuit system provided on the single housing, so
  • the single housing includes a heat-conducting part, and the heat-conducting part is connected with the magnetic circuit system.
  • the heat dissipation element includes a heat dissipation plate and a heat conduction plate connected to the heat dissipation plate.
  • the heat dissipation plate is provided on the outer surface of the module housing.
  • the heat conduction plate penetrates the module housing and communicates with the heat conduction plate. Department of thermal conduction connection.
  • the technical scheme of the present invention is provided with a heat conduction part on the single housing of the speaker unit, and connects the heat conduction part with the magnetic circuit system, so that the heat in the magnetic circuit system can be conducted to the heat conduction part, and then is arranged on the module housing
  • the heat dissipation plate and the heat conduction plate are arranged on the outer surface of the module housing.
  • One end of the heat conduction plate is connected with the heat dissipation plate, and the other end penetrates the module housing and is thermally connected to the heat conduction part. So that the heat in the magnetic circuit system can be sequentially conducted from the heat conducting part and the heat conducting plate to the heat sink, and then radiated from the exposed surface of the heat sink.
  • heat conduction is carried out by setting a heat conduction part and a heat conduction plate, and then heat is dissipated through a heat dissipation plate.
  • the heat conduction effect of the heat conduction part and the heat conduction plate is better, which can effectively connect the magnetic circuit
  • the heat of the system is conducted to the heat sink for heat dissipation, which can reduce the temperature in the speaker unit by at least 5°C, which improves the heat dissipation capacity of the speaker module.
  • Fig. 1 is a schematic structural diagram of an embodiment of a speaker module of the present invention
  • Fig. 2 is a schematic cross-sectional view in the X-X direction in Fig. 1;
  • Figure 3 is an enlarged view of A in Figure 2;
  • Fig. 4 is a schematic cross-sectional view in the Y-Y direction in Fig. 1;
  • Figure 5 is an enlarged view of B in Figure 4.
  • FIG. 6 is a schematic diagram of the structure of the speaker unit in the speaker module of the present invention.
  • Fig. 7 is an enlarged view of C in Fig. 4.
  • the directional indication is only used to explain that it is in a specific posture (as shown in the drawings). If the specific posture changes, the relative positional relationship, movement, etc. of the components below will also change the directional indication accordingly.
  • the present invention provides a speaker module, which can be used in electronic devices capable of producing sound such as earphones and mobile phones.
  • the speaker module includes a module housing 10, a speaker unit 20 and a heat sink 50.
  • the module housing 10 has a receiving cavity 11.
  • the speaker unit 20 is arranged in the housing cavity 11, and the housing cavity 11 is divided into a front acoustic cavity 111 and a rear acoustic cavity 112.
  • the speaker unit 20 includes a unit housing 21 and a magnetic circuit system 22 and a vibration system provided in the unit housing 21 23.
  • the single housing 21 includes a heat-conducting part 211, and the heat-conducting part 211 is connected to the magnetic circuit system 22.
  • the heat sink 50 includes a heat dissipation plate 51 and a heat conduction plate 52 connected to the heat dissipation plate 51.
  • the heat dissipation plate 51 is disposed on the outer surface of the module housing 10.
  • the heat conduction plate 52 penetrates the module housing 10 and is thermally connected to the heat conduction portion 211.
  • the vibration system 23 includes a diaphragm 231 and a voice coil 232 fixed on one side of the diaphragm 231.
  • the magnetic circuit system 22 includes a magnetically conductive yoke 221.
  • the magnetically conductive yoke 221 is provided with an inner magnetic circuit part and an outer magnetic circuit part, and a magnetic gap for accommodating the voice coil 232 is formed between the two.
  • the inner magnetic circuit part includes a central magnet 224 arranged at the center of the magnetic yoke 221 and a central magnetic plate arranged on the central magnet 224
  • the outer magnetic circuit part includes a central magnet arranged on the magnetic yoke 221.
  • the side magnet 223 at the edge position and the side magnetic conductive plate 222 provided on the side magnet 223.
  • the heat dissipation plate 51 is exposed on the outer surface of the module housing 10, and the number of the heat dissipation plate 51 may be one or more.
  • the number of the heat dissipation plate 51 may be two, and the two heat dissipation plates 51 are respectively Corresponding to the positions of the front acoustic cavity 111 and the rear acoustic cavity 112.
  • the heat in the accommodating cavity 11 is conducted to the heat dissipation plate 51 via the heat conducting plate 52, the heat can be radiated from the exposed surface of the heat dissipation plate 51, thereby achieving a heat dissipation effect.
  • the material of the heat conducting portion 211 may be metal, heat conducting plastic or composite heat conducting material.
  • the heat conduction plate 52 and the heat conduction portion 211 are thermally connected to guide the heat of the heat conduction portion 211 to be conducted to the heat conduction board 52.
  • the specific method includes, but is not limited to, directly abutting the heat conduction board 52 and the heat conduction portion 211, or the heat conduction board 52 and the heat conduction portion 211 There is a heat transfer medium 60 and so on between.
  • a heat conducting part 211 is provided on the unit housing 21 of the speaker unit 20, and the heat conducting part 211 is connected to the magnetic circuit system 22, so that the heat in the magnetic circuit system 22 can be conducted to the heat conducting part 211,
  • a heat dissipation plate 51 and a heat conduction plate 52 are then arranged on the module housing 10, and the heat dissipation plate 51 is arranged on the outer surface of the module housing 10.
  • One end of the heat conduction plate 52 is connected to the heat dissipation plate 51, and the other end penetrates the module housing 10, and It is thermally connected to the heat conducting part 211.
  • the heat in the magnetic circuit system 22 can be sequentially conducted from the heat conducting portion 211 and the heat conducting plate 52 to the heat dissipation plate 51, and then radiated from the exposed surface of the heat dissipation plate 51.
  • the heat conduction part 211 and the heat conduction plate 52 are provided for heat conduction, and then the heat dissipation plate 51 is used for heat dissipation.
  • the heat conduction part 211 and the heat conduction plate 52 have a better heat conduction effect.
  • the heat of the magnetic circuit system 22 can be effectively conducted to the heat dissipation plate 51 for heat dissipation, and the temperature in the speaker unit 20 can be reduced by at least 5° C., and the heat dissipation capability of the speaker module can be improved. It can effectively reduce the excessively high temperature in the speaker unit 20, which causes the Smart PA (Smart Power Amplifier) temperature protection mechanism to be triggered and lower the input voltage, resulting in the possibility of poor playback sound quality, and also reduces the voice coil of the speaker unit 20 232 Circle burning risk.
  • Smart PA Smart Power Amplifier
  • part of the heat can also be radiated out through the sound hole 12, which is equivalent to the ability to dissipate heat through the heat dissipation plate 51 on the basis of heat dissipation through the sound hole 12.
  • the heat dissipation of the speaker module More capable.
  • the front acoustic cavity 111 has a heat dissipation opening
  • the vibration system 23 of the speaker unit 20 is opposite to the heat dissipation opening
  • the heat dissipation plate 51 covers the heat dissipation opening.
  • the heat dissipation opening is provided on the cavity wall opposite to the diaphragm 231, which is equivalent to that the heat dissipation plate 51 can directly contact the heat in the front acoustic cavity 111, so that the heat in the front acoustic cavity 111 can be conducted and radiated through the heat dissipation plate 51.
  • the heat dissipation plate 51 is made of metal material, so the strength of the heat dissipation plate 51 is relatively high, and the thickness of the heat dissipation plate 51 can be set to be thinner, so that the space of the front acoustic cavity 111 can be increased, or the speaker mold can be reduced. The thickness of the group.
  • the heat dissipation opening may not be provided, and the heat dissipation plate 51 may be directly attached to the outer surface of the module housing 10.
  • the material of the heat dissipation plate 51 may be graphite or silicon.
  • the rear acoustic cavity 112 may also be provided with a heat dissipation opening, and the magnetic circuit system 22 may face the heat dissipation opening, or both the front acoustic cavity 111 and the rear acoustic cavity 112 may be provided with heat dissipation openings.
  • Each heat dissipation opening is correspondingly provided with a heat dissipation plate 51, and at least one The heat dissipating plate 51 and the magnetic circuit system 22 are thermally connected through the heat conducting plate 52.
  • the heat dissipation plate 51 and the heat conduction plate 52 are integrally formed. Specifically, the heat dissipation plate 51 and the heat conduction plate 52 are both metal parts. By integrally forming the heat dissipation plate 51 and the heat conduction plate 52, the connection between the heat dissipation plate 51 and the heat conduction plate 52 can be made closer, avoiding the heat dissipation plate 51 and the heat conduction plate. There is a gap between 52, which results in poor heat conduction effect. The heat conduction and heat dissipation effect is better, and the subsequent assembly process of side heat dissipation plate 51 and heat conduction plate 52 can be eliminated, and the installation process of the speaker module is simplified, which is beneficial to improve Productivity.
  • the heat dissipation plate 51 and the heat conduction plate 52 may also be welded, or bonded by thermally conductive glue, or the like.
  • the heat sink 50 and the module housing 10 are injection molded into one body, that is, the heat sink 51 and the heat conducting plate 52 are used as inserts to the module housing 10.
  • the heat sink 51 is embedded on the outer surface of the module housing 10
  • the heat conducting plate 52 is embedded in the module housing 10, so that the heat sink 51 and the module housing 10 are connected more firmly, with high stability, and The structural strength of the module housing 10 is improved, and the subsequent assembly process of the heat dissipation plate 51 and the module housing 10 is also eliminated, and the installation process of the speaker module is simplified, which is beneficial to improving production efficiency.
  • the heat dissipation plate 51 is adhered to the module housing 10.
  • the module housing 10 has a side wall, the side wall is formed with a sound hole 12 communicating with the front acoustic cavity 111, and the heat dissipation plate 51 has a first side edge 511 facing the side wall, and a first side edge 511 connected to the first side edge 511.
  • the heat dissipation plate 51 has a rectangular plate shape, the two second side edges 512 are opposite, the first side edge 511 and the third side edge 513 are opposite, and the first side edge 511 is adjacent to the side wall provided with the sound hole 12, In addition, the first side edge 511 is arranged corresponding to the position of the sound hole 12.
  • the two second side edges 512 and the third side edge 513 are each provided with a heat conducting plate 52, which is equivalent to the number of heat conducting plates 52, so that the plurality of heat dissipation plates 51 can contact multiple positions of the magnetic circuit system 22 for heat conduction. Therefore, the heat conduction effect of the magnetic circuit system 22 can be further improved, and the heat dissipation capacity of the speaker module can be improved.
  • two adjacent heat dissipation plates 51 may be arranged at intervals, or may be connected to each other.
  • a heat conducting plate 52 may be connected to only one of the second side edges 512. Or only a heat conducting plate 52 is connected to the third side edge 513. Or the two second side edges 512 are respectively provided with heat conducting plates 52. Or a heat conducting plate 52 is connected to one of the second side edges 512, and a heat conducting plate 52 is connected to the third side edge 513 and so on.
  • a heat-conducting medium 60 is filled between the heat-conducting portion 211 and the heat-conducting plate 52.
  • the heat-conducting medium 60 may be heat-conducting glue, heat-conducting silica gel, heat-conducting silicone grease, or soft silica gel heat-conducting pad, or the like.
  • the heat-conducting medium 60 is heat-conducting glue
  • the heat-conducting part 211 and the heat-conducting plate 52 are bonded by heat-conducting glue, so that the heat-conducting part 211 and the heat-conducting plate 52 can be more connected while ensuring the heat conduction effect. It is firm and reduces the risk of separation of the heat conducting portion 211 and the heat conducting plate 52.
  • the heat conduction part 211 is ring-shaped
  • the vibration system 23 of the speaker unit 20 is connected to one end of the heat conduction part 211
  • the side magnetic conductive plate 222 is connected to the other end of the heat conduction part 211 and is integrally formed with the heat conduction part 211.
  • the heat conducting portion 211 and the side magnetic conductive plate 222 are made of the same material, and are made of magnetic conductive metal.
  • the heat conducting part 211 and the side magnetic conductive plate 222 can be integrally drawn or bent by a stamping die, or the side magnetic conductive plate 222 can be formed by thinning the middle part of the ring-shaped magnetic conductive metal plate.
  • the thinned part is used as the heat conduction part 211, and the heat conduction part 211 and the side magnetic conductive plate 222 can also be formed by cutting processing or the like.
  • the diaphragm 231 is installed on the upper end surface of the heat-conducting part 211, and the heat-conducting plate 52 is located on the outer peripheral surface of the heat-conducting part 211.
  • the single housing 21 further includes a mounting portion 212.
  • the mounting portion 212 is a plastic part.
  • the mounting portion 212 and the heat conducting portion 211 are integrally molded by injection molding, and the mounting portion 212 It can be used for mounting pads (not shown in the figure) and magnetic circuit system 22.
  • the plastic mounting part 212 is easier to form a structure for mounting the magnetic circuit system 22. The process is simple and can be lower the cost.
  • the whole single housing 21 may also be made of metal, that is, the single housing 21 only includes the heat conducting portion 211.
  • the single housing 21 has a rectangular ring shape, that is, the heat conducting portion 211 has a rectangular ring shape, and the mounting portion 212 is provided at the corner between two adjacent straight sides of the heat conducting portion 211, so that the heat conducting portion 211 is The straight side is exposed, so as to ensure the thermal conduction connection between the heat conducting plate 52 and the straight side of the heat conducting portion 211, so that the contact area between the two is larger, and the heat conduction effect is better.
  • the heat-conducting part 211 may also be arranged in an annular shape, and a plurality of mounting parts 212 are arranged on the heat-conducting part 211 at intervals along the circumferential direction.
  • the heat conducting plate 52 can also be extended toward the magnetic conductive yoke 221, and the heat conducting plate 52 is also thermally connected to the outer peripheral surface of at least one of the magnetic conductive yoke 221, the side magnet 223, and the side magnetic conductive plate 222.
  • the upper surface of the side magnetic conductive plate 222 is connected to the lower surface of the heat conducting portion 211, and the lower end of the heat conductive plate 52 extends to the outer peripheral surface of the side magnetic conductive plate 222, and is connected to the side magnetic conductive plate 222.
  • the outer peripheral surface is connected by heat conduction.
  • the lower end of the heat conducting plate 52 extends to the outer circumferential surface of the side magnet 223 and is thermally connected to the outer circumferential surface of the side magnet 223. In one embodiment, the lower end of the heat conducting plate 52 extends to the magnetic yoke 221 and is thermally connected to the outer peripheral surface of the magnetic yoke 221. In one embodiment, the heat conducting plate 52 can also be thermally connected to any two of the magnetic yoke 221, the side magnet 223, and the side magnetic guide 222 at the same time, or the heat conducting plate 52 can be connected to the magnetic yoke 221, the side magnet 223 and any two at the same time. The three side magnetic conductive plates 222 are thermally connected.
  • thermally conductively connecting the heat conducting plate 52 to the outer peripheral surface of at least one of the magnetic yoke 221, the side magnet 223, and the side magnetic conducting plate 222 it is equivalent to increasing the contact area between the heat conducting plate 52 and the magnetic circuit system 22, which can further The heat conduction effect of the magnetic circuit system 22 is improved, thereby improving the heat dissipation capacity of the speaker module.
  • the module housing 10 corresponding to the rear acoustic cavity 112 is provided with a flexible deformable portion 30, and the speaker module further includes an electronic device housing (not shown), and an electronic device housing A closed cavity 70 is formed between the module housing 10 and the housing of the electronic device.
  • the electronic device housing isolates the sound generated by the flexible deformable part 30 from the sound emitted by the speaker unit 20 through the front acoustic cavity 111;
  • the communication port communicated with the cavity 90 is opposite to the flexible deformable portion 30;
  • the speaker module further includes a heat dissipation cover plate 40 located at the communication port, and the heat dissipation cover plate 40 is provided with a plurality of heat dissipation through holes 41.
  • the electronic device housing in this embodiment may be a housing structure integrally formed with the module housing 10, that is, the electronic device housing is a part of the speaker module, and the speaker module is installed in an electronic device such as a mobile phone.
  • the device is installed, it is equivalent to installing the module housing 10 and the electronic device housing in an electronic device such as a mobile phone.
  • the housing of the electronic device can also be used as the housing of an electronic device such as a mobile phone.
  • the flexible deformable part 30 includes a central part 31 and a convex suspension part 32 located outside the central part 31, and the suspension part 32 is fixedly connected to the module housing 10.
  • the flexible deformable portion 30 may be a single-layer structure, which is made of one of polymer plastics, thermoplastic elastomers and silicone rubber, or may be a multilayer structure, and at least one layer of the multilayer structure is It is made of one of high molecular plastic, thermoplastic elastomer and silicone rubber.
  • the flexible deforming part 30 deforms with the sound pressure, so that the volume of the first back cavity 1121 and the back acoustic cavity 112 can be adjusted, thereby increasing the equivalent sound of the first back cavity 1121 and the back acoustic cavity 112, and effectively reducing
  • the resonance frequency of the speaker module improves the low-frequency sensitivity; and the sound unit of the vibration system of the speaker unit 20 and the flexible deformation part 30 are isolated by the electronic equipment housing, and the radiated sound wave of the flexible deformation part 30 is enclosed inside the electronic equipment housing , To avoid the anti-phase radiated sound waves of the flexible deformable part 30, which will offset the positive radiated sound waves of the speaker unit 20, thereby greatly improving the low-frequency sensitivity of the product as a whole.
  • the heat dissipation cover 40 is a metal piece, the outer surface of the heat dissipation cover 40 is exposed outside the speaker module, the heat dissipation cover 40 covers the flexible deformable portion 30, and the heat dissipation through hole 41 penetrates the heat dissipation cover 40.
  • the heat in the speaker module can be better radiated through the heat dissipation cover 40, and the provision of heat dissipation through holes 41 on the heat dissipation cover 40 can increase the heat dissipation area of the heat dissipation cover 40, and when the flexible deformation part 30 vibrates
  • the heat dissipation through holes 41 can achieve pressure balance during the vibration of the flexible deformation part 30, that is, when the flexible deformation part 30 vibrates, the airflow on both sides of the heat dissipation cover 40 can flow into and out of the heat dissipation cover 40 and the heat dissipation cover 40 through the heat dissipation through holes 41.
  • the cavity between the flexible deformable portion 30 can drive the heat in the flexible deformable portion 30 to be dissipated from the heat dissipation through hole 41, which can further improve the heat dissipation effect of the speaker module.
  • the heat dissipation cover 40 itself has a certain degree of hardness and strength, which can protect the inner flexible deformable part 30.
  • materials with good thermal conductivity such as graphite sheet, copper foil or aluminum foil may also be pasted on the outer surface of the heat dissipation cover plate 40.
  • a composite sheet (not shown in the figure) can be superimposed on the central portion 31 of the flexible deformable portion 30.
  • the strength of the composite sheet is higher than that of the flexible deformable portion 30, and can be made of metal or plastic. , Carbon fiber or its composite structure, etc.
  • the central portion 31 may be a sheet-like overall structure, or may be a hollow structure, and the hollow structure is sealed by a composite sheet.
  • the present invention also provides an electronic device that includes a device housing, a host, and a speaker module.
  • the specific structure of the speaker module refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, Therefore, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
  • the host and the speaker module are both arranged in the housing.
  • At least a part of the device housing and the rear acoustic cavity 112 of the speaker module form a closed cavity, and the closed cavity is sealed with the sound hole 12 to avoid the reverse phase radiation of sound waves from the flexible deformable portion 30 and forward radiation to the speaker module Acoustic waves cause cancellation effects, and overall the product's low-frequency sensitivity is greatly improved.
  • the device housing doubles as the cavity wall of the rear acoustic cavity 112, which can make full use of the space inside the electronic device, while saving a part of the space occupied by the cavity wall, which is more conducive to the thin design of the electronic device.

Abstract

本发明公开一种扬声器模组和电子设备，其中，该扬声器模组包括模组外壳、扬声器单体和散热件，所述模组外壳具有收容腔。所述扬声器单体设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳和设于所述单体外壳的磁路系统，所述单体外壳包括导热部，所述导热部与所述磁路系统连接。所述散热件包括散热板和连接于所述散热板的导热板，所述散热板设于所述模组外壳的外表面，所述导热板穿入所述模组外壳，并与所述导热部热传导连接。本发明技术方案能够提高扬声器模组的散热能力。

Description

扬声器模组和电子设备 技术领域
本发明涉及声能转换技术领域，特别涉及一种扬声器模组和电子设备。
背景技术
扬声器模组是便携式电子设备的重要声学器件，用于完成电信号与声信号之间的转换，为在较小腔体空间下实现较好地声音重放效果，目前常采用的是Smart PA(智能功率放大器)和调音算法，但是在Smart PA应用过程中，扬声器模组会在高功率条件下长时间工作，会增大扬声器模组产生的热量，目前的扬声器模组主要是通过壳体上的出音孔进行散热，散热效果差，扬声器模组内的高温无法有效传导散发出去，扬声器模组音圈烧圈风险较大。
发明内容
本发明的主要目的是提出一种扬声器模组，旨在提高扬声器模组的散热能力。
为实现上述目的，本发明提出的扬声器模组，包括：
模组外壳，具有收容腔；
扬声器单体，设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳和设于所述单体外壳的磁路系统，所述单体外壳包括导热部，所述导热部与所述磁路系统连接；以及，
散热件，包括散热板和连接于所述散热板的导热板，所述散热板设于所述模组外壳的外表面，所述导热板穿入所述模组外壳，并与所述导热部热传导连接。
可选地，所述前声腔具有散热开口，所述扬声器单体的振动系统与所述散热开口相对，所述散热板盖合所述散热开口。
可选地，所述散热板与所述模组外壳注塑为一体；或者，所述散热板粘接于所述模组外壳。
可选地，所述模组外壳具有侧壁，所述侧壁成型有与所述前声腔连通的出音孔；所述散热板具有朝向所述侧壁的第一侧缘、与所述第一侧缘连接的两第二侧缘、及与所述第一侧缘相对的第三侧缘，所述第三侧缘和两所述第二侧缘中至少一者设有所述导热板。
可选地，所述导热部与所述导热板之间填设有导热介质。
可选地，所述散热板与所述导热板一体成型。
可选地，所述磁路系统包括导磁轭、设于所述导磁轭的边磁体、及设于所述边磁体上端的边导磁板；所述导热部呈环状，所述扬声器单体的振动系统连接于所述导热部的一端，所述边导磁板连接于所述导热部的另一端，并与所述导热部一体成型。
可选地，所述磁路系统包括导磁轭、设于所述导磁轭的边磁体、及设于所述边磁体上端的边导磁板；所述导热板朝所述导磁轭的方向延伸，所述导热板至少还与所述导磁轭、所述边磁体和所述边导磁板中一者的外周面热传导连接。
可选地，所述后声腔对应的模组外壳上设有柔性形变部，所述扬声器模组还包括电子设备壳体，所述电子设备壳体与所述模组外壳之间形成密闭腔，所述电子设备壳体将所述柔性形变部产生的声音与所述扬声器单体通过前声腔传出的声音进行隔离；所述模组外壳上设有与所述密闭腔连通的连通口，所述连通口与所述柔性形变部相对；所述扬声器模组还包括位于所述连通口的散热盖板，所述散热盖板设有散热通孔。
本发明还提出一种电子设备，该电子设备包括扬声器模组，所述扬声器模组包括模组外壳、扬声器单体和散热件，所述模组外壳具有收容腔。所述扬声器单体设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳和设于所述单体外壳的磁路系统，所述单体外壳包括导热部，所述导热部与所述磁路系统连接。所述散热件包括散热板和连接于所述散热板的导热板，所述散热板设于所述模组外壳的外表面，所述导热板穿入所述模组外壳，并与所述导热部热传导连接。
本发明技术方案通过在扬声器单体的单体外壳上设有与导热部，并将导 热部与磁路系统连接，使得磁路系统中的热量能够传导至导热部，再在模组外壳上设置散热板和导热板，将散热板设置在模组外壳的外表面，导热板一端与散热板连接，另一端穿入模组外壳，并与导热部热传导连接。以使磁路系统中的热量能够依次从导热部和导热板传导至散热板，再由散热板显露在外的表面辐射出去。相较于通过出音孔散热的方式，本方案中是通过设置导热部和导热板进行导热，再通过散热板进行散热的，导热部和导热板的导热效果更好，能够有效地将磁路系统的热量传导至散热板进行散热，至少能够将扬声器单体内的温度降低5℃，提高了扬声器模组的散热能力。可以有效降低扬声器单体内的温度过高而导致Smart PA(智能功率放大器)温度保护机制被触发而降低输入电压，从而导致重放音质差的可能，还能降低扬声器单体的音圈烧圈风险。而且在通过散热板散热的同时，部分热量也可以通过出音孔辐射出去，相当于可以在通过出音孔进行散热的基础上，能够通过散热板进一步散热，扬声器的散热能力更强。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明扬声器模组一实施例的结构示意图；
图2为图1中X-X方向的剖切示意图；
图3为图2中A处的放大图；
图4为图1中Y-Y方向的剖切示意图；
图5为图4中B处的放大图；
图6为本发明扬声器模组中扬声器单体的结构示意图；
图7为图4中C处的放大图。
附图标号说明：
标号 名称 标号 名称
10 模组外壳 23 振动系统
11 收容腔 231 振膜
111 前声腔 232 音圈
112 后声腔 30 柔性形变部
12 出音孔 31 中心部
20 扬声器单体 32 悬挂部
21 单体外壳 40 散热盖板
211 导热部 41 散热通孔
212 安装部 50 散热件
22 磁路系统 51 散热板
221 导磁轭 511 第一侧缘
222 边导磁板 512 第二侧缘
223 边磁体 513 第三侧缘
224 中心磁体 52 导热板
70 密闭腔 60 导热介质
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二” 的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B为例”，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种扬声器模组，该扬声器模组能够用于耳机、手机等能够发声的电子设备。
在本发明实施例中，请结合参考图1至图5，该扬声器模组包括模组外壳10、扬声器单体20和散热件50，模组外壳10具有收容腔11。扬声器单体20设于收容腔11，并将收容腔11隔设为前声腔111和后声腔112，扬声器单体20包括单体外壳21和设于单体外壳21的磁路系统22和振动系统23，单体外壳21包括导热部211，导热部211与磁路系统22连接。散热件50包括散热板51和连接于散热板51的导热板52，散热板51设于模组外壳10的外表面，导热板52穿入模组外壳10，并与导热部211热传导连接。
本实施例中，振动系统23包括振膜231以及固定于振膜231一侧的音圈232。磁路系统22包括导磁轭221，导磁轭221上设有内磁路部分和外磁路部分，两者之间形成容纳音圈232的磁间隙。其中，一种情况下，内磁路部分包括设于导磁轭221的中央位置的中心磁体224和设于中心磁体224上的中心导磁板，外磁路部分包括设于导磁轭221的边缘位置的边磁体223和设于边磁体223上的边导磁板222。
其中，散热板51显露于模组外壳10的外表面，而散热板51的数量可以为一个或多个，例如一实施例中，散热板51的数量可以为两个，两个散热板51分别对应前声腔111和后声腔112的位置设置。当收容腔11内的热量经由导热板52传导至散热板51时，热量能够从散热板51的显露在外的表面辐射出去，进而能够起到散热效果。导热部211的材质可以为金属、导热塑料或者复合导热材料。导热板52与导热部211热传导连接指导热部211的热量能够传导至导热板52，其具体方式包括但不限于，将导热板52与导热部211直接抵接，或者导热板52和导热部211之间设有导热介质60等等。
本发明技术方案通过在扬声器单体20的单体外壳21上设有与导热部 211，并将导热部211与磁路系统22连接，使得磁路系统22中的热量能够传导至导热部211，再在模组外壳10上设置散热板51和导热板52，将散热板51设置在模组外壳10的外表面，导热板52一端与散热板51连接，另一端穿入模组外壳10，并与导热部211热传导连接。以使磁路系统22中的热量能够依次从导热部211和导热板52传导至散热板51，再由散热板51显露在外的表面辐射出去。相较于通过出音孔12散热的方式，本方案中是通过设置导热部211和导热板52进行导热，再通过散热板51进行散热的，导热部211和导热板52的导热效果更好，能够有效地将磁路系统22的热量传导至散热板51进行散热，至少能够将扬声器单体20内的温度降低5℃，提高了扬声器模组的散热能力。可以有效降低扬声器单体20内的温度过高而导致Smart PA(智能功率放大器)温度保护机制被触发而降低输入电压，从而导致重放音质差的可能，还能降低扬声器单体20的音圈232烧圈风险。而且在通过散热板51散热的同时，部分热量也可以通过出音孔12辐射出去，相当于可以在通过出音孔12进行散热的基础上，能够通过散热板51进一步散热，扬声器模组的散热能力更强。
其中，散热板51安装结构具有多种，例如，一实施例中，前声腔111具有散热开口，扬声器单体20的振动系统23与散热开口相对，散热板51盖合散热开口。具体而言，散热开口设置在振膜231相对的腔壁上，如此相当于散热板51能够与前声腔111中的热量直接接触，使得前声腔111中的热量能够通过散热板51传导辐射出去，能够进一步提高扬声器模组的散热效果。此外，本实施例中，散热板51为金属材质，如此散热板51的强度较高，可以将散热板51的厚度设置较薄，从而可以增大前声腔111的空间，或者也可以减少扬声器模组的厚度。当然，在其它实施例中，也可以不设置散热开口，直接将散热板51贴在模组外壳10的外表面，该方案中，散热板51的材质可以为石墨或硅等。另外，也可以在后声腔112设置有散热开口，磁路系统22朝向散热开口，或者在前声腔111和后声腔112均设置有散热开口，每一散热开口对应设有一散热板51，且至少一散热板51与磁路系统22通过导热板52热传导连接。
一实施例中，散热板51与导热板52一体成型。具体而言，散热板51与导热板52均为金属件，通过将散热板51与导热板52一体成型，能够使得散热板51与导热板52的连接更加紧密，避免了散热板51与导热板52之间存 在间隙而导致导热效果差的情况发生，导热散热效果更好，也能免去边散热板51与导热板52的后续组装工序，简化了的扬声器模组的安装工序，有利于提高生产效率。当然，在其它实施例中，也可以将散热板51与导热板52焊接，或者通过导热胶水粘接等等。
散热件50与模组外壳10的连接方式具有多种，例如，一实施例中，散热件50与模组外壳10注塑为一体，即将散热板51和导热板52作为嵌件与模组外壳10一体注塑成型，散热板51嵌设于模组外壳10的外表面，导热板52嵌设于模组外壳10内，如此使得散热板51与模组外壳10连接更加牢靠，稳定性高，还能提高模组外壳10的结构强度，而且还免去了散热板51和模组外壳10的后续组装工序，简化了的扬声器模组的安装工序，有利于提高生产效率。另外，其它实施例中，散热板51粘接于模组外壳10。
一实施例中，模组外壳10具有侧壁，侧壁成型有与前声腔111连通的出音孔12，散热板51具有朝向侧壁的第一侧缘511、与第一侧缘511连接的两第二侧缘512、及与第一侧缘511相对的第三侧缘513，第三侧缘513和两第二侧缘512中至少一者设有导热板52。具体而言，散热板51呈矩形板状，两第二侧缘512相对，第一侧缘511和第三侧缘513相对，第一侧缘511与靠近设有出音孔12的侧壁，且第一侧缘511对应出音孔12的位置设置。两个第二侧缘512和第三侧缘513均分别设有导热板52，相当于导热板52的数量为多个，使得多个散热板51能够接触磁路系统22的多个位置进行导热，能够进一步提高磁路系统22的热传导效果，进而可以提高扬声器模组的散热能力。其中，相邻两散热板51之间可以间隔设置，也可以相互连接。另外，在其它实施例中，也可以在仅在其中一个第二侧缘512连接有一导热板52。或者仅在第三侧缘513连接有一导热板52。或者两第二侧缘512上均分别设有导热板52。或者在其中一第二侧缘512连接有一导热板52，并在第三侧缘513连接有一导热板52等等。
一实施例中，导热部211与导热板52之间填设有导热介质60。具体而言，导热介质60可以为导热胶水、导热硅胶、导热硅脂或软性硅胶导热垫等等。可以理解，将导热部211与导热板52直接抵接导热时，导热部211和导热板52之间容易存在间隙，从而会降低导热部211和导热板52之间的热传递效果，而通过在导热部211与导热板52之间填设有导热介质60时，导热介质60能 够填充于导热部211与导热板52之间的间隙中，而且导热介质60具有较好的导热性能，能够提高导热部211与导热板52之间的导热效果。另外，本实施例中，导热介质60为导热胶水，导热部211和导热板52之间通过导热胶水粘接，以在保证导热效果的情况下，还能使得导热部211和导热板52连接更加牢固，降低导热部211和导热板52分离的风险。
一实施例中，导热部211呈环状，扬声器单体20的振动系统23连接于导热部211的一端，边导磁板222连接于导热部211的另一端，并与导热部211一体成型。具体而言，导热部211与边导磁板222的材质相同，且为导磁金属。其中，导热部211与边导磁板222可以通过冲压模具一体拉深或弯曲成型，也可以通过将环形导磁金属板的中间部分压薄形成边导磁板222，而环形金属板外周的未压薄的部分作为导热部211，还可以通过切削加工等方式成型导热部211与边导磁板222。振膜231安装于导热部211的上端面，导热板52位于导热部211的外周面。通过将边导磁板222与导热部211一体成型，能够使得边导磁板222和导热部211的连接更加紧密，避免了边导磁板222和导热部211存在间隙而导致导热效果差的情况发生，导热散热效果更好，也能免去边导磁板222和单体外壳21的后续组装工序，简化了的扬声器模组的安装工序，有利于提高生产效率。
另外，请结合参考图3、图5和图6，一实施例中，单体外壳21还包括安装部212，安装部212为塑料件，安装部212与导热部211一体注塑成型，安装部212可以用于安装焊盘(图未示出)和磁路系统22，相较于难成型出复杂结构的金属，塑料的安装部212更容易成型供磁路系统22安装的结构，工艺简单，能够降低成本。当然，在其它实施例中，也可以将单体外壳21整体呈金属设置，即单体外壳21仅包括导热部211。此外，一实施例中，单体外壳21呈矩形环状，即导热部211呈矩形环状，安装部212设于导热部211的相邻两直边的夹角处，以使得导热部211的直边外露，从而可以保证导热板52与导热部211的直边热传导连接，如此两者的接触面积较大，导热效果更好。当然，在其它实施例中，也可以将导热部211呈圆环状设置，并在导热部211上沿周向间隔设置多个安装部212。
为增大散热效果，还可以将导热板52朝导磁轭221的方向延伸，导热板52至少还与导磁轭221、边磁体223和边导磁板222中一者的外周面热传导 连接。具体而言，一实施例中，边导磁板222的上表面与导热部211的下表面连接，导热板52的下端延伸至边导磁板222的外周面，并与边导磁板222的外周面热传导连接。一实施例中，导热板52的下端延伸至边磁体223的外周面，并与边磁体223的外周面热传导连接。一实施例中，导热板52的下端延伸至导磁轭221，并与导磁轭221的外周面热传导连接。一实施例中，还可以将导热板52同时与导磁轭221、边磁体223和边导磁板222中任意两者热传导连接，或者将导热板52同时与导磁轭221、边磁体223和边导磁板222三者热传导连接。通过将导热板52至少还与导磁轭221、边磁体223和边导磁板222中一者的外周面热传导连接，相当于增大了导热板52与磁路系统22的接触面积，能够进一步提高磁路系统22的热传导效果，进而可以提高扬声器模组的散热能力。
请结合参考图4和图7，一实施例中，后声腔112对应的模组外壳10上设有柔性形变部30，扬声器模组还包括电子设备壳体(图未示出)，电子设备壳体与模组外壳10之间形成密闭腔70，电子设备壳体将柔性形变部30产生的声音与扬声器单体20通过前声腔111传出的声音进行隔离；模组外壳10上设有与密闭腔90连通的连通口，连通口与柔性形变部30相对；扬声器模组还包括位于连通口的散热盖板40，所述散热盖板40设有多个散热通孔41。
需要说明的是，本实施例中的电子设备壳体可以为与模组外壳10一体成型的壳体结构，即电子设备壳体为扬声器模组的一部分，将扬声器模组安装在例如手机等电子设备上时，相当于将模组外壳10和电子设备壳体安装在手机等电子设备内。当然，在其它实施例中，也可以将电子设备壳体作为手机等电子设备的外壳。
具体而言，第一后腔1121后声腔112为密闭腔，柔性形变部30包括中心部31和位于中心部31外侧的凸起状的悬挂部32，悬挂部32与模组外壳10固定连接。其中，柔性形变部30可以是单层结构，单层结构由高分子塑料、热塑性弹性体和硅橡胶中的一种材料制成，也可以是多层结构，多层结构中的至少一层为高分子塑料、热塑性弹性体和硅橡胶中的一种材料制成。通过设置柔性形变部30，柔性形变部30随着声压产生变形，使得第一后腔1121后声腔112的容积大小可调，从而增加第一后腔1121后声腔112等效声顺，有效降低扬声器模组的共振频率，提升低频灵敏度；并通过电子设备壳体对 扬声器单体20的振动系统发声单元和柔性形变部30隔离设计，将柔性形变部30的辐射声波封闭于电子设备壳体内部，避免柔性形变部30的反相位辐射声波，对扬声器单体20的正向辐射声波造成抵消影响，进而整体上较大幅度提升产品的低频段灵敏度。
散热盖板40为金属件，散热盖板40的外表面显露在扬声器模组外，散热盖板40盖合柔性形变部30，散热通孔41贯穿散热盖板40。扬声器模组内的热量能够较好地通过散热盖板40辐射散发出去，而且在散热盖板40上设置散热通孔41可以增大散热盖板40的散热面积，而且在柔性形变部30振动时，散热通孔41可以实现柔性形变部30振动过程中的压力平衡，即在柔性形变部30振动时，散热盖板40两侧的气流能够经过散热通孔41流进和流出散热盖板40和柔性形变部30之间的空腔，进而可以带动柔性形变部30内的热量自散热通孔41散发出去，能够进一步提高扬声器模组的散热效果。此外，散热盖板40自身具有一定的硬度及强度，能够对内侧的柔性形变部30形成保护作用。另外，为进一步提高散热盖板40的散热效果，还可以在散热盖板40的外表面贴设是石墨片、铜箔或铝箔等等导热性能好的材料。
进一步的，为了提升振动效果，还可以在柔性形变部30的中心部31上叠加一复合片(图未示出)，该复合片的强度高于柔性形变部30的强度，可以是金属、塑料、碳纤维或者是其复合结构等等。另外中心部31可以是片状的整体结构，也可以是镂空结构，通过复合片密闭该镂空结构。
本发明还提出一种电子设备，该电子设备包括设备壳体、主机和扬声器模组，该扬声器模组的具体结构参照上述实施例，由于本电子设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。其中，主机和扬声器模组均设于壳体内。设备壳体至少一部分与扬声器模组的后声腔112形成封闭腔，该封闭腔与出音孔12之间密封设置，避免柔性形变部30的反相位辐射声波，对扬声器模组的正向辐射声波造成抵消影响，进而整体上较大幅度提升产品的低频段灵敏度。而且设备壳体兼做后声腔112的腔体壁，能够充分利用电子设备内部的空间，同时节约一部分腔体壁占用的空间，更加有利于电子设备的薄型化设计。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括：
    模组外壳，具有收容腔；
    扬声器单体，设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳和设于所述单体外壳的磁路系统，所述单体外壳包括导热部，所述导热部与所述磁路系统连接；
    散热件，包括散热板和连接于所述散热板的导热板，所述散热板设于所述模组外壳的外表面，所述导热板穿入所述模组外壳，并与所述导热部热传导连接。
  2. 如权利要求1所述的扬声器模组，其特征在于，所述前声腔具有散热开口，所述扬声器单体的振动系统与所述散热开口相对，所述散热板盖合所述散热开口。
  3. 如权利要求1所述的扬声器模组，其特征在于，所述散热件与所述模组外壳注塑为一体；或者，所述散热件粘接于所述模组外壳。
  4. 如权利要求1所述的扬声器模组，其特征在于，所述模组外壳具有侧壁，所述侧壁成型有与所述前声腔连通的出音孔；
    所述散热板具有朝向所述侧壁的第一侧缘、与所述第一侧缘连接的两第二侧缘、及与所述第一侧缘相对的第三侧缘，所述第三侧缘和两所述第二侧缘中至少一者设有所述导热板。
  5. 如权利要求1所述的扬声器模组，其特征在于，所述导热部与所述导热板之间填设有导热介质。
  6. 如权利要求1所述的扬声器模组，其特征在于，所述散热板与所述导热板一体成型。
  7. 如权利要求1至6任意一项所述的扬声器模组，其特征在于，所述磁路系统包括导磁轭、设于所述导磁轭的边磁体、及设于所述边磁体上端的边导磁板；
    所述导热部呈环状，所述扬声器单体的振动系统连接于所述导热部的一端，所述边导磁板连接于所述导热部的另一端，并与所述导热部一体成型。
  8. 如权利要求1至6任意一项所述的扬声器模组，其特征在于，所述磁路系统包括导磁轭、设于所述导磁轭的边磁体、及设于所述边磁体上端的边导磁板；
    所述导热板朝所述导磁轭的方向延伸，所述导热板至少 还与所述导磁轭、所述边磁体和所述边导磁板中一者的外周面热传导连接。
  9. 如权利要求1所述的扬声器模组，其特征在于，所述后声腔对应的模组外壳上设有柔性形变部，所述扬声器模组还包括电子设备壳体，所述电子设备壳体与所述模组外壳之间形成密闭腔，所述电子设备壳体将所述柔性形变部产生的声音与所述扬声器单体通过所述前声腔传出的声音进行隔离；
    所述模组外壳上设有与所述密闭腔连通的连通口，所述连通口与所述柔性形变部相对；所述扬声器模组还包括位于所述连通口的散热盖板，所述散热盖板设有散热通孔。
  10. 一种电子设备，其特征在于，包括如权利要求1至9中任意一项所述的扬声器模组。
PCT/CN2020/129108 2019-12-20 2020-11-16 扬声器模组和电子设备 WO2021120948A1 (zh)

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