WO2021120949A1 - 扬声器模组和电子设备 - Google Patents

扬声器模组和电子设备 Download PDF

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Publication number
WO2021120949A1
WO2021120949A1 PCT/CN2020/129216 CN2020129216W WO2021120949A1 WO 2021120949 A1 WO2021120949 A1 WO 2021120949A1 CN 2020129216 W CN2020129216 W CN 2020129216W WO 2021120949 A1 WO2021120949 A1 WO 2021120949A1
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WO
WIPO (PCT)
Prior art keywords
heat
cavity
heat transfer
housing
magnetic circuit
Prior art date
Application number
PCT/CN2020/129216
Other languages
English (en)
French (fr)
Inventor
刘磊
孙立国
曹明君
Original Assignee
歌尔股份有限公司
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Filing date
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021120949A1 publication Critical patent/WO2021120949A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/022—Cooling arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil

Definitions

  • the present invention relates to the technical field of sound energy conversion, in particular to a speaker module and electronic equipment.
  • the speaker module is an important acoustic component of portable electronic equipment. It is used to complete the conversion between electrical and acoustic signals. In order to achieve better sound reproduction in a small cavity space, SmartPA ( Smart power amplifier) and tuning algorithms. However, in the application of Smart PA, the speaker module will work for a long time under high power conditions, which will increase the heat generated by the speaker module.
  • the current speaker module mainly uses a single unit The sound outlets on the housing dissipate heat, and the heat dissipation effect is poor. The high temperature in the speaker module cannot be effectively conducted and emitted, and the risk of the voice coil of the speaker module is relatively high.
  • the main purpose of the present invention is to provide a loudspeaker module, which aims to improve the heat dissipation capacity of the loudspeaker module.
  • the speaker module provided by the present invention includes:
  • the speaker unit is arranged in the receiving cavity, and the receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity.
  • the speaker unit includes a single housing, and a vibration system and a magnetic circuit connected to the single housing System, the vibration system is in communication with the front acoustic cavity, and the magnetic circuit system is in communication with the rear acoustic cavity; and,
  • the heat transfer element is arranged between the magnetic circuit system and the cavity wall of the rear acoustic cavity.
  • the heat transfer element is an elastic element, and the thickness of the heat transfer element is greater than the distance between the magnetic circuit system and the cavity wall of the rear acoustic cavity.
  • the heat transfer element includes a thermally conductive layer and an elastic layer, the thermally conductive layer envelops the elastic layer, and two opposite sides of the thermally conductive layer respectively abut against the cavity wall of the magnetic circuit system and the rear acoustic cavity .
  • the elastic layer is made of a thermally conductive material.
  • the thermally conductive layer and the elastic layer are bonded by a thermally conductive glue.
  • the thermally conductive layer is a graphite layer, a copper foil layer or an aluminum foil layer; and/or, the elastic layer is a thermally conductive silica gel layer or a thermally conductive foam layer.
  • the magnetic circuit system includes a magnetic yoke, the heat transfer member is arranged between the magnetic yoke and the cavity wall of the rear acoustic cavity, and the magnetic yoke and the cavity wall of the rear acoustic cavity At least one of them is provided with a limiting groove, and the heat transfer element is arranged in the limiting groove.
  • the module housing includes an upper housing and a lower housing, the upper housing and the speaker unit jointly form the front sound cavity, and the upper housing, the lower housing and the speaker unit jointly form The rear acoustic cavity; the heat transfer element is provided between the magnetic circuit system and the lower shell, and at least the part of the lower shell connected to the heat transfer element is made of thermally conductive material.
  • the single housing includes a heat conduction part connected to the magnetic circuit system
  • the speaker module further includes a heat dissipation plate and a heat conduction plate connected to the heat dissipation plate, and the heat dissipation plate is arranged at On the outer surface of the module housing, the heat conduction plate penetrates the module housing and is thermally connected to the heat conduction part.
  • a flexible deformable part is provided on the module housing corresponding to the rear acoustic cavity
  • the speaker module further includes an electronic device housing, and a closed cavity is formed between the electronic device housing and the module housing, The electronic device housing isolates the sound generated by the flexible deformation portion from the sound emitted by the speaker unit through the front sound cavity;
  • the module housing is provided with a communication port communicating with the closed cavity The communication port is opposite to the flexible deformable part;
  • the speaker module further includes a heat dissipation cover plate located at the communication port, and the heat dissipation cover plate is provided with a heat dissipation through hole.
  • the present invention also provides an electronic device, including a speaker module, the speaker module includes a module housing, a speaker unit and a heat transfer element, the module housing has a housing cavity, and the speaker unit is arranged in the housing The housing cavity is divided into a front acoustic cavity and a rear acoustic cavity.
  • the speaker unit includes a single housing, and a vibration system and a magnetic circuit system connected to the single housing, the vibration system and the The front acoustic cavity is in communication, the magnetic circuit system is in communication with the rear acoustic cavity, and the heat transfer element is arranged between the magnetic circuit system and the cavity wall of the rear acoustic cavity.
  • the technical solution of the present invention is to provide a heat transfer member between the magnetic circuit system and the cavity wall of the rear acoustic cavity, so that when the speaker module is working, the heat transfer member can conduct the heat generated by the speaker unit to the rear acoustic cavity through the magnetic circuit system.
  • the cavity wall and the module shell transfer heat to the outside.
  • the heat transfer element is set to contact the magnetic circuit system and the module shell to conduct heat, and the heat transfer effect of the heat transfer element Even better, it can effectively conduct the heat of the magnetic circuit system to the heat sink for heat dissipation, which effectively improves the heat dissipation capacity of the speaker module.
  • FIG. 1 is an exploded schematic diagram of an embodiment of the speaker module of the present invention
  • Fig. 2 is a cross-sectional view of the speaker module in Fig. 1 in a combined state
  • Figure 3 is an enlarged view of A in Figure 2;
  • Fig. 4 is a schematic diagram of the structure of the heat transfer element in Fig. 3;
  • Fig. 5 is an enlarged view of B in Fig. 2.
  • the directional indication is only used to explain that it is in a specific posture (as shown in the drawings). If the specific posture changes, the relative positional relationship, movement, etc. of the components below will also change the directional indication accordingly.
  • the present invention provides a speaker module, which can be used in electronic devices capable of producing sound such as earphones and mobile phones.
  • the speaker module includes a module housing 10, a speaker unit 20, and a heat transfer member 70.
  • the module housing 10 has a receiving cavity 13, and the speaker unit 20 is provided with In the receiving cavity 13, and dividing the receiving cavity 13 into a front acoustic cavity 131 and a rear acoustic cavity 132, the speaker unit 20 includes a unit housing 21, and a vibration system 23 and a magnetic circuit system 22 connected to the unit housing 21.
  • the vibration system 23 communicates with the front acoustic cavity 131, the magnetic circuit system 22 communicates with the rear acoustic cavity 132, and the heat transfer element 70 is arranged between the magnetic circuit system 22 and the cavity wall of the rear acoustic cavity 132.
  • the vibration system 23 includes a diaphragm 231 and a voice coil 232 fixed on one side of the diaphragm 231.
  • the magnetic circuit system 22 includes a magnetically conductive yoke 221.
  • the magnetically conductive yoke 221 is provided with an inner magnetic circuit part and an outer magnetic circuit part, and a magnetic gap for accommodating the voice coil 232 is formed between the two.
  • the inner magnetic circuit part includes a central magnet 224 arranged at the center of the magnetic yoke 221 and a central magnetic plate arranged on the central magnet 224
  • the outer magnetic circuit part includes a central magnet arranged on the magnetic yoke 221.
  • the side magnet 223 at the edge position and the side magnetic conductive plate 222 provided on the side magnet 223.
  • the two sides of the heat transfer member 70 are respectively connected to the cavity wall of the magnetic circuit system 22 and the rear acoustic cavity 132.
  • the heat transfer member 70 can conduct the heat of the magnetic circuit system 22 to the cavity wall of the rear acoustic cavity 132, and then the heat is transferred from the module housing 10 to the cavity wall of the rear acoustic cavity 132.
  • the heat transfer element 70 may only be thermally conductively connected to the magnetic yoke 221, or only the side magnet 223 may be thermally connected, or the heat transfer element 70 may be thermally conductively connected to the magnetic yoke 221 and the side magnet 223 at the same time.
  • the heat transfer member 70 can be thermal conductive mud, graphite, copper foil, aluminum foil, thermal conductive silica gel, thermal conductive foam, or the like.
  • the length and width of the heat transfer member 70 may be approximately the same as the length and width of the magnetic yoke 221, or the length and width of the heat transfer member 70 may be set smaller than or greater than the length and width of the magnetic yoke 221.
  • a heat transfer member 70 is provided between the magnetic circuit system 22 and the cavity wall of the rear acoustic cavity 132, so that when the speaker module is working, the heat transfer member 70 can transfer the heat generated by the speaker unit 20 through the magnetic circuit system. 22 is conducted to the cavity wall of the rear acoustic cavity 132, and then the heat is transferred from the module housing 10 to the outside. Compared with the way of dissipating heat through the sound hole 14, in this solution, a heat transfer element 70 is provided to contact the magnetic circuit system 22 and the mold.
  • the group housing 10 conducts heat, and the heat transfer member 70 has a better heat conduction effect, and can effectively conduct the heat of the magnetic circuit system 22 to the heat dissipation plate 50 for heat dissipation, which effectively improves the heat dissipation capability of the speaker module. It can effectively reduce the excessively high temperature in the speaker unit 20, which causes the Smart PA (Smart Power Amplifier) temperature protection mechanism to be triggered and lower the input voltage, resulting in the possibility of poor playback sound quality, and also reduces the voice coil of the speaker unit 20 232 Circle burning risk.
  • Smart PA Smart Power Amplifier
  • part of the heat can also be radiated out through the sound outlet 14, which is equivalent to the ability to dissipate heat through the heat transfer element 70 on the basis of heat dissipation through the sound outlet 14.
  • the heat dissipation of the speaker More capable.
  • the heat transfer element 70 is an elastic element, and the thickness of the heat transfer element 70 is greater than the distance between the magnetic circuit system 22 and the cavity wall of the rear acoustic cavity 132.
  • the heat transfer member 70 has a first surface and a second surface opposite to each other. The first surface is in contact with the magnetic yoke 221, the second surface is in contact with the cavity wall of the rear acoustic cavity 132, and the first surface and the second surface are in contact with each other.
  • the distance of is the thickness of the heat transfer member 70. It should be noted that the thickness refers to the size of the heat transfer element 70 in a free state before installation.
  • the heat transfer element 70 When the heat transfer element 70 is installed between the magnetic circuit system 22 and the cavity wall of the rear acoustic cavity 132, the heat transfer element 70 is subjected to the magnetic circuit.
  • the system 22 and the cavity wall of the rear acoustic cavity 132 are squeezed in a compressed state and tightly fit between the magnetic circuit system 22 and the cavity wall of the rear acoustic cavity 132.
  • the gap between the heat transfer element 70 and the magnetic circuit system 22 and between the heat transfer element 70 and the cavity wall of the rear acoustic cavity 132 can be reduced, the contact tightness of the heat transfer element 70 is improved, and the heat conduction and heat dissipation effect is better.
  • the elastic heat transfer member 70 can also be used to reduce vibration, which can reduce the noise generated by the collision between the speaker unit 20 and the module housing 10 when the speaker unit 20 vibrates, which is beneficial to improve the acoustic performance of the speaker module.
  • the heat transfer element 70 has various structures.
  • the heat transfer element 70 includes a thermally conductive layer 71 and an elastic layer 72.
  • the thermally conductive layer 71 wraps the elastic layer 72.
  • the two opposite sides of the layer 71 abut against the cavity wall of the magnetic circuit system 22 and the rear acoustic cavity 132 respectively.
  • the thermally conductive layer 71 includes a first heat transfer part 711 in contact with the magnetic circuit system 22, a second heat transfer part 712 in contact with the cavity wall of the rear acoustic cavity 132, and a connection between the first heat transfer part 711 and the second heat transfer part 712.
  • the third heat transfer portion 713 of the heat portion 712, the first heat transfer portion 711 is located between the elastic layer 72 and the magnetic circuit system 22, and the second heat transfer portion 712 is located between the elastic layer 72 and the cavity wall of the rear acoustic cavity 132.
  • the third heat transfer portion 713 is located on the outer periphery of the elastic layer 72. Wherein, the third heat transfer part 713 may be arranged around the outer periphery of the elastic layer 72, or the third heat transfer part 713 may only be arranged around a part of the elastic layer 72.
  • the heat conducting layer 71 can be used as the main heat conducting structure, and the elastic layer 72 can be used as the main elastic structure. Ensure the elasticity of the heat transfer member 70. In addition, while ensuring the heat dissipation effect, it can also reduce the volume of the heat-conducting layer 71, which is beneficial to save the material of the heat-conducting layer 71. Even if the heat-conducting layer 71 uses a material with better thermal conductivity, it will not cause the cost of heat transfer parts. The cost of 70 is too high.
  • the thermal conductive layer 71 can be made of materials with good thermal conductivity, such as graphite, copper foil, silver foil, or aluminum foil. In addition, in other embodiments, the thermally conductive layer 71 may also be arranged elastically.
  • the elastic layer 72 is made of a heat conduction material.
  • the thermally conductive material in this embodiment guides materials with better thermal performance, for example, the elastic layer 72 is a thermally conductive silica gel layer or a thermally conductive foam layer or other elastic materials with good thermal conductivity.
  • the heat transfer portion 713 and the elastic layer 72 are conducted to the second heat transfer portion 712, and finally the second heat transfer portion 712 conducts heat to the module housing 10 and radiates to the outside of the speaker module.
  • effective heat conduction can be conducted through the thermal conductive layer 71, and effective heat conduction can be conducted through the elastic layer 72, which can further improve the heat dissipation effect of the speaker module.
  • the thermally conductive layer 71 and the elastic layer 72 are bonded by a thermally conductive glue.
  • the thermal conductive glue can be filled in the gap between the thermal conductive layer 71 and the elastic layer 72, and the thermal conductive glue has better thermal conductivity, which can improve the thermal conductivity between the thermal conductive layer 71 and the elastic layer 72.
  • the connection between the thermal conductive layer 71 and the elastic layer 72 is stronger, the structure of the heat transfer member 70 is more stable, and the risk of the thermal conductive layer 71 and the elastic layer 72 being separated is reduced.
  • the heat transfer element 70 is provided between the magnetically conductive yoke 221 and the cavity wall of the back acoustic cavity 132, at least one of the magnetically conductive yoke 221 and the cavity wall of the back acoustic cavity 132 is provided with a limiting groove 80, and the heat transfer element 70 is provided ⁇ Limiting slot 80.
  • the limiting groove 80 may be provided only on the magnetic yoke 221, or only the limiting groove 80 may be provided on the cavity wall of the rear acoustic cavity 132, or the limiting grooves 80 may be provided on the cavity wall of the magnetic yoke 221 and the rear acoustic cavity 132 at the same time.
  • Position slots 80, and the notches of the two limit slots 80 are arranged opposite to each other.
  • the limiting groove 80 is located on the surface of the magnetic yoke 221 away from the central magnet 224.
  • the limit slot 80 By providing the limit slot 80, when the heat transfer element 70 is installed, the heat transfer element 70 can be conveniently positioned, and the position can be effectively limited after installation.
  • the heat transfer element 70 is arranged in the limiting groove 80, the contact area between the heat transfer element 70 and the magnetic yoke 221, or the contact area between the heat transfer element 70 and the cavity wall of the rear acoustic cavity 132 can be increased, which can further increase Heat conduction effect.
  • the heat transfer member 70 can also be directly held against the cavity wall of the rear acoustic cavity 132 and the surface of the magnetic yoke 221.
  • the module housing 10 includes an upper housing 11 and a lower housing 12, the upper housing 11 and the speaker unit 20 together form a front acoustic cavity 131, the upper housing 11, the lower housing 12 and The speaker units 20 collectively form the rear acoustic cavity 132, the heat transfer element 70 is arranged between the magnetic circuit system 22 and the lower shell 12, and at least the part of the lower shell 12 connected to the heat transfer element 70 is made of thermally conductive material.
  • a receiving cavity 13 is formed between the upper shell 11 and the lower shell 12, the speaker unit 20 is provided on the upper shell 11 to form a front acoustic cavity 131 together with the upper shell 11, the lower shell 12, the upper shell 11 and the speaker unit 20 Together, the rear acoustic cavity 132 is formed, and the inner surface of the lower shell 12 forms the cavity wall of the rear acoustic cavity 132.
  • the first surface of the heat transfer element 70 abuts against the magnetic yoke 221, and the second surface of the heat transfer element 70 abuts against the inner surface of the lower shell 12.
  • the lower shell 12 is made of a thermally conductive material as a whole.
  • the thermally conductive material has a better heat conduction and heat dissipation effect.
  • the heat transfer efficiency between the heat transfer element 70 and the lower shell 12 is high, and
  • the lower shell 12 has a large heat dissipation area and faster heat dissipation, which can improve the heat dissipation capacity of the speaker module.
  • the lower shell 12 made of metal has higher strength, which can improve the overall strength of the module housing 10.
  • the lower shell 12 includes a shell body (not shown in the figure) and a heat sink (not shown in the figure), the shell body has an opening (not shown in the figure), and the opening is in communication with the rear acoustic cavity 132,
  • the heat sink is arranged to cover the opening, the facing inner surface of the heat sink forms the cavity wall of the rear acoustic cavity 132, the heat sink is made of heat conducting material, and the heat transfer member 70 is arranged between the magnetic yoke 221 and the heat sink.
  • the heat sink can be integrated with the shell body by injection molding, or the heat sink can be bonded to the shell body.
  • the material of the heat sink can be stainless steel, copper and its alloys, aluminum and its alloys, silicon or graphite, and so on.
  • the single housing 21 includes a heat conduction portion 211
  • the heat conduction portion 211 is connected to the magnetic circuit system 22
  • the speaker module further includes a heat dissipation plate 50 and a heat conduction plate connected to the heat dissipation plate 50 60.
  • the heat dissipation plate 50 is provided on the outer surface of the module housing 10, and the heat conducting plate 60 penetrates the module housing 10 and is thermally connected to the heat conducting portion 211. Specifically, when the heat in the accommodating cavity 13 is conducted to the heat dissipation plate 50 via the heat conducting plate 60, the heat can be radiated from the exposed surface of the heat dissipation plate 50, thereby achieving a heat dissipation effect.
  • the heat conducting part 211 is provided on the housing 21 of the speaker unit 20, and the heat conducting part 211 is connected to the magnetic circuit system 22, so that the heat in the magnetic circuit system 22 can be conducted to the heat conducting part 211, and then in the module
  • the housing 10 is provided with a heat dissipation plate 50 and a heat conduction plate 60.
  • the heat dissipation plate 50 is arranged on the outer surface of the module housing 10.
  • One end of the heat conduction plate 60 is connected to the heat dissipation plate 50, and the other end penetrates the module housing 10 and is connected to the heat conduction part 211. Thermal connection.
  • the heat in the magnetic circuit system 22 can be sequentially conducted from the heat conducting portion 211 and the heat conducting plate 60 to the heat dissipation plate 50, and then radiated from the exposed surface of the heat dissipation plate 50.
  • the heat conduction part 211 and the heat conduction plate 60 are provided for heat conduction, and then the heat dissipation plate 50 is used for heat dissipation.
  • the heat conduction part 211 and the heat conduction plate 60 have better heat conduction effects. It can effectively conduct the heat of the magnetic circuit system 22 to the heat sink 50 for heat dissipation.
  • the temperature in the speaker unit 20 can be reduced by at least 10°C, which improves the speaker module.
  • the heat dissipation capacity It further effectively reduces the temperature in the speaker unit 20 being too high, which causes the Smart PA temperature protection mechanism to be triggered and reduces the input voltage, which may result in poor playback sound quality.
  • the heat-conducting part 211 may be metal, heat-conducting plastic, or composite heat-conducting material.
  • the material of the heat-conducting part 211 may be stainless steel or copper sheet.
  • the heat conduction plate 60 and the heat conduction part 211 are thermally connected to guide the heat of the heat conduction part 211 to be conducted to the heat conduction plate 60. Specific methods include, but are not limited to, directly abutting the heat conduction plate 60 and the heat conduction part 211, or the heat conduction plate 60 and the heat conduction part 211 There is a heat-conducting medium and so on between.
  • the number of the heat dissipation plates 50 may be one or more.
  • the number of the heat dissipation plates 50 may be two, and the two heat dissipation plates 50 are arranged corresponding to the positions of the front acoustic cavity 131 and the rear acoustic cavity 132 respectively.
  • the single housing 21 further includes a mounting part (not shown in the figure).
  • the mounting part is a plastic part.
  • the mounting part and the heat conducting part 211 are integrally injection-molded.
  • the mounting part can be used to mount the pad and the magnetic circuit system. twenty two.
  • the whole single housing 21 may also be made of metal, that is, the single housing 21 only includes the heat conducting portion 211.
  • the module housing 10 corresponding to the rear acoustic cavity 132 is provided with a flexible deformable portion 30, and the speaker module further includes an electronic device housing (not shown), and a gap between the electronic device housing and the module housing 10 is formed Closed cavity, the electronic device housing isolates the sound generated by the flexible deformable part 30 from the sound emitted by the speaker unit 30 through the front sound cavity 131; the module housing 10 is provided with a communication port communicating with the airtight cavity 90, which communicates with The flexible deformable portion 30 is opposite; the speaker module further includes a heat dissipation cover plate 40 located at the communication port, and the heat dissipation cover plate 40 is provided with a plurality of heat dissipation through holes 41.
  • the electronic device housing in this embodiment may be a housing structure integrally formed with the module housing 10, that is, the electronic device housing is a part of the speaker module, and the speaker module is installed in an electronic device such as a mobile phone.
  • the device is installed, it is equivalent to installing the module housing 10 and the electronic device housing in an electronic device such as a mobile phone.
  • the housing of the electronic device can also be used as the housing of an electronic device such as a mobile phone.
  • the rear acoustic cavity 132 is a closed cavity
  • the flexible deformation part 30 includes a central part 31 and a convex suspension part 32 located inside the central part 31, and the suspension part 32 is fixedly connected to the module housing 10.
  • the flexible deformable portion 30 may be a single-layer structure, which is made of one of polymer plastics, thermoplastic elastomers and silicone rubber, or may be a multilayer structure, and at least one layer of the multilayer structure is It is made of one of high molecular plastic, thermoplastic elastomer and silicone rubber.
  • the flexible deforming part 30 deforms with the sound pressure, so that the volume of the rear acoustic cavity 132 can be adjusted, thereby increasing the equivalent acoustic compliance of the rear acoustic cavity 132, effectively reducing the resonance frequency of the speaker module, and improving low-frequency sensitivity ;
  • the vibration system of the speaker unit 20 and the flexible deformation portion 30 are isolated by the electronic device housing, and the radiated sound waves of the flexible deformation portion 30 are enclosed inside the electronic device housing to avoid the reverse phase radiation sound waves of the flexible deformation portion 30 , It has a cancellation effect on the forward radiated sound waves of the speaker unit 20, thereby greatly improving the low-frequency sensitivity of the product as a whole.
  • the heat dissipation cover 40 is a metal piece, the outer surface of the heat dissipation cover 40 is exposed outside the speaker module, the heat dissipation cover 40 covers the flexible deformable portion 30, and the heat dissipation through hole 41 penetrates the heat dissipation cover 40.
  • the heat in the speaker module can be better radiated through the heat dissipation cover 40, and the provision of heat dissipation through holes 41 on the heat dissipation cover 40 can increase the heat dissipation area of the heat dissipation cover 40, and when the flexible deformation part 30 vibrates
  • the heat dissipation through holes 41 can achieve pressure balance during the vibration of the flexible deformation part 30, that is, when the flexible deformation part 30 vibrates, the airflow on both sides of the heat dissipation cover 40 can flow into and out of the heat dissipation cover 40 and the heat dissipation cover 40 through the heat dissipation through holes 41.
  • the cavity between the flexible deformable portion 30 can drive the heat of the flexible deformable portion 30 to be dissipated from the heat dissipation through hole 41, which can further improve the heat dissipation effect of the speaker module.
  • the heat dissipation cover 40 itself has a certain degree of hardness and strength, which can protect the inner flexible deformable part 30.
  • materials with good thermal conductivity such as graphite sheet, copper foil or aluminum foil may also be pasted on the outer surface of the heat dissipation cover plate 40.
  • a composite sheet (not shown in the figure) can be superimposed on the central portion 31 of the flexible deformable portion 30.
  • the strength of the composite sheet is higher than that of the flexible deformable portion 30, and can be made of metal or plastic. , Carbon fiber or its composite structure, etc.
  • the central portion 31 may be a sheet-like overall structure, or may be a hollow structure, and the hollow structure is sealed by a composite sheet.
  • the present invention also provides an electronic device that includes a device housing, a host, and a speaker module.
  • the specific structure of the speaker module refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, Therefore, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.
  • the host and the speaker module are both arranged in the housing.
  • At least a part of the device housing and the sealed cavity 90 of the speaker module form a sealed cavity, and the sealed cavity is arranged between the sealed cavity and the sound hole 14 to prevent the reverse phase radiation of sound waves from the flexible deformable portion 30 and forward radiation to the speaker module Acoustic waves cause cancellation effects, and overall the product's low-frequency sensitivity is greatly improved.
  • the device housing doubles as the cavity wall of the sealed cavity 90, which can make full use of the space inside the electronic device, while saving a part of the space occupied by the cavity wall, which is more conducive to the thin design of the electronic device.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开一种扬声器模组和电子设备，其中，该扬声器模组包括模组外壳、扬声器单体和传热件，所述模组外壳具有收容腔，所述扬声器单体设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳、及连接于所述单体外壳的振动系统和磁路系统，所述振动系统与所述前声腔连通，所述磁路系统与所述后声腔连通，所述传热件设于所述磁路系统和所述后声腔的腔壁之间。本发明技术方案能够提高扬声器模组的散热能力。

Description

扬声器模组和电子设备 技术领域
本发明涉及声能转换技术领域，特别涉及一种扬声器模组和电子设备。
背景技术
扬声器模组是便携式电子设备的重要声学器件，用于完成电信号与声信号之间的转换，为在较小腔体空间下实现较好地声音重放效果，目前常采用的是Smart PA(智能功率放大器)和调音算法，但是在Smart PA应用过程中，扬声器模组会在高功率条件下长时间工作，会增大扬声器模组产生的热量，目前的扬声器模组主要是通过单体外壳上的出音孔进行散热，散热效果差，扬声器模组内的高温无法有效传导散发出去，扬声器模组音圈烧圈风险较大。
发明内容
本发明的主要目的是提出一种扬声器模组，旨在提高扬声器模组的散热能力。
为实现上述目的，本发明提出的扬声器模组，包括：
模组外壳，具有收容腔；
扬声器单体，设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳、及连接于所述单体外壳的振动系统和磁路系统，所述振动系统与所述前声腔连通，所述磁路系统与所述后声腔连通；以及，
传热件，设于所述磁路系统和所述后声腔的腔壁之间。
可选地，所述传热件为弹性件，所述传热件的厚度大于所述磁路系统与所述后声腔的腔壁之间的间距。
可选地，所述传热件包括导热层和弹性层，所述导热层包裹所述弹性层，所述导热层的两相对侧分别抵接所述磁路系统和所述后声腔的腔壁。
可选地，所述弹性层为导热材质。
可选地，所述导热层和所述弹性层之间通过导热胶粘接。
可选地，所述导热层为石墨层、铜箔层或铝箔层；及/或，所述弹性层为导热硅胶层或导热泡棉层。
可选地，所述磁路系统包括导磁轭，所述传热件设于所述导磁轭和所述后声腔的腔壁之间，所述导磁轭和所述后声腔的腔壁至少一者设有限位槽，所述传热件设于所述限位槽。
可选地，所述模组外壳包括上壳和下壳，所述上壳和所述扬声器单体共同形成所述前声腔，所述上壳、所述下壳和所述扬声器单体共同形成所述后声腔；所述传热件设于所述磁路系统和所述下壳之间，所述下壳中至少与所述传热件连接的部分为导热材质。
可选地，所述单体外壳包括导热部，所述导热部与所述磁路系统连接，所述扬声器模组还包括散热板和连接所述散热板的导热板，所述散热板设于所述模组外壳的外表面，所述导热板穿入所述模组外壳，并与所述导热部热传导连接。
可选地，所述后声腔对应的模组外壳上设有柔性形变部，所述扬声器模组还包括电子设备壳体，所述电子设备壳体与所述模组外壳之间形成密闭腔，所述电子设备壳体将所述柔性形变部产生的声音与所述扬声器单体通过所述前声腔传出的声音进行隔离；所述模组外壳上设有与所述密闭腔连通的连通口，所述连通口与所述柔性形变部相对；所述扬声器模组还包括位于所述连通口的散热盖板，所述散热盖板设有散热通孔。
本发明还提出一种电子设备，包括扬声器模组，该扬声器模组包括模组外壳、扬声器单体和传热件，所述模组外壳具有收容腔，所述扬声器单体设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳、及连接于所述单体外壳的振动系统和磁路系统，所述振动系统与所述前声腔连通，所述磁路系统与所述后声腔连通，所述传热件设于所述磁路系统和所述后声腔的腔壁之间。
本发明技术方案通过在磁路系统和后声腔的腔壁之间设置传热件，以在扬声器模组工作时，传热件能够将扬声器单体产生的热量经由磁路系统传导 至后声腔的腔壁，进而由模组外壳将热量传递至外界，相较于通过出音孔散热的方式，本方案中通过设置传热件接触磁路系统和模组外壳传导热量，传热件的导热效果更好，能够有效地将磁路系统的热量传导至散热板进行散热，有效提高了扬声器模组的散热能力。可以有效降低扬声器单体内的温度过高而导致Smart PA(智能功率放大器)温度保护机制被触发而降低输入电压，从而导致重放音质差的可能，还能降低扬声器单体的音圈烧圈风险。而且在通过传热件散热的同时，部分热量也可以通过出音孔辐射出去，相当于可以在通过出音孔进行散热的基础上，能够通过传热件进一步散热，扬声器的散热能力更强。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明扬声器模组一实施例的分解示意图；
图2为图1中扬声器模组组合状态下的剖视图；
图3为图2中A处的放大图；
图4为图3中传热件的结构示意图；
图5为图2中B处的放大图。
附图标号说明：
标号 名称 标号 名称
10 模组外壳 23 振动系统
11 上壳 231 振膜
12 下壳 232 音圈
13 收容腔 30 柔性形变部
131 前声腔 31 中心部
132 后声腔 32 悬挂部
14 出音孔 40 散热盖板
20 扬声器单体 41 散热通孔
21 单体外壳 50 散热板
211 导热部 60 导热板
22 磁路系统 70 传热件
221 导磁轭 71 导热层
222 边导磁板 711 第一传热部
223 边磁体 712 第二传热部
224 中心磁体 713 第三传热部
80 限位槽 72 弹性层
90 密闭腔    
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本发明实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B为例”，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合 出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种扬声器模组，该扬声器模组能够用于耳机、手机等能够发声的电子设备。
在本发明实施例中，请结合参考图1至图3，该扬声器模组包括模组外壳10、扬声器单体20和传热件70，模组外壳10具有收容腔13，扬声器单体20设于收容腔13，并将收容腔13隔设为前声腔131和后声腔132，扬声器单体20包括单体外壳21、及连接于单体外壳21的振动系统23和磁路系统22，振动系统23与前声腔131连通，磁路系统22与后声腔132连通，传热件70设于磁路系统22和后声腔132的腔壁之间。
本实施例中，振动系统23包括振膜231以及固定于振膜231一侧的音圈232。磁路系统22包括导磁轭221，导磁轭221上设有内磁路部分和外磁路部分，两者之间形成容纳音圈232的磁间隙。其中，一种情况下，内磁路部分包括设于导磁轭221的中央位置的中心磁体224和设于中心磁体224上的中心导磁板，外磁路部分包括设于导磁轭221的边缘位置的边磁体223和设于边磁体223上的边导磁板222。
传热件70的两侧分别连接磁路系统22和后声腔132的腔壁，传热件70能够将磁路系统22的热量传导至后声腔132的腔壁，进而由模组外壳10将热量散发出去。其中，传热件70可以仅与导磁轭221热传导连接，也可以仅与边磁体223热传导连接，或者将传热件70同时与导磁轭221热传导及边磁体223热传导连接。传热件70可以为导热泥、石墨、铜箔、铝箔、导热硅胶或导热泡棉等等。此外，传热件70的长度和宽度可以大致与导磁轭221的长度和宽度相同，也可以将传热件70的长度和宽度设置小于或大于导磁轭221的长度和宽度。
本发明技术方案通过在磁路系统22和后声腔132的腔壁之间设置传热件70，以在扬声器模组工作时，传热件70能够将扬声器单体20产生的热量经由磁路系统22传导至后声腔132的腔壁，进而由模组外壳10将热量传递至外界，相较于通过出音孔14散热的方式，本方案中通过设置传热件70接触磁路系统22和模组外壳10传导热量，传热件70的导热效果更好，能够有效地将磁路系统22的热量传导至散热板50进行散热，有效提高了扬声器模组 的散热能力。可以有效降低扬声器单体20内的温度过高而导致Smart PA(智能功率放大器)温度保护机制被触发而降低输入电压，从而导致重放音质差的可能，还能降低扬声器单体20的音圈232烧圈风险。而且在通过传热件70散热的同时，部分热量也可以通过出音孔14辐射出去，相当于可以在通过出音孔14进行散热的基础上，能够通过传热件70进一步散热，扬声器的散热能力更强。
一实施例中，传热件70为弹性件，传热件70的厚度大于磁路系统22与后声腔132的腔壁之间的间距。具体而言，传热件70具有相对的第一表面和第二表面，第一表面与导磁轭221接触，第二表面与后声腔132的腔壁接触，第一表面和第二表面之间的距离为传热件70的厚度。需要说明的是，该厚度指传热件70安装前处于自由状态下的尺寸，当传热件70安装于磁路系统22与后声腔132的腔壁之间时，传热件70受到磁路系统22与后声腔132的腔壁的挤压处于压缩状态，并紧贴合在磁路系统22与后声腔132的腔壁之间。能够减小传热件70与磁路系统22之间、及传热件70与后声腔132的腔壁之间的间隙，提高了传热件70的接触紧密性，导热散热效果更好。此外，还能通过弹性的传热件70进行减振，能够降低扬声器单体20振动时与模组外壳10之间相互碰撞而产生噪音的情况，有利于提高扬声器模组的声学性能。
其中，传热件70的结构具有多种，例如，一实施例中，请结合参考图3和图4，传热件70包括导热层71和弹性层72，导热层71包裹弹性层72，导热层71的两相对侧分别抵接磁路系统22和后声腔132的腔壁。具体而言，导热层71包括与磁路系统22接触的第一传热部711、与后声腔132的腔壁接触的第二传热部712、及连接第一传热部711和第二传热部712的第三传热部713，第一传热部711位于弹性层72和磁路系统22之间，第二传热部712位于弹性层72和后声腔132的腔壁之间，第三传热部713位于弹性层72的外周。其中，第三传热部713可以环绕包裹于弹性层72的外周设置，或者第三传热部713仅包裹部分弹性层72设置。
通过将传热件70设置为导热层71和弹性层72的结构，可以通过导热层71作为主要的导热结构，而将弹性层72作为主要弹性结构，如此既能够较好地传导热量，也能够保证传热件70的弹性。此外，如此在保证散热效果的同时，还能减小导热层71的体积，有利于节省导热层71的用料，即使导热层 71采用导热性更好的材料，也不会导致成本传热件70的成本过高。其中，导热层71可以为石墨、铜箔、银箔或铝箔等等导热性能良好的材质。另外，在其它实施例中，也可以将导热层71呈弹性设置。
为了提高传热件70的导热效果，一实施例中，弹性层72为导热材质。需要说明的是，本实施例中的导热材质指导热性能较好的材质，例如弹性层72为导热硅胶层或导热泡棉层等等具有良好导热性能的弹性材质。传热件70导热时，磁路系统22的热量先传导至第一传热部711，第一传热部711的热量能够分别传导至第三传热部713和弹性层72，再由第三传热部713和弹性层72传导至第二传热部712，最终由第二传热部712将热量传导至模组外壳10辐射至扬声器模组外。如此即可以通过导热层71进行有效导热，也能够通过弹性层72进行有效导热，能够进一步提高扬声器模组的散热效果。
可以理解，在将传热件70在磁路系统22和后声腔132的腔壁之间后，虽然磁路系统22和后声腔132的腔壁能够抵紧传热件70，并使得导热层71和弹性层72之间能够相互抵紧，但是导热层71和弹性层72可能仍会存在微小间隙，从而会降低导热层71和弹性层72之间的热传递效果。故而在一实施例中，导热层71和弹性层72之间通过导热胶粘接。如此一方面导热胶能够填充于导热层71和弹性层72之间的间隙中，而且导热胶具有较好的导热性能，能够提高导热层71和弹性层72之间的导热效果。另一方面还使得导热层71和弹性层72的连接更加牢固，传热件70的结构更加稳定，降低了导热层71和弹性层72分离的风险。
一实施例中，传热件70设于导磁轭221和后声腔132的腔壁之间，导磁轭221和后声腔132的腔壁至少一者设有限位槽80，传热件70设于限位槽80。其中，可以仅在导磁轭221上设有限位槽80，也可以仅在后声腔132的腔壁设置限位槽80，还可以在导磁轭221和后声腔132的腔壁上同时设有限位槽80，且两限位槽80的槽口相对设置。导磁轭221设有限位槽80时，限位槽80位于导磁轭221的背离中心磁体224的表面。通过设置限位槽80，在安装传热件70时，能够方便对传热件70进行定位，以及在安装后能够有效限位。此外，将传热件70设置在限位槽80内时，增大了传热件70与导磁轭221的接触面积、或者传热件70与后声腔132腔壁的接触面积，能够进一步提高热传导效果。当然，在其它实施例中，也可以将传热件70直接抵持在后 声腔132的腔壁和导磁轭221的表面。
请再次结合参考图1和图3，一实施例中，模组外壳10包括上壳11和下壳12，上壳11和扬声器单体20共同形成前声腔131，上壳11、下壳12和扬声器单体20共同形成后声腔132，传热件70设于磁路系统22和下壳12之间，下壳12中至少与传热件70连接的部分为导热材质。具体而言，上壳11和下壳12之间形成收容腔13，扬声器单体20设于上壳11而与上壳11共同形成前声腔131，下壳12、上壳11和扬声器单体20共同形成后声腔132，下壳12的内表面形成后声腔132的腔壁。传热件70的第一表面与导磁轭221抵接，传热件70的第二表面与下壳12的内表面抵接。本实施例中，下壳12整体为导热材质制成，导热材质的导热散热效果较好，传热件70与下壳12抵接时，传热件70与下壳12的热传导效率高，而且下壳12的散热面积大，散热更快，能够提高扬声器模组的散热能力。此外，金属材质的下壳12强度更高，能够提高模组外壳10的整体强度。当然，另一实施例中，下壳12包括壳主体(图未示出)和散热片(图未示出)，壳主体具有敞口(图未示出)，敞口与后声腔132连通，散热片盖合敞口设置，散热片的朝向的内表面形成后声腔132的腔壁，散热片为导热材质，传热件70设于导磁轭221和散热片之间。其中，散热片可以与壳主体注塑为一体，或者散热片粘接于所述壳主体上。散热片的材质可以为不锈钢、铜及其合金、铝及其合金、硅或石墨等等。
请再次结合参考图2和图5，一实施例中，单体外壳21包括导热部211，导热部211与磁路系统22连接，扬声器模组还包括散热板50和连接散热板50的导热板60，散热板50设于模组外壳10的外表面，导热板60穿入模组外壳10，并与导热部211热传导连接。具体而言，当收容腔13内的热量经由导热板60传导至散热板50时，热量能够从散热板50的显露在外的表面辐射出去，进而能够起到散热效果。
通过在扬声器单体20的单体外壳21上设有与导热部211，并将导热部211与磁路系统22连接，使得磁路系统22中的热量能够传导至导热部211，再在模组外壳10上设置散热板50和导热板60，将散热板50设置在模组外壳10的外表面，导热板60一端与散热板50连接，另一端穿入模组外壳10，并与导热部211热传导连接。以使磁路系统22中的热量能够依次从导热部211和导热板60传导至散热板50，再由散热板50显露在外的表面辐射出去。相 较于通过出音孔14散热的方式，本方案中是通过设置导热部211和导热板60进行导热，再通过散热板50进行散热的，导热部211和导热板60的导热效果更好，能够有效地将磁路系统22的热量传导至散热板50进行散热，结合传热件70对扬声器模组进行散热时，至少能够将扬声器单体20内的温度降低10℃，提高了扬声器模组的散热能力。进一步有效降低扬声器单体20内的温度过高而导致Smart PA温度保护机制被触发而降低输入电压，从而导致重放音质差的可能。
其中，导热部211可以为金属、导热塑料或者复合导热材料，例如导热部211的材质可以为不锈钢或铜片等等。导热板60与导热部211热传导连接指导热部211的热量能够传导至导热板60，其具体方式包括但不限于，将导热板60与导热部211直接抵接，或者导热板60和导热部211之间设有导热介质等等。散热板50的数量可以为一个或多个，例如一实施例中，散热板50的数量可以为两个，两个散热板50分别对应前声腔131和后声腔132的位置设置等。另外，一实施例中，单体外壳21还包括安装部(图未示出)，安装部为塑料件，安装部与导热部211一体注塑成型，安装部可以用于安装焊盘和磁路系统22。当然，在其它实施例中，也可以将单体外壳21整体呈金属设置，即单体外壳21仅包括导热部211。
一实施例中，后声腔132对应的模组外壳10上设有柔性形变部30，扬声器模组还包括电子设备壳体(图未示出)，电子设备壳体与模组外壳10之间形成密闭腔，电子设备壳体将柔性形变部30产生的声音与扬声器单体30通过前声腔131传出的声音进行隔离；模组外壳10上设有与密闭腔90连通的连通口，连通口与柔性形变部30相对；扬声器模组还包括位于连通口的散热盖板40，所述散热盖板40设有多个散热通孔41。
需要说明的是，本实施例中的电子设备壳体可以为与模组外壳10一体成型的壳体结构，即电子设备壳体为扬声器模组的一部分，将扬声器模组安装在例如手机等电子设备上时，相当于将模组外壳10和电子设备壳体安装在手机等电子设备内。当然，在其它实施例中，也可以将电子设备壳体作为手机等电子设备的外壳。
后声腔132为密闭腔，柔性形变部30包括中心部31和位于中心部31内侧的凸起状的悬挂部32，悬挂部32与模组外壳10固定连接。其中，柔性形 变部30可以是单层结构，单层结构由高分子塑料、热塑性弹性体和硅橡胶中的一种材料制成，也可以是多层结构，多层结构中的至少一层为高分子塑料、热塑性弹性体和硅橡胶中的一种材料制成。通过设置柔性形变部30，柔性形变部30随着声压产生变形，使得后声腔132的容积大小可调，从而增加后声腔132等效声顺，有效降低扬声器模组的共振频率，提升低频灵敏度；并通过电子设备壳体对扬声器单体20的振动系统和柔性形变部30隔离设计，将柔性形变部30的辐射声波封闭于电子设备壳体内部，避免柔性形变部30的反相位辐射声波，对扬声器单体20的正向辐射声波造成抵消影响，进而整体上较大幅度提升产品的低频段灵敏度。
散热盖板40为金属件，散热盖板40的外表面显露在扬声器模组外，散热盖板40盖合柔性形变部30，散热通孔41贯穿散热盖板40。扬声器模组内的热量能够较好地通过散热盖板40辐射散发出去，而且在散热盖板40上设置散热通孔41可以增大散热盖板40的散热面积，而且在柔性形变部30振动时，散热通孔41可以实现柔性形变部30振动过程中的压力平衡，即在柔性形变部30振动时，散热盖板40两侧的气流能够经过散热通孔41流进和流出散热盖板40和柔性形变部30之间的空腔，进而可以带动柔性形变部30的热量自散热通孔41散发出去，能够进一步提高扬声器模组的散热效果。此外，散热盖板40自身具有一定的硬度及强度，能够对内侧的柔性形变部30形成保护作用。另外，为进一步提高散热盖板40的散热效果，还可以在散热盖板40的外表面贴设是石墨片、铜箔或铝箔等等导热性能好的材料。
进一步的，为了提升振动效果，还可以在柔性形变部30的中心部31上叠加一复合片(图未示出)，该复合片的强度高于柔性形变部30的强度，可以是金属、塑料、碳纤维或者是其复合结构等等。另外中心部31可以是片状的整体结构，也可以是镂空结构，通过复合片密闭该镂空结构。
本发明还提出一种电子设备，该电子设备包括设备壳体、主机和扬声器模组，该扬声器模组的具体结构参照上述实施例，由于本电子设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。其中，主机和扬声器模组均设于壳体内。设备壳体至少一部分与扬声器模组的密闭腔90形成封闭腔，该封闭腔与出音孔14之间密封设置，避免柔性形变部30的反相位辐射声波，对扬声器 模组的正向辐射声波造成抵消影响，进而整体上较大幅度提升产品的低频段灵敏度。而且设备壳体兼做密闭腔90的腔体壁，能够充分利用电子设备内部的空间，同时节约一部分腔体壁占用的空间，更加有利于电子设备的薄型化设计。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (11)

  1. 一种扬声器模组，其特征在于，包括：
    模组外壳，具有收容腔；
    扬声器单体，设于所述收容腔，并将所述收容腔隔设为前声腔和后声腔，所述扬声器单体包括单体外壳、及连接于所述单体外壳的振动系统和磁路系统，所述振动系统与所述前声腔连通，所述磁路系统与所述后声腔连通；以及，
    传热件，设于所述磁路系统和所述后声腔的腔壁之间。
  2. 如权利要求1所述的扬声器模组，其特征在于，所述传热件为弹性件，所述传热件的厚度大于所述磁路系统与所述后声腔的腔壁之间的间距。
  3. 如权利要求2所述的扬声器模组，其特征在于，所述传热件包括导热层和弹性层，所述导热层包裹所述弹性层，所述导热层的两相对侧分别抵接所述磁路系统和所述后声腔的腔壁。
  4. 如权利要求3所述的扬声器模组，其特征在于，所述弹性层为导热材质。
  5. 如权利要求3所述的扬声器模组，其特征在于，所述导热层和所述弹性层之间通过导热胶粘接。
  6. 如权利要求3所述的扬声器模组，其特征在于，所述导热层为石墨层、铜箔层或铝箔层；及/或，所述弹性层为导热硅胶层或导热泡棉层。
  7. 如权利要求1所述的扬声器模组，其特征在于，所述磁路系统包括导磁轭，所述传热件设于所述导磁轭和所述后声腔的腔壁之间，所述导磁轭和所述后声腔的腔壁至少一者设有限位槽，所述传热件设于所述限位槽。
  8. 如权利要求1至7任意一项所述的扬声器模组，其特征在于，所述模组外壳包括上壳和下壳，所述上壳和所述扬声器单体共同形成所述前声腔，所述上壳、所述下壳和所述扬声器单体共同形成所述后声腔；
    所述传热件设于所述磁路系统和所述下壳之间，所述下壳中至少与所述传热件连接的部分为导热材质。
  9. 如权利要求1所述的扬声器模组，其特征在于，所述单体外壳包括导热部，所述导热部与所述磁路系统连接，所述扬声器模组还包括散热板和连接所述散热板的导热板，所述散热板设于所述模组外壳的外表面，所述导热板穿入所述模组外壳，并与所述导热部热传导连接。
  10. 如权利要求1所述的扬声器模组，其特征在于，所述后声腔对应的模组外壳上设有柔性形变部，所述扬声器模组还包括电子设备壳体，所述电子设备壳体与所述模组外壳之间形成密闭腔，所述电子设备壳体将所述柔性形变部产生的声音与所述扬声器单体通过所述前声腔传出的声音进行隔离；
    所述模组外壳上设有与所述密闭腔连通的连通口，所述连通口与所述柔性形变部相对；所述扬声器模组还包括位于所述连通口的散热盖板，所述散热盖板设有散热通孔。
  11. 一种电子设备，其特征在于，包括如权利要求1至10中任意一项所述的扬声器模组。
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CN113993017A (zh) * 2021-11-04 2022-01-28 歌尔科技有限公司 音箱
CN113993017B (zh) * 2021-11-04 2024-04-30 歌尔科技有限公司 音箱
WO2023213333A1 (zh) * 2022-07-02 2023-11-09 林昌鹏 一种基于磁波转换型电子管音频功率放大器

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