WO2021129263A1 - 扬声器内核、扬声器模组和电子设备 - Google Patents

扬声器内核、扬声器模组和电子设备 Download PDF

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Publication number
WO2021129263A1
WO2021129263A1 PCT/CN2020/130382 CN2020130382W WO2021129263A1 WO 2021129263 A1 WO2021129263 A1 WO 2021129263A1 CN 2020130382 W CN2020130382 W CN 2020130382W WO 2021129263 A1 WO2021129263 A1 WO 2021129263A1
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WIPO (PCT)
Prior art keywords
diaphragm
frame
sound
piezoelectric element
speaker
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PCT/CN2020/130382
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English (en)
French (fr)
Inventor
于利刚
苏杰
张贝
金明昱
吴桂敏
孙正滨
辜磊
Original Assignee
华为技术有限公司
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Publication of WO2021129263A1 publication Critical patent/WO2021129263A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein

Definitions

  • This application relates to the technical field of sound production, and in particular to a speaker core, a speaker module and an electronic device.
  • piezoelectric speakers As a common electro-acoustic conversion device that converts electrical energy into sound energy, speakers have a wide variety of types. Piezoelectric speakers are widely used in various consumer electronic products due to their small size, simple process, low cost and high electro-acoustic conversion efficiency. . However, piezoelectric speakers have poor audio performance, and it is difficult to meet people's requirements for speaker acoustic performance.
  • the purpose of this application is to provide a speaker core, a speaker module, and an electronic device for improving audio performance and meeting people's requirements for speaker acoustic performance.
  • the speaker core of the present application includes a first frame, a first diaphragm, and a first piezoelectric element.
  • the first diaphragm includes a middle part and an edge part surrounding the middle part.
  • the edge part is installed on the first frame, and the first piezoelectric element is fixed to
  • the middle part faces the surface of the first frame or the middle part faces away from the surface of the first frame, and the material of the edge part is aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy.
  • the first piezoelectric element drives the middle part to vibrate, which in turn drives the edge part to vibrate and produce sound.
  • the edge part made of aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy has moderate rigidity and low density, It helps to increase the amplitude of vibration at the edge, improve the low-frequency sensitivity of the speaker core, and improve the low-frequency frequency response of the speaker core, thereby improving the audio performance of the speaker core.
  • the speaker core is a piezoelectric speaker core.
  • aluminum-magnesium alloy is an aluminum alloy with magnesium as the main additive element
  • magnesium-aluminum alloy is a magnesium alloy with aluminum as the main additive element
  • the content of magnesium in the material used in the edge part is between 0% and 90%.
  • the magnesium content of the aluminum-magnesium alloy is 5%.
  • the material of the middle part is made of aluminum, aluminum-magnesium alloy, or magnesium-aluminum alloy to reduce the weight of the first diaphragm, increase the sensitivity of the first diaphragm to vibrate under the drive of the first piezoelectric element, and improve The audio performance of the speaker core.
  • the middle part and the edge part are integrally formed to simplify the preparation process of the first diaphragm.
  • the first diaphragm is a film or thin plate made of aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy.
  • the middle part is provided with a through hole to further reduce the weight of the first vibrating membrane and improve the sensitivity of the first vibrating membrane to vibrate under the driving of the first piezoelectric element.
  • the first piezoelectric element is embedded in the through hole, or the first piezoelectric element covers the through hole to drive the part of the first diaphragm near the through hole to vibrate, thereby improving the audio performance of the speaker core.
  • the first diaphragm includes a main diaphragm and an auxiliary diaphragm
  • the auxiliary diaphragm is installed in the middle of the main diaphragm
  • the auxiliary diaphragm and part of the main diaphragm form the middle part
  • part of the auxiliary diaphragm forms the edge part
  • the rigidity of the auxiliary diaphragm is greater than the rigidity of the edge part.
  • the first piezoelectric element is installed on the surface of the auxiliary diaphragm away from the main diaphragm to increase the rigidity of the part of the first diaphragm that carries the first piezoelectric element, so that the first vibration
  • no split vibration occurs, which improves the high-frequency cut-off frequency of the speaker core and improves the high-frequency performance of the speaker core.
  • the thickness of the first diaphragm is between 0.05 mm and 0.3 mm.
  • the selected diaphragm thickness can be adjusted adaptively to improve the audio performance of the speaker cores.
  • the driving force used by the speaker core is small.
  • a thinner diaphragm can be used to improve the low-frequency performance of the speaker core; when the size of the speaker core is large, the driver used by the speaker core If the force is large, a thicker diaphragm can be used at this time to ensure the reliability performance of the speaker core.
  • the first piezoelectric element includes a plurality of piezoelectric ceramic sheets, the resonance frequencies of the plurality of piezoelectric ceramic sheets are different, and the plurality of piezoelectric ceramic sheets are all arranged on the surface of the first diaphragm.
  • the speaker core includes a plurality of piezoelectric ceramic sheets with different resonance frequencies.
  • the plurality of piezoelectric ceramic sheets resonate in different frequency bands, so that the speaker core has better audio performance in all frequency bands.
  • the areas or thicknesses of the plurality of piezoelectric ceramic sheets are different.
  • the material of the piezoelectric ceramic sheet includes an electronic ceramic material with piezoelectric characteristics. Due to the rigidity of the ceramic material, the piezoelectric ceramic sheet does not undergo split vibration when vibrating, which is beneficial to improve the high-frequency performance of the speaker core. .
  • the speaker core further includes a second frame.
  • the second frame is installed on the side of the first diaphragm away from the first frame and clamps the first diaphragm together with the first frame to clamp the first frame.
  • the membrane keeps the first vibrating membrane always in a tensioned state, improves the sensitivity of the first vibrating membrane to vibrate under the driving of the first piezoelectric element, and thereby improves the audio performance of the speaker core.
  • the speaker core further includes a second diaphragm and a second piezoelectric element.
  • the edge of the second diaphragm is installed on the surface of the second frame away from the first diaphragm.
  • the second diaphragm is connected to the second frame and the first diaphragm.
  • a diaphragm surrounds the front sound cavity, and the second piezoelectric element is installed in the middle area of the surface of the second diaphragm facing the second frame, or the middle area of the surface of the second diaphragm facing away from the second frame;
  • the vibration direction in which the second piezoelectric element drives the second vibrating membrane to vibrate is opposite to the vibration direction in which the first piezoelectric element drives the first vibrating membrane to vibrate.
  • the first piezoelectric element and the second piezoelectric element respectively drive the first diaphragm and the second diaphragm to vibrate and produce sound.
  • the second piezoelectric element drives the second diaphragm to vibrate.
  • the vibration direction is opposite to the vibration direction in which the first piezoelectric element drives the first diaphragm to vibrate, which is equivalent to two speaker cores working at the same time, which is beneficial to improve the sound pressure level of the speaker cores.
  • the sum of the masses of the second diaphragm and the second piezoelectric element is equal to the sum of the masses of the first diaphragm and the first piezoelectric element, and the second piezoelectric element drives the second diaphragm to vibrate.
  • the speed is the same as the vibration speed at which the first piezoelectric element drives the first diaphragm to vibrate, because the second piezoelectric element drives the second diaphragm to vibrate in the same direction as the first piezoelectric element drives the first diaphragm to vibrate.
  • the second piezoelectric element drives the second diaphragm to vibrate and the first piezoelectric element drives the first diaphragm to vibrate.
  • the impact on the vibration of the electronic device is canceled out, which reduces the vibration impact on the electronic device when the speaker core sounds. Improve the user experience.
  • the speaker core further includes a third frame.
  • the third frame is installed on the side of the second diaphragm away from the second frame and clamps the second diaphragm together with the second frame to clamp the second diaphragm.
  • the membrane keeps the second vibrating membrane always in a tensioned state, improves the sensitivity of the second vibrating membrane to vibrate under the driving of the second piezoelectric element, and thereby improves the audio performance of the speaker core.
  • the speaker module of the present application includes a shell and any one of the above-mentioned speaker cores.
  • the shell is installed on the surface of the first frame away from the first diaphragm.
  • the shell or the speaker core is provided with a sound hole to drive the first piezoelectric element. The sound generated by the vibration of the first diaphragm is transmitted to the external environment to realize the sound generation of the speaker module.
  • the first piezoelectric element drives the middle part to vibrate, which in turn drives the edge part to vibrate and produce sound.
  • the edge part made of aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy has moderate rigidity and low density, It is helpful to increase the amplitude when the edge part vibrates, improve the low-frequency sensitivity of the speaker module, and improve the low-frequency frequency response of the speaker module, thereby improving the audio performance of the speaker module.
  • the speaker module is a piezoelectric speaker module.
  • the loudspeaker module further includes a sound output member, the sound output member is installed on the speaker core, the sound output member is provided with a sound channel, the sound channel communicates with the sound hole, and drives the first piezoelectric member The sound emitted by the vibration of the first diaphragm is directed to the external environment.
  • the electronic equipment of this application includes a screen, a housing, and any of the above-mentioned speaker modules.
  • the screen is mounted on the housing, the housing is provided with a sound hole, the speaker module is located between the display screen and the housing, and the housing is mounted on the housing or the display screen
  • the sound hole is connected with the sound hole, so that the sound generated by the first piezoelectric element to drive the first diaphragm to vibrate is transmitted to the external environment through the sound hole and the sound hole in order to realize the sound generation of the electronic device.
  • the first piezoelectric element drives the middle part to vibrate, which in turn drives the edge part to vibrate and produce sound.
  • the edge part made of aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy has moderate rigidity and low density, It helps to increase the amplitude of vibration at the edge, improve the low-frequency sensitivity of electronic equipment, and enhance the low-frequency frequency response of electronic equipment, thereby improving the audio performance of electronic equipment.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an exploded structure of the electronic device shown in FIG. 1;
  • FIG. 3 is a schematic diagram of an exploded structure of the speaker module in the electronic device shown in FIG. 2;
  • FIG. 4 is a schematic cross-sectional structure diagram of the speaker module in the electronic device shown in FIG. 2 along the A-A direction;
  • FIG. 5 is a schematic cross-sectional structure diagram of the speaker module in the electronic device shown in FIG. 2 along the B-B direction;
  • Figure 6 is a simulation test of the frequency response curve of the diaphragm for PET film and magnesium-aluminum alloy film
  • FIG. 7 is a schematic structural diagram of the first piezoelectric element in the speaker module shown in FIG. 3 in another embodiment
  • FIG. 8 is a schematic structural diagram of the first diaphragm in the speaker module shown in FIG. 3 in another embodiment
  • FIG. 9 is a schematic diagram of the structure of the first diaphragm in the speaker module shown in FIG. 3 in a third embodiment
  • FIG. 10 is a schematic diagram of an exploded structure of the first diaphragm shown in FIG. 9;
  • Fig. 11 is a partial cross-sectional structural diagram of the electronic device shown in Fig. 1 along the direction C-C;
  • Fig. 12 is a partial cross-sectional structural diagram of the electronic device shown in Fig. 1 along the D-D direction;
  • FIG. 13 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of a partially exploded structure of the electronic device shown in FIG. 13;
  • FIG. 15 is a schematic partial cross-sectional structure diagram of the electronic device shown in FIG. 13 along the E-E direction;
  • Fig. 16 is a partial cross-sectional structural diagram of the electronic device shown in Fig. 13 along the F-F direction;
  • FIG. 17 is a schematic structural diagram of a third electronic device provided by an embodiment of the present application.
  • FIG. 18 is a schematic diagram of an exploded structure of the speaker module in the electronic device shown in FIG. 17;
  • Fig. 19 is a schematic partial cross-sectional structure diagram of the electronic device shown in Fig. 17 along the G-G direction;
  • FIG. 20 is a partial cross-sectional structure diagram of the electronic device shown in FIG. 17 along the H-H direction.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an exploded structure of the electronic device 100 shown in FIG. 1.
  • the electronic device 100 may be a product with a sound function such as a mobile phone, a tablet computer, a multimedia player, an e-book reader, a notebook computer, a vehicle-mounted device, or a wearable device.
  • the electronic device 100 is a mobile phone as an example for description.
  • the electronic device 100 includes a housing 10, a screen 20, a circuit board 30, a controller 40, a signal processor 50, and a speaker module 60.
  • the housing 10 is provided with a sound hole 101.
  • the screen 20 is installed on the casing 10 and encloses the inner cavity of the whole machine together with the casing 10.
  • the circuit board 30, the controller 40, the signal processor 50 and the speaker module 60 are all accommodated in the internal cavity of the complete machine.
  • the controller 40 and the signal processor 50 are both installed on the circuit board 30, and the controller 40 is electrically connected to the signal processor 50.
  • the controller 40 sends an audio signal
  • the signal processor 50 receives the audio signal, performs processing such as amplifying and modifying the audio signal, and sends the processed audio signal.
  • the speaker module 60 is electrically connected to the signal processor 50, receives the processed audio signal, and vibrates and produces sound according to the received audio signal. The sound diffuses into the external environment through the sound hole 101 to realize the sound production of the electronic device 100.
  • the housing 10 includes a middle frame 11 and a back cover 12, and the sound hole 101 is opened on the middle frame 11.
  • the middle frame 11 includes an upper middle frame 111, a lower middle frame 112, a left middle frame 113, a right middle frame 114 and a partition 115.
  • the sound hole 101 is opened on the upper middle frame 111.
  • the upper middle frame 111 and the lower middle frame 112 are arranged parallel and opposite to each other.
  • the upper middle frame 111 includes an inner surface, a top surface, an outer surface, and a bottom surface that are sequentially connected.
  • the inner surface of the upper middle frame 111 is the surface of the upper middle frame 111 facing the lower middle frame 112, and the inner surface of the upper middle frame 111 is provided with a first receiving groove 116 and a second receiving groove 117 spaced apart. Both the first receiving groove 116 and the second receiving groove 117 penetrate the top surface and the bottom surface of the upper middle frame 111.
  • the outer surface of the upper middle frame 111 is opposite to the inner surface, that is, the outer surface of the upper middle frame 111 is the surface of the upper middle frame 111 away from the lower middle frame 112.
  • the sound hole 101 is opened on the outer surface of the upper middle frame 111 and communicates with the first receiving groove 116.
  • the plurality of sound outlets 101 are arranged on the outer surface of the upper middle frame 111 at intervals to increase the volume of the sound emitted by the electronic device 100.
  • the sound hole 101 may also be opened in other positions of the middle frame 11 or the back cover 12, which is not specifically limited in this application.
  • orientation terms such as “top” and "bottom” used by the electronic device 100 shown in this embodiment are mainly explained based on the display orientation in FIG. Limitation of orientation.
  • the left middle frame 113 and the right middle frame 114 are connected between the upper middle frame 111 and the lower middle frame 112.
  • the left middle frame 113 and the right middle frame 114 are parallel and opposite to each other.
  • the left middle frame 113 includes an inner surface and a bottom surface.
  • the inner surface of the left middle frame 113 is the surface of the left middle frame 113 facing the right middle frame 114 and is connected to the inner surface of the upper middle frame 111.
  • the bottom surface of the left middle frame 113 is connected to the inner surface of the left middle frame 111 and is located on the same surface as the bottom surface of the upper middle frame 111.
  • a third accommodating groove (not shown in the figure) is opened at the junction between the inner surface and the bottom surface of the left middle frame 113.
  • the right middle frame 114 includes an inner surface and a bottom surface.
  • the inner surface of the right middle frame 114 is the surface of the right middle frame 114 and the inner surface of the left middle frame 113 opposite to each other, and is connected to the inner surface of the upper middle frame 111, that is, the inner surface of the upper middle frame 111 is connected to the left middle frame 113 Between the inner surface and the inner surface of the right middle frame 114.
  • the bottom surface of the right middle frame 114 is connected to the inner surface of the right middle frame 114 and is located on the same surface as the bottom surface of the upper middle frame 111 and the bottom surface of the left middle frame 111.
  • a fourth accommodating groove 118 is opened at the junction of the inner surface and the bottom surface of the right middle frame 114.
  • the upper middle frame 111 is generally upward
  • the lower middle frame 112 is generally downward
  • the left middle frame 113 is close to the user's left hand side
  • the right middle frame 114 is close to the user's right hand side.
  • the left middle frame 113, the upper middle frame 111, the right middle frame 114, and the lower middle frame 112 are sequentially connected to form a storage space 110, that is, the left middle frame 113 and the right middle frame 114 are surrounded by the upper middle frame 111 and the lower middle frame 112 to form a storage space.
  • the partition 115 is connected between the left middle frame 113 and the right middle frame 114 and divides the storage space 110 into a first storage space 1101 and a second storage space 1101.
  • the first accommodating space 1101 is close to the upper middle frame 111, and the first accommodating groove 116, the second accommodating groove 117, the third accommodating groove 119 and the fourth accommodating groove 118 are all connected with the first accommodating space 1101.
  • the second accommodating space 1102 is close to the lower middle frame 112 for accommodating the battery 70 of the electronic device 100.
  • the rear cover 12 is installed on one side of the middle frame 11.
  • the back cover 12 can be detachably installed on the middle frame 11 to facilitate the maintenance and replacement of the battery, memory card or circuit board in the electronic device 100.
  • the middle frame 11 can be made of metal alloy materials such as titanium alloy or aluminum-magnesium alloy
  • the back cover 12 can be made of PC (Polycarbonate), ABS (Acrylonitrile Butadiene Styrene) copolymers) and other engineering plastics or titanium alloys, aluminum-magnesium alloys and other metal alloys.
  • the back cover 12 and the middle frame 11 may be integrally formed to improve the structural stability of the electronic device 100.
  • the middle frame 11 and the back cover 12 may be made of metal materials.
  • the screen 20 is installed on the side of the middle frame 11 away from the rear cover 12.
  • the screen 20 is placed toward the user, and the back cover 12 is placed away from the user.
  • the screen 20 includes a display surface 201 and a non-display surface 202 arranged oppositely.
  • the display surface 201 is the surface of the screen 20 away from the middle frame 11 for displaying images.
  • the edge of the screen 20 is provided with an earpiece hole 203.
  • the earpiece hole 203 penetrates the display surface 201 and the non-display surface 202 and communicates with the second receiving groove 117.
  • the screen 20 includes a cover plate and a display screen fixed on the cover plate.
  • the cover plate can be made of transparent materials such as glass.
  • the display screen can be an LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode) display.
  • the screen 20 and the rear cover 12 are respectively installed on both sides of the middle frame 11 to seal the receiving space 110 to form an internal cavity of the complete machine, and the circuit board 30 is located in the internal cavity of the complete machine.
  • the circuit board 30 is located in the first accommodating space 1101 and is located close to the back cover 12, that is, the circuit board 30 is located away from the screen 20.
  • both ends of the circuit board 30 are installed in the third and fourth receiving grooves 118 respectively.
  • the circuit board 30 includes a mounting surface 301, and the mounting surface 301 is the surface of the circuit board 30 facing the back cover 12.
  • the mounting surface 301 is provided with a wiring hole 31 communicating with the first accommodating space 1101.
  • the circuit board 30 is the main board of the electronic device 100.
  • the controller 40 and the signal processor 50 are installed on the mounting surface 301.
  • the controller 40 is a CPU (Central Processing Unit) of the electronic device 100
  • the signal processor 50 is a PA (Power Amplifier) for amplifying or modifying audio signals.
  • the audio performance of the electronic device 100 is improved.
  • the speaker module 60 is located in the first accommodating space 1101 and is installed on the side of the circuit board 30 away from the back cover 12. Among them, the speaker module 60 is a piezoelectric speaker module.
  • the speaker module 60 includes a speaker core 61, a housing 62 and a sound output component 63. Specifically, the speaker core 61 is provided with two spaced sound outlets (not shown in the figure).
  • the speaker core 61 is electrically connected to the signal processor 50 through two first wires 80. One end of the two first wires 80 is electrically connected to the speaker core 61, and the other end extends from the connection hole 31 and is electrically connected to the signal processor 50.
  • the two first wires 80 are respectively a positive wire 80 and a negative wire 80.
  • the positive wire 80 is electrically connected to the positive electrode of the signal processor 50, and the negative wire 80 is electrically connected to the negative electrode of the signal processor 50.
  • the housing 62 is installed on the speaker core 61 and located on the side of the speaker core 61 away from the circuit board 30. It should be noted that in other embodiments, the sound outlet may also be provided on the housing, which is not specifically limited in this application.
  • the sound output assembly 63 is installed on the speaker core 61 and is located on the side of the speaker core 61 facing the upper frame 111.
  • the sound output assembly 63 includes two sound output parts, the two sound output parts are installed at intervals on the periphery of the speaker core 63, and each sound output part is provided with a sound output channel.
  • the two sound output pieces are the first sound output piece 631 and the second sound output piece 632 respectively.
  • the sound channel 633 of the first sound output member 631 communicates with one sound outlet, and the sound channel 634 of the second sound output member 632 communicates with the other sound outlet.
  • the sound produced by the loudspeaker core 61 is transmitted to the sound channel 633 of the first sound member 631 and the sound channel 634 of the second sound member 632 through the two sound holes 601 respectively, and the sound is in the sound channel 633 and the sound channel 634 of the second sound member 632.
  • the sound channels 634 are gathered and transmitted to the external environment, which helps to increase the volume and tone of the sound generated by the speaker core 60.
  • the sound channel 633 of the first sound output member 631 is the speaker sound channel of the electronic device 100
  • the sound channel 634 of the second sound member 632 is the earpiece sound channel of the electronic device 100.
  • FIG. 3 is an exploded structure diagram of the speaker module 60 in the electronic device 100 shown in FIG. 2.
  • the speaker core 61 includes a frame 611, a first diaphragm 612, and a first piezoelectric element 613.
  • the frame 611 includes a first frame 614 and a second frame 615 that are arranged opposite to each other.
  • the first frame 614 includes a first surface 6141 and a second surface 6142 disposed opposite to each other, and an outer peripheral surface 6143 connected between the first surface 6141 and the second surface 6142.
  • the first frame 614 is provided with a first through slot 6144.
  • the first through groove 6144 penetrates the first surface 6141 and the second surface 6142.
  • the area of the outer peripheral surface 6143 facing the sound output member 613 is provided with two sound output holes 601, and both of the sound output holes 601 are communicated with the first through groove 6144.
  • the second frame 615 is located on one side of the first frame 614.
  • the second frame 615 includes a third surface 6151 facing the first frame 614 and a fourth surface 6152 disposed opposite to the third surface 6151.
  • the second frame 615 is provided with a second through groove 6153 passing through the third surface 6151 and the fourth surface 6152.
  • the first diaphragm 612 is located between the first frame 614 and the second frame 615.
  • the first diaphragm 612 includes a middle portion 6121 and an edge portion 6122.
  • the middle portion 6121 is used to carry the first piezoelectric element 613.
  • the edge portion 6122 surrounds the middle portion 6121, and the material of the edge portion 6122 is aluminum, aluminum-magnesium alloy, or magnesium-aluminum alloy.
  • the content of magnesium is between 0% and 90%. It should be understood that aluminum-magnesium alloys are aluminum alloys with magnesium as the main additive element, and magnesium-aluminum alloys are magnesium alloys with aluminum as the main additive element.
  • the edge part 6122 made of aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy has moderate rigidity and low density, which helps increase the amplitude of the edge part 6122 when vibration occurs, and improves the low-frequency sensitivity of the speaker core 62.
  • the low frequency response of the speaker core 62 is improved, the audio performance of the speaker core 62 is improved, and the audio performance of the speaker module 60 and the electronic device 100 is improved.
  • the thickness of the first diaphragm 612 is between 0.05 mm and 0.3 mm.
  • the selected diaphragm thickness can be adjusted adaptively to improve the audio performance of the speaker cores.
  • the driving force used by the speaker core is small.
  • a thinner diaphragm can be used to improve the low-frequency performance of the speaker core; when the size of the speaker core is large, the driver used by the speaker core If the force is large, a thicker diaphragm can be used at this time to ensure the reliability performance of the speaker core.
  • FIG. 4 is a schematic cross-sectional structure diagram of the speaker module 60 in the electronic device 100 shown in FIG. 2 along the A-A direction.
  • FIG. 5 is a schematic cross-sectional structure diagram of the speaker module 60 in the electronic device 100 shown in FIG. 2 along the B-B direction.
  • the edge portion 6122 of the first diaphragm 612 is installed on the first frame 614, and the second frame 615 is installed on the side of the edge portion 6122 away from the first frame 614, that is, the edge portion 6122 is installed between the first frame 614 and the second frame 615. between. Specifically, the edge portion 6122 is installed on the first surface of the first frame 614 and the third surface of the second frame 615. Wherein, the edge portion 6122 is respectively installed on the first surface of the first frame 614 and the third surface of the second frame 615 through the adhesive layer 90.
  • the second frame 615 is located on the side of the first diaphragm 612 away from the first frame 614, and clamps the first diaphragm 612 together with the first frame 614, so that the first diaphragm 612 is separated by the first frame 614
  • the second frame 615 is clamped and is always in a tight state, which improves the vibration sensitivity of the first diaphragm 612, which is beneficial to improve the audio performance of the speaker module 60.
  • the material of the middle part 6121 is aluminum, aluminum-magnesium alloy or magnesium-aluminum alloy to reduce the weight of the first diaphragm 612 and increase the vibration of the first diaphragm 612 driven by the first piezoelectric element 613
  • the sensitivity improves the audio performance of the speaker core 62.
  • the middle part 6121 and the edge part 612 are integrally formed to simplify the preparation process of the first diaphragm 612 and save the production cost of the speaker core 62.
  • the first diaphragm 612 is an aluminum, aluminum-magnesium-aluminum, or magnesium-aluminum alloy film or thin plate.
  • Figure 6 is a simulation test of the frequency response curve of a PET film and an aluminum-magnesium alloy film. Among them, the magnesium content of the aluminum-magnesium alloy film is 5%.
  • the first piezoelectric element 613 is installed in the middle part 6121. Specifically, the first piezoelectric element 613 is installed on the surface of the middle part 6121 away from the first frame 614, that is, the first piezoelectric element 613 is installed on the surface of the middle part 6121 facing the second frame 615. Wherein, the first piezoelectric element 613 can be installed on the surface of the middle portion 6121 through the adhesive layer 90. At this time, the orthographic projection of the first piezoelectric element 613 on the first diaphragm 612 just covers the middle portion 6121, that is, the portion covered by the projection of the first piezoelectric element 613 on the first diaphragm 612 is the middle portion 6121. It should be noted that in other embodiments, the first piezoelectric element 613 may be installed on the surface of the middle portion 6121 close to the first frame 614, or it may also be embedded in the middle portion 6121, which is not specifically limited in this application. .
  • the first piezoelectric element 613 includes a piezoelectric ceramic sheet.
  • the piezoelectric ceramic sheet has a positive electrode and a negative electrode.
  • the positive electrode of the piezoelectric ceramic sheet is connected to the positive electrode lead 80, and the negative electrode is connected to the negative electrode lead 80.
  • the piezoelectric ceramic sheet receives the audio signal transmitted by the first lead 80 and drives the first diaphragm 612 to vibrate and produce sound.
  • the materials of piezoelectric ceramics include PZT (lead zirconate titanate piezoelectric ceramics, Pb(Zr(1-x)Tix)O3) and other electronic ceramic materials with piezoelectric characteristics.
  • the rigidity of ceramic materials is large, and piezoelectric ceramics When the sheet vibrates, it is not prone to split vibration, which is beneficial to improve the high-frequency performance of the electronic device 100. At this time, the piezoelectric ceramic sheet will deform under the action of an external electric field due to its piezoelectric effect.
  • FIG. 7 is a schematic structural diagram of the first piezoelectric element 613 in the speaker module 60 shown in FIG. 3 in another embodiment.
  • the difference between the first piezoelectric element 613 shown in this embodiment and the first piezoelectric element 613 shown in the foregoing embodiment is that the first piezoelectric element 613 includes a plurality of piezoelectric ceramic sheets, The resonance frequency is different, and a plurality of piezoelectric ceramic sheets are all arranged on the surface of the middle part 6122. Specifically, the areas of the plurality of piezoelectric ceramic sheets are different. Among them, multiple refers to two or more. It should be noted that in other embodiments, the multiple piezoelectric ceramic sheets may also have different thicknesses, or the multiple piezoelectric ceramic sheets may have different areas and thicknesses.
  • the first piezoelectric element 613 includes three piezoelectric ceramic sheets with different areas as an example for description.
  • the three piezoelectric ceramic sheets are the first piezoelectric ceramic sheet 6131, the second piezoelectric ceramic sheet 6132, and the third piezoelectric ceramic sheet 6133, respectively.
  • the first piezoelectric ceramic sheet 6131, the second piezoelectric ceramic sheet 6132, and the third piezoelectric ceramic sheet 6133 are all disposed on the middle portion 6121, and the positive and negative electrodes of the three are connected to the two first wires 80 respectively.
  • receiving the audio signal transmitted through the first wire 80 drives the first diaphragm 612 to vibrate and produce sound.
  • the first piezoelectric ceramic sheet 6131 has the largest area and resonates at low frequencies (for example, the frequency is within 0 to 1 kHz).
  • the second piezoelectric ceramic sheet 6132 is disposed adjacent to the first piezoelectric ceramic sheet 6131, and the area of the second piezoelectric ceramic sheet 6132 is smaller than the area of the first piezoelectric ceramic sheet 6131. After the second piezoelectric ceramic sheet 6132 receives the audio signal, it resonates at the intermediate frequency (for example, the frequency is within 1kHz ⁇ 3kHz) to compensate for the sound pressure at the intermediate frequency when the first piezoelectric ceramic sheet 6131 drives the first diaphragm 612 to vibrate and produce sound. Insufficiency of lower grade.
  • the third piezoelectric ceramic sheet 6133 is disposed adjacent to the second piezoelectric ceramic sheet 6132, and the area of the third piezoelectric ceramic sheet 6133 is smaller than the area of the second piezoelectric ceramic sheet 6132. After the third piezoelectric ceramic sheet 6133 receives the audio signal, it resonates at a high frequency (for example, the frequency is above 3kHz) to compensate for the higher sound pressure level at high frequencies when the second piezoelectric ceramic sheet 6132 drives the first diaphragm 612 to vibrate and produce sound. Low deficiency.
  • the second piezoelectric ceramic sheet 6132 can make up for the lack of sound pressure level at the intermediate frequency when the first piezoelectric ceramic sheet 6131 drives the first diaphragm 612 to vibrate and produce sound.
  • the ceramic sheet 6133 can make up for the insufficiency of the sound pressure level at high frequencies when the second piezoelectric ceramic sheet 6132 drives the first diaphragm 612 to vibrate and produce sound, that is, the first piezoelectric ceramic sheet 6131, the second piezoelectric ceramic sheet 6132, and the third piezoelectric ceramic sheet 6132.
  • the piezoelectric ceramic sheet 6133 respectively resonates in the low, middle and high frequency bands, so that the loudspeaker module 60 has a higher sound pressure level in the whole frequency band, and improves the audio performance of the electronic device 100 in the whole frequency band.
  • FIG. 8 is a schematic structural diagram of the first diaphragm 612 in the speaker module 60 shown in FIG. 3 in another embodiment.
  • the difference between the first diaphragm 612 shown in this embodiment and the first diaphragm 612 shown in the foregoing embodiment is that the middle portion 6121 is provided with a through hole 6123, and the first piezoelectric element is mounted on the middle portion 6121 and covers Through hole 6123.
  • the first vibrating membrane 612 shown in this embodiment is provided with a through hole 6123, which is equivalent to reducing the mass of the first vibrating membrane 612 and improving the sensitivity of the first vibrating membrane 612 to vibrate under the driving of the first piezoelectric element 613. Improve the audio performance of the speaker module 60.
  • the first piezoelectric element may also be embedded in the through hole 6123 to reduce the mass of the first diaphragm 612 and improve the vibration sensitivity of the first diaphragm 612.
  • the first piezoelectric element 613 can be adhered to the hole wall of the through hole 6123 through an adhesive layer.
  • FIG. 9 is a schematic diagram of the structure of the first diaphragm 612 in the speaker module 60 shown in Fig. 3 in a third embodiment.
  • FIG. 10 is a schematic diagram of an exploded structure of the first diaphragm 612 shown in FIG. 9.
  • the difference between the first diaphragm 612 shown in this embodiment and the first diaphragm 612 shown in another embodiment is that the first diaphragm 612 includes a main diaphragm 612a and an auxiliary diaphragm 612b, and the auxiliary diaphragm 612b Installed in the middle of the main body diaphragm 612a.
  • Part of the main diaphragm 612a and the auxiliary diaphragm 612b form a middle part (not shown), and part of the main diaphragm 612a forms an edge part (not shown).
  • the main diaphragm 612a includes a first part 612c and a second part 612d surrounding the first part 612c.
  • the first part 612c is provided with an opening 612e.
  • the second portion 612d forms an edge portion.
  • the auxiliary diaphragm 612b is installed on the surface of the first part 612c and covers the opening 612e.
  • the auxiliary diaphragm 612b and the first part 612c form an intermediate part.
  • the rigidity of the auxiliary diaphragm 612b is greater than the rigidity of the edge portion 6122.
  • the material of the auxiliary diaphragm 612b includes but is not limited to carbon fiber, PMI (polymethacrylimide), magnesium aluminum alloy, aluminum foil, or composite material of aluminum foil.
  • the first piezoelectric element is installed on the surface of the auxiliary diaphragm 612b away from the main diaphragm 612a to increase the rigidity of the part of the first diaphragm 612 that carries the first piezoelectric element 613, so that the first diaphragm 612 is in the first piezoelectric
  • the split vibration does not occur, the high-frequency cut-off frequency of the speaker module 60 is improved, and the high-frequency performance of the speaker module 60 is improved.
  • the housing 62 is a flat plate structure, and the housing 62 is installed on the side of the first frame 614 away from the first diaphragm 612. Specifically, the housing 62 is installed on the second surface of the first frame 614 and covers the first through groove. Wherein, the housing 62 is installed on the second surface of the first frame 614 through the adhesive layer 90.
  • the housing 62 and the first diaphragm 612 are respectively installed on opposite sides of the first frame 614, and surround the first frame 614 and the housing 62 to form a front sound cavity 602.
  • the two sound holes 601 are connected to the front sound cavity. 602 connected.
  • the first sound output member 631 is installed on the periphery of the speaker core 61 through the adhesive layer 90, and the sound channel 633 of the first sound output member 631 communicates with a sound hole 601, that is, the sound hole 601 communicates with the sound channel 633 and Front sound cavity 602.
  • the second sound outlet 632 is installed on the periphery of the speaker core 61 through the adhesive layer 90, and the sound outlet channel 634 of the second sound outlet 632 communicates with the other sound outlet 601, that is, the other sound outlet 601 communicates with the sound outlet.
  • the first piezoelectric element 613 drives the first diaphragm 612 to vibrate, and then drives the air in the front sound cavity 602 to vibrate to generate sound waves.
  • the sound waves in the front sound cavity 602 enter the sound channels 633 and 633 through the two sound outlet holes 601, respectively.
  • the sound output channel 634 is transmitted to the external environment through the sound output channel 633 and the sound output channel 634 to realize the sound generation of the speaker module 60.
  • FIG. 11 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 1 along the direction C-C.
  • FIG. 12 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 1 along the D-D direction.
  • the speaker module 60 is installed on the non-display surface 202 of the screen 20.
  • the speaker module 60 is mounted on the non-display surface 202 through the adhesive layer 90.
  • the housing 62 is connected to the adhesive layer 90, that is, the adhesive layer 90 is connected between the housing 62 and the screen 20.
  • the front sound cavity 602 is a cavity close to the screen 20 in the electronic device 100.
  • the speaker module 60 may not include the housing 62, and the first frame 614 is directly sealed and mounted on the screen 20, and is surrounded by the first diaphragm 612, the first frame 614, and the screen 20.
  • the front sound cavity 602 is formed to omit the housing 62 and reduce the thickness of the speaker module 60, thereby reducing the thickness of the electronic device 100.
  • a back sound cavity 603 is formed between the first diaphragm 612 and the back cover 12. At this time, the back sound cavity 603 is a cavity close to the back cover 12 in the electronic device 100.
  • the rear sound cavity 603 is completely isolated from the front sound cavity 602 to prevent the sound generated by the front sound cavity 602 and the rear sound cavity 603 from cancelling each other.
  • the speaker module 60 in this embodiment uses the back cover 12 and the first diaphragm 612 to form a back sound cavity 603, which eliminates the back cover that forms the sound cavity with the diaphragm in the traditional speaker module, and not only makes full use of the electronic device 100
  • the internal space increases the volume of the sound cavity of the rear sound cavity 603, improves the acoustic performance of the speaker module 60, and also helps reduce the thickness of the electronic device 100, which is beneficial to the slim design of the electronic device 100.
  • the part of the first sound output member 631 away from the speaker core 62 is received in the first receiving groove 116, and the sound channel 633 of the first sound member 631 communicates with the sound hole 101, that is, the sound channel 633 communicates with the sound hole 601 And the sound hole 101.
  • the part of the second sound output member 632 away from the speaker core 62 is received in the second receiving groove 117, and the sound channel 634 of the second sound output member 631 communicates with the earpiece hole 203.
  • the first piezoelectric element 613 drives the first diaphragm 612 to vibrate, which in turn drives the air in the front sound cavity 602 and the rear sound cavity 603 to vibrate to produce sound waves.
  • the sound waves in the front sound cavity 602 enter through the two sound outlet holes 601 respectively.
  • the sound output channel 633 and the sound channel 634 are then transmitted to the external environment through the sound hole 101 and the earpiece hole 203, respectively, to realize the sound generation of the electronic device 100.
  • FIG. 13 is a schematic structural diagram of another electronic device 100 provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of a partially exploded structure of the electronic device 100 shown in FIG. 13.
  • the circuit board 30 is arranged close to the screen 20, and the speaker module 60 is located on the side of the circuit board 30 away from the screen 20, that is, the speaker module 60 is located on the circuit board. 30 is close to the side of the back cover 12.
  • the left middle frame 113 also includes a top surface disposed opposite to the bottom surface.
  • the top surface of the left middle frame 113 is connected to the inner surface, and is located on the same surface as the top surface of the upper middle frame 111.
  • the third receiving groove 119 is opened at the junction of the top surface and the inner surface.
  • the right middle frame 114 also includes a top surface disposed opposite to the bottom surface.
  • the top surface of the right middle frame 114 is connected to the inner surface and is located on the same surface as the top surface of the upper middle frame 111.
  • the fourth receiving groove 118 is opened at the junction between the top surface and the inner surface of the right middle frame 114.
  • the two ends of the circuit board 30 are respectively installed in the third receiving groove 119 and the fourth receiving groove 118.
  • FIG. 15 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 13 along the E-E direction.
  • FIG. 16 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 13 along the F-F direction.
  • the speaker module 60 is installed on the back cover 12.
  • the speaker module 60 is installed on the back cover 12 through the adhesive layer 90.
  • the housing 62 is mounted on the back cover 12 through the adhesive layer 90, that is, the adhesive layer 90 is bonded between the housing 62 and the back cover 12.
  • the speaker core 61 is located on the side of the housing 62 away from the rear cover 12.
  • the first diaphragm 612 is surrounded by the first frame 614 and the housing 62 to form a front sound cavity 602.
  • a back sound cavity 603 is formed between the first diaphragm 612 and the screen 20.
  • the front sound cavity 602 is a cavity in the electronic device 100 close to the back cover 12
  • the rear sound cavity 603 is a cavity in the electronic device 100 close to the screen 20.
  • FIG. 17 is a schematic structural diagram of a third electronic device 100 provided by an embodiment of the present application.
  • FIG. 18 is a schematic diagram of an exploded structure of the speaker module 60 in the electronic device 100 shown in FIG. 17.
  • the speaker core 62 is also electrically connected to the signal processor 50 through two second wires 90.
  • One end of the two second wires 90 is electrically connected to the speaker core 62, and the other end also extends from the wiring hole and is electrically connected to the signal processor 50.
  • the two second wires 90 are a positive wire 90 and a negative wire 90, the positive wire 90 is electrically connected to the positive electrode of the signal processor 50, and the negative wire 90 is electrically connected to the negative electrode of the signal processor 50.
  • the speaker core 61 further includes a second diaphragm 616 and a second piezoelectric element 617.
  • the second diaphragm 616 is located on a side of the second frame 615 away from the first diaphragm 612.
  • the second piezoelectric element 617 is located on the side of the second diaphragm 616 away from the second frame 615.
  • the second piezoelectric element 617 includes a piezoelectric ceramic sheet.
  • the positive electrode of the piezoelectric ceramic sheet is connected to the positive lead 90, and the negative electrode is connected to the negative lead 90, and the audio signal sent by the signal processor 50 is received through the two second leads 90, and the second diaphragm 616 is driven to vibrate and produce sound.
  • the vibration direction in which the second piezoelectric element 617 drives the second diaphragm 616 to vibrate is opposite to the vibration direction in which the first piezoelectric element 613 drives the first diaphragm 612 to vibrate.
  • the electronic device 100 may also include two signal processors 50, and the first piezoelectric element 613 and the second piezoelectric element 617 are electrically connected to the two signal processors 50, respectively. There is no specific restriction on this.
  • the sum of the masses of the second diaphragm 616 and the second piezoelectric element 617 is equal to the sum of the masses of the first diaphragm 612 and the first piezoelectric element 613, and the second piezoelectric element 617 drives the second vibration.
  • the vibration speed at which the membrane 616 vibrates is the same as the vibration speed at which the first piezoelectric element 613 drives the first vibrating membrane 612 to vibrate.
  • the outer peripheral surface 6143 of the first frame 614 is provided with two notches 6145 in the area facing away from the sound emitting member 613, and the two notches 6145 are both connected with the first through groove 6144.
  • the second frame 615 also includes an outer peripheral surface 6154 connected between the third surface 6151 and the fourth surface 6152.
  • the two sound outlet holes 601 are opened at intervals in the area of the outer peripheral surface 6154 facing the sound outlet member 613, and both are communicated with the second through groove 6153.
  • the frame 611 further includes a third frame 618, and the third frame 618 is located on a side of the second frame 615 away from the first frame 614.
  • the third frame 618 includes a fifth surface 6181 facing the fourth surface 6152 and a sixth surface 6182 disposed opposite to the fifth surface 6181.
  • the third frame 618 is provided with a third through groove 6183 penetrating the fifth surface 6181 and the sixth surface 6182.
  • FIG. 19 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 17 along the G-G direction.
  • 20 is a partial cross-sectional structure diagram of the electronic device shown in FIG. 17 along the H-H direction.
  • the first diaphragm 612 and the housing 62 are respectively installed on opposite sides of the first frame 614, and surround the first frame 614 and the housing 62 to form a first rear sound cavity 6031.
  • the first rear sound cavity 6031 is in communication with a gap 6145.
  • the first piezoelectric element 613 is installed on the surface of the first diaphragm 612 facing the first frame 614 through the adhesive layer 90 and is accommodated in the first rear sound cavity 6031.
  • the first piezoelectric element 613 is connected to the signal processor through two first wires. One end of the two first wires is connected to the first piezoelectric element 613, and the other end passes through another gap and is connected to the signal processor.
  • the second diaphragm 616 is installed on the surface of the second frame 615 away from the first diaphragm 612, and the third frame 618 is installed on the side of the second diaphragm 616 away from the second frame 615, that is, the second diaphragm 616 is installed on the second frame. Between the border 615 and the third border 618. Specifically, the edge portion of the second diaphragm 616 is installed on the fourth surface of the second frame 615 and the fifth surface of the third frame 618. The second diaphragm 616 is respectively mounted on the fourth surface of the second frame 615 and the fifth surface of the third frame 618 through the adhesive layer 90.
  • the second diaphragm 616 and the first diaphragm 612 are respectively installed on opposite sides of the second frame 615, and surround the second frame 615 and the first diaphragm 612 to form a front sound cavity 602.
  • the holes 601 are in communication with the front sound cavity 602.
  • the third frame 618 is located on the side of the second diaphragm 616 away from the second frame 615, and clamps the second diaphragm 616 together with the second frame 615, so that the second diaphragm 616 is separated by the second frame 615 and the second frame 615.
  • the three frame 618 is clamped and kept in a tight state all the time, which improves the vibration sensitivity of the second diaphragm 616 and improves the audio performance of the speaker module 60.
  • a second back sound cavity 6032 is formed between the second diaphragm 616 and the screen 20.
  • the second back sound cavity 6032 communicates with the first back sound cavity 6031 through a gap 6145, and forms the back sound cavity together with the first back sound cavity 6031 603.
  • the speaker module 60 in this embodiment uses the screen 20 and the second diaphragm 616 to form a second back sound cavity 6032, which eliminates the back cover that forms the sound cavity with the diaphragm in the traditional speaker module, and not only makes full use of the electronic device 100
  • the internal space of increases the volume of the sound cavity of the rear sound cavity 603, improves the acoustic performance of the speaker module 60, and also helps to reduce the thickness of the electronic device 100, which is beneficial to the slim design of the electronic device 100.
  • the second piezoelectric element 617 is installed in the middle area of the surface of the second diaphragm 616 away from the second frame 615. Specifically, the second piezoelectric element 617 is installed in the middle area of the surface of the second diaphragm 616 away from the second frame 615 through the adhesive layer 90, and is accommodated in the second rear sound cavity 6032. It should be understood that other features of the second piezoelectric element 617 shown in this embodiment can be designed with reference to other features of the first piezoelectric element 613 in the electronic device 100 shown in the first embodiment above. Go into details again. It should be noted that in other embodiments, the second piezoelectric element 617 may also be installed in the middle area of the surface of the second diaphragm 616 facing the second frame 615, which is not specifically limited in this application.
  • the electronic device 100 shown in this embodiment includes a second diaphragm 616 and a second piezoelectric element 617.
  • the first piezoelectric element 613 and the second piezoelectric element 617 respectively drive the first diaphragm 612 and the second piezoelectric element 617.
  • the two diaphragms 616 vibrate and produce sound at the same time.
  • the second piezoelectric element 617 drives the second diaphragm 616 to vibrate in a direction opposite to the first piezoelectric element 613 to drive the first diaphragm 612 to vibrate, which is equivalent to a speaker.
  • Two speaker cores in the module 60 work to produce sound, which doubles the sound pressure level of the speaker module 60, which helps to improve the audio performance of the electronic device 100.
  • the second piezoelectric element 617 drives the second diaphragm 616 to generate
  • the vibration speed of the vibration is the same as that of the first piezoelectric element 613 driving the first diaphragm 612 to vibrate, the second piezoelectric element 617 drives the second diaphragm 616 to vibrate and the first piezoelectric element 613 drives the first diaphragm
  • Vibration of the 612 has an effect on the vibration of the electronic device 100 to cancel each other out, which reduces the effect of vibration on the electronic device 100 when the speaker module 60 emits sound, and improves the user experience.

Abstract

本申请提供一种扬声器内核，包括第一边框、第一振膜和第一压电件。第一振膜包括中间部分和环绕中间部分的边缘部分，边缘部分安装于第一边框，第一压电件固定于中间部分朝向第一边框的表面或中间部分背离第一边框的表面，边缘部分的材料采用铝、铝镁合金或镁铝合金。本申请所示扬声器内核工作时，由于采用铝、铝镁合金或镁铝合金制成的边缘部分刚度适中，密度小，能有效增加第一振膜在第一压电件的带动下发生振动的振幅，提高扬声器内核的低频灵敏度，提升扬声器内核的低频频响，提高扬声器内核的音频性能。本申请还提供一种扬声器模组和电子设备。

Description

扬声器内核、扬声器模组和电子设备
本申请要求于2019年12月28日提交中国专利局、申请号为201911385394.6、申请名称为“扬声器内核、扬声器模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及发声技术领域，特别涉及一种扬声器内核、扬声器模组和电子设备。
背景技术
扬声器作为将电能转变为声能的常用电声转换器件，种类繁多，压电扬声器以其体积小、工艺简单、成本低和电声转换效率高等优点而被广泛应用于各类消费性电子产品中。然而，压电扬声器音频性能差，难以满足人们对扬声器声学性能的要求。
发明内容
本申请的目的在于提供一种扬声器内核、扬声器模组和电子设备，用于提高音频性能，满足人们对扬声器声学性能的要求。
本申请扬声器内核包括第一边框、第一振膜和第一压电件，第一振膜包括中间部分和环绕中间部分的边缘部分，边缘部分安装于第一边框，第一压电件固定于中间部分朝向第一边框的表面或中间部分背离第一边框的表面，边缘部分的材料采用铝、铝镁合金或镁铝合金。
本申请扬声器内核工作时，第一压电件带动中间部分发生振动，进而带动边缘部分发生振动发声，由于采用铝、铝镁合金或镁铝合金制成的边缘部分刚度适中，且密度小，有助于增加边缘部分发生振动时的振幅，提高扬声器内核的低频灵敏度，提升扬声器内核的低频频响，进而提高扬声器内核的音频性能。
其中，扬声器内核为压电扬声器内核。
其中，铝镁合金是以镁为主要添加元素的铝合金，镁铝合金是以铝为主要添加元素的镁合金。
一种实施方式中，边缘部分所采用的材料中，镁的含量在0％～90％之间。
一种实施方式中，铝镁合金的含镁量为5％。
一种实施方式中，中间部分的材料采用铝、铝镁合金或镁铝合金，以减小第一振膜的重量，提高第一振膜在第一压电件带动下发生振动的灵敏度，提高扬声器内核的音频性能。此外，中间部分与边缘部分一体成型，以简化第一振膜的制备工艺。
一种实施方式中，第一振膜为采用铝、铝镁合金或和镁铝合金制成的薄膜或薄板。
一种实施方式中，中间部分设有通孔，以进一步减小第一振膜的重量，提高第一振膜在第一压电件带动下发生振动的灵敏度。此外，第一压电件镶嵌于通孔中，或者，第一压电件覆盖通孔，以带动通孔附近的第一振膜部分发生振动，提高扬声器内核的音频性能。
一种实施方式中，第一振膜包括主体振膜和辅助振膜，辅助振膜安装于主体振膜的中部，辅助振膜及部分主体振膜形成中间部分，部分辅助振膜形成边缘部分，辅助振膜的刚 度大于边缘部分的刚度，第一压电件安装于辅助振膜背离主体振膜的表面，以提高第一振膜中承载第一压电件的部分的刚度，使得第一振膜在第一压电件带动下发生振动时不发生分割振动，提高扬声器内核的高频截止频率，提高了扬声器内核的高频性能。
一种实施方式中，第一振膜的厚度在0.05mm～0.3mm之间。
可以理解的是，由于不同尺寸的扬声器内核的驱动力不同，所选用的振膜厚度可以适应性地调整以提高扬声器内核发声的音频性能。当扬声器内核的尺寸较小时，扬声器内核所采用的驱动力小，此时可以采用较薄的振膜，以提高扬声器内核的低频性能；当扬声器的内核尺寸较大时，扬声器内核所采用的驱动力大，此时可以采用较厚的振膜，以保证扬声器内核的可靠性性能。
一种实施方式中，第一压电件包括多个压电陶瓷片，多个压电陶瓷片的共振频率不同，且均设置于第一振膜的表面。
本实施方式扬声器内核包括多个共振频率不同的压电陶瓷片，扬声器内核工作时，多个压电陶瓷片在不同的频段发生共振，以使扬声器内核在全频段都具有较好的音频性能。
一种实施方式中，多个压电陶瓷片的面积或厚度不同。
一种实施方式中，压电陶瓷片的材料包括具有压电特性的电子陶瓷材料，由于陶瓷材料的刚度大，压电陶瓷片发生振动时不发生分割振动，有利于提高扬声器内核的高频性能。
一种实施方式中，扬声器内核还包括第二边框，第二边框安装于第一振膜背离第一边框的一侧，且与第一边框共同夹持第一振膜，以夹紧第一振膜使第一振膜始终处于张紧状态，提高第一振膜在第一压电件带动下发生振动的灵敏度，进而提高扬声器内核的音频性能。
一种实施方式中，扬声器内核还包括第二振膜和第二压电件，第二振膜的边缘安装于第二边框背离第一振膜的表面，第二振膜与第二边框和第一振膜围设形成前音腔，第二压电件安装于第二振膜朝向第二边框的表面的中间区域，或第二振膜背离第二边框的表面的中间区域；
其中，第二压电件带动第二振膜发生振动的振动方向与第一压电件带动第一振膜发生振动的振动方向相反。
本实施方式所示扬声器内核工作时，第一压电件和第二压电件分别带动第一振膜和第二振膜振动发声，此时第二压电件带动第二振膜发生振动的振动方向与第一压电件带动第一振膜发生振动的振动方向相反，相当于两个扬声器内核同时工作，有利于提高扬声器内核的声压级。
一种实施方式中，第二振膜和第二压电件的质量之和等于第一振膜和第一压电件的质量之和，第二压电件带动第二振膜发生振动的振动速度与第一压电件带动第一振膜发生振动的振动速度相同，由于第二压电件带动第二振膜发生振动的振动方向与第一压电件带动第一振膜发生振动的振动方向相反，第二压电件带动第二振膜发生振动和第一压电件带动第一振膜发生振动对电子设备的振动影响相互抵消，减轻了扬声器内核发声时对电子设备的振动影响，提高了用户的使用感受。
一种实施方式中，扬声器内核还包括第三边框，第三边框安装于第二振膜背离第二边框的一侧，且与第二边框共同夹持第二振膜，以夹紧第二振膜使第二振膜始终处于张紧状 态，提高第二振膜在第二压电件带动下发生振动的灵敏度，进而提高扬声器内核的音频性能。
本申请扬声器模组包括壳体和上述任一种扬声器内核，壳体安装于第一边框背离第一振膜的表面，壳体或扬声器内核设有出音孔，以将第一压电件带动第一振膜振动发出的声音传递至外界环境中，实现扬声器模组的发声。
本申请扬声器模组工作时，第一压电件带动中间部分发生振动，进而带动边缘部分发生振动发声，由于采用铝、铝镁合金或镁铝合金制成的边缘部分刚度适中，且密度小，有助于增加边缘部分发生振动时的振幅，提高扬声器模组的低频灵敏度，提升扬声器模组的低频频响，进而提高扬声器模组的音频性能。
其中，扬声器模组为压电扬声器模组。
一种实施方式中，扬声器模组还包括出音件，出音件安装于扬声器内核上，出音件上设有出音通道，出音通道与出音孔连通，将第一压电件带动第一振膜振动发出的声音定向导出至外界环境中。
本申请电子设备包括屏幕、外壳和上述任一种扬声器模组，屏幕安装于外壳上，外壳设有出声孔，扬声器模组位于显示屏和外壳之间，壳体安装于外壳或显示屏上，出音孔与出声孔连通，以将第一压电件带动第一振膜振动发出的声音依次通过出音孔和出声孔传递至外界环境中，实现电子设备的发声。
本申请电子设备工作时，第一压电件带动中间部分发生振动，进而带动边缘部分发生振动发声，由于采用铝、铝镁合金或镁铝合金制成的边缘部分的刚度适中，且密度小，有助于增加边缘部分发生振动时的振幅，提高电子设备的低频灵敏度，提升电子设备的低频频响，进而提高电子设备的音频性能。
附图说明
为了更清楚地说明本申请实施例或背景技术中的技术方案，下面将对本申请实施例或背景技术中所需要使用的附图进行说明。
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示电子设备的分解结构示意图；
图3是图2所示电子设备中扬声器模组的分解结构示意图；
图4是图2所示电子设备中扬声器模组沿A-A方向的剖面结构示意图；
图5是图2所示电子设备中扬声器模组沿B-B方向的剖面结构示意图；
图6是振膜为PET薄膜和镁铝合金薄膜经仿真测试的频响曲线图；
图7是图3所示扬声器模组中第一压电件在另一种实施方式下的结构示意图；
图8是图3所示扬声器模组中第一振膜在另一种实施方式下的结构示意图；
图9是图3所示扬声器模组中第一振膜在第三种实施方式下的结构示意图；
图10是图9所示第一振膜的分解结构示意图；
图11是图1所示电子设备沿C-C方向的局部剖面结构示意图；
图12是图1所示电子设备沿D-D方向的局部剖面结构示意图；
图13是本申请实施例提供的另一种电子设备的结构示意图；
图14是图13所示电子设备的部分分解结构示意图；
图15是图13所示电子设备沿E-E方向的局部剖面结构示意图；
图16是图13所示电子设备沿F-F方向的局部剖面结构示意图；
图17是本申请实施例提供的第三种电子设备的结构示意图；
图18是图17所示电子设备中扬声器模组的分解结构示意图；
图19是图17所示电子设备沿G-G方向的局部剖面结构示意图；
图20是图17所示电子设备沿H-H方向的局部剖面结构示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
请参阅图1和图2。图1是本申请实施例提供的一种电子设备100的结构示意图。图2为图1所示电子设备100的分解结构示意图。
电子设备100可以是手机、平板电脑、多媒体播放器、电子书阅读器、笔记本电脑、车载设备或可穿戴设备等具有发声功能的产品。图1所示实施例以电子设备100是手机为例进行说明。
电子设备100包括外壳10、屏幕20、电路板30、控制器40、信号处理器50和扬声器模组60。外壳10设有出声孔101。屏幕20安装于外壳10上，且与外壳10共同围设出整机内腔。电路板30、控制器40、信号处理器50和扬声器模组60均收容于整机内腔。控制器40和信号处理器50均安装于电路板30上，且控制器40与信号处理器50电连接。控制器40发送音频信号，信号处理器50接收音频信号，对音频信号进行放大和修饰等处理，并发送处理后的音频信号。扬声器模组60与信号处理器50电连接，接收处理后的音频信号，并根据接收到的音频信号振动发声，声音经出声孔101扩散至外界环境中，实现电子设备100的发声。
本实施例中，外壳10包括中框11和后盖12，出声孔101开设于中框11上。具体的，中框11包括上中框111、下中框112、左中框113、右中框114和隔板115。出声孔101开设于上中框111上。上中框111和下中框112平行且相对设置。上中框111包括依次连接的内表面、顶面、外表面和底面。上中框111的内表面为上中框111朝向下中框112的表面，上中框111的内表面设有间隔设置的第一收容槽116和第二收容槽117。第一收容槽116和第二收容槽117均贯穿上中框111的顶面和底面。上中框111的外表面与内表面相背设置，即上中框111的外表面为上中框111远离下中框112的表面。出声孔101开设于上中框111的外表面，且与第一收容槽116连通。其中，出声孔101有多个，多个出声孔101间隔设置于上中框111的外表面，以提高电子设备100发出声音的音量。需要说明的是，在其他实施例中，出声孔101也可以开设于中框11的其他位置或者后盖12，本申请对此不作具体限定。应当理解的是，本实施例所示电子设备100所采用“顶”“底”等方位用词主要依据附图1中的展示方位进行阐述，并不形成对电子设备100于实际应用场景中的方位的限定。
左中框113和右中框114连接在上中框111和下中框112之间。左中框113和右中框114平行且相对设置。左中框113包括内表面和底面。左中框113的内表面为左中框113朝向右中框114的表面，且与上中框111的内表面连接。左中框113的底面与左中框111 的内表面连接，且与上中框111的底面位于同一表面。左中框113的内表面与底面的连接处开设有第三收容槽(图未示)。右中框114包括内表面和底面。右中框114的内表面为右中框114与左中框113的内表面相对设置的表面，且与上中框111的内表面连接，即上中框111的内表面连接于左中框113的内表面和右中框114的内表面之间。右中框114的底面与右中框114的内表面连接，且与上中框111的底面和左中框111的底面位于同一表面。右中框114的内表面和底面的连接处开设有第四收容槽118。
其中，用户在使用电子设备100时，上中框111大致朝上，下中框112大致朝下，左中框113靠近用户的左手边，右中框114靠近用户的右手边。
左中框113、上中框111、右中框114和下中框112依次连接形成收容空间110，即左中框113和右中框114与上中框111和下中框112围设形成收容空间110。隔板115连接于左中框113和右中框114之间，将收容空间110划分为第一收容空间1101和第二收容空间1101。第一收容空间1101靠近上中框111，第一收容槽116、第二收容槽117、第三收容槽119和第四收容槽118均与第一收容空间1101连通。第二收容空间1102靠近下中框112，用以收容电子设备100的电池70。
后盖12安装于中框11的一侧。其中，后盖12可采用可拆卸的方式安装于中框11上，以便于电子设备100内电池、内存卡或电路板的维修和更换。此时，中框11可由钛合金或铝镁合金等金属合金材料制成，后盖12可由PC(聚碳酸酯，Polycarbonate)、ABS(丙烯腈-丁二烯-苯乙烯共聚物，Acrylonitrile Butadiene Styrene copolymers)等工程塑料或者钛合金、铝镁合金等金属合金制成。或者，后盖12和中框11可以一体成型，以提高电子设备100的结构稳定性。此时，中框11和后盖12可由金属材料制成。
屏幕20安装于中框11远离后盖12的一侧。用户使用电子设备100时，屏幕20朝向用户放置，后盖12背离用户放置。具体的，屏幕20包括相对设置的显示面201和非显示面202。显示面201为屏幕20背离中框11的表面，用以显示画面。其中，屏幕20的边缘开设有听筒孔203。听筒孔203贯穿显示面201和非显示面202，且与第二收容槽117连通。一种实施方式中，屏幕20包括盖板和固定于盖板上的显示屏。其中，盖板可以采用玻璃等透明材料制成。显示屏可以是LCD(液晶显示屏，Liquid Crystal Display)或OLED(有机发光二极管，OrganicLight-Emitting Diode)显示屏。
屏幕20和后盖12分别安装中框11的两侧以密封收容空间110形成整机内腔，电路板30位于整机内腔内。具体的，电路板30位于第一收容空间1101内，且靠近后盖12设置，即电路板30远离屏幕20设置。其中，电路板30的两端分别安装于所述第三收容槽和第四收容槽118内。本实施例中，电路板30包括安装面301，安装面301为电路板30朝向后盖12的表面。安装面301设有与第一收容空间1101连通的接线孔31。其中，电路板30为电子设备100的主板。
控制器40和信号处理器50安装于安装面301上。本实施例中，控制器40为电子设备100的CPU(中央处理器，Central Processing Unit)，信号处理器50为PA(功率放大器，Power Amplifier)，用以对音频信号进行放大或修饰等处理，以优化传输至扬声器模组60的音频信号，提高电子设备100的音频性能。
扬声器模组60位于第一收容空间1101内，且安装于电路板30背离后盖12的一侧。 其中，扬声器模组60为压电扬声器模组。扬声器模组60包括扬声器内核61、壳体62和出音组件63。具体的，扬声器内核61设有两个间隔设置的出音孔(图未示)。扬声器内核61通过两根第一导线80与信号处理器50电连接。两根第一导线80的一端与扬声器内核61电连接，另一端从接线孔31伸出与信号处理器50电连接。其中，两根第一导线80分别为正极导线80和负极导线80，正极导线80与信号处理器50的正极电连接，负极导线80与信号处理器50的负极电连接。壳体62安装于扬声器内核61上，且位于扬声器内核61背离电路板30的一侧。需要说明的是，在其他实施例中，出音孔也可以开设于壳体上，本申请对此不作具体限定。
出音组件63安装于扬声器内核61上，且位于扬声器内核61朝向上框架111的一侧。本实施例中，出音组件63包括两个出音件，两个出音件间隔安装于扬声器内核63的周缘，且每一出音件内设有出音通道。具体的，两个出音件分别为第一出音件631和第二出音件632。第一出音件631的出音通道633与一个出音孔连通，第二出音件632的出音通道634与另一个出音孔连通。扬声器内核61工作时产生的声音经两个出音孔601分别传递至第一出音件631的出音通道633和第二出音件632的出音通道634，声音在出音通道633和出音通道634汇聚之后传递至外界环境中，有助于提高扬声器内核60产生的声音的音量和音色。再其中，第一出音件631的出音通道633为电子设备100的喇叭出音通道，第二出音件632的出音通道634为电子设备100的听筒出音通道。
请参阅图3，图3是图2所示电子设备100中扬声器模组60的分解结构示意图。
本实施例中，扬声器内核61包括框架611、第一振膜612和第一压电件613。框架611包括相对设置的第一边框614和第二边框615。第一边框614包括相背设置的第一表面6141和第二表面6142以及连接在第一表面6141和第二表面6142之间的外周面6143。第一边框614设有第一通槽6144。第一通槽6144贯穿第一表面6141和第二表面6142。外周面6143朝向出音件613的区域设有两个出音孔601，两个出音孔601均与第一通槽6144连通。
第二边框615位于第一边框614的一侧。第二边框615包括朝向第一边框614的第三表面6151和与第三表面6151相背设置的第四表面6152。第二边框615设有贯穿第三表面6151和第四表面6152的第二通槽6153。
第一振膜612位于第一边框614与第二边框615之间。本实施例中，第一振膜612包括中间部分6121和边缘部分6122。具体的，中间部分6121用以承载第一压电件613。边缘部分6122环绕中间部分6121，且边缘部分6122的材料采用铝、铝镁合金或镁铝合金。其中，边缘部分6122所采用的材料中，镁的含量在0％～90％之间。需要了解的是，铝镁合金是以镁为主要添加元素的铝合金，镁铝合金是以铝为主要添加元素的镁合金。
第一压电件613带动中间部分6121发生振动，进而带动边缘部分6122发生振动时，相比于现有振膜常采用的PET(聚对苯二甲酸乙二醇酯，Polyethylene terephthalate)或Cu(铜，Copper)等材料，采用铝、铝镁合金或镁铝合金制成的边缘部分6122刚度适中，密度小，有助于增加边缘部分6122发生振动时的振幅，提高扬声器内核62的低频灵敏度，提升扬声器内核62的低频频响，提高扬声器内核62的音频性能，进而提高扬声器模组60和电子设备100的音频性能。其中，第一振膜612的厚度在0.05mm～0.3mm之间。
可以理解的是，由于不同尺寸的扬声器内核的驱动力不同，所选用的振膜厚度可以适 应性地调整以提高扬声器内核发声的音频性能。当扬声器内核的尺寸较小时，扬声器内核所采用的驱动力小，此时可以采用较薄的振膜，以提高扬声器内核的低频性能；当扬声器的内核尺寸较大时，扬声器内核所采用的驱动力大，此时可以采用较厚的振膜，以保证扬声器内核的可靠性性能。
请参阅图4和图5。图4是图2所示电子设备100中扬声器模组60沿A-A方向的剖面结构示意图。图5是图2所示电子设备100中扬声器模组60沿B-B方向的剖面结构示意图。
第一振膜612的边缘部分6122安装于第一边框614，第二边框615安装于边缘部分6122背离第一边框614的一侧，即边缘部分6122安装于第一边框614和第二边框615之间。具体的，边缘部分6122安装于第一边框614的第一表面和第二边框615的第三表面。其中，边缘部分6122通过粘结层90分别安装于第一边框614的第一表面和第二边框615的第三表面。此时，第二边框615位于第一振膜612背离第一边框614的一侧，且与第一边框614共同夹持第一振膜612，而使第一振膜612被第一边框614与第二边框615夹紧而始终处于紧绷状态，提高了第一振膜612的振动灵敏度，有利于提高扬声器模组60的音频性能。
一种实施方式中，中间部分6121的材料采用铝、铝镁合金或和镁铝合金，以减轻第一振膜612的重量，提高第一振膜612在第一压电件613带动下发生振动的灵敏度，提高扬声器内核62的音频性能。具体的，中间部分6121与边缘部分612一体成型，以简化第一振膜612的制备工艺，节省扬声器内核62的生产成本。换言之，第一振膜612为铝、铝镁铝或镁铝合金薄膜或薄板。
请参阅图6，图6是振膜为PET薄膜和铝镁合金薄膜经仿真测试的频响曲线图。其中，铝镁合金薄膜的镁含量为5％。
从图6可知，相比于采用PET薄膜作为振膜，采用铝镁合金薄膜作为振膜在1kHz(千赫兹，kilohertz)下的SPL(声压级，Sound Pressure Level)可以提高6.8dB，有助于提高电子设备100在1kHz下的音频性能，提高人耳感受到的声音响度，提高用户的使用感受。而且，采用铝镁合金薄膜作为振膜与采用PET薄膜作为振膜在1kHz以上的SPL相差无几，即采用铝镁合金薄膜作为振膜可以在不损失1kHz以上的SPL的前提下，提高1kHz以上的SPL，提高电子设备100在1kHz以上的音频性能。
第一压电件613安装于中间部分6121。具体的，第一压电件613安装于中间部分6121远离第一边框614的表面，即第一压电件613安装于中间部分6121朝向第二边框615的表面。其中，第一压电件613可以通过粘结层90安装于中间部分6121的表面。此时，第一压电件613在第一振膜612的正投影正好覆盖中间部分6121，即第一压电件613在第一振膜612上的投影所覆盖的部分即为中间部分6121。需要说明的是，在其他实施例中，第一压电件613可以安装于中间部分6121靠近第一边框614的表面，或者，也可以嵌设于中间部分6121内，本申请对此不作具体限定。
一种实施方式中，第一压电件613包括一个压电陶瓷片。具体的，压电陶瓷片具有正极和负极。压电陶瓷片的正极与正极导线80连接，负极与负极导线80连接，压电陶瓷片接收第一导线80传递的音频信号，并带动第一振膜612振动发声。其中，压电陶瓷片的材料包括PZT(锆钛酸铅压电陶瓷，Pb(Zr(1-x)Tix)O3)等具有压电特性的电子陶瓷材料，陶瓷材料的刚度大，压电陶瓷片发生振动时不容易发生分割振动，有利于提高电子设备100 的高频性能。此时，压电陶瓷片因具有压电效应，会在外电场作用下发生形变。
请参阅图7，图7是图3所示扬声器模组60中第一压电件613在另一种实施方式下的结构示意图。
本实施方式所示第一压电件613与上述实施方式所示第一压电件613的不同之处在于，第一压电件613包括多个压电陶瓷片，多个压电陶瓷片的共振频率不同，且多个压电陶瓷片均设置于中间部分6122的表面。具体的，多个压电陶瓷片的面积不同。其中，多个是指两个或两个以上。需要说明的是，在其他实施例中，多个压电陶瓷片也可以厚度不同，或者，多个压电陶瓷片面积和厚度均不同。
为了更清楚的对本实施方式所示第一压电件613进行阐述，以第一压电件613包括三个面积不同的压电陶瓷片为例进行说明。
本实施方式中，三个压电陶瓷片分别为第一压电陶瓷片6131、第二压电陶瓷片6132和第三压电陶瓷片6133。具体的，第一压电陶瓷片6131、第二压电陶瓷片6132和第三压电陶瓷片6133均设置于中间部分6121上，且三者的正极和负极均分别与两根第一导线80连接，接收经第一导线80传递的音频信号带动第一振膜612振动发声。具体的，第一压电陶瓷片6131的面积最大，在低频下(如频率在0～1kHz之内)发生共振。第二压电陶瓷片6132与第一压电陶瓷片6131相邻设置，且第二压电陶瓷片6132的面积小于第一压电陶瓷片6131的面积。第二压电陶瓷片6132接收音频信号后，在中频下(如频率在1kHz～3kHz之内)发生共振，弥补第一压电陶瓷片6131带动第一振膜612振动发声时在中频下声压级较低的不足。第三压电陶瓷片6133与第二压电陶瓷片6132相邻设置，且第三压电陶瓷片6133的面积小于第二压电陶瓷片6132的面积。第三压电陶瓷片6133接收音频信号后，在高频率(如频率在3kHz以上)发生共振，弥补第二压电陶瓷片6132带动第一振膜612振动发声时在高频下声压级较低的不足。
本实施方式所示扬声器模组60工作时，第二压电陶瓷片6132可以弥补第一压电陶瓷片6131带动第一振膜612振动发声时在中频下声压级的不足，第三压电陶瓷片6133可以弥补第二压电陶瓷片6132带动第一振膜612振动发声时在高频下声压级的不足，即第一压电陶瓷片6131、第二压电陶瓷片6132和第三压电陶瓷片6133分别在低、中和高三个频段发声共振，使得扬声器模组60在全频段都具有较高的声压级，提高了电子设备100在全频段的音频性能。
请参阅图8，图8是图3所示扬声器模组60中第一振膜612在另一种实施方式下的结构示意图。
本实施方式所示第一振膜612与上述实施方式所示第一振膜612的不同之处在于，中间部分6121设有通孔6123，第一压电件安装于中间部分6121上，且覆盖通孔6123。本实施方式所示第一振膜612设有通孔6123，相当于减小了第一振膜612的质量，提高了第一振膜612在第一压电件613带动下发生振动的灵敏度，提高扬声器模组60的音频性能。需要说明的是，在其他实施方式中，第一压电件也可以镶嵌于通孔6123中，以减小第一振膜612的质量，提高第一振膜612的振动灵敏度。其中，第一压电件613可以通过粘接层粘接于通孔6123的孔壁。
请参阅图9和图10。图9是图3所示扬声器模组60中第一振膜612在第三种实施方 式下的结构示意图。图10是图9所示第一振膜612的分解结构示意图。
本实施方式所示第一振膜612与上述另一种实施方式所示第一振膜612的不同之处在于，第一振膜612包括主体振膜612a和辅助振膜612b，辅助振膜612b安装于主体振膜612a的中部。部分主体振膜612a和辅助振膜612b形成中间部分(图未示)，部分主体振膜612a形成边缘部分(图未示)。具体的，主体振膜612a包括第一部分612c和环绕第一部分612c的第二部分612d。第一部分612c设有开孔612e。第二部分612d形成边缘部分。辅助振膜612b安装于第一部分612c的表面，且覆盖开孔612e。辅助振膜612b与第一部分612c形成中间部分。辅助振膜612b的刚度大于边缘部分6122刚度。其中，辅助振膜612b的材料包括且不限于碳纤维、PMI(聚甲基丙烯酰亚胺，polymethacrylimide)、镁铝合金、铝箔或铝箔的复合材料。
第一压电件安装于辅助振膜612b背离主体振膜612a的表面，以提高第一振膜612中承载第一压电件613的部分的刚度，使得第一振膜612在第一压电件带动下发生振动时不会发生分割振动，提高扬声器模组60的高频截止频率，提高了扬声器模组60的高频性能。
复参图4和图5，本实施例中，壳体62为平面板状结构，壳体62安装于第一边框614背离第一振膜612的一侧。具体的，壳体62安装于第一边框614的第二表面，且覆盖第一通槽。其中，壳体62通过粘接层90安装于第一边框614的第二表面。壳体62与第一振膜612分别安装于第一边框614的相对两侧，并与第一边框614和壳体62围设形成前音腔602，两个出音孔601均与前音腔602连通。
第一出音件631通过粘接层90安装于扬声器内核61的周缘，且第一出音件631的出音通道633与一个出音孔601连通，即出音孔601连通出音通道633与前音腔602。第二出音件632通过粘接层90安装于扬声器内核61的周缘，且第二出音件632的出音通道634与另一个出音孔601连通，即另一出音孔601连通出音通道634与前音腔602。
第一压电件613带动第一振膜612发生振动，进而带动位于前音腔602内的空气振动产生声波，前音腔602内的声波经两个出音孔601分别进入出音通道633和出音通道634内，经出音通道633和出音通道634传递至外界环境中，实现扬声器模组60的发声。
请参阅图11和图12。图11是图1所示电子设备100沿C-C方向的局部剖面结构示意图。图12是图1所示电子设备100沿D-D方向的局部剖面结构示意图。
本实施例中，扬声器模组60安装于屏幕20的非显示面202上。扬声器模组60通过粘接层90安装于非显示面202上。具体的，壳体62与粘接层90连接，即粘接层90连接于壳体62和屏幕20之间。此时，前音腔602为电子设备100中靠近屏幕20的腔室。需要说明的是，在其他实施例中，扬声器模组60也可以不包括壳体62，第一边框614直接密封安装于屏幕20，由第一振膜612与第一边框614和屏幕20围设形成前音腔602，以省去壳体62这一部件，减小扬声器模组60的厚度，进而减小电子设备100的厚度。
第一振膜612与后盖12之间形成后音腔603。此时，后音腔603为电子设备100中靠近后盖12的腔室。后音腔603与前音腔602完全隔离，避免前音腔602和后音腔603产生的声音相互抵消。本实施例所示扬声器模组60利用后盖12与第一振膜612形成后音腔603，取消了传统扬声器模组中与振膜形成音腔的后盖，不仅充分利用了电子设备100的内部空间，提高了后音腔603的音腔体积，提高了扬声器模组60的声学性能，还有助于减小电子 设备100的厚度，有利于电子设备100的轻薄化设计。
第一出音件631背离扬声器内核62的部分收容于第一收容槽116内，且第一出音件631的出音通道633与出声孔101连通，即出音通道633连通出音孔601和出声孔101。第二出音件632背离扬声器内核62的部分收容于第二收容槽117内，且第二出音件631的出音通道634与听筒孔203连通。
第一压电件613带动第一振膜612发生振动，进而带动位于前音腔602和后音腔603内的空气振动产生声波，前音腔602内的声波经两个出音孔601分别进入出音通道633和出音通道634内，再分别经出声孔101和听筒孔203传递至外界环境中，实现电子设备100的发声。
请参阅图13和图14。图13是本申请实施例提供的另一种电子设备100的结构示意图。图14是图13所示电子设备100的部分分解结构示意图。
本实施例所示电子设备100与上述电子设备100的不同之处在于，电路板30靠近屏幕20设置，扬声器模组60位于电路板30背离屏幕20的一侧，即扬声器模组60位于电路板30靠近后盖12的一侧。具体的，左中框113还包括与底面相背设置的顶面。左中框113的顶面与内表面连接，且与上中框111的顶面位于同一表面。第三收容槽119开设于顶面与内表面的连接处。右中框114还包括与底面相背设置的顶面。右中框114的顶面与内表面连接，且与上中框111的顶面位于同一表面。第四收容槽118开设于右中框114的顶面与内表面的连接处。其中，电路板30的两端分别安装于第三收容槽119和第四收容槽118内。
请参阅图15和图16。图15是图13所示电子设备100沿E-E方向的局部剖面结构示意图。图16是图13所示电子设备100沿F-F方向的局部剖面结构示意图。
本实施例中，扬声器模组60安装于后盖12上。扬声器模组60通过粘接层90安装于后盖12上。具体的，壳体62通过粘接层90安装于后盖12上，即粘接层90粘接于壳体62和后盖12之间。扬声器内核61位于壳体62远离后盖12的一侧。本实施例中，第一振膜612与第一边框614和壳体62围设形成前音腔602。第一振膜612与屏幕20之间形成后音腔603。此时，前音腔602为电子设备100中靠近后盖12的腔室，后音腔603为电子设备100中靠近屏幕20的腔室。
应当理解的是，本实施例所示的电子设备100的其他特征均可参考上文实施例所示的电子设备(请一并参阅图1至图12)的其他特征进行设计，此处不再赘述。
请参阅图17和图18。图17是本申请实施例提供的第三种电子设备100的结构示意图。图18是图17所示电子设备100中扬声器模组60的分解结构示意图。
本申请实施例提供的第三种电子设备100与上述第二种实施例所示电子设备100的不同之处在于，扬声器内核62还通过两根第二导线90与信号处理器50电连接。两根第二导线90的一端与扬声器内核62电连接，另一端也从接线孔伸出与信号处理器50电连接。其中，两根第二导线90分别为正极导线90和负极导线90，正极导线90与信号处理器50的正极电连接，负极导线90与信号处理器50的负极电连接。
本实施例中，扬声器内核61还包括第二振膜616和第二压电件617。第二振膜616位于第二边框615背离第一振膜612的一侧。第二压电件617位于第二振膜616背离第二边 框615的一侧。第二压电件617包括一个压电陶瓷片。压电陶瓷片的正极与正极导线90连接，负极与负极导线90连接，并通过两根第二导线90接收信号处理器50发送的音频信号，并带动第二振膜616振动发声。其中，第二压电件617带动第二振膜616发生振动的振动方向与第一压电件613带动第一振膜612发生振动的振动方向相反。需要说明的是，在其他实施例中，电子设备100也可以包括两个信号处理器50，第一压电件613和第二压电件617分别与两个信号处理器50电连接，本申请对此不作具体限定。
一种实施方式中，第二振膜616和第二压电件617的质量之和等于第一振膜612和第一压电件613的质量之和，第二压电件617带动第二振膜616发生振动的振动速度和第一压电件613带动第一振膜612发生振动的振动速度相同。
本实施例中，第一边框614的外周面6143背离出音件613的区域设有两个缺口6145，两个缺口6145均与第一通槽6144连通。第二边框615还包括连接在第三表面6151和第四表面6152之间的外周面6154。两个出音孔601间隔开设于外周面6154朝向出音件613的区域，且均与第二通槽6153连通。
框架611还包括第三边框618，第三边框618位于第二边框615背离第一边框614的一侧。具体的，第三边框618包括朝向第四表面6152的第五表面6181和与第五表面6181相背设置的第六表面6182。第三边框618设有贯穿第五表面6181和第六表面6182的第三通槽6183。
请参阅图19和图20。图19是图17所示电子设备100沿G-G方向的局部剖面结构示意图。图20是图17所示电子设备沿H-H方向的局部剖面结构示意图。
第一振膜612与壳体62分别安装于第一边框614的相对两侧，与第一边框614和壳体62围设形成第一后音腔6031。第一后音腔6031与一个缺口6145连通。第一压电件613通过粘结层90安装于第一振膜612朝向第一边框614的表面，且收容于第一后音腔6031内。具体的，第一压电件613通过两根第一导线与信号处理器连接。两根第一导线的一端与第一压电件613连接，另一端穿过另一缺口与信号处理器连接。
第二振膜616安装于第二边框615背离第一振膜612的表面，第三边框618安装于第二振膜616背离第二边框615的一侧，即第二振膜616安装于第二边框615和第三边框618之间。具体的，第二振膜616的边缘部分安装于第二边框615的第四表面和第三边框618的第五表面。其中，第二振膜616通过粘接层90分别安装于第二边框615的第四表面和第三边框618的第五表面。此时，第二振膜616与第一振膜612分别安装于第二边框615的相对两侧，并与第二边框615和第一振膜612围设形成前音腔602，两个出音孔601均与前音腔602连通。
此外，第三边框618位于第二振膜616背离第二边框615的一侧，且与第二边框615共同夹持第二振膜616，以使第二振膜616被第二边框615和第三边框618夹紧而始终处于紧绷状态，提高第二振膜616的振动灵敏度，提高扬声器模组60的音频性能。
应当理解的是，本实施例所示第二振膜616的特征均可参考上文实施例所示的第一振膜612的特征进行设计，此处不再赘述。
第二振膜616与屏幕20之间形成第二后音腔6032，第二后音腔6032通过一个缺口6145与第一后音腔6031连通，且与第一后音腔6031共同形成后音腔603。本实施例所示扬声 器模组60利用屏幕20与第二振膜616形成第二后音腔6032，取消了传统扬声器模组中与振膜形成音腔的后盖，不仅充分利用了电子设备100的内部空间，提高了后音腔603的音腔体积，提高了扬声器模组60的声学性能，还有助于减小电子设备100的厚度，有利于电子设备100的轻薄化设计。
第二压电件617安装于第二振膜616背离第二边框615的表面的中间区域。具体的，第二压电件617通过粘接层90安装于第二振膜616背离第二边框615的表面的中间区域，且收容于第二后音腔6032内。应当理解的是，本实施例所示第二压电件617的其他特征均可参考上文第一种实施例所示电子设备100中第一压电件613的其他特征进行设计，此处不再赘述。需要说明的是，在其他实施例中，第二压电件617也可以安装于第二振膜616朝向第二边框615的表面的中间区域，本申请对此不作具体限定。
本实施例所示电子设备100包括第二振膜616和第二压电件617，电子设备100发声时，第一压电件613和第二压电件617分别带动第一振膜612和第二振膜616同时振动发声，此时第二压电件617带动第二振膜616发生振动的振动方向与第一压电件613带动第一振膜612发生振动的振动方向相反，相当于扬声器模组60中有两个扬声器内核工作发声，将扬声器模组60的声压级提高了一倍，有助于提高电子设备100的音频性能。此外，由于第二振膜616和第二压电件617的质量之和等于第一振膜612和第一压电件613的质量之和，第二压电件617带动第二振膜616发生振动的振动速度和第一压电件613带动第一振膜612发生振动的振动速度相同，第二压电件617带动第二振膜616发生振动和第一压电件613带动第一振膜612发生振动对电子设备100的振动影响相互抵消，减轻了扬声器模组60发声时对电子设备100的振动影响，提高了用户的使用感受。
以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (12)

  1. 一种扬声器内核，其特征在于，包括第一边框、第一振膜和第一压电件，所述第一振膜包括中间部分和环绕所述中间部分的边缘部分，所述边缘部分安装于所述第一边框，所述第一压电件安装于所述中间部分朝向所述第一边框的表面或所述中间部分背离所述第一边框的表面，所述边缘部分的材料采用铝、铝镁合金或镁铝合金。
  2. 根据权利要求1所述的扬声器内核，其特征在于，所述中间部分的材料采用铝、铝镁合金或镁铝合金，且与所述边缘部分一体成型。
  3. 根据权利要求1所述的扬声器内核，其特征在于，所述中间部分设有通孔，所述第一压电件镶嵌于所述通孔中，或者，所述第一压电件覆盖所述通孔。
  4. 根据权利要求1所述的扬声器内核，其特征在于，所述第一振膜包括主体振膜和辅助振膜，所述辅助振膜安装于所述主体振膜的中部，所述辅助振膜及部分所述主体振膜形成所述中间部分，部分所述主体振膜形成所述边缘部分；
    所述辅助振膜的刚度大于所述边缘部分的刚度，所述第一压电件安装于所述辅助振膜背离所述主体振膜的表面。
  5. 根据权利要求1至4中任一项所述的扬声器内核，其特征在于，所述第一振膜的厚度在0.05mm～0.3mm之间。
  6. 根据权利要求1至4中任一项所述的扬声器内核，其特征在于，所述第一压电件包括多个压电陶瓷片，多个所述压电陶瓷片的共振频率不同，且均设置于所述第一振膜的表面。
  7. 根据权利要求1至4中任一项所述的扬声器内核，其特征在于，所述扬声器内核还包括第二边框，所述第二边框安装于所述第一振膜背离所述第一边框的一侧，且与所述第一边框共同夹持所述第一振膜。
  8. 根据权利要求7所述的扬声器内核，其特征在于，所述扬声器内核还包括第二振膜和第二压电件，所述第二振膜的边缘安装于所述第二边框背离所述第一振膜的表面，所述第二振膜与所述第二边框和所述第一振膜围设形成前音腔，所述第二压电件安装于所述第二振膜朝向所述第二边框的表面的中间区域，或所述第二振膜背离所述第二边框的表面的中间区域；
    其中，所述第二压电件带动所述第二振膜发生振动的振动方向与所述第一压电件带动所述第一振膜发生振动的振动方向相反。
  9. 根据权利要求8所述的扬声器内核，其特征在于，所述扬声器内核还包括第三边框，所述第三边框安装于所述第二振膜背离所述第二边框的一侧，且与所述第二边框共同夹持所述第二振膜。
  10. 一种扬声器模组，其特征在于，包括壳体和如权利要求1-9任一项所述的扬声器内核，所述壳体安装于所述第一边框背离所述第一振膜的表面，所述壳体或所述扬声器内核设有出音孔。
  11. 根据权利要求10所述的扬声器模组，其特征在于，所述扬声器模组还包括出音件，所述出音件安装于所述扬声器内核上，所述出音件上设有出音通道，所述出音通道与所述出音孔连通。
  12. 一种电子设备，其特征在于，包括屏幕、外壳和如权利要求10或11所述的扬声器模组，所述屏幕安装于所述外壳上，所述外壳设有出声孔，所述扬声器模组位于所述外壳和所述显示屏之间，所述壳体安装于所述外壳或所述显示屏上，所述出音孔与所述出声孔连通。
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