JP7318095B1 - スピーカ装置及び電子機器 - Google Patents
スピーカ装置及び電子機器 Download PDFInfo
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- JP7318095B1 JP7318095B1 JP2022207729A JP2022207729A JP7318095B1 JP 7318095 B1 JP7318095 B1 JP 7318095B1 JP 2022207729 A JP2022207729 A JP 2022207729A JP 2022207729 A JP2022207729 A JP 2022207729A JP 7318095 B1 JP7318095 B1 JP 7318095B1
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- JP
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- Prior art keywords
- housing
- speaker device
- sound
- hole
- acoustic chamber
- Prior art date
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- 230000004308 accommodation Effects 0.000 claims abstract description 4
- 238000005192 partition Methods 0.000 claims abstract 2
- 238000002955 isolation Methods 0.000 claims description 26
- 238000009423 ventilation Methods 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 5
- 239000012528 membrane Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- -1 Polyethylene Terephthalate Polymers 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
- H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
- H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/023—Screens for loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
- H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Multimedia (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Description
前記ハウジングには、圧抜き孔が開設され、前記圧抜き孔は、前記前音響チャンバに連通している。
200 電子機器
1 ハウジング
11 上ハウジング
12 下ハウジング
13 収容空間
131 前音響チャンバ
132 バックチャンバ
14 導音チャネル
15 圧抜き孔
16 第1方向
17 第2方向
2 発音単体
21 振動膜
3 隔離アセンブリ
31 支持部材
311 構造孔
32 通気隔離部材
Claims (10)
- スピーカ装置であって、
ハウジングと、発音単体とを含み、
前記ハウジングは、互いに接続される上ハウジングと下ハウジングを含み、前記上ハウジングと前記下ハウジングとの間には、前記発音単体を収容するための収容空間が設けられ、前記発音単体は、振動発音のための振動膜を含み、前記振動膜は、前記収容空間を前音響チャンバとバックチャンバに仕切り、前記ハウジングには、導音チャネルが設けられ、前記導音チャネルは、前記前音響チャンバと外界とを連通し、
前記ハウジングには、圧抜き孔が開設され、前記圧抜き孔は、前記前音響チャンバに連通していることを特徴とするスピーカ装置。 - 前記圧抜き孔の延在方向は、前記導音チャネルの延在方向に交差することを特徴とする請求項1に記載のスピーカ装置。
- 前記圧抜き孔は、第1方向に沿って延在し、前記導音チャネルは、第2方向に沿って延在し、前記第1方向と前記第2方向との夾角は、40°~50°であることを特徴とする請求項1に記載のスピーカ装置。
- 前記圧抜き孔の断面形状は、円形、楕円形、半円形、台形、方形のうちの一種であることを特徴とする請求項1に記載のスピーカ装置。
- 前記圧抜き孔は、前記導音チャネルと同一側に設けられていることを特徴とする請求項1に記載のスピーカ装置。
- 前記導音チャネルと前記圧抜き孔とは、いずれも前記下ハウジングに設けられていることを特徴とする請求項1に記載のスピーカ装置。
- 前記上ハウジングと前記下ハウジングには、係合するスナップフィット構造が設けられていることを特徴とする請求項1に記載のスピーカ装置。
- 前記スピーカ装置は、隔離アセンブリを更に含み、前記隔離アセンブリは、支持部材及び通気隔離部材を含み、前記支持部材は、前記ハウジングの前記導音チャネルが設けられる側に接続され、前記支持部材には、前記導音チャネルにマッチングする構造孔が開設され、前記通気隔離部材は、前記構造孔を覆うことを特徴とする請求項1に記載のスピーカ装置。
- 前記通気隔離部材は、メッシュ布であることを特徴とする請求項8に記載のスピーカ装置。
- 請求項1~9のいずれか一項に記載のスピーカ装置が設けられていることを特徴とする電子機器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220477027.XU CN217216874U (zh) | 2022-03-04 | 2022-03-04 | 扬声器装置及电子设备 |
CN202220477027.X | 2022-03-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7318095B1 true JP7318095B1 (ja) | 2023-07-31 |
JP2023129248A JP2023129248A (ja) | 2023-09-14 |
Family
ID=82754340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022207729A Active JP7318095B1 (ja) | 2022-03-04 | 2022-12-26 | スピーカ装置及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230283945A1 (ja) |
JP (1) | JP7318095B1 (ja) |
CN (1) | CN217216874U (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN217116309U (zh) * | 2022-03-30 | 2022-08-02 | 瑞声光电科技(常州)有限公司 | 扬声器箱 |
CN115065909A (zh) * | 2022-07-19 | 2022-09-16 | 瑞声科技(新加坡)有限公司 | 扬声器模组 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206226704U (zh) | 2016-10-31 | 2017-06-06 | 歌尔科技有限公司 | 扬声器模组 |
US20170339476A1 (en) | 2014-04-29 | 2017-11-23 | Goertek Inc. | Loudspeaker module applied inside terminal |
WO2021196795A1 (en) | 2020-03-31 | 2021-10-07 | Shenzhen Voxtech Co., Ltd. | Systems, methods, and devices for acoustic output |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08107594A (ja) * | 1994-10-04 | 1996-04-23 | Matsushita Electric Ind Co Ltd | スピーカ装置 |
JP2005012644A (ja) * | 2003-06-20 | 2005-01-13 | Matsushita Electric Ind Co Ltd | スピーカそれを用いたモジュールおよび電子機器 |
CN202190382U (zh) * | 2011-07-04 | 2012-04-11 | 常州美欧电子有限公司 | 发声器件 |
US9872099B2 (en) * | 2013-05-10 | 2018-01-16 | Goertek Inc. | Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module |
US9363587B2 (en) * | 2013-12-05 | 2016-06-07 | Apple Inc. | Pressure vent for speaker or microphone modules |
-
2022
- 2022-03-04 CN CN202220477027.XU patent/CN217216874U/zh not_active Expired - Fee Related
- 2022-06-06 US US17/833,874 patent/US20230283945A1/en not_active Abandoned
- 2022-12-26 JP JP2022207729A patent/JP7318095B1/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170339476A1 (en) | 2014-04-29 | 2017-11-23 | Goertek Inc. | Loudspeaker module applied inside terminal |
CN206226704U (zh) | 2016-10-31 | 2017-06-06 | 歌尔科技有限公司 | 扬声器模组 |
WO2021196795A1 (en) | 2020-03-31 | 2021-10-07 | Shenzhen Voxtech Co., Ltd. | Systems, methods, and devices for acoustic output |
Also Published As
Publication number | Publication date |
---|---|
JP2023129248A (ja) | 2023-09-14 |
US20230283945A1 (en) | 2023-09-07 |
CN217216874U (zh) | 2022-08-16 |
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